Optical fiber vertical integration unit and fabrication method

Abstract

The application provides a fiber vertical integration unit and a manufacturing method, wherein the method comprises: a fiber ferrule fixed base provided on a plane chip and loaded with a fiber ferrule, and a fiber single body is arranged in the fiber ferrule; wherein the fiber ferrule fixed base is provided with a gel filling groove corresponding to a first size near a first surface of the plane chip, and a fiber ferrule limiting hole corresponding to a second size is arranged on a second surface of the fiber ferrule fixed base away from the plane chip and is concentric and communicated with the gel filling groove; the fiber ferrule is arranged through the fiber ferrule limiting hole, the end of the fiber ferrule is arranged into the gel filling groove, the fiber single body is abutted to the plane chip, and a high-temperature glue layer is arranged in a space formed between the fiber ferrule and the gel filling groove.

Description

Technical Field

[0001] This invention relates to data processing technology, and more particularly to a fiber optic vertical integration unit and its manufacturing method. Background Technology

[0002] The traditional method for integrating optical fibers with planar chips is the FA (Fiber Array) packaging scheme, which is the mainstream technology in the industry today.

[0003] FA (Fiber Optic Array) refers to an array formed by mounting a bundle of optical fibers or a fiber ribbon on a V-groove substrate at specified intervals. The fiber array manufacturing process involves placing the bare fiber portion, after removing the fiber coating, into the V-groove, pressurizing it with a pressurizing device, bonding it with an adhesive, and finally grinding and polishing the surface to the required precision.

[0004] The advantage of this method is its low cost. However, it cannot meet the application requirements in special environments. Furthermore, the adhesives used, such as resin glue, have low operating temperatures and are prone to aging. This can lead to problems such as misalignment of optical fibers and planar chips due to glue curing, poor resistance to high temperatures and corrosion, and easy detachment after long-term use. Summary of the Invention

[0005] In view of the above problems, the present invention is proposed to provide a fiber vertical integration unit that overcomes or at least partially solves the above problems.

[0006] According to one aspect of the present invention, a fiber optic vertical integration unit is provided, comprising:

[0007] A fiber optic ferrule mounting base with a fiber optic ferrule mounted on a planar chip, wherein a single fiber optic unit is inserted into the fiber optic ferrule.

[0008] The optical fiber ferrule fixing base has a first side with a first-sized adhesive filling groove near the planar chip, and a second side with a second-sized optical fiber ferrule limiting hole that is concentric with and connected to the adhesive filling groove. The optical fiber ferrule passes through the optical fiber ferrule limiting hole to the end of the optical fiber ferrule extending into the adhesive filling groove and abutting the optical fiber against the planar chip. A high-temperature adhesive layer is provided in the space between the optical fiber ferrule and the adhesive filling groove.

[0009] Optionally, in the method according to the present invention, two optical fiber end face observation slots are provided opposite to each other on the surface edge of the first surface of the optical fiber ferrule fixing base, and the two optical fiber end face observation slots extend toward the center position of the corresponding colloid filling slot to communicate with the colloid filling slot.

[0010] Optionally, in the method according to the invention, the fiber optic ferrule fixing base is made of at least one material selected from alumina, fused silica, silicon carbide, and single-crystal magnesium oxide.

[0011] Optionally, in the method according to the invention, the optical fiber ferrule is made of at least one material selected from quartz or ceramic.

[0012] Optionally, in the method according to the present invention, the optical fiber ferrule has an optical fiber transmission channel, the first end of the optical fiber transmission channel has a horn structure, and the optical fiber unit extends from the first end through the second end of the optical fiber transmission channel to abut against the planar chip.

[0013] According to another aspect of the present invention, a method for manufacturing an optical fiber vertical integration unit is provided, comprising the following steps:

[0014] Mechanical drilling is performed on the first and second surfaces of the fiber optic ferrule fixing base, which are arranged opposite to each other, to obtain a colloid filling groove with an opening on the first surface of a corresponding first size and a fiber optic ferrule limiting hole with an opening on the second surface of a corresponding second size. The fiber optic ferrule limiting hole and the colloid filling groove are concentric and connected.

[0015] The fiber ferrule is inserted through the fiber ferrule limiting hole, and the space between the fiber ferrule and the colloid filling groove is filled and cured based on a high-temperature adhesive layer.

[0016] After the high-temperature adhesive layer has been filled and cured, the planar chip is fixed to the first side of the corresponding optical fiber ferrule fixing base;

[0017] The optical fiber unit is inserted through the optical fiber ferrule until the end of the optical fiber unit abuts against the side of the planar chip near the optical fiber ferrule fixing base.

[0018] Optionally, in the method according to the present invention, the space between the optical fiber ferrule and the adhesive filling groove is filled and cured based on a high-temperature adhesive layer, comprising:

[0019] The high-temperature adhesive layer is filled into the space between the optical fiber ferrule and the adhesive filling groove, and the high-temperature adhesive layer is subjected to a static operation at room temperature for a continuously preset static time.

[0020] After the static setting operation is completed, the high-temperature adhesive layer is subjected to a first baking operation at a preset first baking temperature for a preset first baking time.

[0021] After the first preset baking operation is completed, the high-temperature adhesive layer is subjected to a second baking operation at a preset second baking temperature for a continuous preset second baking time.

[0022] After the second baking operation is completed, the high-temperature adhesive layer is allowed to cool naturally.

[0023] Optionally, in the method according to the present invention, fixing the planar chip to the first surface corresponding to the fiber optic ferrule fixing base includes:

[0024] The contour of the colloid filling groove is used to determine the number of welding points corresponding to a preset number of welding points on the first surface of the optical fiber ferrule fixing base, and each welding point is located at a preset distance from the contour of the groove.

