Polishing pad and method of making same, chemical mechanical polishing apparatus

Abstract

This application provides a polishing pad and its preparation method, as well as a chemical mechanical polishing (CMP) device. The polishing pad includes: a polishing layer; a waterproof buffer layer disposed on one side of the polishing layer along its thickness direction, the waterproof buffer layer being composed of at least thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent; and an adhesive backing layer disposed on the side of the waterproof buffer layer opposite to the polishing layer. In this application, the waterproof buffer layer of the polishing pad is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The polyrotaxane enables the waterproof buffer layer to maintain a stable buffering effect, reducing the shear stress on the adhesive layer, while the anti-hydrolysis agent improves its chemical corrosion resistance. By placing the waterproof buffer layer between the polishing layer and the adhesive backing layer, the transfer of polishing liquid absorbed by the polishing layer to the adhesive backing layer can be prevented, thus preventing the adhesive backing layer from corroding and failing. The polishing pad of this application can improve reliability and extend service life, which is beneficial for reducing polishing costs.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a polishing pad and its preparation method, and a chemical mechanical polishing device. Background Technology

[0002] Chemical mechanical polishing (CMP) is currently the mainstream technology for polishing wafers, achieving ultra-high surface flatness. Polishing pads, as one of the main consumables in the CMP process, function to store and supply polishing fluid, remove processing residues, and transfer mechanical loads. The lifespan of polishing pads significantly impacts the cost of CMP.

[0003] Existing composite polishing pads typically consist of a polishing layer, a buffer layer, and an adhesive backing layer. The buffer layer and polishing layer are generally bonded together with pressure-sensitive adhesives or hot-melt adhesives. During use, the polishing pad is bonded to the polishing pad via the adhesive backing layer.

[0004] However, during the CMP process, the shear force on the backing layer of the polishing pad and the corrosion of the backing layer by the polishing fluid can easily cause the adhesive of the backing layer to fail, resulting in the delamination of the polishing pad and the end of its life. Summary of the Invention

[0005] In view of the above problems, this application provides a polishing pad and its preparation method, as well as a chemical mechanical polishing device, which can improve the reliability and service life of the polishing pad and also help reduce polishing costs.

[0006] In a first aspect, this application provides a polishing pad, comprising: a polishing layer; a waterproof buffer layer disposed on one side of the polishing layer along its thickness direction, the waterproof buffer layer being composed of at least thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent; and an adhesive backing layer disposed on the side of the waterproof buffer layer opposite to the polishing layer.

[0007] In some embodiments, the anti-hydrolysis agent includes at least one of polycarbodiimide, an epoxy compound, and oxazolin, and / or the waterproof buffer layer further includes thermosetting polyurethane.

[0008] In some embodiments, the adhesive backing layer comprises at least one of a propylene-based adhesive and a rubber-based adhesive; and / or, the polishing layer is composed of a thermoplastic polyurethane and a nonwoven fabric.

[0009] In some embodiments, the hardness of the polishing layer is 60A-85A; and / or, the thickness of the polishing layer is 0.5mm-5mm; and / or, the thickness of the waterproof buffer layer is 1mm-7mm.

[0010] A second aspect of this application provides a method for preparing a polishing pad, comprising the following steps:

[0011] Prepare a polishing layer;

[0012] A buffer layer pre-casting liquid comprising thermoplastic polyurethane, anti-hydrolysis agent, polyrotaxane and solvent is poured onto one side of the polished layer along the thickness direction to obtain a waterproof buffer layer.

[0013] The waterproof buffer layer is treated with adhesive to obtain an adhesive backing layer, and the polishing pad is then prepared.

[0014] In some embodiments, the pre-cast liquid for the buffer layer comprises, by weight: 100-150 parts thermoplastic polyurethane, 10-30 parts polyrotaxane, and 5-10 parts anti-hydrolysis agent.

[0015] In some embodiments, the solvent is selected from at least one of N,N-dimethylformamide, N,N-dimethylacetamide, or N-methylpyrrolidone.

[0016] In some embodiments, after pouring the buffer layer pre-casting liquid onto the polishing layer, the method further includes: gelling at a first preset temperature for a first preset time to form the waterproof buffer layer.

[0017] In some embodiments, the first preset temperature is 60℃-80℃; and / or the first preset duration is 60min-100min.

[0018] In some embodiments, the preparation of the polishing layer includes: impregnating a polyurethane slurry comprising thermoplastic polyurethane resin and solvent into a nonwoven fabric to obtain an impregnated sample; placing the impregnated sample in water for a second preset time to pre-coagulate; and placing the pre-coagulated impregnated sample in a drying device to dry it at a second preset temperature for a third preset time to obtain the polishing layer.

[0019] In some embodiments, the impregnated sample comprises, by weight, 80-100 parts thermoplastic polyurethane and 30-60 parts solvent; and / or, the second preset time is 20-60 min; and / or, the second preset temperature is 80°C-120°C; and / or, the third preset time is 70-100 min.

[0020] A third aspect of this application provides a chemical mechanical polishing apparatus, including the polishing pad described in the first aspect.

[0021] The polishing pad, its preparation method, and the chemical mechanical polishing equipment provided in this application feature a waterproof buffer layer composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The polyrotaxane enables the waterproof buffer layer to maintain a stable buffering effect, reducing the shear stress on the adhesive layer, while the anti-hydrolysis agent enhances its chemical corrosion resistance. By placing the waterproof buffer layer between the polishing layer and the adhesive backing layer, the waterproof buffer layer can prevent the polishing fluid absorbed by the polishing layer from transferring to the adhesive backing layer, thus preventing the adhesive backing layer from corroding and failing. This significantly improves the reliability and service life of the polishing pad and also helps reduce polishing costs. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the polishing pad according to an embodiment of this application.

