Camera modules and electronic equipment

Abstract

The present application relates to a camera module and electronic equipment, the camera module includes a circuit board, a photosensitive chip, a bracket and an electronic component, the bracket includes a base and a metal insert, the base includes a frame and a receiving platform, the frame is connected to the circuit board, the receiving platform is convexly arranged on the inner wall of the frame, the electronic component is connected to the receiving platform, the electronic component is located outside the photosensitive path of the photosensitive area, at least one of the inner wall of the frame and the receiving platform is provided with an electrical connection part, at least part of the metal insert is embedded in the bracket, the metal insert is electrically connected to the circuit board and the electrical connection part, and the electronic component is electrically connected to the electrical connection part. The camera module and electronic equipment of the present application can achieve miniaturization while taking into account the shooting performance of the camera module.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to camera modules and electronic equipment. Background Art

[0002] As a module that realizes the shooting function of electronic devices such as mobile phones, tablets, and smart watches, the imaging performance of the camera module directly affects the shooting experience of the electronic devices.

[0003] In the related art, in addition to the photosensitive chip, other electronic components need to be arranged around the corresponding photosensitive chip on the circuit board of the camera module, which is not conducive to the miniaturization of the camera module. Removing the electronic components will lead to a decrease in the shooting performance of the camera module. Summary of the invention

[0004] The present application provides a camera module and an electronic device to solve the technical problem of how to achieve miniaturization while taking into account the shooting performance of the camera module.

[0005] On the one hand, the present application provides a camera module, comprising:

[0006] Circuit boards;

[0007] A photosensitive chip having a photosensitive area and a non-photosensitive area around the photosensitive area, wherein a side of the photosensitive chip facing away from the photosensitive area is stacked on the circuit board;

[0008] A bracket, comprising a seat body and a metal insert, the seat body comprising a frame body and a receiving platform, the receiving platform is convexly arranged on the inner wall of the frame body, the frame body is arranged around the peripheral side of the photosensitive chip, the frame body is connected to the circuit board, at least one of the inner wall of the frame body and the receiving platform is provided with an electrical connection part, at least a part of the metal insert is embedded in the bracket, and the metal insert is electrically connected to the circuit board and the electrical connection part;

[0009] An electronic component is connected to the receiving platform, and the electronic component is located outside the photosensitive path of the photosensitive area, and the electronic component is electrically connected to the electrical connection part.

[0010] In one of the embodiments, the orthographic projection of the electronic component on the plane where the photosensitive chip is located at least partially falls into the photosensitive area.

[0011] In one embodiment, the circuit board is provided with a plurality of first solder pads, and one end of the frame connected to the circuit board is provided with a plurality of second solder pads, the plurality of first solder pads are correspondingly welded to the plurality of second solder pads, and the plurality of second solder pads are electrically connected to the metal insert.

[0012] In one embodiment, the photosensitive chip is rectangular, and the frame includes a first frame portion, a second frame portion, a third frame portion and a fourth frame portion arranged along the circumference of the photosensitive chip, a portion of the second solder pad is located in the first frame portion, and another portion of the second solder pad is located in the third frame portion, and a partial structure of the metal insert is embedded in the second frame portion or the fourth frame portion, and at least one of the second solder pads located in the first frame portion is electrically connected to at least one of the second solder pads located in the third frame portion.

[0013] In one embodiment, there are multiple electrical connection parts, the electronic components include multiple electronic components, and the multiple electronic components are electrically connected to the metal inlay through the multiple electrical connection parts.

[0014] In one of the embodiments, the camera module includes a filter, the filter is connected to the receiving platform, and the filter is located on the photosensitive path of the photosensitive area.

[0015] In one of the embodiments, the electronic component is connected to a side of the filter facing away from the receiving platform, or the electronic component is connected to a side of the receiving platform facing away from the filter.

[0016] In one of the embodiments, the camera module includes a lens assembly, and the lens assembly is arranged on the light-sensitive path of the light-sensitive area and connected to the bracket.

[0017] In one embodiment, the lens assembly includes a mounting seat and a plurality of lenses, the plurality of lenses are mounted on the mounting seat, and the mounting seat is integrally formed with the bracket.

[0018] In one embodiment, the camera module includes a filter, the filter is connected to the receiving platform, the filter is located on the photosensitive path of the photosensitive area, and the electronic component is connected to a side of the filter facing the photosensitive chip.

