A multi-molding side-emitting LED

Abstract

The invention relates to the technical field of LEDs, and in particular to a multi-molding side-emitting LED; a fluorescent layer emits light of a specific color by means of excitation of a light-emitting chip, and the light can be emitted in all directions; in order to ensure the brightness of the side light, a first reflecting layer and a second reflecting layer are arranged to block and concentrate the light, so that the light enters the outside through a gap between the first reflecting layer and the second reflecting layer, thereby realizing illumination of the side of the LED and making the illumination brightness more uniform; through the first reflecting surface and the second reflecting surface, the number of refractions of the light emitted by the light-emitting chip before entering the fluorescent layer is greatly reduced, thereby reducing energy loss; and the number of refractions of the light emitted by the fluorescent layer when entering the outside is reduced, thereby reducing energy loss of the light, and making the intensity of the side illumination of the LED higher; and the problem of insufficient side illumination brightness caused by less side light in existing conventional CSP products is solved.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to a multi-molding side-emitting LED. Background Art

[0002] For existing conventional CSP products, single molding is usually used, such as Figure 1 As shown, when emitting light, the light mainly emits toward the front, with a small amount of light on the side. When in a narrow passage or space, it is sometimes necessary to observe the side walls of the passage. For example, in equipment such as bronchoscopes or gastroenteroscopes, if the light is concentrated on the front of the light-emitting chip and there is less light on the side, the side lighting will be insufficient, which may make it difficult for users to clearly observe the side walls of the passage. Summary of the invention

[0003] In view of the shortcomings of the prior art, the present invention provides a multi-molding side-emitting LED, which solves the problem of insufficient side lighting brightness caused by less side light in the existing conventional CSP products.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A multi-molded side-emitting LED comprises a light-emitting chip for front-emitting light, wherein the light-emitting chip is surrounded by a first reflecting layer for reflecting and shading light, a fluorescent layer for emitting light in cooperation with the light-emitting chip is arranged on the light-emitting surface of the light-emitting chip, a second reflecting layer for reflecting and shading light is arranged on a surface of the fluorescent layer away from the light-emitting chip, and the fluorescent layer is arranged between the first reflecting layer and the second reflecting layer for emitting light toward the side of the first reflecting layer.

[0006] Preferably, a first reflecting surface for reflecting light toward the fluorescent layer is obliquely arranged on the inner side surface of the first reflecting layer, and a light-transmitting layer for light to pass through is filled between the first reflecting surface and the light-emitting chip.

[0007] Preferably, a conical second reflecting surface for reflecting light toward the outside of the second reflecting layer is obliquely arranged on the bottom surface of the second reflecting layer. The second reflecting surface is arranged in the fluorescent layer, and the bottom vertex of the second reflecting surface is located at the center of the bottom surface of the fluorescent layer.

[0008] Preferably, a plurality of annular third reflecting surfaces are arranged on the second reflecting surface, and the normal lines of the third reflecting surfaces are parallel to the horizontal plane.

[0009] Preferably, a reflective column located in the fluorescent layer and used for reflecting light in all directions is arranged at the center of the bottom surface of the second reflective layer, and the normal direction of the outer cylindrical surface of the reflective column is parallel to the horizontal plane.

[0010] Preferably, the cross section of the fluorescent layer is circular.

[0011] Preferably, the first reflective layer and the second reflective layer are made of the same material, and the ratio by weight is as follows: 0.5 parts of A glue, 5 parts of B glue, and 6 parts of phosphors, wherein the ratio of phosphors is as follows: 0.2 parts of A glue, 2 parts of B glue, 3 parts of 518 green powder, 0.1 parts of 558 yellow powder, 0.69 parts of 655 red powder, and 0.05 parts of DM-30.