[0024] Explanation of reference numerals in the attached figures:

[0025] 100-Polishing Pad;

[0026] 101 - Polishing layer; 102 - Waterproof buffer layer; 103 - Adhesive backing layer. Detailed Implementation

[0027] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0028] Chemical Mechanical Polishing (CMP) is currently the mainstream technology for polishing wafers, achieving ultra-high surface flatness. Polishing pads, as one of the main consumables in the CMP process, function to store and supply polishing fluid, remove processing residues, and transfer mechanical loads. The lifespan of polishing pads significantly impacts the cost of CMP. Existing composite polishing pads typically consist of a polishing layer, a buffer layer, and an adhesive backing layer. The buffer and polishing layers are generally bonded together with pressure-sensitive adhesives or hot-melt adhesives. During use, the polishing pad is bonded to the polishing pad via the adhesive in the backing layer. However, during the CMP process, the shear force experienced by the backing layer and the corrosion from the polishing fluid can easily cause the adhesive to fail, leading to pad delamination and the end of its lifespan.

[0029] In view of this, this application provides a polishing pad and its preparation method, as well as a chemical mechanical polishing device. The waterproof buffer layer is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The polyrotaxane enables the waterproof buffer layer to maintain a stable buffering effect and reduce the shear stress on the adhesive layer, while the anti-hydrolysis agent improves its chemical corrosion resistance. By placing the waterproof buffer layer between the polishing layer and the adhesive backing layer, the waterproof buffer layer can prevent the polishing liquid absorbed by the polishing layer from transferring to the adhesive backing layer, thus preventing the adhesive backing layer from being corroded and failing. This significantly improves the reliability and service life of the polishing pad and also helps to reduce polishing costs.

[0030] The following is combined Figure 1 The polishing pad 100 provided in the embodiments of this application will be described in detail.

[0031] The polishing pad 100 of this embodiment may include a polishing layer 101, a waterproof buffer layer 102, and an adhesive backing layer 103 stacked along the thickness direction of the polishing pad 100.

[0032] The polishing layer 101 has strong wear resistance and is mainly used to transfer mechanical loads to the workpiece (such as a wafer) to remove excess material from the workpiece surface. Furthermore, since polishing fluid is typically added during CMP (chemical mechanical polishing), the polishing layer 101 can be constructed with a porous structure of varying sizes on its surface. These porous structures serve to transport the polishing fluid, ensure chemical etching, and remove waste during the polishing process. For example, the polishing layer 101 can be composed of at least one of thermoplastic polyurethane, nonwoven fabric, and synthetic leather.

[0033] A waterproof buffer layer 102 is disposed on one side of the polished layer 101 along the thickness direction (e.g., Figure 1(The lower surface of the polished layer 101 shown) The waterproof buffer layer 102 can be in direct contact with the polished layer 101, or the waterproof buffer layer 102 and the polished layer 101 can also be provided with other intermediate layers, which is not limited in this embodiment.

[0034] The adhesive backing layer 103 is disposed on the side of the waterproof buffer layer 102 that faces away from the polishing layer 101 (e.g., Figure 1 (The lower surface of the waterproof buffer layer 102 shown). The adhesive layer 103 can bond and fix the polishing pad 100 to the polishing disc of the chemical mechanical polishing equipment, ensuring the stability of the polishing pad 100 during the CMP process.

[0035] The waterproof buffer layer 102 can support the polishing layer 101 during the polishing process and absorb and disperse the impact applied to the polishing layer 101. In addition, since the waterproof buffer layer 102 has a water-blocking effect, it can prevent the polishing liquid absorbed by the polishing layer 101 from transferring to the adhesive layer 103, thus preventing the adhesive layer 103 from being corroded and failing by the polishing liquid.

[0036] It should be noted that the waterproof buffer layer 102 in this embodiment is composed of at least thermoplastic polyurethane, polyrotaxane and an anti-hydrolysis agent.

[0037] The thermoplastic polyurethane in the waterproof buffer layer 102 ensures that the waterproof buffer layer 102 has a certain degree of elasticity.

[0038] Polyrotaxane is a polymer with good elasticity. It can improve the partial reversibility and cushioning properties of polymer materials by utilizing the free movement (physical effect) of the cyclic molecules within the polyrotaxane. When the recovery properties of thermoplastic polyurethane decrease and the compression set increases, polyrotaxane, with its lower compression set, can provide strong support for the thermoplastic polyurethane, helping it recover and thus helping the polishing pad 100 maintain its elastic properties. In other words, by using polyrotaxane, the waterproof cushioning layer 102 can maintain a stable and continuous cushioning effect, reducing the shear stress on the adhesive layer 103.

[0039] Adding an anti-hydrolysis agent to the waterproof buffer layer 102 can improve its chemical corrosion resistance. For example, the anti-hydrolysis agent can be polycarbodiimide, which contains a compound with the functional group (-N=C=N-) in its molecule. This allows it to react with the carboxylic acid produced after the hydrolysis of thermoplastic polyurethane to form acylurea, thereby preventing the catalytic effect of carboxylic acid on hydrolysis, reducing the hydrolysis reaction of thermoplastic polyurethane, ensuring the stability of thermoplastic polyurethane, and improving the corrosion resistance of the waterproof buffer layer 102.

[0040] For example, a composite material formed from thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent can be cast onto the polishing layer 101 to prepare a waterproof buffer layer 102. Thus, the waterproof buffer layer 102 of this embodiment can form a dense, non-porous structure, effectively preventing the polishing liquid from penetrating into the adhesive layer 103 and avoiding corrosion and failure of the adhesive layer 103 by the polishing liquid. In other words, the waterproof buffer layer 102 of this embodiment is cast, resulting in stronger adhesion and higher density on the polishing layer 101.

[0041] The polishing pad 100 of this embodiment has a waterproof buffer layer 102 composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The polyrotaxane enables the waterproof buffer layer 102 to maintain a stable buffering effect, reducing the shear stress on the adhesive layer, while the anti-hydrolysis agent improves its chemical corrosion resistance. By placing the waterproof buffer layer 102 between the polishing layer 101 and the adhesive backing layer 103, the waterproof buffer layer 102 can prevent the polishing liquid absorbed by the polishing layer 101 from transferring to the adhesive backing layer 103, preventing the adhesive backing layer 103 from corroding and failing. This significantly improves the reliability and service life of the polishing pad 100 and also helps reduce polishing costs.

