Display module and preparation method thereof

Abstract

According to the display module and the preparation method thereof, before a to-be-bent part is bent, a first protection layer covers the side face of a rigid substrate, and a second protection layer covers the back face of the bent part, so that the risk that the to-be-bent part is damaged by the rigid substrate is reduced; the second protection layer covers the back surface of the to-be-bent part, so that the supporting performance of the flexible substrate of the to-be-bent part is improved, and the risk that the wire of the to-be-bent part is broken after being bent is reduced; besides, the binding force between the first protection layer and the side face of the rigid substrate is large, so that the thickness of the first protection layer can be reduced, the bending width of the part to be bent is reduced, and then the frame width of the display module is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a method for preparing the same. Background Art

[0002] At present, rigid organic light-emitting panels have a large border because the border area is a rigid support. In order to solve the problem of the large border of the display screen, the usual method is to cut off the glass substrate in the border area and then reduce the width of the border by bending.

[0003] In the process of research and practice of the prior art, the inventors of the present application discovered that, after directly cutting the glass substrate, the cut surface of the glass substrate is uneven and has sharp protrusions. When the frame area is bent, the flexible substrate layer is easily damaged by the glass substrate. When the bending degree is large, the support of the flexible substrate is weak, which can easily lead to the breakage of the routing of the flexible substrate. Summary of the invention

[0004] The embodiments of the present application provide a display module and a method for preparing the same, which can reduce the width of the frame while protecting the flexible substrate and reducing the risk of wiring breakage at the bent portion.

[0005] The present application provides a method for preparing a display module, which includes:

[0006] An initial display module is provided, the initial display module comprising a display panel and a circuit board assembly, the display panel comprising a rigid substrate and a display body arranged on the rigid substrate, the display body comprising a display portion and a portion to be bent arranged on at least one side of the display portion, the circuit board assembly being connected to a side of the portion to be bent of the display panel away from the display portion;

[0007] Peeling off the portion to be bent and the rigid substrate;

[0008] Cutting the rigid substrate corresponding to the portion to be bent, removing the portion of the rigid substrate corresponding to the portion to be bent, so as to expose the back side of the portion to be bent;

[0009] A first protective layer is formed on the side of the rigid substrate and a second protective layer is formed on the back of the portion to be bent, wherein the bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the portion to be bent, and the thickness of the first protective layer is less than the thickness of the second protective layer;

[0010] The portion to be bent is bent so that at least a portion of the circuit board assembly is located on a side of the rigid substrate away from the display body.

[0011] Optionally, in some embodiments of the present application, after the step of cutting the rigid substrate and before the step of forming the first protective layer, the preparation method further includes:

[0012] A groove is formed on the side of the rigid substrate to form a concave groove, so that the first protective layer in the subsequent step covers the concave groove.

[0013] Optionally, in some embodiments of the present application, the step of forming the first protective layer and the second protective layer includes the following steps:

[0014] Forming a first adhesive layer on the side of the rigid substrate, and forming a second adhesive layer on the back of the to-be-bent portion, wherein the first adhesive layer and the second adhesive layer are connected;

[0015] pre-curing the first adhesive layer and the second adhesive layer;

[0016] And, after the step of bending the portion to be bent, the following steps are included:

[0017] The first adhesive layer and the second adhesive layer are then solidified to form the first protective layer and the second protective layer.

[0018] Optionally, in some embodiments of the present application, before the step of bending the portion to be bent, the sum of the thickness of the first adhesive layer and the thickness of the second adhesive layer is the first thickness;

[0019] After the step of bending the portion to be bent, in a direction perpendicular to the side of the rigid substrate, a portion of the second adhesive layer facing the side of the rigid substrate is at least partially overlapped and connected to the first adhesive layer; in a direction perpendicular to the side of the rigid substrate, a sum of a thickness of the first adhesive layer and a thickness of the second adhesive layer is a second thickness, and the second thickness is less than the first thickness.

[0020] Optionally, in some embodiments of the present application, the first adhesive layer and the second adhesive layer are made of the same material, and the first adhesive layer and the second adhesive layer are formed by a single spraying step.

[0021] Optionally, in some embodiments of the present application, the first protective layer and the second protective layer are made of different materials, and the adhesion of the first protective layer is greater than that of the second protective layer.

[0022] Optionally, in some embodiments of the present application, the rigid substrate is cut by laser and the side surfaces of the rigid substrate are grooved.