[0012] Compared with the prior art, the present invention provides a multi-molding side-emitting LED, which has the following beneficial effects:

[0013] 1. The fluorescent layer is set to emit light of a specific color with the help of the excitation of the light-emitting chip, and the light can be emitted in all directions. Then, in order to ensure the brightness of the side light, the first reflecting layer and the second reflecting layer are set to block and concentrate the light, so that the light enters the outside through the gap between the first reflecting layer and the second reflecting layer, thereby realizing the lighting of the LED side and making the lighting brightness more uniform.

[0014] 2. By setting the first reflecting surface and the second reflecting surface, the number of refractions of the light emitted by the light emitting chip before entering the fluorescent layer is greatly reduced to reduce energy loss, and the number of refractions of the light emitted by the fluorescent layer when entering the outside world is reduced to reduce the energy loss of the light, so as to make the intensity of the LED side lighting higher.

[0015] 3. By arranging the first reflecting surface and the second reflecting surface at the center of the fluorescent layer and making the cross-section of the fluorescent layer circular, it is possible to further ensure that the amount of light emitted from the four sides of the fluorescent layer and entering the outside is roughly the same, so as to achieve uniform illumination of the side environment of the LED and ensure the uniformity of the illumination effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 is a schematic cross-sectional view of a conventional CSP-LED of the present invention;

[0018] Figure 2 is a first schematic cross-sectional view of an LED of the present invention;

[0019] Figure 3 is a second schematic cross-sectional view of an LED according to the present invention;

[0020] Figure 4 is a schematic diagram of the second reflecting surface of the present invention;

[0021] Figure 5 is a schematic diagram of a third reflecting surface of the present invention;

[0022] Figure 6 is a schematic diagram of a reflective column of the present invention;

[0023] Figure 7 Schematic diagram of the three-dimensional structure of the present invention Figure 7 .

[0024] In the figure: 1. light-emitting chip; 2. first reflection layer; 3. fluorescent layer; 4. second reflection layer; 5. first reflection surface; 6. light-transmitting layer; 7. second reflection surface; 8. third reflection surface; 9. reflection column. DETAILED DESCRIPTION

[0025] The following will describe the implementation methods of the present application in detail with the help of accompanying drawings and examples, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0026] Embodiment 1

[0027] In order to solve the problem of insufficient side lighting brightness caused by less side light in existing conventional CSP products, a multi-molding side-emitting LED is developed. By improving the existing CSP packaged LED products, the side of the LED is partially sealed and the top is fully sealed. In the unsealed part, phosphor emits light to the side under the excitation of the chip, thereby ensuring the amount of side light to improve the side lighting effect. Figure 2-Figure 4 and Figure 7As shown, the light emitting chip 1 is surrounded by a first reflecting layer 2 for reflecting and shielding, that is, the light emitted by the light emitting chip 1 cannot pass through the first reflecting layer 2, and the light irradiated on the surface of the first reflecting layer 2 will be reflected by it. A fluorescent layer 3 for cooperating with it to emit light is arranged on the light emitting surface of the light emitting chip 1, and a second reflecting layer 4 for reflecting and shielding is arranged on the side of the fluorescent layer 3 away from the light emitting chip 1. The fluorescent layer 3 is arranged between the first reflecting layer 2 and the second reflecting layer 4 for emitting light toward the side of the first reflecting layer 2. On the one hand, the first reflecting layer 2 can reflect the light in the LED, so that more light emitted by the light emitting chip 1 is reflected to the fluorescent layer 3, so that the fluorescent powder in the fluorescent layer 3 is reflected by the light emitting chip 1. The first reflective layer 2 is a layer of light emitting chip 1 that is excited to emit light of corresponding color. On the other hand, the outer wall of the first reflective layer 2 will also reflect the light reflected by objects in the external environment, thereby further improving the brightness of the environment. In general, a blue light chip is used to excite the fluorescent layer 3. The color of the light emitted by the fluorescent layer 3 is determined by the material ratio of the fluorescent layer 3. In addition, the second reflective layer 4 can prevent the light from being emitted from the front of the light emitting chip 1 through its light shielding property, and through its reflection, the light generated by the fluorescent layer 3 is emitted to the side of the first reflective layer 2, so that the light is more concentrated on the side of the first reflective layer 2, so as to improve the illumination brightness of the side. In addition, the size of the second reflective layer 4, that is, the horizontal cross-sectional area, can be changed, such as Figure 2 and Figure 3 As shown, Figure 3 The horizontal cross-sectional area of ​​the second reflective layer 4 is relatively reduced, thereby changing the range of light irradiation to the front side, thereby controlling the brightness and range of the side light emission. During manufacturing, the first molding is used to complete the first reflective layer 2, the second molding is used to complete the fluorescent layer, and the last molding is used to complete the second reflective layer 4.