[0025] Welding operations are performed on each welding point using femtosecond laser welding to fix the planar chip to the first surface of the corresponding fiber optic ferrule fixing base;

[0026] After the femtosecond laser welding is completed, a cleaning operation is performed on the fiber optic ferrule fixing base and the planar chip.

[0027] Optionally, in the method according to the invention, a cleaning operation is performed on the fiber optic ferrule fixing base and the planar chip, including:

[0028] Organic cleaning is performed on the fiber optic ferrule fixing base and the planar chip.

[0029] After organic cleaning is completed, inorganic cleaning is performed on the fiber optic ferrule fixing base and the planar chip.

[0030] After the inorganic cleaning is completed, a nitrogen-based drying operation is performed on the fiber optic ferrule fixing base and the planar chip.

[0031] Optionally, in the method according to the present invention, organic cleaning is performed on the fiber optic ferrule fixing base and the planar chip, including:

[0032] The optical fiber ferrule fixing base and the planar chip are subjected to acetone-based organic cleaning for a continuously preset first cleaning time.

[0033] After acetone-based organic cleaning is completed, the fiber optic ferrule mounting base and the planar chip are subjected to ethanol-based organic cleaning for a continuously preset second cleaning time.

[0034] Optionally, in the method according to the present invention, inorganic cleaning is performed on the fiber optic ferrule fixing base and the planar chip, including:

[0035] The optical fiber ferrule fixing base and the planar chip are subjected to inorganic cleaning with a first inorganic mixture for a continuous preset third cleaning time at a preset first cleaning temperature. The first inorganic mixture includes concentrated sulfuric acid and hydrogen peroxide in a preset first mixing ratio.

[0036] After the inorganic cleaning based on the first inorganic mixture is completed, the fiber optic ferrule fixing base and the planar chip are subjected to inorganic cleaning based on the second inorganic mixture for a continuous preset fourth cleaning time at a preset second cleaning temperature. The second inorganic mixture includes ammonia, hydrogen peroxide and water in a preset second mixing ratio.

[0037] After the inorganic cleaning based on the second inorganic mixture is completed, the fiber optic ferrule fixing base and the planar chip are rinsed with deionized water.

[0038] According to the present invention, by setting a high-temperature adhesive layer between the fiber optic ferrule fixing base and the fiber optic ferrule, the present invention avoids the decrease in integration accuracy and insufficient reliability caused by the low working temperature, easy aging, and poor corrosion resistance of traditional organic adhesives. The high-temperature adhesive layer can remain stable in a high-temperature environment, ensuring a more secure vertical integration of the optical fiber and the planar chip, and reducing the risk of misalignment and detachment caused by adhesive aging or deformation. In addition, by setting an optical fiber end face observation groove on the fiber optic ferrule fixing base, the installation posture of the individual optical fiber can be easily observed, ensuring that the individual optical fiber is perpendicular to the planar chip, thereby improving the optical data transmission efficiency. Attached Figure Description

[0039] Figure 1 A front view of a fiber optic vertical integration unit according to an embodiment of the present invention is shown;

[0040] Figure 2 A cross-sectional view of the fiber vertical integration unit in this embodiment is shown;

[0041] Figure 3 A flowchart illustrating a method for fabricating a fiber optic vertical integration unit according to another embodiment of the present invention is shown;

[0042] Figure 4 This embodiment shows a schematic diagram of several fiber optic ferrule fixing bases after the fiber optic ferrules have been fixed.

[0043] Figure 5 The diagram shows a schematic of the fiber optic ferrule fixing base and the planar chip after femtosecond laser welding in this embodiment.

[0044] Figure 6 The microscopic results of the femtosecond laser bonding interface in this embodiment are shown.

[0045] Figure 7 A physical image of the optical fiber end face observation slot in this embodiment is shown. Detailed Implementation

[0046] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0047] To address the problems existing in the aforementioned background technology, the inventors have proposed the solution of this invention. Specifically, this invention provides an optical fiber vertical integration unit and its fabrication method.

[0048] Figure 1 A schematic diagram of a fiber optic vertical integration unit according to an embodiment of the present invention is shown, as follows: Figure 1 As shown, the fiber vertical integration unit may include a fiber optic ferrule fixing base and a fiber optic ferrule through which a fiber optic unit is inserted.

[0049] For example, combining Figure 2 As shown, in this embodiment, the fiber vertical integration unit is mainly used for integration with the planar chip, that is, the fiber optic ferrule fixing base is fixed relative to the planar chip. The first side of the fiber optic ferrule fixing base near the planar chip is provided with a colloid filling groove of a corresponding first size. At the same time, the second side of the fiber optic ferrule fixing base away from the planar chip is provided with a fiber optic ferrule limiting hole of a corresponding second size that is concentric with and connected to the colloid filling groove. The fiber optic ferrule passes through the fiber optic ferrule limiting hole to the end of the fiber optic ferrule extending into the colloid filling groove and abutting the fiber optic unit against the planar chip. In order to achieve relative fixation between the fiber optic ferrule and the fiber optic ferrule fixing base, a high-temperature adhesive layer is also provided in the gap space formed between the fiber optic ferrule and the colloid filling groove.

[0050] Based on the above, it can be seen that the fiber vertical integration unit proposed in this embodiment uses a high-temperature adhesive layer to achieve relative fixation between fiber ferrules inserted into the fiber ferrule fixing base. Compared with the prior art, this avoids the problems of low working temperature, easy aging, poor corrosion resistance, and easy deformation of organic adhesives, and effectively improves the reliability and accuracy of vertical integration of optical fibers and planar chips.

