Diamond wire cutting method

Abstract

This invention provides a diamond wire cutting method, comprising: a loading step: a work platform clamps a bar stock and conveys it to the starting position of processing; a cutting step: controlling the diamond wire to cut the bar stock in a reciprocating motion, wherein during the cutting process, as the cutting depth of the bar stock increases, the set values ​​for both the table speed of the bar stock movement and the feed speed of the diamond wire movement are first increased and then decreased; and an unloading step: the work platform drives the bar stock to completely detach from the diamond wire. This invention solves the problem of insufficient cutting force of abnormal diamond wire in the prior art, which easily leads to wire marks.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing, and more specifically, to a diamond wire cutting method. Background Technology

[0002] Currently, in the photovoltaic market, large-size silicon wafers bring significant economic benefits in solar silicon wafer cutting. A 182.2 mm silicon wafer, compared to a conventional 156.75 mm wafer, has a 25% larger area, resulting in a larger effective light-emitting area per module, and consequently, improved conversion efficiency and power. Large-size silicon wafers reduce the number of cells required per module, lowering costs and increasing the return on investment. However, this also necessitates extremely high flatness precision and minimal surface roughness in the silicon wafer cutting process. However, during silicon wafer cutting, some abnormal diamond wires, such as those with uneven sandblasting or short cutting force duration, result in insufficient cutting ability, producing a large number of silicon wafers with surface marks. These marks, varying in depth, account for 20-30% of defective silicon wafers, severely impacting the quality and yield of the wafers. Summary of the Invention

[0003] The main objective of this invention is to provide a diamond wire cutting method to solve the problem of insufficient cutting force of abnormal diamond wire in the prior art, which easily produces wire marks.

[0004] To achieve the above objectives, according to one aspect of the present invention, a diamond wire cutting method is provided, comprising: a loading step: a work platform clamps a bar stock and conveys the bar stock to the starting position of processing; a cutting step: controlling the diamond wire to cut the bar stock in a reciprocating motion, wherein during the cutting process, as the cutting depth of the bar stock increases, the set values ​​of the table speed for bar stock movement and the set values ​​of the infeed speed for diamond wire movement are both increased first and then decreased; and an unloading step: the work platform drives the bar stock to completely detach from the diamond wire.

[0005] Furthermore, the diamond wire cutting method also includes: during the cutting step, when the set table speed setting value increases, the set feed wire speed increases or remains unchanged; when the set table speed setting value decreases, the set feed wire speed setting value decreases or remains unchanged; when the set feed wire speed increases, the set table speed setting value increases or remains unchanged; when the set feed wire speed setting value decreases, the set table speed setting value decreases or remains unchanged.

[0006] Furthermore, the diamond wire cutting method also includes: during the cutting step, obtaining the actual cutting depth of the bar stock, comparing the actual cutting depth with a first preset depth, and when the actual cutting depth is less than the first preset depth, setting at least one of the feed line speed setting value and the table speed setting value to keep increasing.

[0007] Furthermore, the diamond wire cutting method also includes: during the cutting step, the first preset depth is 30%-35% of the total cutting depth of the bar stock.

[0008] Furthermore, the diamond wire cutting method also includes: during the cutting step, obtaining the actual cutting depth of the bar stock, comparing the actual cutting depth with a second preset depth, and while the actual cutting depth is greater than or equal to the second preset depth, setting at least one of the feed line speed setting value and the table speed setting value to keep decreasing.

[0009] Furthermore, the diamond wire cutting method also includes: during the cutting step, the second preset depth is 80%-85% of the total cutting depth of the bar stock.

[0010] Furthermore, the diamond wire cutting method also includes: during the cutting step, obtaining the actual cutting depth of the bar stock, comparing the actual cutting depth with a first preset depth and a second preset depth, and setting at least one of the feed line speed setting value and the table speed setting value to remain unchanged during the process where the actual cutting depth is greater than or equal to the first preset depth and less than the second preset depth.

