Stereoscopic circuit device, imaging device, endoscope, and method for manufacturing imaging device

Abstract

The three-dimensional circuit device includes: a plurality of first pads disposed at N-order symmetrical positions (N is a natural number of 2 or more), the plurality of first pads being soldered to each of a plurality of peripheral electrodes among a plurality of external electrodes of a camera unit; a plurality of first conductor patterns, the plurality of first conductor patterns are configured at N-time symmetrical positions, each of the plurality of first conductor patterns is provided with a first end and a second end, and each first end is connected with the plurality of first welding pads; and a plurality of terminal pads connected to the second ends of the plurality of first conductor patterns, respectively.

Description

Technical Field

[0001] The present invention relates to a three-dimensional circuit device equipped with a camera unit, a camera device in which a camera unit is accommodated in the three-dimensional circuit device, an endoscope having a camera device in which a camera unit is accommodated in the three-dimensional circuit device, and a method for manufacturing a camera device in which a camera unit is accommodated in the three-dimensional circuit device. Background Art

[0002] In recent years, three-dimensional circuit devices, such as molded circuit devices (MID: Molded Interconnect Device), have been used to achieve miniaturization and high functionality of electronic devices.

[0003] Japanese Patent Publication No. 2017-23234 discloses a camera unit of an endoscope using a special-shaped circuit substrate as a three-dimensional circuit device. The camera unit includes an imaging element, a flat wiring board (flat wiring board) on which electronic components are mounted, and a special-shaped circuit substrate (three-dimensional wiring board). A plurality of cables are respectively connected to a plurality of side surfaces of the special-shaped circuit substrate.

[0004] In order to solder and join electronic components to pads of a conductor pattern, a solder resist pattern is provided to cover the periphery of the pads in order to prevent short circuits between the pads and to prevent solder from flowing out.

[0005] International Publication No. 2009 / 090896 discloses an electronic device in which an elongated insulating film (solder resist pattern) is provided on a conductive pattern formed on a main surface of a flat wiring board.

[0006] The solder resist pattern is formed by patterning a spin-coated solder resist or a thin film solder resist using a photolithography method. The solder resist pattern may also be formed by screen printing the solder resist.

[0007] However, it is not easy to provide a solder resist pattern on the surface of a three-dimensional circuit device. In other words, unlike a flat wiring board, it is difficult to perform spin coating or screen printing on the surface of a three-dimensional circuit device. Furthermore, it is also difficult to pattern the solder resist on the surface of a three-dimensional circuit device using photolithography.

[0008] When the camera unit is soldered to the pad of the three-dimensional circuit device, if there is no solder resist pattern covering the pad, the solder will flow to the conductive pattern around the pad, and the camera unit may move from the specified position. When the optical axis of the camera unit deviates from the specified position, the desired field of view may not be obtained, resulting in reduced performance of the camera device.

[0009] Prior art literature

[0010] Patent Literature

[0011] Patent Document 1: Japanese Patent Application Publication No. 2017-23234

[0012] Patent Document 2: International Publication No. 2009 / 090896 Summary of the invention

[0013] Problems to be solved by the invention

[0014] An object of the present invention is to provide a three-dimensional circuit device that does not cause positional deviation of a camera unit, a high-performance camera device in which a camera unit is provided in the three-dimensional circuit device, an endoscope having a high-performance camera device in which a camera unit is provided in the three-dimensional circuit device, and a method for manufacturing a high-performance camera device in which a camera unit is provided in the three-dimensional circuit device.

[0015] Disclosure of the Invention

[0016] Means for solving problems

[0017] A three-dimensional circuit device according to one embodiment of the present invention comprises: a plurality of first welding pads, which are arranged at N-fold symmetrical positions and are respectively welded and joined to a plurality of peripheral electrodes among a plurality of external electrodes of a camera unit, wherein N is a natural number greater than 2; a plurality of first conductor patterns, which are arranged at N-fold symmetrical positions and each of which has a first end and a second end, each of which first end is respectively connected to the plurality of first welding pads; and a plurality of connection pads, which are respectively connected to the second ends of the plurality of first conductor patterns.

