Fabrication methods for micro LED devices, micro LED devices and display devices

Abstract

This disclosure provides a method for fabricating a micro-LED device, a micro-LED device, and a display device. The method includes: obtaining a transparent substrate and a micro-LED chip structure; setting a first partition layer on the transparent substrate, such that the first partition layer includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes; filling a portion of the first through-holes in each set of first through-holes with a first light-absorbing layer to obtain a first intermediate structure; setting a second partition layer on the first intermediate structure, such that the second partition layer includes multiple sets of second through-holes, each set of second through-holes corresponding to the first through-holes in a corresponding set of first through-holes; filling a photoluminescent material layer in the second through-holes in each set of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer to obtain a first color conversion structure; bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro-LED chip to obtain a micro-LED device.

Description

Technical Field

[0001] This disclosure relates to the technical field of semiconductor Micro LED, and more specifically, to a method for fabricating a micro LED device, a micro LED device, and a display device. Background Technology

[0002] Micro-LED is a comprehensive technology that integrates novel display technology with light-emitting diode (LED) technology. It boasts advantages such as small size, high brightness, high resolution, and low power consumption, and is considered one of the most promising next-generation display and light-emitting devices. Currently, full-color Micro-LED displays can be achieved in various ways, one of which is color conversion. However, full-color Micro-LED devices achieved through color conversion still suffer from unsatisfactory display effects. Summary of the Invention

[0003] The present disclosure provides a method for fabricating a micro LED device, a micro LED device, and a display device.

[0004] According to one aspect of the present disclosure, a method for fabricating a micro-LED device is provided, wherein the method includes: obtaining a transparent substrate and a micro-LED chip structure, wherein the micro-LED chip structure includes a micro-LED chip, the micro-LED chip including a micro-LED unit array composed of a plurality of micro-LED units; disposing a first partition layer on the transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes; filling a portion of the first through-holes in each set of first through-holes with a first light-absorbing layer to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the micro-LED units. The light emitted by the LED unit; a second partition layer is disposed on the first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-holes in each set of second through-holes correspond to the first through-holes in the corresponding first through-hole group; a photoluminescent material layer is filled in the second through-holes in each set of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; the side of the first color conversion structure opposite to the transparent substrate is bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0005] Further, a first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. This involves: disposing a first partition layer on the transparent substrate and forming a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including three first through-holes, the three first through-holes including a first first through-hole, a second first through-hole, and a third first through-hole. A first light-absorbing layer is filled in a portion of the first through-holes in each set of first through-holes to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro-LED units, including: filling the third first through-hole in each set of first through-holes with a first light-absorbing layer, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED units. A second partition layer is provided on the first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponding to the first through-hole in the corresponding first through-hole set includes: providing a second partition layer on the first intermediate structure and opening a second through-hole array on the second partition layer, such that the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and each set of second through-holes includes a first second through-hole aligned with a first first through-hole, a second second through-hole aligned with a second first through-hole, and a third second through-hole aligned with a third first through-hole. The photoluminescent material layer includes a first-color photoluminescent material layer and a second-color photoluminescent material layer. A photoluminescent material layer is filled in the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer, resulting in a first color conversion structure. The color of the light emitted by the micro-LED unit differs from the color corresponding to the photoluminescent material layer by: filling the first-color photoluminescent material layer in the first second through-hole in each group of second through-holes, and filling the second-color photoluminescent material layer in the second second through-hole in each group of second through-holes. The light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

[0006] Furthermore, when filling a portion of the first through-holes in each group of first through-holes with a first light-absorbing layer, the method further includes: a first filling step, the first filling step including at least one of the following steps: filling a first filling portion in the first first through-hole in each group of first through-holes, the first filling portion including a first light-filtering layer that allows only light of a first color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material; filling a second filling portion in the second first through-hole in each group of first through-holes, the second filling portion including a second light-filtering layer that allows only light of a second color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0007] Furthermore, the first filling step further includes: when there are unfilled first through holes in each group of first through holes, filling the unfilled first through holes with transparent material.

[0008] Further, a first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The process involves: disposing a first partition layer on the transparent substrate and forming a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including two first through-holes. A first light-absorbing layer is filled into a portion of the first through-holes in each set of first through-holes to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro-LED units. A second partition layer is provided on the first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponds to the first through-hole in the corresponding first through-hole set, including: providing a second partition layer on the first intermediate structure and opening a second through-hole array on the second partition layer, such that the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and each set of second through-holes includes two second through-holes respectively aligned with two first through-holes in the corresponding first through-hole set. The photoluminescent material layer includes a fourth color photoluminescent material layer. The photoluminescent material layer is filled in the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer to obtain a first color conversion structure. The color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, which includes filling the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer with a fourth color photoluminescent material layer. The light corresponding to the fourth color and the light corresponding to the third color are combined to obtain white light.

[0009] Furthermore, when filling a portion of the first through holes in each group of first through holes with a first light-absorbing layer, the method further includes: filling a third filling portion in the first through holes in each group of first through holes that are not filled with the first light-absorbing layer, the third filling portion including a third filter layer that only allows light of a fourth color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0010] Furthermore, before setting the second barrier layer on the first intermediate structure, the method further includes: setting a third light-absorbing layer on the first intermediate structure, wherein the second light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit. Setting the second barrier layer on the first intermediate structure includes: setting the second barrier layer on the third light-absorbing layer.

[0011] Furthermore, when filling the second through hole in each group of second through holes that does not correspond to the first through hole filled with the first light-absorbing layer with a photoluminescent material layer, the method further includes: filling the second through hole in each group of second through holes that corresponds to the first through hole filled with the first light-absorbing layer with a fourth filling portion, the fourth filling portion including a fourth light-absorbing layer for partially absorbing the light emitted by the micro LED unit, a photoluminescent material layer of a third color, or a transparent material.

[0012] Furthermore, before forming the first barrier layer on the transparent substrate, the method further includes forming a fifth light-absorbing layer on the transparent substrate, the fifth light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. Forming the first barrier layer on the transparent substrate includes forming the first barrier layer on the fifth light-absorbing layer.

[0013] Furthermore, after filling the second through hole in each group of second through holes that does not correspond to the first through hole filled with the first light-absorbing layer with a photoluminescent material layer, the method further includes: providing a first reflective layer on the second barrier layer and the photoluminescent material layer, wherein the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

[0014] Further, after filling the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer with a photoluminescent material layer, the method further includes: providing an insulating layer on the second barrier layer and the photoluminescent material layer. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the microLED chip.

[0015] Furthermore, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0016] According to another aspect of this disclosure, a micro LED device is also provided.

[0017] The micro-LED device includes a second color conversion structure and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip, which comprises a micro-LED unit array composed of multiple micro-LED units. The second color conversion structure includes: a first barrier layer comprising a first through-hole array, the arrangement of which corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array comprises multiple sets of first through-holes, each set comprising at least two first through-holes; and a first light-absorbing layer filling a portion of the first through-holes in each set, wherein the first light-absorbing layer is used to partially absorb light. The light emitted by the micro-LED unit; a second barrier layer, disposed below the first barrier layer and the first light-absorbing layer, the second barrier layer including a second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-holes in each set of second through-holes correspond to the first through-holes in the corresponding first through-hole group; a photoluminescent material layer, the photoluminescent material layer filling the second through-holes in each set of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer, the color of the light emitted by the micro-LED unit being different from the color corresponding to the photoluminescent material layer. The second barrier layer and the photoluminescent material layer of the second color conversion structure are disposed on the light-emitting side of the micro-LED chip.

