Epoxy resin composition, prepreg and laminate

By using an epoxy resin composition with components such as isocyanate silicone modified epoxy resin, the problem of yellowing in a traditional epoxy resin substrate is solved, and better adhesive properties, yellowing resistance and weather resistance are achieved, and the luminous effect and service life of the LED are improved.

CN119752199APending Publication Date: 2025-04-04GUANGDONG HINNO TECH CO LTD
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Patent Information

Application Number
CN202411892347.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

Traditional epoxy resin substrates are prone to color aging and yellowing in high-heat radiation environments, which affects the luminous efficiency and overall performance of LEDs, and has poor weather resistance.

Method used

Isocyanate silicone modified epoxy resin is used as the main component, and combined with functional resin, curing agent, filler, coupling agent and curing accelerator, to form an excellent epoxy resin composition for preparing a white laminate for LEDs.

Benefits of technology

The epoxy resin composition has excellent performance in terms of adhesive properties, yellowing resistance and weather resistance, and significantly improves the luminous effect and service life of the LED.

✦ Generated by Eureka AI based on patent content.

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Abstract

This scheme discloses an epoxy resin composition, a prepreg and a laminate. In terms of mass fractions, the composition includes the following components: 10 to 70 parts of isocyanate silicone modified epoxy resin, 10 to 40 parts of functional resin, 10 to 40 parts of curing agent, 10 to 60 parts of filler, 0.1 to 3 parts of coupling agent, and 0.1 to 2 parts of curing accelerator. The isocyanate silicone modified epoxy resin contains epoxy groups, siloxy groups and isocyanate groups on the molecular chain segments at the same time. Compared with ordinary epoxy resins, it has better yellowing resistance, weather resistance and chemical stability, and has better bonding performance than ordinary silicon-modified epoxy resins, so that the composition has significant advantages over traditional materials in terms of bonding performance, yellowing resistance and weather resistance. This innovation not only broadens the application scope of epoxy resins, but also provides more reliable and efficient solutions for fields such as LED lighting and integrated circuit packaging.
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Citation Information

Patent Citations

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