[0018] A camera device according to one embodiment of the present invention has a camera unit and a three-dimensional circuit device, wherein the camera unit has a plurality of external electrodes, and the three-dimensional circuit device has: a plurality of first welding pads, the plurality of first welding pads being arranged at N-fold symmetrical positions, the plurality of first welding pads being respectively welded and joined to a plurality of peripheral electrodes among the plurality of external electrodes of the camera unit, wherein N is a natural number greater than 2; a plurality of first conductor patterns, the plurality of first conductor patterns being arranged at N-fold symmetrical positions, the plurality of first conductor patterns respectively having a first end and a second end, each of the first ends being respectively connected to the plurality of first welding pads; and a plurality of connection pads, the plurality of connection pads being respectively connected to the second ends of the plurality of first conductor patterns.

[0019] An endoscope according to one embodiment of the present invention has a camera device at the front end of the insertion portion, wherein the camera device has a camera unit and a three-dimensional circuit device, the camera unit has a plurality of external electrodes including a plurality of peripheral electrodes, and the three-dimensional circuit device has: a plurality of first welding pads, the plurality of first welding pads are arranged at N-fold symmetrical positions, the plurality of first welding pads are respectively welded and joined to the plurality of peripheral electrodes, wherein N is a natural number greater than 2; a plurality of first conductor patterns, the plurality of first conductor patterns are arranged at N-fold symmetrical positions, the plurality of first conductor patterns each have a first end and a second end, each of the first ends is respectively connected to the plurality of first welding pads; and a plurality of connection plates, the plurality of connection plates are respectively connected to the second ends of the plurality of first conductor patterns.

[0020] A method for manufacturing an imaging device according to one embodiment of the present invention comprises the following steps: a step of manufacturing a stereoscopic circuit device, wherein the stereoscopic circuit device is provided with: a plurality of first pads, the plurality of first pads being arranged at N-fold symmetrical positions, wherein N is a natural number greater than 2; a plurality of first conductor patterns, the plurality of first conductor patterns being arranged at N-fold symmetrical positions, the plurality of first conductor patterns each having a first end and a second end, each of the first ends being connected to the plurality of first pads, respectively; a plurality of connection pads, the plurality of connection pads being connected to the second ends of the plurality of first conductor patterns, respectively; a second pad, the second pad being arranged at a symmetric center of the plurality of first pads; and and a second conductor pattern, the second conductor pattern having a third end and a fourth end, the second solder pad being connected to the third end, and a dummy solder pad among the plurality of first solder pads being connected to the fourth end; a process of using a dispenser to provide a solder resist pattern, the solder resist pattern covering at least a portion of the second conductor pattern but not covering the plurality of first conductor patterns; a process of configuring a camera unit having a plurality of external electrodes on the three-dimensional circuit device, the plurality of external electrodes comprising a central electrode and a plurality of peripheral electrodes; and a reflow soldering process of respectively soldering the plurality of external electrodes to the plurality of first solder pads, and soldering the central electrode to the second solder pad.

[0021] Effects of the Invention

[0022] According to an embodiment of the present invention, it is possible to provide a three-dimensional circuit device that does not cause positional deviation of a camera unit, a high-performance camera device in which a camera unit is provided in the three-dimensional circuit device, an endoscope having a high-performance camera device in which a camera unit is provided in the three-dimensional circuit device, and a method for manufacturing a high-performance camera device in which a camera unit is provided in the three-dimensional circuit device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a perspective view of the imaging device according to the first embodiment.

[0024] Figure 2 It is a perspective view of the imaging device according to the first embodiment.

[0025] Figure 3 It is along Figure 1 Cross-sectional view along line III-III.

[0026] Figure 4 It is a bottom view of the camera unit of the imaging device according to the first embodiment.

[0027] Figure 5 It is a bottom view of the cavity of the three-dimensional circuit device according to the first embodiment.

[0028] Figure 6 It is a bottom view of the cavity of the three-dimensional circuit device according to the first embodiment.

[0029] Figure 7 It is a bottom view of the cavity of the three-dimensional circuit device according to the first embodiment.

[0030] Figure 8 This is a flowchart of the method for manufacturing the imaging device according to the first embodiment.

[0031] Fig. 9 It is a bottom view of the cavity of the three-dimensional circuit device according to Modification 1 of the first embodiment.

[0032] Fig.10 It is a bottom view of the cavity of the three-dimensional circuit device according to the second modification of the first embodiment.

