Display panel, method for manufacturing display panel, and display device

Abstract

The application relates to a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, an isolation structure arranged on one side of the substrate and enclosing an isolation opening, the isolation structure comprising a first isolation part and a second isolation part, the second isolation part having a protruding eave part protruding from the first isolation part towards one side of the isolation opening; a light emitting device, at least part of the structure of the light emitting device being located in the isolation opening; a first encapsulation structure arranged on a side of the light emitting device away from the substrate, the first encapsulation structure comprising a first substructure, a second substructure and a third substructure, the first substructure covering one side of the light emitting device away from the substrate, the second substructure covering one side of the first isolation part towards the isolation opening, and the third substructure being at least partially located on one side of the second isolation part towards the substrate and at least partially attached to the protruding eave part, the first substructure, the second substructure and the third substructure enclosing a gap space, and the third substructure being at least partially connected with the first substructure to form a connecting part.

Description

[0001] Cross-references to related applications This application claims priority to Chinese Patent Application No. 202410364325.1, filed on March 27, 2024, entitled “Display Panel and Display Device”; Chinese Patent Application No. 202311733473.8, filed on December 15, 2023, entitled “Display Panel, Display Device and Method for Manufacturing Display Panel”; and Chinese Patent Application No. 202310944339.6, filed on July 28, 2023, entitled “Display Panel and Display Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, specifically to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0003] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0004] However, the current manufacturing process of OLED display products needs improvement. Summary of the Invention

[0005] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to improve the packaging effect of the display panel.

[0006] An embodiment of the first aspect of this application provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate and enclosing a plurality of isolation openings, the isolation structure including a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, the second isolation portion having a protruding eave portion extending from the first isolation portion toward the isolation opening; a plurality of light-emitting devices, at least a portion of the structure of the light-emitting devices being located within the isolation openings; a first encapsulation structure disposed on the side of the light-emitting devices away from the substrate, the first encapsulation structure including a first portion, a second portion and a third portion, the first portion covering the side of the light-emitting devices away from the substrate, the second portion covering the side of the first isolation portion toward the isolation opening, and the third portion at least partially located on the side of the second isolation portion toward the substrate and at least partially attached to the protruding eave portion, the first portion, the second portion and the third portion enclosing a gap space, and the third portion being at least partially connected to the first portion to form a connection portion.

[0007] An embodiment of the first aspect of this application also provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate and enclosing a plurality of isolation openings, the isolation structure including a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, the second isolation portion having an eave portion protruding from the first isolation portion toward the isolation opening; a plurality of light-emitting devices, at least a portion of the structure of the light-emitting devices being located within the isolation openings, the light-emitting devices including a light-emitting unit and a first electrode located on the side of the light-emitting unit away from the substrate; and a first encapsulation structure disposed on the side of the light-emitting devices away from the substrate, the first encapsulation structure including a first sub-encapsulation... The display panel has a first part, a second part, and a third part. The first part covers the side of the light-emitting device away from the substrate, the second part covers the side of the first isolation part facing the isolation opening, and the third part is at least partially located on the side of the second isolation part facing the substrate and at least partially attached to the eaves. The first part, the second part, and the third part enclose a gap space. The first part and the third part are at least partially spaced apart within the isolation opening and form a connecting opening. The minimum dimension of the connecting opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thickness of the light-emitting unit of at least part of the light-emitting device and the thickness of the first electrode and the sealing coefficient.

[0008] An embodiment of the first aspect of this application also provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate and enclosing an isolation opening; a light-emitting device, at least partially located within the isolation opening; and a first encapsulation structure disposed on the side of the light-emitting device facing away from the substrate. The first encapsulation structure includes a first portion and a second segment. The first portion is located within the isolation opening and disposed on the side of the light-emitting device facing away from the substrate. The second segment is located on the side of the isolation structure facing the isolation opening. The surface of the first portion facing away from the substrate and the surface of the second segment facing away from the isolation structure are at least partially connected to each other to enclose a gap space.

[0009] The second aspect of this application also provides a method for manufacturing a display panel, comprising: An isolation structure is fabricated on a substrate. The isolation structure encloses and forms an isolation opening. The isolation opening includes a first opening and a second opening. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion has an eave portion protruding from the first isolation portion toward the side of the isolation opening. The first device material layer and the first encapsulation material layer are sequentially prepared across the entire surface; The first encapsulation material layer and the first device material layer outside the first opening are etched away to form a first light-emitting device corresponding to the first opening and a first encapsulation unit located on the side of the first light-emitting device away from the substrate. The first encapsulation unit includes a first portion, a second portion and a third portion. The first portion covers the side of the light-emitting device away from the substrate, the second portion covers the side of the first isolation portion facing the isolation opening, and the third portion is at least partially located on the side of the second isolation portion facing the substrate and at least partially attached to the eaves. The first portion, the second portion and the third portion of the first encapsulation unit enclose a gap space, and the gap space of the first encapsulation unit has a communicating opening. The second device material layer and the second encapsulation material layer are prepared sequentially on the entire surface. The second device material layer includes a light-emitting unit material layer and a first electrode material layer. The first electrode material layer of the second device material layer is continuous on the side of the first encapsulation unit away from the substrate and blocks the communication opening of the first encapsulation unit. The second packaging material layer outside the second opening is etched away using a first etching method, and then the second device material layer is etched away using a second etching method to form a second light-emitting device corresponding to the second opening and a second packaging unit located on the side of the second light-emitting device away from the substrate.

[0010] An embodiment of the third aspect of this application provides a display device, which includes a display panel of any of the above embodiments or a display panel prepared by the preparation method of any of the foregoing embodiments.

[0011] In a display panel provided in this application embodiment, the display panel includes a substrate, an isolation structure light-emitting device, and a first packaging structure. The isolation structure is disposed on one side of the substrate and encloses multiple isolation openings. At least a portion of the structure of the light-emitting device is located within the isolation openings. The isolation structure can be used to divide the sub-pixels of the display panel. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion has a protruding eave from the first isolation portion toward the isolation opening, so that when fabricating the light-emitting device of the display panel, at least a portion of the material of the light-emitting device can be directly vapor-deposited over the entire surface. The protruding eave of the second isolation portion can block at least a portion of the material used to fabricate the light-emitting device, thereby isolating the material of the light-emitting device between adjacent sub-pixels. This facilitates the formation of multiple spaced light-emitting devices located within the isolation openings, thereby eliminating the need for a high-precision mask when fabricating the light-emitting device of the display panel. For example, it eliminates the need for a high-precision fine metal mask (FMM) when vapor-depositing the material of the light-emitting device, thus significantly reducing the manufacturing cost of the display panel.

[0012] The first packaging structure is disposed on the side of the light-emitting device away from the substrate, and the first packaging structure can be used to package the light-emitting device. The first packaging structure includes a first portion, a second portion, and a third portion. The first portion covers the side of the light-emitting device away from the substrate, the second portion covers the side of the first isolation portion facing the isolation opening, and the third portion is at least partially located on the side of the second isolation portion facing the substrate and at least partially attached to the eaves portion, so that the first packaging structure can have a larger size to better extend the packaging path of the first packaging structure.

[0013] The first, second, and third portions enclose a gap space, which can effectively reduce the mutual interference between the first, second, and third portions during the formation of the first packaging structure. This allows the first portion to be formed on the side of the light-emitting device away from the substrate, the second portion to be formed on the side of the second isolation portion facing the isolation opening, and the third portion to be formed on the side of the second isolation portion facing the substrate, thereby improving the packaging effect of the first packaging structure on the display panel.

[0014] By setting the third segment to at least partially connect with the first segment to form a connecting portion, the first segment can provide better support for the second segment, making it less likely for the second segment to detach from the isolation structure. This improves the encapsulation effect of the first encapsulation structure on the display panel. Furthermore, it allows for better continuity of the material in subsequent film layers at the connecting portion when fabricating them on the first encapsulation structure. This facilitates the molding or patterning of subsequent film layers, enabling them to better cover the first encapsulation structure and provide a certain degree of protection. Attached Figure Description

[0015] The features, advantages and technical effects of exemplary embodiments of the present application will now be described with reference to the accompanying drawings, which are not drawn to scale.

[0016] Figure 1 This is a partial structural diagram of a display panel provided in an embodiment of this application; Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 3 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 4 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 5 This is a schematic diagram of the structure of a connection portion provided in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of a connection portion provided in another embodiment of this application; Figure 7 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 8 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 9 This is a schematic diagram of the structure of a connection portion provided in another embodiment of this application; Figure 10 This is a partial structural diagram of a first packaging structure provided in an embodiment of this application; Figure 11 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 12 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 13 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 14 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 15 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 16 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 17 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 18 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 19 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 20 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 21 This is a partial structural diagram of an isolation structure provided in an embodiment of this application; Figure 22 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 23 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 24 This is a schematic diagram of the structure of a first segment provided in an embodiment of this application; Figure 25 This is a schematic diagram of the structure of a first segment provided in another embodiment of this application; Figure 26This is a schematic diagram of the structure of a first segment provided in another embodiment of this application; Figure 27 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 28 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 29 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 30 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 31 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 32 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 33 This is a partial schematic diagram of an isolation structure provided in another embodiment of this application; Figure 34 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 35 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 36 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figures 37 to 46 This is a schematic diagram illustrating the fabrication process of a display panel fabrication method provided in an embodiment of this application; Figure 47 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 48 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 49 This is a partial cross-sectional view of a display panel provided in another embodiment of this application; Figure 50 A schematic diagram of a planar structure of a display panel provided in an embodiment of this disclosure; Figure 51 for Figure 50 An enlarged view of area S1 of the display panel shown; Figure 52 for Figure 51 The diagram shows a cross-sectional view of the display panel along MN. Figure 53 for Figure 52 An enlarged view of a portion of the display panel shown; Figure 54A schematic diagram of the structure of another display panel provided as a comparative example according to an embodiment of this disclosure; Figures 55A to 55D An embodiment of this disclosure provides a method for forming such Figure 5 The diagram shows a process diagram of one method for manufacturing a display panel. Figure 56 This is a schematic diagram illustrating the positional relationship between a portion of a film layer in a display panel and a vapor deposition source during vapor deposition, according to an embodiment of this disclosure. Figure 57 A cross-sectional view of a portion of a display panel provided in an embodiment of this disclosure; Figure 58 This is a schematic flowchart of a method for manufacturing a display panel provided in an embodiment of this application; Figures 59 to 62 This is a schematic diagram illustrating the fabrication process of a display panel fabrication method according to another embodiment of this application; Figure 63 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of this application; Figures 64 to 70 This is a schematic diagram illustrating the fabrication process of a display panel fabrication method according to another embodiment of this application.

[0017] Explanation of reference numerals in the attached figures: 10-Display panel; 10a-First encapsulation material layer; 10b-First support material layer; 10c-Second encapsulation material layer; 10d-Second support material layer; 10e-Third encapsulation material layer; 10f-Third support material layer; 10g-First device material layer; 10h-Second device material layer; 10i-Third device material layer; 101-Light-emitting unit material layer; 102-First electrode material layer; 100 - Substrate; 110 - Substrate; 120 - First insulating layer; 130 - Second insulating layer; 140 - Third insulating layer; 150 - Driving circuit; 151 - Transistor; 151a - Gate; 151b - Source / drain; 152 - Storage capacitor; 152a - First electrode plate; 152b - Second electrode plate; 200 - Light-emitting device; 200a - First light-emitting device; 200b - Second light-emitting device; 200c - Third light-emitting device; 210 - Second electrode; 220 - Light-emitting unit; 221 - First functional layer; 222 - Light-emitting layer; 223 - Second functional layer; 230 - First electrode; 300 - Limiting structure; 300a - Limiting opening; 310 - Isolation structure; 310a - Isolation opening; 310aa - First opening; 310ab - Second opening; 310ac - Third opening; 310b - First end; 310c - Second end; 311 - First isolation portion; 312 - Second isolation portion; 312a - Eaves portion; 312aa - First eaves portion; 312ab - Second eaves portion; 312ac - Third eaves portion; 313 - Third isolation portion; 320 - Pixel definition layer; 320a - Pixel opening; 321 - Pixel limiting portion; 400 - First packaging structure; 400a - Gap space; 400b - Communication opening; 400ba - First type of communication opening; 400bb - Second type of communication opening; 400c - Connecting part; 400d - First packaging area; 400e - Second packaging area; 400f - Third packaging area; 401 - First packaging unit; 402 - Second packaging unit; 403 - Third packaging unit; 410 - First segment; 411 - Main body; 411a - First main body segment; 411b - Second main body segment; 411ba - First main body sub-segment; 411bb - Second main body sub-segment; 412 - Support part; 420 - Side segment; 421 - Second segment; 421a - Second segment; 421b - Third segment; 422 - Fourth segment; 500 - Second encapsulation layer; 600 - Third encapsulation layer; P - Support structure; P1 - First encapsulation part; P1a - Light-transmitting opening; P2 - Second encapsulation part; P3 - Third encapsulation part; P4 - Fourth encapsulation part; F-sealing structure; AA - Display area; NA - Border area. Detailed Implementation

[0018] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0019] This application provides a display panel, a method for manufacturing the display panel, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the method for manufacturing the display panel, and the display device.

[0020] Figure 1 This is a partial structural schematic diagram of a display panel 10 provided in an embodiment of this application. Figure 2 This is a partial cross-sectional view of a display panel 10 provided in an embodiment of this application, where the X direction can be the thickness direction of the display panel 10. Optionally, Figure 2 Can be Figure 1 A partial cross-sectional view of one embodiment at point AA.

[0021] An embodiment of the first aspect of this application provides a display panel 10, including: a substrate 100; an isolation structure 310 disposed on one side of the substrate 100 and enclosing a plurality of isolation openings 310a, the isolation structure 310 including a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 facing away from the substrate 100, the second isolation portion 312 having an eave portion 312a protruding from the first isolation portion 311 toward the isolation openings 310a; a plurality of light-emitting devices 200, at least a portion of the structure of the light-emitting devices 200 being located within the isolation openings 310a; and a first encapsulation structure 400 disposed on the side of the light-emitting devices 200 facing away from the substrate 100. On one side, the first packaging structure 400 includes a first portion 410, a second portion 421a, and a third portion 421b. The first portion 410 covers the side of the light-emitting device 200 facing away from the substrate 100. The second portion 421a covers the side of the first isolation portion 311 facing the isolation opening 310a. The third portion 421b is at least partially located on the side of the second isolation portion 312 facing the substrate 100 and is at least partially attached to the eaves portion 312a. The first portion 410, the second portion 421a, and the third portion 421b enclose a gap space 400a. The third portion 421b is at least partially connected to the first portion 410 to form a connection portion 400c.

[0022] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and encloses a plurality of isolation openings 310a. At least a portion of the structure of the light-emitting device 200 is located within the isolation openings 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10.

[0023] Optional, such as Figure 1 As shown, the isolation structure 310 can be in the form of a grid to facilitate the division of sub-pixels in the display panel 10. The hollowed-out areas in the grid-like isolation structure 310 can be isolation openings 310a.