[0051] It should be noted that the first dimension of the corresponding colloid filling groove can be larger than the second dimension of the corresponding fiber optic ferrule limiting hole. In this embodiment, both the first dimension and the second dimension can refer to the corresponding dimensions of the colloid filling groove and the fiber optic ferrule limiting hole on the horizontal cross section. The high-temperature adhesive layer used above can be double bond chemical high-temperature inorganic adhesive DB5012.

[0052] Furthermore, during the fabrication of the fiber vertical integration unit of this embodiment, it is necessary to ensure that the fiber unit can be perpendicular to the planar chip so that the optical data transmitted by the fiber unit can be well transmitted to the planar chip during subsequent use. In order to determine whether the fiber unit located in the fiber ferrule is perpendicular to the planar chip, a corresponding fiber end face observation slot is also provided in the fiber vertical integration unit of this embodiment.

[0053] For example, the first surface edge of the fiber optic ferrule fixing base has two fiber end face observation slots facing each other, and the two fiber end face observation slots extend toward the center of the corresponding colloid filling slot to communicate with the colloid filling slot.

[0054] It should be noted that since the optical fiber end face observation slot is connected to the colloidal filling slot, the internal cleaning of the optical fiber vertical integration unit can also be performed based on the optical fiber end face observation slot during the production process to ensure internal cleanliness. Specifically, the cleaning method can include the corresponding standard cleaning method, such as inorganic cleaning such as Rca-1 and Rca-3, as well as organic cleaning.

[0055] Organic cleaning can specifically include: sequentially ultrasonicating in an acetone water bath for 5 minutes, ultrasonicating in an anhydrous ethanol water bath for 5 minutes, rinsing with deionized water for 2 minutes, and drying with nitrogen; inorganic cleaning can specifically include: sequentially RCA-1 (concentrated H2SO4:H2O2=3:1, hot plate 150℃, 15 minutes), RCA-3 (NH4OH:H2O2:H2O=7:2:1, water bath 60℃, 5 minutes), rinsing with deionized water for 2 minutes, and drying with nitrogen.

[0056] Furthermore, in this embodiment, the corresponding fiber optic ferrule fixing base in the aforementioned fiber vertical integration unit can be made of at least one of the following materials: alumina (i.e., sapphire), fused silica, silicon carbide, and single-crystal magnesium oxide.

[0057] Similarly, in this embodiment, the corresponding fiber optic ferrule in the aforementioned fiber vertical integration unit is made of at least one material selected from quartz or ceramic.

[0058] Furthermore, in this embodiment, in order to facilitate the insertion of the optical fiber unit into the corresponding optical fiber ferrule during the manufacturing process, the optical fiber ferrule is provided with a corresponding optical fiber transmission channel. The first end of the optical fiber transmission channel has a horn structure, and the optical fiber unit passes through the second end of the optical fiber transmission channel from the first end to the second end of the optical fiber unit abutting against the planar chip.

[0059] It should be noted that the planar chip mentioned in this embodiment can be any type of chip, and this embodiment does not limit the specific type of the planar chip.

[0060] Another embodiment of the present invention provides a method for fabricating a fiber optic vertical integration unit. Figure 3 A schematic diagram of the manufacturing method is shown, such as... Figure 3 As shown, the method includes steps S101 to S104, starting with step S101, wherein step S101 includes the following:

[0061] Mechanical drilling is performed on the first and second surfaces of the fiber optic ferrule fixing base, which are arranged opposite to each other, to obtain a colloid filling groove with an opening on the first surface and a fiber optic ferrule limiting hole with an opening on the second surface and a corresponding second size. The fiber optic ferrule limiting hole and the colloid filling groove are concentric and connected.

[0062] For example, in this embodiment, the corresponding fiber optic ferrule fixing base can be made of at least one of the following materials: alumina, fused silica, silicon carbide, and single-crystal magnesium oxide, as described above. In the horizontal direction, the first dimension of the corresponding colloidal filling groove is larger than the second dimension of the corresponding fiber optic ferrule limiting hole.

[0063] Step S102 includes the following:

[0064] The fiber optic ferrule is inserted through the fiber optic ferrule limiting hole, and the space between the fiber optic ferrule and the adhesive filling groove is filled and cured based on a high-temperature adhesive layer.

[0065] For example, after forming the corresponding colloid filling groove and the fiber ferrule limiting hole on the fiber ferrule fixing base based on the above-mentioned mechanical drilling, the corresponding fiber ferrule can be passed through the corresponding fiber ferrule limiting hole until one end of the corresponding fiber ferrule is placed in the colloid filling groove and the other end protrudes from the fiber ferrule limiting hole, that is, the second end is outside the fiber ferrule limiting hole. Since the first end of the fiber ferrule is placed in the colloid filling groove, a corresponding gap space will be formed between the corresponding fiber ferrule and the colloid filling groove. Then, the gap space can be filled and cured based on the high temperature adhesive layer, thereby realizing the mutual fixation between the fiber ferrule and the fiber ferrule fixing base.

[0066] Furthermore, in this embodiment, the high-temperature adhesive layer can specifically be a double-bonded chemical high-temperature inorganic adhesive DB5012, and the aforementioned "filling and curing the space formed between the optical fiber ferrule and the adhesive filling groove based on the high-temperature adhesive layer" can further include the following steps:

[0067] The high-temperature adhesive layer is filled into the space between the optical fiber ferrule and the adhesive filling groove, and the high-temperature adhesive layer is subjected to a static operation at room temperature for a continuously preset static time.

