Preparation method of copolyamide hot melt adhesive
Patent Information
- Application Number
- CN202510294169.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2025-04-15
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing copolyamide hot melt adhesives are difficult to maintain high bond strength while reducing the melting point, especially in textile applications.
By using castor oil as the initial reaction raw material, epoxy castor oil is formed and copolymerized with galacturonic acid, citric acid and hexanediamine. Finally, the terminal blocking is performed with fluorine-containing acid, and surface-modified vapor-phase silica is added as the nucleating agent to control the reaction temperature and vacuum degree to prepare a low-melting point copolyamide hot melt adhesive.
The preparation of low-melting point copolyamide hot melt adhesive has good bonding properties and water-resistant properties, high peel strength, and is suitable for textile applications.
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Abstract
Citation Information
Patent Citations
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