[0018] Furthermore, each group of first through holes includes three first through holes, namely a first first through hole, a second first through hole, and a third first through hole. The first light-absorbing layer fills the third first through hole in each group of first through holes. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. Each group of second through holes includes a first second through hole aligned with the first first through hole, a second second through hole aligned with the second first through hole, and a third second through hole aligned with the third first through hole. The photoluminescent material layer includes a first color photoluminescent material layer and a second color photoluminescent material layer. The first color photoluminescent material layer fills the first second through hole in each group of second through holes, and the second color photoluminescent material layer fills the second second through hole in each group of second through holes. White light is obtained by combining the light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color.

[0019] Furthermore, the second color conversion structure further includes at least one of a first filling portion and a second filling portion, wherein: the first filling portion is used to fill the first first through hole in each group of first through holes, and the first filling portion includes a first light filter layer that allows only light of the first color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material; the second filling portion is used to fill the second first through hole in each group of first through holes, and the second filling portion includes a second light filter layer that allows only light of the second color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material.

[0020] Furthermore, when there are unfilled first through holes in each group of first through holes, the second color conversion structure also includes a transparent material that fills the unfilled first through holes.

[0021] Furthermore, the first color is red, the second color is green, and the third color is blue.

[0022] Furthermore, each group of first through holes includes two first through holes, and the first light-absorbing layer fills one of the first through holes in each group of first through holes. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. Each group of second through holes includes two second through holes that are respectively aligned with the two first through holes in the corresponding group of first through holes. The photoluminescent material layer includes a fourth color photoluminescent material layer, and the fourth color photoluminescent material layer fills the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer. The fourth color light and the third color light are combined to obtain white light.

[0023] Furthermore, the second color conversion structure also includes a third filling portion, which is used to fill the first through-holes in each group of first through-holes that are not filled with the first light-absorbing layer. The third filling portion includes a third filter layer that only allows light of the fourth color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material.

[0024] Furthermore, the fourth color is yellow and the third color is blue.

[0025] Furthermore, the second color conversion structure also includes a third light-absorbing layer, which is disposed below the first barrier layer and the first light-absorbing layer. The third light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the second barrier layer is disposed below the third light-absorbing layer.

[0026] Furthermore, the second color conversion structure also includes a fourth filling portion, which fills the second through hole in each group of second through holes corresponding to the first through hole filled with the first light-absorbing layer. The fourth filling portion includes a fourth light-absorbing layer for partially absorbing the light emitted by the micro LED unit, a photoluminescent material layer of a third color, or a transparent material.

[0027] Furthermore, the second color conversion structure also includes a fifth light-absorbing layer, which is disposed on the first barrier layer and is used to partially absorb the light emitted by the micro LED unit.

[0028] Furthermore, the second color conversion structure also includes a first reflective layer, which is disposed below the second barrier layer and the photoluminescent material layer. The first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer.

[0029] Furthermore, the second color conversion structure also includes an isolation layer, which is disposed below the second barrier layer and the photoluminescent material layer, and the isolation layer of the second color conversion structure is disposed on the light-emitting side of the micro LED chip.

[0030] Furthermore, the micro LED chip structure also includes a driver chip, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure also includes a driver chip and a flexible circuit board, with the side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0031] Furthermore, the materials of the first barrier layer and the second barrier layer include visible light shielding materials; the materials of the first color photoluminescent material layer and the second color photoluminescent material layer include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the materials of the first light-absorbing layer and the second light-absorbing layer include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; and the materials of the first light-filtering layer and the second light-filtering layer include organic dyes, nano-absorbing particles, or inorganic oxides.

[0032] According to another aspect of the present disclosure, a display device is also provided. The display device includes a miniature LED device prepared by the above-described method.

[0033] By applying the technical solution of this disclosure, a transparent substrate and a micro LED chip are obtained. A first barrier layer is disposed on the transparent substrate. Each group of first through holes in the first barrier layer includes at least two first through holes. Then, a first light-absorbing layer is filled in a portion of the first through holes in each group of first through holes. A second barrier layer is disposed on the first barrier layer and the first light-absorbing layer. Each group of second through holes in the second barrier layer includes a second through hole corresponding to a first through hole in the corresponding group of first through holes. Then, a photoluminescent material layer is filled in the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer to form a first color conversion structure. The first color conversion structure is bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0034] In this micro-LED device, the light emitted by the micro-LED unit of the micro-LED chip excites the material in the photoluminescent material layer to emit light of a different color than the light emitted by the micro-LED unit. Since there are corresponding first and second through holes, the first light-absorbing layer filled in the first through hole corresponding to the second through hole can partially absorb the light emitted by the micro-LED unit. This reduces the light overflow caused by the light emitted directly from the micro-LED device, thus reducing color deviation and poor color purity caused by light overflow. This improves the uniformity of different colors of light emitted from the micro-LED device, enhances the color purity of the micro-LED, and ultimately improves the display effect of the micro-LED device. Attached Figure Description

[0035] The above and other objects, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein:

[0036] Figure 1 This is a flowchart illustrating a method for fabricating a micro LED device according to an embodiment of the present disclosure;

[0037] Figures 2 to 12 This is a schematic diagram illustrating the fabrication process of a micro LED device fabrication method according to an embodiment of the present disclosure. Detailed Implementation

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0040] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0041] Exemplary embodiments according to this disclosure will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that this disclosure is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art. In the drawings, for clarity, the thickness of layers and regions has been enlarged, and the same reference numerals are used to denote the same devices, and therefore their description will be omitted.

[0042] This disclosure provides a method for fabricating a micro LED device. (Refer to...) Figures 1 to 12 , Figure 1 This is a flowchart illustrating a method for fabricating a micro LED device according to an embodiment of the present disclosure; Figures 2 to 12 This is a schematic diagram illustrating the fabrication process of a micro LED device fabrication method according to an embodiment of the present disclosure.

[0043] like Figure 1 As shown, the method for fabricating this micro LED device includes the following steps S101-S106.

[0044] Step S101: Obtain a transparent substrate and a micro LED chip structure, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units.

[0045] Step S102: A first partition layer is formed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and each set of first through-holes includes at least two first through-holes.

[0046] Step S103: Fill a portion of the first through-holes in each group of first through-holes with a first light-absorbing layer to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0047] Step S104: A second partition layer is provided on the first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponds to the first through-hole in the corresponding first through-hole set.

[0048] Step S105: Fill the second through hole in each group of second through holes that does not correspond to the first through hole filled with the first light-absorbing layer with a photoluminescent material layer to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer.

[0049] Step S106: Bond the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0050] According to this technical solution, a transparent substrate and a micro LED chip can be obtained. A first barrier layer is formed on the transparent substrate. Each group of first through holes in the first barrier layer includes at least two first through holes. Then, a first light-absorbing layer is filled in a portion of the first through holes in each group of first through holes. A second barrier layer is formed on the first barrier layer and the first light-absorbing layer. Each group of second through holes in the second barrier layer includes a second through hole corresponding to a first through hole in the corresponding group of first through holes. Then, a photoluminescent material layer is filled in the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer to form a first color conversion structure. The first color conversion structure is then bonded to the light-emitting side of the micro LED chip to form a micro LED device.

