Assembly process for composite surge suppressor

Abstract

The invention discloses an assembly process for a composite surge suppressor, and relates to the technical field of suppressor assembly, and the assembly process specifically comprises the following steps: step 1, firstly placing a Z-shaped frame on a placing plate of an assembly device, then conveying the Z-shaped frame to a position below a dispensing assembly, and dispensing the surface of the Z-shaped frame through a dispensing head, meanwhile, the chip is conveyed to the position above the dispensing position through the feeding mechanism and placed at the dispensing position; step 2, rotating a dispensing assembly, and limiting and extruding the chip through an extrusion mechanism; according to the process, composite packaging is completed through a simple planar packaging structure, and the product reliability and the heat dissipation capacity are improved. The problem of combined use on a surge suppression circuit is solved, the number of welding times is reduced, and the layout of PCB layout is improved. Through the arrangement of the clamping mechanism and the extrusion mechanism, the extrusion positioning device can be suitable for different types of products, and meanwhile, during extrusion positioning, limiting can be carried out, and deviation is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of suppressor assembly, and in particular to an assembly process for a composite surge suppressor. Background Art

[0002] The so-called transient interference includes electrostatic discharge, electrical fast transient pulse group, and lightning surge. "Electrostatic discharge" simulates the instantaneous discharge of accumulated charges when objects rub against each other in nature, especially the electrostatic discharge generated by the human body; "electrical fast transient pulse group" simulates a series of pulse interferences generated when the mechanical switch in the circuit switches the inductive load; "lightning surge" simulates the waveform induced by lightning on the power line or communication line.

[0003] During the assembly process of the existing suppressor, the chip needs to be glued and extruded. However, during the glued and extruded process, the chip is easy to deviate, resulting in inaccurate positioning. Therefore, an assembly process for a composite surge suppressor is involved. Summary of the invention

[0004] The purpose of the present invention is to provide an assembly process for a composite surge suppressor to solve the above technical problems.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] An assembly process for a composite surge suppressor comprises the following steps:

[0007] Step 1: First, place the Z-shaped frame on the placement plate of the assembly device, then transport it to the bottom of the glue dispensing component, use the glue dispensing head to dispense glue on the surface of the Z-shaped frame, and at the same time, use the feeding mechanism to transport the chip to the top of the glue dispensing location and place it at the glue dispensing location;

[0008] Step 2: Rotate the dispensing assembly to limit and extrude the chip through the extrusion mechanism; then dispense glue on the chip surface through the dispensing assembly again;

[0009] Step 3: When the placement plate moves to the clamping mechanism, the spring sheet is placed on the chip surface and squeezed by the clamping mechanism;

[0010] Step 4: Put the whole into the welding furnace for integration, and use epoxy resin glue to form black protection through mold injection; the external pins are electroplated and divided into particles, and after testing, they are packaged after appearance inspection.

[0011] As a further solution of the present invention: the assembling device comprises:

[0012] A conveyor frame for conveying a placement plate with a Z-shaped frame placed inside;

[0013] A glue dispensing component, the glue dispensing component is arranged on one side of the conveying frame, and the glue dispensing component is used to dispense glue on the surface of the Z-shaped frame or chip moved below the glue dispensing component;

[0014] A loading mechanism, which is arranged on the other side of the conveying frame and is used to convey the chip to the top of the glue dispensing location and place it at the glue dispensing location;

[0015] An extrusion mechanism, which is arranged on the glue dispensing component and is used to limit and extrude the chip;

[0016] The extrusion mechanism comprises a hollow plate with a central hole, on which a limiting wheel is arranged for synchronous movement to realize the center positioning of the chip; a pressing plate is arranged at the center of the hollow plate, which can be lifted and moved and is used for pressing the chip;

[0017] The clamping mechanism is arranged on one side of the dispensing component, and is used to place the spring sheet on the surface of the chip and squeeze it.

[0018] As a further solution of the present invention: the extrusion mechanism includes a connection plate connected to the dispensing assembly, a plurality of second cylinders are installed at the bottom of the connection plate, a hollow plate is fixedly installed at the bottom of the piston rod of the second cylinder, a rotating ring is rotatably connected inside the hollow plate, and teeth are provided on the rotating ring, the teeth are meshed with a plurality of pinions, one of the pinions is meshed with a first gear, and the first gear is driven to rotate by the clamping cylinder;

[0019] Each pinion is connected to a transmission gear through a transmission shaft, the transmission gear is meshed with a rack, an adjustment plate is fixedly mounted on the bottom of the rack, the adjustment plate passes through the hollow disk, and a limit wheel is arranged at the end of the adjustment plate.