[0042] In some embodiments, the thickness of the waterproof buffer layer 102 is 1mm-7mm. For example, the thickness of the waterproof buffer layer 102 can be 1mm, 1.3mm, 1.5mm, 1.7mm, 2mm, 2.5mm, 2.8mm, 3mm, 3.1mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, or 7mm. Of course, this application does not impose any limitations on this, and the thickness of the waterproof buffer layer 102 can be flexibly selected within the above range as needed. This avoids the situation where the thickness of the waterproof buffer layer 102 is too small, such as less than 1mm, resulting in poor water-blocking and cushioning effects during polishing. It also avoids the situation where the thickness of the waterproof buffer layer 102 is too large, such as greater than 7mm, leading to material waste due to the larger thickness failing to significantly improve the water-blocking effect. In summary, by ensuring that the thickness of the waterproof buffer layer 102 is within the range of 1mm-7mm, both the cushioning and support effect and the waterproof effect can be guaranteed, thereby increasing the service life of the polishing pad 100.

[0043] In some embodiments, the waterproof buffer layer 102 is cast onto the polishing layer 101. For example, thermoplastic polyurethane, an anti-hydrolysis agent, and polyrotaxane can be dissolved in a solvent in a certain mass ratio and adjusted to a certain viscosity to obtain a buffer layer pre-casting liquid. This pre-casting liquid is then cast onto one side of the polishing layer 101 and subjected to gelation treatment to obtain the waterproof buffer layer 102. This casting method is advantageous for obtaining a non-porous, highly dense waterproof buffer layer 102, thus effectively isolating the adhesive layer 103 from corrosive polishing liquid. Furthermore, the casting method is relatively simple and easy to process.

[0044] In some embodiments, the anti-hydrolysis agent may include at least one of polycarbodiimide, an epoxy compound, and oxazoline. For example, the anti-hydrolysis agent may consist only of polycarbodiimide, only of an epoxy compound, or only of oxazoline. Furthermore, the anti-hydrolysis agent may be composed of any two or all of polycarbodiimide, an epoxy compound, and oxazoline. This improves the chemical corrosion resistance of the waterproof buffer layer 102.

[0045] In some embodiments, the waterproof buffer layer 102 may further comprise thermosetting polyurethane. Specifically, during the preparation of the waterproof buffer layer 102, a certain amount of thermosetting polyurethane may be incorporated into the composite material of polyrotaxane, an anti-hydrolysis agent, and thermoplastic polyurethane. Since thermosetting polyurethane has better temperature resistance and deformation resistance than thermoplastic polyurethane, incorporating an appropriate amount of thermosetting polyurethane can enhance the temperature resistance and deformation resistance of the waterproof buffer layer 102.

[0046] In some embodiments, the adhesive backing layer 103 may include at least one of a acrylic-based adhesive or a rubber-based adhesive. For example, the adhesive backing layer 103 may include only an acrylic-based adhesive, or it may include only a rubber-based adhesive. This ensures that the adhesive backing layer 103 has high tackiness, thereby improving the connection stability between the polishing pad 100 and the polishing disc.

[0047] In some embodiments, the polishing layer 101 is composed of thermoplastic polyurethane and nonwoven fabric. The thermoplastic polyurethane material possesses strong wear resistance, tear strength, and acid and alkali corrosion resistance. Its surface microporous structure softens and roughens the workpiece surface, allowing abrasive particles to achieve efficient planarization in the polishing fluid. The nonwoven fabric, on the other hand, has good water permeability and a strong capacity to hold the polishing fluid. In other words, by composing the polishing layer 101 with thermoplastic polyurethane and nonwoven fabric, this embodiment not only ensures sufficient wear resistance but also effectively absorbs and stores the polishing fluid, thereby improving the polishing effect of the workpiece.

[0048] In some embodiments, the hardness of the polishing layer 101 is 60A-85A. For example, the hardness of the polishing layer 101 can be 60A, 65A, 70A, 75A, 80A, or 85A. Of course, this application does not limit this, and the hardness of the polishing layer 101 can be reasonably set according to actual needs. In this way, it can be ensured that the polishing layer 101 has sufficient hardness to efficiently remove excess material from the workpiece.

[0049] In some embodiments, the thickness of the polishing layer 101 is 0.5mm-5mm. For example, the thickness of the polishing layer 101 can be 0.5mm, 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, or 5mm. Of course, this application does not limit this, and the thickness of the polishing layer 101 can be reasonably set according to actual needs. In this way, the polishing layer 101 can have sufficient structural stability and the ability to absorb and store polishing fluid.

[0050] A second aspect of this application provides a method for preparing a polishing pad 100, comprising the following steps:

[0051] S101, Prepare polishing layer 101;

[0052] Specifically, the polishing layer 101 is composed of thermoplastic polyurethane and non-woven fabric.

[0053] S102, a buffer layer pre-casting liquid including thermoplastic polyurethane, anti-hydrolysis agent, polyrotaxane and solvent is poured onto the polished layer 101 to obtain a waterproof buffer layer 102.

[0054] S103, the waterproof buffer layer 102 is treated with adhesive backing to obtain a polishing pad 100 with an adhesive backing layer 103.

[0055] The polishing pad 100 of this application embodiment is prepared by casting a composite material of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent onto the polishing layer 101 to form a waterproof buffer layer 102. This allows the porous structure of the waterproof buffer layer 102 to prevent polishing fluid from penetrating into the adhesive layer 103, thus avoiding corrosion and failure of the adhesive layer 103. The anti-hydrolysis agent in the waterproof buffer layer 102 improves its corrosion resistance. The polyrotaxane material in the waterproof buffer layer 102 quickly restores the elasticity of the thermoplastic polyurethane, maintaining the stable buffering effect and reducing the shear stress on the adhesive layer. Therefore, the polishing pad 100 prepared has good structural stability and service life, which is beneficial for improving polishing efficiency and reducing the cost of chemical mechanical polishing.

