An apparatus and method for attaching a polishing pad

Abstract

The present disclosure provides an apparatus and method for attaching a polishing pad, the apparatus comprising: a spreading mechanism for spreading the polishing pad; a centering mechanism for centering the polishing pad with a polishing table; and a pressing mechanism for pressing the polishing pad to the polishing table along a spiral line starting from the center of the polishing pad to the edge of the polishing pad. The apparatus can improve the attachment accuracy, reduce air bubbles and reduce the dependence on manual operation.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor wafer manufacturing, and more particularly to an apparatus and method for attaching polishing pads. Background Technology

[0002] Wafer polishing is a critical step in semiconductor manufacturing, aiming to remove damaged layers and unevenness from the wafer surface to achieve a highly flat surface. In this process, the polishing pad, acting as an intermediary between the polishing machine and the wafer, must adhere flatly and firmly to the polishing table for high-quality polishing results. The flatness of the polishing pad directly affects the uniformity of polishing and the surface quality of the wafer, while a firm attachment helps improve polishing efficiency and reduce damage during the polishing process. Therefore, ensuring precise alignment and bubble-free attachment of the polishing pad to the polishing table is key to improving wafer manufacturing quality, reducing costs, and increasing production efficiency.

[0003] Currently, polishing pad application is primarily done manually. Operators visually align the center of the polishing pad with the center of the polishing table, then peel off the adhesive backing of the pad and begin partial application. By gradually increasing the application area, the polishing pad is eventually fully attached to the polishing table. For double-sided and final polishing of wafers, due to the large diameter of the polishing table and the correspondingly large size of the polishing pad, manual application requires continuously rotating the polishing table to complete the application of the other half of the pad. This application method is limited by equipment space and the flexibility of manual operation, making it difficult to achieve high-efficiency and high-precision application.

[0004] Manual placement methods present several problems. First, relying on visual alignment makes it difficult to guarantee the alignment accuracy between the polishing pad and the polishing table, easily leading to misalignment. Second, manual operation inevitably results in air bubbles, as repeated manual rolling is required to ensure a smooth, bubble-free placement, which is not only inefficient but also carries the risk of residual air bubbles. Furthermore, misalignment or the presence of numerous air bubbles necessitates repeated placement, increasing the risk of polishing pad scrap. These issues not only affect the product quality of polished wafers but may also increase production costs and reduce production efficiency. Therefore, it is necessary to develop a polishing pad placement device that can improve placement accuracy, reduce air bubbles, and decrease reliance on manual operation. Summary of the Invention

[0005] This disclosure provides an apparatus and method for attaching polishing pads, which can improve attachment accuracy, reduce air bubbles, and reduce reliance on manual operation.

[0006] The technical solution disclosed herein is implemented as follows: In a first aspect, this disclosure provides an apparatus for attaching a polishing pad, the apparatus comprising: A spreading mechanism for spreading the polishing pad; The centering mechanism is used to center the polishing pad and the polishing table; A clamping mechanism for pressing the polishing pad against the polishing table from the center of the polishing pad along a spiral line to the edge of the polishing pad.

[0007] In some optional examples, the spreading mechanism includes: guide; A telescopic rod, which is perpendicular to the guide rail and can move along the guide rail; A clamping part is disposed at the end of the telescopic rod, and the clamping part is used to clamp the edge of the polishing pad.

[0008] In some optional examples, the clamping part includes: First clamping plate; Second clamping plate; Bolts passing through the first clamping plate and the second clamping plate; A nut that mates with the bolt.

[0009] In some optional examples, the centering mechanism includes: A rangefinder, the rangefinder being used to measure a plurality of corresponding distances in the radial direction between a plurality of points on the edge of the polishing pad and the edge of the polishing table; The determination module is used to determine that the polishing pad is aligned with the polishing table when the plurality of spacings are equal.

[0010] In some optional examples, the clamping mechanism includes: A screw, the screw being parallel to the centered polishing pad and extending through the central axis of the centered polishing pad; A first driver, the first driver being used to drive the screw to rotate about the central axis of the polishing pad in the pair; A clamping device having a threaded hole that mates with the screw and being mounted on the screw through the threaded hole; A second actuator is used to drive the screw to rotate about its own longitudinal axis.