[0020] As a further solution of the present invention: a third cylinder is fixedly installed at the inner center of the hollow disk, and a squeeze disk is fixedly installed at the bottom of the piston rod of the third cylinder.

[0021] As a further solution of the present invention: the glue dispensing assembly includes a rotating disk, a connecting rod is fixedly installed on the rotating disk, an L-shaped plate is fixedly installed on the top of the connecting rod, a first cylinder is fixedly installed on one side of the L-shaped plate, and a glue dispensing head is fixedly installed on the bottom of the piston rod of the first cylinder.

[0022] As a further solution of the present invention: the loading mechanism includes a frame, a lifting and adjusting box and a storage box are arranged on the frame, a lifting mechanism for driving the chips inside the storage box to rise is arranged inside the lifting and adjusting box, a horizontal movable guide rail is fixedly installed on the top of the frame, a fourth cylinder is slidably connected to the horizontal movable guide rail, a lifting plate is fixedly installed on the piston rod of the fourth cylinder, an adjustable suction cup is arranged on the lifting plate, and the suction cup is used to absorb chips of different sizes.

[0023] As a further solution of the present invention: the lifting mechanism includes a driving motor, the driving motor drives the screw rod to rotate, the screw rod is threadedly connected with a top plate, and the top plate is inserted into the storage box.

[0024] As a further solution of the present invention: the clamping mechanism includes a support frame, a rotating disk is provided on the support frame, two vertically arranged telescopic plates are fixedly installed on the rotating disk, a fifth cylinder is installed on each of the telescopic plates, a rotating plate is rotatably connected to the piston rod of the fifth cylinder, a first double-headed cylinder is fixedly installed on the bottom of one of the rotating plates, clamping plates are installed all around the first double-headed cylinder, a second double-headed cylinder is fixedly installed on the bottom of the other rotating plate, and limiting plates are symmetrically installed on both sides of the second double-headed cylinder.

[0025] As a further solution of the present invention: a conveyor belt is arranged on the conveyor frame and parallel to the clamping mechanism, and the conveyor belt is used to convey the shrapnel.

[0026] As a further solution of the present invention: four limiting grooves are provided on the placement plate.

[0027] Beneficial effects of the present invention:

[0028] The process of the present invention uses a simple planar packaging structure to complete the composite packaging, improve product reliability and heat dissipation capacity, and is beneficial to solve the combined use in the surge suppression circuit, reduce the number of welding times, and improve the layout of PCB layout.

[0029] The present invention is not only applicable to different types of products by arranging the clamping mechanism and the extruding mechanism, but also can limit the position during extrusion positioning to avoid deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be further described below in conjunction with the accompanying drawings.

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 It is a schematic diagram of the overall structure of the extrusion mechanism of the present invention;

[0033] Figure 3 It is a schematic diagram of the internal structure of the hollow disk of the present invention;

[0034] Figure 4 It is a schematic diagram of the overall structure of the feeding mechanism of the present invention;

[0035] Figure 5 It is a schematic diagram of the internal structure of the lifting and regulating box of the present invention;

[0036] Figure 6 It is a schematic diagram of the overall structure of the clamping mechanism of the present invention;

[0037] Figure 7 It is a schematic diagram of the overall structure of the suppressor of the present invention.

[0038] In the figure: 1, conveyor frame; 11, conveyor belt; 2, placement plate; 31, rotating disk; 32, connecting rod; 33, dispensing head; 34, first cylinder; 35, L-shaped plate; 4, extrusion mechanism; 41, connecting disk; 42, second cylinder; 43, hollow disk; 44, third cylinder; 45, adjustment plate; 46, limit wheel; 47, extrusion disk; 48, clamping cylinder; 49, first gear; 410, rotating ring; 411, teeth; 412, pinion; 413, transmission gear; 414, rack; 5, Feeding mechanism; 51. Frame; 52. Lifting adjustment box; 53. Horizontal moving guide rail; 54. Fourth cylinder; 55. Lifting plate; 56. Adjusting bolt; 57. Suction cup; 58. Storage box; 59. Moving plate; 510. Driving motor; 511. Screw rod; 512. Top plate; 6. Clamping mechanism; 61. Support frame; 62. Telescopic plate; 63. Rotating disk; 64. Rotating plate; 65. First double-headed cylinder; 66. Clamping plate; 67. Fifth cylinder; 68. Second double-headed cylinder; 69. Limiting plate. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] Example 1