[0023] Optionally, in some embodiments of the present application, one of the portions to be bent is connected to one side of the display portion, and another of the portions to be bent is connected to the other side of the display portion;

[0024] The portion to be bent includes a flexible substrate, a fan-out trace and a binding pad arranged on the flexible substrate, and the fan-out trace is connected to the binding pad; the circuit board assembly includes a flexible circuit board and a printed circuit board, one end of the flexible circuit board is connected to the binding pad, and the other end of the flexible circuit board is connected to the printed circuit board;

[0025] After the step of bending the portion to be bent, the portion to be bent is bent at 90 degrees, and the printed circuit board is located on a side of the rigid substrate away from the display body.

[0026] Accordingly, the present application also provides a display module, which includes

[0027] The display panel comprises a rigid substrate and a display body, wherein the display body comprises a display portion and a bending portion, wherein the display portion is arranged on the rigid substrate, and the bending portion is bent along a side surface of the rigid substrate;

[0028] A circuit board assembly is connected to a side of the bent portion away from the display portion, and at least a portion of the circuit board assembly is located on a side of the rigid substrate away from the display portion;

[0029] A first protective layer and a second protective layer, the first protective layer covers the side of the rigid substrate, the second protective layer covers the back of the bent portion, the bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the bent portion, and the thickness of the first protective layer is less than the thickness of the second protective layer.

[0030] Optionally, in some embodiments of the present application, a groove is opened on the side of the rigid substrate, and the first protective layer covers the groove.

[0031] Optionally, in some embodiments of the present application, in a direction perpendicular to the side of the rigid substrate, a portion of the second protective layer facing the side of the rigid substrate at least partially overlaps and is connected to the first protective layer.

[0032] Optionally, in some embodiments of the present application, the first protective layer and the second protective layer are made of the same material.

[0033] Optionally, in some embodiments of the present application, the first protective layer and the second protective layer are made of different materials, and the adhesion of the first protective layer is greater than that of the second protective layer.

[0034] In the preparation method of the display module of the embodiment of the present application, before bending the part to be bent, the first protective layer is used to cover the side of the rigid substrate, and the second protective layer is used to cover the back of the bent part to reduce the risk of the part to be bent being damaged by the rigid substrate. Secondly, the second protective layer covers the back of the part to be bent to improve the support of the flexible substrate of the part to be bent, and reduces the risk of the wiring of the part to be bent breaking after bending. In addition, since the bonding force between the first protective layer and the side of the rigid substrate is relatively large, the thickness of the first protective layer can be thinned to reduce the bending width of the part to be bent, thereby reducing the border width of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic diagram of a process for preparing a display module provided in an embodiment of the present application;

[0036] Figure 2 is a schematic diagram of step B01 of the method for preparing a display module provided in an embodiment of the present application;

[0037] Figure 3 is a schematic diagram of step B02 of the method for preparing a display module provided in an embodiment of the present application;

[0038] Figure 4 is a schematic diagram of step B03 of the method for preparing a display module provided in an embodiment of the present application;

[0039] Figure 5 is a schematic diagram of step B03a of the method for preparing a display module provided in an embodiment of the present application;

[0040] Figure 6 yes Figure 5 A magnified schematic diagram of the A1 portion;

[0041] Figure 7 is a schematic diagram of step B41 of the method for preparing a display module provided in an embodiment of the present application;

[0042] Figure 8 yes Figure 7 A magnified schematic diagram of part A2;

[0043] Fig. 9 is a schematic diagram of step B43 of the method for preparing a display module provided in an embodiment of the present application;

[0044] Fig.10 is a schematic diagram of step B05 of the method for preparing a display module provided in an embodiment of the present application;

[0045] Fig.11 yes Fig.10 A magnified schematic diagram of the A3 portion;

[0046] Fig.12It is a structural schematic diagram of a display module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, the various embodiments can be combined with each other but will not be repeated one by one, and in the absence of contrary instructions, the directional words used, such as "upper" and "lower", usually refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as markings, and no numerical requirements are imposed or order is established.

[0048] The present application provides a display module and a method for manufacturing the same, which are described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0049] The present application provides a method for preparing a display module, which includes:

[0050] An initial display module is provided, the initial display module comprising a display panel and a circuit board assembly, the display panel comprising a rigid substrate and a display body arranged on the rigid substrate, the display body comprising a display portion and a portion to be bent arranged on at least one side of the display portion, the circuit board assembly being connected to a side of the portion to be bent of the display panel away from the display portion;

[0051] Peeling off the portion to be bent and the rigid substrate;

[0052] Cutting the rigid substrate corresponding to the portion to be bent, removing the portion of the rigid substrate corresponding to the portion to be bent, so as to expose the back side of the portion to be bent;

[0053] A first protective layer is formed on the side of the rigid substrate and a second protective layer is formed on the back of the portion to be bent, wherein the bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the portion to be bent, and the thickness of the first protective layer is less than the thickness of the second protective layer;

[0054] The portion to be bent is bent so that at least a portion of the circuit board assembly is located on a side of the rigid substrate away from the display body.

