Assembly method of optical anti-shake photosensitive component

Abstract

The invention discloses an assembling method of an optical anti-shake photosensitive component, which comprises the following steps of: a, providing a first bearing component, a second bearing component and a third movable plate, and installing the third movable plate between the first bearing component and the second bearing component to form a bearing platform; b, at least one driving coil and a photosensitive chip are installed on the bearing platform to form a main body assembly; c, providing a base plate, and mounting the main body assembly on the base plate to form a middle base plate; and d, oppositely arranging at least one driving magnet and the driving coil in the optical axis direction of the photosensitive chip. Through a three-section type assembly method, the area of a single movable plate is reduced, and the yield of the movable substrate is improved.

Description

Technical Field

[0001] The invention relates to the field of electronic technology, and in particular to an assembling method of an optical image stabilization photosensitive component. Background Art

[0002] Electronic devices have gradually become an indispensable social and entertainment tool in people's daily lives, and people's requirements for electronic devices are getting higher and higher. In terms of video, people are increasingly interested in the performance of video anti-shake in order to obtain photos with higher image quality. The increase in the chip image surface can effectively increase the light flux per unit time and further improve the image quality. However, the increase in the chip image surface will be accompanied by the increase in the lens, resulting in an increase in the lens' own weight. Therefore, the driving force and stroke of the common lens anti-shake motor are difficult to meet the demand.

[0003] The principle of photosensitive chip anti-shake technology is similar to that of lens anti-shake. Usually, the photosensitive chip is set on a movable substrate and electrically connected to the movable substrate. The movable substrate is electrically connected to the external circuit through a flexible holding component to achieve electrical connection between the photosensitive chip and the external circuit. During the chip anti-shake process, the movable substrate carries the photosensitive chip to move and pulls and squeezes the flexible holding component. The flexible holding component can deformably electrically connect the movable substrate and the external circuit.

[0004] However, it is very difficult to manufacture a movable substrate with a larger area by semiconductor technology, which will further affect the yield of the movable substrate and cause poor imaging quality of the photosensitive chip. Summary of the invention

[0005] An object of the present invention is to provide an assembly method of an optical image stabilization photosensitive component, so as to improve the yield rate of a movable substrate.

[0006] In order to achieve the above purpose, the technical solution adopted by the present invention is:

[0007] An assembling method of an optical image stabilization photosensitive component comprises the following steps:

[0008] a. providing a first bearing assembly, a second bearing assembly and a third movable plate, wherein the first bearing assembly comprises a first movable plate, a first fixed plate and a plurality of first flexures conductively connecting the first movable plate and the first fixed plate, and the second bearing assembly comprises a second movable plate, a second fixed plate and a plurality of second flexures conductively connecting the second movable plate and the second fixed plate, and the third movable plate is installed between the first bearing assembly and the second bearing assembly to form a bearing platform, wherein the third movable plate is conductively connected to the first movable plate and the second movable plate, and the first movable plate, the second movable plate and the third movable plate form a movable assembly;

[0009] b. Installing at least one driving coil and a photosensitive chip on the movable component to form a main component;

[0010] c. providing a base plate, and installing the main body assembly on the base plate to form an intermediate base plate;

[0011] d. Arrange at least one driving magnet and the driving coil relative to each other in the direction of the optical axis of the photosensitive chip.

[0012] Preferably, step a specifically includes: bonding one side of the third movable plate to the first movable plate of the first supporting assembly, and bonding the other opposite side of the third movable plate to the second movable plate of the second supporting assembly, so that the first movable plate, the second movable plate and the third movable plate are conductively connected to form an integral movable assembly to carry the photosensitive chip and the driving coil.

[0013] As a preferred embodiment, step a specifically includes: providing a first reinforcement plate, a second reinforcement plate and a third reinforcement plate, attaching the first movable plate and the second movable plate to the opposite ends of the third reinforcement plate, attaching the third movable plate to the middle area of ​​the third reinforcement plate, and conductively bonding the first movable plate and the second movable plate respectively located on the opposite sides to form an integrated movable component capable of carrying the photosensitive chip and the driving coil, bonding the first reinforcement plate to the first fixed plate, and bonding the second reinforcement plate to the second fixed plate.

[0014] Preferably, the first bearing assembly further includes at least two retaining assemblies, which are installed at both ends of the first movable plate and the first fixed plate of the first bearing assembly, so that the first movable plate and the first fixed plate are movably connected, and the second bearing assembly further includes at least two retaining assemblies, which are installed at both ends of the second movable plate and the second fixed plate of the second bearing assembly, so that the second movable plate and the second fixed plate are movably connected.