[0019] On the other hand, the present application provides an electronic device, including a device body and the above-mentioned camera module, wherein the camera module is connected to the device body.

[0020] The camera module and electronic device described above, the camera module includes a circuit board, a photosensitive chip, a bracket and an electronic component, the bracket includes a base and a metal insert, the base includes a frame and a receiving platform, the frame is connected to the circuit board, the receiving platform is convexly arranged on the inner wall of the frame, and the electronic component is connected to the receiving platform, so that the electronic component is arranged above the photosensitive chip, thereby making full use of the space enclosed by the bracket above the photosensitive chip, and then realizing the miniaturization of the camera module. Since the electronic component is located outside the photosensitive path of the photosensitive area, it will not interfere with the imaging quality of the photosensitive chip. And since at least one of the inner wall of the frame and the receiving platform is provided with an electrical connection part, at least part of the metal insert is embedded in the bracket, the metal insert is electrically connected to the circuit board and the electrical connection part, and the electronic component is electrically connected to the electrical connection part, so that the electronic component can be connected to the circuit board by using the metal insert, so as to maintain the performance requirements of the electronic component when the camera module is working, therefore, the present application scheme can take into account the shooting performance of the camera module while realizing miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a three-dimensional schematic diagram of an electronic device according to an embodiment.

[0023] Figure 2 It is a schematic diagram of the three-dimensional structure of an electronic device according to another embodiment.

[0024] Figure 3 The figure is a schematic cross-sectional structure diagram of a camera module according to one embodiment.

[0025] Figure 4 A schematic structural diagram of a bracket of a camera module according to one embodiment.

[0026] Figure 5 for Figure 4 The schematic diagram of the structure of the bracket of the camera module is shown as viewed from above.

[0027] Figure 6 A schematic diagram of the cross-sectional structure of a camera module according to another embodiment.

[0028] Figure 7 The figure is a schematic cross-sectional structure diagram of a camera module according to another embodiment.

[0029] Figure 8 This is a structural block diagram of the electronic device provided in this application.

[0030] Description of Figure Numbers:

[0031] 100, device body; 110, housing; 120, display screen; 200, camera module; 210, circuit board; 211, first solder pad; 220, photosensitive chip; 220a, photosensitive area; 220b, non-photosensitive area; 230, bracket; 231, seat; 231a, electrical connection part; 2311, frame; 2311a, first frame part; 2311b, second frame part; 2311c, third frame part; 2311d, four frame parts; 2312, receiving platform; 2313, second solder pad; 232, metal inlay; 240, electronic component; 250, filter; 260, lens assembly; 261, mounting seat; 262, lens. DETAILED DESCRIPTION

[0032] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0033] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0034] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0035] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0036] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0037] (1) Satellite phone or cellular phone;

[0038] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0039] (3) Radiotelephone, pager, Internet / Intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0040] (4) conventional laptop and / or handheld receivers;

[0041] (5) Conventional laptop and / or palmtop radiotelephone transceivers, etc.

[0042] An electronic device according to an embodiment of the present application, such as Figure 1 As shown, the electronic device can be a wearable device such as a smart bracelet, a smart watch, etc. Figure 2 As shown, the electronic device may also be a mobile phone. It is understood that the specific form of the electronic device may be other, such as a tablet computer, a notebook computer, a smart helmet, smart glasses, etc., which is not limited here.

[0043] like Figure 1 and Figure 2 As shown, the electronic device includes a device body 100 and a camera module 200. The camera module 200 is connected to the device body 100. The camera module 200 is used for shooting, so that the electronic device has a shooting function.

[0044] In some embodiments, the device body 100 includes a housing 110 and a display screen 120 connected to the housing 110. A receiving space is formed between the housing 110 and the display screen 120. The receiving space is used to receive the internal parts of the electronic device. The housing 110 can protect the internal parts of the electronic device. The housing 110 can be the back cover of the electronic device and cover the battery, motherboard and other components of the electronic device. The camera module 200 can be installed on the housing 110, and when shooting is required, the camera module 200 can receive external light for imaging.

[0045] It should be noted that the device body 100 may also not have the display screen 120 , that is, the display screen 120 is not necessary for the device body 100 .

[0046] The camera module 200 may be a conventional camera, for example, a plurality of lenses are arranged in a straight line along the optical axis. In some embodiments, the camera module 200 may also be a periscope camera implemented by using edges or reflectors to change the light propagation path. The type of the camera module 200 is not limited here.