[0024] The isolation structure 310 includes a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 facing away from the substrate 100. The second isolation portion 312 has a protruding eave portion 312a protruding from the first isolation portion 311 toward the isolation opening 310a. This allows at least a portion of the material of the light-emitting device 200 to be directly vapor-deposited on the entire surface when the light-emitting device 200 of the display panel 10 is fabricated. The protruding eave portion 312a of the second isolation portion 312 can block at least a portion of the material used to fabricate the light-emitting device 200, thereby isolating the material of the light-emitting device 200 between adjacent sub-pixels. This facilitates the formation of multiple spaced light-emitting devices 200 located within the isolation opening 310a. As a result, it is not necessary to set a high-precision mask when fabricating the light-emitting device 200 of the display panel 10. For example, it is not necessary to set a high-precision metal mask (FMM) when vapor-depositing the material of the light-emitting device 200, thereby significantly reducing the production cost of the display panel 10.

[0025] The first encapsulation structure 400 is disposed on the side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. The first encapsulation structure 400 includes a first portion 410, a second portion 421a, and a third portion 421b. The first portion 410 covers the side of the light-emitting device 200 facing away from the substrate 100. The second portion 421a covers the side of the first isolation portion 311 facing the isolation opening 310a. The third portion 421b is at least partially located on the side of the second isolation portion 312 facing the substrate 100 and is at least partially attached to the eaves portion 312a, so that the first encapsulation structure 400 can have a larger size to better extend the encapsulation path of the first encapsulation structure 400.

[0026] Optionally, in the embodiments of this application, "one covering the other" may mean that the two can be in direct contact with each other; or it may mean that the two are not in direct contact, and other membrane structures may be sandwiched between them. For example, other membranes may be provided between the second portion 421a and the first isolation portion 311, and other membranes may be provided between the third portion 421b and the second isolation portion 312.

[0027] Optionally, the first portion 410, the second portion 421a, and the third portion 421b can be connected in sequence. Specifically, the side of the first portion 410 facing the first isolation portion 311 can be connected to the side of the second portion 421a near the substrate 100, and the side of the second portion 421a near the second isolation portion 312 can be connected to the side of the third portion 421b near the first isolation portion 311.

[0028] The first portion 410, the second portion 421a, and the third portion 421b enclose a gap space 400a, which can effectively reduce the mutual interference between the first portion 410, the second portion 421a, and the third portion 421b when the first packaging structure 400 is formed. This allows the first portion 410 to be formed on the side of the light-emitting device 200 away from the substrate 100, the second portion 421a to be formed on the side of the second isolation portion 312 facing the isolation opening 310a, and the third portion 421b to be formed on the side of the second isolation portion 312 facing the substrate 100. This can effectively improve the packaging effect of the first packaging structure 400 on the display panel 10.

[0029] By setting the third segment 421b to at least partially connect with the first segment 410 to form a connecting portion 400c, the first segment can provide better support for the second segment, making it less likely for the second segment to detach from the isolation structure 310. This improves the encapsulation effect of the first encapsulation structure 400 on the display panel 10. Furthermore, when preparing subsequent film layers on the first encapsulation structure 400, the material of the subsequent film layers can be better continuous at the connecting portion 400c, facilitating the molding or patterning of subsequent film layers. This allows the subsequent film layers to better cover the first encapsulation structure 400 and provide a certain degree of protection to it.

[0030] In some embodiments of this application, the light-emitting device 200 may include a light-emitting unit 220 and a first electrode 230, wherein the first electrode 230 may be located on the side of the light-emitting unit 220 away from the substrate 100.

[0031] Optionally, the light-emitting unit 220 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer, an electron injection layer (EIL), and an electron transport layer (ETL).

[0032] Optionally, the light-emitting device 200 may also include a second electrode 210 disposed on the side of the light-emitting unit 220 facing the substrate 100, and the second electrode 210 may be located between the light-emitting device 200 and the substrate 100.

[0033] Optionally, the first electrode 230 and the second electrode 210 can serve as pixel electrodes of the display panel 10. One of the first electrode 230 and the second electrode 210 can serve as an anode, and the other can serve as a cathode to drive the light-emitting unit 220 to emit light. In this embodiment, the first electrode 230 is used as the cathode of the display panel 10, and the second electrode 210 is used as the anode of the display panel 10 for illustrative purposes.

[0034] In some embodiments of this application, the substrate 100 can be configured in various ways. Optionally, the substrate 100 includes a substrate 110 and a driving circuit 150 disposed on the side of the substrate 110 facing the isolation structure 310. The driving circuit 150 may include a transistor 151, a storage capacitor 152, and driving signal lines for connecting various devices. The transistor 151 includes a semiconductor, a gate 151a, and source / drain electrodes 151b. The storage capacitor 152 includes a first electrode 152a and a second electrode 152b.

[0035] As an example, the substrate 100 may further include a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140 sequentially stacked on the side of the substrate 110 facing the driving circuit 150. The gate 151a and the first electrode 152a may be disposed in the same layer. For example, the gate 151a and the first electrode 152a may be located on the side of the first insulating layer 120 facing the substrate 110. The second electrode 152b may be located between the first insulating layer 120 and the second insulating layer 130, and the source / drain electrode 151b may be located between the second insulating layer 130 and the third insulating layer 140.

[0036] In some optional embodiments, the material of the isolation structure 310 may include a conductive material, and the first electrode 230 may be connected to the isolation structure 310, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the isolation structure 310, that is, the first electrodes 230 of adjacent sub-pixels can be electrically connected to each other through the isolation structure 310 to form a surface electrode, thereby facilitating the control of the first electrodes 230 in the display panel 10. Optionally, the material of the first isolation portion 311 may include a conductive material, and the first electrode 230 may be connected to the first isolation portion 311, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the first isolation portion 311.

[0037] Figure 3 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Optionally, Figure 3 Can be Figure 1 A partial cross-sectional view of another embodiment at point AA.

[0038] like Figure 3As shown, in some optional embodiments, the isolation structure 310 further includes a third isolation portion 313 disposed on the side of the first isolation portion 311 facing the substrate 100. The third isolation portion 313 protrudes from the first isolation portion 311 toward the isolation opening 310a, i.e., it has a protrusion protruding from the first isolation portion 311 toward the isolation opening 310a. The material of the third isolation portion 313 may include a conductive material. The first electrode 230 can be connected to the third isolation portion 313, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the third isolation portion 313. By providing the third isolation portion 313 to protrude from the first isolation portion 311 toward the isolation opening 310a, the third isolation portion 313 can have a larger size to facilitate connection with the first electrode 230.

[0039] Optionally, the display panel 10 further includes a pixel definition layer 320 disposed on the side of the substrate 100 facing the light-emitting device 200. The pixel definition layer 320 includes a pixel limiting portion 321 and a pixel opening 320a formed by the pixel limiting portion 321. An isolation structure 310 is disposed on the side of the pixel limiting portion 321 away from the substrate 100. The pixel opening 320a can communicate with the isolation opening 310a.

[0040] Optionally, the orthographic projection of the pixel opening 320a on the substrate 100 may be located within the orthographic projection of the isolation opening 310a on the substrate 100. The orthographic projection of the pixel opening 320a on the substrate 100 may refer to the orthographic projection area formed by the orthographic projection of the inner wall enclosing the pixel opening 320a on the substrate 100. Similarly, the orthographic projection of the isolation opening 310a on the substrate 100 may refer to the orthographic projection area formed by the orthographic projection of the inner wall enclosing the isolation opening 310a on the substrate 100.

[0041] Optionally, the pixel limiting part 321 can be disposed between adjacent second electrodes 210. The adjacent second electrodes 210 can be insulated from each other by the pixel limiting part 321, and the setting of the pixel limiting part 321 can also facilitate the division of sub-pixels in the display panel 10.

[0042] Optionally, the pixel limiting part 321 may also be located between the second electrode 210 and the isolation structure 310. The isolation structure 310 and the second electrode 210 may also be insulated by the pixel limiting part 321, so that the first electrode 230 and the second electrode 210 are less likely to be short-circuited through the isolation structure 310, thereby improving the working reliability of the display panel 10.

[0043] In these optional embodiments, the relative position between the isolation structure 310 and the pixel defining portion 321 can be configured in various ways. Optionally, such as... Figure 2 and Figure 3As shown, the isolation structure 310 can be disposed on the side of the pixel limiting portion 321 facing away from the substrate 100, or the pixel limiting portion 321 can have a receiving groove, with at least a portion of the isolation structure 310 located within the receiving groove. This makes the isolation structure 310 less likely to have a large height relative to the substrate 100, thereby effectively reducing the thickness of the display panel 10. For ease of description, the following embodiments will be described using the example of the isolation structure 310 being disposed on the side of the pixel limiting portion 321 facing away from the substrate 100.

[0044] Figure 4 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 4 Can be Figure 1 A partial cross-sectional view of another embodiment at point AA.

[0045] like Figure 4 As shown, in some optional embodiments, the isolation opening 310a may include a first opening 310aa and a third opening 310ac, and the light-emitting device 200 includes a first light-emitting device 200a disposed corresponding to the first opening 310aa and a third light-emitting device 200c disposed corresponding to the third opening 310ac.

[0046] Optionally, the first light-emitting device 200a and the third light-emitting device 200c emit different colors, and the display panel 10 can display multiple colors through the first light-emitting device 200a and the third light-emitting device 200c that emit different colors.

[0047] Optionally, the first light-emitting device 200a corresponding to the first opening 310aa can mean that the orthographic projection of the first light-emitting device 200a on the substrate 100 is located within the orthographic projection of the first opening 310aa on the substrate 100. Optionally, the third light-emitting device 200c corresponding to the third opening 310ac can mean that the orthographic projection of the third light-emitting device 200c on the substrate 100 is located within the orthographic projection of the third opening 310ac on the substrate 100.

[0048] Optionally, the material of the light-emitting unit 220 of the first light-emitting device 200a and the material of the light-emitting unit 220 of the third light-emitting device 200c may be at least partially different, so as to achieve different light-emitting colors of the first light-emitting device 200a and the third light-emitting device 200c.

[0049] Optionally, the first encapsulation structure 400 may include a first encapsulation unit 401 located at least partially within the first opening 310aa and a third encapsulation unit 403 located at least partially within the third opening 310ac. The first encapsulation unit 401 can encapsulate the first light-emitting device 200a within the first opening 310aa relatively independently, and the third encapsulation unit 403 can encapsulate the third light-emitting device 200c within the third opening 310ac relatively independently. This ensures that the encapsulation of the first encapsulation unit 401 and the encapsulation of the third encapsulation unit 403 do not affect each other. That is, if one of the first encapsulation unit 401 and the third encapsulation unit 403 is damaged, it is not easy to affect the encapsulation effect of the other, thereby improving the encapsulation effect of the display panel 10.

[0050] Optionally, the first packaging unit 401 and the third packaging unit 403 can be spaced apart, so that the packaging effect of the first packaging unit 401 and the packaging effect of the third packaging unit 403 are less likely to affect each other.

[0051] Optionally, in the fabrication process of the display panel 10, the fabrication step of the first light-emitting device 200a can be performed before the fabrication step of the third light-emitting device 200c. For example, in the fabrication process of the display panel 10, the first light-emitting device 200a and the first encapsulation unit 401 can be fabricated first, and then the third light-emitting device 200c and the third encapsulation unit 403 can be fabricated. Specifically, the second electrode 210 of the first light-emitting device 200a and the third light-emitting device 200c can be fabricated simultaneously first, then the light-emitting unit 220 and the first electrode 230 of the first light-emitting device 200a can be fabricated to complete the fabrication of the first light-emitting device 200a, then the first encapsulation unit 401 can be formed on the first light-emitting device 200a, then the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c can be fabricated to complete the fabrication of the third light-emitting device 200c, and then the third encapsulation unit 403 can be formed on the third light-emitting device 200c.

[0052] In some optional embodiments, the isolation opening 310a further includes a second opening 310ab, and the light-emitting device 200 includes a second light-emitting device 200b disposed corresponding to the second opening 310ab.

[0053] Optionally, the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c emit different colors, and the display panel 10 can display multiple colors through the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c emitting different colors. For example, the first light-emitting device 200a can be used to emit red light, the second light-emitting device 200b can be used to emit green light, and the third light-emitting device 200c can be used to emit blue light.

[0054] Optionally, the second light-emitting device 200b provided corresponding to the second opening 310ab may refer to the orthogonal projection of the second light-emitting device 200b on the substrate 100 being located within the orthogonal projection of the second opening 310ab on the substrate 100.

[0055] Optionally, the materials of the light-emitting unit 220 of the first light-emitting device 200a, the light-emitting unit 220 of the second light-emitting device 200b, and the light-emitting unit 220 of the third light-emitting device 200c may be at least partially different, so as to achieve different light-emitting colors of the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c.

[0056] Optionally, the first encapsulation structure 400 includes a second encapsulation unit 402 located at least partially within the second opening 310ab. The second encapsulation unit 402 can encapsulate the second light-emitting device 200b within the second opening 310ab relatively independently, so that the encapsulation of the first encapsulation unit 401, the encapsulation of the second encapsulation unit 402, and the encapsulation of the third encapsulation unit 403 do not affect each other. That is, if one of the first encapsulation unit 401, the second encapsulation unit 402, and the third encapsulation unit 403 is damaged, it is not easy to affect the encapsulation effect of the other, thereby improving the encapsulation effect of the display panel 10.

[0057] Optionally, the first packaging unit 401, the second packaging unit 402 and the third packaging unit 403 can be arranged in pairs at intervals.

[0058] Optionally, in the fabrication process of the display panel 10, the fabrication step of the second light-emitting device 200b is located between the fabrication steps of the first light-emitting device 200a and the fabrication step of the third light-emitting device 200c. For example, in the fabrication process of the display panel 10, the first light-emitting device 200a and the first packaging unit 401 can be fabricated first, then the second light-emitting device 200b and the second packaging unit 402 can be fabricated, and then the third light-emitting device 200c and the third packaging unit 403 can be fabricated. Specifically, the second electrodes 210 of the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c can be prepared simultaneously first. Then, the light-emitting unit 220 and the first electrode 230 of the first light-emitting device 200a can be prepared to complete the preparation of the first light-emitting device 200a. Next, a first encapsulation unit 401 is prepared on the first light-emitting device 200a. Then, the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b are prepared to complete the preparation of the second light-emitting device 200b. Next, a second encapsulation unit 402 is prepared on the second light-emitting device 200b. Then, the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c are prepared to complete the preparation of the third light-emitting device 200c. Finally, a third encapsulation unit 403 is prepared on the third light-emitting device 200c.

[0059] In some embodiments of this application, the material of the first encapsulation structure 400 may include inorganic materials, thereby giving the first encapsulation structure 400 better encapsulation capabilities to reduce the impact of moisture on the light-emitting device 200. Optionally, the first encapsulation structure 400 may be prepared by chemical vapor deposition (CVD).

[0060] In some alternative embodiments, the third portion 421b is at least partially connected to the first portion 410 to form a connection portion 400c. This can mean that the side of the third portion 421b near the isolation opening 310a can be at least partially connected to the surface of the first portion 410 on the side away from the substrate 100 to form the connection portion 400c.

[0061] It is understandable that the surface of the first portion 410 facing away from the substrate 100 will not be completely connected to the side of the third portion 421b near the isolation opening 310a. That is, the third portion 421b near the isolation opening 310a is at least partially connected to the surface of the first portion 410 facing away from the substrate 100 to form the connecting portion 400c. This means that the surface of the first portion 410 facing away from the substrate 100 is connected to the surface of the third portion 421b near the isolation opening 310a everywhere, or the surface of the first portion 410 facing away from the substrate 100 is partially connected to the surface of the third portion 421b near the isolation opening 310a.