[0056] In some embodiments, the pre-cast liquid for the buffer layer may include, by weight, 100-150 parts of thermoplastic polyurethane, 10-30 parts of polyrotaxane, and 5-10 parts of an anti-hydrolysis agent. That is, the ratio of the mass of thermoplastic polyurethane (M1), the mass of polyrotaxane (M2), and the mass of the anti-hydrolysis agent (M3) is: M1:M2:M3 = (100-150):(10-30):(5-10). By mixing thermoplastic polyurethane, polyrotaxane, and the anti-hydrolysis agent in the above mass ratio to prepare the waterproof buffer layer 102, it is possible to ensure that the waterproof buffer layer 102 has sufficient buffering support performance and water-blocking and corrosion-resistant capabilities.

[0057] In some embodiments, the solvent is selected from at least one of N,N-dimethylformamide, N,N-dimethylacetamide, or N-methylpyrrolidone. For example, the solvent may be only N,N-dimethylformamide, only N,N-dimethylacetamide, or only N-methylpyrrolidone; of course, the solvent may also be any combination of two or all of N,N-dimethylformamide, N,N-dimethylacetamide, or N-methylpyrrolidone. This ensures that the solvent has good solubility for the thermoplastic polyurethane, polyrotaxane, and anti-hydrolysis agent, thereby improving the mixing uniformity of the components such as the thermoplastic polyurethane, polyrotaxane, and anti-hydrolysis agent.

[0058] In some embodiments, after pouring the buffer layer pre-casting liquid onto the polishing layer 101, the method further includes: gelling at a first preset temperature for a first preset duration to form a waterproof buffer layer 102.

[0059] Understandably, since the pre-cast liquid of the buffer layer is a fluid with a certain degree of fluidity, it needs to be gelled at a certain temperature, namely the first preset temperature, to form a non-porous, dense waterproof buffer layer 102.

[0060] In some embodiments, the first preset temperature is 60℃-80℃. For example, the first preset temperature can be 60℃, 61℃, 63℃, 65℃, 68℃, 70℃, 72℃, 75℃, 77℃, or 80℃. Of course, this application does not limit this. To ensure the structural stability of the waterproof buffer layer 102 after gelation and the reliability of its connection with the polishing layer 101, the first preset temperature can be reasonably selected within the above range according to actual needs. In this way, on the one hand, it prevents the gelation rate from being too low when the first preset temperature is too low, for example, below 60℃, and on the other hand, it avoids the solvent from evaporating too quickly and excessively when the first preset temperature is too high, for example, below 80℃, which is not conducive to the formation of a dense structure.

[0061] In some embodiments, the first preset time is 60-100 minutes. For example, the first preset time can be 60 minutes, 63 minutes, 65 minutes, 68 minutes, 70 minutes, 75 minutes, 78 minutes, 80 minutes, 81 minutes, 83 minutes, 85 minutes, 88 minutes, 90 minutes, 92 minutes, 94 minutes, 95 minutes, 97 minutes, 99 minutes, or 100 minutes. Of course, this application does not limit this. The first preset temperature can be reasonably selected within the above range according to actual needs to ensure the structural stability of the waterproof buffer layer 102 after gelation and the reliability of its connection with the polishing layer 101.

[0062] In some embodiments, preparing the polished layer 101, i.e., step S101, may include the following steps:

[0063] S1011, A polyurethane slurry comprising thermoplastic polyurethane resin and solvent is impregnated into a nonwoven fabric to obtain an impregnated sample;

[0064] S1012, Place the impregnated sample in water for a second preset time to pre-coagulate;

[0065] S1013, the pre-condensed impregnated sample is placed in a drying device and dried at a second preset temperature for a third preset time to obtain the polished layer 101.

[0066] Dissolving thermoplastic polyurethane resin in a solvent to form a polyurethane slurry facilitates better impregnation of the polyurethane slurry into the nonwoven fabric; pre-coagulating the polyurethane slurry and nonwoven fabric in water can improve the bonding effect between the polyurethane slurry and the nonwoven fabric; finally, drying the impregnated sample can yield a structurally stable polished layer 101.

[0067] In some embodiments, the impregnated sample comprises, by weight, 80-100 parts thermoplastic polyurethane and 30-60 parts solvent. That is, the ratio of the mass of thermoplastic polyurethane (M11) to the mass of solvent (M12) in the polyurethane slurry is: M11:M12 = (80-100):(30-60). By mixing the thermoplastic polyurethane and solvent in the above mass ratio to prepare the polishing layer 101, it is possible to ensure that the thermoplastic polyurethane dissolves well, facilitating better impregnation into the nonwoven fabric.

[0068] In some embodiments, the second preset time is 20-60 minutes. For example, the second preset time can be 20 minutes, 25 minutes, 30 minutes, 35 minutes, 40 minutes, 45 minutes, 50 minutes, 55 minutes, or 60 minutes. Of course, this application does not limit this. The second preset time can be reasonably selected within the above range according to actual needs. In this way, on the one hand, it helps to avoid poor pre-coagulation effect when the second preset time is too short, such as less than 20 minutes; on the other hand, it helps to avoid the preparation efficiency of the polishing layer 101 being too low when the second preset time is too long, such as greater than 60 minutes.

[0069] In some embodiments, the second preset temperature is 80℃-120℃, for example, the second preset temperature can be 80℃, 85℃, 90℃, 95℃, 100℃, 105℃, 110℃, 115℃ or 120℃. This helps to avoid situations where the second preset temperature is too low, for example below 80℃, resulting in low drying efficiency, and also helps to avoid situations where the second preset temperature is too high, for example above 120℃, which would be detrimental to the structural stability of the polishing layer 101.