[0015] Preferably, step b specifically includes: attaching the photosensitive chip to the central area of ​​the upper surface of the movable component, and connecting the photosensitive component and the supporting platform to form the main component.

[0016] As a preference, the main component further comprises a Hall element, and the Hall element is welded to the movable component.

[0017] Preferably, step b specifically includes: attaching the drive coil to the upper surface of the movable component, and welding the drive coil to the movable component so that the drive coil is fixed and conductive to the movable component, and the drive coil surrounds the outside of the Hall element.

[0018] Preferably, the number of the drive coils is three, wherein the first drive coil and the second drive coil are arranged in parallel on the third movable plate and are located on opposite sides of the photosensitive chip, and the third drive coil is arranged on the first movable plate, and the long side direction of the third drive coil is perpendicular to the long side direction of the first drive coil and the second drive coil.

[0019] Preferably, step c specifically includes: attaching the first fixing plate and the second fixing plate of the main component to the base plate, and connecting the first fixing plate and the base plate, and the second fixing plate and the base plate, so that the main component and the base plate are fixed and connected to form an intermediate base plate.

[0020] Preferably, step d specifically includes: d1, providing a bracket, fixing the driving magnet on the inner surface of the bracket to form an upper cover assembly; d2, installing the upper cover assembly on the intermediate base plate to accommodate the main body assembly between the base plate and the upper cover assembly, wherein the driving magnet and the driving coil are arranged relative to each other in the direction of the optical axis of the photosensitive chip.

[0021] As a preferred embodiment, step d1 also includes: d11: providing at least one magnetic sheet, and bonding the magnetic sheet to the inner surface of the bracket to isolate the magnetic field of the driving magnet from the magnetic field outside the optical image stabilization photosensitive component; d12: bonding the driving magnet to the lower surface of the magnetic sheet to form the upper cover assembly.

[0022] Preferably, the upper cover assembly further comprises a color filter, and the color filter is mounted on the color filter mounting position of the bracket to filter out stray light.

[0023] Preferably, the first fixed plate, the second fixed plate, the first movable plate, the second movable plate, the third movable plate, the first flexible member and the second flexible member are formed by semiconductor process.

[0024] Preferably, the first fixed plate, the first movable plate and the first flexible members are integrally formed, and the second fixed plate, the second movable plate and the second flexible members are integrally formed.

[0025] Preferably, step a also includes: welding the two ends of several of the first flexible members to the first fixed plate and the first movable plate respectively to connect the first fixed plate and the first movable plate, and welding the two ends of several of the second flexible members to the second fixed plate and the second movable plate respectively to connect the second fixed plate and the second movable plate.

[0026] Preferably, the intermediate base plate further comprises a plurality of support blocks, and the support blocks extend upward from the base plate to the first fixed plate, the second fixed plate or the movable component.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] (1) The three-stage assembly method can reduce the area of ​​a single movable plate and improve the yield of the movable substrate;

[0029] (2) The fixed plate and the movable plate are formed by semiconductor technology, which can improve the yield of the forming and further improve the yield of the optical image stabilization photosensitive component after assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a structural diagram of a first bearing assembly according to some embodiments of the present application;

[0031] Figure 2 is a structural diagram of a second bearing assembly according to some embodiments of the present application;

[0032] Figure 3 is a structural diagram of a carrier platform according to some embodiments of the present application;

[0033] Figure 4 is a structural diagram of a main assembly according to some embodiments of the present application;

[0034] Figure 5 is a structural diagram of a main body component according to some other embodiments of the present application;

[0035] Figure 6 is a structural diagram of an intermediate substrate according to some embodiments of the present application;

[0036] Figure 7 is an internal structural diagram of an optical image stabilization photosensitive component according to some embodiments of the present application;

[0037] Figure 8 is a structural diagram of an upper cover assembly according to some embodiments of the present application;

[0038] Fig. 9 is a schematic diagram of a support block according to some embodiments of the present application;

[0039] Fig.10 is a top view of an optical image stabilization photosensitive component according to some embodiments of the present application;

[0040] Fig.11 This application is along Fig.10 Sectional view in the AA direction;

[0041] Fig.12 This application Fig.11 An enlarged schematic diagram of part B in the middle.

