Resin composition for dicing film substrate, dicing film substrate, and dicing film

Abstract

The present invention addresses the problem of providing a resin composition for a dicing film substrate, said resin composition being capable of providing a dicing film substrate having excellent extensibility at normal temperatures and low temperatures and also having excellent modulus strength at normal temperatures and low temperatures. The resin composition for a dicing film substrate, which solves the problem, comprises (A) an ionically crosslinked polymer of an ethylene-unsaturated carboxylic acid copolymer, (B) an ionically crosslinked polymer of an ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid ester copolymer, and (C) a styrene elastomer.