[0047] The structure of the camera module 200 will be further described below.

[0048] Combination Figure 3 As shown, the camera module 200 includes a circuit board 210 , a photosensitive chip 220 , a bracket 230 and electronic components 240 .

[0049] The circuit board 210 may be a PCB, i.e. a printed circuit board. In some embodiments, the PCB includes a first hard board portion, a soft board portion, and a second hard board portion, wherein the soft board portion is connected between the first hard board portion and the second hard board portion. The photosensitive chip 220 is disposed on the first hard board portion. The PCB is provided with a connector, which is disposed on the second hard board portion, so as to electrically connect the PCB with other components of the electronic device such as a main board by using the connector, so as to pave the way for the camera module 200 to perform the shooting function in the electronic device.

[0050] The photosensitive chip 220 can be connected to the circuit board 210 through a patch process. The photosensitive chip 220 is used to convert light into electrical signals when receiving light, and then convert it into digital signals through analog-to-digital conversion to meet the needs of digital imaging.

[0051] The types of the photosensitive chip 220 may include CCD (Charge Coupled Device) elements, CMOS (Complementary Metal Oxide Semiconductor) devices, photosensitive diodes, etc. In terms of color, the photosensitive chip 220 may be a color light sensor, a monochromatic light sensor, an infrared light sensor, a grayscale sensor, etc. The type of the photosensitive chip 220 is not limited here.

[0052] The photosensitive chip 220 has a photosensitive area 220 a and a non-photosensitive area 220 b located around the photosensitive area 220 a. The side of the photosensitive chip 220 facing away from the photosensitive area 220 a is stacked on the circuit board 210 .

[0053] The bracket 230 includes a base 231 and a metal insert 232. The base 231 includes a frame 2311 and a receiving platform 2312. The frame 2311 is arranged around the periphery of the photosensitive chip 220, and the frame 2311 is connected to the circuit board 210. The receiving platform 2312 is convexly arranged on the inner wall of the frame 2311, and the electronic component 240 is connected to the receiving platform 2312, so that the electronic component 240 is arranged above the photosensitive chip 220, thereby making full use of the space enclosed by the bracket 230 above the photosensitive chip 220, and then realizing the miniaturization of the camera module 200.

[0054] It should be noted that the electronic component 240 is located outside the light sensing path of the light sensing area 220 a , so as not to interfere with the imaging quality of the light sensing chip 220 .

[0055] At least one of the inner wall of the frame 2311 and the receiving platform 2312 is provided with an electrical connection portion 231a, and at least a portion of the metal insert 232 is embedded in the bracket 230. The metal insert 232 is electrically connected to the circuit board 210 and the electrical connection portion 231a, and the electronic component 240 is electrically connected to the electrical connection portion 231a, so that the metal insert 232 can be used to connect the electronic component 240 to the circuit board 210, thereby maintaining the performance requirements of the electronic component 240 when the camera module 200 is working.

[0056] The camera module 200 of the present application, on the one hand, makes full use of the space enclosed by the bracket 230 above the photosensitive chip 220 to set the electronic component 240 to achieve miniaturization; on the other hand, the electronic component 240 is electrically connected to the circuit board 210 by using the metal insert 232 set on the base 231 to ensure the shooting performance of the camera module 200. Therefore, the solution of the present application can take into account the shooting performance of the camera module 200 while achieving miniaturization.

[0057] In some embodiments, the orthographic projection of the electronic component 240 on the plane where the photosensitive chip 220 is located at least partially falls into the photosensitive area 220a, so that the electronic component 240 can use part of the space above the photosensitive area 220a, improve space utilization, and further realize the miniaturization of the camera module 200. It should be noted here that when the external light enters the photosensitive area 220a to make the camera module 200 perform imaging, the light beam incident on the photosensitive chip 220 is not completely vertically incident on the photosensitive area 220a, but is incident on the photosensitive area 220a after focusing processing, so that the photosensitive light path of the photosensitive area 220a is cone-shaped near the position of the photosensitive area 220a, and therefore, there is a part of the space above the photosensitive area 220a that does not need light to pass through. Therefore, in the embodiment of the present application, the orthographic projection of the electronic component 240 on the plane where the photosensitive chip 220 is located at least partially falls into the photosensitive area 220a, and can still be located outside the photosensitive path of the photosensitive area 220a to avoid blocking the external light from entering the photosensitive area 220a, ensuring that the imaging quality of the camera module 200 is not affected by the light shielding of the electronic component 240. Then, under this structural setting, the imaging quality of the camera module 200 can be improved while achieving miniaturization.

