Measuring mirror mechanism for wafer laser positioning and method for adjusting measuring mirror mechanism

Abstract

The application discloses a measuring mirror mechanism for wafer laser positioning and a method for adjusting the measuring mirror mechanism. The measuring mirror mechanism for wafer laser positioning comprises a mounting plate with a mounting surface, a measuring mirror arranged on the mounting surface, the measuring mirror having a reflecting surface for reflecting laser, a vertical adjusting connector comprising a vertical limiting part and a vertical connecting part, the vertical connecting part penetrating the measuring mirror and being movably connected with the mounting plate along the direction perpendicular to the mounting surface, a vertical reset part arranged between the measuring mirror and the mounting surface and applying a force to the measuring mirror so that the measuring mirror abuts against the vertical limiting part, and a positioning support part clamped between the mounting plate and the measuring mirror and used for fixing the relative position of the mounting plate and the measuring mirror. The measuring mirror mechanism for wafer laser positioning and the method for adjusting the measuring mirror mechanism can adjust and calibrate the measuring mirror in real time.

Description

Technical Field

[0001] This application relates to the field of laser positioning technology, and in particular to a measuring mirror mechanism for wafer laser positioning and a method for adjusting the measuring mirror mechanism. Background Technology

[0002] With the development of semiconductor technology and the advancement of process technology, the linewidth of integrated circuits is becoming increasingly smaller, placing higher and more challenging demands on circuit manufacturing processes. Simultaneously, semiconductor foundries, in order to reduce costs, increase efficiency, improve production capacity, and maximize cleanroom utilization, are placing higher demands on semiconductor equipment. In semiconductor lens manufacturing, orthogonal laser positioning (XY stage laser positioning) is used to position the moving stage in real time. Before laser positioning, the measuring mirror needs to be fixed and adjusted. Commonly, the measuring mirror is directly bonded to a mounting plate using adhesive, with the X-axis laser illuminating the X-axis measuring mirror and the Y-axis laser illuminating the Y-axis measuring mirror. Because the stage is positioned in a vacuum environment, the volatility and shrinkage of the adhesive are extremely critical; otherwise, the bonding accuracy and stability will be affected, and deformation of the adhesive will make it difficult to adjust the measuring mirror. Summary of the Invention

[0003] This application provides a measuring mirror mechanism for wafer laser positioning and a method for adjusting the measuring mirror mechanism, which can adjust and calibrate the measuring mirror in real time.

[0004] In a first aspect, embodiments of this application provide a measuring mirror mechanism for wafer laser positioning, comprising: a mounting plate having a mounting surface; a measuring mirror disposed on the mounting surface, the measuring mirror having a reflective surface for reflecting laser light; a vertical adjustment connector including a vertical limiting portion and a vertical connecting portion; the vertical connecting portion passing through the measuring mirror and movably connected to the mounting plate along a direction perpendicular to the mounting surface to adjust the distance between the vertical limiting portion and the mounting surface; a vertical reset member disposed between the measuring mirror and the mounting surface, the vertical reset member applying a force to the measuring mirror to move the measuring mirror away from the mounting surface and abut against the vertical limiting portion; and at least one positioning support member clamped between the mounting plate and the measuring mirror for fixing the relative position of the mounting plate and the measuring mirror.

[0005] According to an embodiment of the first aspect of this application, at least a portion of the positioning support is embedded in the mounting surface, and / or at least a portion of the positioning support is embedded in the measuring mirror for fixing the relative positions of the mounting plate and the measuring mirror along a direction parallel to the mounting surface.

[0006] According to an embodiment of the first aspect of this application, the mounting plate further includes a positioning support mounting portion, which protrudes from the mounting surface; the positioning support mounting portion is located on the side of the measuring mirror opposite to the reflecting surface; at least one positioning support is disposed between the measuring mirror and the positioning support mounting portion, at least a portion of the positioning support is embedded in the positioning support mounting portion, and / or, at least a portion of the positioning support is embedded in the measuring mirror, for fixing the relative position of the mounting plate and the measuring mirror in a direction perpendicular to the mounting surface.

[0007] According to an embodiment of the first aspect of this application, the measuring mirror has a through hole, the vertical connecting part passes through the through hole and is threadedly connected to the mounting plate; the vertical reset member is sleeved on the vertical connecting part, the mounting plate has a clearance space on the side facing the measuring mirror, and / or, the measuring mirror has a clearance space on the side facing the mounting plate; at least a portion of the vertical reset member is located in the clearance space.

[0008] According to an embodiment of the first aspect of this application, the vertical reset member includes one of a column spring, a disc spring, and a rubber pad.

[0009] According to an embodiment of the first aspect of this application, the number of vertical adjustment connectors is at least three; on the mounting surface, the centers of the orthographic projections of the at least three vertical adjustment connectors are not collinear.

[0010] According to an embodiment of the first aspect of this application, the measuring mirror includes a first sub-mirror and a second sub-mirror, wherein the reflecting surface of the first sub-mirror is perpendicular to the reflecting surface of the second sub-mirror.

[0011] According to an embodiment of the first aspect of this application, the mounting plate further includes a lateral adjustment mounting portion, which protrudes from the mounting surface; the lateral adjustment mounting portion is located on the side of the measuring mirror opposite to the reflecting surface; the measuring mirror mechanism for wafer laser positioning further includes a lateral adjustment connector and a lateral reset member; the lateral adjustment connector includes a lateral limiting portion and a lateral connecting portion; along the direction perpendicular to the reflecting surface, the lateral connecting portion passes through the lateral adjustment mounting portion, and the lateral connecting portion is movably connected to the measuring mirror to adjust the distance between the lateral limiting portion and the measuring mirror; at least a portion of the lateral limiting portion is located on the side of the lateral adjustment mounting portion away from the measuring mirror; the lateral reset member is disposed between the measuring mirror and the lateral adjustment mounting portion, and the lateral reset member applies a force to the lateral adjustment mounting portion to move the lateral adjustment mounting portion away from the measuring mirror and abut against the lateral limiting portion.

[0012] According to an embodiment of the first aspect of this application, the lateral adjustment mounting part is provided with a through hole, and the lateral connecting part passes through the through hole; the measuring mirror is provided with a hollow part, and at least a portion of the lateral connecting part passes through the hollow part; the measuring mirror mechanism for wafer laser positioning further includes a limiting connector, which is disposed in the hollow part and threadedly connected to the lateral connecting part; and the lateral reset part is sleeved on the lateral connecting part.

[0013] According to an embodiment of the first aspect of this application, the lateral reset member includes one of a column spring, a disc spring, and a rubber pad.

[0014] In a second aspect, a calibration method for a measuring mirror mechanism is provided, using the measuring mirror mechanism for wafer laser positioning as described in the first aspect of this application; the calibration method for the measuring mirror mechanism includes: irradiating the reflective surface of the measuring mirror with a laser and obtaining detection parameters of the reflected laser, the detection parameters including intensity information of the detected reflected laser; adjusting the vertical calibration connector to make the vertical calibration connector and the mounting plate move relative to each other until the detection parameters are within a preset parameter range.