[0042] In the figure: 1. optical image stabilization photosensitive component; 20. bearing platform; 21. first bearing component; 211. first movable plate; 212. first fixed plate; 213. first flexible member; 22. second bearing component; 221. second movable plate; 222. second fixed plate; 223. second flexible member; 23. third movable plate; 30. movable component; 40. holding component; 50. main body component; 51. drive coil; 511. first drive coil; 512. second drive coil; 513. third drive coil; 52. photosensitive chip; 53. Hall element; 60. intermediate base plate; 61. base plate; 62. support block; 70. upper cover component; 71. bracket; 72. drive magnet; 73. magnetic suction sheet; 74. color filter; 81. first reinforcement plate; 82. second reinforcement plate; 83. third reinforcement plate. DETAILED DESCRIPTION

[0043] The present invention is further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0044] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present invention.

[0045] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0046] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0047] An assembling method of an optical image stabilization photosensitive component 1 comprises the following steps:

[0048] a. Provide a first bearing assembly 21, a second bearing assembly 22 and a third movable plate 23, such as Figure 1 As shown, the first bearing assembly 21 includes a first movable plate 211, a first fixed plate 212, and a plurality of first flexures 213 conductively connecting the first movable plate 211 and the first fixed plate 212. Figure 2 As shown, the second bearing assembly 22 includes a second movable plate 221, a second fixed plate 222, and a plurality of second flexures 223 conductively connecting the second movable plate 221 and the second fixed plate 222. Figure 3 As shown, the third movable plate 23 is installed between the first bearing assembly 21 and the second bearing assembly 22 to form a bearing platform 20, wherein the third movable plate 23 is electrically connected to the first movable plate 211 and the second movable plate 221, and the first movable plate 211, the second movable plate 221 and the third movable plate 23 form a movable assembly 30;

[0049] b. Figure 4 and Figure 5 As shown, at least one driving coil 51 and a photosensitive chip 52 are installed on the movable component 30 to form a main component 50;

[0050] c. Figure 7 As shown, a base plate 61 is provided, and the main body assembly 50 is mounted on the base plate 61 to form an intermediate base plate 60, as shown in FIG. Figure 6 As shown; d. at least one driving magnet 72 and the driving coil 51 are arranged relative to each other in the direction of the optical axis of the photosensitive chip 52.

[0051] That is to say, the movable component 30 is divided into the first movable plate 211, the second movable plate 221 and the third movable plate 23, so that the area of ​​a single movable plate can be reduced, which is conducive to the separate semiconductor process molding, so as to improve the yield of the movable component 30. Specifically, a large semiconductor substrate is prone to bending during molding, and as long as there is a defect on the semiconductor substrate, the entire semiconductor substrate is considered defective. Splitting the movable component 30 can reduce the risk of bending or defects in a single movable plate during molding. The first movable plate 211 and the second movable plate 221 are respectively connected to the third movable plate 23, so that the first bearing component 21, the third movable plate 23 and the second bearing component 22 are further connected in sequence to form the bearing platform 20.

[0052] In an alternative embodiment, if Figure 4 and Figure 5 As shown, the driving coil 51 is first installed on the movable component 30, and then the photosensitive chip 52 is installed between the driving coils 51 with reference to the driving coil 51, so as to reduce the influence of the installation deviation on the travel of the movable component 30 relative to the first fixed plate 212 and the second fixed plate 222. It can be understood that if the photosensitive chip 52 is installed first, and then the driving coil 51 is installed with reference to the photosensitive chip 52, the installation deviation of the driving coil 51 relative to the movable component 30 is: the sum of the installation deviation of the photosensitive chip 52 relative to the movable component 30 and the installation deviation of the driving coil 51 relative to the photosensitive chip 52. It is worth mentioning that the movement travel of the movable component 30 relative to the first fixed plate 212 and the second fixed plate 222 is affected by the position of the driving coil 51. Therefore, installing the driving coil 51 first can reduce the installation deviation of the driving coil 51 relative to the movable component 30, which is conducive to reducing the influence of the installation on the movement range of the movable component 30 in the optical image stabilization photosensitive component 1.