[0011] Furthermore, the diamond wire cutting method also includes: the speed of the diamond wire increases from 0 to the infeed speed set value and then decreases to 0, then reverses and increases from 0 to the infeed speed set value and then decreases to 0, which constitutes one reciprocating stroke. The infeed speed set value is the maximum value of the infeed speed of the diamond wire in each reciprocating stroke. The cutting depth of the bar is set for each reciprocating stroke of the diamond wire.

[0012] Furthermore, the diamond wire cutting method also includes: the set depth of bar cutting first increases and then decreases with the number of reciprocating passes.

[0013] Furthermore, the diamond wire cutting method also includes: obtaining the actual cutting depth of the bar stock, comparing the actual cutting depth with a predetermined depth, and during the process where the actual cutting depth is greater than or equal to the predetermined depth, the table speed of the bar stock and the feed speed of the diamond wire change in the same way.

[0014] Furthermore, the diamond wire cutting method also includes: obtaining the actual cutting depth of the bar stock, comparing the actual cutting depth with the predetermined depth, and when the actual cutting depth is less than the predetermined depth, the diamond wire performs one reciprocating motion while the table speed of the bar stock remains unchanged.

[0015] Furthermore, the diamond wire cutting method also includes: when the settable speed is increased, the settable speed gradually increases from 500 m / min to 2200 m / min; when the set feed rate is increased, the set feed rate gradually increases from 800 μm / min to 2400 μm / min; when the settable speed is decreased, the settable speed gradually decreases from 2400 μm / min to 100 μm / min; when the set feed rate is decreased, the set feed rate gradually decreases from 2200 m / min to 1600 m / min.

[0016] Furthermore, the diamond wire cutting method also includes: setting the feed rate to one of 500m / min, 1200m / min, 1800m / min, 2000m / min, 2100m / min, and 2200m / min; and setting the table speed to one of 100um / min, 200um / min, 600um / min, 800um / min, 1200um / min, 1400um / min, 1600um / min, 1800um / min, 1900um / min, 2100um / min, 2200um / min, 2300um / min, and 2400um / min.

[0017] According to another aspect of the present invention, a slicing machine is provided for performing the diamond wire cutting method described above. The slicing machine includes: a working platform and a diamond wire, the working platform being used to hold a bar stock and being movably disposed along a first direction; the diamond wire being used to cut the bar stock and being movably disposed along a second direction, the first direction and the second direction being disposed at an angle.

[0018] By applying the technical solution of this invention, in the cutting step of the diamond wire rod, the settable speed and the feed line speed are configured to first increase and then decrease. This ensures that the settable speed and the feed line speed are continuously adjusted throughout the entire cutting process, thereby improving the silicon wafer cutting quality and increasing the yield rate. Specifically, the settable speed and the feed line speed are lower in the initial and final stages of cutting to ensure a smooth cutting surface and reduce wire marks, thus compensating for insufficient cutting force of the abnormal diamond wire. This allows even abnormal diamond wire to cut qualified silicon wafers. The settable speed and the feed line speed are higher in the middle stage of cutting to ensure cutting efficiency. This cutting method maximizes the utilization of abnormal diamond wire, reducing waste and lowering production costs. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0020] Figure 1 A flowchart of the diamond wire cutting method of the present invention is shown. Detailed Implementation

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0023] In this invention, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.

[0024] To address the problem of insufficient cutting force in existing diamond wire cutting methods, which easily leads to wire marks, this invention provides a diamond wire cutting method.

[0025] like Figure 1 The diamond wire cutting method shown includes: a loading step: the work platform clamps the bar stock and transports the bar stock to the starting position of processing; a cutting step: the diamond wire is controlled to cut the bar stock in a reciprocating motion. During the cutting process, as the cutting depth of the bar stock increases, the set values ​​of the table speed for bar stock movement and the infeed speed for diamond wire movement are first increased and then decreased; and a unloading step: the work platform drives the bar stock to completely detach from the diamond wire.