[0062] Optionally, the third portion 421b and the first portion 410 may not have a clear interface at the connecting portion 400c. For example, the third portion 421b and the first portion 410 may be integrally formed at the connecting portion 400c, meaning that the material of the third portion 421b and the material of the first portion 410 may be fused together at the connecting portion 400c. Alternatively, the third portion 421b and the first portion 410 may have a clear interface at the connecting portion 400c, meaning that the surface of the third portion 421b near the isolation opening 310a and the surface of the first portion 410 facing away from the substrate 100 are attached to each other but not fused together.

[0063] In some alternative embodiments, the third portion 421b may also partially cover the end of the second isolation portion 312 facing the isolation opening 310a.

[0064] Optionally, the side of the third portion 421b away from the first isolation portion 311 may protrude from the second isolation portion 312, which facilitates at least partial connection between the side of the third portion 421b near the isolation opening 310a and the surface of the first portion 410 away from the substrate 100 to form a connection portion 400c, thereby facilitating better support of the third portion 421b by the first portion 410.

[0065] In some alternative embodiments, the first portion 410 may include a first main portion 411a and a second main portion 411b connected to each other, the first main portion 411a being located within the pixel opening 320a, and the second main portion 411b being located on the side of the pixel limiting portion 321 facing away from the substrate 100.

[0066] Optionally, the orthographic projection of the first main body portion 411a on the substrate 100 may be located within the orthographic projection of the pixel opening 320a on the substrate 100, and the orthographic projection of the second main body portion 411b on the substrate 100 may be located within the orthographic projection of the pixel limiting portion 321 on the substrate 100.

[0067] Optionally, the connecting portion 400c may be formed by at least partially connecting the surface of the third portion 421b near the isolation opening 310a to the surface of the second main body portion 411b opposite to the substrate 100.

[0068] Optionally, the side of the second main body portion 411b facing the isolation structure 310 can be connected to the side of the second portion 421a facing the substrate 100. The gap space 400a can be formed by the second main body portion 411b, the second portion 421a and the third portion 421b.

[0069] Optionally, the orthographic projection of the connecting portion 400c on the substrate 100 may at least partially overlap with the orthographic projection of the pixel limiting portion 321 on the substrate 100. That is, at least part of the connecting portion 400c may be located on the side of the pixel limiting portion 321 away from the substrate 100. The pixel limiting portion 321 may raise the position of the second main body portion 411b to facilitate the connection between the side of the third portion 421b near the isolation opening 310a and the surface of the second main body portion 411b away from the substrate 100.

[0070] Figure 5 This is a schematic diagram of the structure of a connecting portion 400c provided in an embodiment of this application.

[0071] like Figure 4 and Figure 5 As shown, in some optional embodiments, the orthographic projection shape of the connection portion 400c within at least partially isolated opening 310a on substrate 100 is annular so that gap space 400a is a sealed space.

[0072] Optionally, at least part of the gap space 400a within the isolation opening 310a is a closed space. Specifically, this can mean that the first part 410, the second part 421a, and the third part 421b within the isolation opening 310a can be enclosed to form a closed gap space 400a.

[0073] Optionally, the orthographic projection of the connecting portion 400c onto the substrate 100 is annular, meaning the orthographic projection of the connecting portion 400c onto the substrate 100 is a closed annular shape, to facilitate the formation of a sealed gap space 400a. The sealed gap space 400a formed by the first portion 410, the second portion 421a, and the third portion 421b may not be connected to other external spaces, thereby further enhancing the structural stability of the first portion 410, the second portion 421a, and the third portion 421b.

[0074] Optionally, the orthographic projection of the connecting portion 400c on the substrate 100 can be set around the orthographic projection of the pixel opening 320a on the substrate 100.

[0075] In these optional embodiments, by setting the orthographic projection shape of the connecting portion 400c within at least a portion of the isolation opening 310a onto the substrate 100 to be annular, a large connection area is formed between the first portion 410 within the isolation opening 310a and the third portion 421b on the periphery of the isolation structure 310. This ensures that the first portion 410 within the isolation opening 310a can provide better support for both the second portion 421a and the third portion 421b on the periphery of the isolation structure 310. This enhances the supporting effect of the first portion 410 on the second portion 421a and the third portion 421b, making it less likely for the second portion 421a and the third portion 421b to detach from the isolation structure 310. This also improves the encapsulation effect of the first encapsulation structure 400 on the display panel 10. Furthermore, when a subsequent film layer is prepared on the first packaging structure 400, the material of the subsequent film layer can be well continuous at the annular connecting portion 400c, which facilitates the molding or patterning of the subsequent film layer, so that the subsequent film layer can better cover at least part of the first packaging structure 400 within the isolation opening 310a, and provide a certain degree of protection to the first packaging structure 400.

[0076] In some alternative embodiments, the gap space 400a within the first opening 310aa is a sealed space. For example, the first portion 410, the second portion 421a, and the third portion 421b of the first packaging unit 401 can be enclosed to form a sealed gap space 400a.

[0077] Optionally, the third portion 421b within the first opening 310aa connects with the first portion 410 to form a connecting portion 400c, and the orthographic projection of the connecting portion 400c within the first opening 310aa onto the substrate 100 is annular. For example, the side surface of the first portion 410 in the first packaging unit 401 facing away from the substrate 100 can be interconnected with the side surface of the third portion 421b covering the second isolation portion 312 away from the first isolation portion 311 to form an annular connecting portion 400c.

[0078] In these optional embodiments, by setting the gap space 400a within the first opening 310aa as a sealed space, the first portion 410 in the first packaging unit 401 can provide better support for the third portion 421b, thereby giving the first packaging unit 401 better structural stability. This makes the first packaging unit 401 less susceptible to damage from subsequent processes. For example, it makes the first packaging unit 401 less likely to be damaged during the fabrication of the second light-emitting device 200b, the second packaging unit 402, the third light-emitting device 200c, and the third packaging unit 403, thus improving the packaging stability of the first packaging unit 401.

[0079] Furthermore, when a subsequent film layer is prepared on the first packaging unit 401, the material of the subsequent film layer can be well continuous at the connection portion 400c, which facilitates the forming of the subsequent film layer or the patterning of the subsequent film layer, so that the subsequent film layer can better cover the first packaging unit 401 and provide a certain degree of protection to the first packaging unit 401.

[0080] For example, during the subsequent fabrication of the light-emitting unit 220 and the second electrode 210 of the second light-emitting device 200b, as well as the second packaging unit 402, after fabricating the material of the light-emitting unit 220 and the second electrode 210 of the second light-emitting device 200b over the entire surface, the material of the light-emitting unit 220 and the second electrode 210 of the second light-emitting device 200b can be relatively continuous on the first packaging unit 401. This allows the material of the light-emitting unit 220 and the second electrode 210 of the second light-emitting device 200b to be used to protect the first packaging unit 401 within the first opening 310aa when the second packaging unit 402 is patterned on the light-emitting unit 220 and the second electrode 210 of the second light-emitting device 200b, i.e. when the material of the second packaging unit 402 outside the second opening 310ab is removed. This material can be used to protect the first packaging unit 401 within the first opening 310aa, making it less likely for the etching material to damage the first packaging unit 401, thereby improving the structural stability of the first packaging unit 401. Furthermore, during the fabrication of the second light-emitting device 200b or the second packaging unit 402, the etching material is less likely to enter the gap space 400a of the first packaging unit 401, which can effectively reduce the etching damage to the inner wall of the gap space 400a in the first packaging unit 401, thereby improving the structural stability of the first packaging structure 400.

[0081] For example, in the subsequent fabrication of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c, as well as the third packaging unit 403, after fabricating the material of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c over the entire surface, the material of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c can be relatively continuous on the first packaging unit 401. This allows the material of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c to be used to protect the first packaging unit 401 within the first opening 310aa when the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c are patterned, i.e. when the material of the third packaging unit 403 outside the third opening 310ac is removed. This material can be used to protect the first packaging unit 401 within the first opening 310aa, making it less likely for the etching material to damage the first packaging unit 401, thereby improving the structural stability of the first packaging unit 401. Furthermore, during the fabrication of the third light-emitting device 200c or the third packaging unit 403, the etching material is less likely to enter the gap space 400a of the first packaging unit 401, which can better reduce the etching damage to the inner wall of the gap space 400a in the first packaging unit 401, thereby better improving the structural stability of the first packaging structure 400.

[0082] Figure 6 This is a schematic diagram of the structure of a connecting portion 400c provided in another embodiment of this application. Figure 7 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 7 Can be Figure 1 A partial cross-sectional view of another embodiment at point AA.

[0083] like Figure 6 and Figure 7 As shown, in some optional embodiments, the first portion 410 and the third portion 421b within at least partially isolated opening 310a may be at least partially spaced apart and form a communicating opening 400b. For example, the first portion 410 and the third portion 421b within the second opening 310ab may be at least partially spaced apart and form a communicating opening 400b, and / or, the first portion 410 and the third portion 421b within the third opening 310ac may be at least partially spaced apart and form a communicating opening 400b.

[0084] Optionally, at least a portion of the first portion 410 within the isolation opening 310a is at least partially spaced from the side surface of the substrate 100 and at least a portion of the third portion 421b is at least partially spaced from the side surface of the isolation opening 310a, forming at least one communicating opening 400b.

[0085] In these optional embodiments, by providing a connecting opening 400b, material can be subsequently filled into the gap space 400a through the connecting opening 400b to better support the second portion 421a and the third portion 421b, making it less likely for the second portion 421a and the third portion 421b to detach from the isolation structure 310, thereby improving the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0086] In some optional embodiments, at least a portion of the gap space 400a is filled with a support structure P. The support structure P can provide good support for the second portion 421a and the third portion 421b. Specifically, the support structure P can provide good support for the second portion 421a and the third portion 421b, making it less likely for the second portion 421a and the third portion 421b to detach from the isolation structure 310, thereby improving the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0087] Optionally, during the fabrication of the display panel 10, the material of the support structure P can be filled into the gap space 400a through the connecting opening 400b.

[0088] Optionally, the material of the support structure P may include an organic material, which allows the material of the support structure P to have good fluidity, so that the support structure P can fill the gap space 400a through the connecting opening 400b.

[0089] In some optional embodiments of this application, there are various methods for preparing the support structure P.

[0090] In some alternative embodiments, the support structure P can be fabricated independently. Specifically, the support structure P can be fabricated after the fabrication of the first encapsulation structure 400 within the partial isolation opening 310a is completed.

[0091] For example, the gap space 400a within the second opening 310ab can form at least one connecting opening 400b, meaning the second packaging unit 402 can have at least one connecting opening 400b. After the fabrication of the second packaging unit 402 is completed, and before the fabrication of the third light-emitting device 200c, the material of the support structure P can be filled into the gap space 400a of the second packaging unit 402 through the connecting opening 400b to complete at least part of the fabrication of the support structure P. The support structure P filled into the gap space 400a of the second packaging unit 402 can be used to support the second packaging unit 402. The second portion 421a and the third portion 421b of 2, and the support structure P filled in the gap space 400a of the second packaging unit 402 can also be used to protect the second packaging unit 402 at the gap space 400a, so that when the third light-emitting device 200c or the third packaging unit 403 is prepared, the etching material is not easy to enter the gap space 400a of the second packaging unit 402, which can better reduce the etching damage of the etching material to the inner wall of the gap space 400a in the second packaging unit 402, thereby better improving the structural stability of the first packaging structure 400.

[0092] For example, the gap space 400a within the third opening 310ac can form at least one connecting opening 400b, that is, the third packaging unit 403 can have at least one connecting opening 400b. After the preparation of the third packaging unit 403 is completed, the material of the support structure P can be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b to complete the preparation of at least part of the support structure P.

[0093] Figure 8 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 8 Can be Figure 1 A partial cross-sectional view of one embodiment is also shown at point AA.

[0094] like Figure 8 As shown, in some alternative embodiments, when preparing other film layer structures in the display panel 10, the material of other film layer structures can be filled into the gap space 400a through the connecting opening 400b to form a support structure P.

[0095] Optionally, the display panel 10 further includes a second encapsulation layer 500 disposed on the side of the first encapsulation structure 400 facing away from the substrate 100. At least a portion of the first portion 410 in the isolation opening 310a is at least partially spaced apart from the surface of the third portion 421b near the isolation opening 310a, forming a connecting opening 400b. At least a portion of the second encapsulation layer 500 is located within the gap space 400a to form a support structure P. The material of the second encapsulation layer 500 is the same as the material of the support structure P.

[0096] For example, when the second encapsulation layer 500 is prepared after the first encapsulation structure 400 is completed, at least a portion of the material of the second encapsulation layer 500 may extend into the gap space 400a through the connecting opening 400b to form a support structure P.

[0097] In these optional embodiments, the second encapsulation layer 500 can also be used to encapsulate the light-emitting device 200 of the display panel 10. When fabricating the second encapsulation layer 500, the material of the second encapsulation layer 500 can enter the gap space 400a through the connecting opening 400b to form a support structure P. This allows a portion of the material of the second encapsulation layer 500 to also support the second portion 421a and the third portion 421b, further enhancing the structural stability of the first encapsulation structure 400 at the gap space 400a. Furthermore, the provision of the second encapsulation layer 500 can further improve the encapsulation effect of the display panel 10.

[0098] Optionally, the material of the second encapsulation layer 500 includes an organic material, which allows the second encapsulation layer 500 to have good flowability, so that the material of the second encapsulation layer 500 can easily extend into the gap space 400a through the connecting opening 400b during the fabrication of the second encapsulation layer 500. Optionally, the second encapsulation layer 500 can be fabricated using inkjet printing (IJP) technology.

[0099] Optionally, the display panel 10 may also include a third encapsulation layer 600 disposed on the side of the second encapsulation layer 500 away from the substrate 100, so as to further improve the encapsulation effect of the light-emitting device 200.

[0100] Optionally, the material of the third encapsulation layer 600 may include inorganic materials, giving the third encapsulation layer 600 better encapsulation capabilities to reduce the impact of moisture on the light-emitting device 200. Optionally, the third encapsulation layer 600 may be prepared by chemical vapor deposition.

[0101] It is understood that the display panel 10 may also include a filter layer, optical adhesive, or cover plate structure located on the side of the third encapsulation layer 600 away from the second encapsulation layer 500.

[0102] In some optional embodiments, the first packaging structure 400 may further include a fourth portion 422 located on the side of the second isolation portion 312 facing away from the substrate 100 and spaced apart from the isolation structure 310. The fourth portion 422 located on the side of the isolation structure 310 facing away from the substrate 100 can better improve the path of moisture (which may include etching material) intruding into the light-emitting device 200, thereby better improving the packaging effect of the first packaging structure 400 on the light-emitting device 200.

[0103] Optionally, the first part 410, the second part 421a, the third part 421b and the fourth part 422 can be connected in sequence.

[0104] Specifically, the side of the second portion 421a facing away from the substrate 100 can be connected to the side of the fourth portion 422 facing the isolation opening 310a.

