Wafer image processing method and device and wafer scanning system

Abstract

The embodiment of the invention discloses a wafer image processing method and device and a wafer scanning system, and the method comprises the steps: controlling a camera to carry out the multiple batch scanning of a target wafer in a line scanning mode under the condition that the target wafer is illuminated based on a light source. Each batch scanning comprises scanning one or more rows of pixels in a row scanning mode to obtain an original scanning image of the batch scanning, and the original scanning image of the batch scanning comprises an image of one or more rows of pixels of the batch scanning. And obtaining the light emitting power corresponding to each batch scanning through a light power measuring device, wherein the light emitting power corresponding to each batch scanning is the light emitting power of the light source during each batch scanning. And adjusting the brightness value of the pixel in the original scanning image of each batch scanning according to the reference pixel brightness value and the light emitting power during each batch scanning to obtain a pixel correction image corresponding to the batch scanning, and obtaining a target scanning image of the target wafer according to a plurality of pixel correction images of multiple batch scanning.

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