A fast and slow vacuum angle valve suitable for the semiconductor industry

Abstract

The present invention relates to the field of vacuum angle valve technology, specifically a fast and slow vacuum angle valve suitable for the semiconductor industry, comprising a bellows, a valve body and a drive assembly, a cavity with a clearance matching the bellows shape provided at the center of the valve body, vents provided at the bottom and sides of the cavity, a bellows lower flange fixedly connected to the bottom of the bellows, and a radial hole communicating with the bottom provided on the bellows lower flange. The fast and slow vacuum angle valve suitable for the semiconductor industry realizes a two-way door opening movement of the valve and a dual flow conduction function through a series cylinder structure design; at the same time, it avoids changes in the overall size of the valve during the lifting movement, thereby reducing the use space and increasing the appearance of the product; through the buffer structure design of the valve opening and closing process, it avoids the impact problem of metal parts occurring during the door opening and closing process, avoids the generation of mechanical particles, and improves the cleanliness of the valve.

Description

Technical Field

[0001] The present invention relates to the technical field of vacuum angle valves, and in particular to a fast and slow vacuum angle valve suitable for the semiconductor industry. Background Art

[0002] In the semiconductor industry, chip production processes place extremely high demands on environmental cleanliness and vacuum levels. In particular, during the preparation of the reaction chamber, periodic vacuum pumping and evacuation operations are required. However, a series of problems arise during the moment the vacuum pump evacuates the chamber. Firstly, the turbulent flow generated during the vacuum pumping process can easily cause particles within the chamber to land on the chip, potentially threatening chip quality. Secondly, the rapid changes in pressure can easily cause condensation, resulting in the formation of small amounts of water droplets, which can also adversely affect chip quality.

[0003] To address these issues, the valve installed between the chamber and the vacuum pump needs to have a slow pumping function to reduce the impact on the chamber's internal environment during the vacuum pumping process. However, the fast and slow pumping angle valves commonly used on the market currently have some shortcomings in design and use. These angle valves generally use springs to store energy and provide a normal seal. By fixing the valve body and cylinder structure, the air pressure input from different air inlets causes the spring to undergo a two-stage compression, thereby opening the valve plate. However, this design causes the indicator to extend when the door is opened, resulting in an increase in the overall size of the valve, which is not conducive to a compact layout in semiconductor production equipment.

[0004] Furthermore, current fast and slow angle valves typically utilize a dual-cylinder, dual-piston structure. However, this structure has limitations in terms of physical buffering and cannot completely eliminate vibration and shock during the opening and closing process. Long-term vibration and shock can easily damage the cylinder, thus affecting the performance and life of the valve.

[0005] Therefore, a new type of fast and slow vacuum angle valve is needed. It can achieve soft opening and hard opening functions of the vacuum pipeline while maintaining the overall height of the valve. It also has excellent cushioning and guiding design to reduce vibration and impact during the opening and closing process, thereby improving the stability and service life of the valve. Summary of the Invention

[0006] In order to solve the above problems, the present invention provides a fast and slow vacuum angle valve suitable for the semiconductor industry. The fast and slow vacuum angle valve suitable for the semiconductor industry realizes the two-way opening movement of the valve and realizes the dual flow conduction function through the serial cylinder structure design; at the same time, it avoids the change of the overall size of the valve during the lifting movement, thereby reducing the usage space and increasing the appearance of the product; through the buffer structure design of the valve opening and closing process, the impact problem of metal parts occurring during the door opening and closing process is avoided, the generation of mechanical particles is avoided, and the cleanliness of the valve is improved; through a special positioning method, the coaxiality of the double-cylinder structure is guaranteed, the compression of the double pistons is uniform, the wear of the sealing ring is reduced, and the service life of the valve is improved; all connections adopt detachable connections, which increases the maintainability of the valve and indirectly improves the service life of the valve.