[0015] According to an embodiment of the second aspect of this application, the measuring mirror includes a first sub-mirror and a second sub-mirror; irradiating the reflective surface of the measuring mirror with a laser and obtaining detection parameters of the reflected laser, the detection parameters including intensity information of the detected reflected laser, includes: irradiating the reflective surface of the first sub-mirror with a first laser along a first direction to obtain a first detection parameter of the reflected first laser, the first detection parameter including intensity information of the reflected first laser along a direction perpendicular to the mounting surface; irradiating the reflective surface of the second sub-mirror with a second laser along a second direction to obtain a second detection parameter of the reflected second laser, the second detection parameter including intensity information of the reflected second laser along a direction perpendicular to the mounting surface; the first direction and the second direction are perpendicular; adjusting the vertical adjustment connector to cause relative movement between the vertical adjustment connector and the mounting plate until the detection parameters are within a preset parameter range, includes: adjusting the vertical adjustment connector connected to the first sub-mirror to cause relative movement between the first sub-mirror and the mounting plate until the first detection parameter is within a preset parameter range; adjusting the vertical adjustment connector connected to the second sub-mirror to cause relative movement between the second sub-mirror and the mounting plate until the second detection parameter is within a preset parameter range.

[0016] According to an embodiment of the second aspect of this application, the mounting plate further includes a lateral adjustment mounting portion, which protrudes from the mounting surface; the lateral adjustment mounting portion is located on the side of the measuring mirror opposite to the reflecting surface; the measuring mirror mechanism for wafer laser positioning further includes a lateral adjustment connector and a lateral reset member; the lateral adjustment connector includes a lateral limiting portion and a lateral connecting portion; along the direction perpendicular to the reflecting surface, the lateral connecting portion passes through the lateral adjustment mounting portion, and the lateral connecting portion is movably connected to the measuring mirror to adjust the distance between the lateral limiting portion and the measuring mirror; at least a portion of the lateral limiting portion is located on the side of the lateral adjustment mounting portion away from the measuring mirror; the lateral reset member is disposed between the measuring mirror and the lateral adjustment mounting portion, and the lateral reset member applies a force to the lateral adjustment mounting portion to move the lateral adjustment mounting portion away from the measuring mirror and abut against the lateral limiting portion; the laser irradiates the reflecting surface of the measuring mirror and obtains a reflection. The detection parameters of the reflected laser include the intensity information of the detected reflected laser, and further include: irradiating the reflecting surface of the first sub-mirror with the first laser along a first direction to obtain a third detection parameter of the reflected first laser, the third detection parameter including the intensity information of the reflected first laser along the direction parallel to the mounting surface; irradiating the reflecting surface of the second sub-mirror with the second laser along a second direction to obtain a fourth detection parameter of the reflected second laser, the fourth detection parameter including the intensity information of the reflected second laser along the direction parallel to the mounting surface; the adjustment method of the measuring mirror mechanism further includes: adjusting the lateral adjustment connector connected to the first sub-mirror to make the lateral adjustment connector and the first sub-mirror move relative to each other, and / or adjusting the lateral adjustment connector connected to the second sub-mirror to make the lateral adjustment connector and the second sub-mirror move relative to each other, until the third detection parameter and the fourth detection parameter are both within the preset parameter range.

[0017] In the measuring mirror mechanism and adjustment method for wafer laser positioning provided in this application embodiment, the measuring mirror is disposed on the mounting surface of the mounting plate. The vertical connecting part of the vertical adjustment connector passes through the measuring mirror and connects to the mounting plate, and abuts against the vertical limiting part. The positioning support is clamped between the mounting plate and the measuring mirror, which can fix the relative position of the mounting plate and the measuring mirror. When the reflective surface of the measuring mirror is not perpendicular to the mounting surface of the mounting plate, the vertical adjustment connector can be adjusted to allow relative movement between the vertical adjustment connector and the mounting plate. Under the force of the vertical reset member disposed between the measuring mirror and the mounting surface, the measuring mirror and the vertical limiting part remain abutted, thereby adjusting the distance between the measuring mirror and the mounting surface. In this process, the positioning support can serve as a fulcrum for adjusting the measuring mirror. By adjusting the distance between the measuring mirror and the mounting surface at the point of engagement with the vertical adjustment connector, the attitude of the measuring mirror relative to the mounting surface can be adjusted more accurately and reliably, making the reflective surface perpendicular to the mounting surface. In this embodiment, the measuring mirror and the mounting plate are non-adhesive, which reduces the impact on the inspection or processing of semiconductor wafers in a hollow environment. The reflective surface of the measuring mirror and the mounting surface of the mounting plate can be adjusted in real time to keep them perpendicular. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a measuring mirror mechanism in related technologies.

[0020] Figure 2 This is a schematic diagram of a measuring mirror mechanism for wafer laser positioning according to an embodiment of this application.

[0021] Figure 3 This is a schematic diagram of a measuring mirror mechanism for wafer laser positioning according to an embodiment of this application, along the direction perpendicular to the mounting surface.

[0022] Figure 4 for Figure 3 A cross-sectional view of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application in section AA.

[0023] Figure 5 This is another schematic diagram of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application.

[0024] Figure 6This is a schematic diagram of another structure of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application, along the direction perpendicular to the mounting surface.

[0025] Figure 7 for Figure 6 A cross-sectional view of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application in section BB.

[0026] Figure 8 for Figure 6 A cross-sectional view of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application in section BB.

[0027] Figure 9 This is a schematic diagram of another structure of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application, along the direction perpendicular to the mounting surface.

[0028] Figure 10 This is another schematic diagram of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application.

[0029] Figure 11 This is another schematic diagram of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application.

[0030] Figure 12 This is a schematic diagram of another structure of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application, along the direction perpendicular to the mounting surface.

[0031] Figure 13 for Figure 12 A cross-sectional view of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application in the CC section.

[0032] Figure 14 This is a schematic flowchart illustrating a calibration method for the measuring mirror mechanism according to an embodiment of this application.

[0033] Figure 15 This is a schematic diagram showing an arrangement of the laser and the measuring mirror mechanism for wafer laser positioning in the calibration method of the measuring mirror mechanism according to an embodiment of this application.

[0034] Figure label:

[0035] 1. Mounting plate; 11. Mounting surface; 12. Positioning support mounting part; 13. Lateral adjustment mounting part;

[0036] 2. Measuring mirror; 2a. First sub-mirror; 2b. Second sub-mirror; 21. Reflecting surface;

[0037] 3. Vertical adjustment connector; 31. Vertical connection part; 32. Vertical limiting part;

[0038] 41. Vertical reset component; 42. Horizontal reset component;

[0039] 5. Positioning support components;

[0040] 6. Lateral adjustment connector; 61. Lateral connection part; 62. Lateral limiting part;

[0041] 7. Limiting connector;

[0042] X, first direction; Y, second direction; R1, first laser; R2, second laser. Detailed Implementation

[0043] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description in order to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples thereof.

[0044] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The embodiments will now be described in detail with reference to the accompanying drawings.

[0045] Relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0046] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0047] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0048] It should be understood that in the embodiments of this application, "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean that B is determined solely based on A; B can also be determined based on A and / or other information.

[0049] The applicant discovered that during the production and testing of semiconductor wafers, when using orthogonal laser positioning (XYstage laser positioning) to position the moving stage in real time, a measuring mirror is mounted on a mounting plate, which is then installed on the moving mechanism of the stage (typically using an orthogonal method to drive the mounting plate's movement). Please refer to [link to relevant documentation]. Figure 1 Under the premise of ensuring that the reflecting surface of the measuring mirror is perpendicular to the mounting surface of the mounting plate, the measuring mirror and the mounting plate are then fixed by adhesive bonding. Considering that it is usually used in a vacuum environment, the physicochemical properties of the adhesive (such as solidification rate, volatility, shrinkage, etc.) may affect the bonding efficiency, bonding accuracy, and detection accuracy. Moreover, once the adhesive solidifies and deforms, it is difficult to adjust the orthogonality between the measuring mirror and the mounting plate.