[0068] After the static setting operation is completed, the high-temperature adhesive layer is subjected to a first baking operation at a preset first baking temperature for a preset first baking time.

[0069] After the first preset baking operation is completed, the high-temperature adhesive layer is subjected to a second baking operation at a preset second baking temperature for a continuous preset second baking time.

[0070] After the second baking operation is completed, the high-temperature adhesive layer is allowed to cool naturally.

[0071] For example, in this embodiment, after the corresponding high-temperature adhesive layer is filled into the corresponding space, the fiber vertical integration unit (i.e., the high-temperature adhesive layer) can be subjected to a static operation for a preset time (e.g., 1 hour) at room temperature (i.e., room temperature 25°C). Subsequently, after the static operation is completed, the fiber vertical integration unit (i.e., the high-temperature adhesive layer) can be subjected to a first baking operation for a corresponding duration of a first baking time (e.g., more than 1 hour) at a preset first baking temperature (e.g., 70°C to 90°C) so that the corresponding high-temperature adhesive layer can be slightly shaped. After the first baking operation is completed, the fiber vertical integration unit (i.e., the high-temperature adhesive layer) can be further subjected to a second baking operation for a corresponding duration of a preset second baking time (e.g., more than 1 hour) at a preset second baking temperature (e.g., 130°C to 150°C) so that the corresponding high-temperature adhesive layer can be fully cured. After the second baking operation is completed, the fiber vertical integration unit can be subjected to a corresponding natural cooling operation, i.e., the fiber vertical integration unit can be cooled at room temperature to reduce the adhesive temperature of the corresponding high-temperature adhesive layer.

[0072] For example, such as Figure 4 As shown, Figure 4 Schematic diagrams of multiple fiber optic ferrule fixing bases after the fiber optic ferrules have been fixed are shown.

[0073] Step S103 includes the following steps:

[0074] After the high-temperature adhesive layer has been filled and cured, the planar chip is fixed to the first side of the corresponding optical fiber ferrule fixing base.

[0075] For example, in this embodiment, after the filling and curing of the corresponding high-temperature adhesive layer is completed, the planar chip can be further fixed on the first side of the corresponding optical fiber ferrule fixing base, thereby completing the assembly process between the optical fiber vertical integration unit and the planar chip.

[0076] Furthermore, in this embodiment, the aforementioned "fixing the planar chip to the first surface corresponding to the fiber optic ferrule fixing base" may further include the following steps:

[0077] The contour of the colloid filling groove is used to determine the number of welding points corresponding to a preset number of welding points on the first surface of the optical fiber ferrule fixing base, and each welding point is located at a preset distance from the contour of the groove.

[0078] Welding operations are performed on each welding point using femtosecond laser welding to fix the planar chip to the first surface of the corresponding fiber optic ferrule fixing base;

[0079] After the femtosecond laser welding is completed, a cleaning operation is performed on the fiber optic ferrule fixing base and the planar chip.

[0080] For example, in this embodiment, the assembly between the fiber optic ferrule fixing base and the planar chip can be performed using femtosecond laser welding. For instance, firstly, based on the contour of the colloid-filled groove, a predetermined number of welding points can be determined on the first surface of the corresponding fiber optic ferrule fixing base, with each welding point at the same predetermined distance from the groove contour. Subsequently, welding operations can be performed on each welding point using femtosecond laser welding, thereby fixing the planar chip to the first surface of the corresponding fiber optic ferrule fixing base, achieving the assembly between the planar chip and the fiber optic ferrule fixing base. Finally, after completing the corresponding femtosecond laser welding, further cleaning operations can be performed on the fiber optic ferrule fixing base and the planar chip to ensure overall cleanliness.

[0081] The parameters of the corresponding femtosecond laser may include: average power 20W, pulse width less than 290fs, single pulse repetition rate 1MHz, wavelength 1030nm, single pulse energy 200μJ, beam quality 1.2M2, and beam pointing stability < 20 µrad / °C.

[0082] For example, in this embodiment, Figure 5 The diagram shows a schematic of the fiber optic ferrule fixing base and the planar chip after femtosecond laser welding in this embodiment. Figure 6 The microscopic results of the femtosecond laser bonding interface in this embodiment are shown.

[0083] Furthermore, in this embodiment, the aforementioned "cleaning operation on the fiber optic ferrule fixing base and the planar chip" may further include the following steps:

[0084] Organic cleaning is performed on the fiber optic ferrule fixing base and the planar chip.

[0085] After organic cleaning is completed, inorganic cleaning is performed on the fiber optic ferrule fixing base and the planar chip.

[0086] After the inorganic cleaning is completed, a nitrogen-based drying operation is performed on the fiber optic ferrule fixing base and the planar chip.

[0087] For example, based on the above, the cleaning operation of the fiber optic ferrule fixing base and the planar chip can be carried out based on the standard cleaning method, that is, based on organic cleaning and inorganic cleaning. After completing the corresponding cleaning operation, the fiber optic ferrule fixing base and the planar chip can be further dried by nitrogen gas, so as to remove the acid or alkaline solution in the inorganic cleaning solution and prevent the planar chip from being corroded.

[0088] Furthermore, in this embodiment, the aforementioned "organic cleaning of the fiber optic ferrule fixing base and the planar chip" may further include the following steps:

[0089] The optical fiber ferrule fixing base and the planar chip are subjected to acetone-based organic cleaning for a continuously preset first cleaning time.

[0090] After the acetone-based organic cleaning is completed, the fiber optic ferrule fixing base and the planar chip are subjected to ethanol-based organic cleaning for a continuously preset second cleaning time.