[0011] In some alternative examples, the clamp presses the polishing pad against the polishing table by generating vibration.

[0012] In some optional examples, the clamping device includes: Eccentric rotor; An electric motor, used to rotate the eccentric rotor.

[0013] In some alternative examples, the device further includes a telescopic boom on which the spreading mechanism is disposed.

[0014] In some optional examples, the device further includes a locating pin disposed on the telescopic boom, wherein the opening mechanism is in the working position relative to the polishing table when the end of the locating pin contacts the polishing table.

[0015] Secondly, this disclosure provides a method for attaching a polishing pad, the method comprising: Spread the polishing pad open; Align the polishing pad with the polishing table; Starting from the center of the polishing pad, press the polishing pad against the polishing table along a spiral path to the edge of the polishing pad.

[0016] This disclosure provides an apparatus and method for attaching polishing pads, achieving automated attachment through an automated spreading mechanism, a centering mechanism, and a clamping mechanism. This automation reduces the uncertainty and labor intensity of manual operation, improving the accuracy and repeatability of the attachment process. Automation also reduces operator safety risks, especially when handling large or heavy polishing pads. The centering mechanism automatically achieves precise alignment between the polishing pad and the polishing table, avoiding alignment accuracy problems caused by visual inspection in manual attachment methods, which is crucial for polishing uniformity and efficiency. The clamping mechanism clamps from the center to the edge of the polishing pad, ensuring complete expulsion of air between the pad and the polishing table, achieving bubble-free attachment and guaranteeing wafer polishing quality. This invention improves polishing efficiency and quality, extends the lifespan of the polishing pad, and ensures uniform pressure distribution during the polishing process. Precise centering and bubble-free attachment reduce the risk of polishing pad scrap and lower production costs. Attached Figure Description

[0017] Figure 1 This is a top view schematic diagram of an apparatus for attaching a polishing pad provided in an embodiment of this disclosure.

[0018] Figure 2 This is a front view schematic diagram of an apparatus for attaching a polishing pad provided in an embodiment of this disclosure.

[0019] Figure 3 This is a front view schematic diagram of the clamping device of the clamping mechanism for attaching a polishing pad provided in an embodiment of this disclosure.

[0020] Figure 4 A flowchart illustrating a method for attaching a polishing pad according to an embodiment of this disclosure. Detailed Implementation

[0021] The technical solutions in this disclosure will now be clearly and completely described with reference to the accompanying drawings.

[0022] In semiconductor manufacturing, wafer polishing is a crucial step in ensuring a high degree of surface flatness. The polishing pad, as a core component in this process, directly impacts polishing quality through its smooth attachment to the polishing table. However, currently, polishing pad attachment is primarily done manually, which presents several major problems: manual operation relies on visual inspection, making it difficult to ensure precise alignment between the polishing pad and the polishing table, easily leading to misalignment; manual application inevitably generates air bubbles, requiring repeated pressing to ensure no bubbles remain, resulting in low efficiency and a risk of residue buildup; misalignment or numerous air bubbles necessitate repeated application, increasing polishing pad waste and impacting production costs and efficiency.

[0023] To address these issues, this disclosure proposes an automated polishing pad application device that improves application accuracy and efficiency through mechanized operation, reduces bubble generation, and decreases reliance on manual labor.

[0024] Specifically, see Figure 1 This disclosure provides an apparatus 1 for attaching a polishing pad P, in... Figure 1 The polishing pad P is schematically shown in the diagram, with the area filled with dots. The device 1 may include a spreading mechanism 10, a centering mechanism 20, and a clamping mechanism 30.