[0070] In some embodiments, the third preset time is 70-100 minutes, for example, the third preset time can be 70 minutes, 75 minutes, 80 minutes, 85 minutes, 90 minutes, 95 minutes, or 100 minutes. This helps to avoid insufficient drying and poor structural stability of the polishing pad 100 when the drying time is too short, for example, less than 70 minutes; and avoids low drying efficiency and low preparation efficiency when the drying time is too long, for example, greater than 100 minutes.

[0071] In some embodiments, prior to the adhesive backing treatment, the process may further include polishing the surface of the polished layer 101 and the side of the waterproof buffer layer 102 facing away from the polished layer 101. This polishing step improves the flatness of the surface of the polished layer 101 and the side of the waterproof buffer layer 102 facing away from the polished layer 101, thereby increasing the adhesion between the adhesive backing layer 103 and the waterproof buffer layer 102, which is beneficial for improving the structural stability and service life of the buffer pad 100.

[0072] In some embodiments, after the backing adhesive treatment, the polishing pad 100 is further cut and grooved. Specifically, the polishing pad 100 can be cut into a target shape, such as a circle, and grooves can be etched on the surface of the polishing layer 101. The grooves can serve as spaces for accommodating polishing fluid, waste materials, and exhausting heat. Thus, the polishing pad 100 can be used for polishing workpieces such as wafers and optical glass.

[0073] The chemical mechanical polishing apparatus provided in the third aspect embodiment of this application includes the polishing pad 100 described above.

[0074] The chemical mechanical polishing equipment of this embodiment, by setting the polishing pad 100 in the above embodiment, has high reliability and long service life, which is beneficial to improving the polishing quality of the chemical mechanical polishing equipment and reducing polishing costs.

[0075] The following describes some specific embodiments of the polishing pad 100 of this application and its preparation method.

[0076] Example 1

[0077] The polishing pad 100 comprises, from top to bottom, a polishing layer 101, a waterproof buffer layer 102, and an adhesive backing layer 103. The polishing layer 101 is composed of thermoplastic polyurethane and non-woven fabric; the waterproof buffer layer 102 is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent; and the adhesive backing layer 103 is selected from at least one of acrylic-based adhesives or rubber-based adhesives. The polishing layer 101 has a hardness of 70A and a thickness of 5mm. The waterproof buffer layer 102 also has a thickness of 5mm.

[0078] The preparation process is as follows: ① Prepare a polyurethane slurry by mixing 100 parts of thermoplastic polyurethane resin and 60 parts of N,N-dimethylformamide. The thermoplastic polyurethane resin has a molecular weight of 300,000. ② Impregnate the polyurethane slurry obtained in step ① into a non-woven fabric, scrape off the excess solution on the surface of the non-woven fabric, and obtain an impregnated sample. Place the impregnated sample in water for pre-coagulation for 60 minutes. ③ Place the pre-coagulated impregnated sample from step ② in a 120°C oven and dry for 100 minutes to obtain polishing layer 101. ④ Dissolve 150 parts of thermoplastic polyurethane, 10 parts of polyrotaxane, and 5 parts of polycarbodiimide in a solvent and adjust its viscosity to 12,000 cP to obtain a buffer layer pre-casting liquid. ⑤ Cast the buffer layer pre-casting liquid obtained in step ④ onto polishing layer 101 and gel at 60°C for 100 minutes. ⑥ Grind, adhesive-backed, cut, and grooved the sample obtained in step ⑤ to obtain a high-recovery corrosion-resistant polishing pad 100.

[0079] Example 2 (compared to Example 1, with increased polyrotaxane usage)

[0080] The polishing pad 100 comprises, from top to bottom, a polishing layer 101, a waterproof buffer layer 102, and an adhesive backing layer 103. The polishing layer 101 is composed of thermoplastic polyurethane and non-woven fabric. The waterproof buffer layer 102 is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The adhesive backing layer 103 is selected from at least one of acrylic-based adhesives or rubber-based adhesives. The polishing layer 101 has a hardness of 70A and a thickness of 5mm. The waterproof buffer layer 102 also has a thickness of 5mm.

[0081] The preparation process is as follows: ① Prepare a polyurethane slurry by mixing 100 parts of thermoplastic polyurethane resin and 60 parts of N,N-dimethylformamide. The thermoplastic polyurethane resin has a molecular weight of 300,000. ② Impregnate the polyurethane slurry obtained in step ① into a nonwoven fabric, scrape off the excess solution on the surface of the nonwoven fabric, and obtain an impregnated sample. Place the impregnated sample in water for pre-coagulation for 60 minutes. ③ Place the pre-coagulated impregnated sample from step ② in a 120°C oven and dry for 100 minutes to obtain polishing layer 101. ④ Dissolve 150 parts of thermoplastic polyurethane, 30 parts of polyrotaxane, and 5 parts of polycarbodiimide in a solvent and adjust its viscosity to 12,000 cP to obtain a buffer layer pre-casting liquid. ⑤ Cast the buffer layer pre-casting liquid obtained in step ④ onto polishing layer 101, and then gel at 60°C for 100 minutes. ⑥ Grind, adhesive-backed, cut, and grooved the sample obtained in step ⑤ to obtain a high-recovery corrosion-resistant polishing pad 100.

[0082] Example 3 (Compared to Example 2, the viscosity of the pre-cast liquid for the buffer layer is reduced)

[0083] The polishing pad 100 comprises, from top to bottom, a polishing layer 101, a waterproof buffer layer 102, and an adhesive backing layer 103. The polishing layer 101 is composed of thermoplastic polyurethane and non-woven fabric. The waterproof buffer layer 102 is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The adhesive backing layer 103 is selected from at least one of acrylic-based adhesives or rubber-based adhesives. The polishing layer 101 has a hardness of 70A and a thickness of 5mm. The waterproof buffer layer 102 also has a thickness of 5mm.

