Display module and display device

Abstract

The invention relates to a display module and a display device. The display module comprises a display panel and a cover plate. The cover plate is arranged on one side of the display panel and comprises an ultra-thin glass layer and a covering layer, the ultra-thin glass layer is located on one side of the display panel, and the covering layer at least covers the side, away from the display panel, of the ultra-thin glass layer; wherein the covering layer contains a silicon-oxygen coupling agent, and chemical bonds are formed between part of the silicon-oxygen coupling agent and the ultra-thin glass layer; according to the application, the hardness of the cover plate can be effectively improved, the touch sense and the crease phenomenon can be improved, the adhesive force between the ultra-thin glass layer and the covering layer can be improved, and the probability of stripping between the ultra-thin glass layer and the covering layer can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Folding display devices are the future technology development trend. Folding brings a new development direction for the display industry. Currently, the organic light emitting diode (OLED) display device is of particular concern. It has unique bending and folding properties, so it can be prepared into folding display devices in various forms. It is easy to carry and store when going out, and has received widespread attention from the market.

[0003] At present, the outermost cover plate of the foldable display module is generally an organic polymer film, which easily makes the surface of the foldable display module feel soft and plastic-like and has serious creases. Summary of the invention

[0004] The embodiments of the present application provide a display module and a display device, which can improve the hardness of the surface of the display module cover, improve the tactile feel and crease phenomenon, and improve the adhesion between the cover layer and the ultra-thin glass layer.

[0005] The present application provides a display module, which includes:

[0006] Display panel;

[0007] A cover plate, disposed on one side of the display panel, the cover plate comprising an ultra-thin glass layer and a covering layer, the ultra-thin glass layer being located on one side of the display panel, and the covering layer at least covering a side of the ultra-thin glass layer away from the display panel;

[0008] The cover layer contains a silicon-oxygen coupling agent, and a chemical bond is formed between a portion of the silicon-oxygen coupling agent and the ultra-thin glass layer.

[0009] In one embodiment of the present application, the siloxane coupling agent includes a first type of siloxane coupling agent, the first type of siloxane coupling agent is connected to the surface of the ultra-thin glass layer, and a siloxane bond is formed between the first type of siloxane coupling agent and the surface of the ultra-thin glass layer.

[0010] In one embodiment of the present application, the covering layer further contains a polymer, and the first type of silicon-oxygen coupling agent is connected between the ultra-thin glass layer and the polymer.

[0011] In one embodiment of the present application, the polymer includes a polyimide molecular chain, and the first type of silicon-oxygen coupling agent is connected between the ultra-thin glass layer and the polyimide molecular chain.

[0012] In one embodiment of the present application, the siloxane coupling agent further includes a second type of siloxane coupling agent, and the second type of siloxane coupling agent is grafted onto the amino group in the polyimide molecular chain.

[0013] In one embodiment of the present application, the silicon-oxygen coupling agent further includes a third type of silicon-oxygen coupling agent, and the third type of silicon-oxygen coupling agent is freely distributed in the covering layer.

[0014] In one embodiment of the present application, the covering layer further contains fluorine-containing particles.

[0015] In one embodiment of the present application, the display module includes a bending area and a non-bending area adjacent to the bending area;

[0016] When the thickness of the ultra-thin glass layer in the non-bending area is less than 50 micrometers, the thickness of the ultra-thin glass layer in the bending area is equal to the thickness of the ultra-thin glass layer in the non-bending area;

[0017] When the thickness of the ultra-thin glass layer in the non-bending area is greater than or equal to 50 microns, the thickness of the ultra-thin glass layer in the bending area is less than the thickness of the ultra-thin glass layer in the non-bending area, and the thickness of the ultra-thin glass layer in the bending area is less than 50 microns.

[0018] In one embodiment of the present application, the display module is of an outward folding type, a groove is provided on the side of the ultra-thin glass layer away from the display panel, the groove is located in the bending area, and the covering layer at least covers the side of the ultra-thin glass layer away from the display panel and fills the groove.

[0019] In one embodiment of the present application, the display module is of an inward-folding type, a groove is provided on a side of the ultra-thin glass layer close to the display panel, the groove is located in the bending area, and the covering layer covers the side of the ultra-thin glass layer close to the display panel and fills the groove.

[0020] In one embodiment of the present application, the display module further includes:

[0021] A hardening layer is disposed between the cover plate and the display panel, and a surface water drop angle of the hardening layer is greater than or equal to 105°;

[0022] The first adhesive layer is arranged between the hardening layer and the cover plate, and the first adhesive layer is in contact with a surface of the cover plate close to the hardening layer.

[0023] In one embodiment of the present application, the first adhesive layer is bonded to a surface of the ultra-thin glass layer close to the display panel, the display module further includes a bearing layer arranged between the first adhesive layer and the hardening layer and a second adhesive layer arranged between the bearing layer and the hardening layer, the cover plate is bonded to the bearing layer through the first adhesive layer, and the bearing layer is bonded to the hardening layer through the second adhesive layer.

[0024] In one embodiment of the present application, the covering layer also covers a side of the ultra-thin glass layer close to the display panel, and the covering layer covering a side of the ultra-thin glass layer close to the display panel is bonded to the hardening layer through the first adhesive layer.

[0025] In one embodiment of the present application, the ultra-thin glass layer includes a first surface away from the display panel, a second surface close to the display panel, and a side surface connected between the first surface and the second surface, and the covering layer also covers the side surface of the ultra-thin glass layer.

