Display screens and electronic devices

By designing a mesh heat dissipation structure in the Micro-LED display, the heat between the light-emitting chips is effectively transferred, which solves the serious problem of heat generation in the display screen at high resolution and improves the display brightness and user experience.

CN119767915APending Publication Date: 2025-04-04LENOVO (BEIJING) LTD
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Patent Information

Application Number
CN202411998548.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

With the improvement of Micro-LED display resolution, the heat production of the display is becoming more and more serious, affecting the performance of the display.

Method used

A display screen is designed in which the light emitting layer is a display array composed of a plurality of light emitting chips, and the heat dissipation structure is a mesh structure composed of a plurality of heat dissipation units. There is a heat dissipation unit between two adjacent light emitting chips. The heat in the working state of the light emitting layer is transferred through the heat dissipation structure, including transferring to the direction of the driving circuit substrate and the protection substrate.

Benefits of technology

Through effective heat dissipation, the temperature of the display screen is reduced, the heating phenomenon is alleviated, and the display brightness and user experience of the display screen are improved.

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Abstract

The present application provides a display screen and an electronic device, the display screen comprising: a light-emitting layer, the light-emitting layer comprising a display array composed of a plurality of light-emitting chips; a heat dissipation structure, the heat dissipation structure being a mesh structure composed of a plurality of heat dissipation units; wherein a heat dissipation unit is provided between two adjacent light-emitting chips, and the heat of the light-emitting layer in a working state is transferred to the heat dissipation structure.
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