[0025] The spreading mechanism 10 is used to spread the polishing pad P. During transportation or storage, the polishing pad P may be folded to save space. This not only causes creases in the polishing pad P, but also results in different parts of the polishing pad P not being on the same plane, which is very detrimental to subsequent application. Even if the polishing pad P is not folded, due to the softness and elasticity of the material itself, it may naturally form a wavy or uneven state. This state directly affects the contact area and flatness between the polishing pad P and the polishing table T, thus affecting the polishing effect. The function of the spreading mechanism 10 is to transform the polishing pad P from any of the above initial states into a flat and uniform plane. This process is crucial for subsequent attachment work because the spread polishing pad P can make better contact with the polishing table T, ensuring flatness and uniformity of attachment. This is essential for improving polishing quality. In addition, a flat polishing pad P can reduce adjustment time during the attachment process, improve attachment efficiency, and reduce the risk of attachment failure caused by wrinkles or unevenness. Moreover, the spread polishing pad P is less likely to generate air bubbles during the attachment process because the flat surface helps the adhesive to be evenly distributed, reducing air bubble problems caused by wrinkles or unevenness.

[0026] The alignment mechanism 20 is used to align the polishing pad P with the polishing stage T. After alignment, each part of the polishing pad P can be fully utilized during the polishing process. If the polishing pad P and the polishing stage T are not aligned, some areas of the polishing pad P may not be able to contact the wafer during polishing, resulting in uneven polishing and affecting the surface quality of the wafer. Figure 1 As shown, when both the polishing pad P and the polishing table T are circular, alignment refers to precisely aligning the center of the polishing pad P with the center of the polishing table T. This precise alignment ensures that the polishing pad P wears evenly during rotation, extending its service life, and guarantees uniform pressure distribution during polishing, thereby improving polishing efficiency and quality. If the polishing pad P is not aligned with the polishing table T, it may cause excessive localized wear or damage to the polishing pad P, which not only affects the polishing effect but also wastes material. This situation can be avoided by adjusting the alignment mechanism 20.

[0027] The clamping mechanism 30 is used to clamp the polishing pad P onto the polishing table T, starting from the center PC of the polishing pad P and moving along the spiral line H to the edge PE of the polishing pad P. Figure 1 When the polishing pad P shown is circular, the center PC is the center of the circle. Figure 1 It is schematically shown in the middle using a cross symbol, and also in Figure 1 The spiral H mentioned above is schematically shown by dashed lines. Additionally, in... Figure 1 When the polishing pad P shown is circular, the edge PE is the circumferential edge of the circle.

[0028] This disclosure achieves automated application of the polishing pad P through an automated spreading mechanism 10, a centering mechanism 20, and a clamping mechanism 30. This automation reduces the uncertainty and labor intensity of manual operation, and improves the accuracy and repeatability of the application process. By reducing manual operation, this disclosure lowers the safety risks for operators during the application process, especially when handling large or heavy polishing pads P. The centering mechanism 20 automatically achieves precise centering between the polishing pad P and the polishing table T. Figure 1 As shown, the centering mechanism 20 ensures precise alignment between the center of the polishing pad P and the center of the polishing table T, avoiding the problem of inconsistent centering accuracy caused by visual inspection in manual application methods. This precise alignment is crucial for the subsequent polishing process, as it directly affects the uniformity and efficiency of polishing. The clamping mechanism 30 uses a clamping method from the center PC of the polishing pad P to the edge PE, as shown... Figure 1The spiral H, schematically shown by dashed lines, represents a clamping method that ensures complete expulsion of air between the polishing pad P and the polishing stage T, achieving bubble-free attachment. Bubble-free attachment is crucial for ensuring wafer polishing quality because it avoids uneven polishing and surface defects caused by bubbles. Due to the precise alignment between the polishing pad P and the polishing stage T and the bubble-free attachment, this disclosure improves polishing efficiency and quality, such as… Figure 1 As shown, each part of the polishing pad P can be fully utilized during the polishing process, avoiding excessive local wear or damage caused by misalignment, thereby extending the service life of the polishing pad P and ensuring uniform pressure distribution during the polishing process. Through the synergistic action of the centering mechanism 20 and the clamping mechanism 30, this disclosure can reduce material waste caused by misalignment or air bubbles. Precise centering and bubble-free adhesion reduce the risk of scrapping the polishing pad P and lower production costs.

[0029] In some embodiments of this disclosure, see Figure 1 The spreading mechanism 10 may include a guide rail 11, a telescopic rod 12, and a clamping part 13.