[0058] The photosensitive chip 220 and the circuit board 210 may be electrically connected via metal wires. In some embodiments, a solder joint may be provided in the non-photosensitive area 220b of the photosensitive chip 220, one end of the metal wire is connected to the solder joint, and the other end is connected to the solder joint on the circuit board 210, so that the metal wire conductor connects the photosensitive chip 220 and the circuit board 210.

[0059] In the present application, the welding methods between the components involved in welding include but are not limited to hot pressing welding, solder reflow welding or low melting point alloy welding. For example, in an embodiment where the photosensitive chip 220 and the circuit board 210 are electrically connected by a metal wire, one end of the metal wire can be welded to the photosensitive chip 220 by hot pressing welding, solder reflow welding or low melting point alloy welding, and the other end can be welded to the circuit board 210 by hot pressing welding, solder reflow welding or low melting point alloy welding.

[0060] In some embodiments, the circuit board 210 is provided with a plurality of first pads 211, and a plurality of second pads 2313 are provided at one end of the frame 2311 connected to the circuit board 210. The plurality of first pads 211 are correspondingly welded with the plurality of second pads 2313, and the plurality of second pads 2313 are electrically connected to the metal insert 232. In this way, the circuit board 210 can be electrically connected to the metal insert 232. In this embodiment, since the number of the first pads 211 and the second pads 2313 are both multiple, the electrical connection requirements between the plurality of electronic components 240 and the circuit board 210 can be met.

[0061] In some embodiments, the photosensitive chip 220 is rectangular. Figure 4 As shown, the frame 2311 includes a first frame portion 2311a, a second frame portion 2311b, a third frame portion 2311c and a fourth frame portion 2311d which are arranged along the peripheral side of the photosensitive chip 220.

[0062] Combination Figure 5 As shown, a portion of the second pad 2313 is located in the first frame portion 2311a, another portion of the second pad 2313 is located in the third frame portion 2311c, a portion of the structure of the metal insert 232 is embedded in the second frame portion 2311b or the fourth frame portion 2311d, and at least one second pad 2313 located in the first frame portion 2311a is electrically connected to at least one second pad 2313 located in the third frame portion 2311c. In this embodiment, the metal insert 232 can be arranged by utilizing the wall thickness of the second frame portion 2311b or the fourth frame portion 2311d, thereby making full use of the structural design space of the frame 2311, so as to facilitate the miniaturization of the camera module 200.

[0063] It should be noted that the embedding position of the metal insert 232 in the frame 2311 and the specific shape of the metal insert 232 are not limited here. When the second pads 2313 are provided on different frame parts of the frame 2311, the metal insert 232 can be adapted to electrically connect the second pads 2313 located on different frame parts of the frame 2311, so that the second pads 2313 are electrically connected to the electronic components 240 at the corresponding positions on the receiving platform 2312.

[0064] In some embodiments, there are multiple electrical connection parts 231a, and the electronic components 240 include multiple electronic components 240, and the multiple electronic components 240 are electrically connected to the metal insert 232 through the multiple electrical connection parts 231a. Thus, the need to improve the shooting performance of the camera module 200 is met by using multiple electronic components 240.

[0065] There is no limitation on the number of the electronic components 240. The types of the electronic components 240 include, but are not limited to, resistors, capacitors, or inductors, which are not limited here.

[0066] Combination Figure 6 As shown, in some embodiments, the camera module 200 includes a filter 250, and the filter 250 is connected to the receiving platform 2312. The filter 250 is located on the light sensing path of the light sensing area 220a to exert a light filtering effect.

[0067] The filter 250 is connected to the side of the receiving platform 2312 facing away from the photosensitive chip 220 .

[0068] In other embodiments, in combination Figure 7 As shown, the filter 250 can also be connected to the side of the receiving platform 2312 facing the photosensitive chip 220. The setting position of the filter 250 is not limited here, as long as the filter 250 is located on the photosensitive path of the photosensitive area 220a to exert the filtering effect.

