Packaging method of packaging structure and packaging structure

By introducing electronic mount devices into 2.3D and 2.5D packaging structures and utilizing the cavity structure of the plastic-encapsulated layer, the challenges of thermal management and interconnect efficiency in packaging technology are solved, achieving higher integration and stress uniformity.

CN119764182APending Publication Date: 2025-04-04SKY CHIP INTERCONNECTION TECH CO LTD
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Patent Information

Application Number
CN202411846659.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

2.3D and 2.5D packaging technologies have challenges in thermal management efficiency and interconnection technology, and it is difficult to effectively improve the integration and stress distribution of the packaging structure.

Method used

By plating conductive columns on the carrier plate, placing the adapter plate and injection molding and etching the first plastic sealing layer forming the cavity, the electronic mounting device is flipped into the cavity, forming a first packaging structure, and then flipped and wired to build a second plastic sealing layer, and finally interconnecting the packaging structure and the packaging substrate through the conductive column.

Benefits of technology

The thermal management efficiency improvement and efficient interconnection technology of 2.3D and 2.5D packaging technologies are achieved, and the integration and stress distribution uniformity of the packaging structure are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a packaging method of a packaging structure and the packaging structure. The method comprises the following steps: providing a carrier plate; wherein the carrier plate is plated with a plurality of groups of conductive columns; placing an adapter plate between the bottoms of the conductive columns, and performing injection molding and etching above the adapter plate to form a first plastic package layer containing a cavity; the electronic surface-mounted device is inversely arranged in the cavity to form a first packaging structure on the carrier plate; inversely mounting the first packaging structure on the carrier plate so as to perform wiring, chip placement and construction of a second plastic packaging layer on the surface of the exposed adapter plate to form a second packaging structure on the carrier plate; and de-bonding the second packaging structure from the carrier plate, and forming interconnection between the second packaging structure and the packaging substrate by using the conductive columns to obtain a target packaging structure. The electronic surface-mounted device is introduced into the 2. 3D or 2.5 D packaging structure, and the electronic surface-mounted device and the interconnection structure thereof are embedded into the plastic packaging layer, so that improvement of thermal management efficiency and efficient interconnection of 2. 3D and 2.5 D packaging technologies can be realized.
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Citation Information

Cited By

  • Packaging method for packaging structure and packaging structure

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