[0030] Guide rail 11 is used to guide the movement of telescopic rod 12. Figure 1 The movement is schematically illustrated by dashed arrows pointing in opposite directions, that is, in Figure 1 In the case shown, it can move in the vertical direction. The telescopic rod 12 is perpendicular to the guide rail 11 and can move along the guide rail 11. Figure 1 The diagram illustrates, with solid arrows pointing in opposite directions, that the telescopic rod 12 is capable of telescoping, meaning that... Figure 1 In the case shown, it can extend and retract in the left and right direction. A clamping part 13 is provided at the end of the telescopic rod 12, and this clamping part 13 is used to clamp the edge PE of the polishing pad P. Additionally, in... Figure 1 The illustration exemplarily shows two telescopic rods 12 and four clamping portions 13 disposed at the ends of the two telescopic rods 12, but the present disclosure is not limited thereto, and the number of telescopic rods 12 and corresponding clamping portions 13 may be greater.

[0031] The spreading mechanism 10, through the cooperation of the guide rail 11 and the telescopic rod 12, realizes the spreading operation of the polishing pad P. The design of the guide rail 11 allows the telescopic rod 12 to move along... Figure 1 It can move up and down, while the telescopic function of the telescopic rod 12 allows it to move along... Figure 1The expansion mechanism 10 extends and retracts in the left and right directions, allowing it to adapt to polishing pads P of different sizes. This facilitates the expansion of the polishing pads P, laying the foundation for subsequent application. A clamping part 13 is located at the end of the telescopic rod 12 to clamp the edge PE of the polishing pad P. This design ensures the stability and accuracy of the polishing pad P during the expansion process, preventing displacement or slippage and thus guaranteeing the precision of the application. Expanding the polishing pad P using the expansion mechanism 10 reduces wrinkles and air bubbles during application, improving efficiency and quality. A flat polishing pad P helps ensure even distribution of the adhesive, reducing air bubbles caused by wrinkles or unevenness, thereby improving polishing quality. The automated expansion function of the expansion mechanism 10 reduces the need for manual operation, lowers the labor intensity of operators, reduces errors caused by human factors, and improves the stability and reliability of the entire application process.

[0032] In some embodiments of this disclosure, see Figure 2 The clamping part 13 may include a first clamping plate 131, a second clamping plate 132, a bolt 133, and a nut 134. The bolt 133 passes through the first clamping plate 131 and the second clamping plate 132, and the nut 134 engages with the bolt 133. Additionally, in Figure 2 Only a single bolt 133 and a single nut 134 corresponding to the first clamping plate 131 and the second clamping plate 132 are shown in the illustration, but this disclosure is not limited thereto, and the number of bolts 133 and nuts 134 corresponding to the first clamping plate 131 and the second clamping plate 132 may be more.

[0033] The clamping part 13 consists of a first clamping plate 131 and a second clamping plate 132, which work together to clamp the edge PE of the polishing pad P. This structural design gives the clamping part 13 good adaptability, enabling it to accommodate polishing pads P of different materials and thicknesses. Regardless of whether the polishing pad P is soft or hard, thin or thick, the clamping part 13 can effectively clamp the edge PE of the polishing pad P, ensuring stability during the unfolding and attachment process. A bolt 133 passes through the first clamping plate 131 and the second clamping plate 132 and engages with a nut 134. This design allows the operator to adjust the clamping force according to the specific material and thickness of the polishing pad P. By adjusting the position of the nut 134 on the bolt 133, the clamping force of the clamping part 13 on the edge PE of the polishing pad P can be precisely controlled, preventing damage to the polishing pad P due to overtightening or instability due to undertightening. The design of the clamping part 13 provides operational flexibility and precision. The operator can fine-tune the clamping force according to the actual situation to adapt to different working conditions, ensuring the optimal state of the polishing pad P during the unfolding and attachment process. By precisely adjusting the clamping force, the clamping part 13 reduces the risk of damage to the polishing pad P due to excessive clamping force, while also preventing displacement or slippage of the polishing pad P during operation due to insufficient clamping force. The adjustability of the clamping part 13 allows for the replacement of polishing pads of different sizes without replacing the entire clamping part; only the clamping force needs to be adjusted. This significantly reduces the time and labor required for replacing polishing pads P, improving production efficiency. The clamping part 13 is designed to be simple and effective; the bolts 133 and nuts 134 are standardized parts, easily obtainable and replaceable. This design reduces maintenance costs and equipment complexity, making equipment maintenance and repair more convenient.