[0053] In some embodiments, Figure 3As shown, step a specifically includes: bonding one side of the third movable plate 23 to the first movable plate 211 of the first bearing assembly 21, and bonding the other opposite side of the third movable plate 23 to the second movable plate 221 of the second bearing assembly 22, so that the first movable plate 211, the second movable plate 221 and the third movable plate 23 are conductively connected and form an integral movable assembly 30, which can carry the photosensitive chip 52 and the driving coil 51. Specifically, the first bearing assembly 21 and the second bearing assembly 22 are respectively located on the opposite sides of the third movable plate 23, wherein the first movable plate 211 of the first bearing assembly 21 is adjacent to the third movable plate 23, and the second movable plate 221 of the second bearing assembly 22 is adjacent to the third movable plate 23, and the first movable plate 211, the third movable plate 23 and the second movable plate 221 are bonded by conductive glue, so that the first movable plate 211, the second movable plate 221 and the third movable plate 23 can be connected to each other. The movable plate 23 forms the movable component 30 that is conductive as a whole, and is conductively connected to the first fixed plate 212 and the second fixed plate 222 through the first flexure 213 and the second flexure 223, respectively, to form the conductive carrying platform 20 that is conductive as a whole. When the drive coil 51 and the photosensitive chip 52 are subsequently installed on the movable component 30, it is beneficial for the drive coil 51 and the photosensitive chip 52 to be routed through the movable component 30 and to form an electrical connection with the first fixed plate 212 and the second fixed plate 222. It is worth mentioning that, compared with the integral molding of the movable component 30, the three-stage assembly can improve the yield of the movable component 30 by conductively bonding the first movable plate 211 and the third movable plate 23, and conductively bonding the second movable plate 221 and the third movable plate 23. At the same time, the glue bonding operation is simple and easy to realize automation, which is conducive to improving the degree of automation of production.

[0054] In some embodiments, Figure 4As shown, step a specifically includes: providing a first reinforcement plate 81, a second reinforcement plate 82 and a third reinforcement plate 83, attaching the first movable plate 211 and the second movable plate 221 to the opposite ends of the third reinforcement plate 83, attaching the third movable plate 23 to the middle area of ​​the third reinforcement plate 83, and conductively bonding with the first movable plate 211 and the second movable plate 221 respectively located on the opposite sides to form an integral movable component 30 that can carry the photosensitive chip 52 and the driving coil 51, bonding the first reinforcement plate 81 to the first fixed plate 212, and bonding the second reinforcement plate 82 to the second fixed plate 222. It is worth mentioning that, in some embodiments, the first reinforcing plate 81 is first attached to the first fixed plate 212, and the second reinforcing plate 82 is attached to the second fixed plate 222, and then the first movable plate 211 and the second movable plate 221 are attached to the third reinforcing plate 83, and finally the third movable plate 23 is attached to the third reinforcing plate 83 and conductively bonded to the first movable plate 211 and the second movable plate 221. In other embodiments, the first movable plate 211 and the second movable plate 221 are first attached to the third reinforcing plate 83, and then the third movable plate 23 is attached to the third reinforcing plate 83 and conductively bonded to the first movable plate 211 and the second movable plate 221, and finally the first reinforcing plate 81 is attached to the first fixed plate 212, and the second reinforcing plate 82 is attached to the second fixed plate 222. In other embodiments, the first movable plate 211 and the second movable plate 221 are first conductively bonded to the third movable plate 23, and then the first reinforcement plate 81, the second reinforcement plate 82 and the third reinforcement plate 83 are respectively attached to the first fixed plate 212, the second fixed plate 222 and the movable component 30. Furthermore, the attachment of the first reinforcement plate 81 and the second reinforcement plate 82 can be carried out at the same time to improve installation efficiency and shorten working hours. It can be understood that the rigidity of the reinforcement plate is relatively large. For example, the material of the reinforcement plate can be a steel plate. The attachment of the reinforcement plate can support the movable component 30, the first fixed plate 212 and the second fixed plate 222, improve the flatness of the bearing platform 20, and further improve the optical performance of the optical image stabilization photosensitive component 1.

[0055] In some embodiments, Figure 1 and Figure 2As shown, the first bearing component 21 also includes at least two retaining components 40, and the at least two retaining components 40 are installed at the two ends of the first movable plate 211 and the first fixed plate 212 of the first bearing component 21, so that the first movable plate 211 and the first fixed plate 212 are movably connected, and the second bearing component 22 also includes at least two retaining components 40, and the at least two retaining components 40 are installed at the two ends of the second movable plate 221 and the second fixed plate 222 of the second bearing component 22, so that the second movable plate 221 and the second fixed plate 222 are movably connected. It is understood that installing the holding assembly 40 between the first movable plate 211 and the first fixed plate 212 enables the first fixed plate 212 to support the first movable plate 211, thereby improving the connection reliability and flatness of the first fixed plate 212 and the first movable plate 211; installing the holding assembly 40 between the second movable plate 221 and the second fixed plate 222 enables the second fixed plate 222 to support the second movable plate 221, thereby improving the connection reliability and flatness of the second fixed plate 222 and the second movable plate 221; further, when the first bearing assembly 21 and the second bearing assembly 22 are bonded to both sides of the third movable plate 23 to form the bearing platform 20, the reliability of the bearing platform 20 is improved. It is understood that bonding the holding assembly 40 between the first movable plate 211 and the first fixed plate 212, and bonding the holding assembly 40 between the second movable plate 221 and the second fixed plate 222 can be performed simultaneously to improve installation efficiency and shorten working hours.