[0051] In this micro-LED device, the light emitted by the micro-LED unit of the micro-LED chip excites the material in the photoluminescent material layer to emit light of a different color than the light emitted by the micro-LED unit. Since there are corresponding first and second through holes, the first light-absorbing layer filled in the first through hole corresponding to the second through hole can partially absorb the light emitted by the micro-LED unit. This reduces the light overflow caused by the light emitted directly from the micro-LED device, thus reducing color deviation and poor color purity caused by light overflow. This improves the uniformity of different colors of light emitted from the micro-LED device, enhances the color purity of the micro-LED, and ultimately improves the display effect of the micro-LED device.

[0052] In step S101, a transparent substrate and a micro LED chip structure can be obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units.

[0053] According to embodiments of this disclosure, a transparent substrate and a micro-LED chip structure can be obtained first. The transparent substrate may include any suitable substrate such as a glass substrate, a polyimide substrate, or a sapphire substrate. The micro-LED chip structure includes a micro-LED chip, which comprises an array of micro-LED units for emitting light. The micro-LED chip can be any micro-LED chip suitable for fabricating a micro-LED device; for example, the structure of the micro-LED chip may include a right-mounted structure, a flip-chip structure, or a vertical structure, etc., without limitation. Each micro-LED unit in the micro-LED unit array may include an exposed first semiconductor layer on its light-emitting side. Depending on the type of micro-LED device, in some embodiments, the first semiconductor layer may include an N-GaN layer; in other embodiments, the first semiconductor layer may include a P-GaN layer. It is worth noting that the micro-LED chip structure can also be obtained in any step prior to the subsequent step of using the micro-LED chip structure.

[0054] Reference Figures 2-12 ,in Figure 2 A side view of a transparent substrate 101 according to an embodiment of the present disclosure is shown. Figure 2 As shown, the transparent substrate 101 may be, for example, a glass substrate.

[0055] Reference Figures 2-12 ,in Figure 3 A side view of a microLED chip structure according to an embodiment of the present disclosure is shown. Figure 3As shown, the micro-LED chip structure includes a micro-LED chip 20, which comprises a micro-LED unit array 201 composed of micro-LED units 2011. Each micro-LED unit 2011 in the micro-LED unit array 201 includes, for example, a first semiconductor layer 20111 of N-GaN layer on the light-emitting side. Figure 3 As shown, the first semiconductor layer 20111 is shared by each micro-LED unit 2011 in the micro-LED unit array 201, that is, the first semiconductor layer 20111 is integrated into the micro-LED chip 20.

[0056] In step S102, a first partition layer can be formed on the transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and each set of first through-holes includes at least two first through-holes.

[0057] According to embodiments of this disclosure, after obtaining a transparent substrate, a first barrier layer can be formed on the transparent substrate. The material of the first barrier layer may include a visible light shielding material, such as a matting material like black photoresist or a reflective material like a metal layer.

[0058] According to one embodiment of the first partition layer of this disclosure, a first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The first partition layer is disposed on a transparent substrate and a first through-hole array is formed on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including three first through-holes, the three first through-holes including a first first through-hole, a second first through-hole, and a third first through-hole.

[0059] According to another embodiment of the first partition layer of this disclosure, a first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The process includes: disposing of a first partition layer on a transparent substrate and forming a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including two first through-holes.

[0060] According to embodiments of this disclosure, before forming a first barrier layer on the transparent substrate, the method further includes forming a fifth light-absorbing layer on the transparent substrate, the fifth light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. Forming the first barrier layer on the transparent substrate includes forming the first barrier layer on the fifth light-absorbing layer. The material of the fifth light-absorbing layer includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light, such as zinc oxide nanoparticle photoresist.

[0061] Reference Figures 2-12 ,in Figure 4 A side view schematic diagram of a first partition layer 102 disposed on a transparent substrate 101 is shown. Figure 4 As shown, the first barrier layer 102 can be, for example, a black photoresist layer. Therefore, a black photoresist layer can be applied to a transparent substrate 101, such as a glass substrate, using spin coating. Then, for example, a first via array 1020 can be formed on the black photoresist layer using photolithography, such that the arrangement of the first via array 1020 corresponds to the arrangement of the subsequent micro-LED unit array 201 and exposes the transparent substrate 101. The first via array 1020 includes multiple sets of first vias, each set including a first first via 1021, a second first via 1022, and a third first via 1023. For clarity and brevity, Figure 4 Only one set of first through holes is shown in the first through hole array 1020, which includes a first first through hole 1021, a second first through hole 1022, and a third first through hole 1023. Figure 4 The number of groups of first vias and the number of first vias in each group shown are merely illustrative and are not intended to be limiting. A first barrier layer 102, such as a black photoresist layer, can make the screen appear black when the display device is powered off or turned off.

[0062] In step S103, a first light-absorbing layer can be filled into a portion of the first through holes in each group of first through holes to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit.

[0063] According to embodiments of this disclosure, after obtaining the first via array described above, a first light-absorbing layer can be filled into the first via array. The first light-absorbing layer can partially absorb the light emitted by the micro-LED unit, so that a portion of the light emitted by the micro-LED unit is absorbed after passing through the first light-absorbing layer.

[0064] Referring to an embodiment of the first partition layer in step S102, according to an embodiment of the present disclosure regarding the filling of the first through-hole, a first light-absorbing layer is filled in a portion of the first through-holes in each group of first through-holes to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, comprising: filling the third first through-hole in each group of first through-holes with the first light-absorbing layer, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit.

[0065] Furthermore, when filling a portion of the first through-holes in each group of first through-holes with a first light-absorbing layer, the method further includes: a first filling step, the first filling step including at least one of the following steps: filling a first filling portion in the first first through-hole in each group of first through-holes, the first filling portion including a first light-filtering layer that allows only light of a first color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material; filling a second filling portion in the second first through-hole in each group of first through-holes, the second filling portion including a second light-filtering layer that allows only light of a second color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0066] Furthermore, the first filling step further includes: when there are unfilled first through holes in each group of first through holes, filling the unfilled first through holes with transparent material.

[0067] In this embodiment, the first color of light refers to the light within the wavelength range corresponding to the first color, the second color of light refers to the light within the wavelength range corresponding to the second color, and the third color of light refers to the light within the wavelength range corresponding to the third color. The first, second, and third colors can be three primary colors, for example, the first color is red, the second color is green, and the third color is blue. The materials of the first and second light-absorbing layers include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light. The materials of the first and second light-absorbing layers can be the same, for example, zinc oxide nanoparticle photoresist. The materials of the first and second light-filtering layers include organic dyes, nano-absorbing particles, or inorganic oxides.

[0068] Referring to another embodiment of the first partition layer in step S102, according to another embodiment of the present disclosure regarding the filling of the first through-hole, a first light-absorbing layer is filled in a portion of the first through-holes in each group of first through-holes to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, comprising: filling the first light-absorbing layer in one of the first through-holes in each group of first through-holes to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit.

[0069] Furthermore, when filling a portion of the first through holes in each group of first through holes with a first light-absorbing layer, the method further includes: filling a third filling portion in the first through holes in each group of first through holes that are not filled with the first light-absorbing layer, the third filling portion including a third filter layer that only allows light of a fourth color to pass through, a second light-absorbing layer for partially absorbing light of a third color, or a transparent material.