[0055] In the preparation method of the display module of the embodiment of the present application, before bending the part to be bent, the first protective layer is used to cover the side of the rigid substrate, and the second protective layer is used to cover the back of the bent part to reduce the risk of the part to be bent being damaged by the rigid substrate. Secondly, the second protective layer covers the back of the part to be bent to improve the support of the flexible substrate of the part to be bent, and reduces the risk of the wiring of the part to be bent breaking after bending. In addition, since the bonding force between the first protective layer and the side of the rigid substrate is relatively large, the thickness of the first protective layer can be thinned to reduce the bending width of the part to be bent, thereby reducing the border width of the display module.

[0056] It should be noted that the binding force between the film layers can be obtained through a peeling test. The adhesion of the film layers can also be obtained through a peeling test. Since the peeling test is a well-known method, it will not be described here.

[0057] It should be understood that some of the steps in all the steps of the display module of the embodiment of the present application are not limited in order, as long as the process of the display module is completed.

[0058] Please refer to Figures 1 to 11 , Figure 1 Shown is a schematic flow chart of a method for preparing a display module according to an embodiment of the present application.

[0059] The present application provides a method for preparing a display module, which includes:

[0060] Step B01, providing an initial display module 1000. The initial display module 1000 includes a display panel 10 and a circuit board assembly 20. The display panel 10 includes a rigid substrate 11 and a display body 12 disposed on the rigid substrate 11. The display body 12 includes a display portion 121 and a portion to be bent 122 disposed on at least one side of the display portion 121. The circuit board assembly 20 is connected to a side of the portion to be bent 122 of the display panel 10 away from the display portion 121.

[0061] Step B02 , peeling off the portion to be bent 122 and the rigid substrate 11 .

[0062] Step B03 , cutting the rigid substrate 11 corresponding to the portion to be bent 122 , removing the portion of the rigid substrate 11 corresponding to the portion to be bent 122 , so as to expose the back side of the portion to be bent 122 .

[0063] Step B04, forming a first protective layer 31 on the side of the rigid substrate 11 and a second protective layer 32 on the back of the portion to be bent 122. The bonding force between the first protective layer 31 and the rigid substrate 11 is greater than the bonding force between the second protective layer 32 and the portion to be bent 122, and the thickness h1 of the first protective layer 31 is less than the thickness h2 of the second protective layer 32.

[0064] Step B05 , bending the to-be-bent portion 122 so that at least a portion of the circuit board assembly 20 is located on a side of the rigid substrate 11 away from the display body 12 .

[0065] The following is a detailed description of the method for preparing the display module according to the embodiment of the present application.

[0066] Please refer to Figure 2 In step B01, an initial display module 1000 is provided. The initial display module 1000 includes a display panel 10 and a circuit board assembly 20. The display panel 10 includes a rigid substrate 11 and a display body 12 disposed on the rigid substrate 11. The display body 12 includes a display portion 121 and a portion to be bent 122 disposed on at least one side of the display portion 121. The circuit board assembly 20 is connected to a side of the portion to be bent 122 of the display panel 10 away from the display portion 121.

[0067] Optionally, the display panel 10 may be an organic light emitting panel, a quantum dot light emitting panel, a micro light emitting diode panel or a liquid crystal panel, etc. The following description will be made by taking the display panel 10 as an organic light emitting panel as an example.

[0068] Optionally, the rigid substrate 11 may be a glass substrate or a hard substrate of other materials.

[0069] Optionally, there are two portions to be bent 122, one portion to be bent 122 is connected to one side of the display portion 121, and the other portion to be bent 122 is connected to the other side of the display portion 121. However, the present invention is not limited thereto, for example, there may be only one portion to be bent 122. The number of portions to be bent 122 may be determined according to the actual situation of the display panel 10, and is not limited here.

[0070] The to-be-bent portion 122 includes a flexible substrate 12a and a fan-out trace and a binding pad 12c disposed on the flexible substrate 12a, and the fan-out trace is connected to the binding pad 12c.

[0071] The flexible substrate 12a extends from the to-be-bent portion 122 to the display portion 121. The display portion 121 is configured to display a screen.