[0091] For example, in this embodiment, the organic cleaning of the fiber optic ferrule fixing base and the planar chip can be performed using acetone and ethanol. The organic cleaning with acetone can be performed for a preset first cleaning time (e.g., 5 minutes), while the organic cleaning with ethanol can be performed for a preset second cleaning time (e.g., 5 minutes).

[0092] Similarly, in this embodiment, the above-mentioned "inorganic cleaning of the fiber optic ferrule fixing base and the planar chip" may further include the following steps:

[0093] The optical fiber ferrule fixing base and the planar chip are subjected to inorganic cleaning with a first inorganic mixture for a continuous preset third cleaning time at a preset first cleaning temperature. The first inorganic mixture includes concentrated sulfuric acid and hydrogen peroxide in a preset first mixing ratio.

[0094] After the inorganic cleaning based on the first inorganic mixture is completed, the fiber optic ferrule fixing base and the planar chip are subjected to inorganic cleaning based on the second inorganic mixture for a continuous preset fourth cleaning time at a preset second cleaning temperature. The second inorganic mixture includes ammonia, hydrogen peroxide and water in a preset second mixing ratio.

[0095] After the inorganic cleaning based on the second inorganic mixture is completed, the fiber optic ferrule fixing base and the planar chip are rinsed with deionized water.

[0096] For example, in this embodiment, the inorganic cleaning of the fiber optic ferrule fixing base and the planar chip can be divided into three steps:

[0097] 1. Based on a preset first cleaning temperature, the fiber optic ferrule fixing base and the planar chip are subjected to inorganic cleaning with a first inorganic mixture for a corresponding preset third cleaning time (e.g., 15 minutes), wherein the first inorganic mixture may include concentrated sulfuric acid and hydrogen peroxide in a corresponding preset first mixing ratio.

[0098] 2. After completing the inorganic cleaning of the first inorganic mixture, the fiber optic ferrule fixing base and the planar chip can be further cleaned with the second inorganic mixture for a corresponding preset fourth cleaning time (e.g., 5 minutes) based on the preset second cleaning temperature. The second inorganic mixture may include ammonia, hydrogen peroxide and water in a corresponding preset second mixing ratio.

[0099] 3. After completing the inorganic cleaning with the corresponding second inorganic mixture, the fiber optic ferrule fixing base and the planar chip can be rinsed with deionized water to complete the corresponding cleaning operation.

[0100] For example, in this embodiment, in order to determine whether the optical fiber unit is perpendicularly abutting the planar chip in the corresponding optical fiber ferrule fixing base, two opposing optical fiber end face observation slots can be formed on the optical fiber ferrule fixing base by means of, for example, mechanical drilling. The two optical fiber end face observation slots extend towards the center of the corresponding colloid filling slot and communicate with it. After the corresponding optical fiber end face observation slots are opened, the internal condition of the corresponding optical fiber ferrule fixing slot can be obtained based on the optical fiber end face observation slots (e.g., ...). Figure 7 As shown in the figure, since the overall size of the corresponding fiber vertical integration unit is small, if manual observation is used, the subjectivity of human observation may lead to corresponding observation bias, resulting in subjectivity and inconsistency in the observation results.

[0101] To address this issue, in this embodiment, an automated observation method can replace the manual observation method. For example, an image acquisition method can be used to acquire images of the optical fiber end face observation slot, and then the orientation of the optical fiber can be determined based on the acquired images. Here, to reduce the amount of data processing, preset pixel markers can be pre-marked on the optical fiber unit to form corresponding position markers. When the optical fiber unit is perpendicular to the planar chip, the corresponding position marker should be located at the center point of the corresponding acquired image, thereby completing the automatic determination of the orientation of the optical fiber unit. The specific process is as follows:

[0102] The control imaging unit acquires images of any optical fiber end face observation slot to obtain the acquired image corresponding to the optical fiber end face observation slot.

[0103] The acquired image is binarized, and then pixelated based on the obtained binarized image to obtain each acquired pixel that makes up the acquired binarized image.

[0104] In response to the fact that any of the acquired pixels has the same pixel value as the marker pixel corresponding to the position marker, the acquired pixel is determined as the target pixel, and the image center point corresponding to the acquired image is obtained;

[0105] When the target pixel coincides with the center point of the image, the installation posture of the corresponding optical fiber unit is determined to be vertical.

[0106] When the target pixel does not coincide with the center point of the image, the fiber unit is adjusted based on the vertical adjustment strategy.

[0107] For example, in this embodiment, the corresponding imaging unit can be controlled first to perform an image acquisition operation on any fiber end face observation slot, thereby acquiring an image directly associated with the fiber end face observation slot; this step ensures that the image data for subsequent processing originates from the fiber unit to be detected.

[0108] Next, the acquired image is binarized. This process aims to simplify the pixels in the image to contain only two different brightness (or color) levels to facilitate subsequent analysis. Based on the obtained acquired binarized image, further pixelation is performed to identify and distinguish the individual acquired pixels that constitute the acquired binarized image.

[0109] Subsequently, by detecting each acquired pixel, if any acquired pixel has a pixel value that is completely consistent with the marked pixel of the corresponding position marker, then the acquired pixel is determined to be the target pixel. At the same time, it is also necessary to obtain the image center point corresponding to the acquired image. This center point is used as the reference point for determining the installation posture of the fiber optic unit.