[0105] Optionally, a support structure P may also be filled between the fourth portion 422 and the isolation structure 310. The support structure P filled between the fourth portion 422 and the isolation structure 310 can provide better restraint for the fourth portion 422. For example, the support structure P filled between the fourth portion 422 and the isolation structure 310 can support the fourth portion 422, making it less likely for the fourth portion 422 to break and fall off towards the isolation structure 310, thereby improving the structural stability of the first packaging structure 400.

[0106] Optionally, when at least a portion of the second encapsulation layer 500 is reused as a support structure P, the material of at least a portion of the second encapsulation layer 500 may also extend between the fourth portion 422 and the isolation structure 310 to form the support structure P, so that a portion of the material of the second encapsulation layer 500 may also be used to support the fourth portion 422.

[0107] In some optional embodiments, at least part of the support structure P may also be located on the side of the fourth portion 422 away from the isolation structure 310, so that the fourth portion 422 can be better wrapped by the support structure P, thereby further enhancing the limiting effect of the support structure P on the fourth portion 422, so that the support structure P can limit the fourth portion 422 from falling off and breaking towards the pixel opening 320a, thereby better improving the structural stability of the first packaging structure 400.

[0108] Optionally, adjacent fourth portions 422 are spaced apart. For example, the side of the isolation structure 310 facing away from the substrate 100 may have at least two fourth portions 422, and each fourth portion 422 may be connected to a second portion 421a within a different isolation opening 310a. By spaced apart adjacent fourth portions 422, when fabricating the support structure P, the material of the support structure P can extend between the fourth portions 422 and the isolation structure 310 through the gaps between adjacent fourth portions 422, thereby facilitating the formation of a support structure P that better covers the periphery of the fourth portions 422.

[0109] In some embodiments of this application, the connecting opening 400b can be arranged in various ways.

[0110] like Figure 6As shown, in some optional embodiments, there are multiple connecting openings 400b within at least partially isolated opening 310a, and these multiple connecting openings 400b are spaced apart. For example, there may be multiple connecting openings 400b within the second opening 310ab.

[0111] Optionally, multiple connecting openings 400b can be spaced around the pixel opening 320a.

[0112] In these optional embodiments, by reasonably setting the number of connecting openings 400b, the connection area between the first portion 410 and the third portion 421b can be better controlled, so that the first portion 410 can provide better support for the third portion 421b to improve the structural stability of the first packaging structure 400, while also reducing the material blocking effect of the connecting portion 400c on the support structure P, so that the material of the support structure P can be more fully filled in the gap space 400a, thereby improving the packaging effect of the first packaging structure 400 on the light-emitting device 200.

[0113] Optionally, the orthographic projection shape of the connecting portion 400c within at least part of the isolation opening 310a on the substrate 100 may not be a closed ring. For example, there may be multiple connecting portions 400c, which may be spaced apart around the pixel opening 320a, and the connecting opening 400b may be located between adjacent connecting portions 400c.

[0114] Optionally, multiple connecting openings 400b can be set at equal intervals.

[0115] There are several ways to set the size of the connecting opening 400b. Optional options include... Figure 6 As shown, the orthographic projection areas of each connecting opening 400b on the substrate 100 can be equal, and / or, the orthographic projection shapes of each connecting opening 400b on the substrate 100 are the same. This allows the connecting portion 400c to support the third portion 421b of the isolation structure 310 facing the inner side of the isolation opening 310a more uniformly, thereby improving the structural stability of the first packaging structure 400. Furthermore, it also allows the material of the supporting structure P to fill the gap space 400a of the isolation structure 310 facing the inner side of the isolation opening 310a more uniformly through the connecting opening 400b.

[0116] Figure 9 This is a schematic diagram of the structure of a connecting portion 400c provided in another embodiment of this application.

[0117] Optional, such as Figure 9As shown, the connecting opening 400b includes a first type of connecting opening 400ba and a second type of connecting opening 400bb. The projected area of ​​the first type of connecting opening 400ba on the substrate 100 is larger than that of the second type of connecting opening 400bb on the substrate 100. By setting the first type of connecting opening 400ba and the second type of connecting opening 400bb with different areas, the first type of connecting opening 400ba with a larger area can facilitate the subsequent filling of material into the gap space 400a. It also allows the first portions 410 on both sides of the second type of connecting opening 400bb with a smaller area to better support the third portion 421b. This allows the first portion 410 to provide better support for the third portion 421b, thereby improving the structural stability of the first packaging structure 400 and reducing the material obstruction effect of the connecting portion 400c on the support structure P, so that the material of the support structure P can be more fully filled into the gap space 400a.

[0118] Optionally, the first type of connecting opening 400ba and the second type of connecting opening 400bb can be arranged alternately, that is, the first type of connecting opening 400ba can be located between adjacent second type of connecting openings 400bb, and / or, the second type of connecting opening 400bb can be located between adjacent first type of connecting openings 400ba. For example, on the inner side of the isolation structure 310 facing the isolation opening 310a, the first type of connecting opening 400ba and the second type of connecting opening 400bb can be alternately arranged to better balance the structural strength of the first encapsulation structure 400 and the ability of the first encapsulation structure 400 to facilitate the material filling of the supporting structure P.

[0119] Figure 10 This is a partial structural diagram of a first packaging structure 400 provided in an embodiment of this application.

[0120] In some optional embodiments, the orthographic projection shape of the connecting opening 400b within at least part of the isolation opening 310a onto the substrate 100 is annular, so as to better reduce the mutual interference between the first portion 410, the second portion 421a and the third portion 421b when the first package structure 400 is formed, and to allow the material of the support structure P to enter into the gap space 400a through the connecting opening 400b.

[0121] In some optional embodiments, the connecting opening 400b within the third opening 310ac may be annular, that is, the third packaging unit 403 may have an annular connecting opening 400b, and the side surface of the first portion 410 in the third packaging unit 403 facing away from the substrate 100 may be spaced apart from the third portion 421b at various locations in the third packaging unit 403.

[0122] In this optional embodiment, since the fabrication step of the third packaging unit 403 is located after the fabrication steps of the first light-emitting device 200a, the first packaging unit 401, the second light-emitting device 200b, and the second packaging unit 402, the fabrication processes of the first light-emitting device 200a, the first packaging unit 401, the second light-emitting device 200b, and the second packaging unit 402 are unlikely to affect the subsequently formed third packaging unit 403. Therefore, the side surface of the first portion 410 in the third packaging unit 403 facing away from the substrate 100 can be spaced apart from the side surface of the third portion 421b covering the second isolation portion 312 away from the first isolation portion 311. That is, the first portion 410 in the third packaging unit 403 does not need to provide excessive support to the third portion 421b in the third packaging unit 403. Therefore, by setting the connecting opening 400b within the third opening 310ac to be annular, the mutual interference between the first portion 410, the second portion 421a, and the third portion 421b in the third packaging unit 403 during its formation can be effectively reduced.

[0123] In some embodiments of this application, the gap space 400a of the first packaging unit 401 corresponding to the first opening 310aa can be a sealed space, and the connecting opening 400b of the third packaging unit 403 corresponding to the third opening 310ac can be annular, so that the first packaging unit 401 and the third packaging unit 403 can have the beneficial effects corresponding to those in the aforementioned embodiments. The morphological configuration of the second packaging unit 402 corresponding to the second opening 310ab can be varied.

[0124] In some optional embodiments, as described in the foregoing embodiments, the first portion 410 and the third portion 421b within the second opening 310ab may be at least partially spaced apart and form a communicating opening 400b, that is, the second packaging unit 402 corresponding to the second opening 310ab may have a communicating opening 400b.

[0125] For example, such as Figure 4 , Figure 7 and Figure 8 As shown, the first portion 410 and the third portion 421b within the second opening 310ab can be partially spaced apart to form a connecting opening 400b, and the first portion 410 and the third portion 421b within the second opening 310ab can be partially connected to form a connecting portion 400c. That is, the second packaging unit 402 corresponding to the second opening 310ab can simultaneously have a connecting portion 400c and a connecting opening 400b.

[0126] Figure 11 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 11 Can be Figure 1 A partial cross-sectional view of one embodiment is also shown at point AA.

[0127] For example, the first portion 410 and the third portion 421b within the second opening 310ab can be spaced apart and form an annular connecting opening 400b, that is, the second packaging unit 402 corresponding to the second opening 310ab can have an annular connecting opening 400b.

[0128] In these optional embodiments, since the fabrication step of the second packaging unit 402 is located after the fabrication steps of the first light-emitting device 200a and the first packaging unit 401, the fabrication process of the first light-emitting device 200a and the first packaging unit 401 does not easily affect the subsequently formed second packaging unit 402. Therefore, the side surface of the first portion 410 in the second packaging unit 402 that is away from the substrate 100 can be spaced apart from the side surface of the third portion 421b that at least partially covers the second isolation portion 312 that is away from the first isolation portion 311. That is, the first portion 410 in the second packaging unit 402 does not need to provide excessive support to the third portion 421b in the second packaging unit 402.

[0129] And since the fabrication step of the second packaging unit 402 is located before the third light-emitting device 200c and the third packaging unit 403, therefore, as Figure 4 , Figure 7 and Figure 8 As shown, by setting the surface of the first portion 410 in the second packaging unit 402 facing away from the substrate 100 to be partially connected to the third portion 421b in the second packaging unit 402, a portion of the first portion 410 can provide a certain support to the third portion 421b, making the second packaging unit 402 less likely to be damaged during the fabrication of the third light-emitting device 200c and the third packaging unit 403, thereby improving the packaging stability of the second packaging unit 402.

[0130] Figure 12 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 12 Can be Figure 1 A partial cross-sectional view of one embodiment is also shown at point AA.

[0131] In some other alternative embodiments, such as Figure 12 As shown, the gap space 400a within the second opening 310ab is a sealed space, meaning that the gap space 400a of the second packaging unit 402 corresponding to the second opening 310ab can be a sealed space. For example, the first portion 410, the second portion 421a, and the third portion 421b of the second packaging unit 402 can enclose and form a sealed gap space 400a.

[0132] Optionally, the third portion 421b within the second opening 310ab connects with the first portion 410 to form a connecting portion 400c, and the orthographic projection of the connecting portion 400c within the second opening 310ab onto the substrate 100 is annular. For example, the side surface of the first portion 410 in the second packaging unit 402 facing away from the substrate 100 can be interconnected with the side surface of the third portion 421b covering the second isolation portion 312 away from the first isolation portion 311 to form an annular connecting portion 400c.

[0133] In these optional embodiments, by setting the first portion 410, the second portion 421a, and the third portion 421b of the second packaging unit 402 to form a closed gap space 400a, the first portion 410 in the second packaging unit 402 can provide better support for the third portion 421b, so that the second packaging unit 402 can have better structural stability. This makes the second packaging unit 402 less susceptible to damage from subsequent processes. For example, it makes the second packaging unit 402 less susceptible to damage during the fabrication of the third light-emitting device 200c and the third packaging unit 403, thereby improving the packaging stability of the second packaging unit 402.

[0134] Furthermore, it also enables the material of the subsequent film layer to be well continuous at the connection portion 400c when the subsequent film layer is prepared on the second packaging unit 402, which facilitates the forming of the subsequent film layer or the patterning of the subsequent film layer, so that the subsequent film layer can better cover the second packaging unit 402 and provide a certain degree of protection to the second packaging unit 402.

[0135] For example, in the subsequent fabrication of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c, as well as the third packaging unit 403, after fabricating the material of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c over the entire surface, the material of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c can be relatively continuous on the second packaging unit 402. This allows the material of the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c to be used to protect the second packaging unit 402 inside the second opening 310ab when the light-emitting unit 220 and the second electrode 210 of the third light-emitting device 200c are patterned, i.e. when the material of the third packaging unit 403 outside the third opening 310ac is removed. This makes it easier for the etching material to damage the second packaging unit 402, thereby improving the structural stability of the second packaging unit 402. Furthermore, during the fabrication of the third light-emitting device 200c or the third packaging unit 403, the etching material is less likely to enter the gap space 400a of the second packaging unit 402, which can effectively reduce the etching damage to the inner wall of the gap space 400a in the second packaging unit 402, thereby improving the structural stability of the second packaging structure.

[0136] Figure 13 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 13 Can be Figure 1 A partial cross-sectional view of one embodiment is also shown at point AA.

[0137] like Figure 13 As shown, in some optional embodiments, when the first packaging structure 400 has a connecting opening 400b, a sealing structure F may be provided at least part of the connecting opening 400b. One side of the sealing structure F is connected to the surface of the first portion 410, and the other side of the sealing structure F is connected to the surface of the third portion 421b.

[0138] Optionally, the sealing structure F can completely cover the connecting opening 400b, so that the connecting opening 400b can be blocked by the sealing structure F, and the sealing structure F can together with the first part 410, the second part 421a and the third part 421b to form a closed gap space 400a. Alternatively, the sealing structure F can not completely cover the connecting opening 400b.

[0139] Optional, such as Figure 13 As shown, the display panel 10 may include only the sealing structure F and not the support structure P.

[0140] Alternatively, the display panel 10 may simultaneously include a sealing structure F and a supporting structure P. For example, the supporting structure P may be prepared first, allowing its material to enter the gap space 400a through the connecting opening 400b, and then the supporting structure P may be prepared. Or, for example, when the sealing structure F does not completely cover the connecting opening 400b, the material of the supporting structure P may enter the gap space 400a through the connecting opening 400b not covered by the connecting structure.

[0141] Optionally, there are various ways to set the material of the sealing structure F. For example, the material of the sealing structure F may include organic materials or inorganic materials.

[0142] Optionally, the material of the sealing structure F can have high viscosity, so that when the display panel 10 includes only the sealing structure F and not the support structure P, the sealing structure F can cover the connecting opening 400b well, and the sealing structure F is not easy to flow into the gap space 400a through the connecting opening 400b.

[0143] In these optional embodiments, the sealing structure F connecting the surface of the first portion 410 facing away from the substrate 100 and the surface of the third portion 421b near the isolation opening 310a can also be used to support the third portion 421b, thereby improving the structural stability of the first packaging structure 400. Furthermore, it allows for better continuity of the material of subsequent film layers at the sealing structure F when fabricating them on the first packaging structure 400, facilitating the molding or patterning of subsequent film layers. This enables the subsequent film layers to better cover the first packaging structure 400 and provide a certain degree of protection to it.

[0144] In some embodiments of this application, there are various ways to adjust the relative position between the side surface of the first portion 410 facing away from the substrate 100 and the side surface of the third portion 421b facing away from the isolation structure 310. That is, there are various ways to achieve at least partial interconnection between the first portion 410 and the third portion 421b, and there are also various ways to achieve at least partial spacing between the first portion 410 and the third portion 421b to form a connecting opening 400b.

[0145] Figure 14 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 14 Can be Figure 1 A partial cross-sectional view of one embodiment is also shown at point AA.

[0146] like Figure 14As shown, in some optional embodiments of this application, the relative position between the side surface of the first portion 410 facing away from the substrate 100 and the side surface of the third portion 421b facing away from the isolation structure 310 can be adjusted by changing the thickness of the first packaging structure 400.

[0147] In some alternative embodiments, the maximum thickness of the first encapsulation structure 400 within a portion of the isolation opening 310a is greater than the maximum thickness of the first encapsulation structure 400 within another portion of the isolation opening 310a.