[0050] Based on the above analysis, embodiments of this application provide a measuring mirror mechanism for wafer laser positioning and a method for adjusting the measuring mirror mechanism. The measuring mirror mechanism for wafer laser positioning includes a mounting plate, a measuring mirror, a vertical adjustment connector, a vertical reset component, and at least one positioning support component. The measuring mirror is disposed on the mounting surface of the mounting plate. The vertical connecting portion of the vertical adjustment connector passes through the measuring mirror and connects to the mounting plate, abutting against a vertical limiting portion. The positioning support component is sandwiched between the mounting plate and the measuring mirror, fixing the relative position of the mounting plate and the measuring mirror. When the reflective surface of the measuring mirror is not perpendicular to the mounting surface of the mounting plate, the vertical adjustment connector can be adjusted, causing relative movement between the vertical adjustment connector and the mounting plate. Under the force of the vertical reset component disposed between the measuring mirror and the mounting surface, the measuring mirror remains abutting against the vertical limiting portion, thereby adjusting the distance between the measuring mirror and the mounting surface. During this process, the positioning support can serve as a fulcrum for adjusting the measuring mirror. At the vertical adjustment connector, the distance between the measuring mirror and the mounting surface is adjusted, thereby more accurately and reliably adjusting the orientation of the measuring mirror relative to the mounting surface, ensuring that the reflecting surface is perpendicular to the mounting surface. In this embodiment, the measuring mirror and the mounting plate are non-adhesive, reducing the impact on semiconductor wafer inspection or processing in a hollow environment. The reflecting surface of the measuring mirror and the mounting surface of the mounting plate can be adjusted in real time to maintain their perpendicularity.

[0051] Figure 2 This is a schematic diagram of a measuring mirror mechanism for wafer laser positioning according to an embodiment of this application. Figure 3 This is a schematic diagram of a measuring mirror mechanism for wafer laser positioning according to an embodiment of this application, along the direction perpendicular to the mounting surface. Figure 4 for Figure 3 A cross-sectional view of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application in section AA.

[0052] Please see Figures 2 to 4 This application provides a measuring mirror mechanism for wafer laser positioning, comprising: a mounting plate 1, a measuring mirror 2, a vertical adjustment connector 3, a vertical reset connector 41, and at least one positioning support 5. The mounting plate 1 has a mounting surface 11; the measuring mirror 2 is disposed on the mounting surface 11 and has a reflective surface 21 for reflecting laser light; the vertical adjustment connector 3 includes a vertical limiting portion 32 and a vertical connecting portion 31; the vertical connecting portion 31 penetrates the measuring mirror 2 along the direction perpendicular to the mounting surface 11, and is movably connected to the mounting plate 1 to adjust the distance between the vertical limiting portion 32 and the mounting surface 11; the vertical reset connector 41 is disposed between the measuring mirror 2 and the mounting surface 11, and applies a force to the measuring mirror 2 to move the measuring mirror 2 away from the mounting surface 11 and abut against the vertical limiting portion 32; the positioning support 5 is clamped between the mounting plate 1 and the measuring mirror 2 to fix the relative positions of the mounting plate 1 and the measuring mirror 2.

[0053] Mounting plate 1 serves as the mounting carrier for measuring mirror 2, and other components of this embodiment are also directly or indirectly connected to mounting plate 1. Measuring mirror 2 is disposed on mounting surface 11 of mounting plate 1. Ideally, reflective surface 21 should be perpendicular to mounting surface 11. If reflective surface 21 and mounting surface 11 are not perpendicular, they can be made perpendicular by adjusting some components of this embodiment. It should be noted that adjusting the orientation of reflective surface 21 relative to mounting surface 11 to make them perpendicular is equivalent to adjusting the vertical angle between reflective surface 21 and mounting surface 11, that is, the angle formed by the normal of reflective surface 21 and mounting surface 11.

[0054] The vertical adjustment connector 3 includes a vertical limiting part 32 and a vertical connecting part 31, which can be obtained by fixed connection or integral molding. The vertical connecting part 31 passes through the measuring mirror 2 and is connected to the mounting plate 1. The vertical reset member 41, which is disposed between the measuring mirror 2 and the mounting surface 11, applies a force to the mounting surface 11 and the measuring mirror 2, causing the measuring mirror 2 to tend to move away from the mounting surface 11. At least a portion of the vertical limiting part 32 is located on the side of the measuring mirror 2 away from the mounting plate 1, so that the measuring mirror 2 abuts against the vertical limiting part 32. Therefore, when the relative position of the vertical connecting part 31 and the mounting plate 1 remains unchanged, the measuring mirror 2 and the mounting plate 1 can be fixed. At the same time, the positioning support member 5, which is sandwiched between the mounting plate 1 and the measuring mirror 2, limits the relative movement of the mounting plate 1 and the measuring mirror 2, thereby further fixing the relative position of the mounting plate 1 and the measuring mirror 2. Since the use of adhesive is eliminated, the measuring mirror 2 and the mounting plate 1, which are fixed together in the measuring mirror mechanism for wafer laser positioning in this embodiment of the application, will have less impact on the outside world and lower requirements for the working process.

[0055] Furthermore, the vertical connecting part 31 is movably connected to the mounting plate 1. By moving the vertical connecting part 31 and the mounting plate 1 relative to each other, the distance between the vertical limiting part 32 and the mounting surface 11 can be adjusted. Since the vertical reset member 41 applies a force to the measuring mirror 2, keeping the measuring mirror 2 in contact with the vertical limiting part 32, when the distance between the vertical limiting part 32 and the mounting surface 11 is adjusted by moving the vertical connecting part 31 and the mounting plate 1 relative to each other, the distance between the measuring mirror 2 and the mounting surface 11 can be adjusted, thereby adjusting the posture of the measuring mirror 2 relative to the mounting surface 11. Therefore, when the reflecting surface 21 and the mounting surface 11 are not perpendicular, the posture of the measuring mirror 2 relative to the mounting plate 1 can be adjusted by adjusting the vertical adjustment connecting part 3, thereby making the reflecting surface 21 perpendicular to the mounting surface 11. Furthermore, the positioning support 5 can be regarded as the fulcrum between the measuring mirror 2 and the mounting surface 11. When adjusting the relative attitude of the reflecting surface 21 and the mounting surface 11 through the vertical adjustment connector 3, the positioning support 5, as the fulcrum, can make the adjustment between the reflecting surface 21 and the mounting surface 11 more precise and reliable.

[0056] Therefore, in this embodiment, the orthogonality between the reflecting surface 21 of the measuring mirror 2 and the mounting surface 11 of the mounting plate 1 can be detected in real time, and the attitude of the measuring mirror 2 relative to the mounting plate 1 can be adjusted in real time based on the detection result, so that the reflecting surface 21 and the mounting surface 11 remain orthogonal.

[0057] It is understandable that the specific position of the vertical reset component 41 between the mounting surface 11 and the measuring mirror 2 is not limited; it is only necessary to apply force to the measuring mirror 2 and the mounting plate 1.