[0110] Furthermore, this embodiment designs a judgment logic: if the target pixel coincides with the center point of the image, the corresponding optical fiber unit is automatically confirmed to be in a vertical installation posture, indicating that its installation position is accurate; otherwise, if the target pixel does not coincide with the center point of the image, a vertical adjustment strategy is activated, and the position or angle of the optical fiber unit is adjusted accordingly to ensure that it meets the predetermined vertical installation requirements, thereby determining that the corresponding optical fiber unit can be in the corresponding vertical posture to ensure good optical data transmission efficiency.

[0111] Furthermore, in this embodiment, the aforementioned "adjusting the fiber unit based on the first vertical adjustment strategy when the target pixel does not coincide with the image center point" may further include the following steps:

[0112] The acquired image is processed into coordinates, and the target coordinates and center coordinates corresponding to the target pixel and the image center point are obtained based on the obtained image coordinate system.

[0113] Connect the target coordinate point with the image coordinate point, and compare the resulting center connection line with the Y-axis of the corresponding image coordinate system;

[0114] In response to the central connecting line coinciding with the Y-axis, the fiber unit is controlled to adjust its position toward the direction closer to the planar chip at a corresponding preset first speed;

[0115] In response to the central connecting line not coinciding with the Y-axis, the fiber unit is controlled to adjust its position toward the plane chip at a corresponding preset first speed.

[0116] For example, in this embodiment, firstly, coordinate processing can be performed on the acquired image. This process aims to map each acquired pixel in the acquired image to a two-dimensional image coordinate system, thereby enabling precise positioning of any acquired pixel in the acquired image. Based on this processing, the target coordinate point and center coordinate point corresponding to the target pixel and the image center point can be obtained respectively. These two coordinate points can serve as key references for subsequent analysis;

[0117] Next, in this embodiment, a central connecting line can be formed by connecting the target coordinate point and the center coordinate point; and this central connecting line can be further compared with the Y-axis of the image coordinate system to evaluate the relative positional relationship of the fiber unit with respect to the planar chip.

[0118] Based on the comparison results, this invention designs two different response strategies:

[0119] When the central connecting line coincides with the Y-axis of the image coordinate system, it means that the position of the fiber unit relative to the planar chip is in an ideal state in the vertical direction. However, since the target pixel of the corresponding fiber unit does not coincide with the center point of the image, it can be known that the fiber unit is not in contact with the planar chip. At this time, the fiber unit can be controlled to make a fine adjustment in the direction closer to the planar chip at a preset first speed, in order to ensure the precise docking between the fiber unit and the planar chip, while avoiding positional deviation caused by over-adjustment.

[0120] Conversely, if the center connecting line does not coincide with the Y-axis, it indicates that although the fiber unit has come into contact with the planar chip, the fiber unit is in an over-extended state, causing the fiber unit to bend. In this case, it is necessary to control the fiber unit to adjust its position at the same preset first speed, but in the opposite direction, i.e., towards the direction away from the planar chip, in order to gradually correct this deviation until the ideal vertical alignment is achieved.

[0121] In summary, this embodiment achieves accurate judgment and automatic adjustment of the fiber optic unit position through coordinate processing and coordinate system-based comparative analysis, significantly improving the accuracy and efficiency of the fiber optic unit and planar chip docking.

[0122] It can be explained that, in the above process, when a corresponding target pixel appears in the acquired image, the fiber unit that is not in a vertical orientation is adjusted based on the relative position of the target pixel in the acquired image; and when the corresponding target pixel does not appear in the acquired image, it means that the fiber unit has not extended to a position where the corresponding position identifier can be viewed by the fiber end face observation slot. Therefore, based on this situation, further adjustments can be made according to the following method so that the corresponding position identifier can be viewed by the fiber end face observation slot:

[0123] In response to the fact that no collected pixel has the same pixel value as the marked pixel corresponding to the position marker, the vertical maximum coordinate point corresponding to the maximum value of the Y-axis is determined based on the image coordinate system, and the difference between the vertical maximum coordinate point and the center coordinate point is calculated to obtain the vertical coordinate difference.

[0124] The fiber optic unit is controlled to adjust its position towards the planar chip at a preset second speed, with the same distance as the difference between the vertical coordinates.

[0125] The control imaging unit acquires images of any optical fiber end face observation slot to obtain an updated image corresponding to the optical fiber end face observation slot.

[0126] The updated image is binarized, and the resulting updated binarized image is pixelated to obtain the updated pixels that make up the updated binarized image.

[0127] If any updated pixel has the same pixel value as the marker pixel corresponding to the position marker, the acquired pixel is determined as the target pixel.

[0128] For example, in this embodiment, when it is detected that none of the collected pixels has the same pixel value as the marker pixel of the corresponding position marker, the vertical maximum coordinate point with the largest value in the Y-axis direction can be identified and determined first based on the image coordinate system established above. Then, the difference between this vertical maximum coordinate point and the preset center coordinate point is calculated to obtain the vertical coordinate difference.

[0129] Based on the vertical coordinate difference calculated above, the fiber unit can be controlled to adjust its position along the direction close to the planar chip at a preset second speed, wherein the adjustment distance is equal to the vertical coordinate difference.

[0130] Next, the image acquisition unit is used to capture images of any optical fiber end face observation slot to obtain an updated image corresponding to that optical fiber end face observation slot.

[0131] Subsequently, the acquired updated image is binarized to distinguish different regions within the image. Based on the processed updated binarized image, further pixelation is performed to obtain the individual updated pixels that constitute the updated binarized image.

[0132] Finally, by checking all updated pixels, if any updated pixel is found to have the same pixel value as the corresponding marked pixel in the preset position marker, then the updated pixel is determined to be the target pixel.