[0026] This embodiment sets the table speed and feed line speed settings during the wire cutting process of the rod to initially increase and then decrease. This ensures continuous adjustment of these settings throughout the entire cutting process, improving silicon wafer cutting quality and yield. Specifically, the table speed and feed line speed settings are lower at the beginning and end of the cutting process to ensure a smooth cut surface, reduce wire marks, and compensate for insufficient cutting force from the abnormal diamond wire. This allows even abnormal diamond wire to cut qualified silicon wafers. The table speed and feed line speed settings are higher during the middle stage of the cutting process to ensure cutting efficiency. This cutting method maximizes the utilization of the abnormal diamond wire, reducing waste and lowering production costs.

[0027] In this embodiment, the diamond wire cutting method further includes: during the cutting step, when the settable speed is increased, the set feed speed is increased or remains unchanged; when the settable speed is decreased, the set feed speed is decreased or remains unchanged; when the set feed speed is increased, the settable speed is increased or remains unchanged; when the set feed speed is decreased, the settable speed is decreased or remains unchanged. This synchronous or semi-synchronous adjustment strategy can reduce material vibration caused by speed mismatch, thereby compensating for the problem of wire marks easily generated by abnormal diamond wire cutting, thus ensuring stability and material uniformity during the cutting process, ensuring the flatness of the cut surface, and thus improving the yield of silicon wafers.

[0028] In this embodiment, the diamond wire cutting method further includes: during the cutting step, obtaining the actual cutting depth of the rod and comparing the actual cutting depth with a first preset depth. If the actual cutting depth is less than the first preset depth, at least one of the feed speed setting and the table speed setting is increased to ensure stability in the initial cutting stage and efficiency in the middle cutting stage, thereby guaranteeing the yield of the silicon wafer. Specifically, the process where the actual cutting depth is less than the first preset depth is the process from the start of cutting the rod to cutting it to the first preset depth. In this embodiment, this refers to the cutting processes numbered 1 to 6 in Table 1. That is, the first preset depth in this embodiment is 140mm. During the cutting processes numbered 1 to 6, the feed speed setting increases from 500m / min to 2200m / min, and the table speed setting increases from 800μm / min to 2400μm / min. Of course, depending on the actual total cutting depth of the rod, the first preset depth can be adjusted proportionally according to the actual situation.

[0029] Preferably, the first preset depth can be set to 30%-35% of the total cutting depth of the bar stock.

[0030] In this embodiment, the diamond wire cutting method further includes: during the cutting step, obtaining the actual cutting depth of the bar stock and comparing the actual cutting depth with a second preset depth; while the actual cutting depth is greater than or equal to the second preset depth, setting at least one of the feed wire speed setting value and the table speed setting value to keep decreasing, thereby ensuring cutting efficiency in the middle stage of cutting and stability in the end stage of cutting.

[0031] This ensures a high yield rate for silicon wafers. Specifically, the process where the actual cutting depth is greater than or equal to the second preset depth is the process from the second preset depth to the end of cutting. In this embodiment, it refers to the cutting processes numbered 10 to 19 in Table 1. The second preset depth in this embodiment is 170mm. During the cutting processes from 10 to 19, the feed rate is reduced from 2200m / min to 1600m / min, and the table speed is reduced from 2200μm / min to 100μm / min. This ensures fine-tuning at the end of the cutting process, reduces micro-cracks in the material, and guarantees the flatness of the cut surface. Of course, depending on the actual total cutting depth of the bar stock, the second preset depth can be adjusted proportionally according to the actual situation.

[0032] Preferably, the second preset depth is 80%-85% of the total cutting depth of the bar stock, thereby ensuring that the cutting speed is reduced when the cutting is nearing completion, reducing thermal damage to the material, improving the flatness of the cut surface, and thus improving the quality of the product.