[0056] In some embodiments, Figure 4 and Figure 5 As shown, step b specifically includes: attaching the photosensitive chip 52 to the central area of ​​the upper surface of the movable component 30, and connecting the photosensitive chip 52 and the carrying platform 20 to form the main component 50. Specifically, in an optional embodiment, the photosensitive chip 52 is first bonded and fixed to the preset area on the carrying platform 20 by glue, and then the pins of the photosensitive chip 52 are welded to the pads on the carrying platform 20, so that the photosensitive chip 52 is fixed and electrically connected to the carrying platform 20, so as to improve the flatness of the main component 50 after assembly, and further improve the optical performance of the optical image stabilization photosensitive component 1. In another optional embodiment, the photosensitive chip 52 is placed on the carrying platform 20, and the photosensitive chip 52 is fixed and electrically connected to the carrying platform 20 by hot pressing bonding, so as to improve the assembly efficiency. It can be understood that the photosensitive chip 52 can be attached manually or by automated machinery.

[0057] In some embodiments, Figure 4-6 As shown, the main component 50 also includes a Hall element 53, and the Hall element 53 is welded to the movable component 30. Specifically, in an optional embodiment, the first bearing component 21 and the second bearing component 22 are first connected to the two sides of the third movable plate 23 to form a bearing platform 20, and then the Hall element 53 is installed on the movable component 30. It can be understood that the movable component 30 is easy to move relative to the first fixed plate 212 and the second fixed plate 222, so when installing the Hall element 53, it is necessary to first use a suction cup to adsorb or other tooling to fix the movable component 30. In another optional embodiment, the Hall element 53 is first installed on the first movable plate 211 and / or the second movable plate 221 and / or the third movable plate 23, and then the first bearing component 21 and the second bearing component 22 are respectively connected to the two sides of the third movable plate 23. It is understandable that the Hall element 53 is installed first, and then the carrying platform 20 is installed, so as to facilitate the fixing of the first movable plate 211, the second movable plate 221 and the third movable plate 23, and is conducive to improving the efficiency of installing the Hall element 53. In another optional embodiment, the drive coil 51 is first installed on the carrying platform 20, and then the Hall element 53 is installed with reference to the drive coil 51. It is understandable that when the Hall element 53 is installed in the middle of the drive coil 51, the drive coil 51 is installed first, which is conducive to avoiding the influence of the installation deviation of the Hall element 53 on the installation of the drive coil 51.

[0058] In some embodiments, step b specifically includes: attaching the drive coil 51 to the upper surface of the movable component 30, and welding the drive coil 51 and the movable component 30, so that the drive coil 51 is fixed and conductive to the movable component 30, and the drive coil 51 surrounds the outside of the Hall element 53. Specifically, the drive coil 51 is first attached and fixed to a preset area on the carrier platform 20, and then the lead of the drive coil 51 is welded to the pad on the carrier platform 20, so that the drive coil 51 is fixed and electrically connected to the carrier platform 20, so as to improve the flatness of the main component 50 after assembly. It can be understood that the drive coil 51 can be attached manually or by automated machinery.

[0059] In some embodiments, Figure 5As shown, the number of the drive coils 51 is three, wherein the first drive coil 511 and the second drive coil 512 are arranged in parallel on the third movable plate 23 and are located on opposite sides of the photosensitive chip 52, and the third drive coil 513 is arranged on the first movable plate 211, and the long side direction of the third drive coil 513 is perpendicular to the long side direction of the first drive coil 511 and the second drive coil 512. It can be understood that the three drive coils 51 can be glued and fixed at the same time, or they can be glued and fixed one by one. Preferably, the three drive coils 51 are all glued and fixed and then the leads are welded for conduction, so as to improve the installation efficiency.

