Miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology

Abstract

The miniaturized high-energy laser heat exchanger based on the vapor-liquid phase change heat dissipation technology of the application comprises a shell with a hollow structure, the upper surface of the shell is provided with a fiber slot and a heating component mounting hole, the lower surface of the shell is provided with a heating component mounting hole, the inside of the shell is provided with an air-cooled heat dissipation structure and a liquid-cooled heat dissipation structure, wherein the air-cooled heat dissipation structure is arranged at intervals in the center line direction of the shell, and adjacent air-cooled heat dissipation structures form a liquid cavity channel of the liquid-cooled heat dissipation structure, the liquid coolant in the substrate can absorb the heat of the laser heating component on the shell and vaporize to enter the liquid cavity channel in a vapor-liquid mixed state, the heat is transferred to the air-cooled heat dissipation structure through the liquid cavity channel, and with the working of the high-performance axial flow fan, the heat in the air-cooled heat dissipation structure is dissipated to the air, so that the whole system realizes efficient heat management with lower power consumption and compact heat dissipation structure.

Description

Technical Field

[0001] This invention belongs to the technical field of lasers, and particularly relates to a miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology. Background Technology

[0002] Currently, high-energy laser thermal management systems designed based on conventional heat dissipation technologies such as air cooling and liquid cooling are bulky and heavy, which cannot meet the requirements of lightweight and low power consumption for airborne optoelectronic products and portable high-energy laser products. There is an urgent need for us to carry out research on miniaturized high-energy laser heat exchangers based on vapor-liquid phase change heat dissipation technology.

[0003] Commonly used high-energy laser systems operate in an intermittent mode. During operation, the waste heat generated can reach tens of thousands or even hundreds of thousands of watts, while during non-operational periods, the heat generated is minimal. Conventional high-energy laser thermal management systems, designed to meet the laser source's operating temperature control requirements, employ cooling compressors and refrigerant pumps. The cooling capacity must exceed the laser source's peak heat load, resulting in significant power consumption. This makes it difficult to meet the requirements for high efficiency, miniaturization, lightweight design, and low power consumption in laser heat exchangers, leading to lower performance. Summary of the Invention

[0004] In view of this, the miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology provided by the present invention enables high-energy lasers to operate efficiently and stably in both low-altitude airborne and ground environments.

[0005] A miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology is provided, comprising a hollow shell. The upper surface of the shell is provided with fiber optic grooves and mounting holes for heating components, and the lower surface is provided with mounting holes for heating components. The shell is provided with an air-cooled heat dissipation structure and a liquid-cooled heat dissipation structure. The air-cooled heat dissipation structures are spaced apart along the center line of the shell, and adjacent air-cooled heat dissipation structures form a liquid cavity channel of the liquid-cooled heat dissipation structure. The refrigerant in the liquid cavity channel can absorb the heat emitted by the electronic components on the shell and convert it into a gaseous state. When the gaseous refrigerant flows through the air-cooled heat dissipation structure, under the action of cooling air, the refrigerant can be converted from a gaseous state to a liquid state.

[0006] The beneficial effects of the present invention are as follows:

[0007] The pool boiling high-efficiency heat conduction technology can rapidly dissipate the heat generated by the laser, enhancing the heat transfer capacity of the heat exchanger. The microchannel high-efficiency heat dissipation technology effectively solves the heat storage problem of high-power pulsating heat load and short-term high heat flux density in high-energy lasers. The design of a three-dimensional uniform temperature heat dissipation component with a double-sided heat source not only improves the compactness of the high-energy laser, but also allows the cavity structure of its upper and lower substrates to connect with the microchannel fins, ensuring equal pressure inside the heat exchanger, guaranteeing pressure stability in all parts of the heat sink, accelerating the reflux of the condensed liquid working fluid within the microchannel fins, and improving the overall heat dissipation capacity of the heat exchanger. The microchannel fins and air-side fins utilize a thin-plate and profile plate welding technique, effectively increasing the heat dissipation area within the microchannels while reducing the weight of the heat exchanger. Sealing strips are added to the upper and lower sides of the air-side fins welded between the two microchannel fins to improve the pressure resistance of the heat exchanger. Left and right support plates are located on the left and right sides of the heat exchanger, further enhancing its mechanical strength. Attached Figure Description

[0008] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This is a front view of the overall structure;

[0010] Figure 2 for Figure 1 Left side view of the BB section;

[0011] Figure 3 A schematic diagram illustrating the overall heat dissipation principle;

[0012] Figure 4 This is a top view of the overall structure.