[0033] In this embodiment, the diamond wire cutting method further includes: during the cutting step, obtaining the actual cutting depth of the bar stock, and comparing the actual cutting depth with a first preset depth and a second preset depth. If the actual cutting depth is greater than or equal to the first preset depth but less than the second preset depth, at least one of the feed line speed setting value and the table speed setting value is kept constant. This ensures cutting efficiency and stability during the cutting process, reduces material vibration caused by speed changes, and improves cutting accuracy. Specifically, this process refers to the cutting processes numbered 7 to 9 in Table 1. During this process, both the feed line speed setting value and the table speed setting value are maintained at their maximum values: the feed line speed setting value is maintained at 2200 m / min, and the table speed setting value is maintained at 2400 μm / min, to ensure the cutting speed of the bar stock.

[0034] In this embodiment, the diamond wire cutting method further includes: the speed of the diamond wire increasing from 0 to a set infeed speed value and then decreasing to 0, then reversing and increasing from 0 to the set infeed speed value and then decreasing to 0, constituting one reciprocating stroke. The set infeed speed value is the maximum value of the infeed speed of the diamond wire in each reciprocating stroke. A set cutting depth is set for each reciprocating stroke of the diamond wire. Specifically, the entire cutting process of the bar consists of multiple reciprocating strokes of the diamond wire. The set infeed speed value for each reciprocating stroke can be the same or different. The cutting depth of the bar in each reciprocating stroke, i.e., the set depth, can be set to be the same or different, as shown in Table 1. The table shows a total of 19 reciprocating strokes of the diamond wire. In each reciprocating stroke, the diamond wire undergoes both forward acceleration / deceleration and reverse acceleration / deceleration processes.

[0035] In this embodiment, taking number 1 as an example, the depth is set to 5mm and the cutting speed is set to 500m / min. During the cutting process, the speed of the diamond wire increases uniformly from 0m / min to the cutting speed set to 500m / min, and then decreases uniformly to 0m / min before reversing. During the reverse movement, the speed of the diamond wire also increases uniformly from 0m / min to the cutting speed set to 500m / min, and then decreases uniformly to 0m / min. Thus, the first reciprocating cutting is completed. Taking number 2 as an example, the initial cutting depth of the bar stock is 5mm, and the cutting continues to 10mm. The reciprocating cutting process of the diamond wire is as follows: the speed of the diamond wire increases uniformly from 0m / min to the infeed speed setting of 1200m / min, and then decreases uniformly to 0m / min before reversing. During the reverse movement, the speed of the diamond wire also increases uniformly from 0m / min to the infeed speed setting of 1200m / min, and then decreases uniformly to 0m / min. This completes the second reciprocating cutting process. Taking number 3 as an example, the initial cutting depth of the bar stock is 10mm, and the cutting continues to 20mm. The reciprocating cutting process of the diamond wire is as follows: the speed of the diamond wire increases uniformly from 0m / min to the infeed speed setting of 1800m / min, and then decreases uniformly to 0m / min before reversing. During the reverse movement, the speed of the diamond wire also increases uniformly from 0m / min to the infeed speed setting of 1800m / min, and then decreases uniformly to 0m / min. This completes the third reciprocating cutting process. Taking number 4 as an example, the initial cutting depth of the bar stock is 20mm, and the cutting continues to 40mm. The reciprocating cutting process of the diamond wire is as follows: the speed of the diamond wire increases uniformly from 0m / min to the infeed speed setting of 2000m / min, and then decreases uniformly to 0m / min before reversing. During the reverse movement, the speed of the diamond wire also increases uniformly from 0m / min to the infeed speed setting of 2000m / min, and then decreases uniformly to 0m / min. Thus, the fourth reciprocating cutting is completed. Taking steps 5 through 9 as examples, the initial cutting depth of the bar stock is 40mm, continuing to 160mm. The diamond wire feed rate is increased to 2100m / min in the 5th reciprocating pass and to 2200m / min in the 6th reciprocating pass, remaining at 2200m / min in subsequent passes. Throughout this process, all cutting is done with fresh diamond wire, thus reaching maximum table speed and feed rate. In subsequent steps 10 through 19, where the cutting depth increases from 160mm to 191.5mm, the diamond wire continues to feed in a reciprocating manner, which will not be elaborated further. However, in steps 10 through 14, fresh diamond wire continues to be used for cutting, thereby reducing cutting marks and improving cutting quality.In processes 15 to 19, the silicon wafer has already been cut. The next step is cutting the lower-hardness plastic sheet. Therefore, no new diamond wire needs to be supplied to cut through the plastic sheet to the designated position; simply unwind the old diamond wire and cut the plastic sheet again. This reciprocating wire routing method effectively reduces diamond wire wear, maximizing the utilization of defective diamond wire, minimizing waste, and thus lowering production costs.