[0060] In some embodiments, Figure 6 As shown, step c specifically includes: attaching the first fixing plate 212 and the second fixing plate 222 of the main body component 50 to the base plate 61, and conducting the first fixing plate 212 and the base plate 61, and conducting the second fixing plate 222 and the base plate 61, so that the main body component 50 is fixed and conducted with the base plate 61 to form an intermediate base plate 60. Specifically, the first fixing plate 212 and the second fixing plate 222 are firstly bonded and fixed to a preset area on the base plate 61, and then the pads on the first fixing plate 212 and the pads on the base plate 61 are connected and conducted with gold wires, and the pads on the second fixing plate 222 and the pads on the base plate 61 are connected and conducted with gold wires, so that the main body component 50 is fixed and electrically connected to the base plate 61, so as to improve the flatness of the main body component 50 after assembly. It can be understood that the components located on the movable assembly 30 are electrically connected to the movable assembly 30, and the movable assembly 30 is electrically connected to the first fixed plate 212 and the second fixed plate 222 through the first flexure 213 and the second flexure 223, respectively, and the first fixed plate 212 and the second fixed plate 222 are electrically connected to the base plate 61, so that the electronic components on the movable assembly 30 and the fixed assembly are connected to the base plate 61, and further electrically connected to the external circuit. It is worth mentioning that the movable assembly 30 is suspended between the first fixed plate 212 and the second fixed plate 222 through the holding assembly 40, and is movably located above the base plate 61.

[0061] In some embodiments, Figure 8As shown, step d specifically includes: d1, providing a bracket 71, fixing the driving magnet 72 on the inner surface of the bracket 71 to form an upper cover assembly 70; d2, installing the upper cover assembly 70 on the intermediate base plate 60 to accommodate the main body assembly 50 between the base plate 61 and the upper cover assembly 70, wherein the driving magnet 72 and the driving coil 51 are arranged relative to each other in the direction of the optical axis of the photosensitive chip 52. It can be understood that the installation of the driving magnet 72 is not affected by the installation of the bearing platform 20, the main body assembly 50 and the intermediate base plate 60, that is, the installation of the driving magnet 72 can be carried out simultaneously with any step of installing the bearing platform 20, installing the main body assembly 50 and installing the intermediate base plate 60, so as to improve the installation efficiency and shorten the installation time.

[0062] Specifically, if Figure 8 As shown, in step d1, the driving magnet 72 is bonded to the preset position of the inner surface of the bracket 71 by glue, so that after assembly, the driving magnet 72 is arranged opposite to the driving coil 51 on the main body assembly. It is worth mentioning that in some embodiments, in step d2, the edge of the upper cover assembly 70 is bonded to the edge of the intermediate base plate 60 by glue, so as to improve the installation reliability of the optical image stabilization photosensitive component 1. In other embodiments, in step d2, the upper cover assembly 70 and the intermediate base plate 60 are installed and fixed by a snap assembly, so as to reduce the glue coating work, and the operation is simple and convenient for disassembly and maintenance. In other embodiments, in step d2, the upper cover assembly 70 and the intermediate base plate 60 are fixed by a connecting piece, which is convenient for disassembly and maintenance, and at the same time improves the installation reliability. The connecting piece can be a screw or a bolt. It can be understood that step d1 can be performed simultaneously with step a and / or step b and / or step c, so as to improve the installation efficiency and reduce the installation time.

[0063] In some embodiments, step d1 further includes: d11: providing at least one magnetic sheet 73, bonding the magnetic sheet 73 to the inner surface of the bracket 71, so as to isolate the magnetic field of the driving magnet 72 from the magnetic field outside the optical image stabilization photosensitive component 1; d12: bonding the driving magnet 72 to the lower surface of the magnetic sheet 73 to form the upper cover component 70. It can be understood that the order of step d11 and step d12 can be interchanged, that is, step d11 can be performed first and then step d12, or step d12 can be performed first and then step d11. Preferably, step d11 is performed first and then step d12, and the bonding of the magnetic sheet 73 and the driving magnet 72 is based on the bracket 71 as a reference, so as to reduce the influence of the installation deviation on the installation position of the driving magnet 72, and further reduce the deviation of the relative position of the driving magnet 72 and the driving coil 51 in the optical axis direction of the photosensitive chip 52, so as to improve the operating performance of the optical image stabilization photosensitive component 1.

[0064] In some embodiments, the upper cover assembly 70 further includes a color filter 74, and the color filter 74 is installed on the color filter 74 installation position of the bracket 71 to filter out stray light. It is understandable that the color filter 74 can be installed before step d1 or after step d1. The color filter 74 is fixed to the color filter 74 installation position by glue, which is easy to operate and reliable in connection.