[0007] The technical solutions of the present invention are as follows:

[0008] A fast and slow vacuum angle valve suitable for the semiconductor industry includes a bellows, a valve body, and a drive assembly. The valve body is provided with a cavity at the center thereof, which has a clearance matching the bellows shape. Vents are provided at the bottom and sides of the cavity. A bellows lower flange is fixedly connected to the bottom of the bellows, and a radial hole communicating with the bottom is provided on the bellows lower flange.

[0009] Under the action of the driving assembly, when the lower flange of the bellows is in close contact with the bottom of the cavity and the radial holes are blocked, the bottom air vent of the cavity is not connected to the side air vents; when the lower flange of the bellows is in close contact with the bottom of the cavity and the radial holes are connected to the bottom, the bottom air vent of the cavity and the side air vents are connected through the radial holes, reaching a soft-open door state; when the lower flange of the bellows is away from the bottom of the cavity, the bottom air vent and the side vent of the cavity are connected to the bottom idle space of the air through the lower flange of the bellows, reaching a hard-open door state.

[0010] The driving assembly includes a cylinder body, a main piston, a cylinder head, an auxiliary piston and a core shaft. The cylinder body is fixedly connected to the top of the valve body, the main piston is airtightly arranged in the cylinder body, the cylinder head is airtightly fixedly connected to the bottom of the cylinder body, a soft air inlet and a pump air inlet are respectively provided on the cylinder body, the auxiliary piston is airtightly slidably installed in the center of the cylinder head, an auxiliary spring is installed between the top of the auxiliary piston and the main piston, and a main spring is installed between the cylinder head and the lower flange of the bellows. The top of the core shaft is fixedly connected to the main piston, and the core shaft passes through the auxiliary piston and the lower flange of the bellows in sequence. The bottom of the core shaft is arranged at the connection point between the bottom of the lower flange of the bellows and the radial hole. When the bottom of the core shaft is tightly against the bottom of the lower flange of the bellows, the bottom of the lower flange of the bellows is not connected to the radial hole;

[0011] When in the normally closed state, the pre-compression force provided by the main spring and the auxiliary spring respectively makes the lower flange of the bellows fit tightly against the bottom of the cavity and the radial holes are blocked; when the soft pumping function needs to be opened, the SOFT air inlet is ventilated, the main piston compresses the auxiliary spring to move downward, the auxiliary piston remains stationary, and the main piston moves the core shaft downward, so that the core shaft under normal conditions is separated from the lower flange of the bellows, and the two air vents at the bottom and side of the cavity form a conductive state through the radial holes of the lower flange of the bellows, reaching the soft door opening state; when the hard pumping function needs to be opened, the PUMP air inlet is ventilated, the main piston will move upward with the core shaft, the lower flange of the bellows, and the auxiliary piston, compressing the main spring and the bellows, so that the lower flange of the bellows is separated from the valve body, and the two air vents at the bottom and side of the cavity are directly connected, reaching the hard door opening state.

[0012] The upper part of the bellows is fixedly connected with a bellows upper flange, and the bellows upper flange is fixedly connected to the top of the valve body in an airtight manner.

[0013] An O-ring is installed between the core shaft and the lower flange of the bellows, and the O-ring is arranged above the radial hole.

[0014] The cylinder head is installed in the cylinder body in an airtight manner and is fixedly connected to the cylinder body through a retaining spring.

[0015] The SOFT air inlet is set at the uppermost end of the cylinder body, and the PUMP air inlet is set between the main piston and the cylinder head.

[0016] The beneficial effects of the present invention are:

[0017] 1. The present invention discloses a fast and slow vacuum angle valve suitable for the semiconductor industry. The fast and slow vacuum angle valve suitable for the semiconductor industry realizes two-way door opening movement of the valve through a series cylinder structure design, namely soft door opening and hard door opening. In the soft door opening state, the air vent is connected through the radial hole of the lower flange of the bellows; in the hard door opening state, the air vent is directly connected through the gap between the lower flange of the bellows and the valve body. Both states are achieved without changing the overall height of the valve, thereby reducing the usage space and increasing the appearance and applicability of the product.