[0070] In this embodiment, the fourth color of light refers to light within the wavelength range corresponding to the fourth color. The fourth color is yellow light, and the third color is blue. The materials of the first light-absorbing layer and the second light-absorbing layer include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light. The materials of the first light-absorbing layer and the second light-absorbing layer can be the same, for example, zinc oxide nanoparticle photoresist. The material of the third filter layer includes organic dyes, nano-absorbing particles, or inorganic oxides.

[0071] Reference Figures 2-12 ,in Figure 5 A side view schematic diagram is shown of the first light-absorbing layer and the filling portion filling each group of first through-holes. (Combined with...) Figure 4 ,like Figure 5 As shown, a first filling portion is filled in the first first through-hole 1021 of each group of first through-holes. This first filling portion may include a first filter layer 1031 that allows only light of a first color, such as red, to pass through. A second filling portion is filled in the second first through-hole 1022 of each group of first through-holes. This second filling portion may include a second filter layer 1032 that allows only light of a second color, such as green, to pass through. A first light-absorbing layer 1033 is filled in the third first through-hole 1023 of each group of first through-holes. This first light-absorbing layer 1033 is used to partially absorb light of a third color, such as blue, to obtain... Figure 5 The first intermediate structure 30 is shown. It is worth noting that in other embodiments, when there are unfilled first through holes in each group of first through holes, transparent material can be filled into the unfilled first through holes to support the portion above the corresponding first through holes in subsequent manufacturing processes. The transparent material can be, for example, any suitable material such as transparent resin.

[0072] In step S104, a second partition layer can be provided on the first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponds to the first through-hole in the corresponding first through-hole set.

[0073] According to embodiments of this disclosure, after preparing the first barrier layer, a second barrier layer can be disposed on the first barrier layer. The second barrier layer can function as a grid, and the interior of the grid can be filled with a corresponding material. In some embodiments, the second barrier layer may include a visible light shielding material, such as a matting material like black photoresist or a reflective material like a metal layer.

[0074] Referring to an embodiment of the first partition layer in step S102 and an embodiment of the filling of the first through-hole in step S103, according to an embodiment of the second partition layer of this disclosure, a second partition layer is provided on a first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponding to the first through-hole in the corresponding first through-hole set includes: providing a second partition layer on the first intermediate structure and opening a second through-hole array on the second partition layer, such that the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and each set of second through-holes includes a first second through-hole aligned with a first first through-hole, a second second through-hole aligned with a second first through-hole, and a third second through-hole aligned with a third first through-hole.

[0075] Referring to another embodiment of the first partition layer in step S102 and another embodiment of the filling of the first through-hole in step S103, according to another embodiment of the second partition layer of this disclosure, a second partition layer is provided on a first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponding to the first through-hole in the corresponding first through-hole group includes: providing a second partition layer on the first intermediate structure and opening a second through-hole array on the second partition layer, such that the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and each set of second through-holes includes two second through-holes respectively aligned with two first through-holes in the corresponding first through-hole group.

[0076] According to embodiments of this disclosure, before providing the second barrier layer on the first intermediate structure, the method further includes: providing a third light-absorbing layer on the first intermediate structure, the third light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. Providing the second barrier layer on the first intermediate structure includes: providing the second barrier layer on the third light-absorbing layer.

[0077] Reference Figures 2-12 ,in Figure 6 A side view schematic diagram of a third light-absorbing layer 104 disposed on the first intermediate structure 30 is shown. Figure 6 As shown, a third light-absorbing layer 104 is disposed on the first intermediate structure 30. This third light-absorbing layer 104 is used to partially absorb, for example, blue light emitted by the micro LED unit. The material of the third light-absorbing layer 104 includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light. The material of the third light-absorbing layer 104 can be the same as the material of the first light-absorbing layer 1033 and the second light-absorbing layer, for example, it can be zinc oxide nanoparticle photoresist.

[0078] Reference Figures 2-12 ,in Figure 7 A side view schematic diagram of a second barrier layer 105 disposed on a third light-absorbing layer 104 is shown. Figure 7 As shown, the second barrier layer 105 can be, for example, a black photoresist layer. Therefore, a black photoresist layer can be coated onto the third light-absorbing layer 104 using a spin-coating method. Then, for example, a second via array 1050 can be formed on the black photoresist layer by photolithography, such that the second via array 1050 is aligned with the first via array 1020, and the third via array 1050 exposes the third light-absorbing layer 104. The second via array 1050 includes multiple sets of second vias corresponding to multiple sets of first vias. Each set of second vias includes a first second via 1051 aligned with the first first via 1021, a second second via 1052 aligned with the second first via 1022, and a third second via 1053 aligned with the third first via 1023, resulting in the following... Figure 7 The structure shown. Figure 7 The number of groups of second through holes and the number of second through holes in each group shown are only illustrative. As long as the correspondence between the first through holes and the second through holes described above is followed, there are no restrictions here.

[0079] In step S105, a photoluminescent material layer can be filled into the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer to obtain a first color conversion structure, wherein the color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer.

[0080] According to embodiments of this disclosure, after obtaining the second through-hole array described above, a photoluminescent material layer can be filled into the second through-hole array.

[0081] Referring to an embodiment of the first barrier layer in step S102, an embodiment of the first through-hole filling in step S103, and an embodiment of the second barrier layer in step S104, according to an embodiment of the photoluminescent material layer filled in this disclosure, the photoluminescent material layer includes a first color photoluminescent material layer and a second color photoluminescent material layer. A photoluminescent material layer is filled in the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer, resulting in a first color conversion structure. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, which includes filling the first color photoluminescent material layer in the first second through-hole in each group of second through-holes and filling the second color photoluminescent material layer in the second second through-hole in each group of second through-holes. The light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

[0082] In this embodiment, the first color of light refers to the light within the wavelength range corresponding to the first color, the second color of light refers to the light within the wavelength range corresponding to the second color, and the third color of light refers to the light within the wavelength range corresponding to the third color. The first, second, and third colors can be three primary colors; for example, the first color is red, the second color is green, and the third color is blue. The materials of the photoluminescent material layer of the first color and the photoluminescent material layer of the second color include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots.

[0083] Referring to another embodiment of the first barrier layer in step S102, another embodiment of the first through-hole filling in step S103, and another embodiment of the second barrier layer in step S104, according to another embodiment of the photoluminescent material layer filled in this disclosure, the photoluminescent material layer includes a photoluminescent material layer of a fourth color. A photoluminescent material layer is filled in the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer, resulting in a first color conversion structure. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer, including: filling the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer with a fourth color photoluminescent material layer; and combining the light corresponding to the fourth color and the light corresponding to the third color to obtain white light.

[0084] In this embodiment, the fourth color of light refers to light within the wavelength range corresponding to the fourth color, wherein the fourth color is yellow light and the third color is blue. The material of the photoluminescent material layer of the fourth color may include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots.

[0085] According to an embodiment of this disclosure, when a photoluminescent material layer is filled in a second through hole in each group of second through holes that does not correspond to a first through hole filled with a first light-absorbing layer, the method further includes: filling a fourth filling portion in a second through hole in each group of second through holes that corresponds to a first through hole filled with a first light-absorbing layer, the fourth filling portion including a fourth light-absorbing layer for partially absorbing light emitted by the micro LED unit, a photoluminescent material layer of a third color, or a transparent material.