[0026] In one embodiment of the present application, the orthographic projection boundary of the cover plate on the hardened layer coincides with the orthographic projection boundary of the first adhesive layer on the hardened layer, the orthographic projection of the cover plate on the hardened layer and the orthographic projection of the first adhesive layer on the hardened layer are located within the coverage range of the hardened layer, and the orthographic projection boundary of the cover plate on the hardened layer is separated from the boundary of the hardened layer, and the orthographic projection boundary of the first adhesive layer on the hardened layer is separated from the boundary of the hardened layer.

[0027] According to the above-mentioned purpose of the present application, an embodiment of the present application further provides a display device, which includes the display module.

[0028] The present application provides a display module and a display device, wherein an ultra-thin glass layer is arranged in a cover plate to effectively improve the hardness of the cover plate, improve the touch and crease phenomenon; in addition, a covering layer covering the ultra-thin glass layer contains a silicon-oxygen coupling agent, and a silicon-oxygen bond can be formed between the silicon-oxygen coupling agent and the glass, thereby improving the adhesion between the ultra-thin glass layer and the covering layer, reducing the probability of peeling between the ultra-thin glass layer and the covering layer, and improving the stability of the cover plate; and the silicon-oxygen coupling agent can also be grafted onto a polymer in the covering layer to increase the degree of cross-linking of the polymer in the covering layer, so as to further improve the hardness of the cover plate surface and improve the touch and crease phenomenon of the display module.

[0029] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0031] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0032] Figure 1 A schematic diagram of the structure of a display module provided by an embodiment;

[0033] Figure 2 A schematic diagram of a first structure of a display module provided in an embodiment of the present application;

[0034] Figure 3 A schematic diagram of the connection interface structure between the ultra-thin glass layer and the cover layer provided in an embodiment of the present application;

[0035] Figure 4 A schematic diagram of the first structure of the cover plate provided in the embodiment of the present application;

[0036] Figure 5 A second structural schematic diagram of a display module provided in an embodiment of the present application;

[0037] Figure 6 A second structural schematic diagram of the cover plate provided in the embodiment of the present application;

[0038] Figure 7 A third structural schematic diagram of a display module provided in an embodiment of the present application;

[0039] Figure 8 A third structural schematic diagram of the cover plate provided in the embodiment of the present application;

[0040] Fig. 9 A fourth structural schematic diagram of a display module provided in an embodiment of the present application;

[0041] Fig.10 A fourth structural schematic diagram of the cover plate provided in the embodiment of the present application;

[0042] Fig.11 A fifth structural schematic diagram of a display module provided in an embodiment of the present application;

[0043] Fig.12 A fifth structural schematic diagram of the cover plate provided in an embodiment of the present application.

[0044] Description of reference numerals:

[0045] 1. Panel; 2. Polarizer (substrate); 3. First OCA adhesive layer; 4. First polymer layer; 5. Second OCA adhesive layer; 6. Second polymer layer;

[0046] 10. display panel; 101. bending area; 102. non-bending area;

[0047] 20, cover plate; 21, ultra-thin glass layer; 22, cover layer; 210, groove; 211, first surface; 212, second surface; 213, side; first type of silicon-oxygen coupling agent 221; polyimide molecular chain 222;

[0048] 30. Hardened layer;

[0049] 40. Bearing layer;

[0050] 51. first adhesive layer; 52. second adhesive layer;

[0051] 60. Functional layer. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0053] Please refer to Figure 1 The foldable display module includes a display panel 1, a polarizer (substrate) 2, a first OCA adhesive layer 3, a first polymer layer 4, a second OCA adhesive layer 5 and a second polymer layer 6 which are stacked in sequence; currently, a polymer film is often used as a cover plate on the outermost side of the display module, such as the first polymer layer 4 and the second polymer layer 6, but the polymer layer is relatively soft and has poor support, resulting in a soft touch and easy creases, which seriously affects the user experience.

[0054] Please refer to Figure 2 An embodiment of the present application provides a display module, which includes a display panel 10 and a cover plate 20; the cover plate 20 is arranged on one side of the display panel 10, and the cover plate 20 includes an ultra-thin glass layer 21 and a covering layer 22, the ultra-thin glass layer 21 is located on one side of the display panel 10, and the covering layer 22 at least covers the side of the ultra-thin glass layer 21 away from the display panel 10.

[0055] The cover layer 22 contains a silicon-oxygen coupling agent, and a chemical bond is formed between a portion of the silicon-oxygen coupling agent and the ultra-thin glass layer 21 .

[0056] During the implementation and application process, the embodiment of the present application arranges the ultra-thin glass layer 21 in the cover plate 20 to effectively improve the hardness of the cover plate 20, improve the touch and crease phenomenon; in addition, the cover layer 22 covering the ultra-thin glass layer 21 contains a silicon-oxygen coupling agent, and a silicon-oxygen bond can be formed between the silicon-oxygen coupling agent and the glass, thereby improving the adhesion between the ultra-thin glass layer 21 and the cover layer 22, reducing the probability of peeling between the ultra-thin glass layer 21 and the cover layer 22, and improving the stability of the cover plate 20; and the silicon-oxygen coupling agent can also be grafted onto the polymer in the cover layer 22 to increase the degree of cross-linking of the polymer in the cover layer 22, so as to further improve the hardness of the surface of the cover plate 20 and improve the touch and crease phenomenon of the display module.

[0057] It should be noted that the display panel 10 is an OLED display panel, and the display module can be a foldable display module.