[0013] 1. Lower substrate; 2. Capillary core; 3. Lower cover plate; 4. Air-side fins; 5. Support plate; 6. Upper substrate; 7. First heat dissipation fins; 8. Upper cover plate; 9. Welding plate; 10. Liquid cavity channel; 11. Seal; 12. Housing. Detailed Implementation

[0014] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0015] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. This disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0016] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this disclosure, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0017] like Figures 1 to 4 The miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology shown includes an upper surface with fiber optic grooves and mounting holes for heating components, a lower surface with mounting holes for heating components, and an internal hollow shell 12. The shell contains independent air-cooled and liquid-cooled heat dissipation structures. The air-cooled structures are spaced apart along the centerline of the shell, and adjacent air-cooled structures form liquid cavity channels for the liquid-cooled heat dissipation structure. The liquid refrigerant in the liquid cavity channels absorbs heat emitted by the electronic components on the shell and converts it into a gaseous state. As the gaseous refrigerant flows through the air-cooled heat dissipation structure, the refrigerant is converted from a gaseous state to a liquid state under the action of cooling air. This structure's air-cooled and liquid-cooled heat dissipation structures are based on a thermal management heat exchange system integrating pool boiling high-efficiency thermal conductivity technology and microchannel high-efficiency heat dissipation technology, which can improve heat dissipation efficiency. This achieves miniaturization, lightweighting, and high-efficiency design of the high-energy laser heat exchanger, effectively addressing the heat dissipation problems of high-power pulsating heat load and high heat flux density brought by high-energy lasers.

[0018] As a specific embodiment provided in this case, the shell includes a hollow structure with an upper substrate 6 and a lower substrate 1. The inner bottom surface of the upper substrate 6 and the lower substrate 1 is filled with a capillary wick 2 and a liquid refrigerant. The upper substrate 6 and the lower substrate 1 are connected by a liquid cavity channel to ensure the uniformity of the pressure of the entire heat exchanger and improve the heat conduction efficiency of the pool boiling. The upper substrate 6 and the lower substrate 1 are provided with an upper cover plate 8 and a lower cover plate 3 as a transition of the liquid cooling channel.

[0019] Working principle: The heat generated by the high-energy laser is transferred to the capillary core 2 inside the substrate through the upper substrate 6 and the lower substrate 1. The vapor-liquid phase change working medium adsorbed in the capillary core 2 (in a liquid state) undergoes a pool boiling reaction as the temperature of the capillary core 2 and the substrate rises, and enters the microchannel fins in a vapor-liquid mixed state. The vapor-liquid phase change working medium in the vapor-liquid mixed state is cooled back to a liquid state in the microchannel fins and returns to the capillary core 2 inside the substrate along the microchannel fins. The heat is also transferred to the air-side fins 4 through the microchannel fins. With the operation of the high-performance axial flow fan, the heat in the air-side fins 4 is dissipated into the air, achieving efficient thermal management of the entire system with low power consumption.

[0020] As a specific embodiment provided in this case, boss structures or groove structures are provided in the upper substrate 6 and the lower substrate 1, and the boss structures or groove structures are used to fill the capillary wick 2. The effect of providing the capillary wick 2 in this structure is: to increase the contact between the substrate and the capillary wick 2, to increase the effective heat transfer area between the substrate and the capillary wick 2, to increase the welding area between the substrate and the cover plate, to improve the pressure resistance of the heat exchanger, and the porous structure of the capillary wick 2 increases the vaporization nuclei for pool boiling, thereby improving the thermal conductivity. As a specific implementation provided in this case, support plates 5 are integrally provided on both sides of the shell. The support plates 5 are used to support and reinforce the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure. The air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure are not connected. The air-cooled heat dissipation structure includes a first heat dissipation fin 7 and a welding plate 9. Two adjacent welding plates form a liquid cavity channel 10. A second heat dissipation fin (not shown in the figure) is provided on the wall of the liquid cavity channel 10. The size of the first heat dissipation fin 7 is larger than that of the second heat dissipation fin. The second heat dissipation fin and the first heat dissipation fin are both formed by continuous arrangement of U-shaped corrugated plates. The first heat dissipation fin 7 is provided between the welding plate and the support plates 5 on both sides, and between the welding plates, to increase the contact area with the air and to transfer heat when the refrigerant in the liquid cavity channel 10 undergoes phase change. Heat exchange is also carried out through the second heat dissipation fin, thereby improving the heat exchange efficiency of the overall structure.