[0041] See also Figure 1-7 As shown, the present invention is an assembly process for a composite surge suppressor, comprising the following steps:

[0042] Step 1: First, place the Z-shaped frame on the placement plate 2 of the assembly device, then transport it to the bottom of the glue dispensing assembly, use the glue dispensing head 33 to dispense glue on the surface of the Z-shaped frame, and at the same time, use the feeding mechanism 5 to transport the chip to the top of the glue dispensing location and place it at the glue dispensing location;

[0043] Step 2: Rotate the glue dispensing component to limit and extrude the chip through the extrusion mechanism 4; then dispense glue on the chip surface through the glue dispensing component again;

[0044] Step 3: When the placement plate 2 moves to the clamping mechanism 6, the spring sheet is placed on the chip surface and squeezed by the clamping mechanism 6;

[0045] Step 4: Put the whole into the welding furnace for integration, and use epoxy resin glue to form black protection through mold injection; the external pins are electroplated and divided into particles, and after testing, they are packaged after appearance inspection.

[0046] Example 2

[0047] See also Figure 1-7 As shown: the assembly device comprises:

[0048] The conveying frame 1 is used to convey a placement plate 2 with a Z-shaped frame placed inside; four limit grooves are opened on the placement plate 2. Because the frame is Z-shaped, four frames can be placed through the four limit grooves, which is convenient for overall transportation. A TSS chip or TVS chip and a spring are glued on every two frames.

[0049] A glue dispensing component, which is arranged on one side of the conveying frame 1 and is used for dispensing glue on the surface of the Z-shaped frame or chip moved below it;

[0050] A feeding mechanism 5, which is arranged on the other side of the conveying frame 1, and is used to convey the chip to the top of the glue dispensing location and place it at the glue dispensing location;

[0051] An extrusion mechanism 4, which is arranged on the glue dispensing component and is used to limit and extrude the chip;

[0052] The extrusion mechanism 4 comprises a hollow plate 43 having a central opening, on which a limiting wheel 46 is provided for synchronous movement to realize the centering of the chip; a pressing plate 47 is provided at the center of the hollow plate 43, which can be lifted and moved and is used for pressing the chip;

[0053] The clamping mechanism 6 is arranged at one side of the dispensing component, and is used to place the spring sheet on the chip surface and squeeze it.

[0054] See also Figure 1As shown, the glue dispensing assembly includes a rotating disk 31, a connecting rod 32 is fixedly installed on the rotating disk 31, an L-shaped plate 35 is fixedly installed on the top of the connecting rod 32, a first cylinder 34 is fixedly installed on one side of the L-shaped plate 35, a glue dispensing head 33 is fixedly installed at the bottom of the piston rod of the first cylinder 34, and the glue head 33 is connected to the storage tank through a pump.

[0055] See also Figure 2 and Figure 3 As shown, the extrusion mechanism 4 includes a connection plate 41 connected to the dispensing assembly, three second cylinders 42 are installed at the bottom of the connection plate 41, a hollow plate 43 is fixedly installed at the bottom of the piston rod of the second cylinder 42, and a rotating ring 410 is rotatably connected inside the hollow plate 43, and the rotating ring 410 is provided with teeth 411, and the teeth 411 are meshed with four pinions 412, one of which is meshed with a first gear 49, and the first gear 49 is driven to rotate by a clamping cylinder 48, and the clamping cylinder 48 is movably installed on the hollow plate 43;

[0056] Each pinion 412 is connected to a transmission gear 413 through a transmission shaft, and the transmission gear 413 is meshed with a rack 414. An adjustment plate 45 is fixedly installed at the bottom of the rack 414. The adjustment plate 45 is L-shaped and passes through the hollow disk 43. A limit wheel 46 is provided at the end of the adjustment plate 45. A third cylinder 44 is fixedly installed at the center of the hollow disk 43, and a squeeze disk 47 is fixedly installed at the bottom of the piston rod of the third cylinder 44;

[0057] Start the second cylinder 42 to drive the hollow plate 43 to descend, then start the clamping cylinder 48 to drive the first gear 49 to rotate, drive one of the pinions 412 to rotate, and drive the rotating ring 410 to rotate through the pinion 412, thereby synchronously driving the pinion 412 and the transmission gear 413 to rotate, thereby driving the rack 414 to move, and then driving the four limiting wheels 46 to move, so as to position the chip from all sides, which is suitable for chips of different sizes, and no matter how the feeding mechanism 5 is placed, it can achieve center positioning, and then start the third cylinder 44 to drive the extrusion plate 47 to descend, thereby extruding and fixing the chip, and limiting it through the four limiting wheels 46 to ensure that there is no deviation during the extrusion process.