[0034] In some embodiments of this disclosure, see Figure 1 The centering mechanism 20 may include a rangefinder 21 and a determination module 22. The rangefinder 21 is used to measure multiple radial distances between multiple points on the edge PE of the polishing pad P and the edge TE of the polishing table T, such as... Figure 1 As shown, the rangefinder 21 can measure the distance between three points on the edge PE of the polishing pad P and the edge TE of the polishing table T, that is, measure three of the aforementioned distances. However, this disclosure is not limited to this, and the rangefinder 21 can also measure more distances. The determination module 22 is used to determine that the polishing pad P is aligned with the polishing table T when multiple distances are equal.

[0035] The centering mechanism 20 measures the distance between multiple points on the edge PE of the polishing pad P and the edge TE of the polishing table T using a rangefinder 21, such as... Figure 1As shown, the rangefinder 21 can measure three or more gaps, ensuring the accuracy of alignment determination. The determination module 22 determines that the polishing pad P is aligned with the polishing stage T when multiple gaps are equal. This automated alignment determination mechanism improves the accuracy and reliability of the alignment process. Ensuring precise alignment between the polishing pad P and the polishing stage T through the alignment mechanism 20 improves the accuracy of subsequent attachment operations. This precise alignment is crucial for achieving uniform and high-quality polishing results, as it directly affects the contact area and pressure distribution between the polishing pad P and the wafer. The automated alignment mechanism 20 reduces errors that may occur during manual visual alignment, improving the consistency and repeatability of the alignment process. This reduces the risk of polishing pad P being scrapped and production costs due to misalignment. The automated alignment determination module 22 of the alignment mechanism 20 can quickly complete the alignment determination, reducing the time and labor required for manual alignment, thereby improving overall production efficiency. The rangefinder 21 can measure multiple distances, not just three points. This design allows the centering mechanism 20 to adapt to polishing pads P and polishing tables T of different sizes and shapes, enhancing the flexibility and adaptability of the equipment. The automated operation of the centering mechanism 20 reduces direct contact between operators and the centering process, lowering safety risks, especially when handling large or heavy polishing pads P.

[0036] In some embodiments of this disclosure, see Figure 2 and Figure 3 The clamping mechanism 30 may include a screw 31, a first driver 32, a clamping device 33, and a second driver 34. The screw 31 is parallel to the centered polishing pad P and extends through the central axis PX of the centered polishing pad P. The first driver 32 drives the screw 31 to rotate about the central axis PX of the centered polishing pad P. The clamping device 33 is formed with a mechanism that mates with the screw 31. Figure 3 The screw 33H shown is used to mount the screw 31. The second driver 34 is used to drive the screw 31 to rotate about its own longitudinal axis 34X.

[0037] In this way, the clamping device 33 can press the polishing pad P along the spiral line H. Specifically, the clamping device 33 moves circumferentially on the polishing pad P by rotating the screw 31 around the central axis PX of the centered polishing pad P. At the same time, the clamping device 33 moves radially on the polishing pad P by rotating the screw 31 around its own longitudinal axis 34X. The two movements combine, and the clamping device 33 moves along the spiral line H. The spiral clamping method of the clamping device 33 reduces air retention, allowing the air between the polishing pad P and the polishing table T to be completely expelled, achieving bubble-free adhesion. This efficient clamping method reduces the adjustment time during the adhesion process and improves the adhesion efficiency. The precise clamping path and uniform pressure distribution reduce the scrap of the polishing pad P caused by air bubbles or misalignment, thereby reducing material waste and lowering production costs. The coordinated use of the first driver 32 and the second driver 34 realizes the automated clamping operation of the clamping device 33, reducing the need for manual operation, reducing the labor intensity of operators, and improving the consistency and repeatability of operation. Automated clamping operations reduce direct contact between operators and the clamping process, lowering safety risks, especially when handling large or heavy polishing pads P.

[0038] In some embodiments of this disclosure, the clamp 33 can press the polishing pad P against the polishing table T by generating vibration. (See also...) Figure 2 It is easy to understand that when the clamping device 33 vibrates in the vertical direction, it can press the polishing pad P against the polishing table T.