[0058] In some embodiments, the display panel 10 may include a substrate and a thin film transistor layer disposed on the substrate, wherein the thin film transistor layer is located on a side of the substrate close to the cover plate 20. The substrate may be a hard substrate, such as a glass substrate; or the substrate may be a flexible substrate, such as a substrate formed of polyimide. When the substrate is a flexible substrate, the substrate may be formed of multiple sub-substrates with the same material, such as polyimide, and adjacent sub-substrates are bonded by bonding sub-layers.

[0059] In some embodiments, the thin film transistor layer includes a thin film transistor, which includes a semiconductor located on a substrate, and the semiconductor can be formed of polysilicon or a metal oxide (such as indium gallium zinc oxide). Among them, the semiconductor is divided into a channel region and a source region and a drain region formed on both sides of the channel region. The thin film transistor layer also includes a first gate insulating layer, and the first gate insulating layer covers the semiconductor. The thin film transistor also includes a first gate formed on the first gate insulating layer, and the first gate overlaps with the channel region. The first gate can be formed as a plurality of layers or a single layer including a low resistance material such as Al, Ti, Mo, Cu, Ni, or an alloy thereof, or a material with high corrosion resistance. The thin film transistor layer also includes a second gate insulating layer, and the second gate insulating layer covers the first gate. The thin film transistor also includes a second gate located on the second gate insulating layer, and the second gate overlaps with the first gate. The second gate can be formed as a plurality of layers or a single layer including a low resistance material such as Al, Ti, Mo, Cu, Ni, or an alloy thereof, or a material with high corrosion resistance. The thin film transistor layer also includes a first interlayer insulating layer formed on the second gate. The first interlayer insulating layer, the first gate insulating layer and the second gate insulating layer include a source contact hole and a drain contact hole, and the source region and the drain region are exposed through the source contact hole and the drain contact hole, respectively.

[0060] The thin film transistor also includes a source and a drain arranged in the same layer, both formed on the first interlayer insulating layer, the source electrode is connected to the source region through the source contact hole, and the drain electrode is connected to the drain region through the drain contact hole. Among them, the source and the drain can be multiple layers or a single layer formed by a low resistance material such as Al, Ti, Mo, Cu, Ni, or their alloys, or a material with high corrosion resistance. For example, the source and the drain can be a triple layer of Ti / Cu / Ti, Ti / Ag / Ti, Ti / Al / Ti or Mo / Al / Mo or other single or multilayer structures.

[0061] In some embodiments, the display panel 10 further includes a planar layer between the thin film transistor layer and the light emitting layer, and the planar layer covers the source electrode and the drain electrode.

[0062] In some embodiments, the display panel 10 further includes an anode layer located on a side of the planar layer away from the thin film transistor layer, the anode layer includes a plurality of anodes, and the anodes are arranged one by one in correspondence with the pixel units. Each anode is electrically connected to the thin film transistor respectively. The planar layer includes an anode contact hole, and the anode contacts the source or drain of the thin film transistor through the anode contact hole.

[0063] In some embodiments, the display panel 10 further includes a pixel definition layer, which is disposed on a side of the planar layer away from the thin film transistor layer, and the pixel definition layer includes a pixel definition portion and an opening between the pixel definition portions. The display panel 10 further includes a light emitting layer, which includes a plurality of pixel units. The pixel unit is located in the opening. The opening exposes a portion of the anode and covers the edge of the anode. The pixel unit may include a red pixel unit, a green pixel unit, and a blue pixel unit.

[0064] In some embodiments, the display panel 10 further includes a cathode layer, which covers the light-emitting layer. In the direction from the anode to the cathode layer, the light-emitting layer includes a hole-type organic layer, a light-emitting material layer, and an electronic organic layer which are stacked in sequence. The hole-type organic layer may include a hole injection layer and a hole transport layer, the hole injection layer is in direct contact with the anode, and the hole transport layer is located between the hole injection layer and the light-emitting material layer. The hole-type organic layer may also include an electron blocking layer located between the hole transport layer and the light-emitting material layer. The electronic organic layer may include an electron injection layer and an electron transport layer, the electron injection layer is in direct contact with the cathode layer, and the electron transport layer is located between the electron injection layer and the light-emitting material layer. The electronic organic layer may also include a hole blocking layer located between the electron transport layer and the light-emitting layer.

[0065] In some embodiments, the display panel 10 further includes an encapsulation layer located on a side of the cathode layer away from the light-emitting layer. The encapsulation layer is formed by alternating a plurality of inorganic film layers and organic film layers. For example, along the direction from the substrate to the thin film transistor layer, the encapsulation layer includes a first inorganic encapsulation sublayer, a first organic encapsulation sublayer, and a second inorganic encapsulation sublayer.

[0066] In some embodiments, the display panel 10 further includes a touch layer located on a side of the encapsulation layer away from the light-emitting layer. The touch layer may implement the touch function in a self-capacitive touch or a mutual-capacitive touch. When the touch layer implements the touch function in a self-capacitive touch, the touch layer may have only one touch metal layer.

[0067] When the touch layer implements the touch function by mutual capacitive touch, the touch layer includes a first touch metal layer, a touch insulating layer and a second touch metal layer, wherein the touch insulating layer is located on a side of the first touch metal layer away from the encapsulation layer, and the second touch metal layer is located on a side of the touch insulating layer away from the encapsulation layer. The first touch metal layer can be directly disposed on the encapsulation layer, or a spacer layer is further disposed between the first touch layer and the encapsulation layer, and the spacer layer may include an inorganic spacer layer and / or an organic spacer layer. The first touch metal layer includes a first touch electrode, a second touch electrode and a first bridge wire, the second touch metal layer includes a second bridge wire, and the first touch electrode and the second touch electrode are both metal networks; or the second touch metal layer includes a first touch electrode, a second touch electrode and a first bridge wire, and the first touch metal layer includes a second bridge wire.

