Wafer defect detection stage and method of using the same

Abstract

This application relates to the field of wafer inspection technology and discloses a wafer defect inspection stage and its usage method, including a stage, two lifting components, and two connecting components; the two lifting components are located on both sides of the stage, and each lifting component is provided with a lifting end; in one connecting component, its first end is hinged to the lifting end of one lifting component, and its second end is hinged to one end of the stage along a first direction; in the other connecting component, its first end is hinged to the lifting end of the other lifting component, and its second end is hinged to the other end of the stage along the first direction; wherein, at least one of the connecting components is elastically expandable and contractable along a second direction; at least one of the connecting components has its first end and second end circumferentially limited around the second direction, the second direction being the direction from the first end of the connecting component to its second end; this can improve the imaging clarity of the imaging equipment for the warped parts of the wafer, so as to obtain wafer defect information.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, specifically to a wafer defect inspection stage and its usage method. Background Technology

[0002] Silicon wafers are thin, flat, circular silicon matrix materials made by purifying silicon and processing it through a series of processes. They have wide applications in many fields, such as integrated circuits, solar panels, sensors, microelectromechanical systems, optoelectronics, and optical communications. Wafers are usually required to have precise mechanical properties and excellent surface quality.

[0003] In related technologies, in order to improve the surface quality and polishing speed of silicon wafer chemical mechanical polishing, defect detection and imaging analysis are usually performed on the polished wafer. Wafer surface defect imaging equipment can read the coordinates of defects generated by the wafer front-end process, quickly scan the defects corresponding to the coordinates, and perform SEM imaging (SEM, Scanning Electron Microscope).

[0004] However, due to the inherent characteristics of processes such as chamfering, grinding, polishing and cleaning in wafer manufacturing, the wafer edge has a certain degree of warping. The presence of warping causes inconsistent depth of field when wafer surface defect imaging equipment images defects on the wafer edge, which can easily lead to focusing failure and make it impossible to obtain specific information about the wafer edge defects. Summary of the Invention

[0005] This application provides a wafer defect detection stage and its usage method, which can improve the imaging clarity of imaging equipment for warped areas of a wafer, so as to obtain wafer defect information.

[0006] On the one hand, this application provides a wafer defect detection stage, including a stage, two lifting components and a connecting component; the specific solution is as follows.

[0007] The two lifting components are respectively located on both sides of the platform along the first direction, and each lifting component is provided with a lifting end;

[0008] The connecting components are provided in two parts. In one connecting component, its first end is hinged to the lifting end of one lifting component, and its second end is hinged to one end of the platform along the first direction. In the other connecting component, its first end is hinged to the lifting end of another lifting component, and its second end is hinged to the other end of the platform along the first direction.

[0009] At least one of the two connecting components is capable of elastic extension and retraction along the second direction; at least one of the two connecting components has its first end and second end circumferentially limited around the second direction, wherein the second direction is the direction from the first end of the connecting component to its second end.

[0010] Beneficial effects: Because a lifting assembly is installed on each side of the stage along the first direction, and each lifting assembly is connected to the stage via a connecting assembly that can elastically extend and retract, during the process of adjusting the stage angle by raising one lifting end and lowering the other (or keeping one lifting end stationary while the other rises or falls), the elastic extension and retraction of the connecting assembly absorbs the displacement difference caused by the increased distance between the two lifting ends; it also keeps the lifting ends of the two lifting assemblies, the first end and the second end of the connecting assembly on a straight line at all times, ensuring the accuracy of the stage tilt angle adjustment; simultaneously, because the first and second ends of the connecting assembly can circumferentially limit movement around the second direction, it prevents the stage from rotating around the second direction, keeping the stage stable. This allows for tilt adjustment of the stage, enabling the imaging device to perform orthographic projection detection on the edge of the wafer, improving the imaging clarity of the warped areas of the wafer, and facilitating the acquisition of wafer defect information.

[0011] In one alternative embodiment, the connecting assembly includes at least two rigid members and an elastic telescopic member, wherein a plurality of the rigid members are connected in series and hinged, and the two ends of the elastic telescopic member are respectively connected to two of the rigid members, so that the first end and the second end of the connecting assembly tend to move closer together.

[0012] In one alternative embodiment, a first rotation drive assembly is further included. The stage includes a stage body and a turntable, the turntable being located on and connected to the stage body. The turntable is used to carry a wafer and is rotatably connected to the rotating end of the first rotation drive assembly to rotate relative to the stage body.

[0013] In one optional embodiment, the stage body is provided with a through hole, and the turntable is provided with a rotating shaft on the surface near the stage body. The rotating shaft passes through the through hole and is rotatably connected to the rotating end of the first rotary drive assembly. The rotating end of the first rotary drive assembly can be rotatably connected to or separated from the rotating shaft.

[0014] In one optional embodiment, the first rotary drive assembly includes a rotary assembly body and an adapter, the adapter being capable of telescoping along its axial direction, one end of the adapter being fixedly connected to the rotating end of the rotary assembly body, and the other end of the adapter being rotatably connected to or separated from the rotating shaft through telescoping.

[0015] In one optional embodiment, the turntable is provided with a first cavity and a second cavity. The portion of the turntable used to contact the wafer is provided with a plurality of first adsorption holes, all of which are connected to the first cavity. The portion of the turntable used to contact the stage body is provided with a plurality of second adsorption holes, all of which are connected to the second cavity. Both the first cavity and the second cavity are used to connect to a vacuum pumping device.