[0069] The electronic component 240 may be disposed on the optical filter 250 so as to be connected to the receiving platform 2312 together with the optical filter 250. The electronic component 240 and the optical filter 250 may also be connected to the receiving platform 2312 independently.

[0070] The locations of the electronic component 240 and the filter 250 are not limited here.

[0071] For example, combined with Figure 3 As shown, the electronic component 240 is connected to the side of the receiving platform 2312 facing away from the filter 250 .

[0072] For example, combining Figure 6 As shown, in some embodiments, the electronic component 240 is connected to a side of the filter 250 that faces away from the receiving platform 2312 .

[0073] It should be noted that, in some embodiments, the camera module 200 further includes a lens assembly 260, which is disposed on the light sensing path of the light sensing area 220a and connected to the bracket 230. The lens assembly 260 is used to process external light so as to process the light into light that can adapt to the imaging chip for imaging.

[0074] Specifically, the external light passes through the lens assembly 260 and irradiates the photosensitive area 220a of the photosensitive chip 220. The photosensitive chip 220 converts the light transmitted from the lens assembly 260 into an electrical signal, and then converts it into a digital signal through analog-to-digital conversion.

[0075] The lens assembly 260 includes a mounting seat 261 and a plurality of lenses 262. The plurality of lenses 262 are mounted on the mounting seat 261. The plurality of lenses 262 are arranged on the mounting seat 261 along the optical axis direction of the lens assembly 260. The number of lenses 262 can be 2 or more than 2. The type, number and arrangement structure of the lenses 262 arranged in the mounting seat 261 are not limited here.

[0076] In some embodiments, the lens assembly 260 includes a lens barrel (not shown), which is connected to a mounting seat 261. A plurality of lenses 262 may be installed in the lens barrel to be connected to the mounting seat 261 through the lens barrel.

[0077] The lens barrel is movably connected to the mounting seat 261, so that the lens barrel can adjust its position relative to the mounting seat 261, thereby achieving focusing. For example, the lens assembly 260 includes a voice coil motor (not shown), which is arranged between the lens barrel and the mounting seat 261. The voice coil motor is used to drive the lens barrel to move relative to the mounting seat 261, so that the lens 262 arranged on the lens barrel moves away from or close to the photosensitive chip 220 along the photosensitive path of the photosensitive area 220a, so as to achieve optical focusing.

[0078] The connection method between the mounting base 261 and the bracket 230 includes but is not limited to glue connection or hot melt connection.

[0079] For example, combined with Figure 8 As shown, the mounting seat 261 is integrally formed with the bracket 230. In some embodiments, the mounting seat 261 and the bracket 230 are integrally formed by injection molding. The mounting seat 261 and the bracket 230 can both be made of plastic. In this way, the mounting seat 261 and the bracket 230 can be integrally formed by injection molding, that is, the mounting seat 261 and the bracket 230 are an integral structural member. This reduces the number of parts, reduces the assembly complexity of the camera module 200, and reduces the processing cost of the camera module 200.

[0080] It should be noted that the arrangement positions of the electronic component 240 and the optical filter 250 can be adjusted according to the structural arrangement of the bracket 230. For example, in some embodiments, the side of the receiving platform 2312 facing away from the photosensitive chip 220 is integrally formed with the mounting seat 261, and thus, the optical filter 250 cannot be arranged on the side of the receiving platform 2312 facing away from the photosensitive chip 220. In this embodiment, the optical filter 250 is connected to the receiving platform 2312, and the electronic component 240 is connected to the side of the optical filter 250 facing the photosensitive chip 220.

[0081] Combination Figure 8 , Figure 8 The circuit module block diagram of the device body 100 of the electronic device provided in the embodiment of the present application. The device body 100 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Figure 8 The structure of the device body 100 shown in the figure does not constitute a limitation on the device body 100, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0082] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Generally, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the Global System of Mobile Communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0083] The memory 502 can be used to store applications and data. The applications stored in the memory 502 include executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the device body 100 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0084] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch panel or touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0085] Furthermore, the touch-sensitive surface may cover a liquid crystal panel. When the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event. The processor 508 then provides corresponding visual output on the liquid crystal panel according to the type of touch event.

[0086] The display unit 504 may be used to display information input by a user or information provided to a user and various graphical user interfaces of the device body 100 . These graphical user interfaces may be composed of graphics, texts, icons, videos, and any combination thereof.