[0072] Optionally, the circuit board assembly 20 includes a flexible circuit board 21 and a printed circuit board 22 , one end of the flexible circuit board 21 is connected to the binding pad 12 c , and the other end of the flexible circuit board 21 is connected to the printed circuit board 22 .

[0073] Optionally, in some embodiments, a driving chip 23 is also disposed on the portion to be bent 122 .

[0074] Then go to step B02.

[0075] Please refer to Figure 3 , step B02, peeling off the part to be bent 122 and the rigid substrate 11.

[0076] Optionally, laser scanning is used to peel off the rigid substrate 11 of the portion 122 to be bent.

[0077] Then go to step B03.

[0078] Please refer to Figure 4 , step B03, cutting the rigid substrate 11 corresponding to the portion to be bent 122, removing the portion of the rigid substrate 11 corresponding to the portion to be bent 122 to expose the back side of the portion to be bent 122.

[0079] Optionally, the rigid substrate 11 may be cut by laser or other means.

[0080] Then proceed to step B04.

[0081] Step B04, forming a first protective layer 31 on the side of the rigid substrate 11 and a second protective layer 32 on the back of the portion to be bent 122. The bonding force between the first protective layer 31 and the rigid substrate 11 is greater than the bonding force between the second protective layer 32 and the portion to be bent 122, and the thickness h1 of the first protective layer 31 is less than the thickness h2 of the second protective layer 32.

[0082] In some embodiments, please refer to Figure 5 and Figure 6 , after step B03 and before step B04, the following steps are also included:

[0083] Step B03a, grooves are formed on the side of the rigid substrate 11 to form a groove 11a, so that the first protection layer 31 in the subsequent step covers the groove 11a.

[0084] Optionally, laser or other means may be used to groove the side surface of the rigid substrate 11 .

[0085] Optionally, laser is used to cut the rigid substrate 11 and grooves are made on the side of the rigid substrate 11. The same laser device is used to continuously cut the rigid substrate 11 and grooves are made on the side of the rigid substrate 11 to improve the preparation efficiency.

[0086] Optionally, in some embodiments, a plurality of grooves 11a may be continuously formed on the side of the rigid substrate 11. The depth g1 of the groove 11a penetrating into the rigid substrate 11 is less than or equal to 20 micrometers to avoid excessive strength of the rigid substrate 11. For example, the depth g1 of the groove 11a may be 20 micrometers, 19 micrometers, 18 micrometers, 17 micrometers, 16 micrometers, 15 micrometers, 14 micrometers, 13 micrometers, 12 micrometers, 10 micrometers, 9 micrometers, 8 micrometers, 7 micrometers, 6 micrometers or 5 micrometers.

[0087] Optionally, in the thickness direction of the rigid substrate 11, the width g2 of the groove 11a is less than or equal to 20 microns to avoid excessive strength of the rigid substrate 11. For example, the width g2 of the groove 11a can be 20 microns, 19 microns, 18 microns, 17 microns, 16 microns, 15 microns, 14 microns, 13 microns, 12 microns, 10 microns, 9 microns, 8 microns, 7 microns, 6 microns or 5 microns.

[0088] In some embodiments, in the thickness direction of the rigid substrate 11 , the plurality of grooves 11 a are spaced apart and evenly arranged to improve the uniformity of adhesion of the subsequent first protective layer.

[0089] In some embodiments, the spacing between the grooves 11a decreases from the side of the rigid substrate 11 away from the display portion 121 to the side close to the display portion 121, so that the density of the grooves 11a close to the display portion 121 is greater, and the adhesion of the subsequent first protective layer 31 is greater the closer to the display portion 121. When the portion to be bent 122 is bent, the portion of the first protective layer 31 close to the bending corner has a greater adhesion to pull the portion to be bent 122, so as to maintain the stability of the shape of the portion to be bent 122 after being bent.

[0090] In some embodiments, step B04, forming the first protective layer 31 and the second protective layer 32, includes the following steps:

[0091] Please refer to Figure 7 and Figure 8 , step B41, forming a first adhesive layer 311 on the side of the rigid substrate 11, and forming a second adhesive layer 321 on the back side of the to-be-bent portion 122, the first adhesive layer 311 and the second adhesive layer 321 are connected, and the thickness h01 of the first adhesive layer 311 is less than the thickness h02 of the second adhesive layer 321.

[0092] Optionally, the glue is sprayed on the side surface of the rigid substrate 11 and the back surface of the portion to be bent 122 .

[0093] Optionally, the first adhesive layer 311 may not only cover the concave-convex structures such as the tip protrusions on the side of the rigid substrate 11 , but also be connected to the second adhesive layer 321 to stabilize the bending shape of the to-be-bent portion 122 .