[0033] Fig.11 It is a bottom view of the cavity of the three-dimensional circuit device according to Modification 3 of the first embodiment.

[0034] Fig.12 It is a perspective view of an imaging device according to Modification 3 of the first embodiment.

[0035] Fig.13 It is a perspective view of an endoscope according to a second embodiment. DETAILED DESCRIPTION

[0036] Hereinafter, embodiments of the present invention will be described using the drawings.

[0037] In addition, the drawings based on the embodiments are schematic. The relationship between the thickness and width of each part, the ratio of the thickness of each part, etc. are different from reality. There are also parts where the relationship and ratio of each size are different between the drawings.

[0038] <First Embodiment>

[0039] Figure 1 to Figure 3An imaging device 1 according to this embodiment is shown. The imaging device 1 includes a three-dimensional circuit device 2 which is a molded circuit device (MID: Molded Interconnect Device), and a camera unit 10 .

[0040] The three-dimensional circuit device 2 is a three-dimensional (stereoscopic) molded circuit device having a conductor pattern on the surface of an injection-molded three-dimensional molded product. By using the three-dimensional circuit device 2, unlike the conventional flat conductor pattern plate, the shape has a function and the conductor pattern can be formed on an inclined surface, a vertical surface, a curved surface, and a through hole.

[0041] The three-dimensional circuit device 2 has a complex three-dimensional structure. Specifically, the three-dimensional circuit device 2 has a convex region 3 and an assembly region 4. The convex region 3 forms a cavity H10 which is a hole for accommodating the camera unit 10.

[0042] A plurality of first pads 61 are disposed on the bottom surface H10SB of the cavity H10. The three-dimensional circuit device 2 has a through electrode 80 that reaches the surface 40SA on the opposite side of the bottom surface H10SB below the first pad 61. A conductor pattern 40 connected to the through electrode 80 is disposed on the surface 40SA, and an electronic component such as a chip capacitor 30 is mounted on the surface of the conductor pattern 40. Although not shown in the figure, a signal cable is connected to the pad 49 of the conductor pattern 40.

[0043] like Figure 3 As shown, the gap between the camera unit 10 accommodated in the cavity H10 and the wall surface of the cavity H10 is filled with a sealing resin 20. The camera unit 10 includes an imager 11 and an optical unit 12. The optical unit 12 includes a plurality of lenses, etc. The imager 11 is a CCD, CMOS, etc. that converts the subject image focused by the optical unit 12 into an electrical signal.

[0044] like Figure 4 As shown, the camera unit 10 (imager 11) has a plurality of external electrodes 19 for transmitting and receiving electric signals on the bottom surface 10SB. The external electrodes 19 include a central electrode 19A and eight peripheral electrodes 19B surrounding the central electrode 19A. Solder bumps 18 are provided on each of the plurality of external electrodes 19 arranged in a grid pattern, forming a ball grid array.

[0045] like Figure 5 As shown, pads 60 are provided on the bottom surface H10SB of the three-dimensional circuit device 2 to be bonded to the external electrodes 19 of the camera unit 10 via solder bumps 18. The pads 60 are composed of first pads 61 bonded to the peripheral electrodes 19B and second pads 61A bonded to the central electrodes 19A.

[0046] The first pad 61 is connected to the first end 71A of the first conductor pattern 71 having the first end 71A and the second end 71B. The plurality of elongated first conductor patterns 71 are arranged radially outward with the second pad 61A as the center. The second end 71B of the first conductor pattern 71 is connected to the connection land 62 disposed on the through electrode 80. The interval between the plurality of connection lands 62 is longer than the interval between the plurality of first pads 61. Therefore, crosstalk of the electrical signal of the imaging device 1 is suppressed.

[0047] Furthermore, a second pad 61A is provided on the bottom surface H10SB to be joined to the center electrode 19A of the external electrode 19 of the camera unit 10. The second pad 61A is connected to the third end 72C of the second conductor pattern 72 having the third end 72C and the fourth end 73D. The fourth end 72D of the second conductor pattern 72 is connected to a dummy pad 61D of the plurality of first pads 61.

[0048] The dummy pad 61D is a conductor pattern for arranging the plurality of first pads 61 at four-fold symmetrical positions. The dummy pad 61D may not be connected to the through wiring 80. Furthermore, the peripheral electrode 19B connected to the through wiring 80 connected to the dummy pad 61D may not be connected to the internal circuit of the camera unit 10. The dummy pad 61D may have the same potential as the second pad 61A, for example, a set potential.