[0058] See also Figure 4 and Figure 5As shown, the feeding mechanism 5 includes a frame 51, on which a lifting adjustment box 52 and a storage box 58 are provided, and a lifting mechanism for driving the chips inside the storage box 58 to rise is provided inside the lifting adjustment box 52, and a horizontal movable guide rail 53 is fixedly installed on the top of the frame 51, and a screw rod can be provided inside the horizontal movable guide rail 53 to drive the fourth cylinder 54 to move horizontally, and the fourth cylinder 54 is slidably connected to the horizontal movable guide rail 53, and a lifting plate 55 is fixedly installed on the piston rod of the fourth cylinder 54, and four movable plates 59 are connected to the lifting plate 55 by adjusting bolts 56, and bolt grooves are opened on the movable plates 59, and suction cups 57 are fixedly installed on the ends of the movable plates 59, and the length of the movable plates 59 is adjusted by adjusting the bolts 56, so as to be suitable for adsorbing chips of different sizes. The lifting mechanism includes a driving motor 510 , which drives a screw rod 511 to rotate, and can be driven to rotate by a pulley and a belt transmission. A top plate 512 is threadedly connected to the screw rod 511 , and the top plate 512 is inserted into the storage box 58 .

[0059] Place the chip in the storage box 58, start the drive motor 510, drive the screw rod 511 to rotate, and then drive the top plate 512 to lift the chip in the storage box 58; then start the fourth cylinder 54 to drive the suction cup 57 to descend, suck the chip, and then move it along the horizontal moving guide rail 53 to place it at the glue dispensing location;

[0060] See also Figure 6 As shown, the clamping mechanism 6 includes a support frame 61, on which a rotating disk 63 is provided, which can be driven to rotate by a motor, and on which two vertically arranged telescopic plates 62 are fixedly installed, and on which each telescopic plate 62 is installed a fifth cylinder 67, and on which a rotating plate 64 is rotatably connected to the piston rod of the fifth cylinder 67, which can be driven to rotate by a motor, a first double-headed cylinder 65 is fixedly installed at the bottom of one of the rotating plates 64, and clamping plates 66 are installed all around the first double-headed cylinder 65, and a second double-headed cylinder 68 is fixedly installed at the bottom of the other rotating plate 64, and limit plates 69 are symmetrically installed on both sides of the second double-headed cylinder 68. The clamping plates 66 and the limit plates 69 are arranged to be rotatable in order to make them more applicable.

[0061] A conveyor belt 11 is provided on the conveyor frame 1 and parallel to the clamping mechanism 6 , and the conveyor belt 11 is used to convey the shrapnel.

[0062] The L-shaped spring piece transported by the conveyor belt 11 is clamped by the clamping plate 66, and then moved to the top of the placement plate 2, and then placed at the glue dispensing location, and then limited from both sides by the limiting plate 69, squeezed by the bottom of the second double-headed cylinder 68, and then transported out.

[0063] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. An assembly process for a composite surge suppressor, characterized in that: The following steps are involved: Step 1: firstly place the Z-shaped frame on the placement plate (2) of the assembly device, then transport it to the bottom of the glue dispensing assembly, glue the surface of the Z-shaped frame through the glue dispensing head (33), and at the same time transport the chip to the top of the glue dispensing location through the feeding mechanism (5) and place it at the glue dispensing location; Step 2: Rotate the glue dispensing component to limit and extrude the chip through the extrusion mechanism (4); then dispense glue on the chip surface through the glue dispensing component again; Step 3: When the placement plate (2) moves to the clamping mechanism (6), the spring sheet is placed on the surface of the chip and squeezed by the clamping mechanism (6); Step 4: Put the whole into the welding furnace for integration, and use epoxy resin glue to form black protection through mold injection; the external pins are electroplated and divided into particles, and after testing, they are packaged after appearance inspection.