[0036] In this embodiment, the diamond wire cutting method further includes: the set depth of bar cutting first increases and then decreases with the number of reciprocating passes, meaning the change in set depth matches the change pattern of the feed rate and table speed settings, thereby ensuring fine adjustment at the beginning and end of the cutting process and cutting efficiency in the middle stage. Specifically, as shown in Table 1, the set depth gradually increases from number 1 to number 8. Of course, the specific value of the set depth can be adjusted according to actual conditions.

[0037] In this embodiment, the diamond wire cutting method further includes: obtaining the actual cutting depth of the bar stock and comparing the actual cutting depth with a predetermined depth. During the process where the actual cutting depth is greater than or equal to the predetermined depth, the table speed of the bar stock and the feed speed of the diamond wire change in the same way, so that the feed speed setting value and the table speed setting value can simultaneously respond to the change in cutting depth, ensuring the continuity and stability of the cutting process, guaranteeing the cutting quality of the diamond wire, and avoiding wire marks. Specifically, the predetermined depth in this embodiment is 5mm in Table 1. During the cutting processes from number 2 to number 19, the change pattern of the table speed matches the speed change pattern of the reciprocating wire travel process. Taking the table speed in number 2 as an example, during the process where the feed speed of the diamond wire increases from 0m / min to 1200m / min, the table speed increases uniformly to 1800μm / min; during the process where the feed speed of the diamond wire decreases to 0m / min, the table speed decreases uniformly to 0μm / min. Taking the table speed in step 3 as an example, as the diamond wire entry velocity increases from 0 m / min to 1800 m / min, the table speed increases uniformly to 2100 μm / min. Conversely, as the diamond wire entry velocity decreases to 0 m / min, the table speed decreases uniformly to 0 μm / min. The subsequent table speed variation follows the same pattern as in steps 2 and 3, and will not be repeated here.

[0038] In this embodiment, the diamond wire cutting method further includes: obtaining the actual cutting depth of the bar stock and comparing the actual cutting depth with a predetermined depth. When the actual cutting depth is less than the predetermined depth, the diamond wire performs one reciprocating stroke, while the table speed of the bar stock remains constant. This ensures the stability of the bar stock when the cutting depth has not reached the predetermined depth and reduces cutting marks caused by speed variations. Specifically, the process in this embodiment where the actual cutting depth is less than the predetermined depth is the cutting process number 1 in Table 1. During this process, the entry speed of the diamond wire changes according to the reciprocating stroke pattern, while the table speed of the bar stock remains constant at 800 μm / min, thereby ensuring the stability of the bar stock in the initial stage of cutting.

[0039] In this embodiment, the diamond wire cutting method further includes: when the settable speed is increased, the settable speed is gradually increased from 500 m / min to 2200 m / min; when the set feed wire speed is increased, the set feed wire speed is gradually increased from 800 μm / min to 2400 μm / min; when the settable speed is decreased, the settable speed is gradually decreased from 2400 μm / min to 100 μm / min; when the set feed wire speed is decreased, the set feed wire speed is gradually decreased from 2200 m / min to 1600 m / min, thereby ensuring high efficiency and stability in the cutting process and being able to be flexibly adjusted to adapt to different cutting needs.

