Base plate recycling method and circuit board punching equipment

Abstract

The invention belongs to the technical field of circuit board manufacturing, and discloses a base plate recycling method and circuit board punching device.The base plate recycling method comprises the steps that circuit board data is converted into a first coordinate plane, and a point to be punched is converted into a plurality of first coordinate points; a base plate is selected and converted into a second coordinate plane; the first coordinate plane is put into the second coordinate plane in a simulation mode, and a first batch of punching points on the base plate are calculated in a simulation mode according to the first coordinate points; two points of the first batch of punching points are selected to punch holes in the base plate, a first circuit board is placed on the base plate, and the first batch of punching points are punched and marked; the first coordinate plane is put into a second coordinate plane in a simulated mode, a second batch of punching points in the base plate are calculated by avoiding the first batch of punching points, and a second circuit board is positioned, placed and punched according to a result; and avoiding the previous batch of punching points, and sequentially simulating and putting the first coordinate plane into the second coordinate plane to calculate the latest batch of punching points until the punching points meeting the requirements cannot be calculated in the second coordinate plane.

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