[0039] The clamping device 33 effectively presses the polishing pad P against the polishing table T by generating vibration. This vibrational clamping method increases the contact tightness between the polishing pad P and the polishing table T, ensuring the stability of the polishing pad P during the polishing process. The vibrational force generated during the clamping process helps to expel air from between the polishing pad P and the polishing table T, reducing the formation of air bubbles. This effect is crucial for achieving a high-quality polished surface, as air bubbles can lead to uneven polishing or defects. The vibrational clamping method can achieve better adhesion without damaging the polishing pad P. This gentle yet effective clamping method helps extend the service life of the polishing pad P, reduces material waste, and the clamping device 33 using the vibrational clamping method reduces the need for manual clamping, lowers the labor intensity of operators, and improves the consistency and repeatability of operations.

[0040] In some embodiments of this disclosure, see Figure 3 The clamping device 33 may include an eccentric rotor 331 and a motor 332. Figure 3The eccentric rotor 331 in the diagram is only schematic. The eccentric rotor 331 may have a mass eccentricity relative to the horizontal axis of rotation, and the motor 332 is used to rotate the eccentric rotor 331 about the horizontal axis of rotation, so that the clamp 33 will generate vertical vibration.

[0041] The eccentric rotor 331 has a mass eccentricity relative to the horizontal axis of rotation. When the motor 332 drives the eccentric rotor 331 to rotate around the horizontal axis of rotation, the presence of the eccentric mass generates a periodic centrifugal force, causing the clamp 33 to vibrate vertically. This vibration helps to achieve a tight contact between the polishing pad P and the polishing table T. The vibration generated by the eccentric rotation makes the pressure applied to the polishing pad P by the clamp 33 more uniform, reducing damage caused by pressure concentration, and improving the contact tightness between the polishing pad P and the polishing table T. Vibration helps to expel air between the polishing pad P and the polishing table T, reducing the formation of air bubbles, thereby improving the adhesion quality and ensuring uniformity and efficiency in the polishing process. The precise control of the motor 332 allows the vibration frequency and amplitude to be adjusted as needed, realizing automated operation, reducing manual intervention, and improving production efficiency.

[0042] In some embodiments of this disclosure, see Figure 1 and Figure 2 The device 1 may also include a telescopic arm 40, and the spreading mechanism 10 is disposed on the telescopic arm 40. Figure 2 The telescopic capability of the telescopic boom 40 is schematically shown in the middle by solid arrows pointing in opposite directions.

[0043] Using the telescopic arm 40, the device 1 can precisely control the vertical distance between the polishing pad P and the polishing table T. This precise control is crucial for ensuring the effective operation of the clamping mechanism 30, ensuring that the polishing pad P and the polishing table T maintain appropriate contact pressure during the clamping process, and avoiding damage caused by excessive distance leading to insufficient compaction or insufficient distance leading to damage. For example, when the vertical distance between the polishing pad P and the polishing table T is 5mm, the clamping mechanism 30 can begin operation, pressing the polishing pad P onto the polishing table T. This design allows the device 1 to adapt to different combinations of polishing pad P and polishing table T, improving the adaptability and flexibility of the clamping operation. By controlling the vertical distance through the telescopic arm 40, it can be ensured that the clamping device 33 applies uniform and appropriate pressure when clamping the polishing pad P, avoiding damage to the polishing pad P or the generation of air bubbles due to uneven pressure, thus improving the clamping quality.

[0044] In some embodiments of this disclosure, see Figure 1 and Figure 2 The device 1 may also include a positioning pin 50, which is disposed on the telescopic arm 40. When the end of the positioning pin 50 contacts the polishing table T, the spreading mechanism 10 is in the working position relative to the polishing table T.