[0086] According to embodiments of this disclosure, after filling the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer with a photoluminescent material layer, the method further includes: disposing a first reflective layer on the second barrier layer and the photoluminescent material layer, the first reflective layer being used to reflect light of the color corresponding to the photoluminescent material layer. The first reflective layer may include a distributed Bragg reflector film for reflecting light of the color corresponding to the photoluminescent material layer. For example, the first reflective layer may be a distributed Bragg reflector film formed by alternating stacks of silicon dioxide layers and titanium dioxide layers, and may also include any material layer for reflecting light of the color corresponding to the photoluminescent material layer.

[0087] According to an embodiment of this disclosure, after filling a photoluminescent material layer into a second through hole in each group of second through holes that does not correspond to a first through hole filled with a first light-absorbing layer, the method further includes: providing an insulating layer on the second barrier layer and the photoluminescent material layer.

[0088] Reference Figures 2-12 ,in Figure 8 This diagram shows a side view of a photoluminescent material layer filling the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer. (Combined with...) Figure 7 ,like Figure 8 As shown, the first second through hole 1051 in each group of second through holes is filled with a photoluminescent material layer 1061 of a first color, such as red, and the second second through hole 1052 in each group of second through holes is filled with a photoluminescent material layer 1062 of a second color, such as green.

[0089] Reference Figures 2-12 ,in Figure 9A side view schematic diagram is shown of a fourth filling portion filling the second through-hole in each group of second through-holes, corresponding to the first through-hole filled with the first light-absorbing layer. (Combined with...) Figure 7 and Figure 8 ,like Figure 9 As shown, the fourth filling portion is, for example, a fourth light-absorbing layer 1063. This fourth light-absorbing layer 1063, used for absorbing, for example, blue light, is filled into the third second through-hole 1053, which is aligned with the third first through-hole 1023. The material of the fourth light-absorbing layer 1063 includes organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light. The material of the fourth light-absorbing layer 1063 can be the same as the materials of the first light-absorbing layer 1033, the second light-absorbing layer, and the third light-absorbing layer 104, for example, zinc oxide nanoparticle photoresist. It is worth noting that the filling order of the first-color photoluminescent material layer 1061, the second-color photoluminescent material layer 1062, and the fourth light-absorbing layer 1063 is merely exemplary and not limited here. The filling order of the first-color photoluminescent material layer 1061, the second-color photoluminescent material layer 1062, and the fourth light-absorbing layer 1063 can be arbitrarily adjusted according to specific processes, equipment, and other actual preparation conditions. The fourth filling section may also include a third color photoluminescent material layer, such as blue, so that the third color light emitted by the micro LED unit, such as blue light, excites the third color photoluminescent material layer to emit third color light, such as blue light.

[0090] Reference Figures 2-12 ,in Figure 10 A side view schematic diagram is shown, illustrating the barrier layer disposed on the second barrier layer and the photoluminescent material layer. (See diagram for reference.) Figure 10 As shown, a barrier layer 107, such as a silicon dioxide layer, can be deposited on the second barrier layer 105, the first color photoluminescent material layer 1061, the second color photoluminescent material layer 1062, and the fourth light-absorbing layer 1063 using plasma-enhanced chemical vapor deposition (PECVD) to obtain the following: Figure 10 The first color conversion structure 10 is shown. Of course, the insulating layer can also include any other suitable materials, such as any suitable organic polymers and inorganic oxides, and any suitable fabrication process can be used to prepare the insulating layer for different materials. The insulating layer is used to protect the other parts of the first color conversion structure and can also serve as a surface layer of the first color conversion structure, making the surface of the first color conversion structure smoother, thereby facilitating the subsequent bonding of the first color conversion structure to the micro-LED chip.

[0091] In step S106, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0092] According to embodiments of this disclosure, after obtaining the first color conversion structure, the side of the first color conversion structure opposite to the transparent substrate can be bonded to the light-emitting side of the micro LED chip to obtain a micro LED device.

[0093] Furthermore, bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the microLED chip.

[0094] Furthermore, each micro-LED unit in the micro-LED unit array includes a first semiconductor layer on the light-emitting side, and bonding the isolation layer of the first color conversion structure to the light-emitting side of the micro-LED chip includes: bonding the isolation layer of the first color conversion structure to the first semiconductor layer.

[0095] According to an embodiment of this disclosure, after bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: removing the transparent substrate of the first color conversion structure to obtain a second color conversion structure from the first color conversion structure.

[0096] According to embodiments of this disclosure, the micro LED chip structure further includes a driver chip, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0097] Reference Figures 2-12 ,in Figure 11 A side view showing the bonding of a first color conversion structure 10 to a microLED chip 20 according to an embodiment of the present disclosure is shown. Figure 11 As shown, the insulating layer 107 of the first color conversion structure 10 is bonded to the first semiconductor layer 20111 of the micro-LED chip 20, resulting in the following... Figure 12 The structure shown.

[0098] Reference Figures 2-12 ,in Figure 12 A side view of a micro LED device 1 according to an embodiment of the present disclosure is shown. Figure 12 As shown, remove Figure 11 The transparent substrate 101 of the first color conversion structure 10 in the structure shown obtains the second color conversion structure 11 through the first color conversion structure 10, resulting in the following... Figure 12 The micro LED device 1 shown.

[0099] Reference Figures 2 to 12 It should be understood that the third color light emitted by the micro-LED unit 2011, such as blue light, excites the first color photoluminescent material layer 1061, such as red light, to emit red light, and the third color light emitted by the micro-LED unit 2011, such as blue light, excites the second color photoluminescent material layer 1062, such as green light, to emit green light. Since the position corresponding to the first light-absorbing layer 1033 is used to emit blue light, the third color light emitted by the micro-LED unit, such as blue light, is partially absorbed after passing through the first light-absorbing layer 1033, but some blue light still passes through the first light-absorbing layer 1033. The first color light, such as red light, the second color light, such as green light, and the third color light, such as blue light, emitted after passing through the photoluminescent material layer and the first light-absorbing layer 1033 can be combined to obtain white light. Therefore, by setting a first light-absorbing layer that partially absorbs, for example, blue light emitted by the micro-LED unit, the blue light overflow caused by the direct emission of blue light from the micro-LED device can be reduced. This reduces color deviation and poor color purity caused by blue light overflow, thereby improving the uniformity of different colors of light emitted from the micro-LED device, enhancing the color purity of the micro-LED, and ultimately improving the display effect of the micro-LED device.

[0100] Regarding the second light-absorbing layer, since the first first through-hole 1021 is aligned with the first second through-hole 1051, and the second first through-hole 1022 is aligned with the second second through-hole 1052, when the second light-absorbing layer is filled in the first first through-hole 1021 and / or the second first through-hole 1022, and when a portion of the blue light emitted by the micro-LED unit corresponding to the first color photoluminescent material layer 1061 and the second color photoluminescent material layer 1062 does not participate in exciting the photoluminescent material layer and leaks through the photoluminescent material layer, the second light-absorbing layer can absorb the leaked portion of blue light. This reduces the mixing output of the leaked portion of blue light with the red and green light emitted by exciting the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus improving the display effect of the micro-LED device.

[0101] Furthermore, regarding the third light-absorbing layer 104, it can partially absorb, for example, blue light emitted by the micro-LED unit 2011 corresponding to the third first through-hole 1023, thereby further reducing blue light overflow caused by the direct emission of blue light from the micro-LED device, thus further improving the display effect of the micro-LED device. Also, since the third light-absorbing layer 104 covers the photoluminescent material layer, when a portion of the blue light emitted by the micro-LED unit corresponding to the photoluminescent material layer leaks through the photoluminescent material layer without participating in the excitation of the photoluminescent material layer, the third light-absorbing layer 104 can absorb this leaked portion of blue light. This reduces the mixing and output of the leaked blue light with the red and green light emitted from the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus enhancing the display effect of the micro-LED device.