[0040] In this embodiment, the diamond wire cutting method further includes: setting the feed rate to one of 500m / min, 1200m / min, 1800m / min, 2000m / min, 2100m / min, and 2200m / min; and setting the table speed to one of 100um / min, 200um / min, 600um / min, 800um / min, 1200um / min, 1400um / min, 1600um / min, 1800um / min, 1900um / min, 2100um / min, 2200um / min, 2300um / min, and 2400um / min, to ensure cutting quality and cutting efficiency.

[0041] It should be noted that this embodiment uses a bar cutting depth of 191.5mm as an example. In actual use, the cutting parameters, such as the predetermined depth and preset depth, can be adjusted according to the size of the bar. During the cutting process, the wire feed rate, wire return rate, infeed wire speed, and table speed of the slicing machine should be matched. The starting position in this embodiment refers to the position where the bar is 0.5mm away from the diamond wire, which can be adjusted according to the actual situation.

[0042] Table 1

[0043]

[0044] This embodiment addresses abnormal diamond wire cutting force by adjusting the cutting depth, table speed, wire speed, and feed / return wire settings. This ensures that the table speed and feed wire speed are optimally matched at each step, guaranteeing a continuous supply of new diamond wire throughout the cutting process until the cutting is complete. By rationally connecting the parameters at each stage, wear on the rod caused by the diamond wire during reversal is reduced, effectively decreasing the depth of the grooves and thus altering the silicon wafer's parameter defects. This reduces the generation of wire marks and the roughness of the silicon wafer, thereby improving the silicon wafer cutting quality. It also maximizes the use of abnormal diamond wire, saving costs and increasing efficiency.

[0045] This invention also provides a slicing machine for performing the aforementioned diamond wire cutting method. The slicing machine includes a working platform and a diamond wire. The working platform is used to hold the bar stock and is movable along a first direction. The diamond wire is used to cut the bar stock and is movable along a second direction, with the first and second directions forming an angle. In this way, the slicing machine achieves the aforementioned cutting method by precisely controlling the movement of the bar stock and the diamond wire, thereby ensuring the cutting quality of abnormal diamond wires, improving cutting efficiency and accuracy, and reducing production costs.

[0046] It should be noted that "multiple" in the above embodiments refers to at least two.

[0047] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0048] 1. This solves the problem of insufficient cutting force of abnormal diamond wire in existing technologies, which easily leads to wire marks;

[0049] 2. By setting the table speed and feed line speed settings during the diamond wire cutting process of the rod to initially increase and then decrease, these settings are continuously adjusted throughout the entire cutting process. This improves the silicon wafer cutting quality and ultimately increases the yield rate. Specifically, the table speed and feed line speed settings are lower at the beginning and end of the cutting process to ensure a smooth cut surface, reduce wire marks, and compensate for insufficient cutting force from abnormal diamond wires. This allows even abnormal diamond wires to cut qualified silicon wafers. The table speed and feed line speed settings are higher during the middle of the cutting process to ensure cutting efficiency.

[0050] 3. This allows for the maximum utilization of abnormal diamond wire, thereby reducing waste and lowering production costs.

[0051] Obviously, the embodiments described above are merely some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention.