[0045] The positioning pin 50 ensures that the spreading mechanism 10 can be accurately positioned to a suitable initial position for operation. When the positioning pin 50 contacts the polishing table T, the spreading mechanism 10 is in the working position relative to the polishing table T, providing a precise starting point for the subsequent spreading and attachment of the polishing pad P. The positioning pin 50 quickly positions the spreading mechanism 10 to the working position, reducing the time and labor required for manual adjustment and improving work efficiency. The positioning pin 50 provides a fixed reference point, allowing the spreading mechanism 10 to be repeatedly positioned to the same working position each time, which is crucial for ensuring the consistency and quality control of the polishing pad P. After the spreading mechanism 10 is in the working position, the centering mechanism 20 can precisely position the polishing pad P based on this. This two-step positioning method first uses the positioning pin 50 for coarse positioning, and then uses the rangefinder 21 and the judgment module 22 for fine positioning, ensuring precise centering of the polishing pad P and the polishing table T.

[0046] See Figure 4 This disclosure also provides a method for attaching a polishing pad P, the method including: S401: Expand the polishing pad P; S402: Align the polishing pad P with the polishing table T; S403: Starting from the center PC of the polishing pad P, press the polishing pad P against the polishing table T along the spiral line H to the edge PE of the polishing pad P.

[0047] Expanding the polishing pad P helps eliminate surface defects caused by folding, ensuring that the polishing pad P is in an optimal flat state before attachment. Centering ensures precise alignment between the polishing pad P and the polishing table T, reducing material waste and pad scrap due to misalignment. The compression method, using a spiral H from the center PC to the edge PE, ensures even pressure distribution, preventing uneven pressure damage to the polishing pad P or polishing table T. The spiral compression method also helps expel air during the compression process, reducing bubble formation and improving polishing uniformity.

[0048] It should be noted that the technical solutions described in this disclosure can be combined arbitrarily as long as they do not conflict.

[0049] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An apparatus for attaching a polishing pad, characterized in that, The device includes: A spreading mechanism for spreading the polishing pad; The centering mechanism is used to center the polishing pad and the polishing table; A clamping mechanism is provided for clamping the polishing pad to the polishing table along a spiral path from the center of the polishing pad to its edge. The spreading mechanism includes: guide; A telescopic rod, which is perpendicular to the guide rail and can move along the guide rail; A clamping part is disposed at the end of the telescopic rod, and the clamping part is used to clamp the edge of the polishing pad; The clamping mechanism includes a clamping device, which includes: An eccentric rotor, wherein the eccentric rotor is eccentric in mass relative to the horizontal axis of rotation; An electric motor is used to drive the eccentric rotor to rotate around the horizontal rotation axis, so that the clamping device generates vertical vibration, and the polishing pad is pressed against the polishing table by the vertical vibration; The clamping device further includes a screw, the screw being parallel to the centered polishing pad and extending through the central axis of the centered polishing pad; A first driver, the first driver being used to drive the screw to rotate about the central axis of the polishing pad in the pair; The clamping device has a screw hole that mates with the screw rod and is assembled onto the screw rod through the screw hole; A second actuator is used to drive the screw to rotate about its own longitudinal axis.

2. The apparatus for attaching a polishing pad according to claim 1, characterized in that, The clamping part includes: First clamping plate; Second clamping plate; Bolts passing through the first clamping plate and the second clamping plate; A nut that mates with the bolt.

3. The apparatus for attaching a polishing pad according to claim 1, characterized in that, The centering mechanism includes: A rangefinder, the rangefinder being used to measure a plurality of corresponding distances in the radial direction between a plurality of points on the edge of the polishing pad and the edge of the polishing table; The determination module is used to determine that the polishing pad is aligned with the polishing table when the plurality of spacings are equal.

4. The apparatus for attaching a polishing pad according to claim 1, characterized in that, The device also includes a telescopic boom, and the spreading mechanism is disposed on the telescopic boom.

5. The apparatus for attaching a polishing pad according to claim 4, characterized in that, The device also includes a positioning pin, which is disposed on the telescopic upright arm. When the end of the positioning pin contacts the polishing table, the spreading mechanism is in the working position relative to the polishing table.

6. A method for attaching a polishing pad, characterized in that, The method is performed using the apparatus according to any one of claims 1 to 5, the method comprising: The polishing pad is opened using the opening mechanism; The polishing pad is aligned with the polishing table using the alignment mechanism. The pressing mechanism is used to press the polishing pad against the polishing table from the center of the polishing pad along a spiral line to the edge of the polishing pad.

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