[0084] The preparation process is as follows: ① Prepare a polyurethane slurry by mixing 100 parts of thermoplastic polyurethane resin and 60 parts of N,N-dimethylformamide. The thermoplastic polyurethane resin has a molecular weight of 300,000. ② Impregnate the polyurethane slurry obtained in step ① into a nonwoven fabric, scrape off the excess solution on the surface of the nonwoven fabric, and obtain an impregnated sample. Place the impregnated sample in water for pre-coagulation for 60 minutes. ③ Place the pre-coagulated impregnated sample from step ② in a 120°C oven and dry for 100 minutes to obtain polishing layer 101. ④ Dissolve 150 parts of thermoplastic polyurethane, 30 parts of polyrotaxane, and 5 parts of polycarbodiimide in a solvent and adjust its viscosity to 8000 cP to obtain a buffer layer pre-casting liquid. ⑤ Cast the buffer layer pre-casting liquid obtained in step ④ onto polishing layer 101, and then gel at 60°C for 100 minutes. ⑥ Grind, adhesive-backed, cut, and grooved the sample obtained in step ⑤ to obtain a high-recovery corrosion-resistant polishing pad 100.

[0085] Example 4 (compared to Example 3, the amount of anti-hydrolysis agent polycarbodiimide is increased)

[0086] The polishing pad 100 comprises, from top to bottom, a polishing layer 101, a waterproof buffer layer 102, and an adhesive backing layer 103. The polishing layer 101 is composed of thermoplastic polyurethane and non-woven fabric. The waterproof buffer layer 102 is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The adhesive backing layer 103 is selected from at least one of acrylic-based adhesives or rubber-based adhesives. The polishing layer 101 has a hardness of 70A and a thickness of 5mm. The waterproof buffer layer 102 also has a thickness of 5mm.

[0087] The preparation process is as follows: ① Prepare a polyurethane slurry by mixing 100 parts of thermoplastic polyurethane resin and 60 parts of N,N-dimethylformamide. The thermoplastic polyurethane resin has a molecular weight of 300,000. ② Impregnate the polyurethane slurry obtained in step ① into a nonwoven fabric, scrape off the excess solution on the surface of the nonwoven fabric, and obtain an impregnated sample. Place the impregnated sample in water for pre-coagulation for 60 minutes. ③ Place the pre-coagulated impregnated sample from step ② in a 120°C oven and dry for 100 minutes to obtain polishing layer 101. ④ Dissolve 150 parts of thermoplastic polyurethane, 30 parts of polyrotaxane, and 10 parts of polycarbodiimide in a solvent and adjust its viscosity to 8000 cP to obtain a buffer layer pre-casting liquid. ⑤ Cast the buffer layer pre-casting liquid obtained in step ④ onto polishing layer 101, and then gel at 60°C for 100 minutes. ⑥ Grind, adhesive-backed, cut, and grooved the sample obtained in step ⑤ to obtain a high-recovery corrosion-resistant polishing pad 100.

[0088] Comparative Example 1 (compared to Example 4, the buffer precast liquid did not use polyrotaxane)

[0089] The polishing pad consists of, from top to bottom, a polishing layer, a waterproof buffer layer, and an adhesive backing layer. The polishing layer is composed of thermoplastic polyurethane and non-woven fabric. The waterproof buffer layer is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The adhesive backing layer is selected from at least one of acrylic-based or rubber-based adhesives. The polishing layer has a hardness of 70A and a thickness of 5mm. The waterproof buffer layer also has a thickness of 5mm.

[0090] The preparation process is as follows: ① Prepare a polyurethane slurry by mixing 100 parts of thermoplastic polyurethane resin and 60 parts of N,N-dimethylformamide. The thermoplastic polyurethane resin has a molecular weight of 300,000. ② Impregnate the polyurethane slurry obtained in step ① into a nonwoven fabric, scrape off the excess solution from the surface of the nonwoven fabric, and obtain an impregnated sample. Place the impregnated sample in water for pre-coagulation for 60 minutes. ③ Place the pre-coagulated impregnated sample from step ② in a 120°C oven and dry for 100 minutes to obtain a polishing layer. ④ Dissolve 150 parts of thermoplastic polyurethane and 10 parts of polycarbodiimide in a solvent and adjust its viscosity to 8000 cP to obtain a buffer layer pre-casting liquid. ⑤ Cast the buffer layer pre-casting liquid obtained in step ④ onto the polishing layer, and then gel at 60°C for 100 minutes. ⑥ Grind, adhesive-backed, cut, and grooved the sample obtained in step ⑤ to obtain a polishing pad.

[0091] Comparative Example 2 (compared to Example 4, the buffer layer pre-cast liquid did not use an anti-hydrolysis agent)

[0092] The polishing pad consists of, from top to bottom, a polishing layer, a waterproof buffer layer, and an adhesive backing layer. The polishing layer is composed of thermoplastic polyurethane and non-woven fabric. The waterproof buffer layer is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The adhesive backing layer is selected from at least one of acrylic-based adhesives or rubber-based adhesives. Furthermore, the polishing layer has a hardness of 70A and a thickness of 5mm. Furthermore, the waterproof buffer layer has a thickness of 5mm.

[0093] The preparation process is as follows: ① Prepare a polyurethane slurry by mixing 100 parts of thermoplastic polyurethane resin and 60 parts of N,N-dimethylformamide. The thermoplastic polyurethane resin has a molecular weight of 300,000. ② Impregnate the polyurethane slurry obtained in step ① into a nonwoven fabric, scrape off the excess solution from the surface of the nonwoven fabric, and place it in water for pre-coagulation for 60 minutes. ③ Place the pre-coagulated impregnated sample from step ② in a 120℃ oven and dry for 100 minutes to obtain a polishing layer. ④ Dissolve 150 parts of thermoplastic polyurethane and 30 parts of polyrotaxane in a solvent and adjust its viscosity to 8000 cP to obtain a buffer layer pre-casting liquid. ⑤ Cast the buffer layer pre-casting liquid obtained in step ④ onto the polishing layer, and then gel at 60℃ for 100 minutes. ⑥ Grind, adhesive-backed, cut, and grooved the sample obtained in step ⑤ to obtain a polishing pad.