[0018] 2. The present invention discloses a fast and slow vacuum angle valve suitable for the semiconductor industry. The fast and slow vacuum angle valve suitable for the semiconductor industry effectively avoids the vibration and impact problems caused by the valve during the opening and closing process through the buffering and guiding structure design; the coordinated movement of the main piston and the auxiliary piston, and the pre-compression force of the main spring and the auxiliary spring together constitute a buffer mechanism during the valve opening and closing process; it not only reduces the direct impact of metal parts, but also avoids the generation of mechanical particles, thereby improving the cleanliness and service life of the valve.

[0019] 3. The present invention discloses a fast and slow vacuum angle valve suitable for the semiconductor industry. The fast and slow vacuum angle valve suitable for the semiconductor industry ensures the coaxiality of the dual-cylinder structure through a special positioning method, such as the cylinder head provides a coaxial limit for the auxiliary piston, and the auxiliary piston provides a coaxial limit for the core shaft, etc.; the compression amount of the dual pistons is uniform, thereby reducing the wear of the sealing ring and further improving the service life and sealing performance of the valve.

[0020] 4. The present invention discloses a fast and slow vacuum angle valve suitable for the semiconductor industry. All connections of the fast and slow vacuum angle valve suitable for the semiconductor industry adopt detachable connections. For example, the cylinder body and the valve body are statically sealed by tightening the flange on the bellows and screws, and the cylinder cover is fixed to the cylinder body by a retaining spring, etc.; it not only facilitates the assembly and disassembly of the valve, but also improves the maintainability of the valve, making it more convenient and quicker for users to repair or replace parts.

[0021] 5. The present invention discloses a fast and slow vacuum angle valve suitable for the semiconductor industry. The fast and slow vacuum angle valve suitable for the semiconductor industry is particularly suitable for the semiconductor industry. The design of the high-vacuum fast and slow pneumatic angle valve meets the needs of periodic vacuuming and breaking the vacuum in the reaction chamber when preparing chips; by precisely controlling the switching speed and ventilation volume of the valve, the occurrence of turbulent disturbance and condensation is effectively reduced, thereby improving the production quality and efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] By reading the detailed description of the preferred embodiment below, the solutions and advantages of the present application will become clear to those skilled in the art. The accompanying drawings are only for illustrating the preferred embodiment and are not to be considered as limiting the present invention.

[0023] In the attached figure:

[0024] Figure 1 This is a schematic diagram of the three-dimensional appearance of a fast and slow vacuum angle valve suitable for the semiconductor industry according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the exploded structure of a fast and slow vacuum angle valve suitable for the semiconductor industry according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the exploded structure of a fast and slow vacuum angle valve suitable for the semiconductor industry according to an embodiment of the present invention (the valve body is not shown);

[0027] Figure 4 This is a schematic diagram of the cross-sectional structure of a fast and slow vacuum angle valve applicable to the semiconductor industry in a normally closed state according to an embodiment of the present invention;

[0028] Figure 5This is a schematic cross-sectional view of a fast and slow vacuum angle valve applicable to the semiconductor industry in an embodiment of the present invention, with the main valve plate closed and the auxiliary valve plate open;

[0029] Figure 6 This is a schematic cross-sectional view of a fast and slow vacuum angle valve suitable for the semiconductor industry in an embodiment of the present invention, with the main valve plate open and the auxiliary valve plate closed;

[0030] The components represented by the reference numerals in the figure are:

[0031] The present invention comprises: 1. a cylinder body, 2. a main piston, 3. an auxiliary spring, 4. a cylinder cover, 5. an auxiliary piston, 6. a main spring, 7. a bellows, 8. a core shaft, and 9. a valve body. DETAILED DESCRIPTION

[0032] like Figures 1 to 3 As shown, the fast and slow vacuum angle valve suitable for the semiconductor industry mainly includes a bellows 7, a valve body 9 and a drive assembly.

[0033] The valve body 9 has a central cavity whose shape matches the profile of the bellows 7, with a clearance between the two ensuring smooth and tight movement. Vents are located at the bottom and sides of the cavity for connecting to external equipment such as the reaction chamber and a vacuum pump.