[0148] Optionally, the maximum thickness of the first encapsulation structure 400 within the isolation opening 310a can refer to the thickness of the first encapsulation structure 400 at the middle of the sub-pixel corresponding to the isolation opening 310a. For example, the maximum thickness of the first encapsulation structure 400 within the isolation opening 310a can be the thickness of the first main body portion 411a of the first encapsulation structure 400 within the isolation opening 310a.

[0149] Optionally, the maximum thickness of the first portion 410 of the first encapsulation structure 400 within a portion of the isolation opening 310a is greater than the maximum thickness of the first portion 410 of the first encapsulation structure 400 within another portion of the isolation opening 310a.

[0150] Optionally, the maximum thickness of the second portion 421a of the first encapsulation structure 400 within a portion of the isolation opening 310a is greater than the maximum thickness of the second portion 421a of the first encapsulation structure 400 within another portion of the isolation opening 310a.

[0151] Optionally, the maximum thickness of the third portion 421b of the first packaging structure 400 within a portion of the isolation opening 310a is greater than the maximum thickness of the third portion 421b of the first packaging structure 400 within another portion of the isolation opening 310a.

[0152] In these optional embodiments, when the thickness of the first packaging structure 400 at the partial isolation opening 310a is relatively thick, the side surface of the first portion 410 at the partial isolation opening 310a facing away from the substrate 100 can be connected to the side surface of the third portion 421b covering the second isolation portion 312 away from the first isolation portion 311, so that the first portion 410 at the partial isolation opening 310a can provide better support to the third portion 421b, and make the thicker first packaging structure 400 at the partial isolation opening 310a less susceptible to etching damage.

[0153] When the thickness of the first packaging structure 400 at the partial isolation opening 310a is relatively thin, the side surface of the first portion 410 at the partial isolation opening 310a facing away from the substrate 100 can be spaced apart from the side surface of the third portion 421b covering the second isolation portion 312 away from the first isolation portion 311, so as to form a connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100, so that the material of the support structure P can be filled into the gap space 400a through the connecting opening 400b, so as to better support the structure of the first packaging structure 400 at the partial isolation opening 310a.

[0154] When the thickness of the first encapsulation structure 400 at the partial isolation opening 310a is moderate, the side surface of the first portion 410 at the partial isolation opening 310a facing away from the substrate 100 can be spaced apart from a portion of the third portion 421b, and the side surface of the first portion 410 at the partial isolation opening 310a facing away from the substrate 100 can be connected to another portion of the third portion 421b, so that the first portion 410 at the partial isolation opening 310a can provide better support to the third portion 421b, and the material of the support structure P can be filled into the gap space 400a through the connecting opening 400b formed between the first portion 410 and the second portion 421a.

[0155] In some alternative embodiments, the maximum thickness of the first packaging unit 401 is greater than the maximum thickness of the third packaging unit 403.

[0156] Optionally, the thickness of the first portion 410 in the first packaging unit 401 may represent the maximum thickness of the first packaging unit 401. Specifically, the thickness of the first main body portion 411a in the first packaging unit 401 may represent the maximum thickness of the first packaging unit 401.

[0157] Optionally, the thickness of the first portion 410 in the third packaging unit 403 may represent the maximum thickness of the third packaging unit 403. Specifically, the thickness of the first main body portion 411a in the third packaging unit 403 may represent the maximum thickness of the third packaging unit 403.

[0158] Optionally, the maximum thickness of the first portion 410 of the first packaging unit 401 is greater than the maximum thickness of the first portion 410 of the third packaging unit 403; and / or, the maximum thickness of the second portion 421a of the first packaging unit 401 is greater than the maximum thickness of the second portion 421a of the third packaging unit 403; and / or, the maximum thickness of the third portion 421b of the first packaging unit 401 is greater than the maximum thickness of the third portion 421b of the third packaging unit 403.

[0159] In these optional embodiments, by setting the maximum thickness of the first packaging unit 401 to be greater than the maximum thickness of the third packaging unit 403, the first packaging unit 401 is less susceptible to damage during subsequent etching processes in the fabrication of the display panel 10. For example, it makes the first packaging unit 401 less likely to be etched and damaged by the etching material during the etching processes of the second light-emitting device 200b, the second packaging unit 402, the third light-emitting device 200c, and the third packaging unit 403, thereby improving the packaging stability of the first packaging unit 401. Simultaneously, it also facilitates the formation of a sealed gap space 400a by the first portion 410, the second portion 421a, and the third portion 421b of the first packaging unit 401, allowing the first portion 410 to provide better support for the third portion 421b, thus giving the first packaging unit 401 better structural stability. Furthermore, it also facilitates the arrangement of the first portion 410 of the third packaging unit 403 away from the substrate 100 and the third portion 421b of the third packaging unit 403 away from the isolation structure 310, so as to form a connecting opening 400b located on the side of the gap space 400a away from the substrate 100, so that the material of the support structure P can be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b.

[0160] In some alternative embodiments, the maximum thickness of the second packaging unit 402 is greater than or equal to the maximum thickness of the third packaging unit 403; and / or, the maximum thickness of the second packaging unit 402 is less than or equal to the maximum thickness of the first packaging unit 401.

[0161] Optionally, the thickness of the first portion 410 in the second packaging unit 402 may represent the maximum thickness of the second packaging unit 402. Specifically, the thickness of the first main body portion 411a in the second packaging unit 402 may represent the maximum thickness of the second packaging unit 402.

[0162] For example, such as Figure 14As shown, the maximum thickness of the second packaging unit 402 can be greater than the maximum thickness of the third packaging unit 403, and the maximum thickness of the second packaging unit 402 can be less than the maximum thickness of the first packaging unit 401. By setting the maximum thickness of the second packaging unit 402 to be greater than the maximum thickness of the third packaging unit 403, during the fabrication of the display panel 10, the second packaging unit 402 is less likely to be damaged by etching material during the etching process of the third light-emitting device 200c and the third packaging unit 403, thereby significantly improving the packaging stability of the second packaging unit 402. By setting the maximum thickness of the second packaging unit 402 to be less than the maximum thickness of the first packaging unit 401, it is easy to realize that the side surface of the first portion 410 in the second packaging unit 402 facing away from the substrate 100 can be spaced apart from the third portion 421b of a part of the second packaging unit 402, and the side surface of the first portion 410 in the second packaging unit 402 facing away from the substrate 100 can be connected to the third portion 421b of another part of the second packaging unit 402, so as to achieve similar beneficial effects as the second packaging unit 402 with a similar structure in the aforementioned embodiments. This application will not elaborate further.

[0163] Alternatively, the maximum thickness of the second packaging unit 402 may be equal to the maximum thickness of the first packaging unit 401 (not shown in the figure), so that the structure of the second packaging unit 402 can be similar to that of the first packaging unit 401. This makes the second packaging unit 402 less susceptible to being etched and damaged by the etching material during the etching process of the third light-emitting device 200c and the third packaging unit 403. Furthermore, it is also convenient to realize that the first portion 410, the second portion 421a, and the third portion 421b of the second packaging unit 402 can be enclosed to form a closed gap space 400a, so as to achieve similar beneficial effects as the first packaging unit 401 with a similar structure in the aforementioned embodiments. This application will not elaborate further.

[0164] Alternatively, for example, the maximum thickness of the second packaging unit 402 may be equal to the maximum thickness of the third packaging unit 403 (not shown in the figure), so that the structure of the second packaging unit 402 may be similar to the structure of the third packaging unit 403, and the surface of the first portion 410 in the second packaging unit 402 facing away from the substrate 100 may be spaced apart from the third portion 421b in the second packaging unit 402 to form an annular connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100, so as to achieve similar beneficial effects as the third packaging unit 403 with a similar structure in the aforementioned partial embodiments. This application will not elaborate further.

[0165] In some alternative embodiments, the surface of the eaves 312a facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100 have a first gap, and the ratio of the maximum thickness of at least a portion of the first main body portion 411a to the first gap is not less than 1.25; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion 411b to the first gap is not less than 1.25.

[0166] Optionally, the maximum thickness of the first main body portion 411a may be slightly greater than the maximum thickness of the second main body portion 411b.

[0167] Optionally, the ratio of the maximum thickness of the first main body portion 411a to the first spacing is 1.5-2.5. Further optionally, the ratio of the maximum thickness of the first main body portion 411a to the first spacing can be 1.6-2.

[0168] Optionally, the second main body portion 411b includes a first main body sub-portion 411ba and a second main body sub-portion 411bb that are connected to each other. The orthographic projection of the first main body sub-portion 411ba on the substrate 100 is outside the orthographic projection of the second isolation portion 312 on the substrate 100, and the orthographic projection of the second main body sub-portion 411bb on the substrate 100 is inside the orthographic projection of the second isolation portion 312 on the substrate 100.

[0169] Optionally, the connection between the first part 410 and the third part 421b may refer to the connection between the first main body sub-part 411ba and the third part 421b.

[0170] Optionally, the maximum thickness of the second main body portion 411b may be the maximum thickness of the first main body sub-portion 411ba, and the ratio of the maximum thickness of at least part of the first main body sub-portion 411ba to the first spacing may be not less than 1.25.

[0171] Optionally, the ratio of the maximum thickness of at least a portion of the first main body portion 411a of the first packaging unit 401 to the first spacing is not less than 1.25; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion 411b of the first packaging unit 401 to the first spacing is not less than 1.25.

[0172] Optionally, the eaves 312a includes a first eaves 312aa corresponding to the first opening 310aa and a third eaves 312ac corresponding to the third opening 310ac. Optionally, the first opening 310aa may be formed by the first eaves 312aa. Optionally, the third opening 310ac may be formed by the third eaves 312ac.

[0173] Specifically, the first spacing can refer to the spacing between the surface of the first eaves 312aa facing the substrate 100 and the surface of the pixel limiting portion 321 away from the substrate 100, the ratio of the maximum thickness of the first main body portion 411a of the first packaging unit 401 to the first spacing corresponding to the first eaves 312aa is not less than 1.25, and / or the ratio of the maximum thickness of the second main body portion 411b of the first packaging unit 401 to the first spacing corresponding to the first eaves 312aa is not less than 1.25.

[0174] Optionally, the ratio of the maximum thickness of at least a portion of the first main body portion 411a of the second packaging unit 402 to the first spacing may also be not less than 1.25; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion 411b of the second packaging unit 402 to the first spacing may also be not less than 1.25.

[0175] Optionally, the eaves 312a may also include a second eaves 312ab corresponding to the second opening 310ab. Optionally, the second opening 310ab may be formed by the second eaves 312ab.

[0176] Specifically, the first spacing can also refer to the spacing between the surface of the second eaves 312ab facing the substrate 100 and the surface of the pixel limiting portion 321 facing away from the substrate 100. The ratio of the maximum thickness of the first main body portion 411a of the second packaging unit 402 to the first spacing corresponding to the second eaves 312ab is not less than 1.25, and / or the ratio of the maximum thickness of the second main body portion 411b of the second packaging unit 402 to the first spacing corresponding to the second eaves 312ab is not less than 1.25.

[0177] The distance between the surface of the first eaves 312aa facing the substrate 100 and the surface of the pixel limiting portion 321 away from the substrate 100 may be equal to the distance between the surface of the second eaves 312ab facing the substrate 100 and the surface of the pixel limiting portion 321 away from the substrate 100. Alternatively, the distance between the surface of the first eaves 312aa facing the substrate 100 and the surface of the pixel limiting portion 321 away from the substrate 100 may not be equal to the distance between the surface of the second eaves 312ab facing the substrate 100 and the surface of the pixel limiting portion 321 away from the substrate 100. This application does not impose specific limitations on this.

[0178] In these optional embodiments, by reasonably setting the ratio of the maximum thickness of the first main body portion 411a to the first spacing, and reasonably setting the ratio of the maximum thickness of the second main body portion 411b to the first spacing, the thickness of at least a portion of the first main body portion 411a and at least a portion of the second main body portion 411b in the first encapsulation structure 400 can be adjusted according to the shielding ability of the eaves portion 312a on the first encapsulation structure 400, so as to enable at least a portion of the first portion 410 in the first encapsulation structure 400 to be connected to the third portion 421b, thereby facilitating the support of the first portion 410 on the third portion 421b.

[0179] Specifically, when the first gap is large, the eaves 312a will be closer to the fabrication equipment of the first packaging structure 400 during the fabrication process of the first packaging structure 400, so that the eaves 312a has a greater impact on the material shielding of the first packaging structure 400, that is, the eaves 312a can have a better shielding ability. Therefore, according to the large first gap, at least a portion of the first main body portion 411a and at least a portion of the second main body portion 411b can be set to have a larger thickness to facilitate the connection between at least a portion of the first portion 410 and the third portion 421b, so as to realize the support of the first portion 410 for the third portion 421b.

[0180] When the first pitch is small, the eaves 312a will be relatively far away from the fabrication equipment of the first packaging structure 400 during the fabrication process of the first packaging structure 400, so that the eaves 312a has a small impact on the material shielding of the first packaging structure 400, that is, the shielding ability of the eaves 312a on the first packaging structure 400 is not good. Therefore, according to the small first pitch, at least a portion of the first main body portion 411a and at least a portion of the second main body portion 411b can be set to have a reasonable thickness, so as to facilitate the connection between at least a portion of the first portion 410 and the third portion 421b, while not increasing the thickness of the display panel 10 too much.

[0181] There are several ways to adjust the first gap. For example, the first gap can be adjusted by adjusting the size of the first isolation part 311 in the thickness direction.

[0182] In some optional embodiments, the dimension of the first isolation portion 311 in the thickness direction of the display panel 10 is a first height, and the ratio of the maximum thickness of at least a portion of the first main body portion 411a to the first height is not less than 1.25, so as to achieve that the ratio of the maximum thickness of at least a portion of the first main body portion 411a to the first spacing is not less than 1.25, and / or, the ratio of the maximum thickness of at least a portion of the second main body portion 411b to the first height is not less than 1.25, so as to achieve that the ratio of the maximum thickness of at least a portion of the second main body portion 411b to the first spacing is not less than 1.25.

[0183] Optionally, the first height may also refer to the maximum distance between the surface of the first isolation portion 311 facing the substrate 100 and the surface of the first isolation portion 311 away from the substrate 100. Optionally, the first height may be equal to the first distance.

[0184] Optionally, the maximum thickness of the first main body portion 411a may be slightly greater than the maximum thickness of the second main body portion 411b.

[0185] Optionally, the ratio of the maximum thickness to the first height of at least a portion of the first main body portion 411a is not less than 1.4. Further optionally, the ratio of the maximum thickness to the first height of at least a portion of the first main body portion 411a is not less than 1.617, and / or, the ratio of the maximum thickness to the first height of at least a portion of the second main body portion 411b is not less than 1.389.

[0186] In some alternative embodiments, the surface of the eaves 312a facing the substrate 100 has a second distance from the surface of the light-emitting device 200 facing away from the substrate 100, and the ratio of the maximum thickness of at least a portion of the first main body portion 411a to the second distance is not less than 1, and / or the ratio of the maximum thickness of at least a portion of the second main body portion 411b to the second distance is not less than 1.