[0068] In some embodiments, the display module further includes a hardening layer 30 disposed between the display panel 10 and the cover plate 20 , a functional layer 60 disposed between the hardening layer 30 and the cover plate 20 , and a first adhesive layer 51 disposed between the hardening layer 30 and the cover plate 20 .

[0069] In some embodiments, the functional layer 60 may be a polarizer; or when the display panel 10 adopts a depolarizer architecture, a color film layer is added to the display panel 10 to achieve the functions of anti-reflection and depolarizer. At this time, the functional layer 60 may be a substrate layer, and the material may include polyethylene terephthalate.

[0070] In some embodiments, the surface water drop angle of the hard coating (HC) 30 is greater than or equal to 105°, which is beneficial to the separation between the cover plate 20 and the hard layer 30. During the use of the display module, the cover plate 20 can be replaced, thereby improving the service life and convenience of the display module.

[0071] In some embodiments, the first adhesive layer 51 is bonded to a side of the cover plate 20 close to the hardening layer 30, and the cover plate 20 is attached to a side of the hardening layer 30 away from the display panel 10 through the first adhesive layer 51; it can be understood that the cover plate 20 can be directly attached to the side of the hardening layer 30 away from the display panel 10 through the first adhesive layer 51, or there are some functional film layers between the hardening layer 30 and the cover plate 20, and the cover plate 20 is attached to the side of the functional film layer away from the hardening layer 30 through the first adhesive layer 51.

[0072] In the embodiment of the present application, the cover plate 20 includes an ultra-thin glass layer 21 and a cover layer 22, wherein the cover layer 22 covers at least one side of the ultra-thin glass layer 21 away from the display panel 10, wherein the ultra-thin glass layer 21 is relatively Figure 1 As for the polymer layer shown in , the hardness is relatively large, which can effectively improve the hardness of the cover plate 20, so that the elastic modulus of the cover plate 20 can reach about 50GPa, so as to improve the touch of the display module and improve the crease phenomenon.

[0073] Furthermore, the cover layer 22 contains a silicon-oxygen coupling agent, and the silicon-oxygen coupling agent can form a chemical bond with the ultra-thin glass layer 21 on the one hand to improve the adhesion between the cover layer 22 and the ultra-thin glass layer 21 and reduce the probability of peeling between the cover layer 22 and the ultra-thin glass layer 21; on the other hand, the silicon-oxygen coupling agent can also be grafted onto the polymer molecules in the cover layer 22 to increase the cross-linking degree of the polymer in the cover layer 22, thereby further improving the hardness of the cover plate 20, thereby improving the touch of the display module and improving the crease phenomenon.

[0074] Please combine Figure 2 as well as Figure 3 The silicon-oxygen coupling agent is distributed in the cover layer 22 , and the silicon-oxygen coupling agent may include a first type of silicon-oxygen coupling agent 221 , a second type of silicon-oxygen coupling agent, and a third type of silicon-oxygen coupling agent according to different distribution positions.

[0075] In some embodiments, the first type of silicon-oxygen coupling agent 221 is located at the interface between the covering layer 22 and the ultra-thin glass layer 21, and the first type of silicon-oxygen coupling agent 221 is connected to the surface of the ultra-thin glass layer 21, and a silicon-oxygen bond is formed between the first type of silicon-oxygen coupling agent 221 and the surface of the ultra-thin glass layer 21; for example, Si in the first type of silicon-oxygen coupling agent 221 can be connected to O on the surface of the ultra-thin glass layer 21 to form a silicon-oxygen bond.

[0076] In some embodiments, the cover layer 22 further includes a polymer, and the first siloxane coupling agent 221 may be connected between the polymer and the ultra-thin glass layer 21 .

[0077] In some embodiments, the polymer may include a polyimide molecular chain 222, that is, the polymer in the covering layer 22 is polyimide; it can be understood that if the covering layer 22 does not contain the silicon-oxygen coupling agent, the covering layer 22 and the ultra-thin glass layer 21 will be connected through hydrogen bonding force, and the hydrogen bonding force is smaller than the silicon-oxygen bonding force. Therefore, the embodiment of the present application can effectively improve the adhesion between the covering layer 22 and the ultra-thin glass layer 21 by adding a silicon-oxygen coupling agent to the covering layer 22.

[0078] In other embodiments of the present application, the polymer in the covering layer 22 may also include polyethylene terephthalate (PET), thermoplastic polyurethane (TPU) or polymethyl methacrylate (PMMA).

[0079] In some embodiments, the first type of silicon-oxygen coupling agent 221 is connected between the ultra-thin glass layer 21 and the polyimide molecular chain 222 ; further, the first type of silicon-oxygen coupling agent 221 can be connected to the amino groups in the ultra-thin glass layer 21 and the polyimide molecular chain 222 .

[0080] Understandably, Figure 3 The connection structure shown is only used to illustrate the connection method between the first type of silicon-oxygen coupling agent 221, the ultra-thin glass layer 21 and the polyimide molecular chain 222, that is, Si in the silicon-oxygen coupling agent is connected to O on the surface of the ultra-thin glass layer 21, and the alkyl group in the silicon-oxygen coupling agent is connected to the amino group in the polyimide molecular chain 222; however, the specific structure is not limited thereto and changes according to the selection of the silicon-oxygen coupling agent and the polyimide.