[0021] The refrigerant mentioned above is acetone, R134a, R1233zd, or other liquids or media. Sealing strips 11 are provided at both ends of the first and second heat dissipation fins, respectively. These sealing strips 11 are used to improve the pressure resistance and sealing effect of the heat exchanger. The interior of the microchannel fins and the air-side fins 4 utilize a thin plate and profile plate welding technique, effectively increasing the heat dissipation area within the microchannels while reducing the weight of the heat exchanger. Sealing strips 11 are added to the upper and lower sides of the air-side fins 4 welded between the two microchannel fins to improve the pressure resistance of the heat exchanger. Left and right support plates 5 are located on the left and right sides of the heat exchanger, further enhancing its mechanical strength.

[0022] Overall working principle:

[0023] like Figure 3 As shown, the arrows and thick solid lines represent a thermal management heat exchange system integrating pool boiling high-efficiency heat conduction technology and microchannel high-efficiency heat dissipation technology. Heat generated by the high-energy laser is transferred through the upper substrate 6 and the lower substrate 1 to the capillary core 2 within the substrate. The vapor-liquid phase change working fluid adsorbed in the capillary core 2 (in a liquid state) undergoes a pool boiling reaction as the temperature of the capillary core 2 and the substrate rises, entering the microchannel fins in a vapor-liquid mixed state. This vapor-liquid phase change working fluid is then cooled back to a liquid state within the microchannel fins and returns to the capillary core 2 within the substrate along the microchannel fins. Heat is also transferred through the microchannel fins to the air-side fins 4. With the operation of the high-performance axial flow fan, the heat in the air-side fins 4 is dissipated into the air, achieving efficient thermal management of the entire system with low power consumption and a compact heat dissipation structure.

[0024] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A miniaturized high-energy laser heat exchanger based on vapor-liquid phase change heat dissipation technology, characterized in that, The housing includes a hollow structure, with fiber optic grooves and mounting holes for heating components on the upper surface and mounting holes for heating components on the lower surface. The housing is equipped with both air-cooled and liquid-cooled heat dissipation structures. The air-cooled heat dissipation structures are spaced apart along the center line of the shell, and adjacent air-cooled heat dissipation structures form the liquid cavity channel of the liquid-cooled heat dissipation structure. The liquid refrigerant in the liquid cavity channel can absorb the heat emitted by the electronic components on the shell and convert it into a gaseous state. When the gaseous refrigerant flows through the air-cooled heat dissipation structure, under the action of the cooling wind, the refrigerant can be converted from a gaseous state to a liquid state. The shell includes a hollow structure with an upper substrate and a lower substrate. The bottom part of the interior of the upper substrate and the lower substrate is filled with a capillary wick and a refrigerant with a volume larger than the capillary wick. The upper substrate and the lower substrate are connected by a liquid cavity channel to ensure the pressure uniformity of the entire heat exchanger. The upper and lower substrates are provided with boss structures or groove structures, which are used to fill the capillary core and increase the contact area between the capillary core and the substrate. The air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure are not connected. The air-cooled heat dissipation structure includes a first heat dissipation fin and a welding plate. Two adjacent welding plates form the liquid cavity channel. A second heat dissipation fin is provided on the wall of the liquid cavity channel. The size of the first heat dissipation fin is larger than that of the second heat dissipation fin. The second heat dissipation fin and the first heat dissipation fin are both formed by continuous arrangement of U-shaped corrugated plates. The two ends of the first heat dissipation fin and the second heat dissipation fin are respectively provided with sealing strips, which are used to improve the pressure resistance and sealing effect of the heat exchanger. The shell has an integrally formed support plate on each side, which is used to support and reinforce the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure.

2. The miniaturized high-energy laser heat exchanger according to claim 1, characterized in that, The refrigerant is acetone, R134a, or R1233zd.

Images