[0094] The second adhesive layer 321 can not only protect the portion 122 to be bent, improve its support, and reduce the risk of the wiring breaking during bending, but also can be combined with the first adhesive layer 311 to stabilize the bending shape of the portion 122 to be bent.

[0095] Optionally, in some embodiments of the present application, the first adhesive layer 311 and the second adhesive layer 321 are made of the same material. The first adhesive layer 311 and the second adhesive layer 321 are formed by a single spraying step to improve the manufacturing efficiency.

[0096] It should be noted that, since the groove 11 a is provided on the side of the rigid substrate 11 , the bonding force between the first adhesive layer 311 and the rigid substrate 11 can be improved, and the first adhesive layer 311 can be thinned, thereby reducing the bending width of the to-be-bent portion 122 .

[0097] Optionally, the thickness h01 of the first adhesive layer 311 is between 50 micrometers and 150 micrometers, for example, may be 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, 140 micrometers or 150 micrometers.

[0098] The thickness h02 of the second adhesive layer 321 is between 100 micrometers and 200 micrometers, for example, it can be 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, 140 micrometers, 150 micrometers, 160 micrometers, 170 micrometers, 180 micrometers, 190 micrometers or 200 micrometers.

[0099] Optionally, the second adhesive layer 321 covers the entire back side of the to-be-bent portion 122. The first adhesive layer 311 covers at least part of the side of the rigid substrate 11, for example, the first adhesive layer 311 covers the entire side of the rigid substrate 11; for another example, the first adhesive layer 311 covers a portion of the side of the rigid substrate 11 close to the display portion 121.

[0100] Then go to step B42.

[0101] Step B42 , pre-curing the first adhesive layer 311 and the second adhesive layer 321 .

[0102] Optionally, when the first adhesive layer 311 and the second adhesive layer 321 may be UV-curable adhesive, UV light may be used to pre-cure the first adhesive layer 311 and the second adhesive layer 321. However, the present invention is not limited thereto. For example, when the first adhesive layer 311 and the second adhesive layer 321 may be heat-curable adhesive, heating may be used to pre-cure the first adhesive layer 311 and the second adhesive layer 321.

[0103] It can be understood that pre-curing the first adhesive layer 311 and the second adhesive layer 321 allows the first adhesive layer 311 and the second adhesive layer 321 to have better adhesion and support while also having certain flexibility and fluidity, thereby improving the stability of the bending process.

[0104] Optionally, in some embodiments, the pre-curing degree of the first adhesive layer 311 is greater than the pre-curing degree of the second adhesive layer 321. It is understandable that the higher the pre-curing degree of the first adhesive layer 311, the lower the risk of excessive overflow of the first adhesive layer 311 during the process of bending the portion to be bent 122, resulting in an excessively thin thickness, thereby reducing the risk of the thorns on the side of the rigid substrate 11 piercing the portion to be bent 122.

[0105] Then proceed to step B05 and step B43.

[0106] Please refer to Fig. 9 , step B43, solidifying the first adhesive layer 311 and the second adhesive layer 321 to form a first protective layer 31 and a second protective layer 32.

[0107] It should be noted that step B43 is performed after step B05, that is, after the step of bending the portion 122 to be bent.

[0108] After the portion to be bent 122 is bent, the first adhesive layer 311 and the second adhesive layer 321 are solidified. After the bending shape of the portion to be bent 122 is determined, the first adhesive layer 311 and the second adhesive layer 321 are solidified. The adhesion of the first adhesive layer 311 and the second adhesive layer 321 can be used to maintain the shape of the portion to be bent 122 after bending, thereby reducing the risk of peeling. At the same time, the portion to be bent 122 can be better supported, thereby reducing the risk of wiring breakage.

[0109] Please refer to Fig.10 and Fig.11 , step B05 , bending the to-be-bent portion 122 so that at least a portion of the circuit board assembly 20 is located on a side of the rigid substrate 11 away from the display body 12 .

[0110] It is understandable that based on the flexibility and fluidity of the first adhesive layer 311 and the second adhesive layer 321 after pre-curing, the bending degree can be increased by fine-tuning to achieve the effect of squeezing the first adhesive layer 311 and the second adhesive layer 321 to reduce the thickness of the connection between the two and further reduce the bending width.

[0111] Secondly, during the mutual extrusion between the first adhesive layer 311 and the second adhesive layer 321 , the first adhesive layer 311 and the second adhesive layer 321 are connected as one, and flow to other spaces, thereby filling the inner circle space of the bent portion 122 after bending.