[0081] It is understandable that, depending on the choice of silicone coupling agent, Figure 3 Alkyl groups can also be connected to the O groups on the left and right sides of Si, that is, R can be an alkyl group.

[0082] Furthermore, the present embodiment provides a comparative example and Example 1 to verify the improved adhesion between the ultra-thin glass layer 21 and the covering layer 22 in the present embodiment, and obtains the results shown in Table 1 below, wherein the material of the covering layer 22 in the comparative example is polyimide, and the material of the covering layer 22 in Example 1 includes polyimide and the silicon-oxygen coupling agent.

[0083] Table 1

[0084] Comparative Example Example 1 Adhesion force (N / cm) 0.017 0.45

[0085] It can be seen from Table 1 that after the silicon-oxygen coupling agent is added to the covering layer 22, the adhesion between the ultra-thin glass layer 21 and the covering layer 22 is more than 26 times that of the control group, which means that the embodiment of the present application can effectively improve the adhesion between the covering layer 22 and the ultra-thin glass layer 21 by adding the silicon-oxygen coupling agent to the covering layer 22, and reduce the probability of peeling between the covering layer 22 and the ultra-thin glass layer 21.

[0086] In some embodiments, the silicone coupling agent also includes a second type of silicone coupling agent, which is grafted onto the amino group in the polyimide molecular chain 222; thereby, the cross-linking density of the covering layer 22 can be increased to a greater extent, so that the cover plate 20 forms a high-hardness surface, further improving the support of the cover plate 20, and effectively improving the touch and crease phenomenon.

[0087] In some embodiments, the siloxane coupling agent further includes a third type of siloxane coupling agent, and the third type of siloxane coupling agent is freely distributed in the covering layer 22 , that is, the third type of siloxane coupling agent is an unreacted siloxane coupling agent.

[0088] In some embodiments, the chemical structure of the first type of silicon-oxygen coupling agent can be

[0089]

[0090] Among them, R1 includes at least one of an alkyl group with 1 to 15 carbon atoms, a cycloalkyl group with 1 to 15 carbon atoms, and an alkoxy group with 1 to 15 carbon atoms, and R2 and R3 may both include an alkyl group with 1 to 10 carbon atoms.

[0091] In some embodiments, the chemical structure of the second type of silicon-oxygen coupling agent can be

[0092] Among them, R1 includes at least one of an alkyl group with a carbon number of 1 to 15, a cycloalkyl group with a carbon number of 1 to 15, and an alkoxy group with a carbon number of 1 to 15, R2 and R3 may both include an alkyl group with a carbon number of 1 to 10, and R4 includes at least one of an alkyl group with a carbon number of 1 to 10 and an alkenyl group with a carbon number of 1 to 10.

[0093] In some embodiments, the siloxy coupling agent may include propyltrimethoxysilane, A151 (vinyltriethoxysilane), A171 (vinyltrimethoxysilane), A172 (vinyltri(β-methoxyethoxy)silane), 3-glycidyloxypropyltrimethoxysilane, 3-(2,3-epoxypropyloxy)propyltrimethoxysilane, trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane or 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, etc.

[0094] For example, when the siloxane coupling agent is propyltrimethoxysilane, the first type of siloxane coupling agent is The second type of silicone coupling agent is The third type of siloxane coupling agent is propyltrimethoxysilane.

[0095] In some embodiments, the cover layer 22 further contains fluorine-containing particles, so that the surface of the cover layer 22 and the cover plate 20 have anti-fingerprint, anti-oil and high water resistance properties.

[0096] In some embodiments, the elastic modulus of the cover layer 22 is greater than or equal to 3 GPa and less than or equal to 7 GPa, and the elongation at break of the cover layer 22 is greater than 5%.

[0097] Furthermore, in some embodiments, the display module includes a bending zone 101 and a non-bending zone 102 adjacent to the bending zone 101, and the portion of the display module located in the bending zone 101 can be bent, so that the display module can be applied to a folding display device.

[0098] Among them, the thickness of the ultra-thin glass layer 21 in the bending area 101 is less than or equal to the thickness of the ultra-thin glass layer 21 in the non-bending area 102, that is, the embodiment of the present application can improve the bending performance of the cover plate 20 by reducing the thickness of the ultra-thin glass layer 21 in the bending area 101.

[0099] In one embodiment of the present application, please combine Figure 2 as well as Figure 4 The ultra-thin glass layer 21 includes a first surface 211 and a second surface 212 that are oppositely arranged, and a side surface 213 connected between the first surface 211 and the second surface 212. The first surface 211 is located on a side of the ultra-thin glass layer 21 away from the display panel 10, and the second surface 212 is located on a side of the ultra-thin glass layer 21 close to the display panel 10.

[0100] The covering layer 22 covers the first surface 211 and the side surface 213 , and the first adhesive layer 51 is bonded to the second surface 212 , that is, the first adhesive layer 51 is bonded to a surface of the ultra-thin glass layer 21 close to the display panel 10 .

[0101] In some embodiments, the display module also includes a bearing layer 40 disposed between the first adhesive layer 51 and the hardening layer 30 and a second adhesive layer 52 disposed between the bearing layer 40 and the hardening layer 30, the cover plate 20 is bonded to the bearing layer 40 through the first adhesive layer 51, and the bearing layer 40 is bonded to the hardening layer 30 through the second adhesive layer 52.