[0187] Optionally, at least some of the light-emitting devices 200 may be located on the side of the pixel limiting portion 321 away from the substrate 100, and a second gap is formed between the surface of the eaves portion 312a facing the substrate 100 and the surface of the light-emitting device 200 on the pixel limiting portion 321 away from the substrate 100.

[0188] Optionally, the ratio of the maximum thickness of at least a portion of the first main body portion 411a of the first packaging unit 401 to the second spacing is not less than 1; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion 411b of the first packaging unit 401 to the second spacing is not less than 1.

[0189] Specifically, the second spacing can refer to the spacing between the surface of the first eaves 312aa facing the substrate 100 and the surface of the light-emitting device 200 away from the substrate 100, the ratio of the maximum thickness of the first main body portion 411a of the first packaging unit 401 to the second spacing corresponding to the first eaves 312aa is not less than 1, and / or the ratio of the maximum thickness of the second main body portion 411b of the first packaging unit 401 to the second spacing corresponding to the first eaves 312aa is not less than 1.

[0190] Optionally, the ratio of the maximum thickness of at least a portion of the first main body portion 411a of the second packaging unit 402 to the second spacing may also be not less than 1; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion 411b of the second packaging unit 402 to the second spacing may also be not less than 1.

[0191] Specifically, the second spacing can also refer to the spacing between the surface of the second eaves 312ab facing the substrate 100 and the surface of the light-emitting device 200 facing away from the substrate 100. The ratio of the maximum thickness of the first main body portion 411a of the second packaging unit 402 to the second spacing corresponding to the second eaves 312ab is not less than 1, and / or the ratio of the maximum thickness of the second main body portion 411b of the second packaging unit 402 to the second spacing corresponding to the second eaves 312ab is not less than 1.

[0192] The distance between the surface of the first eaves 312aa facing the substrate 100 and the surface of the light-emitting device 200 away from the substrate 100 may be equal to the distance between the surface of the second eaves 312ab facing the substrate 100 and the surface of the light-emitting device 200 away from the substrate 100. Alternatively, the distance between the surface of the first eaves 312aa facing the substrate 100 and the surface of the light-emitting device 200 away from the substrate 100 may not be equal to the distance between the surface of the second eaves 312ab facing the substrate 100 and the surface of the light-emitting device 200 away from the substrate 100. This application does not impose any specific limitations on this distance.

[0193] In these optional embodiments, the thickness of the light-emitting device 200 located on the pixel limiting portion 321 can affect the distance between the first portion 410 and the eaves portion 312a, that is, the thickness of the light-emitting device 200 located on the pixel limiting portion 321 can affect the distance between the first portion 410 and the third portion 421b covering the eaves portion 312a. Therefore, by further limiting the ratio of the maximum thickness of the first main body portion 411a to the second distance, and reasonably setting the ratio of the maximum thickness of the second main body portion 411b to the second distance, the thickness of at least a portion of the first main body portion 411a and at least a portion of the second main body portion 411b in the first packaging structure 400 can be adjusted more accurately according to the distance between the eaves portion 312a and the light-emitting device 200, so as to enable at least a portion of the first portion 410 in the first packaging structure 400 to be connected to the third portion 421b, thereby facilitating the support of the first portion 410 for the third portion 421b.

[0194] Figure 15 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 15 Can be Figure 1 A partial cross-sectional view of one embodiment is also shown at point AA.

[0195] like Figure 15 As shown, in some optional embodiments of this application, the relative position between the side surface of the first portion 410 facing away from the substrate 100 and the side surface of the third portion 421b facing away from the isolation structure 310 can be adjusted by changing the shape of the isolation structure 310.

[0196] In some alternative embodiments, the protruding length of at least a portion of the eaves 312a corresponding to one portion of the isolation opening 310a is greater than that of at least a portion of the eaves 312a corresponding to another portion of the isolation opening 310a.

[0197] Optionally, the protruding length of the eaves 312a may refer to the distance between the orthographic projection of the edge of the eaves 312a facing the isolation opening 310a on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing away from the substrate 100 on the substrate 100.

[0198] Optionally, the eaves 312a provided for a certain isolation opening 310a may refer to the eaves 312a that participates in enclosing and forming that part of the isolation opening 310a.

[0199] In these optional embodiments, by reasonably setting the protruding lengths of the eaves 312a corresponding to different isolation openings 310a to be different, during the manufacturing process of the display panel 10, some of the eaves 312a with longer protruding lengths in the isolation openings 310a can have better blocking and isolation capabilities, while the eaves 312a with shorter protruding lengths in other isolation openings 310a have less blocking and isolation capabilities.

[0200] Therefore, when fabricating the first packaging structure 400, the eaves 312a with a longer protruding length in a portion of the isolation opening 310a can better shield the material of the first packaging structure 400, making it difficult for the surface of the first portion 410 away from the substrate 100 in this portion of the isolation opening 310a to connect with the surface of the third portion 421b away from the first isolation portion 311. This allows the third portion 421b to be spaced apart from the first portion 410, so that a connecting opening 400b located on the side of the gap space 400a away from the substrate 100 can be formed in this portion of the isolation opening 310a.

[0201] The other part of the isolation opening 310a has a shorter protruding eave 312a, which is less likely to cause excessive obstruction to the material of the first packaging structure 400. This allows the surface of the first part 410 in the other part of the isolation opening 310a facing away from the substrate 100 to be more easily connected to the surface of the third part 421b away from the first isolation part 311. As a result, the first part 410 can provide better support for the third part 421b, thereby improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0202] In some alternative embodiments, the protruding length of the first eaves 312aa is less than the protruding length of the third eaves 312ac, that is, the protruding length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the first opening 310aa is less than the protruding length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the third opening 310ac.

[0203] Optionally, the protruding length of the first eaves 312aa can refer to the minimum distance between the orthographic projection of the edge of the first eaves 312aa facing the first opening 310aa onto the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the first eaves 312aa onto the substrate 100. Optionally, Figure 15 The length of a1 can represent the protruding length of the first convex part 312aa.

[0204] Optionally, the protruding length of the third eaves 312ac can refer to the minimum distance between the orthographic projection of the edge of the third eaves 312ac facing the third opening 310ac on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the third eaves 312ac on the substrate 100. Optionally, Figure 15 The length of a3 can represent the protruding length of the third convex part 312ac.

[0205] In these alternative embodiments, under the less obstructive effect provided by the first eaves 312aa with a shorter protruding length, the first portion 410, the second portion 421a, and the third portion 421b of the first packaging unit 401 at the first opening 310aa can enclose a sealed gap space 400a, so that the first portion 410 in the first packaging unit 401 can provide better support for the third portion 421b, so that the first packaging unit 401 can have better structural stability, thereby making the first packaging unit 401 less susceptible to damage from subsequent processes.

[0206] Under the significant shielding effect provided by the third eaves 312ac with a relatively long protrusion, the surface of the first portion 410 of the third packaging unit 403 facing away from the substrate 100 at the third opening 310ac can be spaced apart from each other by the third portions 421b at various locations in the third packaging unit 403, so as to form an annular connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100, so that the material of the support structure P can be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b, so as to better support the third packaging unit 403.

[0207] In some alternative embodiments, the protruding length of the second eaves 312ab is less than or equal to the protruding length of the third eaves 312ac; and / or, the protruding length of the second eaves 312ab is greater than or equal to the protruding length of the first eaves 312aa.

[0208] That is, the protrusion length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the second opening 310ab is less than or equal to the protrusion length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the third opening 310ac, and / or, the protrusion length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the second opening 310ab is greater than or equal to the protrusion length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the first opening 310aa.

[0209] Optionally, the protruding length of the second eaves 312ab may refer to the minimum distance between the orthographic projection of the edge of the second eaves 312ab toward the second opening 310ab on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 toward the second eaves 312ab on the substrate 100.

[0210] Optional, Figure 15 The length of a2 can represent the protruding length of the second eaves 312ab. Here, a2 can include a21 and a22. Specifically, when the protruding length of the second eaves 312ab is greater than or equal to the protruding length of the first eaves 312aa, the length of a21 can represent the protruding length of the second eaves 312ab; when the protruding length of the second eaves 312ab is less than or equal to the protruding length of the third eaves 312ac, the length of a22 can represent the protruding length of the second eaves 312ab.

[0211] In some embodiments, such as Figure 15As shown, the protruding length of a portion of the second eaves 312ab can be equal to the protruding length of the third eaves 312ac, and the protruding length of another portion of the second eaves 312ab can be equal to the protruding length of the first eaves 312aa. This allows the third portion 421b in the second packaging unit 402 to be spaced apart from a portion of the first portion 410 under the greater shielding effect provided by the portion of the second eaves 312ab with a longer protruding length. This forms a connecting opening 400b on the second packaging unit 402 located on the side of the gap space 400a away from the substrate 100. This allows the material of the support structure P to be filled into the gap space 400a of the second packaging unit 402 through the connecting opening 400b, thereby better supporting the structure of the second packaging unit 402. Furthermore, under the less obstructive influence provided by the second eaves 312ab with a shorter protruding length, the third portion 421b in the second packaging unit 402 can be interconnected with a portion of the first portion 410, so that a portion of the first portion 410 in the second packaging unit 402 can provide a certain support to the third portion 421b, making the second packaging unit 402 less likely to be damaged during the fabrication of the third light-emitting device 200c and the third packaging unit 403, thereby improving the packaging stability of the second packaging unit 402.

[0212] In other embodiments, the protruding length of the second eaves 312ab may be less than the protruding length of the third eaves 312ac, and the protruding length of the second eaves 312ab may be equal to the protruding length of the first eaves 312aa. This allows the structure of the second encapsulation unit 402 at the second opening 310ab to approximate the structure of the first encapsulation unit 401 within the first opening 310aa, under the greater shielding effect provided by the second eaves 312ab with a longer protruding length. This allows the first portion 410, the second portion 421a, and the third portion 421b of the second encapsulation unit 402 to enclose a sealed gap space 400a, thereby achieving a similar beneficial effect to the first encapsulation unit 401 with a similar structure in the aforementioned embodiments. This application will not elaborate further.

[0213] In other embodiments, the protruding length of the second eaves 312ab can be equal to the protruding length of the third eaves 312ac, and the protruding length of the second eaves 312ab can be greater than the protruding length of the first eaves 312aa. This allows the structure of the second packaging unit 402 at the second opening 310ab to approximate the structure of the third packaging unit 403 within the third opening 310ac, under the smaller obstruction provided by the second eaves 312ab with a shorter protruding length. This allows the surface of the first portion 410 of the second packaging unit 402 at the second opening 310ab facing away from the substrate 100 to be spaced apart from the third portions 421b at various locations in the second packaging unit 402, forming an annular connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100. This achieves a similar beneficial effect to the third packaging unit 403 with a similar structure in the aforementioned embodiments, which will not be elaborated further in this application.

[0214] In some alternative embodiments, the ratio of the protruding length of at least a portion of the eaves 312a to the first height is not greater than 1.25.

[0215] Optionally, the ratio of the protruding length of the first eaves 312aa to the first height may not be greater than 1.25, and / or, at least a portion of the ratio of the protruding length of the second eaves 312ab to the first height may not be greater than 1.25.

[0216] In these optional embodiments, by setting the ratio of the protruding length of at least a portion of the eaves 312a to the first height to be no greater than 1.25, that is, by reasonably limiting the protruding length of the portion of the eaves 312a according to the size of the first isolation portion 311, the protruding length of at least a portion of the eaves 312a is not too large relative to the height of the first isolation portion 311. This makes the shielding and isolation effect of the portion of the eaves 312a on the material of the first encapsulation structure 400 smaller, which facilitates the connection between the first portion 410 and the third portion 421b in the isolation opening 310a corresponding to the portion of the eaves 312a. In other words, it facilitates the first portion 410 in the isolation opening 310a corresponding to the portion of the eaves 312a to provide a better support effect to the third portion 421b, thereby improving the structural stability of the first encapsulation structure 400 in the isolation opening 310a.

[0217] For example, when the ratio of the protruding length of the first eaves 312aa to the first height is not greater than 1.25, under the smaller obstruction effect provided by the first eaves 312aa, which has a shorter protruding length relative to the height of the first isolation portion 311, it is easier to connect the first portion 410 and the third portion 421b within the first opening 310aa. That is, it is easier for the first portion 410 within the first opening 310aa to provide a better support effect to the third portion 421b, thereby improving the structural stability of the first encapsulation structure 400 within the first opening 310aa.

[0218] For example, when the ratio of the protruding length of at least a portion of the second eaves 312ab to the first height is not greater than 1.25, under the smaller obstruction effect provided by the second eaves 312ab, which has a shorter protruding length relative to the height of the first isolation portion 311, it is easier to connect at least a portion of the first portion 410 and the third portion 421b within the second opening 310ab. That is, it is easier for the first portion 410 within the second opening 310ab to provide a better support effect to the third portion 421b, thereby improving the structural stability of the first encapsulation structure 400 within the second opening 310ab.

[0219] Figure 16 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 16 Can be Figure 1 A partial cross-sectional view of one embodiment is also shown at point AA.

[0220] like Figure 16 As shown, in some optional embodiments, the distance between at least a portion of the second isolation portion 312 that participates in enclosing and forming the first opening 310aa and the substrate 100 is smaller than the distance between the second isolation portion 312 that participates in enclosing and forming the third opening 310ac and the substrate 100.

[0221] Optionally, the distance between the second isolation portion 312 and the substrate 100 may refer to the distance between the surface of the second isolation portion 312 facing the substrate 100 and the substrate 100.

[0222] Optionally, the distance between the first eaves 312aa and the substrate 100 is smaller than the distance between the third eaves 312ac and the substrate 100.

[0223] In these optional embodiments, by setting the distance between at least a portion of the second isolation portion 312 participating in enclosing and forming the first opening 310aa and the substrate 100 to be smaller than the distance between the second isolation portion 312 participating in enclosing and forming the third opening 310ac and the substrate 100, the third eaves portion 312ac can be closer to the fabrication equipment of the first packaging structure 400 than the first eaves portion 312aa during the fabrication process of the first packaging structure 400. This makes the material shielding effect of the first eaves portion 312aa on the first packaging structure 400 less, and facilitates the connection between the first portion 410 and the third portion 421b within the first opening 310aa. In other words, it facilitates the first portion 410 within the first opening 310aa to provide better support to the third portion 421b, thereby improving the structural stability of the first packaging structure 400 within the first opening 310aa. Furthermore, the third protrusion 312ac has a greater impact on the material shielding of the first packaging structure 400, which facilitates at least partial spacing between the first portion 410 and the third portion 421b within the third opening 310ac to form a connecting opening 400b. This allows the material of the subsequent support structure P to be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b, thereby better supporting the third packaging unit 403.

[0224] There are various ways to adjust the distance between the second isolation portion 312 and the substrate 100. For example, the distance between the second isolation portion 312 and the substrate 100 can be adjusted by adjusting the size of the first isolation portion 311 in the thickness direction.

[0225] Optionally, the dimension of at least a portion of the first isolation portion 311 participating in enclosing and forming the first opening 310aa in the thickness direction of the display panel 10 may be smaller than the dimension of the first isolation portion 311 participating in enclosing and forming the third opening 310ac in the thickness direction of the display panel 10, so as to achieve a spacing between at least a portion of the second isolation portion 312 participating in enclosing and forming the first opening 310aa and the substrate 100 that is smaller than the spacing between the second isolation portion 312 participating in enclosing and forming the third opening 310ac and the substrate 100.