[0102] Furthermore, regarding the fourth light-absorbing layer 1063, when the fourth light-absorbing layer 1063 is filled in the third second through hole 1053, the fourth light-absorbing layer 1063 can further enhance the absorption of, for example, blue light emitted by the micro LED unit 2011 corresponding to the third second through hole 1053, thereby further reducing the blue light overflow caused by the light emitted by the micro LED unit directly from the micro LED device, thus further improving the display effect of the micro LED device.

[0103] Furthermore, regarding the fifth light-absorbing layer, it can partially absorb, for example, blue light emitted by the micro-LED unit corresponding to the third first through-hole, thereby further reducing blue light overflow caused by the direct emission of blue light from the micro-LED device, thus further improving the display effect of the micro-LED device. Moreover, since this fifth light-absorbing layer covers the photoluminescent material layer, when a portion of the blue light emitted by the micro-LED unit corresponding to the photoluminescent material layer leaks through the photoluminescent material layer without participating in the excitation of the photoluminescent material layer, the fifth light-absorbing layer can absorb this leaked portion of blue light. This reduces the mixing and output of the leaked blue light with the red and green light emitted from the excitation of the photoluminescent material layer, thereby improving the color purity of the micro-LED and thus enhancing the display effect of the micro-LED device. The material of the fifth light-absorbing layer can be the same as the materials of the first, second, third, and fourth light-absorbing layers.

[0104] Furthermore, regarding the first reflective layer, this first reflective layer is disposed on the second barrier layer and the photoluminescent material layer, and the barrier layer can be disposed on the first reflective layer and located between the first reflective layer and the microLED chip. Therefore, the first reflective layer can cover, for example, the photoluminescent material layer of a first color and the photoluminescent material layer of a second color. Since the first reflective layer is used to reflect light of the color corresponding to the photoluminescent material layer, light emitted from the microLED unit, for example, blue light, can pass through the first reflective layer. When the blue light emitted by the microLED unit excites, for example, the first color photoluminescent material layer (e.g., red) to emit red light, a portion of the emitted red light will be emitted towards the microLED unit. The first reflective layer can reflect this portion of red light towards the first color photoluminescent material layer (e.g., red), thereby increasing the light output of the color corresponding to the photoluminescent material layer, thus improving the brightness of the microLED, and preventing light from emanating from the microLED chip. The red light emitted from the D unit direction interferes with the blue light emitted by the micro LED unit. Similarly, when the blue light emitted by the micro LED unit excites a second-color photoluminescent material layer (e.g., green) to emit green light, a portion of the emitted green light will be emitted towards the micro LED unit. The first reflective layer can reflect this portion of green light towards the second-color photoluminescent material layer, thereby increasing the light output of the color corresponding to the photoluminescent material layer, thus improving the brightness of the micro LED, and preventing the portion of green light emitted towards the micro LED unit from interfering with the blue light emitted by the micro LED unit.

[0105] It is worth noting that when the first second through-hole 1021 is filled with the first filter layer 1031 and the second second through-hole 1022 is filled with the second filter layer 1032, the first filter layer 1031 only allows light of a first color, such as red, to pass through, and reflects light of a third color, such as blue, towards the photoluminescent material layer 1061 of the first color, such as red. The second filter layer 1032 only allows light of a second color, such as green, to pass through, and reflects light of a third color, such as blue, towards the photoluminescent material layer 1062 of the second color, such as green. Therefore, the function of the first filter layer 1031 and the second filter layer 1032 is to reflect light other than the corresponding colors, which is different from the light absorption function of the first light-absorbing layer, the second light-absorbing layer, and the third light-absorbing layer.

[0106] It is worth noting that when the material of the first barrier layer is transparent, the number of first through holes in each group of first through holes can be different from the number of second through holes in the corresponding group of second through holes. For example, if each group of second through holes includes a first second through hole, a second second through hole, and a third second through hole, the corresponding group of first through holes can include a first first through hole aligned with the first second through hole and a second first through hole aligned with the second second through hole. A photoluminescent material layer can be filled in the first and second first through holes. Since the first barrier layer is transparent, light emitted by the micro-LED unit that does not correspond to the photoluminescent material layer can pass through the transparent first barrier layer and be emitted from the micro-LED device.

[0107] This disclosure also provides a miniature LED device.

[0108] like Figures 2-12 As shown, the micro-LED device 1 includes a second color conversion structure 11 and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip 20, which includes a micro-LED unit array 201 composed of multiple micro-LED units 2011. The second color conversion structure 11 includes: a first barrier layer 102, which includes a first through-hole array 1020, the arrangement of which corresponds to the arrangement of the micro-LED unit array 201, wherein the first through-hole array 1020 includes multiple sets of first through-holes, each set including at least two first through-holes; and a first light-absorbing layer 1033, which fills a portion of the first through-holes in each set of first through-holes. The second color conversion structure 11 is used to partially absorb the light emitted by the micro-LED unit 2011; a second barrier layer 105 is disposed below the first barrier layer 102 and the first light-absorbing layer 1033, the second barrier layer 105 includes a second through-hole array 1050, the second through-hole array 1050 corresponds to the first through-hole array 1020, wherein the second through-hole array 1050 includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-holes in each set of second through-holes correspond to the first through-holes in the corresponding first through-hole group; a photoluminescent material layer is filled in the second through-holes in each set of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer, and the color of the light emitted by the micro-LED unit 2011 is different from the color corresponding to the photoluminescent material layer. The second barrier layer 105 and the photoluminescent material layer of the second color conversion structure 11 are disposed on the light-emitting side of the micro-LED chip 20.

[0109] According to embodiments of this disclosure, each group of first through holes includes three first through holes, namely a first first through hole 1021, a second first through hole 1022, and a third first through hole 1023. A first light-absorbing layer 1033 fills the third first through hole 1023 in each group of first through holes. The first light-absorbing layer 1033 is used to partially absorb the third color light emitted by the micro-LED unit 2011. Each group of second through holes includes a first second through hole 1051 aligned with the first first through hole 1021 and a second second through hole 1051 aligned with the second first through hole 1022. 052. A third second through-hole 1053 aligned with the third first through-hole 1023. The photoluminescent material layer includes a first-color photoluminescent material layer 1061 and a second-color photoluminescent material layer 1062. The first-color photoluminescent material layer 1061 fills the first second through-hole 1051 in each group of second through-holes, and the second-color photoluminescent material layer 1062 fills the second second through-hole 1052 in each group of second through-holes. White light is obtained by combining light corresponding to the first color, light corresponding to the second color, and light corresponding to the third color.

[0110] According to embodiments of this disclosure, the second color conversion structure further includes at least one of a first filling portion and a second filling portion, wherein: the first filling portion is used to fill the first first through-hole 1021 in each group of first through-holes, and the first filling portion includes a first light filter layer 1031 that allows only light of the first color to pass through, a second light-absorbing layer or a transparent material for partially absorbing light of the third color; the second filling portion is used to fill the second first through-hole 1022 in each group of first through-holes, and the second filling portion includes a second light filter layer 1032 that allows only light of the second color to pass through, a second light-absorbing layer or a transparent material for partially absorbing light of the third color.