[0065] In some embodiments, the first fixed plate 212, the second fixed plate 222, the first movable plate 211, the second movable plate 221, the third movable plate 23, the first flexible member 213 and the second flexible member 223 are formed by semiconductor process to improve the flatness of the assembled optical image stabilization photosensitive component 1.

[0066] In some embodiments, step a further includes: welding the two ends of a plurality of first flexures 213 to the first fixed plate 212 and the first movable plate 211, respectively, so as to connect the first fixed plate 212 and the first movable plate 211, and form the first bearing assembly 21; welding the two ends of a plurality of second flexures 223 to the second fixed plate 222 and the second movable plate 221, respectively, so as to connect the second fixed plate 222 and the second movable plate 221, and form the second bearing assembly 22. It can be understood that welding the first flexures 213 and welding the second flexures 223 can be performed simultaneously, so as to further improve the assembly efficiency, and the welding of the first flexures 213 and the second flexures 223 can be manual welding or automatic welding.

[0067] In some embodiments, the first fixed plate 212, the first movable plate 211 and the first flexures 213 are integrally formed, and the second fixed plate 222, the second movable plate 221 and the second flexures 223 are integrally formed, so that the process of welding the first flexure 213 and the second flexure 223 can be reduced, and the production efficiency can be improved. It can be understood that by stacking the metal layer on the semiconductor material in a relatively simple manner such as etching, photolithography, chemical deposition, vapor deposition, etc. to further form a specific pattern so that the circuit is conductive, the installation process of welding the first flexure 213 and the second flexure 223 can be reduced, and the first bearing assembly 21 and the second bearing assembly 22 obtained by integral molding have a higher flatness. Furthermore, the semiconductor material and the metal layer are integrally formed, so that the connection between the metal layer and the base plate 61 can be improved.

[0068] In some embodiments, Figure 9-12 As shown, the intermediate base plate 60 also includes a plurality of support blocks 62, which extend upward from the base plate 61 to the first fixed plate 212, the second fixed plate 222 or the movable assembly 30, so as to support the movable assembly 30 in the direction of the optical axis of the photosensitive chip 52, and at the same time make the first fixed plate 212, the second fixed plate 222 and the movable assembly 30 located in the same horizontal plane, further improving the flatness of the bearing platform 20, so as to improve the optical performance of the optical image stabilization photosensitive assembly 1. In an optional implementation, the base plate 61 is a circuit board, and the support block 62 is a polyimide material, which is integrally formed on the circuit board. In another optional embodiment, the support block 62 is a separate plastic part, which is fixed to the base plate 61 by glue. It can be understood that when the main body component 50 is installed on the base plate 61, the bottom of the main body component 50 touches the support block 62, so as to prevent the main body component 50 from moving further downward and damaging the base plate 61. Especially in the process of automated installation, the actuator drives the main body component 50 to move toward the base plate 61. When it is pressed down to the support block 62, the actuator can stop moving, thereby further avoiding damage to the base plate 61.

[0069] The above describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention to be protected. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for assembling an optical image stabilization photosensitive component, characterized in that: Includes steps: a. providing a first bearing assembly, a second bearing assembly and a third movable plate, wherein the first bearing assembly comprises a first movable plate, a first fixed plate and a plurality of first flexures conductively connecting the first movable plate and the first fixed plate, and the second bearing assembly comprises a second movable plate, a second fixed plate and a plurality of second flexures conductively connecting the second movable plate and the second fixed plate, and the third movable plate is installed between the first bearing assembly and the second bearing assembly to form a bearing platform, wherein the third movable plate is conductively connected to the first movable plate and the second movable plate, and the first movable plate, the second movable plate and the third movable plate form a movable assembly; b. Installing at least one driving coil and a photosensitive chip on the movable component to form a main component; c. providing a base plate, and installing the main body assembly on the base plate to form an intermediate base plate; d. Arrange at least one driving magnet and the driving coil relative to each other in the direction of the optical axis of the photosensitive chip.

2. The method for assembling an optical image stabilization photosensitive component according to claim 1, characterized in that: Step a specifically includes: bonding one side of the third movable plate to the first movable plate of the first supporting component, and bonding the other opposite side of the third movable plate to the second movable plate of the second supporting component, so that the first movable plate, the second movable plate and the third movable plate are conductively connected to form an integral movable component to carry the photosensitive chip and the driving coil.