[0058] Further reading Figures 2 to 4 At least a portion of the positioning support 5 is embedded in the mounting surface 11, and / or at least a portion of the positioning support 5 is embedded in the measuring mirror 2, for fixing the relative positions of the mounting plate 1 and the measuring mirror 2 along a direction parallel to the mounting surface 11.

[0059] A positioning support 5 is disposed between the measuring mirror 2 and the mounting surface 11. At least a portion of the positioning support 5 is embedded in the mounting surface 11, and / or at least a portion of the positioning support 5 is embedded in the measuring mirror 2, thereby fixing the relative position of the mounting plate 1 and the measuring mirror 2 along a direction parallel to the mounting surface 11. Furthermore, since the positioning support 5 is partially embedded in the mounting surface 11 and / or the measuring mirror 2, the measuring mirror 2 can be brought closer to the mounting surface 11 at the positioning support 5, reducing the influence of the positioning support on the adjustment range of the measuring mirror 2, and also enabling a more compact connection between the measuring mirror 2 and the mounting plate 1. Exemplarily, the positioning support 5 can be spherical, making the contact between the positioning support 5 and the mounting plate 1 and the measuring mirror 2 smoother, thereby improving the accuracy and reliability of the adjustment between the reflective surface 21 and the mounting surface 11.

[0060] Figure 5 This is another schematic diagram of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application. Figure 6 This is a schematic diagram of another structure of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application, along the direction perpendicular to the mounting surface. Figure 7 for Figure 6 A cross-sectional view of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application in section BB.

[0061] Further, please refer to Figures 5 to 7 The mounting plate 1 also includes a positioning support mounting portion 12, which protrudes from the mounting surface 11. The positioning support mounting portion 12 is located on the side of the measuring mirror 2 opposite to the reflecting surface 21. At least one positioning support 5 is disposed between the measuring mirror 2 and the positioning support mounting portion 12, and at least a portion of the positioning support 5 is embedded in the positioning support mounting portion 12, and / or at least a portion of the positioning support 5 is embedded in the measuring mirror 2, for fixing the relative position of the mounting plate 1 and the measuring mirror 2 in a direction perpendicular to the mounting surface 11.

[0062] The positioning support mounting part 12 protrudes from the mounting surface 11, with one side of the positioning support mounting part 12 facing the side of the measuring mirror 2 opposite to the reflecting surface 21. The positioning support 5 can also be disposed between the positioning support mounting part 12 and the measuring mirror 2. At least a portion of the positioning support 5 is embedded in the positioning support mounting part 12, and / or, at least a portion of the positioning support 5 is embedded in the measuring mirror 2 to fix the relative position of the mounting plate 1 and the measuring mirror 2 in a direction perpendicular to the mounting surface 11.

[0063] When there is at least one positioning support, positioning supports 5 can be provided simultaneously between the measuring mirror 2 and the mounting surface 11, and between the positioning support mounting part 12 and the measuring mirror 2, thereby fixing the relative position of the mounting plate 1 and the measuring mirror 2.

[0064] Figure 8 for Figure 6 A cross-sectional view of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application in section BB.

[0065] Further, please refer to Figure 8 The measuring mirror 2 has a through hole, the vertical connecting part 31 passes through the through hole and is threadedly connected to the mounting plate 1; the vertical reset member 41 is sleeved on the vertical connecting part 31, the mounting plate 1 has a clearance space on the side facing the measuring mirror 2, and / or the measuring mirror 2 has a clearance space on the side facing the mounting plate 1; at least a part of the vertical reset member 41 is located in the clearance space.

[0066] The vertical connecting part 31 passes through the through hole of the measuring mirror 2 and is threadedly connected to the mounting plate 1. By rotating the vertical adjustment connector 3, the mounting plate 1 and the vertical connecting part 31 move relative to each other, thereby adjusting the distance between the vertical limiting part 32 and the mounting surface 11, and further adjusting the distance between the measuring mirror 2 and the mounting surface 11.

[0067] The vertical reset member 41 can be in the form of a spring, sleeved on the vertical connecting part 31. One end of the vertical reset member 41 abuts against the mounting plate 1, and the other end abuts against the measuring mirror 2. The vertical reset member 41 is in a compressed state, thereby applying a force to the measuring mirror 2. The mounting plate 1 has a clearance space on the side facing the measuring mirror 2, and / or the measuring mirror 2 has a clearance space on the side facing the mounting plate 1. At least a portion of the vertical reset member 41 is located in the clearance space, which can reduce the influence of the vertical reset member 41 on the minimum distance between the measuring mirror 2 and the mounting surface 11, thereby making the structure of the measuring mirror mechanism for wafer laser positioning in this embodiment of the application more compact, and thus reducing the space occupied.

[0068] Further reading Figure 8 The vertical reset member 41 includes one of a column spring, a disc spring, and a rubber pad. It is understood that the vertical reset member 41 is in a compressed state, so it can exert a force on the measuring mirror 2, keeping the measuring mirror 2 in contact with the vertical limiting part 32. For ease of explanation, in this embodiment, the vertical reset member 41 is in the form of a disc spring. Along the extending direction of the vertical connecting part 31, the vertical reset member 41 has a smaller thickness, occupying less space between the measuring mirror 2 and the mounting plate 1, thereby reducing the impact on the adjustable range of the vertical adjustment connector 3.

[0069] Figure 9 This is a schematic diagram of another structure of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application, along the direction perpendicular to the mounting surface.

[0070] Further, please refer to Figure 9 The number of vertical adjustment connectors 3 is at least three; on the mounting surface 11, the centers of the orthographic projections of at least three vertical adjustment connectors 3 are not collinear.

[0071] By adjusting a certain vertical adjustment connector 3, the distance between the measuring mirror 2 and the mounting surface 11 at that vertical adjustment connector 3 can be adjusted. At least three vertical adjustment connectors 3 represent at least three points where the distance between the measuring mirror 2 and the mounting surface 11 can be adjusted. The centers of the orthographic projections of the at least three vertical adjustment connectors 3 onto the mounting surface 11 are not collinear, so at least three non-collinear positions can be adjusted to ensure the distance between the measuring mirror 2 and the mounting surface 11 is adjusted. Since the three non-collinear points can define a plane, the orientation of the side of the measuring mirror 2 facing the mounting surface 11 can be precisely adjusted relative to the mounting surface 11. Given a fixed shape for the measuring mirror 2, the orientation of the reflecting surface 21 relative to the mounting surface 11 can be precisely adjusted so that the reflecting surface 21 is perpendicular to the mounting surface 11.

[0072] Figure 10 This is another schematic diagram of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application.

[0073] Further, please refer to Figure 10 The measuring mirror 2 includes a first sub-mirror 2a and a second sub-mirror 2b, and the reflecting surface 21 of the first sub-mirror 2a is perpendicular to the reflecting surface 21 of the second sub-mirror 2b.