[0094] Comparative Example 3 (compared to Example 4, the polished layer and the waterproof buffer layer are bonded together with an adhesive)

[0095] The polishing pad consists of, from top to bottom, a polishing layer, an adhesive layer, a waterproof buffer layer, and a backing adhesive layer. The polishing layer is composed of thermoplastic polyurethane and non-woven fabric. The waterproof buffer layer is composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The backing adhesive layer is selected from at least one of acrylic-based or rubber-based adhesives. The polishing layer has a hardness of 70A and a thickness of 5mm. The waterproof buffer layer also has a thickness of 5mm.

[0096] The preparation process is as follows: ① Prepare a polyurethane slurry by mixing 100 parts of thermoplastic polyurethane resin and 60 parts of N,N-dimethylformamide. The thermoplastic polyurethane resin has a molecular weight of 300,000. ② Impregnate the polyurethane slurry obtained in step ① into a non-woven fabric, scrape off the excess solution from the surface of the non-woven fabric, and obtain an impregnated sample. Place the impregnated sample in water for pre-coagulation for 60 minutes. ③ Place the pre-coagulated impregnated sample from step ② in a 120°C oven and dry for 100 minutes to obtain a polishing layer. ④ Dissolve 150 parts of thermoplastic polyurethane, 30 parts of polyrotaxane, and 10 parts of polycarbodiimide in a solvent and adjust its viscosity to 8000 cP to obtain a buffer layer pre-casting liquid. ⑤ Apply the buffer layer pre-casting liquid obtained in step ④ onto a glass plate and gel at 60°C for 100 minutes to obtain a waterproof buffer layer. ⑥ Use an acrylic adhesive to bond the polishing layer to the waterproof buffer layer obtained in step ⑤, and then perform grinding, backing adhesive, cutting, and groove engraving to obtain a polishing pad.

[0097] Test methods and results for the above embodiments and comparative examples:

[0098] (1) Polishing pad peel performance test: GB / T 2792 180° peel test was adopted. The polishing pads of the above embodiments and comparative examples were immersed in polishing liquid for 40h. The change in peel strength between the waterproof buffer layer and the adhesive layer before and after immersion was tested. The sample width was 25mm, the peel length was 25mm, and the peel speed was 300mm / min.

[0099]

[0100] According to the table above, in conjunction with Example 4 and Comparative Example 3, Comparative Example 3 uses an adhesive to bond the polishing layer and the waterproof buffer layer, resulting in a four-layer structure for the polishing pad. The peel strength between the waterproof buffer layer and the adhesive backing layer is significantly reduced. Therefore, this application improves the connection performance between the waterproof buffer layer and the polishing layer by casting the waterproof buffer layer onto the polishing layer, increasing the peel strength. Furthermore, the waterproof buffer layer has good waterproof performance, reducing the corrosion of the adhesive backing layer by the polishing liquid.

[0101] Combining Examples 3 and 4, it can be found that the peel strength between the waterproof buffer layer and the adhesive layer of the polishing pad in Example 4 is higher than that in Example 3 before and after immersion in the polishing liquid. Therefore, adding an anti-hydrolysis agent is beneficial to improving the waterproof performance of the waterproof buffer layer and reducing the corrosion of the adhesive layer by the polishing liquid.

[0102] (2) Polishing pad shear strength test: The polishing pads of the above embodiments and comparative examples were immersed in polishing liquid for 40 hours, and the shear strength change between the waterproof buffer layer and the adhesive backing layer before and after immersion was tested. The width of the bonding area of ​​the sample was 25 mm, the length was 30 mm, and the tensile rate was 50 mm / min.

[0103]

[0104] According to the table above, and in conjunction with Examples 1-4 and Comparative Examples 1-3, the lack of polyrotaxane in the waterproof buffer layer of Comparative Example 1 resulted in reduced buffering capacity; the absence of an anti-hydrolysis agent in Comparative Example 2 led to decreased corrosion resistance; and Comparative Example 3, by using an adhesive to bond the polishing layer and the waterproof buffer layer, resulted in a four-layer structure consisting of a polishing layer, adhesive, waterproof buffer layer, and backing layer. Any of these factors would reduce the shear strength between the waterproof buffer layer and the backing layer. Therefore, this application uses a waterproof buffer layer composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent, cast into the polishing layer. This improves the waterproof performance of the waterproof buffer layer and reduces the corrosion of the backing layer by the polishing liquid. Furthermore, as can be seen from Examples 1 and 2, increasing the amount of polyrotaxane helps the waterproof buffer layer maintain its elastic properties, sustain a stable and continuous buffering effect, and reduce the shear stress on the backing layer.

[0105] (3) Polishing pad hardness test: The hardness of the polishing pads in the above embodiments and comparative examples was tested in accordance with the standard GB / T 2411-2008 Plastics and hard rubber by using a hardness tester to determine the indentation hardness (Shore A hardness).

[0106]

[0107] According to the table above, combined with Examples 1 and 2, it can be seen that increasing the amount of polyrotaxane will increase the hardness of the polishing pad. Combined with Examples 2 and 3, it can be seen that reducing the viscosity of the buffer layer pre-cast liquid will increase the hardness of the polishing pad. Combined with Examples 3 and 4, it can be seen that increasing the amount of the anti-hydrolysis agent polycarbodiimide will decrease the hardness of the polishing pad.

[0108] Combining Example 4 and Comparative Examples 1-3, since the waterproof buffer layer of Comparative Example 1 did not use polyrotaxane, Comparative Example 2 did not use an anti-hydrolysis agent, and the polishing pad of Comparative Example 3 contains a four-layer structure including a polishing layer, an adhesive, a waterproof buffer layer, and a backing layer, any of the above factors will lead to an increase in the hardness of the polishing pad. Excessive hardness of the polishing pad is not conducive to polishing the wafer.