[0049] The three-dimensional circuit device 2 has a solder resist pattern 90 on the bottom surface H10SB that covers at least a portion of the second conductor pattern 72 and does not cover the plurality of first conductor patterns 71. The solder resist pattern 90 is composed of a first solder resist pattern 91 and a second solder resist pattern 92 that respectively intersect the second conductor pattern 72. The first solder resist pattern 91 covers the third end 72C of the second conductor pattern 72, and the second solder resist pattern 92 covers the fourth end 72D of the second conductor pattern 72.

[0050] like Figure 6 As shown, the plurality of first pads 61 are arranged at four-fold symmetric positions with the second pad 61A located at the optical axis position as the center O. In other words, the plurality of first pads 61 are arranged at overlapping positions when rotated 90 degrees relative to the center O. Similarly, the plurality of first conductor patterns 71 are arranged at four-fold symmetric positions with the first pad 61 as the center O.

[0051] like Figure 7 As shown, the lengths L71 of the plurality of first conductor patterns 71 are the same, and the widths W71 are also substantially the same.

[0052] Figure 4The bottom surface 10SB of the camera unit 10 shown is not fixed to the bottom surface 10SB of the cavity H10 before the reflow process. When the solder bump 18 of the external electrode 19 melts, the unfixed camera unit 10 moves in the direction of solder outflow, and the connecting component moves in the outflow direction due to surface tension. Therefore, it is preferred that the periphery of the plurality of solder pads 60 is surrounded by solder resist to suppress the outflow of solder. However, it is difficult to provide a solder resist pattern covering the periphery of the plurality of solder pads 60 on a smaller surface of the three-dimensional circuit device 2.

[0053] However, in the imaging device 1, the pad 60 is connected only to the first conductor pattern 71, so the solder 18 flows out to the first conductor pattern 71. The solder 18 of the peripheral electrode 19B joined to the dummy pad 61D flows out only to the first conductor pattern 71 when it is melted due to the presence of the second solder resist pattern 92. Furthermore, due to the first solder resist pattern 91, the solder 18 of the central electrode 19A joined to the second pad 61A does not flow out to the surroundings when it is melted.

[0054] As already described, the plurality of first conductor patterns 71 are arranged at four-fold symmetrical positions with the second pad 61A as the center O. Therefore, when the plurality of solders 18 arranged at the same orientation relative to the center O are melted, they flow toward the plurality of first conductor patterns 71 arranged at the same orientation relative to the center O. The plurality of molten solders 18 move symmetrically relative to the center O, so that the imaging device 1 is pulled by the surface tension of the solders 18. In the imaging device 1, the peripheral electrode 19B is arranged at the position of the first pad 61, and the central electrode 19A is arranged at the position of the second pad 61A by the so-called self-alignment effect.

[0055] In addition, the plurality of first conductor patterns 71 and the plurality of first conductor patterns 71 may be arranged at N-fold symmetrical positions (N is a natural number greater than or equal to 2) with the second pad 61A as the center O.

[0056] In the present embodiment, the camera unit 10 is accommodated in the cavity H10 of the three-dimensional circuit device 2. It is not easy to arrange the solder resist pattern for soldering the external electrode on the lower surface of the camera unit accommodated in the cavity of the three-dimensional circuit device to the solder pad on the bottom surface of the cavity. Before the solder reflow process, it is difficult to fix the smaller lower surface of the camera unit to a specified position on the bottom surface of the cavity. Therefore, during the reflow process, the solder melts and flows out to the conductor pattern around the solder pad, so that the camera unit sometimes moves from the specified position. When the optical axis of the camera unit deviates from the specified position, it may not be possible to obtain the desired field of view, resulting in degradation of the characteristics of the camera device.

[0057] In particular, since the imaging device 1 is small, the area of ​​the bottom surface H10SB of the cavity H10 is, for example, 4 mm. 2 , less than 5mm 2Furthermore, in order to miniaturize the imaging device 1, the wall surface of the cavity H10 is substantially perpendicular to the bottom surface H10SB. The wall surface of the cavity H10 is sometimes inclined, but the inclination angle of the wall surface is only a few degrees. Therefore, it is more difficult to arrange a solder resist pattern on the bottom surface H10SB.