[0074] The first sub-mirror 2a and the second sub-mirror 2b can have the same structure. The difference lies in the orientation of the reflecting surface 21 of the first sub-mirror 2a and the second sub-mirror 2b. Considering that the measuring mirror mechanism for wafer laser positioning in this embodiment is used for orthogonal laser positioning, the reflecting surface 21 of the first sub-mirror 2a is perpendicular to the reflecting surface 21 of the second sub-mirror 2b. Ideally, the reflecting surface 21 of the first sub-mirror 2a is perpendicular to the reflecting surface 21 of the second sub-mirror 2b. If the reflecting surface 21 of the first sub-mirror 2a is not perpendicular to the reflecting surface 21 of the second sub-mirror 2b, this can be achieved by adjusting some components of this embodiment to make the reflecting surface 21 of the first sub-mirror 2a perpendicular to the reflecting surface 21 of the second sub-mirror 2b. It should be noted that before adjusting the orientation of the first sub-mirror 2a and the second sub-mirror 2b so that their reflecting surfaces 21 are perpendicular, the reflecting surface 21 of the first sub-mirror 2a should already be perpendicular to the mounting surface 11, and the reflecting surface 21 of the second sub-mirror 2b should already be perpendicular to the mounting surface 11. Therefore, adjusting the orientation of the first sub-mirror 2a and the second sub-mirror 2b is equivalent to adjusting the angle between the first sub-mirror 2a and the second sub-mirror 2b along the direction parallel to the mounting surface 11, that is, the lateral angle between the reflecting surface 21 of the first sub-mirror 2a and the reflecting surface 21 of the second sub-mirror 2b. Figure 11 This is another schematic diagram of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application. Figure 12 This is a schematic diagram of another structure of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application, along the direction perpendicular to the mounting surface. Figure 13 for Figure 12A cross-sectional view of the measuring mirror mechanism for wafer laser positioning according to an embodiment of this application in the CC section.

[0075] Further, please refer to Figures 11 to 13 The mounting plate 1 also includes a lateral adjustment mounting part 13, which protrudes from the mounting surface 11. The lateral adjustment mounting part 13 is located on the side of the measuring mirror 2 opposite to the reflecting surface 21. The measuring mirror mechanism for wafer laser positioning also includes a lateral adjustment connector 6 and a lateral reset member 42. The lateral adjustment connector 6 includes a lateral limiting part 62 and a lateral connecting part 61. Along the direction perpendicular to the reflecting surface 21, the lateral connecting part 61 passes through the lateral adjustment mounting part 13 and is movably connected to the measuring mirror 2 to adjust the distance between the lateral limiting part 62 and the measuring mirror 2. The lateral reset member 42 is disposed between the measuring mirror 2 and the lateral adjustment mounting part 13. The lateral reset member 42 applies a force to the lateral adjustment mounting part 13 to move the lateral adjustment mounting part 13 away from the measuring mirror 2 and abut against the lateral adjustment mounting part 13.

[0076] Since the first sub-mirror 2a and the second sub-mirror 2b have the same structure, the first sub-mirror 2a will be used as an example in the embodiments of this application.

[0077] The lateral adjustment mounting portion 13 protrudes from the mounting surface 11, with one side surface of the lateral adjustment mounting portion 13 facing the side of the measuring mirror 2 opposite to the reflecting surface 21. The lateral adjustment connector 6 includes a lateral limiting portion 62 and a lateral connecting portion 61, and can be obtained by fixed connection or integral molding. The lateral connecting portion 61 passes through the lateral adjustment mounting portion 13 and is connected to the measuring mirror 2. The lateral reset member 42, provided between the measuring mirror 2 and the lateral adjustment mounting portion 13, applies a force to the measuring mirror 2 and the lateral adjustment mounting portion 13, causing the measuring mirror 2 to tend to move away from the lateral adjustment mounting portion 13. Since at least a portion of the lateral limiting portion 62 is located on the side of the lateral adjustment mounting portion 13 away from the mounting plate 1, the lateral adjustment mounting portion 13 abuts against the lateral limiting portion 62. Therefore, when the relative position of the lateral connecting portion 61 and the measuring mirror 2 remains unchanged, the measuring mirror 2 and the lateral adjustment mounting portion 13 can be fixed.

[0078] The lateral connecting part 61 is movably connected to the measuring mirror 2. By moving the lateral connecting part 61 and the measuring mirror 2 relative to each other, the distance between the lateral limiting part 62 and the measuring mirror 2 can be adjusted. Since the lateral reset member 42 applies a force to the measuring mirror 2 and the lateral adjustment member mounting part 13, keeping the lateral adjustment member mounting part 13 in contact with the lateral limiting part 62, when the distance between the lateral limiting part 62 and the measuring mirror 2 is adjusted by moving the lateral connecting part 61 and the measuring mirror 2 relative to each other, the distance between the measuring mirror 2 and the lateral adjustment member mounting part 13 can be adjusted, thereby adjusting the posture of the measuring mirror 2 relative to the lateral adjustment member mounting part 13. Therefore, provided that the reflecting surface 21 and the mounting surface 11 are perpendicular, the posture of the measuring mirror 2 relative to the mounting plate 1 can be adjusted by adjusting the lateral adjustment connecting part 6. Considering that the first sub-mirror 2a and the second sub-mirror 2b have the same structure, by adjusting the lateral adjustment connector 6 corresponding to the first sub-mirror 2a and / or adjusting the lateral adjustment connector 6 corresponding to the second sub-mirror 2b, the attitude of the reflecting surface 21 of the first sub-mirror 2a relative to the mounting surface 11 can be adjusted, and / or the attitude of the reflecting surface 21 of the second sub-mirror 2b relative to the mounting surface 11 can be adjusted, so that the reflecting surface 21 of the first sub-mirror 2a is perpendicular to the reflecting surface 21 of the second sub-mirror 2b, that is, the lateral angle between the reflecting surface 21 of the first sub-mirror 2a and the reflecting surface 21 of the second sub-mirror 2b is adjusted to make the angle equal to 90°.

[0079] In this embodiment, the orthogonality between the reflecting surfaces 21 of the two measuring mirrors 2 (first sub-mirror 2a and second sub-mirror 2b) can be detected in real time, and the orientation of the reflecting surfaces 21 of the two measuring mirrors 2 can be adjusted in real time based on the detection results, so that the reflecting surfaces 21 of the two measuring mirrors 2 remain orthogonal, which is suitable for orthogonal laser positioning.

[0080] It should be noted that when at least one positioning support 5 is disposed between the measuring mirror 2 and the positioning support mounting part 12, during the process of adjusting the lateral adjustment connector 6 to make the reflecting surface 21 of the first sub-mirror 2a perpendicular to the reflecting surface 21 of the second sub-mirror 2b, the positioning support 5 can be regarded as a fulcrum, so that the vertical angle adjustment of the reflecting surface 21 of the first sub-mirror 2a and the reflecting surface 21 of the second sub-mirror 2b is more accurate and reliable.

[0081] Further reading Figures 11 to 13 The lateral adjustment mounting part 13 is provided with a through hole, and the lateral connecting part 61 passes through the through hole; the measuring mirror 2 is provided with a hollow part, and at least a part of the lateral connecting part 61 passes through the hollow part; the measuring mirror mechanism for wafer laser positioning also includes a limiting connecting part 7, which is disposed in the hollow part and is threadedly connected to the lateral connecting part 61; the lateral reset part 42 is sleeved on the lateral connecting part 61.

[0082] The lateral connecting part 61 passes through the through hole of the lateral adjusting member mounting part 13 and is threadedly connected to the limiting connecting part 7 located in the hollow part. By rotating the lateral adjusting connecting part 6, the measuring mirror 2 and the lateral connecting part 61 move relative to each other, thereby adjusting the distance between the lateral limiting part 62 and the measuring mirror 2, and further adjusting the distance between the measuring mirror 2 and the lateral adjusting member mounting part 13. Since the measuring mirror 2 is made of glass, it is difficult to make threads on the measuring mirror 2. The limiting connecting part 7 is used to achieve an indirect connection between the measuring mirror 2 and the lateral connecting part 61.