[0109] (4) Polishing pad compression rate test: According to the test standard JIS L1021, a SCHOPPER type thickness measuring instrument was used, with a pressure surface of 1cm, and the initial load was 100g / cm. 2 The thickness t0 after applying pressure for 30 seconds was then measured at the final pressure of 1120 g / cm³. 2 After applying pressure for 5 minutes, the thickness t1, excluding the total load, has a compression rate (%) of 100 × (t0 - t1) / t1.

[0110]

[0111] According to the table above, and in conjunction with Example 4 and Comparative Examples 1-3, since the waterproof buffer layer of Comparative Example 1 did not use polyrotaxane, Comparative Example 2 did not use an anti-hydrolysis agent, and the polishing pad of Comparative Example 3 includes a four-layer structure consisting of a polishing layer, an adhesive, a waterproof buffer layer, and a backing layer, any of these factors would lead to a decrease in the compressibility of the polishing pad and a weakening of its buffering performance. Therefore, this application sets a waterproof buffer layer composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent onto the polishing layer by casting, which is beneficial to improving the compressibility and buffering performance of the waterproof buffer layer.

[0112] (5) Polishing pad life test: Polishing experiments were conducted using a CMP testing machine of model TAP-402S, using ANJIAEPU3061A polishing fluid, and a polishing pad diameter of 550mm. The polishing parameters were as follows: polishing pressure 1.5psi, polishing speed 50-60rpm, polishing fluid flow rate 300mL / min, and polishing time 60s.

[0113]

[0114] According to the table above, and in conjunction with Examples 1-4 and Comparative Examples 1-3, since the waterproof buffer layer of Comparative Example 1 did not use polyrotaxane, the waterproof buffer layer of Comparative Example 2 did not use an anti-hydrolysis agent, and the polishing pad of Comparative Example 3 contained a four-layer structure including a polishing layer, an adhesive, a waterproof buffer layer, and a backing layer, any of these factors would lead to a shortened service life of the polishing pad. Therefore, this application sets a waterproof buffer layer composed of thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent on the polishing layer. The polyrotaxane enables the waterproof buffer layer to maintain a stable buffering effect and reduce the shear stress on the adhesive layer. The anti-hydrolysis agent can improve its chemical corrosion resistance. The waterproof buffer layer prevents the polishing liquid absorbed by the polishing layer from transferring to the backing layer, which helps to reduce the corrosion of the backing layer by the polishing liquid and prevent the backing layer from being corroded and failing, thereby extending the service life of the polishing pad.

[0115] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0116] It should be noted that the embodiments referred to in the specification, such as "one embodiment," "embodiment," "exemplary embodiment," and "some embodiments," may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0117] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0118] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0119] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0120] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A polishing pad, characterized by, include: Polished layer; A waterproof buffer layer is disposed on one side of the polished layer along the thickness direction. The waterproof buffer layer is composed of at least thermoplastic polyurethane, polyrotaxane, and an anti-hydrolysis agent. The thickness of the waterproof buffer layer is 2.5mm-7mm, and the mass ratio of the thermoplastic polyurethane, the polyrotaxane, and the anti-hydrolysis agent is (100-150):(10-30):(5-10). An adhesive backing layer is provided on the side of the waterproof buffer layer opposite to the polishing layer.

2. The polishing pad of claim 1, wherein, The anti-hydrolysis agent includes at least one of polycarbodiimide, epoxy compound, and oxazoline; And / or, the waterproof buffer layer further includes thermosetting polyurethane.

3. The polishing pad of claim 1, wherein, The adhesive backing layer includes at least one of acrylic adhesive and rubber adhesive; And / or, the polishing layer is composed of thermoplastic polyurethane and nonwoven fabric.

4. The polishing pad of claim 1, wherein, The hardness of the polishing layer is 60A-85A; and / or the thickness of the polishing layer is 0.5mm-5mm.

5. A method for producing a polishing pad for producing the polishing pad according to any one of claims 1 to 4, characterized by, Includes the following steps: Prepare a polishing layer; A buffer layer pre-casting liquid comprising thermoplastic polyurethane, anti-hydrolysis agent, polyrotaxane and solvent is poured onto one side of the polished layer along the thickness direction to obtain a waterproof buffer layer. The waterproof buffer layer is treated with adhesive to obtain an adhesive backing layer, and the polishing pad is then prepared.

6. The method of claim 5, wherein the polishing pad is prepared by a method comprising: The pre-cast liquid for the buffer layer comprises, by weight: 100-150 parts thermoplastic polyurethane, 10-30 parts polyrotaxane, and 5-10 parts anti-hydrolysis agent.

7. The method of claim 5, wherein the polishing pad is prepared by a method comprising: The solvent is selected from at least one of N,N-dimethylformamide, N,N-dimethylacetamide, or N-methylpyrrolidone.

8. The method of claim 5, wherein the polishing pad is prepared by a method comprising: After pouring the buffer layer pre-casting liquid onto the polishing layer, the process further includes: The waterproof buffer layer is formed by gelling at a first preset temperature for a first preset time.

9. The method for preparing the polishing pad according to claim 8, characterized in that, The first preset temperature is 60℃-80℃; and / or the first preset duration is 60min-100min.

10. The method for preparing the polishing pad according to claim 5, characterized in that, The preparation of the polishing layer includes: A polyurethane slurry comprising thermoplastic polyurethane resin and solvent is impregnated into a nonwoven fabric to obtain an impregnated sample. The impregnated sample is placed in water for a second preset coagulation time; The pre-condensed impregnated sample is placed in a drying device and dried at a second preset temperature for a third preset time to obtain the polished layer.

11. The method for preparing the polishing pad according to claim 10, characterized in that, The impregnated sample comprises, by weight, 80-100 parts thermoplastic polyurethane and 30-60 parts solvent; and / or, The second preset duration is 20-60 minutes; and / or, The second preset temperature is 80℃-120℃; and / or, The third preset duration is 70-100 minutes.

12. A chemical mechanical polishing apparatus, characterized in that, The polishing pad included in any one of claims 1-4.

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