[0058] However, when the solder of the three-dimensional circuit device 2 melts (reflow process), the camera unit 10 accommodated in the cavity H10 does not shift (optical axis position and rotation). Since the optical axis O of the camera unit 10 does not shift, the imaging device 1 can obtain a desired field of view, and thus has high performance.

[0059] Alternatively, the plurality of first pads 61 and the plurality of first conductor patterns 71 may be arranged at N-fold symmetrical positions (N is a natural number greater than or equal to 2) with the second pad 61A as the center O.

[0060] In order to prevent positional deviation of the camera unit 10, the length L71 and width W71 of the plurality of first conductor patterns 71 through which solder flows are preferably substantially the same. In addition, substantially the same means, for example, that the length of each first conductor pattern 71 exceeds 85% of the average value of the lengths of the plurality of first conductor patterns 71 and is less than 115%.

[0061] As described later, the solder resist pattern 90 is provided by using a dispenser. Therefore, the solder resist pattern 90 has an elongated shape. Figure 7 As shown, the length L90 of the first solder resist pattern 91 exceeds three times the width W90.

[0062] In addition, whether the solder resist pattern 90 is disposed using a dispenser cannot be directly confirmed in the state of the imaging device 1 as a finished product.

[0063] The solder resist pattern 90 can be easily arranged on the bottom surface H10SB where it is difficult to arrange a solder resist pattern covering all the pads 60. Furthermore, the solder resist pattern 90 uses a small amount of solder resist and is cheaper than the solder resist pattern covering all the pads 60, and can reduce the production cycle time of solder resist arrangement.

[0064] <Method for manufacturing imaging device>

[0065] according to Figure 8 The manufacturing method of the imaging device 1 is described with reference to the flowchart of FIG.

[0066] <Step S10> Three-dimensional Circuit Device Manufacturing Process

[0067] The molded body is produced by injection molding. That is, MID resin is injected into a mold (not shown) having the shape of the three-dimensional circuit device 2. By irradiating the surface of the molded body with laser, an electroless plated catalytically active area is formed. Furthermore, a through hole is formed on the bottom surface H10SB of the cavity H10, and a conductor is filled in the through hole. Thereafter, by performing an electroless plating treatment, the molded body becomes a three-dimensional circuit device (three-dimensional circuit device 2) having a conductor on the surface. Regarding the conductor, for example, a barrier layer composed of nickel / gold is provided on the copper layer.

[0068] That is, a three-dimensional circuit device is manufactured, and the three-dimensional circuit device is provided with: a plurality of first welding pads, which are arranged at four-fold symmetrical positions, and are respectively welded and joined to a plurality of peripheral electrodes among a plurality of external electrodes of the camera unit; a plurality of first conductor patterns, which are arranged at four-fold symmetrical positions, and each of the plurality of first conductor patterns has a first end and a second end, and each first end is respectively connected to a plurality of first welding pads; a plurality of connecting plates, which are respectively connected to the second ends of the plurality of first conductor patterns; a second welding pad, which is arranged at the symmetry center of the plurality of first welding pads, and is welded and joined to a central electrode among a plurality of external electrodes of the camera unit; and a second conductor pattern, which has a third end and a fourth end, and the second welding pad is connected to the third end, and a dummy welding pad among the plurality of first welding pads is connected to the fourth end.

[0069] <Step S20> Solder Resist Application Process

[0070] By using a dispenser, an elongated solder resist pattern 90 is disposed on the bottom surface H10SB of the cavity H10.

[0071] In other words, the solder resist pattern 90 is disposed on the bottom surface H10SB using a dispenser, the solder resist pattern 90 covering at least a portion of the second conductor pattern 72 and not covering the plurality of first conductor patterns 71 .

[0072] <Step S30> Camera Unit Arrangement Process

[0073] For example, the camera unit 10 as a wafer-level camera is manufactured by cutting a stacked wafer in which a plurality of imaging element chips are bonded to an optical wafer. The external electrodes 19 of the camera unit 10 are provided with solder bumps 18. Instead of the solder bumps 18, solder paste may be provided on the external electrodes 19.

[0074] Of course, the camera unit 10 may be manufactured before the three-dimensional circuit device is manufactured ( S10 ) and the solder resist is disposed ( S20 ).

