High-current copper plating additive as well as use method and application thereof

By developing a high-current copper plating additive, using preferred brightener and wetting agent formulas, the problem of difficult to ensure the plating quality and uniformity in the manufacturing of high-density electronic interconnection materials is solved, and the effect of significantly improving the plating efficiency and plating quality under high current density is achieved.

CN119753772AActive Publication Date: 2025-04-04NANTONG MACDERLUN MATERIAL LTD
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Patent Information

Application Number
CN202411957881.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2025-04-04
Estimated Expiration
2044-12-30

AI Technical Summary

Technical Problem

Traditional electroplating copper technology faces the problem of difficult to ensure the quality and uniformity of the coating at high current density in the manufacturing of high-density electronic interconnect materials.

Method used

A high current copper plating additive is developed to improve the brightness and uniformity of the plating layer by formulating preferred brighteners and wetting agents, including sodium polydithiodipropanesulfonate, sodium N,N-dimethyldithioformamide propane sulfonate, internal salt of 3-mercapto-1-propanesulfonate and propylene glycol-based polyethers.

Benefits of technology

The electroplating efficiency is significantly improved under high current density, shorten the electroplating time, obtain a bright, uniform and superior ductility plating layer, and improve the quality of the workpiece.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of electroplating, in particular to a high-current copper plating additive and a using method and application thereof. The copper plating additive is prepared from the following raw materials: 0.1-5g / L of a brightening agent, 5-60g / L of a wetting agent and water serving as a solvent. According to the copper plating additive disclosed by the invention, the preferable brightener is sodium dithiodipropane sulfonate, sodium N, N-dimethyl dithioformamide propane sulfonate and 3-sulfydryl-1-propanesulfonic acid inner salt in a mass ratio of (1-3): (1-5): (1-7), and meanwhile, the preferable polyether in the wetting agent is propylene glycol polyether, so that the acting effect of the additive is improved, and the obtained copper plating additive can be used under high current density, and has the advantages of low cost and high efficiency. And the electroplating efficiency is obviously improved. And meanwhile, the plating effect can be further improved, the finally prepared plating is bright, crystals are fine, internal stress is low, the plating has excellent ductility, the electroplating time is shortened, and meanwhile the workpiece quality is improved.
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Citation Information

Patent Citations

  • Compounding brightener for copper plating and preparation method thereof

    CN107177868A

  • HDI plate hole filling copper plating liquid composition

    CN115341250A

  • Blind hole filling electrocoppering solution for HDI plate and carrier plate

    CN111945192A

  • Glossing agent and application thereof

    CN116590765A

  • Ultrahigh-current-density horizontal acid copper electroplating additive, electroplating method and circuit board

    CN118461085A