[0083] The transverse reset member 42 can be in the form of a spring and is sleeved on the transverse connecting part 61. One end of the transverse reset member 42 abuts against the transverse adjusting member mounting part 13, and the other end abuts against the measuring mirror 2. The transverse reset member 42 is in a compressed state, thereby applying a force to the measuring mirror 2 and the transverse adjusting member mounting part 13, so that the transverse limiting part 62 abuts against the transverse adjusting member mounting part 13, and the limiting connecting member 7 abuts against the inner wall of the hollow part.

[0084] Further reading Figure 13 The lateral reset member 42 includes one of a column spring, a disc spring, and a rubber pad. It is understood that the lateral reset member 42 is in a compressed state, so it can exert a force on the measuring mirror 2 and the lateral adjustment mounting portion 13, keeping the lateral adjustment mounting portion 13 in contact with the lateral limiting portion 62. For ease of explanation, in this embodiment, the lateral reset member 42 is in the form of a disc spring. Along the extending direction of the lateral connecting portion 61, the lateral reset member 42 has a smaller thickness, occupying less space between the measuring mirror 2 and the mounting plate 1, thereby reducing the impact on the adjustable range of the lateral adjustment connector 6.

[0085] Figure 14 This is a schematic flowchart illustrating a calibration method for the measuring mirror mechanism according to an embodiment of this application. Figure 15 This is a schematic diagram showing an arrangement of the laser and the measuring mirror mechanism for wafer laser positioning in the calibration method of the measuring mirror mechanism according to an embodiment of this application.

[0086] Please see Figure 14 and Figure 15 This application also provides a calibration method for a measuring mirror mechanism, using the measuring mirror mechanism for wafer laser positioning from the foregoing embodiments of this application. It is understood that, when using the measuring mirror mechanism for wafer laser positioning from the foregoing embodiments of this application, the calibration method of this application can be used to calibrate the measuring mirror mechanism for wafer laser positioning from the foregoing embodiments of this application, both before and during laser positioning.

[0087] Specifically, the calibration method of the measuring mirror mechanism in this application embodiment includes:

[0088] Step S1: Illuminate the reflective surface 21 of the measuring mirror 2 with a laser and obtain the detection parameters.

[0089] The laser can be any laser used in the laser positioning process. For example, in orthogonal laser positioning, the laser can be either an X-axis laser or a Y-axis laser. Ideally, the reflecting surface 21 of the measuring mirror 2 is perpendicular to the mounting surface 11, and the reflecting surface 21 is perpendicular to the direction of laser illumination. The reflected laser is detected by the detector, and a preset parameter range containing the intensity of the reflected laser is obtained. In reality, the obtained detection parameters include the intensity of the reflected laser. Considering that the reflecting surface 21 of the measuring mirror 2 may not be perpendicular to the mounting surface 11, the reflected laser may be deflected, the amount of laser that can be detected by the detector may decrease, and the obtained detection parameters may be less than the minimum value of the preset parameter range.

[0090] Step S2: Adjust the vertical alignment connector 3.

[0091] The vertical adjustment connector 3 and the mounting plate 1 are moved relative to each other, thereby adjusting the distance between the measuring mirror 2 and the mounting surface 11, and thus adjusting the attitude of the measuring mirror 2 relative to the mounting plate 1, that is, adjusting the attitude of the reflecting surface 21 relative to the mounting surface 11.

[0092] During this process, detection parameters are acquired in real time until the detection parameters are within the preset parameter range. The relative attitude of the reflective surface 21 and the mounting surface 11 in the current state is the same as that in the ideal state, that is, the reflective surface 21 is perpendicular to the mounting surface 11 in the current state.

[0093] Further reading Figure 14 and Figure 15 The measuring mirror 2 includes a first sub-mirror 2a and a second sub-mirror 2b.

[0094] Step S1 includes:

[0095] Step S11: Illuminate the reflective surface 21 of the first sub-mirror 2a with the first laser R1 and obtain the first detection parameters.

[0096] The first laser R1 is directed along the first direction X to illuminate the reflecting surface 21 of the first sub-mirror 2a. First detection parameters of the reflected first laser R1 are obtained, including intensity information of the reflected first laser R1 along the direction perpendicular to the mounting surface 11. Provided that the first direction X is parallel to the mounting surface 11, the first detection parameters can be used to determine whether the reflecting surface 21 of the first sub-mirror 2a is perpendicular to the mounting surface 11. When the reflecting surface 21 of the first sub-mirror 2a is not perpendicular to the mounting surface 11, the incident and reflected rays of the first laser R1 will form an acute angle in the direction perpendicular to the mounting surface 11; that is, the angle between the reflecting surface 21 and the vertical direction of the mounting surface 11 is acute.

[0097] Step S12: Illuminate the reflective surface 21 of the second sub-mirror 2b with the second laser R2 and obtain the second detection parameters.

[0098] The second laser R2 is directed along the second direction Y to illuminate the reflecting surface 21 of the second sub-mirror 2b. A second detection parameter of the reflected second laser R2 is obtained, containing intensity information of the reflected second laser R2 along the direction parallel to the mounting surface 11. Provided the second direction is parallel to the mounting surface 11, the second detection parameter can be used to determine whether the reflecting surface 21 of the second sub-mirror 2b is perpendicular to the mounting surface 11. When the reflecting surface 21 of the second sub-mirror 2b is not perpendicular to the mounting surface 11, the incident and reflected rays of the second laser R2 will form an acute angle in the direction perpendicular to the mounting surface 11; that is, the angle between the reflecting surface 21 and the vertical direction of the mounting surface 11 is acute.

[0099] In this embodiment, the first direction X and the second direction Y are perpendicular, and the first laser R1 and the second laser R2 can use laser sources with orthogonal laser positioning.

[0100] Step S2 includes:

[0101] Step S21: Adjust the vertical adjustment connector 3 connected to the first sub-mirror 2a.

[0102] The vertical adjustment connector 3 and the mounting plate 1 are moved relative to each other, thereby adjusting the distance between the first sub-mirror 2a and the mounting surface 11, and thus adjusting the attitude of the first sub-mirror 2a relative to the mounting plate 1, that is, adjusting the attitude of the reflecting surface 21 of the first sub-mirror 2a relative to the mounting surface 11.

[0103] During this process, the first detection parameter is acquired in real time until it falls within the preset parameter range. The relative orientation of the reflecting surface 21 and mounting surface 11 of the first sub-mirror 2a in the current state is the same as that in the ideal state. At this time, the angle between the reflecting surface 21 and mounting surface 11 of the first sub-mirror 2a in the current state is 90°, and they are perpendicular.

[0104] Step S22: Adjust the vertical adjustment connector 3 connected to the second sub-mirror 2b.

[0105] The vertical adjustment connector 3 and the mounting plate 1 are moved relative to each other, thereby adjusting the distance between the second sub-mirror 2b and the mounting surface 11, and thus adjusting the attitude of the second sub-mirror 2b relative to the mounting plate 1, that is, adjusting the attitude of the reflecting surface 21 of the second sub-mirror 2b relative to the mounting surface 11.

