Preparation method of copolyamide hot melt adhesive

CN119823706AInactive Publication Date: 2025-04-15SHANGHAI DONGRUI CHEM

Patent Information

Application Number
CN202510294169.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-13
Publication Date
2025-04-15
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing copolyamide hot melt adhesives are difficult to maintain high bond strength while reducing the melting point, especially in textile applications.

Method used

By using castor oil as the initial reaction raw material, epoxy castor oil is formed and copolymerized with galacturonic acid, citric acid and hexanediamine. Finally, the terminal blocking is performed with fluorine-containing acid, and surface-modified vapor-phase silica is added as the nucleating agent to control the reaction temperature and vacuum degree to prepare a low-melting point copolyamide hot melt adhesive.

Benefits of technology

The preparation of low-melting point copolyamide hot melt adhesive has good bonding properties and water-resistant properties, high peel strength, and is suitable for textile applications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of high polymer materials, in particular to a preparation method of a copolyamide hot melt adhesive. The problems that a copolyamide hot melt adhesive is high in melting point and poor in bonding performance with a textile fabric after being washed with water are solved. Castor oil is added into a system to introduce a branched structure, the branched structure, citric acid and hexamethylenediamine are subjected to a copolymerization reaction, finally, fluorine-containing acid is used for end capping treatment, surface-modified fumed silica is added in the preparation process to serve as a nucleating agent, and the copolyamide hot melt adhesive is prepared. The copolyamide hot melt adhesive is low in melting point, good in adhesive property with the textile fabric and high in peel strength after being washed with water.
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Citation Information

Patent Citations

  • Low-melting-point polyamide hot melt adhesive with high weather resistance and preparation method thereof

    CN102924712A

  • A high-performance copolyamide hot melt adhesive composition

    CN110845987B

  • A low-VOC copolyamide hot melt adhesive and its preparation method

    CN111040721B

  • Polyamic acid solution, preparation method thereof and raw material composition for preparing polyamic acid solution

    CN119219919A

  • Two-component polyurethane adhesive as well as preparation method and application thereof

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