[0016] In one optional embodiment, the lifting assembly includes a guide rail column, a lead screw, and a slider. The guide rail column has an accommodating cavity along its axial direction, and a limiting groove is provided on its outer wall surface. The limiting groove extends along the axial direction of the guide rail column and communicates with the accommodating cavity. The lead screw is rotatably disposed within the accommodating cavity, and the axis of the lead screw is parallel to or coincides with the axial direction of the guide rail column. One end of the slider is located within the accommodating cavity and screwed to the lead screw. The other end of the slider passes through the limiting groove and is located outside the guide rail column, hinged to the connecting assembly. The slider serves as the lifting end.

[0017] In one optional embodiment, the system further includes a fixed frame, two transmission wheels, an annular transmission component, and a second rotary drive assembly. The two guide rails are connected to the fixed frame, and the ends of the two lead screws near the fixed frame are coaxially connected to one of the transmission wheels. The second rotary drive assembly is driven by either of the transmission wheels, and the two transmission wheels are driven by the annular transmission component.

[0018] In one alternative embodiment, the device further includes a measuring instrument and a controller. The measuring instrument is used to measure the warpage of the wafer, and the controller is connected to the measuring instrument and the second rotation drive assembly. The controller is capable of sending an action signal to the second rotation drive assembly based on the measurement result of the measuring instrument.

[0019] On the other hand, this application also provides a method of using the wafer defect detection stage in any of the above embodiments, including:

[0020] Place the wafer on the stage;

[0021] Measure the warpage of the wafer edge;

[0022] Based on the warpage, the lifting end of at least one lifting component is controlled to rise or fall to adjust the angle of the stage, so that the imaging device can achieve consistent depth of field when imaging the wafer edge.

[0023] Beneficial effects: Since this method uses a wafer defect detection stage, it has the same effect as a wafer defect detection stage, so it will not be elaborated here. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this application, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a wafer defect detection stage according to an embodiment of this application;

[0026] Figure 2 for Figure 1 A magnified view of point A shown below;

[0027] Figure 3 This is a schematic diagram of the structure of a lifting assembly for removing sliders in a wafer defect detection stage according to an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] X, first direction; Y, second direction;

[0030] 1. Platform; 2. Lifting assembly; 3. Connecting assembly; 4. First rotary drive assembly; 5. Fixing frame; 6. Transmission wheel; 7. Circular transmission component; 8. Second rotary drive assembly;

[0031] 101. Platform body; 102. Turntable; 103. Rotation axis;

[0032] 201. Lifting end; 202. Guide rail column; 203. Lead screw; 204. Slider;

[0033] 2021, accommodating cavity;

[0034] 301. Rigid components; 302. Elastic expansion components;

[0035] 401. Rotating component body; 402. Adapter. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In related technologies, in order to improve the surface quality and polishing speed of single-crystal silicon chemical mechanical polishing, defect detection and imaging analysis are usually performed on the polished wafer. Wafer surface defect imaging equipment can read the coordinates of defects generated by the wafer front-end process, quickly scan the defects corresponding to the coordinates, and perform SEM imaging (SEM, Scanning Electron Microscope).

[0038] However, due to the inherent characteristics of processes such as chamfering, grinding, polishing and cleaning in wafer manufacturing, the wafer edge has a certain degree of warping. The presence of warping causes inconsistent depth of field when wafer surface defect imaging equipment images defects on the wafer edge, which can easily lead to focusing failure and make it impossible to obtain specific information about the wafer edge defects.

[0039] Therefore, this application provides a wafer defect detection stage and its usage method, which can improve the imaging clarity of the imaging equipment for the warped parts of the wafer, so as to obtain the defect information of the wafer.

[0040] The following is combined Figures 1 to 3 This describes an embodiment of the present application.

[0041] According to embodiments of this application, in one aspect, a wafer defect detection stage is provided, such as... Figure 1 As shown, it includes a platform 1, a lifting assembly 2, and a connecting assembly 3; the specific scheme is as follows.

[0042] The stage 1 is used to support the wafer for inspection. Specifically, the shape of the stage 1 can be any shape such as circle, square, or rectangle, but it is preferably circle. The stage 1 can be provided with a limiting surface, such as a circular groove, to limit the position of the wafer and prevent it from falling.

[0043] like Figure 1 As shown, there are two lifting components 2, located on both sides of the platform 1 along the first direction X. Each lifting component 2 is equipped with a lifting end 201. Specifically, the lifting end 201 on the lifting component 2 has the function of moving up and down. There are various ways to achieve this, such as connecting ropes to the lifting end 201 and moving the lifting end 201 up and down through the lifting ropes, or other methods, as long as the up and down movement of the lifting end 201 can be achieved.

[0044] like Figure 1 As shown, there are two connecting components 3. In one connecting component 3, the first end is hinged to the lifting end 201 of a lifting component 2, and the second end is hinged to one end of the platform 1 along the first direction X. In the other connecting component 3, the first end is hinged to the lifting end 201 of another lifting component 2, and the second end is hinged to the other end of the platform 1 along the first direction X. That is, the two connecting components 3 are respectively used to connect the lifting ends 201 of the two lifting components 2 to the two ends of the platform 1 along the first direction X.

[0045] Among them, at least one of the two connecting components 3 is capable of elastic expansion and contraction along the second direction Y; at least one of the two connecting components 3 has its first end and second end circumferentially limited around the second direction Y, wherein the second direction Y is the direction from the first end of the connecting component 3 to its second end.