3. The method for assembling an optical image stabilization photosensitive component according to claim 1, characterized in that: Step a specifically includes: providing a first reinforcement plate, a second reinforcement plate and a third reinforcement plate, attaching the first movable plate and the second movable plate to the opposite ends of the third reinforcement plate, attaching the third movable plate to the middle area of ​​the third reinforcement plate, and conductively bonding the first movable plate and the second movable plate respectively located on the opposite sides to form an integrated movable component capable of carrying the photosensitive chip and the driving coil, bonding the first reinforcement plate to the first fixed plate, and bonding the second reinforcement plate to the second fixed plate.

4. The method for assembling an optical image stabilization photosensitive component according to claim 1, characterized in that: The first bearing assembly further includes at least two retaining assemblies, which are installed at both ends of the first movable plate and the first fixed plate of the first bearing assembly so that the first movable plate and the first fixed plate are movably connected. The second bearing assembly further includes at least two retaining assemblies, which are installed at both ends of the second movable plate and the second fixed plate of the second bearing assembly so that the second movable plate and the second fixed plate are movably connected.

5. The method for assembling an optical image stabilization photosensitive component according to any one of claims 2 to 3, characterized in that: Step b specifically includes: attaching the photosensitive chip to the central area of ​​the upper surface of the movable component, and connecting the photosensitive component and the supporting platform to form the main component.

6. The method for assembling an optical image stabilization photosensitive component according to any one of claims 2 to 3, characterized in that: The main component also includes a Hall element, and the Hall element is welded to the movable component.

7. The method for assembling an optical image stabilization photosensitive component according to claim 6, characterized in that: Step b specifically includes: attaching the driving coil to the upper surface of the movable component, and welding the driving coil to the movable component so that the driving coil is fixed and conductive to the movable component, and the driving coil surrounds the outside of the Hall element.

8. The method for assembling an optical image stabilization photosensitive component according to claim 6, characterized in that: The number of the drive coils is three, wherein the first drive coil and the second drive coil are arranged in parallel on the third movable plate and are located on opposite sides of the photosensitive chip, and the third drive coil is arranged on the first movable plate, and the long side direction of the third drive coil is perpendicular to the long side direction of the first drive coil and the second drive coil.

9. The method for assembling an optical image stabilization photosensitive component according to claim 1, characterized in that: Step c specifically includes: attaching the first fixing plate and the second fixing plate of the main component to the base plate, and connecting the first fixing plate and the base plate, and the second fixing plate and the base plate, so that the main component and the base plate are fixed and connected to form an intermediate base plate.

10. The method for assembling an optical image stabilization photosensitive component according to claim 1, characterized in that: Step d specifically includes: d1. Provide a bracket and fix the driving magnet to the inner surface of the bracket to form an upper cover assembly; d2. Install the upper cover assembly on the intermediate base plate to accommodate the main body assembly between the base plate and the upper cover assembly, wherein the driving magnet and the driving coil are arranged relative to each other in the direction of the optical axis of the photosensitive chip.

11. The method for assembling an optical image stabilization photosensitive component according to claim 10, characterized in that: Step d1 also includes: d11: providing at least one magnetic sheet, and bonding the magnetic sheet to the inner surface of the bracket to isolate the magnetic field of the driving magnet from the magnetic field outside the optical image stabilization photosensitive component; d12: Bond the driving magnet to the lower surface of the magnetic sheet to form the upper cover assembly.

12. The method for assembling an optical image stabilization photosensitive component according to any one of claims 10 to 11, characterized in that: The upper cover assembly also includes a color filter, which is installed on the color filter installation position of the bracket to filter out stray light.

13. The method for assembling an optical image stabilization photosensitive component according to any one of claims 1 to 3, characterized in that: The first fixed plate, the second fixed plate, the first movable plate, the second movable plate, the third movable plate, the first flexure and the second flexure are formed by a semiconductor process.

14. The method for assembling an optical image stabilization photosensitive component according to claim 13, characterized in that: The first fixed plate, the first movable plate and a plurality of the first flexures are integrally formed, and the second fixed plate, the second movable plate and a plurality of the second flexures are integrally formed.

15. The method for assembling an optical image stabilization photosensitive component according to claim 13, characterized in that: Step a also includes: welding the two ends of several of the first flexible members to the first fixed plate and the first movable plate respectively to connect the first fixed plate and the first movable plate, and welding the two ends of several of the second flexible members to the second fixed plate and the second movable plate respectively to connect the second fixed plate and the second movable plate.

16. The method for assembling an optical image stabilization photosensitive component according to any one of claims 1 to 3, characterized in that: The intermediate base plate further includes a plurality of support blocks, and the support blocks extend upward from the base plate to the first fixed plate, the second fixed plate or the movable component.

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