[0075] The camera unit 10 having a plurality of external electrodes 19 each having a solder bump 18 is housed in the cavity H10 of the three-dimensional circuit device 2. The external electrodes 19 (solder bumps 18) of the camera unit 10 are located at positions abutting against the pads 60 of the bottom surface H10SB.

[0076] <Step S40> Reflow Process

[0077] For example, the stereoscopic circuit device 2 is heated to a temperature at which the solder bumps 18 melt using a reflow oven. When the stereoscopic circuit device 2 returns to room temperature, the external electrodes 19 of the camera unit 10 are solder-bonded to the pads 60 of the stereoscopic circuit device 2.

[0078] <Step S50> Resin Sealing Process

[0079] After the reflow process, the sealing resin 20 is injected between the cavity and the camera unit and cured, thereby completing the imaging device 1 .

[0080] It is not easy to arrange a solder resist pattern surrounding the solder pad on the bottom surface H10SB of the cavity H10 of the three-dimensional circuit device 2. However, by using a dispenser to arrange the linear solder resist pattern 90 only on the second conductor pattern 72, the directions in which the plurality of solders 18 flow out toward the first conductor pattern 71 are in the same direction with the center electrode 19A as the center. Therefore, the camera unit 10 of the imaging device 1 housed in the cavity H10 does not shift in position. According to this manufacturing method, a high-performance imaging device can be manufactured.

[0081] <Modification of First Embodiment>

[0082] The imaging devices 1A to 1D of the modified examples of the first embodiment have the same effects as the imaging device 1 of the first embodiment. Therefore, in the following description, the same reference numerals are given to the components having the same functions as the imaging device 1, and the description thereof is omitted.

[0083] <Modification 1>

[0084] like Fig. 9 As shown, in the imaging device 1A of the present modification, the first solder resist pattern 91A of the solder resist pattern 90A is in a ring shape surrounding the second pad 61A.

[0085] <Modification 2>

[0086] like Fig.10 As shown, in the image pickup device 1B of the present modification, the solder resist pattern 90B covers the entire second conductor pattern 72 .

[0087] <Variation 3>

[0088] exist Fig.11In the camera device 1C of this variation shown, the camera unit does not have a central electrode. Therefore, the three-dimensional circuit device 2C has a bottom surface H10SB including: a plurality of first pads 61 arranged at four-fold symmetrical positions, a plurality of elongated first conductor patterns 71 arranged at four-fold symmetrical positions, and a plurality of connection lands 62 connected to the plurality of first conductor patterns 71, respectively.

[0089] <Variation 4>

[0090] exist Fig.12 In the imaging device 1D of the present modification shown, the three-dimensional circuit device 2D does not have a cavity. The camera unit 10 is surface-mounted on the surface 40SB of the three-dimensional circuit device 2D. The three-dimensional circuit device 2D has a through electrode (not shown) extending from the surface 40SB to the surface 40SA.

[0091] <Second Embodiment>

[0092] Fig.13 The endoscope 9 of the present embodiment shown in the figure has: a rigid front end portion 9A equipped with an imaging device 1 (1A to 1D); a bendable portion 9B which is provided in connection with the base end of the rigid front end portion 9A; and an elongated soft portion 9C which is provided in connection with the base end of the bendable portion 9B. The bendable portion 9B is bent by operating the operating portion 9C. The rigid front end portion 9A, the bendable portion 9B, and the soft portion 9C are insertion portions inserted into the body. A universal cable E extending from the operating portion 9C is connected to a processor, etc., which is not shown.

[0093] The endoscope 9 has the imaging device 1 (1A to 1D), and therefore has high performance.

[0094] Furthermore, the endoscope 9 is a flexible endoscope for medical use, but the endoscope of another embodiment may be an industrial endoscope or a rigid endoscope having a rigid straight tube instead of the flexible portion 9C.

[0095] Furthermore, the three-dimensional circuit device is not limited to MID, and can be manufactured by, for example, processing with a 3D printer or cutting. The material of the three-dimensional circuit device is not limited to resin, and ceramic or glass epoxy resin can also be used.

[0096] The present invention is not limited to the above-described embodiments and the like, and various changes and modifications can be made without departing from the spirit and scope of the present invention.