[0046] It should be noted that the above-mentioned "at least one of the two connecting components 3 is capable of elastic extension and retraction along the second direction Y" means that the connecting component 3 is capable of extension and retraction along the second direction Y and can be reset under elastic force.

[0047] The phrase "its first end and second end can be circumferentially limited around the second direction Y" means that the first end and the second end of the connecting component 3 cannot rotate relative to each other around the second direction Y, so as to maintain the stability of the stage 1 and prevent it from rotating around the second direction Y.

[0048] It should also be noted that, such as Figure 2 As shown, the "second direction Y" is the direction from the first end to the second end in the connecting component 3; that is, each connecting component 3 has a second direction Y; generally, the second direction Y of the two components is the same, because the first end and the second end of the two connecting components 3 are on a straight line.

[0049] The specific solutions for the two connecting components 3 are as follows: Solution 1: One connecting component 3 is a connecting rod (which cannot be extended or retracted), and the other connecting component 3 is a spring extension component; Solution 2: One connecting component 3 can be extended or retracted, and its first end and second end can be circumferentially limited around the second direction Y, while the other connecting component 3 is not limited; Solution 3: Both connecting components 3 can be extended or retracted, and their first end and second end can be circumferentially limited around the second direction Y; Solution 3 is the preferred solution.

[0050] In specific usage, such as Figure 1As shown, in the initial stage of use, the lifting ends 201 of the two lifting components 2 are kept at the same horizontal height, so that the stage 1 is kept horizontal. Then, the wafer is placed on the stage 1 and the imaging equipment is used for inspection. During the inspection process, it is found that the edge of the wafer has a warpage. Therefore, by controlling the two lifting ends 201 to lift and lower in a coordinated manner, the stage 1 is tilted at a certain angle to counteract the warpage of the wafer edge, so that the imaging equipment can perform orthographic projection inspection of the edge of the wafer.

[0051] In this embodiment, such as Figure 1 As shown, since a lifting assembly 2 is respectively provided on both sides of the platform 1 along the first direction X, and the two lifting assemblies 2 are respectively connected to the platform 1 through a connecting assembly 3, and the connecting assembly 3 can elastically extend and retract, during the process of adjusting the angle of the platform 1 by one lifting end 201 rising and the other lowering (or one lifting end 201 remaining stationary while the other rises or falls), the elastic extension and retraction of the connecting assembly 3 can absorb the displacement difference caused by the increase in the distance between the two lifting ends 201; and make the two lifting ends 201... The lifting end 201 on component 2, the first end and the second end of connecting component 3 are always kept in a straight line to ensure the accuracy of the tilt angle adjustment of stage 1; at the same time, since the first end and the second end of connecting component 3 can be circumferentially limited around the second direction Y, the stage 1 can be prevented from rotating around the second direction Y, so that the stage 1 remains stable, thereby realizing the tilt adjustment of stage 1, enabling the imaging device to perform orthographic projection detection on the edge of the wafer, improving the imaging clarity of the wafer with warp, so as to obtain wafer defect information.

[0052] In one embodiment, such as Figure 2 As shown, the connecting component 3 includes at least two rigid members 301 and an elastic telescopic member 302. The multiple rigid members 301 are connected in series and hinged. The two ends of the elastic telescopic member 302 are respectively connected to the two rigid members 301, so that the first end and the second end of the connecting component 3 tend to move closer together.

[0053] It should be explained that the rigid components 301 are two parts whose shape is difficult to change, such as connecting rods, chain links, etc. After multiple rigid components 301 are hinged through the pivot 103, they can only be folded and will not allow the first and second ends of the connecting assembly 3 to rotate relative to each other around the second direction Y.

[0054] Specifically, the number of rigid components 301 can be 2 to 4, preferably 2, such as... Figure 1 As shown.

[0055] The elastic telescopic component 302 can be a spring or elastic rubber with a certain amount of telescopic movement. Both ends of the elastic telescopic component 302 can be connected to any two of the multiple rigid components 301, so that the first end and the second end of the connecting component 3 tend to be relatively close.

[0056] In this embodiment, such as Figure 2 As shown, the connecting component 3 includes at least two rigid members 301 and an elastic telescopic member 302. The two ends of the elastic telescopic member 302 are respectively connected to the two rigid members 301, so that the first end and the second end of the connecting component 3 tend to approach each other. This enables the elastic telescopic function of the connecting component 3 and also enables the first end of the connecting component 3 to be circumferentially limited relative to the second end around the second direction Y. The structure is simple and easy to manufacture.

[0057] In some embodiments not shown in the figures, the connecting component 3 includes a first tube, a second tube, and an elastic element. The first tube and the second tube are slidably connected, and the first tube and the second tube are connected by the elastic element for resetting. The cross-sections of the first tube and the second tube are adaptable polygons, such as triangles, squares, regular pentagons, etc.

[0058] More specifically, the elastic element can be disposed outside the first tube and the second tube, and connected to the outer side wall of the first tube and the outer side wall of the second tube; the elastic element can also be fixedly disposed inside the first tube, with the second tube slidably sleeved inside the second tube, and the elastic element can extend and retract inside the first tube, with the elastic element connected to one end of the second tube located inside the first tube.

[0059] In one embodiment, such as Figure 2 As shown, each connecting component 3 has two rigid members 301. Specifically, the rigid member 301 can be a metal rod or a plastic rod with high resistance to deformation. The first ends of the two rigid members 301 are hinged through the pivot 103. The part of one rigid member 301 away from its first end is connected to one end of the elastic telescopic member 302, and the part of the other rigid member 301 away from its first end is connected to the other end of the elastic telescopic member 302.