[0034] The bottom of the bellows 7 is fixedly connected to a bellows lower flange, which is provided with a radial hole communicating with the bottom. This radial hole will play a key role in different working conditions of the valve.

[0035] The drive assembly is the core of this angle valve and consists of a cylinder body 1, a primary piston 2, a cylinder head 4, a secondary piston 5, and a core shaft 8. The cylinder body 1 is fixedly connected to the top of the valve body 9, forming a closed pneumatic system. The primary piston 2 is airtightly mounted within the cylinder body 1, receiving pneumatic signals and generating corresponding movement. The cylinder head 4 is airtightly mounted to the bottom of the cylinder body 1 and fixedly connected to the cylinder body 1 via a retaining spring, ensuring the system's tightness.

[0036] The cylinder block 1 is equipped with a soft inlet and a pump inlet, which are used to receive different pneumatic signals and control the opening and closing status of the valve. The soft inlet is located at the top of the cylinder block 1, while the pump inlet is located between the main piston 2 and the cylinder head 4.

[0037] A secondary piston 5 is airtightly and slidably mounted in the center of the cylinder head 4, assisting the movement of the primary piston 2 and increasing system stability. An auxiliary spring 3 is installed between the top of the secondary piston 5 and the primary piston 2, providing pre-compression and absorbing shock during movement. A main spring 6 is installed between the cylinder head 4 and the lower flange of the bellows, also providing pre-compression and ensuring the valve's initial closure.

[0038] The top of core shaft 8 is fixedly connected to the main piston 2, forming an integral moving unit. After passing through the auxiliary piston 5 and the lower bellows flange, its bottom is positioned where the bottom of the bellows flange connects to the radial holes. When the bottom of core shaft 8 is in close contact with the bottom of the bellows flange, the bottom of the bellows flange and the radial holes are disconnected, and the valve is closed.

[0039] To enhance the system's sealing and stability, a bellows upper flange is fixed to the top of bellows 7 and airtightly secured to the top of valve body 9 using screws or other means. An O-ring is installed between core shaft 8 and the bellows lower flange to ensure a tight seal and prevent gas leakage. The O-ring is positioned above the radial hole to prevent it from affecting its connectivity.

[0040] like Figures 4 to 6 As shown, the working principle of the fast and slow vacuum angle valve suitable for the semiconductor industry is as follows:

[0041] Normally Closed: In the initial state, the pre-compression force provided by the main spring 6 and auxiliary spring 3 keeps the bellows' lower flange in close contact with the bottom of the cavity, and blocks the radial holes. At this point, the bottom vent and the side vents of the cavity are disconnected, and the valve is closed.

[0042] Soft-open state: To activate the soft-open function, ventilate the SOFT air inlet. At this point, the main piston 2, under the action of the pneumatic signal, compresses the auxiliary spring 3, causing it to move downward, while the auxiliary piston 5 remains stationary due to a rigid limiter. The movement of the main piston 2 drives the core shaft 8 downward, causing it to detach from, or create a gap between, the lower flange of the bellows. At this point, the bottom and side vents of the cavity are connected through the radial holes in the lower flange of the bellows and the gap between the core shaft 8 and the lower flange, achieving the soft-open state.

[0043] Hard-open state: When the hard pumping function needs to be turned on, ventilate the PUMP air inlet. At this time, under the action of the pneumatic signal, the main piston 2 will move upward together with the core shaft 8, the lower flange of the bellows, and the auxiliary piston 5. During this process, the main spring 6 is further compressed, and the bellows 7 is also stretched. As the lower flange of the bellows gradually separates from the bottom of the cavity of the valve body 9, the bottom vent of the cavity is directly connected to the side vent, reaching the hard-open state.

[0044] In a specific embodiment:

[0045] The high-vacuum pneumatic angle valve for the semiconductor industry is primarily composed of a valve fixing mechanism, a drive assembly, a guide assembly, and connectors. Specifically, it consists of a cylinder block 1, a main piston 2, an auxiliary spring 3, a cylinder head 4, an auxiliary piston 5, a main spring 6, a bellows 7, a core shaft 8, and a valve body 9.