[0028] When the inner wall side of the first reflective layer 2 is a plane, when reflecting light, the light is reflected more times before it can enter the fluorescent layer 3, thereby consuming the energy of the light and reducing the brightness. In order to reduce the number of times the light is reflected from the light emitting chip 1 to the time it enters the fluorescent layer 3, the inner side of the first reflective layer 2 is inclined to be provided with a first reflective surface 5 for reflecting the light toward the fluorescent layer 3. A light-transmitting layer 6 for the light to pass through is filled between the first reflective surface 5 and the light emitting chip 1. The light-transmitting layer 6 cooperates with the first reflective layer 2 to fix the light emitting chip 1 and reduce the energy consumption of light propagation. Commonly used materials include epoxy resin, etc. The light emitted by the light emitting chip 1 is directly reflected into the fluorescent layer 3 more quickly through the first reflective surface 5, thereby reducing the consumption of light energy and improving the brightness of the light emitted by the fluorescent layer 3.

[0029] In order to allow the light emitted by the fluorescent layer 3 to enter the outside air as quickly as possible and reduce the energy loss caused by multiple reflections of the light in the LED, thereby improving the illumination brightness of the side, a conical second reflection surface 7 for reflecting the light toward the outside of the second reflection layer 4 is obliquely arranged on the bottom surface of the second reflection layer 4. The second reflection surface 7 is arranged in the fluorescent layer 3, and the bottom vertex of the second reflection surface 7 is located at the center of the bottom surface of the fluorescent layer 3, so that the light emitted by the fluorescent layer 3 is reflected as quickly as possible to the gap between the second reflection layer 4 and the first reflection layer 2, so that the light is emitted into the air faster with fewer reflections, so as to improve the side illumination brightness of the LED.

[0030] In order to further cooperate with the conical second reflecting surface 7 to reflect the light emitted by the fluorescent layer 3, the cross-section of the fluorescent layer 3 is made circular, and the distance from the second reflecting surface 7 to the outer side of the fluorescent layer 3 can be made roughly the same, so that the light can be evenly dispersed on the side of the LED when reflected, so that the brightness of each area on the side of the LED is the same, thereby improving the uniformity of the lighting brightness.

[0031] The first reflective layer 2 and the second reflective layer 4 have two characteristics. One is light-shielding property, which can prevent light from passing through and reduce the amount of light entering its interior and being partially absorbed. The other is reflective property, which can greatly reflect the light irradiated on its surface to reduce the energy loss of light reflection. Therefore, the materials of the two are specifically described below to achieve the above two functions. The materials of the first reflective layer 2 and the second reflective layer 4 are the same. In parts by weight, the ratio is as follows: 0.5 parts of A glue, 5 parts of B glue, and 6 parts of phosphor. Among them, the ratio of phosphor is as follows: 0.2 parts of A glue, 2 parts of B glue, 3 parts of 518 green powder, 0.1 parts of 558 yellow powder, 0.69 parts of 655 red powder, and 0.05 parts of DM-30. The colloid produced by this ratio is packaged and shaped by equipment, so that its light-shielding and reflective functions can be well achieved.