[0097] Description of symbols

[0098] 1. 1A to 1D: imaging device; 2. 2D: stereo circuit device; 9: endoscope; 10: camera unit; 10SB: bottom surface; 11: imager; 12: optical unit; 18: solder bump; 19: external electrode; 19A: center electrode; 19B: peripheral electrode; 20: sealing resin; 30: chip capacitor; 40: conductor pattern; 60: solder pad; 61: first solder pad; 61A: second solder pad; 61D: dummy solder pad; 62: connecting plate; 71: first conductor pattern; 72: second conductor pattern; 80: through electrode; 90: solder resist pattern; 91: first solder resist pattern; 92: second solder resist pattern; H10: cavity; H10SB: bottom surface.

Claims

1. A three-dimensional circuit device, characterized in that: The three-dimensional circuit device has: A plurality of first pads, the plurality of first pads being arranged at N-fold symmetrical positions, the plurality of first pads being respectively welded to a plurality of peripheral electrodes among a plurality of external electrodes of the camera unit, wherein N is a natural number greater than or equal to 2; a plurality of first conductor patterns, the plurality of first conductor patterns being arranged at N-fold symmetrical positions, the plurality of first conductor patterns each having a first end and a second end, and each of the first ends being connected to the plurality of first pads respectively; and A plurality of connection pads are respectively connected to the second ends of the plurality of first conductor patterns.

2. The three-dimensional circuit device according to claim 1, characterized in that: The three-dimensional circuit device also has: A second welding pad is arranged at a symmetrical center of the plurality of first welding pads and is welded and bonded to a central electrode among the plurality of external electrodes of the camera unit; a second conductor pattern having a third end and a fourth end, wherein the second pad is connected to the third end, and a dummy pad among the plurality of first pads is connected to the fourth end; as well as The solder resist pattern covers at least a portion of the second conductor pattern and does not cover the plurality of first conductor patterns.

3. The three-dimensional circuit device according to claim 2, characterized in that: The solder resist pattern includes a first solder resist pattern and a second solder resist pattern respectively crossing the second conductor pattern, the first solder resist pattern covers the third end, and the second solder resist pattern covers the fourth end.

4. The three-dimensional circuit device according to claim 3, characterized in that: The length of the first solder resist pattern and the second solder resist pattern exceeds 3 times of the width.

5. The three-dimensional circuit device according to claim 3, characterized in that: The first solder resist pattern surrounds the second pad.

6. The three-dimensional circuit device according to claim 2, characterized in that: The solder resist pattern covers the entirety of the second conductor pattern.

7. The three-dimensional circuit device according to claim 2, characterized in that: The plurality of first conductor patterns respectively extend radially outward from the plurality of first bonding pads.

8. The three-dimensional circuit device according to claim 2, characterized in that: The plurality of first conductor patterns have substantially the same length and substantially the same width.

9. The three-dimensional circuit device according to claim 7, characterized in that: The plurality of first bonding pads and the second bonding pads are arranged in a lattice shape.

10. The three-dimensional circuit device according to claim 2, characterized in that: The three-dimensional circuit device is a molded circuit component.

11. The three-dimensional circuit device according to claim 2, characterized in that: The area of ​​the bottom surface is less than 5mm 2 .

12. The three-dimensional circuit device according to claim 2, characterized in that: The plurality of first pads and the plurality of first conductor patterns are arranged at four-fold symmetrical positions.

13. The three-dimensional circuit device according to claim 2, characterized in that: The three-dimensional circuit device has a cavity. The camera unit is accommodated in the cavity, and the plurality of first solder pads, the plurality of first conductor patterns, and the plurality of connection lands are disposed on the bottom surface of the cavity.

14. The three-dimensional circuit device according to claim 13, characterized in that: The three-dimensional circuit device includes a plurality of through wirings, and the plurality of through wirings are respectively provided below the plurality of lands and extend from the bottom surface of the cavity to a surface on the opposite side of the bottom surface.

15. The three-dimensional circuit device according to claim 13, characterized in that: The wall surface of the cavity is substantially perpendicular to the bottom surface.