[0106] During this process, the second detection parameter is acquired in real time until it falls within the preset parameter range. The relative orientation of the reflecting surface 21 and mounting surface 11 of the second sub-mirror 2b in the current state is the same as that in the ideal state. At this time, the angle between the reflecting surface 21 and mounting surface 11 of the second sub-mirror 2b in the current state is 90°, and they are perpendicular.

[0107] Further reading Figure 14 and Figure 15 The mounting plate 1 also includes a lateral adjustment mounting part 13, which protrudes from the mounting surface 11. The lateral adjustment mounting part 13 is located on the side of the measuring mirror 2 opposite to the reflecting surface 21. The measuring mirror mechanism for wafer laser positioning also includes a lateral adjustment connector 6 and a lateral reset member 42. The lateral adjustment connector 6 includes a lateral limiting part 62 and a lateral connecting part 61. Along the direction perpendicular to the reflecting surface 21, the lateral connecting part 61 passes through the lateral adjustment mounting part 13 and is movably connected to the measuring mirror 2 to adjust the distance between the lateral limiting part 62 and the measuring mirror 2. The lateral reset member 42 is disposed between the measuring mirror 2 and the lateral adjustment mounting part 13. The lateral reset member 42 applies a force to the lateral adjustment mounting part 13 to move the lateral adjustment mounting part 13 away from the measuring mirror 2 and abut against the lateral limiting part 62.

[0108] Step S1 also includes:

[0109] Step S13: Obtain the third detection parameter.

[0110] The first laser R1 is directed along the first direction X to illuminate the reflecting surface 21 of the first sub-mirror 2a. A third detection parameter is obtained for the reflected first laser R1, which includes the intensity information of the reflected first laser R1 along the direction parallel to the mounting surface 11. Provided that the first direction X is parallel to the mounting surface 11, the third detection parameter can be used to determine whether the reflecting surface 21 of the first sub-mirror 2a and the incident direction (first direction X) of the first laser R1 are perpendicular. When the reflecting surface 21 of the first sub-mirror 2a and the incident direction of the first laser R1 are not perpendicular, the incident and reflected rays of the first laser R1 will form an acute angle along the direction parallel to the mounting surface 11; that is, the normal of the reflecting surface 21 of the first sub-mirror 2a forms an acute angle with the transverse angle of the first laser R1 relative to the mounting surface 11.

[0111] Step S14: Obtain the fourth detection parameter.

[0112] The second laser R2 is directed along the second direction Y to illuminate the reflecting surface 21 of the second sub-mirror 2b. A fourth detection parameter of the reflected second laser R2 is obtained, which includes the intensity information of the reflected second laser R2 along the direction parallel to the mounting surface 11. Provided that the second direction Y is parallel to the mounting surface 11, the fourth detection parameter can be used to determine whether the reflecting surface 21 of the second sub-mirror 2b and the incident direction (second direction Y) of the second laser R2 are perpendicular. When the reflecting surface 21 of the second sub-mirror 2b is not perpendicular to the incident direction of the second laser R2, the incident and reflected rays of the second laser R2 will form an acute angle in the direction parallel to the mounting surface 11; that is, the normal of the reflecting surface 21 of the second sub-mirror 2b forms an acute angle with the transverse angle of the second laser R2 relative to the mounting surface 11.

[0113] Considering that the incident direction of the first laser R1 is perpendicular to the incident direction of the second laser R2, when the reflecting surface 21 of the first sub-mirror 2a is perpendicular to the incident direction of the first laser R1, and the reflecting surface 21 of the second sub-mirror 2b is perpendicular to the incident direction of the second laser R2, the reflecting surface 21 of the first sub-mirror 2a and the reflecting surface 21 of the second sub-mirror 2b are perpendicular.

[0114] It is understandable that steps S11, S12, S13, and S14 can be performed simultaneously or at different times.

[0115] The calibration method for the measuring mirror mechanism in this application embodiment further includes:

[0116] Step S3: Adjust the lateral adjustment connector 6.

[0117] Adjust the lateral adjustment connector 6 connected to the first sub-mirror 2a so that the lateral adjustment connector 6 and the first sub-mirror 2a move relative to each other, and adjust the posture of the first sub-mirror 2a relative to the mounting surface 11, so as to adjust the posture of the reflecting surface 21 of the first sub-mirror 2a relative to the mounting surface 11. During this process, the reflecting surface 21 of the first sub-mirror 2a should be kept perpendicular to the mounting surface 11. If the reflecting surface 21 of the first sub-mirror 2a is not perpendicular to the mounting surface 11 after step S3, then repeat step S2.

[0118] And / or, adjust the lateral adjustment connector 6 connected to the second sub-mirror 2b so that the lateral adjustment connector 6 and the second sub-mirror 2b move relative to each other, adjust the attitude of the second sub-mirror 2b relative to the mounting surface 11, and adjust the attitude of the reflecting surface 21 of the second sub-mirror 2b relative to the mounting surface 11. During this process, the reflecting surface 21 of the second sub-mirror 2b should be kept perpendicular to the mounting surface 11. If the reflecting surface 21 of the second sub-mirror 2b is not perpendicular to the mounting surface 11 after step S3, then repeat step S2.

[0119] During the above adjustment process, the third and fourth detection parameters are acquired in real time until both are within the preset parameter range. This indicates that the reflecting surface 21 of the first sub-mirror 2a is perpendicular to the incident direction of the first laser R1, and the reflecting surface 21 of the second sub-mirror 2b is perpendicular to the incident direction of the second laser R2. Since the incident direction of the first laser R1 is perpendicular to the incident direction of the second laser R2, the reflecting surface 21 of the first sub-mirror 2a is perpendicular to the reflecting surface 21 of the second sub-mirror 2b.

[0120] In summary, this application provides a measuring mirror mechanism for wafer laser positioning and a method for adjusting the measuring mirror mechanism. The measuring mirror mechanism for wafer laser positioning includes a mounting plate, a measuring mirror, a vertical adjustment connector, a vertical reset component, and at least one positioning support component. The measuring mirror is disposed on the mounting surface of the mounting plate. The vertical connecting portion of the vertical adjustment connector passes through the measuring mirror and connects to the mounting plate, and abuts against the vertical limiting portion. The positioning support component is sandwiched between the mounting plate and the measuring mirror, which can fix the relative position of the mounting plate and the measuring mirror. When the reflective surface of the measuring mirror is not perpendicular to the mounting surface of the mounting plate, the vertical adjustment connector can be adjusted to allow relative movement between the vertical adjustment connector and the mounting plate. Under the force of the vertical reset component disposed between the measuring mirror and the mounting surface, the measuring mirror remains abutting against the vertical limiting portion, thereby adjusting the distance between the measuring mirror and the mounting surface. During this process, the positioning support can serve as a fulcrum for adjusting the measuring mirror. At the vertical adjustment connector, the distance between the measuring mirror and the mounting surface is adjusted, thereby more accurately and reliably adjusting the orientation of the measuring mirror relative to the mounting surface, ensuring that the reflecting surface is perpendicular to the mounting surface. In this embodiment, the measuring mirror and the mounting plate are non-adhesive, reducing the impact on semiconductor wafer inspection or processing in a hollow environment. The reflecting surface of the measuring mirror and the mounting surface of the mounting plate can be adjusted in real time to maintain their perpendicularity.