[0226] In some alternative embodiments, the distance between at least a portion of the second isolation portion 312 participating in enclosing the second opening 310ab and the substrate 100 is greater than or equal to the distance between the second isolation portion 312 participating in enclosing the first opening 310aa and the substrate 100; and / or, the distance between at least a portion of the second isolation portion 312 participating in enclosing the second opening 310ab and the substrate 100 is less than or equal to the distance between the second isolation portion 312 participating in enclosing the third opening 310ac and the substrate 100.

[0227] Optionally, the distance between at least a portion of the second eaves 312ab and the substrate 100 is greater than or equal to the distance between the first eaves 312aa and the substrate 100; and / or, the distance between at least a portion of the second eaves 312ab and the substrate 100 is less than or equal to the distance between the third eaves 312ac and the substrate 100.

[0228] Optionally, the dimension of at least a portion of the first isolation portion 311 participating in enclosing and forming the second opening 310ab in the thickness direction of the display panel 10 is greater than or equal to the dimension of the first isolation portion 311 participating in enclosing and forming the first opening 310aa in the thickness direction of the display panel 10, so as to achieve a distance between at least a portion of the second isolation portion 312 participating in enclosing and forming the second opening 310ab and the substrate 100 that is greater than or equal to the distance between the second isolation portion 312 participating in enclosing and forming the first opening 310aa and the substrate 100; and / or, the dimension of at least a portion of the first isolation portion 311 participating in enclosing and forming the second opening 310ab in the thickness direction of the display panel 10 is less than or equal to the dimension of the first isolation portion 311 participating in enclosing and forming the third opening 310ac in the thickness direction of the display panel 10, so as to achieve a distance between at least a portion of the second isolation portion 312 participating in enclosing and forming the second opening 310ab and the substrate 100 that is less than or equal to the distance between the second isolation portion 312 participating in enclosing and forming the third opening 310ac and the substrate 100.

[0229] In these alternative embodiments, the distance between at least a portion of the second eaves 312ab and the substrate 100 may be between the distance between the first eaves 312aa and the substrate 100 and the distance between the third eaves 312ac and the substrate 100, and / or, the distance between at least a portion of the second eaves 312ab and the substrate 100 may be equal to the distance between the first eaves 312aa and the substrate 100, and / or, the distance between at least a portion of the second eaves 312ab and the substrate 100 may be equal to the distance between the third eaves 312ac and the substrate 100. For ease of description, an example will be given where the distance between a portion of the second eaves 312ab is equal to the distance between the first eaves 312aa and the substrate 100, and the distance between another portion of the second eaves 312ab is equal to the distance between the third eaves 312ac and the substrate 100.

[0230] During the fabrication of the first packaging structure 400, the portion of the second eaves 312ab with a large gap from the substrate 100 can be relatively close to the fabrication equipment of the first packaging structure 400. This makes the portion of the second eaves 312ab have a greater impact on the material shielding of the first packaging structure 400. This allows the first portion 410 and the third portion 421b within the third opening 310ac to be at least partially spaced to form a connecting opening 400b. This allows the material of the subsequent support structure P to be filled into the gap space 400a of the third packaging unit 403 through the connecting opening 400b, thereby better supporting the third packaging unit 403. The other part of the second eaves 312ab, which has a smaller gap with the substrate 100, can be relatively far away from the fabrication equipment of the first packaging structure 400. This makes the other part of the second eaves 312ab have less impact on the material shielding of the first packaging structure 400. It can facilitate the connection between the part of the first portion 410 and the third portion 421b in the second opening 310ab. In other words, it can facilitate the part of the first portion 410 in the second opening 310ab to provide a better support effect to the third portion 421b, thereby improving the structural stability of the first packaging structure 400 in the second opening 310ab.

[0231] Figure 17 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0232] Please refer to Figures 1 to 17An embodiment of the first aspect of this application also provides a display panel 10, comprising: a substrate 100; an isolation structure 310 disposed on one side of the substrate 100 and enclosing a plurality of isolation openings 310a, the isolation structure 310 including a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 facing away from the substrate 100, the second isolation portion 312 having an eave portion 312a protruding from the first isolation portion 311 toward the side of the isolation openings 310a; a plurality of light-emitting devices 200, at least a portion of the structure of the light-emitting devices 200 being located within the isolation openings 310a, the light-emitting devices 200 including a light-emitting unit 220 and a first electrode 230 located on the side of the light-emitting unit 220 facing away from the substrate 100; and a first encapsulation structure 400 disposed on the side of the light-emitting devices 200 facing away from the substrate 100, the first encapsulation structure 400 including a first portion 410. The first portion 410 covers the side of the light-emitting device 200 away from the substrate 100, the second portion 421a covers the side of the first isolation portion 311 facing the isolation opening 310a, and the third portion 421b is at least partially located on the side of the second isolation portion 312 facing the substrate 100 and is at least partially attached to the eaves portion 312a. The first portion 410, the second portion 421a, and the third portion 421b enclose a gap space 400a. The first portion 410 and the third portion 421b are at least partially spaced apart within the isolation opening 310a and form a connecting opening 400b. The minimum dimension of the connecting opening 400b in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting units 220 and the first electrode 230 of at least a portion of the light-emitting device 200 and the sealing coefficient.

[0233] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and encloses a plurality of isolation openings 310a. At least a portion of the structure of the light-emitting device 200 is located within the isolation openings 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10. The isolation structure 310 includes a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 facing away from the substrate 100. The second isolation portion 312 has a protruding eave 312a extending from the first isolation portion 311 toward the isolation opening 310a. This allows at least a portion of the material of the light-emitting device 200 to be directly vapor-deposited over the entire surface during the fabrication of the light-emitting device 200 of the display panel 10. The protruding eave 312a of the second isolation portion 312 can block at least a portion of the material used to fabricate the light-emitting device 200, thereby isolating the material of the light-emitting device 200 between adjacent sub-pixels. This facilitates the formation of multiple spaced light-emitting devices 200 located within the isolation opening 310a. Consequently, a high-precision photomask is not required during the fabrication of the light-emitting device 200 of the display panel 10. For example, a high-precision metal photomask is not required during the vapor deposition of the material of the light-emitting device 200, thus significantly reducing the manufacturing cost of the display panel 10. Furthermore, the isolation structure 310 allows for the relatively independent fabrication of different light-emitting devices 200.

[0234] The first encapsulation structure 400 is disposed on the side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. The first encapsulation structure 400 includes a first portion 410, a second portion 421a, and a third portion 421b. The first portion 410 covers the side of the light-emitting device 200 facing away from the substrate 100. The second portion 421a covers the side of the first isolation portion 311 facing the isolation opening 310a. The third portion 421b is at least partially located on the side of the second isolation portion 312 facing the substrate 100 and is at least partially attached to the eaves portion 312a, so that the first encapsulation structure 400 can have a larger size to better extend the encapsulation path of the first encapsulation structure 400.

[0235] The first portion 410, the second portion 421a, and the third portion 421b enclose a gap space 400a, which can effectively reduce the mutual interference between the first portion 410, the second portion 421a, and the third portion 421b when the first packaging structure 400 is formed. This allows the first portion 410 to be formed on the side of the light-emitting device 200 away from the substrate 100, the second portion 421a to be formed on the side of the second isolation portion 312 facing the isolation opening 310a, and the third portion 421b to be formed on the side of the second isolation portion 312 facing the substrate 100. This can effectively improve the packaging effect of the first packaging structure 400 on the display panel 10.

[0236] At least partially, the first portion 410 and the third portion 421b within the isolation opening 310a are at least partially spaced apart and form a connecting opening 400b. By setting the minimum dimension of the connecting opening 400b in the thickness direction of the display panel 10 to be less than or equal to the product of the sum of the thicknesses of the light-emitting units 220 and the first electrode 230 of at least some of the light-emitting devices 200 and the sealing coefficient, when different light-emitting devices 200 are fabricated individually during the fabrication process of the display panel 10, the material of the light-emitting units 220 and the first electrode 230 of the later-fabricated light-emitting device 200 can better seal the connecting opening 400b of the first encapsulation structure 400 above the previously fabricated light-emitting device 200. 0b, that is, the materials of the light-emitting unit 220 and the first electrode 230 of the later-prepared light-emitting device 200 can be better continuous at the connecting opening 400b of the first packaging structure 400 above the previously prepared light-emitting device 200. This allows the light-emitting unit 220 and the first electrode 230 of the later-prepared light-emitting device 200 to better cover and protect the first packaging structure 400 below when the film structure above the light-emitting unit 220 and the first electrode 230 of the later-prepared light-emitting device 200 is patterned. This makes it difficult for etching material to enter the gap space 400a through the connecting opening 400b, thereby improving the structural stability of the display panel 10.

[0237] Specifically, regarding the beneficial effects that setting the minimum size of the connecting opening 400b in the thickness direction of the display panel 10 can bring during the fabrication process of the display panel 10, please refer to the corresponding fabrication method and corresponding drawings in the embodiments described later.

[0238] Optionally, the display panel 10 provided in the first aspect of this application may be the display panel 10 in any of the foregoing embodiments. Therefore, the display panel 10 provided in the embodiments of this application may have the beneficial effects of the display panel 10 in any of the foregoing embodiments. This application will not elaborate further on it.

[0239] For example, the isolation structure 310 may be the isolation structure 310 described in any of the foregoing embodiments, and the isolation structure 310 may include the first isolation portion 311, the second isolation portion 312, and the third isolation portion 313 described in any of the foregoing embodiments. The isolation opening 310a may include the first opening 310aa, the second opening 310ab, and the third opening 310ac described in any of the foregoing embodiments.

[0240] For example, the display panel 10 also includes a pixel definition layer 320 disposed on the side of the substrate 100 facing the light-emitting device 200. The pixel definition layer 320 includes a pixel limiting portion 321 and a pixel opening 320a formed by the pixel limiting portion 321. An isolation structure 310 is disposed on the side of the pixel limiting portion 321 away from the substrate 100. The pixel opening 320a communicates with the isolation opening 310a.

[0241] For example, the light-emitting device 200 may be the light-emitting device 200 described in any of the foregoing embodiments. The light-emitting device 200 may include a first light-emitting device 200a provided corresponding to the first opening 310aa, a second light-emitting device 200b provided corresponding to the second opening 310ab, and a third light-emitting device 200c provided corresponding to the third opening 310ac in any of the foregoing embodiments.

[0242] For example, the first packaging structure 400 may include a first packaging unit 401 located at least partially within the first opening 310aa, a second packaging unit 402 located at least partially within the second opening 310ab, and a third packaging unit 403 located at least partially within the third opening 310ac in any of the foregoing embodiments.

[0243] In some embodiments, the first encapsulation structure 400 in a display panel 10 provided by the first aspect of this application can be completely configured with reference to the first encapsulation structure 400 in the display panel 10 in any of the foregoing embodiments. That is, the first portion 410 in the first encapsulation structure 400 can be at least partially connected with the third portion 421b to form the connection portion 400c described in any of the foregoing embodiments. For example, the side of the third portion 421b in the first opening 310aa near the isolation opening 310a is at least partially connected with the surface of the first portion 410 on the side away from the substrate 100 to form the connection portion 400c, and the orthographic projection shape of the connection portion 400c in the first opening 310aa on the substrate 100 is annular so that the gap space 400a in the first opening 310aa is a sealed space. For example, the third portion 421b within the second opening 310ab is at least partially connected to the surface of the first portion 410 on the side away from the substrate 100 to form a connecting portion 400c, and the orthographic projection of the connecting portion 400c within the second opening 310ab onto the substrate 100 is annular so that the gap space 400a within the second opening 310ab forms a closed gap space 400a.

[0244] In other embodiments, the embodiments of the first aspect of this application also provide a first encapsulation structure 400 in a display panel 10 that can be at least partially different from the first encapsulation structure 400 in any of the foregoing embodiments. Specifically, the first portion 410 of the first encapsulation structure 400 within each isolation opening 310a can be spaced apart from the third portion 421b and form a connecting opening 400b, meaning the connecting opening 400b within each isolation opening 310a can be annular. For example, the gap space 400a within the first opening 310aa forms at least one connecting opening 400b. For example, the gap space 400a within the second opening 310ab forms at least one connecting opening 400b. For example, the gap space 400a within the third opening 310ac forms at least one connecting opening 400b.

[0245] For ease of description, the following embodiments will be referred to as Figure 17 The following is an example of how the first portion 410 of the first encapsulation structure 400 within each isolation opening 310a can be spaced apart from the third portion 421b to form an annular connecting opening 400b.

[0246] In some embodiments of this application, the minimum dimension of the connecting opening 400b in the thickness direction of the display panel 10 may be the minimum value of the distance between the first portion 410 and the third portion 421b in the thickness direction of the isolation opening 310a.

[0247] In some alternative embodiments, the minimum size of the connecting opening 400b in the thickness direction of the display panel 10 may be less than or equal to the opening size that can be blocked by at least part of the light-emitting unit 220 of the light-emitting device 200 and the first electrode 230.

[0248] Optionally, the size of the opening that can be sealed by the light-emitting unit 220 of the light-emitting device 200 and the first electrode 230 can refer to the maximum value that the material of the light-emitting unit 220 and the first electrode 230 of the rear light-emitting device 200 can seal in the thickness direction of the communication opening 400b of the first encapsulation structure 400 of the front light-emitting device 200 can be set when the rear light-emitting device 200 is prepared after the preparation of the front part of the light-emitting device 200 and the first encapsulation structure 400.

[0249] The sealing of the opening by the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 can mean that the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 can fill the opening, or it can mean that the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 can completely cover the opening.

[0250] Optionally, the sealing coefficient can be obtained experimentally. For example, during the experiment of the display panel 10, after simulating the fabrication of a specific light-emitting device 200 and a portion of the first encapsulation structure 400 above the specific light-emitting device 200, when the corresponding virtual light-emitting units 220 and virtual first electrodes 230 are fabricated using the same method as the fabrication of light-emitting units 220 and first electrodes 230 of other light-emitting devices 200 besides the specific light-emitting device 200, under the condition that these films can block the connecting opening 400b of the portion of the first encapsulation structure 400 above the specific light-emitting device 200 and the film corresponding to the first electrode 230 is not disconnected at the connecting opening 400b, the maximum value that the minimum dimension of the connecting opening 400b above the specific light-emitting device 200 in the thickness direction of the display panel 10 can be set to can be a first reference value, and the sum of the thicknesses of the virtual light-emitting units 220 and the virtual first electrodes 230 can be a second reference value. The sealing coefficient can refer to the ratio of the first reference value to the second reference value.

[0251] The maximum value that can be set for the minimum dimension of the connecting opening 400b above the specific light-emitting device 200 in the thickness direction of the display panel 10 can refer to the maximum value among the minimum dimensions of the connecting opening 400b above the specific light-emitting device 200 in the thickness direction of the display panel 10 obtained through multiple experiments.