[0052] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0053] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0054] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method of cutting with a diamond wire, characterized in that, include: Feeding step: The work platform clamps the bar stock and conveys the bar stock to the starting position of processing; Cutting steps: Control the diamond wire to cut the bar in a reciprocating motion. During the cutting process, as the cutting depth of the bar increases, the table speed setting value for the bar movement and the infeed speed setting value for the diamond wire movement are both increased first and then decreased. Material feeding step: The working platform drives the bar stock to completely detach from the diamond wire; During the cutting step... When the table speed setting value is increased, the tool feed rate is set to increase or remain unchanged; when the table speed setting value is decreased, the tool feed rate setting value is set to decrease or remain unchanged. When the feed rate is increased, the table speed setting value is either increased or remains unchanged; when the feed rate is decreased, the table speed setting value is either decreased or remains unchanged. The diamond wire cutting method further includes: during the cutting step... The actual cutting depth of the bar stock is obtained and compared with a first preset depth. When the actual cutting depth is less than the first preset depth, at least one of the infeed line speed setting value and the table speed setting value is kept increasing. The diamond wire cutting method further includes: during the cutting step... The actual cutting depth of the bar stock is obtained, and the actual cutting depth is compared with a second preset depth. During the process where the actual cutting depth is greater than or equal to the second preset depth, at least one of the tool feed line speed setting value and the table speed setting value is kept decreasing. The process where the actual cutting depth is less than the first preset depth is the process from the start of cutting the bar stock to the cutting of the bar stock to the first preset depth. The process where the actual cutting depth is greater than or equal to the second preset depth is the process from the second preset depth to the end of the cutting; The diamond wire cutting method further includes: during the cutting step... The actual cutting depth of the bar stock is obtained, and the actual cutting depth is compared with a first preset depth and a second preset depth. During the process where the actual cutting depth is greater than or equal to the first preset depth and less than the second preset depth, at least one of the tool feed line speed setting value and the table speed setting value is kept constant. The diamond wire cutting method further includes: The speed of the diamond wire increases from 0 to the set value of the infeed speed and then decreases to 0, then reverses and increases from 0 to the set value of the infeed speed and then decreases to 0, which constitutes one reciprocating stroke. The set value of the infeed speed is the maximum value of the infeed speed of the diamond wire in each reciprocating stroke. The cutting depth of the bar is set for each reciprocating stroke of the diamond wire.

2. The diamond wire cutting method according to claim 1, characterized in that, The diamond wire cutting method further includes: during the cutting step... The first preset depth is 30%-35% of the total cutting depth of the bar stock.

3. The diamond wire cutting method according to claim 1, characterized in that, The diamond wire cutting method further includes: during the cutting step... The second preset depth is 80%-85% of the total cutting depth of the bar stock.

4. The diamond wire cutting method according to claim 1, characterized in that, The diamond wire cutting method further includes: The set depth of the bar cutting first increases and then decreases with the number of reciprocating passes.

5. The diamond wire cutting method according to claim 1, characterized in that, The diamond wire cutting method further includes: The actual cutting depth of the bar stock is obtained and compared with a predetermined depth. During the process where the actual cutting depth is greater than or equal to the predetermined depth, the table speed of the bar stock and the feed speed of the diamond wire change in the same way.

6. The diamond wire cutting method according to claim 1, characterized in that, The diamond wire cutting method further includes: The actual cutting depth of the bar stock is obtained and compared with a predetermined depth. When the actual cutting depth is less than the predetermined depth, the diamond wire performs one reciprocating stroke, and the table speed of the bar stock remains unchanged.

7. The diamond wire cutting method according to claim 1, characterized in that, The diamond wire cutting method further includes: When the table speed setting value is increased, the table speed setting value gradually increases from 500m / min to 2200m / min; when the tool infeed speed setting value is increased, the tool infeed speed setting value gradually increases from 800um / min to 2400um / min. When the table speed setting value is reduced, the table speed setting value gradually decreases from 2400um / min to 100um / min. When the tool feed rate setting value is reduced, the tool feed rate setting value gradually decreases from 2200m / min to 1600m / min.

8. The diamond wire cutting method according to claim 1, characterized in that, The diamond wire cutting method further includes: The tool feed rate is set to one of the following values: 500 m / min, 1200 m / min, 1800 m / min, 2000 m / min, 2100 m / min, and 2200 m / min. The speed setting is set to one of the following values: 100um / min, 200um / min, 600um / min, 800um / min, 1200um / min, 1400um / min, 1600um / min, 1800um / min, 1900um / min, 2100um / min, 2200um / min, 2300um / min, and 2400um / min.

9. A slicer, characterized in that, For performing the diamond wire cutting method according to any one of claims 1 to 8, the slicing machine comprises: A working platform for clamping bar stock, the working platform being movable along a first direction; Diamond wire, used for cutting the bar stock, is movable along a second direction, with the first direction and the second direction forming an angle.

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