[0133] In summary, according to the solution of this embodiment, by setting a high-temperature adhesive layer between the fiber optic ferrule fixing base and the fiber optic ferrule, this avoids the reduced integration accuracy and insufficient reliability caused by traditional organic adhesives due to their low operating temperature, easy aging, and poor corrosion resistance. The high-temperature adhesive layer can remain stable in high-temperature environments, ensuring a more secure vertical integration of the fiber optic cable and the planar chip, and reducing the risk of misalignment and detachment caused by adhesive aging or deformation. In addition, by setting an optical fiber end face observation groove on the fiber optic ferrule fixing base, the installation posture of the individual fiber optic cable can be easily observed, ensuring that the individual fiber optic cable is perpendicularly abutting the planar chip, thereby improving the optical data transmission efficiency.

[0134] It should be noted that, here, when there is a captured pixel in the image that has the same pixel value as the marker pixel of the corresponding position marker, it means that the corresponding fiber optic unit has been extended to a position where the position marker can be viewed by the fiber optic end face observation slot. Therefore, in this case, the position adjustment of the fiber optic unit can be based on a relatively slow speed (i.e., a preset first speed) to ensure the accuracy of the adjustment. On the other hand, when there is no captured pixel in the image that has the same pixel value as the marker pixel of the corresponding position marker, it means that the corresponding fiber optic unit has not been extended to a position where the position marker can be viewed by the fiber optic end face observation slot. Therefore, in this case, the position adjustment of the fiber optic unit can be based on a relatively fast speed (i.e., a preset second speed) to ensure the efficiency of the adjustment.

[0135] In the specification provided herein, the algorithms and displays are not inherently related to any particular computer, virtual system, or other device. Various general-purpose systems can also be used with the examples of this invention. The required structure for constructing such systems is apparent from the above description. Furthermore, this invention is not directed to any particular programming language. It should be understood that the contents of the invention described herein can be implemented using various programming languages, and the above description of specific languages ​​is for the purpose of disclosing preferred embodiments of the invention.

[0136] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0137] Similarly, it should be understood that, in order to streamline this disclosure and aid in understanding one or more of the various aspects of the invention, in the description of exemplary embodiments of the invention above, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof.

[0138] Those skilled in the art will understand that modules, units, or components of the devices disclosed in the examples herein can be arranged in the devices described in this embodiment, or alternatively, can be located in one or more devices different from the devices in this example. The modules in the foregoing examples can be combined into a single module or, in addition, can be divided into multiple sub-modules.

[0139] Those skilled in the art will understand that the modules in the device of the embodiment can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiment can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components.

[0140] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features from different embodiments are meant to be within the scope of the invention and form different embodiments.

[0141] Furthermore, some of the embodiments described herein are methods or combinations of method elements that can be implemented by a processor of a computer system or by other means of performing the functions. Therefore, a processor having the necessary instructions for implementing the methods or method elements forms means for implementing the methods or method elements. Furthermore, the elements described herein in the apparatus embodiments are examples of means for implementing the functions performed by elements for the purposes of carrying out the invention.

[0142] As used herein, unless otherwise specified, the use of ordinal numbers such as “first,” “second,” “third,” etc., to describe ordinary objects merely indicates different instances of similar objects and is not intended to imply that the objects being described must have a given order in time, space, ordering, or any other manner.

[0143] Although the invention has been described with respect to a limited number of embodiments, those skilled in the art will understand from the foregoing description that other embodiments are conceivable within the scope of the invention described herein. Furthermore, it should be noted that the language used in this specification has been chosen primarily for readability and edibility purposes, and not for the purpose of explaining or limiting the subject matter of the invention.