[0046] The valve fixing mechanism is primarily composed of the cylinder block 1, cylinder head 4, valve body 9, and the upper flange of the bellows 7. The cylinder block 1 and valve body 9 are connected by the upper flange of the bellows. Screws are tightened to compress the O-ring on the upper flange of the bellows, creating a static seal. The cylinder head 4 is installed in the cylinder block 1, compressing the O-ring to achieve a radial seal, while the cylinder head 4 is secured by a retaining ring.

[0047] The drive assembly consists of a main piston 2, an auxiliary spring 3, an auxiliary piston 5, a main spring 6, a bellows 7, a bellows lower flange, and a core shaft 8. When the valve is in a normally closed state, the auxiliary spring 3 provides a pre-compression force, causing the core shaft 8 to compress the O-ring at the lower flange of the bellows 7, thereby achieving sealing of the auxiliary valve plate; the main spring 6 provides a pre-compression force, causing compression between the O-ring at the lower flange of the bellows 7 and the valve body, thereby achieving sealing of the main valve plate; when the SOFT air port is ventilated, the main piston 2 moves downward, the auxiliary piston 5 remains stationary, and the auxiliary spring 3 is further compressed, causing the core shaft 8 to separate from the lower flange of the bellows 7, thereby achieving soft opening of the valve; when the PUMP air port is ventilated, the main piston 2 moves upward, driving the core shaft 8, the lower flange of the bellows 7, and the auxiliary piston 5 to move upward, causing the main spring 6 and the bellows 7 to be further compressed, causing the lower flange of the bellows 7 to separate from the sealing surface of the valve body, thereby achieving hard opening of the valve.

[0048] The guide assembly consists of a cylinder head 4, an auxiliary piston 5 and related guide sleeves, wherein the cylinder head 4 provides a coaxial limit for the auxiliary piston 5, and the auxiliary piston 5 provides a coaxial limit for the core shaft 8. Through the two coaxial limits, the cylinder wall and the piston are guaranteed to be coaxial, ensuring the uniformity of the compression of the O-ring on the piston.

[0049] Specific implementation steps

[0050] 1. The valve is in the normally closed state. According to the pre-compression force provided by the main spring and the auxiliary spring respectively, the main valve plate and the auxiliary valve plate are both in the closed state;

[0051] 2. When the soft pumping function needs to be turned on, air is ventilated to the SOFT air inlet. At this time, the main piston will further compress the auxiliary spring and move downward. However, due to the rigid limit, the auxiliary piston remains stationary. Therefore, the main piston will cause the core shaft to move downward, so that the core shaft in the normal state is separated from the lower flange of the bellows. At this time, the two ports of the angle valve can be connected through the radial holes of the lower flange of the bellows to achieve the soft door opening state.

[0052] 3. When the hard pumping function needs to be turned on, ventilate the PUMP air inlet. At this time, the main piston will move upward with the core shaft, the lower flange of the bellows, and the auxiliary piston. This process will further compress the main spring and the bellows, causing the lower flange of the bellows to separate from the valve body. At this time, the two ports of the angle valve are directly connected, reaching the hard-open state.

[0053] This fast and slow vacuum angle valve suitable for the semiconductor industry uses a series cylinder structure design to achieve two-way opening movement of the valve and realize dual flow conduction function; at the same time, it avoids the change of the overall size of the valve during the lifting movement, thereby reducing the usage space and increasing the product appearance; through the buffer structure design of the valve opening and closing process, it avoids the impact problem of metal parts in the opening and closing process, avoids the generation of mechanical particles, and improves the cleanliness of the valve; through a special positioning method, the coaxiality of the double-cylinder structure is guaranteed, the compression of the double pistons is uniform, and the wear of the sealing ring is reduced, thereby increasing the service life of the valve; all connections are detachable, which increases the maintainability of the valve and indirectly increases the service life of the valve.