[0060] In this embodiment, the connecting component 3 has only two rigid parts 301, which makes the structure simpler and the cost lower, thus reducing the production cost of the wafer defect detection stage.

[0061] In one embodiment, such as Figure 1As shown, the wafer defect detection stage also includes a first rotary drive assembly 4. Specifically, the first rotary drive assembly 4 is a motor, or more specifically, a stepper motor, etc. The stage 1 includes a stage body 101 and a turntable 102. The turntable 102 is located on the stage body 101 and connected to the stage body 101. The turntable 102 is used to carry the wafer. The turntable 102 can be rotatably connected to the rotating end of the first rotary drive assembly 4 so as to rotate relative to the stage body 101.

[0062] Specifically, the turntable 102 is rotatably and slidably connected to the platform body 101 to achieve the rotation of the turntable 102; alternatively, the turntable 102 can be raised or lowered to separate it from the platform body 101, thereby achieving the rotation of the turntable 102.

[0063] In practical use, when the imaging device images a portion of the wafer's edge and then needs to image other parts of the wafer, the first rotation drive component 4 can be controlled to rotate at a certain angle, causing the turntable 102 to rotate at equal angular intervals. For example, the first rotation can be at a fixed angle, and the next rotation can be at a fixed angle. Each rotation angle can be 60° to 180°, specifically any one of 60°, 90°, 120°, 150°, and 180°.

[0064] In this embodiment, such as Figure 1 As shown, by setting the stage 1 as a stage body 101 and a turntable 102, and rotating the turntable 102 to the first rotation drive component 4, the turntable 102 is rotated, thereby enabling the wafer on the turntable 102 to rotate under the drive of the first rotation component, thereby adjusting the wafer to a certain angle, which facilitates the imaging device to image different edge parts of the wafer.

[0065] In one specific embodiment, the stage body 101 is provided with a through hole, and the turntable 102 is provided with a rotating shaft 103 on the surface near the stage body 101. The rotating shaft 103 passes through the through hole and is rotatably connected to the rotating end of the first rotating drive component 4. The rotating end of the first rotating drive component 4 can be rotatably connected to or separated from the rotating shaft 103.

[0066] Specifically, the rotating end of the first rotary drive assembly 4 can be rotatably connected to or separated from the rotating shaft 103, which can be achieved by a connector with telescopic function, or by lifting the first rotary drive assembly 4 as a whole.

[0067] In this embodiment, the rotating end of the first rotary drive assembly 4 can be rotatably connected to or separated from the rotating shaft 103, so that when the turntable 102 needs to be rotated, the rotating end of the first rotary drive assembly 4 can be rotatably connected to the rotating shaft 103; when the stage 1 needs to be adjusted, the rotating end of the first rotary drive assembly 4 can be separated from the rotating shaft 103, so as to avoid the first rotary drive assembly 4 affecting the angle adjustment of the stage 1.

[0068] In a more specific embodiment, such as Figure 1 As shown, the first rotary drive assembly 4 includes a rotary assembly body 401 and an adapter 402. The adapter 402 is capable of telescoping along its axial direction. One end of the adapter 402 is fixedly connected to the rotating end of the rotary assembly body 401, and the other end of the adapter 402 is rotatably connected to or separated from the rotating shaft 103 through telescoping.

[0069] Specifically, the adapter 402 can be a lifting bearing or a rod that extends or retracts via hydraulic or pneumatic pressure.

[0070] In this embodiment, the rotating assembly body 401 and the rotating shaft 103 are connected or separated by a telescopic adapter 402, which is simple in structure and easy to manufacture.

[0071] In one embodiment, the turntable 102 is provided with a first cavity and a second cavity. The portion of the turntable 102 that is in contact with the wafer is provided with a plurality of first adsorption holes, all of which are connected to the first cavity. The portion of the turntable 102 that is in contact with the stage body 101 is provided with a plurality of second adsorption holes, all of which are connected to the second cavity. Both the first cavity and the second cavity are used to communicate with a vacuum pumping device.

[0072] Specifically, the number, diameter, and arrangement of the first and second adsorption pores can be selected and set according to actual needs.

[0073] It should be noted that the first adsorption hole can directly adsorb the wafer, or an adsorption disk can be embedded in the adsorption hole to adsorb the wafer. This method has a better adsorption effect. Similarly, the second adsorption hole can directly adsorb the stage body 101, or an adsorption disk can be embedded in the adsorption hole to adsorb and connect with the stage body 101. This method has a better adsorption effect.

[0074] In this embodiment, by providing a first cavity and a second cavity in the turntable 102, and having a first adsorption hole for adsorbing the wafer connected to the first cavity, and a second adsorption hole for adsorbing and connecting with the stage body 101 connected to the second cavity, the vacuum equipment provides different vacuum levels to the first cavity and the second cavity, i.e. different adsorption forces, which can adjust the adsorption force on different wafers, prevent wafer deformation, and maintain the adsorption connection strength between the turntable 102 and the stage body 101.

[0075] In one embodiment, such as Figure 1 and Figure 3 As shown, the lifting assembly 2 includes a guide rail column 202, a lead screw 203, and a slider 204; the specific scheme is as follows.

[0076] The guide post 202 has a receiving cavity 2021 arranged along its axial direction, meaning that the guide post 202 can be made directly from hollow steel pipe or hollow pipe of other materials; a limiting groove is provided on the outer wall surface of the guide post 202, the limiting groove extends along the axial direction of the guide post 202, and the limiting groove is connected to the receiving cavity 2021.