[0102] It should be noted that, since the covering layer 22 does not cover the second surface 212, when the cover plate 20 is replaced, in order to avoid the ultra-thin glass layer 21 from being cracked and remaining due to stress, in the embodiment of the present application, a bearing layer 40 is formed on the side of the ultra-thin glass layer 21 close to the display panel 10 to cover the second surface 212, so that the ultra-thin glass layer 21 can be completely removed during the replacement process, so as to improve the replacement yield and convenience of the cover plate 20.

[0103] In some embodiments, the orthographic projection boundary of the cover plate 20 on the hardened layer 30, the orthographic projection boundary of the first adhesive layer 51 on the hardened layer 30, the orthographic projection boundary of the bearing layer 40 on the hardened layer 30, and the orthographic projection boundary of the second adhesive layer 52 on the hardened layer 30 all coincide with each other, that is, the sides of the cover plate 20, the first adhesive layer 51, the bearing layer 40, and the second adhesive layer 52 are flush with each other.

[0104] In some embodiments, the orthographic projection of the cover plate 20 on the hardened layer 30, the orthographic projection of the first adhesive layer 51 on the hardened layer 30, the orthographic projection of the bearing layer 40 on the hardened layer 30, and the orthographic projection of the second adhesive layer 52 on the hardened layer 30 are all located within the coverage range of the hardened layer, and the orthographic projection boundary of the cover plate 20 on the hardened layer 30 is spaced from the boundary of the hardened layer 30, the orthographic projection boundary of the first adhesive layer 51 on the hardened layer 30 is spaced from the boundary of the hardened layer 30, the orthographic projection boundary of the bearing layer 40 on the hardened layer 30 is spaced from the boundary of the hardened layer 30, and the orthographic projection boundary of the second adhesive layer 52 on the hardened layer 30 is spaced from the boundary of the hardened layer 30.

[0105] In some embodiments, the material of the carrier layer 40 may include polyethylene terephthalate, and the first adhesive layer 51 and the second adhesive layer 52 may both be OCA optical adhesive.

[0106] In this embodiment, the thickness of the ultra-thin glass layer 21 in the non-bending area 102 is less than 50 microns. At this time, the thickness of the ultra-thin glass layer 21 is small and has good bending performance. Therefore, the thickness of the ultra-thin glass layer 21 in the bending area 101 is equal to the thickness of the ultra-thin glass layer 21 in the non-bending area 102. Therefore, the cover plate 20 can have higher hardness and support while ensuring that the cover plate 20 has good bending performance.

[0107] In another embodiment of the present application, please combine Figure 5 and Figure 6 , this embodiment and Figure 2 The difference between the illustrated embodiments is that the thickness of the ultra-thin glass layer 21 in the non-bending area 102 is greater than or equal to 50 microns, so as to further increase the hardness and support of the cover plate 20 and improve the touch of the display module.

[0108] In this embodiment, the thickness of the ultra-thin glass layer 21 in the bending area 101 is less than the thickness of the ultra-thin glass layer 21 in the non-bending area 102, that is, in this embodiment, the ultra-thin glass layer 21 in the bending area 101 is thinned to improve the bending performance of the ultra-thin glass layer 21 in the bending area 101. Therefore, this embodiment can improve the hardness and support of the cover plate 20 and improve the touch of the display module while also ensuring the bending performance of the cover plate 20 in the bending area 101.

[0109] In some embodiments, the thickness of the ultra-thin glass layer 21 in the bending region 101 is less than 50 micrometers.

[0110] Specifically, the ultra-thin glass layer 21 includes a groove 210 opened in the bending area 101, and the groove 210 is located on the side of the ultra-thin glass layer 21 away from the display panel 10, that is, the groove 210 is located at the first surface 211; the covering layer 22 covers the first surface 211 and the side surface 213, and fills the groove 210.

[0111] In some embodiments, a surface of the cover layer 22 away from the display panel 10 is a plane, so that the outer surface of the display module is a plane, thereby improving the touch effect of the display module.

[0112] In another implementation of this application, please combine Figure 7 and Figure 8 , this embodiment and Figure 2The difference between the illustrated embodiments is that the covering layer 22 also covers the side of the ultra-thin glass layer 21 close to the display panel 10 , and the covering layer 22 covering the side of the ultra-thin glass layer 21 close to the display panel 10 is bonded to the hardening layer 30 through the first adhesive layer 51 .

[0113] Among them, the covering layer 22 covers the ultra-thin glass layer 21, that is, the covering layer 22 covers the first surface 211, the second surface 212 and the side surface 213. Therefore, in this embodiment, when the cover plate 20 is replaced, since the ultra-thin glass layer 21 is covered by the covering layer 22, the ultra-thin glass layer 21 can be prevented from being cracked and remaining due to stress, so that the ultra-thin glass layer 21 can be completely removed during the replacement process, so as to improve the replacement yield and convenience of the cover plate 20.

[0114] Furthermore, this embodiment is relative to Figure 2 In the embodiment shown, there is no need to set up the bearing layer 40. Therefore, the cover plate 20 is directly bonded to the hardening layer 30 through the first adhesive layer 51. The embodiment of the present application can save the preparation of the bearing layer 40, save process steps, reduce process costs, and also reduce the thickness of the display module.

[0115] In some embodiments, the orthographic projection boundary of the cover plate 20 on the hardening layer 30 and the orthographic projection boundary of the first adhesive layer 51 on the hardening layer 30 are coincident, that is, the side surfaces of the cover plate 20 and the first adhesive layer 51 are flush.