[0111] According to an embodiment of this disclosure, when there is an unfilled first through hole in each group of first through holes, the second color conversion structure 11 further includes a transparent material that fills the unfilled first through hole.

[0112] According to embodiments of this disclosure, the first color is red, the second color is green, and the third color is blue.

[0113] According to embodiments of this disclosure, each group of first through holes includes two first through holes, and the first light-absorbing layer fills one of the first through holes in each group of first through holes. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. Each group of second through holes includes two second through holes that are respectively aligned with the two first through holes in the corresponding group of first through holes. The photoluminescent material layer includes a fourth color photoluminescent material layer, and the fourth color photoluminescent material layer fills the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer. The light corresponding to the fourth color and the third color are combined to obtain white light.

[0114] According to an embodiment of this disclosure, the second color conversion structure further includes a third filling portion for filling the first through-holes in each group of first through-holes that are not filled with the first light-absorbing layer. The third filling portion includes a third filter layer that allows only light of the fourth color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material.

[0115] According to an embodiment of this disclosure, the fourth color is yellow and the third color is blue.

[0116] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes a third light-absorbing layer 104, which is disposed below the first barrier layer 102 and the first light-absorbing layer 1033. The third light-absorbing layer 104 is used to partially absorb the light emitted by the micro LED unit 2011, and the second barrier layer 105 is disposed below the third light-absorbing layer 104.

[0117] According to an embodiment of this disclosure, the second color conversion structure 11 further includes a fourth filling portion, which fills the second through hole in each group of second through holes corresponding to the first through hole filled with the first light-absorbing layer 1033. The fourth filling portion includes a fourth light-absorbing layer 1063 for partially absorbing the light emitted by the micro LED unit 2011, a photoluminescent material layer of a third color, or a transparent material.

[0118] According to an embodiment of this disclosure, the second color conversion structure further includes a fifth light-absorbing layer disposed on the first barrier layer, the fifth light-absorbing layer being used to partially absorb the light emitted by the micro LED unit.

[0119] According to an embodiment of this disclosure, the second color conversion structure 11 further includes a first reflective layer disposed below the second barrier layer 105 and the photoluminescent material layer, the first reflective layer being used to reflect light of the color corresponding to the photoluminescent material layer.

[0120] According to an embodiment of the present disclosure, the second color conversion structure 11 further includes an isolation layer 107, which is disposed below the second barrier layer 105 and the photoluminescent material layer, and the isolation layer 107 of the second color conversion structure 11 is disposed on the light-emitting side of the micro LED chip 20.

[0121] According to embodiments of this disclosure, the micro LED chip structure further includes a driver chip, with one side of the micro LED chip 20 opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure further includes a driver chip and a flexible circuit board, with one side of the micro LED chip 20 opposite to the light-emitting side disposed on the driver chip to form a micro LED module, and the micro LED module disposed on the flexible circuit board via the driver chip.

[0122] According to embodiments of this disclosure, the materials of the first barrier layer 102 and the second barrier layer 105 include visible light shielding materials; the materials of the first color photoluminescent material layer 1061 and the second color photoluminescent material layer 1062 include at least one of group II-VI quantum dots, group III-V quantum dots, perovskite quantum dots, and carbon quantum dots; the materials of the first light-absorbing layer 1033 and the second light-absorbing layer include organic dyes, nano-absorbing particles, or inorganic oxides for absorbing blue light; and the materials of the first light-filtering layer 1031 and the second light-filtering layer 1032 include organic dyes, nano-absorbing particles, or inorganic oxides.

[0123] It is worth noting that any relevant descriptions of the micro-LED device in the above-mentioned micro-LED device fabrication method (including but not limited to technical features and their functions, explanations, etc.) can be applied to the micro-LED device disclosed herein.

[0124] According to embodiments of this disclosure, the pixel size in a micro-LED device is typically less than 50 micrometers.

[0125] This disclosure also provides a display device including the aforementioned LED device. This display device can be applied to flexible electronic devices to realize technologies such as Augmented Reality (AR), Virtual Reality (VR), Extended Reality (XR), and Mixed Reality (MR). For example, the micro-LED device can be a projection part of an electronic device, such as a projector or head-up display (HUD); or, for example, the micro-LED device can be a display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, head-mounted device, or any device with a display screen.

[0126] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0127] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this application, the sequence numbers of the above steps / processes do not imply a sequential order of execution; the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. Moreover, the above embodiment numbers are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0128] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0129] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A method for fabricating a micro LED device, wherein, The method includes: A transparent substrate and a micro LED chip structure are obtained, wherein the micro LED chip structure includes a micro LED chip, and the micro LED chip includes a micro LED unit array composed of multiple micro LED units; A first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, and each set of first through-holes includes at least two first through-holes. A first light-absorbing layer is filled into a portion of the first through-holes in each group to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit; A second partition layer is provided on the first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponds to the first through-hole in the corresponding first through-hole set. A photoluminescent material layer is filled in each of the second through holes that does not correspond to the first through hole filled with the first light-absorbing layer to obtain a first color conversion structure, wherein the color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer; The side of the first color conversion structure opposite to the transparent substrate is bonded to the light-emitting side of the micro-LED chip to obtain a micro-LED device.

2. The method for fabricating a micro LED device according to claim 1, wherein, A first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The process involves: disposing a first partition layer on the transparent substrate and forming a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including three first through-holes, the three first through-holes including a first first through-hole, a second first through-hole, and a third first through-hole. A first light-absorbing layer is filled into a portion of the first through-holes in each group to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit by: filling a third first through-hole in each group with the first light-absorbing layer, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit. A second partition layer is provided on a first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponding to the first through-hole in the corresponding first through-hole set includes: providing a second partition layer on the first intermediate structure and opening a second through-hole array on the second partition layer, such that the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and each set of second through-holes includes a first second through-hole aligned with a first first through-hole, a second second through-hole aligned with a second first through-hole, and a third second through-hole aligned with a third first through-hole. The photoluminescent material layer includes a first-color photoluminescent material layer and a second-color photoluminescent material layer. A photoluminescent material layer is filled in the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer, resulting in a first color conversion structure. The color of the light emitted by the micro-LED unit differs from the color corresponding to the photoluminescent material layer by: filling the first-color photoluminescent material layer in the first second through-hole in each group of second through-holes, and filling the second-color photoluminescent material layer in the second second through-hole in each group of second through-holes. The light corresponding to the first color, the light corresponding to the second color, and the light corresponding to the third color are combined to obtain white light.

3. The method for fabricating a micro LED device according to claim 2, wherein, When filling a portion of the first through-holes in each group of first through-holes with a first light-absorbing layer, the method further includes: A first filling step, the first filling step comprising at least one of the following steps: A first filling portion is filled in the first first through hole in each group of first through holes. The first filling portion includes a first filter layer that allows only light of the first color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material. A second filling portion is filled in the second first through hole in each group of first through holes. The second filling portion includes a second filter layer that allows only the second color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

4. The method for fabricating a micro LED device according to claim 3, wherein, The first filling step further includes: When there is an unfilled first through hole in each group of first through holes, fill the unfilled first through hole with transparent material.