[0077] The two ends of the lead screw 203 are rotatably mounted in the accommodating cavity 2021 via bearings, and the axial direction of the lead screw 203 is parallel to or coincides with the axial direction of the guide column 202.

[0078] One end of the slider 204 is located inside the accommodating cavity 2021 and is threaded to the lead screw 203. The other end of the slider 204 passes through the limiting groove and is located outside the guide post 202, and is hinged to the connecting assembly 3 through the rotating shaft 103.

[0079] In this embodiment, such as Figure 1 and Figure 3 As shown, the lifting assembly 2 includes a guide rail column 202, a lead screw 203, and a slider 204. Since the slider 204 is screwed to the lead screw 203, by driving the lead screw 203 to rotate, the lead screw 203 can only move up and down along the axial direction of the guide rail column 202 under the restriction of the limiting groove. The structure is simple and easy to manufacture. At the same time, the driving method of the lead screw 203 to the slider 204 enables the slider 204 to move up and down precisely, which can improve the angle adjustment accuracy of the platform 1.

[0080] In one embodiment, such as Figure 1As shown, the wafer defect detection stage also includes a fixed frame 5, two transmission wheels 6, an annular transmission component 7, and a second rotary drive assembly 8. Specifically, the second rotary drive assembly 8 is a stepper motor; the annular transmission component 7 can be a belt, chain, or transmission belt, preferably a belt; the two guide rail posts 202 are fixedly connected to the fixed frame 5 by bolts; the ends of the two lead screws 203 near the fixed frame 5 are coaxially connected to a transmission wheel 6; the second rotary drive assembly 8 is driven by any one of the transmission wheels 6; and the two transmission wheels 6 are driven by the annular transmission component 7.

[0081] Specifically, the outer skin of the mounting bracket 5 can be sealed, such as sheet metal or plastic sheet, to prevent dust.

[0082] In this embodiment, by fixing the two lifting components 2 on the fixed frame 5, the lead screws 203 in the two lifting components 2 are connected by a ring transmission component 7 and driven by the second rotary drive component 8, so that the lead screws 203 in the two lifting components 2 can rotate in opposite directions, that is, the lifting end 201 of one lifting component 2 rises and the lifting end 201 of the other lifting component 2 falls synchronously, thereby quickly and accurately adjusting the angle of the platform 1.

[0083] In one embodiment, the wafer defect detection stage further includes a measuring instrument and a controller. The measuring instrument is used to measure the warpage of the wafer. Specifically, the measuring instrument can be a forming device, i.e., an imaging device with the function of measuring wafer warpage. The controller can be a microcontroller, computer, or other module with data processing capabilities. The controller is connected to the measuring instrument and the second rotation drive component 8. The controller can send an action signal to the second rotation drive component 8 based on the measurement results of the measuring instrument.

[0084] In practical use, the measuring instrument detects the warpage of the wafer and transmits it to the controller via electrical or wireless signals. The controller analyzes the signal and generates an action signal for the second rotation drive component 8 based on the operating parameters of the lifting component 2. The controller then sends the action signal to the second rotation drive component 8. The second rotation drive component 8 receives the action signal and executes it to adjust the angle of the wafer on the stage 1.

[0085] In this embodiment, by setting up a measuring instrument and a controller, the angle of the stage 1 can be automatically adjusted, thereby improving the automation and intelligence of the wafer defect detection stage.

[0086] The following embodiment illustrates the overall solution of this application.

[0087] In one embodiment, a wafer defect detection stage is provided, such as... Figure 1As shown, it includes a platform 1, a lifting assembly 2, a connecting assembly 3, a first rotary drive assembly 4, a fixed frame 5, a transmission wheel 6, a ring transmission component 7, and a second rotary drive assembly 8; the specific scheme is as follows.

[0088] The stage 1 is used to support the wafer for inspection. Specifically, the shape of the stage 1 can be any shape such as circle, square, or rectangle, but it is preferably circle. The stage 1 can be provided with a limiting surface, such as a circular groove, to limit the position of the wafer and prevent it from falling.

[0089] like Figure 1 As shown, there are two lifting components 2, located on both sides of the platform 1 along the first direction X. Each lifting component 2 is equipped with a lifting end 201. Specifically, the lifting end 201 on the lifting component 2 has the function of moving up and down. There are various ways to achieve this, such as connecting ropes to the lifting end 201 and moving the lifting end 201 up and down through the lifting ropes, or other methods, as long as the up and down movement of the lifting end 201 can be achieved.

[0090] like Figure 1 As shown, there are two connecting components 3. In one connecting component 3, the first end is hinged to the lifting end 201 of a lifting component 2, and the second end is hinged to one end of the platform 1 along the first direction X. In the other connecting component 3, the first end is hinged to the lifting end 201 of another lifting component 2, and the second end is hinged to the other end of the platform 1 along the first direction X. That is, the two connecting components 3 are respectively used to connect the lifting ends 201 of the two lifting components 2 to the two ends of the platform 1 along the first direction X.

[0091] Among them, at least one of the two connecting components 3 is capable of elastic expansion and contraction along the second direction Y; at least one of the two connecting components 3 has its first end and second end circumferentially limited around the second direction Y, wherein the second direction Y is the direction from the first end of the connecting component 3 to its second end.

[0092] It should be noted that the above-mentioned "at least one of the two connecting components 3 is capable of elastic extension and retraction along the second direction Y" means that the connecting component 3 is capable of extension and retraction along the second direction Y and can be reset under elastic force.