Claims

1. A fast and slow vacuum angle valve suitable for the semiconductor industry, characterized in that: The valve body (9) comprises a bellows (7), a valve body (9) and a drive assembly, wherein a cavity is provided at the center of the valve body (9) and has a clearance matching the outer shape of the bellows (7), vents are provided at the bottom and sides of the cavity, a bellows lower flange is fixedly connected to the bottom of the bellows (7), and a radial hole communicating with the bottom is provided on the bellows lower flange; Under the action of the driving component, when the lower flange of the bellows is in close contact with the bottom of the cavity and the radial holes are blocked, the bottom vent of the cavity is not connected to the side vents; when the lower flange of the bellows is in close contact with the bottom of the cavity and the radial holes are connected to the bottom, the bottom vent of the cavity and the side vents are connected through the radial holes, achieving a soft-open door state; when the lower flange of the bellows is away from the bottom of the cavity, the bottom vent and the side vent of the cavity are connected to the bottom idle space of the air through the lower flange of the bellows, achieving a hard-open door state; The driving assembly comprises a cylinder body (1), a main piston (2), a cylinder head (4), an auxiliary piston (5) and a core shaft (8); the cylinder body (1) is fixedly connected to the top of the valve body (9); the main piston (2) is airtightly arranged in the cylinder body (1); the cylinder head (4) is airtightly fixedly connected to the bottom of the cylinder body (1); a soft air inlet and a pump air inlet are respectively provided in the cylinder body (1); and the auxiliary piston (5) is airtightly and slidably installed in the center of the cylinder head (4). An auxiliary spring (3) is installed between the top of the auxiliary piston (5) and the main piston (2), and a main spring (6) is installed between the cylinder head (4) and the bellows lower flange. The top of the core shaft (8) is fixedly connected to the main piston (2). After the core shaft (8) passes through the auxiliary piston (5) and the bellows lower flange in sequence, the bottom of the core shaft (8) is set at the bottom of the bellows lower flange and the radial hole. When the bottom of the core shaft (8) is tightly attached to the bottom of the bellows lower flange, the bottom of the bellows lower flange is not connected to the radial hole. When in the normally closed state, the pre-compression force provided by the main spring (6) and the auxiliary spring (3) respectively causes the lower flange of the bellows to be in close contact with the bottom of the cavity and the radial hole to be blocked; When the soft pumping function is to be turned on, the SOFT air inlet is ventilated, the main piston (2) compresses the auxiliary spring (3) and moves downward, the auxiliary piston (5) remains stationary, and the main piston (2) moves the core shaft (8) downward, so that the core shaft (8) under normal conditions is separated from the lower flange of the bellows, and the two air vents at the bottom and side of the cavity form a conductive state through the radial holes of the lower flange of the bellows, achieving a soft door opening state; when the hard pumping function is to be turned on, the PUMP air inlet is ventilated, the main piston (2) will move upward with the core shaft (8), the lower flange of the bellows, and the auxiliary piston (5), (6) compresses the main spring and the bellows (7), so that the lower flange of the bellows is separated from the valve body (9), and the two air vents at the bottom and side of the cavity are directly connected, achieving a hard door opening state.

2. A fast and slow vacuum angle valve suitable for the semiconductor industry according to claim 1, characterized in that: The upper portion of the bellows (7) is fixedly connected to a bellows upper flange, and the bellows upper flange is fixedly connected to the top of the valve body (9) in an airtight manner.

3. The fast and slow vacuum angle valve suitable for the semiconductor industry according to claim 1, characterized in that: An O-ring is installed between the core shaft (8) and the lower flange of the bellows, and the O-ring is arranged above the radial hole.

4. The fast and slow vacuum angle valve suitable for the semiconductor industry according to claim 1, characterized in that: The cylinder head (4) is airtightly mounted in the cylinder body (1) and fixedly connected to the cylinder body (1) via a retaining spring.

5. The fast and slow vacuum angle valve suitable for the semiconductor industry according to claim 1, characterized in that: The SOFT air inlet is arranged at the uppermost end of the cylinder body (1), and the PUMP air inlet is arranged between the main piston (2) and the cylinder head (4).

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