2. The assembly process for a composite surge suppressor according to claim 1, characterized in that: The assembling device comprises: A conveying frame (1) for conveying a placement plate (2) having a Z-shaped frame placed therein; A glue dispensing component, the glue dispensing component is arranged on one side of the conveying frame (1), and the glue dispensing component is used to dispense glue on the surface of the Z-shaped frame or chip moved below the glue dispensing component; A loading mechanism (5), the loading mechanism (5) being arranged on the other side of the conveying frame (1), the loading mechanism (5) being used to transport the chip to the top of the glue dispensing location and place it on the glue dispensing location; An extrusion mechanism (4), the extrusion mechanism (4) being arranged on the glue dispensing component, and the extrusion mechanism (4) being used to limit the position of the chip and to perform extrusion; The extrusion mechanism (4) comprises a hollow plate (43) with a central opening, and a limiting wheel (46) is arranged on the hollow plate (43) for synchronously moving to realize the center positioning of the chip; a squeezing plate (47) is arranged at the center of the hollow plate (43) and can be lifted and moved and is used to squeeze the chip; A clamping mechanism (6), wherein the clamping mechanism (6) is arranged on one side of the glue dispensing component, and the clamping mechanism (6) is used to place the spring sheet on the surface of the chip and squeeze it.

3. The assembly process for a composite surge suppressor according to claim 2, characterized in that: The extrusion mechanism (4) comprises a connection plate (41) connected to the dispensing assembly, a plurality of second cylinders (42) are installed at the bottom of the connection plate (41), a hollow plate (43) is fixedly installed at the bottom of the piston rod of the second cylinder (42), the hollow plate (43) is rotatably connected to a rotating ring (410) inside, the rotating ring (410) is provided with teeth (411), the teeth (411) are meshed with a plurality of pinions (412), one of the pinions (412) is meshed with a first gear (49), and the first gear (49) is driven to rotate by a clamping cylinder (48); Each pinion (412) is connected to a transmission gear (413) via a transmission shaft, and the transmission gear (413) is meshedly connected to a rack (414). An adjustment plate (45) is fixedly mounted on the bottom of the rack (414), and the adjustment plate (45) passes through the hollow disk (43). A limit wheel (46) is provided at the end of the adjustment plate (45).

4. The assembly process for a composite surge suppressor according to claim 2, characterized in that: A third cylinder (44) is fixedly mounted at the inner center of the hollow disk (43), and a pressing disk (47) is fixedly mounted at the bottom of the piston rod of the third cylinder (44).

5. The assembly process for a composite surge suppressor according to claim 2, characterized in that: The glue dispensing assembly comprises a rotating disk (31), a connecting rod (32) is fixedly mounted on the rotating disk (31), an L-shaped plate (35) is fixedly mounted on the top of the connecting rod (32), a first cylinder (34) is fixedly mounted on one side of the L-shaped plate (35), and a glue dispensing head (33) is fixedly mounted on the bottom of the piston rod of the first cylinder (34).

6. The assembly process for a composite surge suppressor according to claim 2, characterized in that: The loading mechanism (5) comprises a frame (51), on which a lifting and adjusting box (52) and a storage box (58) are arranged, and inside the lifting and adjusting box (52) is arranged a lifting mechanism for driving the chips inside the storage box (58) to rise, and a horizontal movable guide rail (53) is fixedly installed on the top of the frame (51), and a fourth cylinder (54) is slidably connected to the horizontal movable guide rail (53), and a lifting plate (55) is fixedly installed on the piston rod of the fourth cylinder (54), and an adjustable suction cup (57) is arranged on the lifting plate (55), and the suction cup (57) is used to absorb chips of different sizes.

7. The assembly process for a composite surge suppressor according to claim 6, characterized in that: The lifting mechanism comprises a driving motor (510), wherein the driving motor (510) drives a screw rod (511) to rotate, a top plate (512) is threadedly connected to the screw rod (511), and the top plate (512) is inserted into the storage box (58).

8. The assembly process for a composite surge suppressor according to claim 2, characterized in that: The clamping mechanism (6) comprises a support frame (61), a rotating disk (63) is provided on the support frame (61), two vertically arranged telescopic plates (62) are fixedly installed on the rotating disk (63), a fifth cylinder (67) is installed on each of the telescopic plates (62), a rotating plate (64) is rotatably connected to the piston rod of the fifth cylinder (67), a first double-headed cylinder (65) is fixedly installed on the bottom of one of the rotating plates (64), clamping plates (66) are installed on all four sides of the first double-headed cylinder (65), a second double-headed cylinder (68) is fixedly installed on the bottom of the other rotating plate (64), and limiting plates (69) are symmetrically installed on both sides of the second double-headed cylinder (68).

9. The assembly process for a composite surge suppressor according to claim 8, characterized in that: A conveyor belt (11) is arranged on the conveyor frame (1) and parallel to the clamping mechanism (6), and the conveyor belt (11) is used to convey the shrapnel.

10. The assembly process for a composite surge suppressor according to claim 8, characterized in that: The placement plate (2) is provided with four limiting grooves.

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