[0093] The phrase "its first end and second end can be circumferentially limited around the second direction Y" means that the first end and the second end of the connecting component 3 cannot rotate relative to each other around the second direction Y, so as to maintain the stability of the stage 1 and prevent it from rotating around the second direction Y.

[0094] It should also be noted that, such as Figure 2As shown, the "second direction Y" is the direction from the first end to the second end in the connecting component 3; that is, each connecting component 3 has a second direction Y; generally, the second direction Y of the two components is the same, because the first end and the second end of the two connecting components 3 are on a straight line.

[0095] The specific solutions for the two connecting components 3 are as follows: Solution 1: One connecting component 3 is a connecting rod (which cannot be extended or retracted), and the other connecting component 3 is a spring extension component; Solution 2: One connecting component 3 can be extended or retracted, and its first end and second end can be circumferentially limited around the second direction Y, while the other connecting component 3 is not limited; Solution 3: Both connecting components 3 can be extended or retracted, and their first end and second end can be circumferentially limited around the second direction Y; Solution 3 is the preferred solution.

[0096] More specifically, such as Figure 2 As shown, the connecting component 3 includes at least two rigid members 301 and an elastic telescopic member 302. The multiple rigid members 301 are connected in series and hinged. The two ends of the elastic telescopic member 302 are respectively connected to the two rigid members 301, so that the first end and the second end of the connecting component 3 tend to move closer together.

[0097] It should be explained that the rigid components 301 are two parts whose shape is difficult to change, such as connecting rods, chain links, etc. After multiple rigid components 301 are hinged through the pivot 103, they can only be folded and will not allow the first and second ends of the connecting assembly 3 to rotate relative to each other around the second direction Y.

[0098] Specifically, the number of rigid components 301 can be 2 to 4, preferably 2, such as... Figure 1 As shown.

[0099] The elastic telescopic component 302 can be a spring or elastic rubber with a certain amount of telescopic movement. Both ends of the elastic telescopic component 302 can be connected to any two of the multiple rigid components 301, so that the first end and the second end of the connecting component 3 tend to be relatively close.

[0100] More specifically, such as Figure 2 As shown, each connecting component 3 has two rigid members 301. Specifically, the rigid member 301 can be a metal rod or a plastic rod with high resistance to deformation. The first ends of the two rigid members 301 are hinged through the pivot 103. The part of one rigid member 301 away from its first end is connected to one end of the elastic telescopic member 302, and the part of the other rigid member 301 away from its first end is connected to the other end of the elastic telescopic member 302.

[0101] More specifically, such as Figure 1As shown, the wafer defect detection stage also includes a first rotary drive assembly 4. Specifically, the first rotary drive assembly 4 is a motor, or more specifically, a stepper motor, etc. The stage 1 includes a stage body 101 and a turntable 102. The turntable 102 is located on the stage body 101 and connected to the stage body 101. The turntable 102 is used to carry the wafer. The turntable 102 can be rotatably connected to the rotating end of the first rotary drive assembly 4 so as to rotate relative to the stage body 101.

[0102] Specifically, the turntable 102 is rotatably and slidably connected to the platform body 101 to achieve the rotation of the turntable 102; alternatively, the turntable 102 can be raised or lowered to separate it from the platform body 101, thereby achieving the rotation of the turntable 102.

[0103] In practical use, when the imaging device images a portion of the wafer's edge and then needs to image other parts of the wafer, the first rotation drive component 4 can be controlled to rotate at a certain angle, causing the turntable 102 to rotate at equal angular intervals. For example, the first rotation can be at a fixed angle, and the next rotation can be at a fixed angle. Each rotation angle can be 60° to 180°, specifically any one of 60°, 90°, 120°, 150°, and 180°.

[0104] More specifically, the stage body 101 is provided with a through hole, and the turntable 102 is provided with a rotating shaft 103 on the surface near the stage body 101. The rotating shaft 103 passes through the through hole and is rotatably connected to the rotating end of the first rotary drive assembly 4. The rotating end of the first rotary drive assembly 4 can be rotatably connected to or separated from the rotating shaft 103.

[0105] Specifically, the rotating end of the first rotary drive assembly 4 can be rotatably connected to or separated from the rotating shaft 103, which can be achieved by a connector with telescopic function, or by lifting the first rotary drive assembly 4 as a whole.

[0106] More specifically, such as Figure 1 As shown, the first rotary drive assembly 4 includes a rotary assembly body 401 and an adapter 402. The adapter 402 is capable of telescoping along its axial direction. One end of the adapter 402 is fixedly connected to the rotating end of the rotary assembly body 401, and the other end of the adapter 402 is rotatably connected to or separated from the rotating shaft 103 through telescoping.

[0107] Specifically, the adapter 402 can be a lifting bearing or a rod that extends or retracts via hydraulic or pneumatic pressure.

[0108] More specifically, the turntable 102 is provided with a first cavity and a second cavity. The part of the turntable 102 that is used to contact the wafer is provided with a plurality of first adsorption holes, all of which are connected to the first cavity. The part of the turntable 102 that is used to contact the stage body 101 is provided with a plurality of second adsorption holes, all of which are connected to the second cavity. Both the first cavity and the second cavity are used to connect to a vacuum pumping device.

[0109] Specifically, the number, diameter, and arrangement of the first and second adsorption pores can be selected and set according to actual needs.