[0112] In some embodiments, based on the first adhesive layer 311 covering the side of the rigid substrate 11 close to the display portion 121, when the portion 122 to be bent is bent, the portion 122 to be bent and the second adhesive layer 321 will squeeze the first adhesive layer 311 after bending, so that the first adhesive layer 311 flows toward the rigid substrate 11 away from the display portion 121, thereby reducing the risk of the first adhesive layer 311 overflowing from the rigid substrate 11 during the bending process and saving material of the first adhesive layer 311.

[0113] Optionally, in some embodiments of the present application, before the step of bending the to-be-bent portion 122 , the sum of the thickness h01 of the first adhesive layer 311 and the thickness h02 of the second adhesive layer 321 is the first thickness;

[0114] After the step of bending the portion to be bent 122, in a direction perpendicular to the side of the rigid substrate 11, the portion of the second adhesive layer 321 facing the side of the rigid substrate 11 at least partially overlaps and is connected to the first adhesive layer 311. In a direction perpendicular to the side of the rigid substrate 11, the sum of the thickness h01 of the first adhesive layer 311 and the thickness h02 of the second adhesive layer 321 is a second thickness, which is less than the first thickness.

[0115] It can be understood that, based on the flexibility and fluidity of the first adhesive layer 311 and the second adhesive layer 321 after pre-curing, the first adhesive layer 311 and the second adhesive layer 321 can be squeezed during the process of improving the bending degree through fine-tuning, so that part of the adhesive material of the first adhesive layer 311 and the second adhesive layer 321 flows to the area with less force, thereby reducing the total thickness of the first adhesive layer 311 and the second adhesive layer 321, thereby reducing the bending width of the to-be-bent portion 122.

[0116] Optionally, after the step of bending the portion to be bent 122 , the portion to be bent 122 is bent at 90 degrees. The printed circuit board 22 is located on a side of the rigid substrate 11 away from the display body 12 .

[0117] It is understandable that the bending portion 122 can be bent at 90 degrees to further reduce the bending width and reduce the frame width of the display module. The bending portion is formed after the bending portion 122 is bent.

[0118] Optionally, in some embodiments of the present application, the first protective layer 31 and the second protective layer 32 are made of different materials, and the adhesion of the first protective layer 31 is greater than that of the second protective layer 32 .

[0119] It should be noted that, based on step B41 to step B43, the materials of the first adhesive layer 311 and the second adhesive layer 321 are different, and two spraying steps are used to form the first adhesive layer 311 and the second adhesive layer 321 respectively. The viscosity of the first adhesive layer 311 is greater than that of the second adhesive layer 321, so that the first adhesive layer 311 has greater adhesion to improve the bonding force with the side of the rigid substrate 11. Based on this, the side of the rigid substrate 11 may not be grooved. In some embodiments, the side of the rigid substrate 11 is still grooved, which can further improve the bonding force between the first adhesive layer 311 and the side of the rigid substrate 11, and further achieve the effect of reducing the width of the frame.

[0120] Please refer to Fig.12 Accordingly, the embodiment of the present application further provides a display module 100 , which includes a display panel 10 , a circuit board assembly 20 , a first protective layer 31 and a second protective layer 32 .

[0121] The display panel 10 includes a rigid substrate 11 and a display body 12. The display body 12 includes a display portion 121 and a bent portion 123. The display portion 121 is disposed on the rigid substrate 11, and the bent portion 123 is bent along the side of the rigid substrate 11. The circuit board assembly 20 is connected to a side of the bent portion 123 away from the display portion 121, and at least a portion of the circuit board assembly 20 is located on a side of the rigid substrate 11 away from the display portion 121.

[0122] The first protective layer 31 covers the side of the rigid substrate 11, and the second protective layer 32 covers the back of the bent portion 123. The bonding force between the first protective layer 31 and the rigid substrate 11 is greater than the bonding force between the second protective layer 32 and the bent portion 123, and the thickness of the first protective layer 31 is less than the thickness of the second protective layer 32.

[0123] The display module 100 of the embodiment of the present application adopts a first protective layer 31 to cover the side of the rigid substrate 11, and a second protective layer 32 to cover the back of the bent portion 123 to reduce the risk of the bent portion 123 being damaged by the rigid substrate 11. Secondly, the second protective layer 32 covering the back of the bent portion 123 improves the support of the flexible substrate of the bent portion 123 and reduces the risk of breakage of the routing of the bent portion 123. In addition, since the bonding force between the first protective layer 31 and the side of the rigid substrate 11 is relatively large, the thickness of the first protective layer 31 can be thinned to reduce the width of the bent portion 123, thereby reducing the border width of the display module 100.