16. An imaging device comprising a camera unit and a stereo circuit device, characterized in that: The camera unit has a plurality of external electrodes, The three-dimensional circuit device comprises: a plurality of first pads, the plurality of first pads being arranged at N-fold symmetrical positions, the plurality of first pads being respectively welded and joined to a plurality of peripheral electrodes of the plurality of external electrodes of the camera unit, wherein N is a natural number greater than or equal to 2; a plurality of first conductor patterns, the plurality of first conductor patterns being arranged at N-fold symmetrical positions, the plurality of first conductor patterns each having a first end and a second end, and each of the first ends being connected to the plurality of first pads respectively; and A plurality of connection pads are respectively connected to the second ends of the plurality of first conductor patterns.

17. The camera device according to claim 16, characterized in that: The plurality of first pads and the plurality of first conductor patterns are arranged at four-fold symmetrical positions.

18. The imaging device according to claim 16, wherein: The three-dimensional circuit device has a cavity, The camera unit is accommodated in the cavity, and the plurality of first solder pads, the plurality of first conductor patterns, and the plurality of connection lands are disposed on the bottom surface of the cavity.

19. The imaging device according to claim 18, wherein: The imaging device further includes a sealing resin provided between the camera unit and the cavity.

20. An endoscope having an imaging device at a distal end portion of an insertion portion, characterized in that: The imaging device comprises a camera unit and a stereo circuit device. The camera unit has a plurality of external electrodes including a plurality of peripheral electrodes, The three-dimensional circuit device comprises: A plurality of first welding pads, the plurality of first welding pads are arranged at N-fold symmetrical positions, the plurality of first welding pads are respectively welded and joined to the plurality of peripheral electrodes, wherein N is a natural number greater than 2; a plurality of first conductor patterns, the plurality of first conductor patterns being arranged at N-fold symmetrical positions, the plurality of first conductor patterns each having a first end and a second end, and each of the first ends being connected to the plurality of first pads respectively; and A plurality of connection pads are respectively connected to the second ends of the plurality of first conductor patterns.

21. A method for manufacturing a camera device, characterized in that: The following processes are available: A process for making a three-dimensional circuit device, wherein the three-dimensional circuit device is provided with: a plurality of first pads, the plurality of first pads being arranged at N-fold symmetrical positions, wherein N is a natural number greater than 2; a plurality of first conductor patterns, the plurality of first conductor patterns being arranged at N-fold symmetrical positions, the plurality of first conductor patterns each having a first end and a second end, each of the first ends being connected to the plurality of first pads respectively; a plurality of connection pads, the plurality of connection pads being connected to the second ends of the plurality of first conductor patterns respectively; a second pad, the second pad being arranged at a symmetric center of the plurality of first pads; and a second conductor pattern, the second conductor pattern having a third end and a fourth end, the second pad being connected to the third end, and a dummy pad among the plurality of first pads being connected to the fourth end; a step of applying a solder resist pattern using a dispenser, the solder resist pattern covering at least a portion of the second conductor pattern but not covering the plurality of first conductor patterns; The step of disposing a camera unit having a plurality of external electrodes on the three-dimensional circuit device, the plurality of external electrodes including a central electrode and a plurality of peripheral electrodes; and In the reflow process, the plurality of outer electrodes are respectively bonded to the plurality of first pads by soldering, and the center electrode is bonded to the second pad by soldering.

22. The method for manufacturing an imaging device according to claim 21, wherein: In the reflow process, the solder spreads to the first conductor pattern.

23. The method for manufacturing an imaging device according to claim 21, wherein: The solder resist pattern is composed of a first solder resist pattern and a second solder resist pattern, the first solder resist pattern and the second solder resist pattern are respectively elongated shapes crossing the second conductor pattern, the first solder resist pattern covers the third end, and the second solder resist pattern covers the fourth end.

24. The method for manufacturing an imaging device according to claim 21, wherein: The plurality of first pads and the plurality of first conductor patterns are arranged at four-fold symmetrical positions.

25. The method for manufacturing an imaging device according to claim 21, wherein: The three-dimensional circuit device has a cavity, The camera unit is accommodated in the cavity, and the plurality of first solder pads, the plurality of first conductor patterns, and the plurality of connection lands are disposed on the bottom surface of the cavity.

26. The method for manufacturing an imaging device according to claim 25, wherein: Before the reflow process, the camera unit is not fixed to the bottom surface.

27. The method for manufacturing an imaging device according to claim 21, wherein: After the reflow step, a step of injecting a sealing resin into a space between the cavity and the camera unit and curing the sealing resin is further provided.

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