[0110] It should be noted that the first adsorption hole can directly adsorb the wafer, or an adsorption disk can be embedded in the adsorption hole to adsorb the wafer. This method has a better adsorption effect. Similarly, the second adsorption hole can directly adsorb the stage body 101, or an adsorption disk can be embedded in the adsorption hole to adsorb and connect with the stage body 101. This method has a better adsorption effect.

[0111] More specifically, such as Figure 1 and Figure 3 As shown, the lifting assembly 2 includes a guide post 202, a lead screw 203, and a slider 204. The guide post 202 has an accommodating cavity 2021 arranged along its axial direction; that is, the guide post 202 can be made directly from a hollow steel pipe or other hollow tubes. A limiting groove is provided on the outer wall of the guide post 202, extending along its axial direction and communicating with the accommodating cavity 2021. Both ends of the lead screw 203 are rotatably mounted in the accommodating cavity 2021 via bearings, and the axis of the lead screw 203 is parallel to or coincides with the axial direction of the guide post 202. One end of the slider 204 is located inside the accommodating cavity 2021 and is threadedly connected to the lead screw 203. The other end of the slider 204 passes through the limiting groove and is located outside the guide post 202, hinged to the connecting assembly 3 via a rotating shaft 103.

[0112] More specifically, such as Figure 1 As shown, the wafer defect detection stage also includes a fixed frame 5, two transmission wheels 6, an annular transmission component 7, and a second rotary drive assembly 8. Specifically, the second rotary drive assembly 8 is a stepper motor; the annular transmission component 7 can be a belt, chain, or transmission belt, preferably a belt; the two guide rail posts 202 are fixedly connected to the fixed frame 5 by bolts; the ends of the two lead screws 203 near the fixed frame 5 are coaxially connected to a transmission wheel 6; the second rotary drive assembly 8 is driven by any one of the transmission wheels 6; and the two transmission wheels 6 are driven by the annular transmission component 7.

[0113] Specifically, the outer skin of the mounting bracket 5 can be sealed, such as sheet metal or plastic sheet, to prevent dust.

[0114] More specifically, the wafer defect detection stage also includes a measuring instrument and a controller. The measuring instrument is used to measure the warpage of the wafer. Specifically, the measuring instrument can be a forming device, i.e., an imaging device with the function of measuring wafer warpage. The controller can be a microcontroller, computer, or other module with data processing capabilities. The controller is connected to the measuring instrument and the second rotation drive component 8. The controller can send an action signal to the second rotation drive component 8 based on the measurement results of the measuring instrument.

[0115] In specific usage, such as Figure 1 As shown, in the initial stage of use, the lifting ends 201 of the two lifting components 2 are kept at the same horizontal height, so that the stage 1 is kept horizontal. Then, the wafer is placed on the stage 1 and detected using an imaging device.

[0116] The measuring instrument detects the warpage of the wafer and transmits it to the controller via electrical or wireless signals. The controller analyzes the signal and generates an action signal for the second rotation drive component 8 based on the operating parameters of the lifting component 2. The controller then sends the action signal to the second rotation drive component 8. The second rotation drive component 8 receives the action signal and executes it to adjust the angle of the wafer on the stage 1.

[0117] When the imaging device images a portion of the wafer's edge, and then needs to image other parts of the wafer, the controller can control the first rotation drive assembly 4 to rotate at a certain angle, causing the turntable 102 to rotate at equal angular intervals. For example, the first rotation can be at a fixed angle, and the next rotation can be at a fixed angle. Each rotation angle can be between 60° and 180°, specifically any one of 60°, 90°, 120°, 150°, and 180°.

[0118] According to embodiments of this application, in another aspect, a method for using the wafer defect detection stage in any of the above embodiments is provided, such as... Figure 1 As shown, it includes:

[0119] Place the wafer on stage 1.

[0120] The warpage of the wafer edge is measured using an imaging device; specifically, the imaging device can be a SEM imaging device.

[0121] Based on the warpage, the lifting end 201 in at least one lifting component 2 is controlled to rise or fall to adjust the angle of the stage 1, so that the imaging device can image the edge of the wafer with consistent depth of field.

[0122] Specifically, during use, the lifting end 201 of any one of the lifting components 2 can be controlled to move, or the lifting ends 201 of both lifting components 2 can be controlled to move up and down simultaneously to adjust the angle of the platform 1.

[0123] Beneficial effects: Since this method uses a wafer defect detection stage, it has the same effect as a wafer defect detection stage, so it will not be elaborated here.

[0124] Furthermore, the wafer defect detection stage also includes a first rotary drive component 4. Specifically, the first rotary drive component 4 is a motor, and more specifically, a stepper motor, etc. The stage 1 includes a stage body 101 and a turntable 102. The turntable 102 is located on the stage body 101 and connected to the stage body 101. The turntable 102 is used to carry the wafer.

[0125] The platform body 101 is provided with a through hole, and the turntable 102 is provided with a rotating shaft 103 on the surface near the platform body 101. The rotating shaft 103 passes through the through hole and is rotatably connected to the rotating end of the first rotating drive assembly 4.

[0126] The first rotary drive assembly 4 includes a rotary assembly body 401 and an adapter 402. The adapter 402 is capable of telescoping along its axial direction. One end of the adapter 402 is fixedly connected to the rotating end of the rotary assembly body 401, and the other end of the adapter 402 is rotatably connected to or separated from the rotating shaft 103 through telescoping.

[0127] In actual use, when the imaging device images a part of the edge of the wafer and then needs to image other parts of the wafer, the adapter 402 is extended to raise the turntable 102 and separate it from the stage body 101.