[0124] It should be noted that the display module 100 of the embodiment of the present application is formed by the manufacturing method of the display module of the above embodiment, wherein the to-be-bent portion 122 becomes the bent portion 123 after being bent.

[0125] In addition, compared to before the rigid substrate is cut and bent, the border width of the display module 100 of the embodiment of the present application can be reduced to 7 mm.

[0126] Optionally, the bending portion 123 includes a flexible substrate 12a and a fan-out trace and a binding pad 12c disposed on the flexible substrate 12a, and the fan-out trace is connected to the binding pad 12c.

[0127] Optionally, in some embodiments of the present application, a groove 11 a is formed on a side surface of the rigid substrate 11 , and the first protective layer 31 covers the groove 11 a .

[0128] Optionally, in some embodiments, a plurality of grooves 11a are formed on the side of the rigid substrate 11. The depth g1 of the grooves 11a penetrating into the rigid substrate 11 is less than or equal to 20 micrometers to avoid excessive strength of the rigid substrate 11. For example, the depth g1 of the grooves 11a may be 20 micrometers, 19 micrometers, 18 micrometers, 17 micrometers, 16 micrometers, 15 micrometers, 14 micrometers, 13 micrometers, 12 micrometers, 10 micrometers, 9 micrometers, 8 micrometers, 7 micrometers, 6 micrometers or 5 micrometers.

[0129] Optionally, in the thickness direction of the rigid substrate 11, the width g2 of the groove 11a is less than or equal to 20 microns to avoid excessive strength of the rigid substrate 11. For example, the width g2 of the groove 11a can be 20 microns, 19 microns, 18 microns, 17 microns, 16 microns, 15 microns, 14 microns, 13 microns, 12 microns, 10 microns, 9 microns, 8 microns, 7 microns, 6 microns or 5 microns.

[0130] In some embodiments, in the thickness direction of the rigid substrate 11 , the plurality of grooves 11 a are spaced apart and evenly arranged to improve the uniformity of adhesion of the subsequent first protective layer.

[0131] In some embodiments, the spacing between the grooves 11a decreases from the side of the rigid substrate 11 away from the display portion 121 to the side close to the display portion 121, so that the density of the grooves 11a close to the display portion 121 is greater, and the adhesion of the subsequent first protective layer 31 is greater the closer to the display portion 121. When the portion to be bent 122 is bent, the portion of the first protective layer 31 close to the bending corner has a greater adhesion to pull the portion to be bent 122, so as to maintain the stability of the shape of the portion to be bent 122 after being bent.

[0132] Optionally, in some embodiments of the present application, in a direction perpendicular to the side of the rigid substrate 11 , a portion of the second protective layer 32 facing the side of the rigid substrate 11 at least partially overlaps and is connected to the first protective layer 31 .

[0133] It can be understood that, based on the flexibility and fluidity of the first adhesive layer 311 and the second adhesive layer 321 after pre-curing, the first adhesive layer 311 and the second adhesive layer 321 can be squeezed and connected during the process of fine-tuning to increase the bending degree, so that ultimately, in the direction perpendicular to the side of the rigid substrate 11, the part of the side of the second protective layer 32 facing the rigid substrate 11 is at least partially overlapped and connected to the first protective layer 31.

[0134] The first protective layer 31 and the second protective layer 32 are connected at the inner circle of the bending part, which can maintain the stability of the shape of the bending part 123 while better supporting the bending part 123 and reducing the risk of wiring breakage.

[0135] Optionally, in some embodiments of the present application, the first protective layer 31 and the second protective layer 32 are integrally connected and fill the inner circle space of the bent portion 123 close to the display portion 121 to better maintain the shape of the bent portion 123 and support the bent portion 123 .

[0136] Optionally, in some embodiments of the present application, the first protective layer 31 and the second protective layer 32 are made of the same material, so that the first protective layer 31 and the second protective layer 32 are formed by one spraying step to improve the preparation efficiency.

[0137] Optionally, in some embodiments of the present application, the first protective layer 31 and the second protective layer 32 are made of different materials, and the adhesion of the first protective layer 31 is greater than that of the second protective layer 32 .

[0138] It can be understood that by forming the first protective layer 31 and the second protective layer 32 with different adhesions by using different materials, the bonding force between the first protective layer 31 and the rigid substrate 11 is greater, so that the thickness of the first protective layer 31 can be reduced.