[0087] Although in Figure 8In the embodiment, the touch sensitive surface and the liquid crystal panel are used as two independent components to realize input and output functions, but in some embodiments, the touch sensitive surface and the liquid crystal panel can be integrated to realize input and output functions. It can be understood that the device body 100 can include an input unit 503 and a display unit 504.

[0088] The device body 100 may also include at least one sensor 505, such as a proximity sensor, a motion sensor, and other sensors. Among them, the proximity sensor can turn off the LCD panel and / or the backlight when the device body 100 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that can be configured with the device body 100, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0089] The audio circuit 506 can provide an audio interface between the user and the device body 100 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another device body 100 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the device body 100.

[0090] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The device body 100 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507. It provides users with wireless broadband Internet access. Figure 8 A wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the device body 100 and can be omitted as needed without changing the essence of the invention.

[0091] The processor 508 is the control center of the device body 100. It uses various interfaces and lines to connect various parts of the entire device body 100. By running or executing the application program stored in the memory 502 and calling the data stored in the memory 502, it executes various functions of the device body 100 and processes data, thereby monitoring the device body 100 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface and application program, etc., and the modem processor mainly processes wireless communication. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0092] The device body 100 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0093] although Figure 8 Not shown, the device body 100 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0094] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A camera module, characterized in that: include: Circuit boards; A photosensitive chip having a photosensitive area and a non-photosensitive area around the photosensitive area, wherein a side of the photosensitive chip facing away from the photosensitive area is stacked on the circuit board; A bracket, comprising a seat body and a metal insert, the seat body comprising a frame body and a receiving platform, the receiving platform is convexly arranged on the inner wall of the frame body, the frame body is arranged around the peripheral side of the photosensitive chip, the frame body is connected to the circuit board, at least one of the inner wall of the frame body and the receiving platform is provided with an electrical connection part, at least a part of the metal insert is embedded in the bracket, and the metal insert is electrically connected to the circuit board and the electrical connection part; An electronic component is connected to the receiving platform, and the electronic component is located outside the photosensitive path of the photosensitive area, and the electronic component is electrically connected to the electrical connection part.

2. The camera module according to claim 1, characterized in that: The orthographic projection of the electronic component on the plane where the photosensitive chip is located at least partially falls into the photosensitive area.

3. The camera module according to claim 1 or 2, characterized in that: The circuit board is provided with a plurality of first solder pads, and one end of the frame connected to the circuit board is provided with a plurality of second solder pads, the plurality of first solder pads are correspondingly welded with the plurality of second solder pads, and the plurality of second solder pads are electrically connected to the metal insert.

4. The camera module according to claim 3, characterized in that: The photosensitive chip is rectangular, and the frame includes a first frame portion, a second frame portion, a third frame portion and a fourth frame portion arranged along the circumference of the photosensitive chip, a portion of the second solder pad is located in the first frame portion, and another portion of the second solder pad is located in the third frame portion, and a partial structure of the metal insert is embedded in the second frame portion or the fourth frame portion, and at least one of the second solder pads located in the first frame portion is electrically connected to at least one of the second solder pads located in the third frame portion.

5. The camera module according to claim 3, characterized in that: There are a plurality of electrical connection parts, and the electronic components include a plurality of electronic components, and the plurality of electronic components are electrically connected to the metal insert via the plurality of electrical connection parts.

6. The camera module according to claim 1, characterized in that: The camera module comprises a filter, the filter is connected to the receiving platform, and the filter is located on the photosensitive path of the photosensitive area.

7. The camera module according to claim 6, characterized in that: The electronic component is connected to a side of the filter facing away from the receiving platform, or the electronic component is connected to a side of the receiving platform facing away from the filter.

8. The camera module according to claim 1, characterized in that: The camera module comprises a lens assembly, and the lens assembly is arranged on the light-sensing path of the light-sensing area and connected to the bracket.

9. The camera module according to claim 8, characterized in that: The lens assembly comprises a mounting seat and a plurality of lenses, the plurality of lenses are mounted on the mounting seat, and the mounting seat is integrally formed with the bracket.

10. The camera module according to claim 9, characterized in that: The camera module includes a filter, which is connected to the receiving platform and is located on the photosensitive path of the photosensitive area. The electronic component is connected to a side of the filter facing the photosensitive chip.

11. An electronic device, characterized in that: It comprises a device body and the camera module according to any one of claims 1 to 10, wherein the camera module is connected to the device body.

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