[0128] The first rotary drive component 4 is controlled to rotate at a certain angle so that the turntable 102 rotates at equal angular intervals. For example, the first rotation is a fixed angle, and the next rotation is also a fixed angle. The angle of each rotation can be 60° to 180°, specifically any one of 60°, 90°, 120°, 150° and 180°.

[0129] The control adapter 402 retracts, so that the turntable 102 fits into the platform body 101.

[0130] The warpage of the wafer edge is measured again using an imaging device; specifically, the imaging device can be a SEM imaging device.

[0131] Based on the warpage, the lifting end 201 in at least one lifting component 2 is controlled to rise or fall to adjust the angle of the stage 1, so that the imaging device can image the edge of the wafer with consistent depth of field.

[0132] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and all such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A wafer defect detection stage, characterized in that, include: Stage (1); Two lifting components (2) are located on both sides of the platform (1) along the first direction (X), and each lifting component (2) is provided with a lifting end (201), wherein the first direction (X) is parallel to the upper surface of the platform (1); There are two connecting components (3). In one connecting component (3), its first end is hinged to the lifting end (201) of one lifting component (2), and its second end is hinged to one end of the platform (1) along the first direction (X). In the other connecting component (3), its first end is hinged to the lifting end (201) of the other lifting component (2), and its second end is hinged to the other end of the platform (1) along the first direction (X). At least one of the two connecting components (3) is capable of elastic extension and retraction along the second direction (Y); at least one of the two connecting components (3) has its first end and second end circumferentially limited around the second direction (Y), wherein the second direction (Y) is the direction from the first end of the connecting component (3) toward its second end.

2. The wafer defect detection stage according to claim 1, characterized in that, The connecting assembly (3) includes at least two rigid members (301) and an elastic telescopic member (302). The multiple rigid members (301) are connected in series and hinged. The two ends of the elastic telescopic member (302) are respectively connected to the two rigid members (301) so that the first end and the second end of the connecting assembly (3) tend to move closer together.

3. The wafer defect detection stage according to claim 1 or 2, characterized in that, It also includes a first rotation drive assembly (4), the stage (1) includes a stage body (101) and a turntable (102), the turntable (102) is located on the stage body (101) and connected to the stage body (101), the turntable (102) is used to carry the wafer, and the turntable (102) can be rotatably connected to the rotating end of the first rotation drive assembly (4) to rotate relative to the stage body (101).

4. The wafer defect detection stage according to claim 3, characterized in that, The platform body (101) is provided with a through hole, and the turntable (102) is provided with a rotating shaft (103) on the surface near the platform body (101). The rotating shaft (103) passes through the through hole and is rotatably connected to the rotating end of the first rotary drive assembly (4). The rotating end of the first rotary drive assembly (4) can be rotatably connected to or separated from the rotating shaft (103).

5. The wafer defect detection stage according to claim 4, characterized in that, The first rotary drive assembly (4) includes a rotary assembly body (401) and an adapter (402). The adapter (402) is capable of telescoping along its axial direction. One end of the adapter (402) is fixedly connected to the rotating end of the rotary assembly body (401), and the other end of the adapter (402) is rotatably connected to or separated from the rotating shaft (103) through telescoping.

6. The wafer defect detection stage according to claim 3, characterized in that, The turntable (102) is provided with a first cavity and a second cavity. The part of the turntable (102) used to contact the wafer is provided with a plurality of first adsorption holes, and the plurality of first adsorption holes are all connected to the first cavity. The part of the turntable (102) used to contact the stage body (101) is provided with a plurality of second adsorption holes, and the plurality of second adsorption holes are all connected to the second cavity. The first cavity and the second cavity are both used to connect to a vacuum pumping device.

7. The wafer defect detection stage according to claim 1 or 2, characterized in that, The lifting assembly (2) includes: A guide post (202) has a receiving cavity (2021) arranged inside it along its axial direction. A limiting groove is provided on the outer wall surface of the guide post (202). The limiting groove extends along the axial direction of the guide post (202) and communicates with the receiving cavity (2021). A lead screw (203) is rotatably disposed within the accommodating cavity (2021), and the axial direction of the lead screw (203) is parallel to or coincides with the axial direction of the guide rail column (202). The slider (204) has one end located inside the accommodating cavity (2021) and screwed to the lead screw (203). The other end of the slider (204) passes through the limiting groove and is located outside the guide post (202), and is hinged to the connecting assembly (3).

8. The wafer defect detection stage according to claim 7, characterized in that, It also includes a fixed frame (5), two transmission wheels (6), an annular transmission component (7), and a second rotary drive assembly (8). The two guide rail columns (202) are connected to the fixed frame (5), and the two lead screws (203) are coaxially connected to one of the transmission wheels (6) at one end near the fixed frame (5). The second rotary drive assembly (8) is connected to any one of the transmission wheels (6), and the two transmission wheels (6) are connected to each other through the annular transmission component (7).

9. The wafer defect detection stage according to claim 8, characterized in that, It also includes a measuring instrument and a controller. The measuring instrument is used to measure the warpage of the wafer. The controller is connected to the measuring instrument and the second rotation drive assembly (8). The controller can send an action signal to the second rotation drive assembly (8) according to the measurement result of the measuring instrument.

10. A method of using a wafer defect detection stage as described in any one of claims 1 to 9, characterized in that, include: Place the wafer on the stage (1); Measure the warpage of the wafer edge; Based on the warp, the lifting end (201) in at least one lifting component (2) is controlled to rise or fall to adjust the angle of the stage (1) so that the imaging device can image the edge of the wafer with consistent depth of field.

Images