[0032] Embodiment 2

[0033] In order to achieve the technical effect similar to that of the first embodiment, a new structure is provided to achieve the purpose of reflecting the light generated by the fluorescent layer 3 to the side of the LED, such as Figure 6 As shown, compared with the first embodiment, the second embodiment is different in that: a reflective column 9 located in the fluorescent layer 3 for reflecting light to all directions is provided at the center of the bottom surface of the second reflective layer 4, and the normal direction of the outer cylindrical surface of the reflective column 9 is parallel to the horizontal plane. The light emitted by the fluorescent layer 3 is reflected by the reflective column 9. The reflective column 9 has a more regular shape during packaging, so that it is easier to package and shape, and can directly reflect the light to the side of the LED.

[0034] Embodiment 3

[0035] In order to achieve the technical effects similar to those of the first and second embodiments, the structural features of the first and second embodiments are combined to realize the reflection of the light of the fluorescent layer 3, such as Figure 5 As shown, compared with the first embodiment, the second embodiment is different in that: a plurality of annular third reflection surfaces 8 are provided on the second reflection surface 7, and the normal of the third reflection surface 8 is parallel to the horizontal plane, so that the light generated by the fluorescent layer 3 is reflected by the second reflection surface 7 and the third reflection surface 8, and the second reflection surface 7 and the third reflection surface 8 have different reflection angles when reflecting. For example, when illuminating in the first and second embodiments, the positions where the light is stronger are different, so that the light intensity irradiated to different areas of the outside world can be adjusted by adjusting the sizes of the second reflection surface 7 and the third reflection surface 8, so that personalized adjustment can be achieved according to specific usage conditions.

[0036] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-molded side-emitting LED, comprising a light-emitting chip (1) for front-emitting light, characterized in that: The light-emitting chip (1) is surrounded by a first reflective layer (2) for reflecting and shielding light, a fluorescent layer (3) for emitting light in cooperation with the light-emitting chip (1) is arranged on the light-emitting surface of the light-emitting chip (1), a second reflective layer (4) for reflecting and shielding light is arranged on the side of the fluorescent layer (3) away from the light-emitting chip (1), and the fluorescent layer (3) is arranged between the first reflective layer (2) and the second reflective layer (4) for emitting light toward the side of the first reflective layer (2).

2. The side-emitting LED according to claim 1, characterized in that: A first reflecting surface (5) for reflecting light towards the fluorescent layer (3) is obliquely arranged on the inner side surface of the first reflecting layer (2), and a light-transmitting layer (6) for light to pass through is filled between the first reflecting surface (5) and the light-emitting chip (1).

3. The side-emitting LED according to claim 1, characterized in that: The bottom surface of the second reflection layer (4) is obliquely provided with a conical second reflection surface (7) for reflecting light toward the outside of the second reflection layer (4); the second reflection surface (7) is arranged in the fluorescent layer (3); and the bottom vertex of the second reflection surface (7) is located at the center of the bottom surface of the fluorescent layer (3).

4. The side-emitting LED according to claim 1, characterized in that: A plurality of annular third reflecting surfaces (8) are arranged on the second reflecting surface (7), and the normal lines of the third reflecting surfaces (8) are parallel to the horizontal plane.

5. The side-emitting LED according to claim 1, characterized in that: A reflection column (9) is arranged at the center of the bottom surface of the second reflection layer (4) and is located inside the fluorescent layer (3) for reflecting light in all directions. The normal direction of the outer cylindrical surface of the reflection column (9) is parallel to the horizontal plane.

6. The side-emitting LED according to claim 5, characterized in that: The cross section of the fluorescent layer (3) is circular.

7. The side-emitting LED according to claim 1, characterized in that: The materials of the first reflective layer (2) and the second reflective layer (4) are the same, and the proportions thereof are as follows, in parts by weight: 0.5 parts of A glue, 5 parts of B glue, and 6 parts of phosphors, wherein the proportions of the phosphors are as follows: 0.2 parts of A glue, 2 parts of B glue, 3 parts of 518 green powder, 0.1 parts of 558 yellow powder, 0.69 parts of 655 red powder, and 0.05 parts of DM-30.

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