5. The method for fabricating a micro LED device according to claim 1, wherein, A first partition layer is disposed on a transparent substrate, such that the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponding to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including at least two first through-holes. The process involves: disposing a first partition layer on the transparent substrate and forming a first through-hole array on the first partition layer, such that the arrangement of the first through-hole array corresponds to the arrangement of the micro-LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes including two first through-holes. A first light-absorbing layer is filled into a portion of the first through-holes in each group to obtain a first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro-LED unit, comprising: filling one of the first through-holes in each group with the first light-absorbing layer to obtain the first intermediate structure, wherein the first light-absorbing layer is used to partially absorb the third color light emitted by the micro-LED unit. A second partition layer is provided on a first intermediate structure, such that the second partition layer includes a second through-hole array, the second through-hole array corresponding to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and the second through-hole in each set of second through-holes corresponds to the first through-hole in the corresponding first through-hole set. This includes: providing a second partition layer on the first intermediate structure and opening a second through-hole array on the second partition layer, such that the second through-hole array corresponds to the first through-hole array, wherein the second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes, and each set of second through-holes includes two second through-holes respectively aligned with two first through-holes in the corresponding first through-hole set. The photoluminescent material layer includes a fourth color photoluminescent material layer. The photoluminescent material layer is filled in the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer to obtain a first color conversion structure. The color of the light emitted by the micro LED unit is different from the color corresponding to the photoluminescent material layer, which includes filling the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer with a fourth color photoluminescent material layer. The light corresponding to the fourth color and the light corresponding to the third color are combined to obtain white light.

6. The method for fabricating a micro LED device according to claim 5, wherein, When filling a portion of the first through-holes in each group of first through-holes with a first light-absorbing layer, the method further includes: A third filling portion is filled in the first through hole of each group of first through holes that is not filled with the first light-absorbing layer. The third filling portion includes a third light-filtering layer that allows only the fourth color of light to pass through, a second light-absorbing layer for partially absorbing the third color of light, or a transparent material.

7. The method for fabricating a micro LED device according to claim 1, wherein, Before the second partition layer is disposed on the first intermediate structure, the method further includes: disposing a third light-absorbing layer on the first intermediate structure, the third light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. The provision of a second barrier layer on the first intermediate structure includes: providing a second barrier layer on the third light-absorbing layer.

8. The method for fabricating a micro LED device according to claim 1, wherein, When filling a photoluminescent material layer into a second through-hole in each group of second through-holes that does not correspond to a first through-hole filled with a first light-absorbing layer, the method further includes: A fourth filling portion, comprising a transparent material, is filled into the second through hole in each group of second through holes that corresponds to the first through hole filled with the first light-absorbing layer.

9. The method for fabricating a micro LED device according to claim 1, wherein, Before depositing the first barrier layer on the transparent substrate, the method further includes: depositing a fifth light-absorbing layer on the transparent substrate, the fifth light-absorbing layer being used to partially absorb the light emitted by the micro-LED unit. Depositing a first barrier layer on a transparent substrate includes: depositing a first barrier layer on the fifth light-absorbing layer.

10. The method for fabricating a micro LED device according to claim 1, wherein, After filling the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer with a photoluminescent material layer, the method further includes: providing an insulating layer on the second barrier layer and the photoluminescent material layer. Bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip includes: bonding the insulating layer of the first color conversion structure to the light-emitting side of the microLED chip.

11. The method for fabricating a micro LED device according to claim 1, wherein, After bonding the side of the first color conversion structure opposite to the transparent substrate to the light-emitting side of the microLED chip, the method includes: Remove the transparent substrate of the first color conversion structure to obtain the second color conversion structure.

12. A miniature LED device, wherein, The micro-LED device includes a second color conversion structure and a micro-LED chip structure. The micro-LED chip structure includes a micro-LED chip, and the micro-LED chip includes a micro-LED unit array composed of multiple micro-LED units. The second color conversion structure includes: A first partition layer, the first partition layer includes a first through-hole array, the arrangement of the first through-hole array corresponds to the arrangement of the micro LED unit array, wherein the first through-hole array includes multiple sets of first through-holes, each set of first through-holes includes at least two first through-holes; A first light-absorbing layer is filled in a portion of the first through-holes in each group of first through-holes, wherein the first light-absorbing layer is used to partially absorb the light emitted by the micro LED unit; A second barrier layer is disposed below the first barrier layer and the first light-absorbing layer. The second barrier layer includes a second through-hole array, which corresponds to the first through-hole array. The second through-hole array includes multiple sets of second through-holes corresponding to the multiple sets of first through-holes. The second through-hole in each set of second through-holes corresponds to the first through-hole in the corresponding first through-hole group. A photoluminescent material layer is provided, which fills the second through-holes in each group of second through-holes that do not correspond to the first through-holes filled with the first light-absorbing layer. The color of the light emitted by the micro-LED unit is different from the color corresponding to the photoluminescent material layer. The second barrier layer and the photoluminescent material layer of the second color conversion structure are disposed on the light-emitting side of the micro LED chip.

13. The micro LED device according to claim 12, wherein, Each group of first through holes includes two first through holes. The first light-absorbing layer fills one of the first through holes in each group of first through holes. The first light-absorbing layer is used to partially absorb the third color light emitted by the micro LED unit. Each group of second through holes includes two second through holes that are respectively aligned with the two first through holes in the corresponding group of first through holes. The photoluminescent material layer includes a fourth color photoluminescent material layer. The fourth color photoluminescent material layer fills the second through holes in each group of second through holes that do not correspond to the first through holes filled with the first light-absorbing layer. The fourth color light and the third color light are combined to obtain white light.

14. The micro LED device according to claim 13, wherein, The second color conversion structure further includes a third filling portion, which is used to fill the first through-holes of each group of first through-holes that are not filled with the first light-absorbing layer. The third filling portion includes a third filter layer that only allows light of the fourth color to pass through, a second light-absorbing layer for partially absorbing light of the third color, or a transparent material.

15. The micro LED device according to claim 13, wherein, The fourth color is yellow and the third color is blue.

16. The micro LED device according to claim 12, wherein, The second color conversion structure further includes a third light-absorbing layer, which is disposed below the first barrier layer and the first light-absorbing layer. The third light-absorbing layer is used to partially absorb the light emitted by the micro LED unit, and the second barrier layer is disposed below the third light-absorbing layer.

17. The micro LED device according to claim 12, wherein, The second color conversion structure further includes a fourth filling portion, which fills the second through hole in each group of second through holes corresponding to the first through hole filled with the first light-absorbing layer, and the fourth filling portion includes a transparent material.

18. The micro LED device according to claim 12, wherein, The second color conversion structure further includes a fifth light-absorbing layer, which is disposed on the first barrier layer and is used to partially absorb the light emitted by the micro LED unit.

19. The micro LED device according to claim 12, wherein, The second color conversion structure further includes an isolation layer, which is disposed below the second barrier layer and the photoluminescent material layer. The isolation layer of the second color conversion structure is disposed on the light-emitting side of the micro LED chip.

20. The micro LED device according to claim 12, wherein, The micro LED chip structure also includes a driver chip, with one side of the micro LED chip opposite to the light-emitting side disposed on the driver chip. Alternatively, the micro LED chip structure may further include a driver chip and a flexible circuit board. The side of the micro LED chip opposite to the light-emitting side is disposed on the driver chip to form a micro LED module, and the micro LED module is disposed on the flexible circuit board through the driver chip.

21. The micro LED device according to claim 12, wherein, The materials of the first barrier layer and the second barrier layer include visible light shielding materials, and the material of the first light-absorbing layer includes organic dyes, nano-absorbing particles or inorganic oxides for absorbing blue light.

22. A display device, wherein, The display device includes the micro LED device according to any one of claims 12 to 21.

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