[0116] In some embodiments, the orthographic projection of the cover plate 20 on the hardened layer 30 and the orthographic projection of the first adhesive layer 51 on the hardened layer 30 are both located within the coverage range of the hardened layer, and the orthographic projection boundary of the cover plate 20 on the hardened layer 30 is separated from the boundary of the hardened layer 30, and the orthographic projection boundary of the first adhesive layer 51 on the hardened layer 30 is separated from the boundary of the hardened layer 30.

[0117] In another embodiment of the present application, please combine Fig. 9 as well as Fig.10 , this embodiment and Figure 7 The difference between the illustrated embodiments is that the thickness of the ultra-thin glass layer 21 in the non-bending area 102 is greater than 50 micrometers, so as to further increase the hardness and support of the cover plate 20 and improve the touch of the display module.

[0118] In this embodiment, the thickness of the ultra-thin glass layer 21 in the bending area 101 is less than the thickness of the ultra-thin glass layer 21 in the non-bending area 102, that is, in this embodiment, the ultra-thin glass layer 21 in the bending area 101 is thinned to improve the bending performance of the ultra-thin glass layer 21 in the bending area 101. Therefore, this embodiment can improve the hardness and support of the cover plate 20 and improve the touch of the display module while also ensuring the bending performance of the cover plate 20 in the bending area 101.

[0119] In some embodiments, the thickness of the ultra-thin glass layer 21 in the bending region 101 is less than 50 micrometers.

[0120] Specifically, the ultra-thin glass layer 21 includes a groove 210 opened in the bending area 101, and the groove 210 is located on the side of the ultra-thin glass layer 21 away from the display panel 10, that is, the groove 210 is located at the first surface 211; the covering layer 22 covers the first surface 211 and the side surface 213, and fills the groove 210.

[0121] In some embodiments, a surface of the cover layer 22 away from the display panel 10 is a plane, so that the outer surface of the display module is a plane, thereby improving the touch effect of the display module.

[0122] In another embodiment of the present application, please combine Fig.11 as well as Fig.12 , this embodiment and Fig. 9 The difference between the illustrated embodiments is that the ultra-thin glass layer 21 includes a groove 210 opened in the bending area 101, and the groove 210 is located on a side of the ultra-thin glass layer 21 close to the display panel 10, that is, the groove 210 is located at the second surface 212; the covering layer 22 covers the second surface 212 and the side surface 213, and fills the groove 210.

[0123] In some embodiments, a surface of the cover layer 22 close to the display panel 10 and a surface away from the display panel 10 are both planes, so that the outer surface of the display module is plane, thereby improving the touch effect of the display module.

[0124] It should be noted that, in the embodiment of the present application, the groove 210 can be arranged on the side of the ultra-thin glass layer 21 away from the display panel 10 and / or the side of the ultra-thin glass layer 21 close to the display panel, the groove 210 is located in the bending area 101, and the cover layer 22 can cover the side of the ultra-thin glass layer 21 provided with the groove 210 and fill the groove 210. Wherein, when the groove 210 is arranged on the side of the ultra-thin glass layer 21 away from the display panel 10, the display module can be an outward folding display module; when the groove 210 is arranged on the side of the ultra-thin glass layer 21 close to the display panel 10, the display module can be an inward folding display module; when the display module is bent, the groove 210 is located on the outside of the bend.

[0125] As mentioned above, the embodiment of the present application arranges the ultra-thin glass layer 21 in the cover plate 20 to effectively improve the hardness of the cover plate 20, improve the touch and crease phenomenon; in addition, the cover layer 22 covering the ultra-thin glass layer 21 contains a silicon-oxygen coupling agent, and a silicon-oxygen bond can be formed between the silicon-oxygen coupling agent and the glass, thereby improving the adhesion between the ultra-thin glass layer 21 and the cover layer 22, reducing the probability of peeling between the ultra-thin glass layer 21 and the cover layer 22, and improving the stability of the cover plate 20; and the silicon-oxygen coupling agent can also be grafted onto the polymer in the cover layer 22 to increase the degree of cross-linking of the polymer in the cover layer 22, so as to further improve the hardness of the surface of the cover plate 20 and improve the touch and crease phenomenon of the display module.

[0126] Further, the present application provides Examples 2 to 4 to illustrate the Figure 4 and Figure 8 The cover plate 20 is shown being strain tested.

[0127] Among them, in Example 2, the Figure 4 The cover plate 20 structure shown in the figure has a thickness of 15 microns.

[0128] In Example 3, the Figure 4 The cover plate 20 structure shown in the figure has a thickness of 35 microns.

[0129] In Example 4, the Figure 8 The cover plate 20 structure shown in the figure has a single-side covering layer 22 with a thickness of 15 microns.

[0130] The results shown in Table 2 below were obtained after verification.

[0131] Table 2

[0132] Example 2 Example 3 Example 4 Material safety value Covering layer strain value 0.1％ 0.2％ 1.3％ 8.0％ Ultra-thin glass layer strain value 0.7％ 0.8％ 0.6％ 1.95％

[0133] It can be seen from Table 2 that the cover plate 20 provided in the embodiment of the present application can fully meet the safety value of the material used, that is, the cover plate 20 provided in the embodiment of the present application has good stability.

[0134] In addition, an embodiment of the present application further provides a display device, which includes the display module described in the above embodiment.