[0139] The above is a detailed introduction to a display module and a preparation method thereof provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a display module, characterized in that: include: An initial display module is provided, the initial display module comprising a display panel and a circuit board assembly, the display panel comprising a rigid substrate and a display body arranged on the rigid substrate, the display body comprising a display portion and a portion to be bent arranged on at least one side of the display portion, the circuit board assembly being connected to a side of the portion to be bent of the display panel away from the display portion; Peeling off the portion to be bent and the rigid substrate; Cutting the rigid substrate corresponding to the portion to be bent, removing the portion of the rigid substrate corresponding to the portion to be bent, so as to expose the back side of the portion to be bent; A first protective layer is formed on the side of the rigid substrate and a second protective layer is formed on the back of the portion to be bent, wherein the bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the portion to be bent, and the thickness of the first protective layer is less than the thickness of the second protective layer; The portion to be bent is bent so that at least a portion of the circuit board assembly is located on a side of the rigid substrate away from the display body.

2. The preparation method according to claim 1, characterized in that: After the step of cutting the rigid substrate and before the step of forming the first protective layer, the preparation method further includes: A groove is formed on the side of the rigid substrate to form a concave groove, so that the first protective layer in the subsequent step covers the concave groove.

3. The preparation method according to claim 2, characterized in that: The step of forming the first protective layer and the second protective layer comprises the following steps: Forming a first adhesive layer on the side of the rigid substrate, and forming a second adhesive layer on the back of the to-be-bent portion, wherein the first adhesive layer and the second adhesive layer are connected; pre-curing the first adhesive layer and the second adhesive layer; And, after the step of bending the portion to be bent, the following steps are included: The first adhesive layer and the second adhesive layer are then solidified to form the first protective layer and the second protective layer.

4. The preparation method according to claim 3, characterized in that: Before the step of bending the portion to be bent, the sum of the thickness of the first adhesive layer and the thickness of the second adhesive layer is a first thickness; After the step of bending the portion to be bent, in a direction perpendicular to the side of the rigid substrate, a portion of the second adhesive layer facing the side of the rigid substrate is at least partially overlapped and connected to the first adhesive layer; in a direction perpendicular to the side of the rigid substrate, a sum of a thickness of the first adhesive layer and a thickness of the second adhesive layer is a second thickness, and the second thickness is less than the first thickness.

5. The preparation method according to claim 3, characterized in that: The first adhesive layer and the second adhesive layer are made of the same material, and the first adhesive layer and the second adhesive layer are formed by a single spraying step.

6. The preparation method according to any one of claims 1 to 3, characterized in that: The first protective layer and the second protective layer are made of different materials, and the adhesion of the first protective layer is greater than that of the second protective layer.

7. The preparation method according to any one of claims 2 to 4, characterized in that: The rigid substrate is cut by laser and the side surface of the rigid substrate is grooved.

8. The preparation method according to any one of claims 1 to 4, characterized in that: One of the portions to be bent is connected to one side of the display portion, and the other portion to be bent is connected to the other side of the display portion; The portion to be bent includes a flexible substrate, a fan-out trace and a binding pad arranged on the flexible substrate, and the fan-out trace is connected to the binding pad; the circuit board assembly includes a flexible circuit board and a printed circuit board, one end of the flexible circuit board is connected to the binding pad, and the other end of the flexible circuit board is connected to the printed circuit board; After the step of bending the portion to be bent, the portion to be bent is bent at 90 degrees, and the printed circuit board is located on a side of the rigid substrate away from the display body.

9. A display module, characterized in that: include The display panel comprises a rigid substrate and a display body, wherein the display body comprises a display portion and a bending portion, wherein the display portion is arranged on the rigid substrate, and the bending portion is bent along a side surface of the rigid substrate; A circuit board assembly is connected to a side of the bent portion away from the display portion, and at least a portion of the circuit board assembly is located on a side of the rigid substrate away from the display portion; A first protective layer and a second protective layer, the first protective layer covers the side of the rigid substrate, the second protective layer covers the back of the bent portion, the bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the bent portion, and the thickness of the first protective layer is less than the thickness of the second protective layer.

10. The display module according to claim 9, characterized in that: A groove is formed on the side of the rigid substrate, and the first protective layer covers the groove.

11. The display module according to claim 10, characterized in that: In a direction perpendicular to the side of the rigid substrate, a portion of the second protective layer facing the side of the rigid substrate at least partially overlaps and is connected to the first protective layer.

12. The display module according to claim 11, characterized in that: The first protection layer and the second protection layer are made of the same material.

13. The display module according to any one of claims 9 to 11, characterized in that: The first protective layer and the second protective layer are made of different materials, and the adhesion of the first protective layer is greater than that of the second protective layer.

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