[0121] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A measuring mirror mechanism for wafer laser positioning, characterized in that, include: A mounting plate has a mounting surface, and the mounting plate includes a lateral adjustment mounting portion that protrudes from the mounting surface; A measuring mirror is disposed on the mounting surface, the measuring mirror having a reflective surface for reflecting laser light; the lateral adjustment mounting portion is located on the side of the measuring mirror opposite to the reflective surface; A vertical adjustment connector includes a vertical limiting part and a vertical connecting part; along the direction perpendicular to the mounting surface, the vertical connecting part passes through the measuring mirror and is movably connected to the mounting plate to adjust the distance between the vertical limiting part and the mounting surface; A vertical reset member is disposed between the measuring mirror and the mounting surface. The vertical reset member applies a force to the measuring mirror to move the measuring mirror away from the mounting surface and abut against the vertical limiting part. A positioning support is clamped between the mounting plate and the measuring mirror to fix the relative position of the mounting plate and the measuring mirror; A lateral adjustment connector is disposed between the lateral adjustment component mounting portion and the measuring mirror; the lateral adjustment connector includes a lateral limiting portion. A lateral reset member is disposed between the measuring mirror and the lateral adjustment member mounting part. The lateral reset member applies a force to the lateral adjustment member mounting part to move the lateral adjustment member mounting part away from the measuring mirror and abut against the lateral limiting part.

2. The measuring mirror mechanism for wafer laser positioning according to claim 1, characterized in that, At least a portion of the positioning support is embedded in the mounting surface, and / or at least a portion of the positioning support is embedded in the measuring mirror, for fixing the relative position of the mounting plate and the measuring mirror along a direction parallel to the mounting surface.

3. The measuring mirror mechanism for wafer laser positioning according to claim 1, characterized in that, The mounting plate further includes a positioning support mounting part, which protrudes from the mounting surface; the positioning support mounting part is located on the side of the measuring mirror opposite to the reflecting surface; At least one of the positioning supports is disposed between the measuring mirror and the positioning support mounting portion, at least a portion of the positioning support is embedded in the positioning support mounting portion, and / or at least a portion of the positioning support is embedded in the measuring mirror, for fixing the relative position of the mounting plate and the measuring mirror along a direction perpendicular to the mounting surface.

4. The measuring mirror mechanism for wafer laser positioning according to claim 1, characterized in that, The measuring mirror has a through hole, and the vertical connecting part passes through the through hole and is threadedly connected to the mounting plate; The vertical reset component is sleeved on the vertical connecting part, and the mounting plate has a clearance space on the side facing the measuring mirror, and / or the measuring mirror has a clearance space on the side facing the mounting plate; at least a portion of the vertical reset component is located in the clearance space.

5. The measuring mirror mechanism for wafer laser positioning according to claim 1, characterized in that, The vertical reset component includes one of a column spring, a disc spring, and a rubber pad.

6. The measuring mirror mechanism for wafer laser positioning according to claim 1, characterized in that, The number of vertical adjustment connectors is at least three; the centers of the at least three vertical adjustment connectors are not collinear in the orthographic projection of their respective mounting surfaces.

7. The measuring mirror mechanism for wafer laser positioning according to claim 1, characterized in that, The measuring mirror includes a first sub-mirror and a second sub-mirror, wherein the reflecting surface of the first sub-mirror is perpendicular to the reflecting surface of the second sub-mirror.

8. The measuring mirror mechanism for wafer laser positioning according to claim 7, characterized in that, The lateral adjustment connector further includes a lateral connecting portion; along the direction perpendicular to the reflective surface, the lateral connecting portion passes through the lateral adjustment component mounting portion, and the lateral connecting portion is movably connected to the measuring mirror to adjust the distance between the lateral limiting portion and the measuring mirror.

9. The measuring mirror mechanism for wafer laser positioning according to claim 8, characterized in that, The lateral adjustment component mounting part is provided with a through hole, and the lateral connecting part passes through the through hole; the measuring mirror is provided with a hollow part, and at least a portion of the lateral connecting part passes through the hollow part; The measuring mirror mechanism for wafer laser positioning further includes a limiting connector, which is disposed within the hollow portion and threadedly connected to the transverse connecting portion; the transverse reset member is sleeved on the transverse connecting portion.

10. The measuring mirror mechanism for wafer laser positioning according to claim 8, characterized in that, The lateral reset component includes one of a column spring, a disc spring, and a rubber pad.

11. A method for adjusting a measuring mirror, characterized in that, The measuring mirror mechanism for wafer laser positioning as described in any one of claims 1 to 10 is used; the calibration method of the measuring mirror mechanism includes: The laser is used to illuminate the reflective surface of the measuring mirror, and the detection parameters of the reflected laser are obtained. The detection parameters include the intensity information of the reflected laser detected. Adjust the vertical adjustment connector to allow relative movement between the vertical adjustment connector and the mounting plate until the detection parameters are within the preset parameter range.

12. The method for adjusting a measuring mirror according to claim 11, characterized in that, The measuring mirror includes a first sub-mirror and a second sub-mirror; The laser is used to illuminate the reflecting surface of the measuring mirror, and detection parameters of the reflected laser are obtained. These detection parameters include the intensity information of the detected reflected laser, including: A first laser is irradiated along a first direction onto the reflecting surface of the first sub-mirror, and a first detection parameter of the reflected first laser is obtained. The first detection parameter includes intensity information of the reflected first laser along a direction perpendicular to the mounting surface. A second laser is irradiated along a second direction onto the reflecting surface of the second sub-mirror, and a second detection parameter of the reflected second laser is obtained. The second detection parameter includes intensity information of the reflected second laser along a direction perpendicular to the mounting surface. The first direction and the second direction are perpendicular. Adjusting the vertical adjustment connector to allow relative movement between the vertical adjustment connector and the mounting plate until the detection parameter is within a preset parameter range includes: Adjust the vertical adjustment connector connected to the first sub-lens to make the first sub-lens and the mounting plate move relative to each other until the first detection parameter is within the preset parameter range; adjust the vertical adjustment connector connected to the second sub-lens to make the second sub-lens and the mounting plate move relative to each other until the second detection parameter is within the preset parameter range.

13. The method for adjusting a measuring mirror according to claim 12, characterized in that, The lateral adjustment connector includes a lateral limiting part and a lateral connecting part; along the direction perpendicular to the reflective surface, the lateral connecting part passes through the lateral adjustment component mounting part, and the lateral connecting part is movably connected to the measuring mirror to adjust the distance between the lateral limiting part and the measuring mirror; The laser is used to illuminate the reflecting surface of the measuring mirror, and detection parameters of the reflected laser are obtained. These detection parameters include the intensity information of the reflected laser, and further include: The first laser is irradiated along a first direction onto the reflecting surface of the first sub-mirror to obtain a third detection parameter of the reflected first laser, the third detection parameter including the intensity information of the reflected first laser along the direction parallel to the mounting surface; the second laser is irradiated along a second direction onto the reflecting surface of the second sub-mirror to obtain a fourth detection parameter of the reflected second laser, the fourth detection parameter including the intensity information of the reflected second laser along the direction parallel to the mounting surface. The calibration method for the measuring mirror mechanism further includes: Adjust the lateral adjustment connector connected to the first sub-lens to make the lateral adjustment connector and the first sub-lens move relative to each other, and / or adjust the lateral adjustment connector connected to the second sub-lens to make the lateral adjustment connector and the second sub-lens move relative to each other, until the third detection parameter and the fourth detection parameter are both within the preset parameter range.

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