Claims

1. A method for fabricating fiber optic vertical integration units, characterized in that, The fiber optic vertical integration unit includes: A fiber optic ferrule mounting base with a fiber optic ferrule mounted on a planar chip, wherein a single fiber optic unit is inserted into the fiber optic ferrule. The optical fiber ferrule fixing base has a first side with a corresponding first size of adhesive filling groove on the side closest to the planar chip. The second side of the optical fiber ferrule fixing base away from the planar chip has an optical fiber ferrule limiting hole of a corresponding second size that is concentric with and connected to the adhesive filling groove. The optical fiber ferrule passes through the optical fiber ferrule limiting hole to the end of the optical fiber ferrule extending into the adhesive filling groove and abutting the optical fiber unit against the planar chip. A high-temperature adhesive layer is provided in the space between the optical fiber ferrule and the adhesive filling groove. The first surface of the fiber optic ferrule fixing base has two fiber optic end face observation slots facing each other, and the two fiber optic end face observation slots extend toward the center of the corresponding colloid filling slot to communicate with the colloid filling slot. The fiber optic ferrule fixing base is made of at least one material selected from alumina, fused silica, silicon carbide, and single-crystal magnesium oxide; The fiber optic ferrule is made of at least one material selected from quartz or ceramic. The optical fiber ferrule has an optical fiber transmission channel. The first end of the optical fiber transmission channel has a horn structure. The optical fiber unit passes through the first end and exits the second end of the optical fiber transmission channel until the optical fiber unit abuts against the planar chip. The method includes the following steps: Mechanical drilling is performed on the first and second surfaces of the fiber optic ferrule fixing base, which are arranged opposite to each other, to obtain a colloid filling groove with an opening on the first surface of a corresponding first size and a fiber optic ferrule limiting hole with an opening on the second surface of a corresponding second size. The fiber optic ferrule limiting hole and the colloid filling groove are concentric and connected. The fiber ferrule is inserted through the fiber ferrule limiting hole, and the space between the fiber ferrule and the colloid filling groove is filled and cured based on a high-temperature adhesive layer. After the high-temperature adhesive layer has been filled and cured, the planar chip is fixed to the first side of the corresponding optical fiber ferrule fixing base; The optical fiber unit is inserted through the optical fiber ferrule until the end of the optical fiber unit abuts against the side of the planar chip near the optical fiber ferrule fixing base; The control imaging unit acquires images of any optical fiber end face observation slot to obtain the acquired image corresponding to the optical fiber end face observation slot. The acquired image is binarized, and then pixelated based on the obtained binarized image to obtain each acquired pixel that makes up the acquired binarized image. Pre-marking of pixels with preset pixels is performed on the fiber unit to form a position marker; In response to the fact that no collected pixel has the same pixel value as the marked pixel corresponding to the position marker, the vertical maximum coordinate point corresponding to the maximum value of the Y-axis is determined based on the image coordinate system, and the difference between the vertical maximum coordinate point and the center coordinate point is calculated to obtain the vertical coordinate difference. The fiber optic unit is controlled to adjust its position towards the planar chip at a preset second speed, with the same distance as the difference between the vertical coordinates. The control imaging unit acquires images of any optical fiber end face observation slot to obtain an updated image corresponding to the optical fiber end face observation slot. The updated image is binarized, and the resulting updated binarized image is pixelated to obtain the updated pixels that make up the updated binarized image. In response to the fact that any updated pixel among the updated pixels has the same pixel value as the marked pixel corresponding to the position marker, the collected pixel is determined as the target pixel; In response to the fact that any of the acquired pixels has the same pixel value as the marker pixel corresponding to the position marker, the acquired pixel is determined as the target pixel, and the image center point corresponding to the acquired image is obtained; When the target pixel coincides with the center point of the image, the installation posture of the corresponding optical fiber unit is determined to be vertical. When the target pixel does not coincide with the center point of the image, the acquired image is processed by coordinate conversion, and the target coordinate point and center coordinate point corresponding to the target pixel and the center point of the image are obtained based on the obtained image coordinate system. Connect the target coordinate point with the image coordinate point, and compare the resulting center connection line with the Y-axis of the corresponding image coordinate system; In response to the central connecting line coinciding with the Y-axis, the fiber unit is controlled to adjust its position toward the direction closer to the planar chip at a corresponding preset first speed; In response to the central connecting line not coinciding with the Y-axis, the fiber unit is controlled to adjust its position toward the plane chip at a corresponding preset first speed.

2. The method for fabricating the fiber optic vertical integration unit according to claim 1, characterized in that, The space between the optical fiber ferrule and the adhesive filling groove is filled and cured using a high-temperature adhesive layer, including: The high-temperature adhesive layer is filled into the space between the optical fiber ferrule and the adhesive filling groove, and the high-temperature adhesive layer is subjected to a static operation at room temperature for a continuously preset static time. After the static setting operation is completed, the high-temperature adhesive layer is subjected to a first baking operation at a preset first baking temperature for a preset first baking time. After the first baking operation is completed, the high-temperature adhesive layer is subjected to a second baking operation at a preset second baking temperature for a preset second baking time. After the second baking operation is completed, the high-temperature adhesive layer is allowed to cool naturally.

3. The method for fabricating the fiber optic vertical integration unit according to claim 2, characterized in that, Fixing the planar chip to the first surface corresponding to the fiber optic ferrule fixing base includes: The contour of the colloid filling groove is used to determine the corresponding preset number of welding points on the first surface of the optical fiber ferrule fixing base, and each welding point is located at a preset distance from the contour of the groove. Welding operations are performed on each welding point using femtosecond laser welding to fix the planar chip to the first surface of the corresponding fiber optic ferrule fixing base; After the femtosecond laser welding is completed, a cleaning operation is performed on the fiber optic ferrule fixing base and the planar chip.

4. The method for fabricating the fiber optic vertical integration unit according to claim 3, characterized in that, Perform a cleaning operation on the fiber optic ferrule mounting base and the planar chip, including: Organic cleaning is performed on the fiber optic ferrule fixing base and the planar chip. After organic cleaning is completed, inorganic cleaning is performed on the fiber optic ferrule fixing base and the planar chip. After the inorganic cleaning is completed, a nitrogen-based drying operation is performed on the fiber optic ferrule fixing base and the planar chip.

5. The method for fabricating the fiber optic vertical integration unit according to claim 4, characterized in that, Organic cleaning of the fiber optic ferrule mounting base and the planar chip includes: The optical fiber ferrule fixing base and the planar chip are subjected to acetone-based organic cleaning for a continuously preset first cleaning time. After the acetone-based organic cleaning is completed, the fiber optic ferrule fixing base and the planar chip are subjected to ethanol-based organic cleaning for a continuously preset second cleaning time.

6. The method for fabricating an optical fiber vertical integration unit according to claim 5, characterized in that, Inorganic cleaning of the fiber optic ferrule fixing base and the planar chip includes: The optical fiber ferrule fixing base and the planar chip are subjected to inorganic cleaning with a first inorganic mixture for a continuous preset third cleaning time at a preset first cleaning temperature. The first inorganic mixture includes concentrated sulfuric acid and hydrogen peroxide in a preset first mixing ratio. After the inorganic cleaning based on the first inorganic mixture is completed, the fiber optic ferrule fixing base and the planar chip are subjected to inorganic cleaning based on the second inorganic mixture for a continuous preset fourth cleaning time at a preset second cleaning temperature. The second inorganic mixture includes ammonia, hydrogen peroxide and water in a preset second mixing ratio. After the inorganic cleaning based on the second inorganic mixture is completed, the fiber optic ferrule fixing base and the planar chip are rinsed with deionized water.

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