[0135] In summary, the embodiment of the present application sets the ultra-thin glass layer 21 in the cover plate 20 to effectively improve the hardness of the cover plate 20, improve the touch and crease phenomenon; in addition, the cover layer 22 covering the ultra-thin glass layer 21 contains a silicon-oxygen coupling agent, and a silicon-oxygen bond can be formed between the silicon-oxygen coupling agent and the glass, thereby improving the adhesion between the ultra-thin glass layer 21 and the cover layer 22, reducing the probability of peeling between the ultra-thin glass layer 21 and the cover layer 22, and improving the stability of the cover plate 20; and the silicon-oxygen coupling agent can also be grafted onto the polymer in the cover layer 22 to increase the degree of cross-linking of the polymer in the cover layer 22, so as to further improve the hardness of the surface of the cover plate 20 and improve the touch and crease phenomenon of the display device.

[0136] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0137] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0138] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0139] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that: include: Display panel; A cover plate, disposed on one side of the display panel, the cover plate comprising an ultra-thin glass layer and a covering layer, the ultra-thin glass layer being located on one side of the display panel, and the covering layer at least covering a side of the ultra-thin glass layer away from the display panel; The cover layer contains a silicon-oxygen coupling agent, and a chemical bond is formed between a portion of the silicon-oxygen coupling agent and the ultra-thin glass layer.

2. The display module according to claim 1, characterized in that: The siloxane coupling agent includes a first type of siloxane coupling agent, the first type of siloxane coupling agent is connected to the surface of the ultra-thin glass layer, and a siloxane bond is formed between the first type of siloxane coupling agent and the surface of the ultra-thin glass layer.

3. The display module according to claim 2, characterized in that: The cover layer also contains a polymer, and the first type of silicon-oxygen coupling agent is connected between the ultra-thin glass layer and the polymer.

4. The display module according to claim 3, characterized in that: The polymer includes a polyimide molecular chain, and the first type of silicon-oxygen coupling agent is connected between the ultra-thin glass layer and the polyimide molecular chain.

5. The display module according to claim 4, characterized in that: The siloxane coupling agent also includes a second type of siloxane coupling agent, and the second type of siloxane coupling agent is grafted onto the amino group in the polyimide molecular chain.

6. The display module according to claim 2, characterized in that: The siloxane coupling agent further includes a third type of siloxane coupling agent, and the third type of siloxane coupling agent is freely distributed in the covering layer.

7. The display module according to claim 1, characterized in that: The cover layer further contains fluorine-containing particles.

8. The display module according to claim 1, characterized in that: The display module includes a bending area and a non-bending area adjacent to the bending area; When the thickness of the ultra-thin glass layer in the non-bending area is less than 50 micrometers, the thickness of the ultra-thin glass layer in the bending area is equal to the thickness of the ultra-thin glass layer in the non-bending area; When the thickness of the ultra-thin glass layer in the non-bending area is greater than or equal to 50 microns, the thickness of the ultra-thin glass layer in the bending area is less than the thickness of the ultra-thin glass layer in the non-bending area, and the thickness of the ultra-thin glass layer in the bending area is less than 50 microns.

9. The display module according to claim 8, characterized in that: The display module is outward-folding, a groove is formed on a side of the ultra-thin glass layer away from the display panel, the groove is located in the bending area, and the covering layer at least covers the side of the ultra-thin glass layer away from the display panel and fills the groove.

10. The display module according to claim 8, characterized in that: The display module is of an inward folding type, a groove is provided on a side of the ultra-thin glass layer close to the display panel, the groove is located in the bending area, and the covering layer covers the side of the ultra-thin glass layer close to the display panel and fills the groove.

11. The display module according to claim 1, characterized in that: The display module also includes: A hardening layer is disposed between the cover plate and the display panel, and a surface water drop angle of the hardening layer is greater than or equal to 105°; The first adhesive layer is arranged between the hardening layer and the cover plate, and the first adhesive layer is in contact with a surface of the cover plate close to the hardening layer.

12. The display module according to claim 11, characterized in that: The first adhesive layer is bonded to a side of the ultra-thin glass layer close to the display panel, and the display module also includes a bearing layer arranged between the first adhesive layer and the hardening layer and a second adhesive layer arranged between the bearing layer and the hardening layer, the cover plate is bonded to the bearing layer through the first adhesive layer, and the bearing layer is bonded to the hardening layer through the second adhesive layer.

13. The display module according to claim 11, characterized in that: The covering layer also covers a side of the ultra-thin glass layer close to the display panel, and the covering layer covering a side of the ultra-thin glass layer close to the display panel is adhered to the hardening layer through the first adhesive layer.

14. The display module according to claim 11, characterized in that: The ultra-thin glass layer includes a first surface away from the display panel, a second surface close to the display panel, and a side surface connected between the first surface and the second surface, and the covering layer also covers the side surface of the ultra-thin glass layer.

15. The display module according to claim 11, characterized in that: The orthographic projection boundary of the cover plate on the hardened layer coincides with the orthographic projection boundary of the first adhesive layer on the hardened layer, the orthographic projection of the cover plate on the hardened layer and the orthographic projection of the first adhesive layer on the hardened layer are located within the coverage range of the hardened layer, and the orthographic projection boundary of the cover plate on the hardened layer is spaced from the boundary of the hardened layer, and the orthographic projection boundary of the first adhesive layer on the hardened layer is spaced from the boundary of the hardened layer.

16. A display device, characterized in that: The display device comprises the display module according to any one of claims 1 to 15.

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