Method for monitoring deviation abnormity of cleaning brush of grinding machine table

By forming a semiconductor structure with a PN junction conduction loop on the substrate and forming a patterned metal layer thereon, defect detection is performed on the surface of the semiconductor structure after performing the chemical mechanical grinding process, the problem that traditional monitoring methods cannot effectively monitor the abnormal deviation of the cleaning brush of the grinding machine table is solved, and timely and effective monitoring of the abnormal deviation is achieved.

CN119795017AActive Publication Date: 2025-04-11HUA HONG SEMICON WUXI LTD
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Patent Information

Application Number
CN202510061505.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-14
Publication Date
2025-04-11
Estimated Expiration
2045-01-14

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Abstract

The invention provides a method for monitoring deviation abnormity of a cleaning brush of a grinding machine table, and the method comprises the steps: forming a PN junction conduction loop in a substrate and a semiconductor device, and then cleaning grinding byproducts on the surface of a metal layer through the cleaning brush of the grinding machine table in cooperation with cleaning liquid medicine in a CMP process, thereby achieving the purpose of monitoring deviation abnormity of the cleaning brush of the grinding machine table. And carrying out defect detection on the surface of the semiconductor structure after the CMP process so as to monitor whether a cleaning brush of the grinding machine has deviation abnormity or not. According to the invention, the semiconductor structure with the PN junction loop (the PN junction loop can realize electron conduction) is used for executing the CMP process of the rear-section metal layer, so that the abnormities such as the offset of a cleaning brush of a grinding machine table can be shown through the corrosion defect of the metal layer on the surface of the semiconductor structure with the PN junction loop in defect detection; therefore, timely and effective monitoring of deviation abnormity of the cleaning brush of the grinding machine table after the rear-section metal layer CMP process is realized.
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Citation Information

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