[0252] For example, to ensure that the minimum size of the connecting opening 400b in the thickness direction of the display panel 10 differs in each experiment, at least one relevant parameter can be adjusted according to product design needs (e.g., other parameters can be kept constant while only one parameter is adjusted, such as adjusting only the film thickness of the first encapsulation structure 400). Specifically, to achieve the goal that "the minimum size of the connecting opening 400b in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of at least a portion of the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200 and the sealing coefficient", the corresponding parameter used in the experiment that obtained the "maximum value that the minimum size of the connecting opening 400b in the thickness direction of the display panel 10 can be set" can be used as a reference, and one or more parameters that can reduce the "minimum size of the connecting opening 400b in the thickness direction of the display panel 10" can be adjusted, such as increasing the film thickness of the first encapsulation structure.

[0253] In these optional embodiments, by setting the minimum size of the connecting opening 400b in the thickness direction of the display panel 10 to be less than or equal to the product of the sum of the thicknesses of at least a portion of the light-emitting units 220 and the first electrode 230 of the light-emitting device 200 and the sealing coefficient, the size of the connecting opening 400b can be more precisely controlled, so that the size of the connecting opening 400b is not set too large. This allows the material of the light-emitting units 220 and the first electrode 230 of the later-prepared light-emitting device 200 to better seal the connecting opening 400b of the first encapsulation structure 400 above the previously prepared light-emitting device 200 when different light-emitting devices 200 are prepared separately during the fabrication process of the display panel 10.

[0254] Optionally, the sealing coefficient can be 1. Optionally, the minimum dimension of the connecting opening 400b in the thickness direction of the display panel 10 can be less than or equal to the sum of the thicknesses of at least a portion of the light-emitting unit 220 of the light-emitting device 200 and the first electrode 230.

[0255] In some optional embodiments, during the fabrication of the display panel 10, the fabrication step of the first light-emitting device 200a may precede the fabrication step of the third light-emitting device 200c. For example, during the fabrication of the display panel 10, the first light-emitting device 200a and the first encapsulation unit 401 may be fabricated first, and then the third light-emitting device 200c and the third encapsulation unit 403 may be fabricated. Specifically, the second electrode 210 of the first light-emitting device 200a and the third light-emitting device 200c may be fabricated simultaneously first, then the light-emitting unit 220 and the first electrode 230 of the first light-emitting device 200a may be fabricated to complete the fabrication of the first light-emitting device 200a, then the first encapsulation unit 401 may be formed on the first light-emitting device 200a, then the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c may be fabricated to complete the fabrication of the third light-emitting device 200c, and finally the third encapsulation unit 403 may be formed on the third light-emitting device 200c.

[0256] Optionally, in the fabrication process of the display panel 10, the fabrication step of the second light-emitting device 200b is located between the fabrication steps of the first light-emitting device 200a and the fabrication step of the third light-emitting device 200c. For example, in the fabrication process of the display panel 10, the first light-emitting device 200a and the first packaging unit 401 can be fabricated first, then the second light-emitting device 200b and the second packaging unit 402 can be fabricated, and then the third light-emitting device 200c and the third packaging unit 403 can be fabricated. Specifically, the second electrodes 210 of the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c can be prepared simultaneously first. Then, the light-emitting unit 220 and the first electrode 230 of the first light-emitting device 200a can be prepared to complete the preparation of the first light-emitting device 200a. Next, a first encapsulation unit 401 is prepared on the first light-emitting device 200a. Then, the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b are prepared to complete the preparation of the second light-emitting device 200b. Next, a second encapsulation unit 402 is prepared on the second light-emitting device 200b. Then, the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c are prepared to complete the preparation of the third light-emitting device 200c. Finally, a third encapsulation unit 403 is prepared on the third light-emitting device 200c.

[0257] In some embodiments of this application, the sealing coefficient varies with the shape and structure of the corresponding connecting opening 400b and the film material and thickness of the light-emitting unit 220 and the first electrode 230 of the corresponding different color light-emitting device 200.

[0258] In some optional embodiments, the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 of the second light-emitting device 200b and the first electrode 230 and the corresponding sealing coefficient; and / or, the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 of the third light-emitting device 200c and the first electrode 230 and the corresponding sealing coefficient.

[0259] Optionally, the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 of the second light-emitting device 200b and the first electrode 230 and the corresponding sealing coefficient. This can mean that the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 of the second light-emitting device 200b and the first electrode 230 and the first sealing coefficient.

[0260] Optionally, the first sealing coefficient can be obtained experimentally. For example, during the experiment of the display panel 10, after simulating the fabrication of the first light-emitting device 200a within the first opening 310aa and the first encapsulation unit 401 above the first light-emitting device 200a, when the corresponding virtual light-emitting unit 220 and virtual first electrode 230 film layers are fabricated using the same method as the fabrication of the light-emitting unit 220 and first electrode 230 of the second light-emitting device 200b, under the condition that these film layers can block the connecting opening 400b of the first encapsulation unit 401 and the film layer corresponding to the first electrode 230 is not disconnected at the connecting opening 400b of the first encapsulation unit 401, the maximum value that the minimum dimension of the connecting opening 400b of the first encapsulation unit 401 in the thickness direction of the display panel 10 can be set to can be the third reference value, and the sum of the thicknesses of the first electrodes 230 of the second light-emitting device 200b can be the fourth reference value. The first sealing coefficient can refer to the ratio of the third reference value to the fourth reference value.

[0261] The maximum value that can be set for the minimum dimension of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10 can refer to the maximum value among the minimum dimensions of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10 obtained through multiple experiments.

[0262] Optionally, the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 of the third light-emitting device 200c and the first electrode 230 and the corresponding sealing coefficient. This can refer to the minimum dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 being less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 of the third light-emitting device 200c and the first electrode 230 and the second sealing coefficient.

[0263] Optionally, the second sealing coefficient can be obtained experimentally. For example, during the experiment of the display panel 10, after simulating the fabrication of the first light-emitting device 200a within the first opening 310aa and the first encapsulation unit 401 above the first light-emitting device 200a, when the corresponding virtual light-emitting unit 220 and virtual first electrode 230 films are fabricated using the same method as the fabrication of the light-emitting unit 220 and first electrode 230 of the third light-emitting device 200c, under the condition that these films can block the connecting opening 400b of the first encapsulation unit 401 and the film corresponding to the first electrode 230 is not disconnected at the connecting opening 400b of the first encapsulation unit 401, the maximum value that the minimum dimension of the connecting opening 400b of the first encapsulation unit 401 in the thickness direction of the display panel 10 can be set to can be the fifth reference value, and the sum of the thicknesses of the first electrode 230 of the third light-emitting device 200c can be the sixth reference value. The second sealing coefficient can refer to the ratio of the fifth reference value to the sixth reference value.

[0264] The maximum value that can be set for the minimum dimension of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10 can refer to the maximum value among the minimum dimensions of the communication opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10 obtained through multiple experiments.

[0265] In these optional embodiments, by setting the minimum size of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 based on the thicknesses of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b and the third light-emitting device 200c, the size of the connecting opening 400b within the first opening 310aa can be more precisely controlled. This allows the material of the light-emitting unit 220 and the first electrode 230 of the second light-emitting device 200b, which are manufactured later, to better seal the first light-emitting device 200a during the fabrication of the second light-emitting device 200b and the second encapsulation unit 402. The material of the light-emitting unit 220 of the second light-emitting device and the first electrode 230 of the upper first packaging unit 401 can be well continuous at the connecting opening 400b of the first packaging unit 401 above the first light-emitting device 200a. This allows the material of the light-emitting unit 220 of the second light-emitting device 200b and the first electrode 230 to better cover and protect the lower first packaging unit 401 when the material of the second packaging unit 402 is patterned. This makes it difficult for etching material to enter the gap space 400a of the first packaging unit 401 through the connecting opening 400b, thereby improving the structural stability of the display panel 10.

[0266] Furthermore, this also allows the materials of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c, which are fabricated later, to effectively block the connecting opening 400b of the first packaging unit 401 above the first light-emitting device 200a during the fabrication of the third light-emitting device 200c and the third packaging unit 403. In other words, the materials of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device can be well continuous at the connecting opening 400b of the first packaging unit 401 above the first light-emitting device 200a. This allows the materials of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c to effectively cover and protect the first packaging unit 401 below during the patterning process of the material of the third packaging unit 403. This makes it difficult for etching material to enter the gap space 400a of the first packaging unit 401 through the connecting opening 400b, thereby improving the structural stability of the display panel 10.

[0267] Optionally, the first sealing coefficient may be 1, and / or the second sealing coefficient may be 1. Optionally, the dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the thickness of the light-emitting unit 220 of the second light-emitting device 200b; and / or, the dimension of the connecting opening 400b within the first opening 310aa in the thickness direction of the display panel 10 is less than or equal to the thickness of the light-emitting unit 220 of the third light-emitting device 200c.

[0268] In some alternative embodiments, the minimum dimension of the connecting opening 400b within the second opening 310ab in the thickness direction of the display panel 10 is less than or equal to the product of the sum of the thicknesses of the light-emitting unit 220 of the third light-emitting device 200c and the first electrode 230 and the fourth sealing coefficient.

[0269] Optionally, the fourth sealing factor can be obtained experimentally. For example, during the experiment of the display panel 10, after simulating the fabrication of the second light-emitting device 200b within the second opening 310ab and the second encapsulation unit 402 above the second light-emitting device 200b, when the corresponding virtual light-emitting unit 220 and virtual first electrode 230 films are fabricated using the same method as the fabrication of the light-emitting unit 220 and first electrode 230 of the third light-emitting device 200c, under the condition that these films can seal the connecting opening 400b of the second encapsulation unit 402 without breaking at the connecting opening 400b of the second encapsulation unit 402, the maximum value that the minimum dimension of the connecting opening 400b of the second encapsulation unit 402 in the thickness direction of the display panel 10 can be set to can be the seventh reference value, and the sum of the thicknesses of the first electrode 230 of the third light-emitting device 200c can be the eighth reference value. The fourth sealing factor can refer to the ratio of the seventh reference value to the eighth reference value.

[0270] The maximum value that can be set for the minimum dimension of the communication opening 400b of the second packaging unit 402 in the thickness direction of the display panel 10 can refer to the maximum value among the minimum dimensions of the communication opening 400b of multiple second packaging units 402 that meet the requirements in the thickness direction of the display panel 10, obtained through multiple experiments.

[0271] In these optional embodiments, by setting the minimum size of the connecting opening 400b within the second opening 310ab in the thickness direction of the display panel 10 based on the thickness of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c, the size of the connecting opening 400b within the second opening 310ab can be more precisely controlled. This allows the material of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c, which are fabricated later, to effectively seal the connection between the second packaging unit 402 above the second light-emitting device 200b during the fabrication of the third light-emitting device 200c and the third packaging unit 403. The material of the light-emitting unit 220 of the third light-emitting device and the first electrode 230 at the opening 400b, i.e. the opening of the second packaging unit 402 above the second light-emitting device 200b, can be well continuous. This allows the material of the light-emitting unit 220 and the first electrode 230 of the third light-emitting device 200c to better cover and protect the second packaging unit 402 below when the material of the third packaging unit 403 is patterned. This makes it difficult for the etching material to enter the gap space 400a of the second packaging unit 402 through the opening 400b, thereby improving the structural stability of the display panel 10.

[0272] Optionally, the fourth sealing coefficient can be 1. Optionally, the dimension of the connecting opening 400b within the second opening 310ab in the thickness direction of the display panel 10 is less than or equal to the thickness of the light-emitting unit 220 of the third light-emitting device 200c.

[0273] In some embodiments of this application, since it is unnecessary to continue fabricating the light-emitting device 200 and the first packaging structure 400 after the fabrication of the third light-emitting device 200c and the third packaging unit 403 is completed, the minimum size of the connecting opening 400b in the third packaging unit 403 in the thickness direction of the display panel 10 is not particularly limited. For example, the connecting opening 400b in the third packaging unit 403 may have a larger size in the thickness direction of the display panel 10 to facilitate the fabrication of the third packaging unit 403.

[0274] In some optional embodiments, the size of the connecting opening 400b in the first opening 310aa in the thickness direction of the display panel 10 is smaller than the size of the connecting opening 400b in the third opening 310ac in the thickness direction of the display panel 10, so that the connecting opening 400b in the first opening 310aa can have a smaller size to facilitate the sealing of the light-emitting unit 220 of the second light-emitting device 200b and the third light-emitting device 200c with the first electrode 230.

[0275] Optionally, the dimension of the connecting opening 400b in the second opening 310ab in the thickness direction of the display panel 10 is less than or equal to the dimension of the connecting opening 400b in the third opening 310ac in the thickness direction of the display panel 10, so that the connecting opening 400b in the second opening 310ab can have a smaller size so as to facilitate the sealing of the light-emitting unit 220 of the third light-emitting device 200c with the first electrode 230.

[0276] Optionally, the dimension of the connecting opening 400b in the second opening 310ab in the thickness direction of the display panel 10 is greater than or equal to the dimension of the connecting opening 400b in the first opening 310aa in the thickness direction of the display panel 10, so that the connecting opening 400b in the first opening 310aa can be smaller, so that the light-emitting unit 220 of the second light-emitting device 200b and the third light-emitting device 200c and the first electrode 230 can block the connecting opening 400b in the first opening 310aa.

[0277] There are various methods for adjusting the size of the connecting opening 400b in the thickness direction of the display panel 10, namely, there are various methods for adjusting the spacing between the side surface of the first portion 410 away from the substrate 100 and the side surface of the third portion 421b away from the isolation structure 310.

[0278] Optionally, the size of the connecting opening 400b in the thickness direction of the display panel 10 can be adjusted by referring to the methods in any of the foregoing embodiments. For example, the size of the connecting opening 400b in the thickness direction of the display panel 10 can be adjusted by adjusting the thickness of the first encapsulation structure 400 in the foregoing embodiments. For example, the size of the connecting opening 400b in the thickness direction of the display panel 10 can be adjusted by adjusting the morphology of the isolation structure 310 in the foregoing embodiments.

[0279] Figure 18 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0280] like Figure 18 As shown, in some optional embodiments, the maximum thickness of the first packaging unit 401 is greater than the maximum thickness of the third packaging unit 403.

[0281] Optionally, the thickness of the first portion 410 in the first packaging unit 401 may represent the maximum thickness of the first packaging unit 401. Specifically, the thickness of the first main body portion 411a in the first packaging unit 401 may represent the maximum thickness of the first packaging unit 401.

[0282] Optionally, the thickness of the first portion 410 in the third packaging unit 403 may represent the maximum thickness of the third packaging unit 403. Specifically, the thickness of the first main body portion 411a in the third packaging unit 403 may represent the maximum thickness of the third packaging unit 403.

[0283] In these optional embodiments, by setting the maximum thickness of the first packaging unit 401 to be greater than the maximum thickness of the third packaging unit 403, the first packaging unit 401 is less susceptible to damage during subsequent etching processes in the fabrication of the display panel 10. For example, the first packaging unit 401 is less likely to be etched and damaged by etching materials during the etching processes of the second light-emitting device 200b, the second packaging unit 402, the third light-emitting device 200c, and the third packaging unit 403, thereby improving the packaging stability of the first packaging unit 401. Simultaneously, the first portion 410 of the first packaging unit 401 can be positioned closer to the third portion 421b of the first packaging unit 401, resulting in a smaller size of the connecting opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10. This facilitates the sealing of the connecting opening 400b of the first packaging unit 401 by the light-emitting units 220 of the second and third light-emitting devices 200b and the first electrode 230.

[0284] In some alternative embodiments, the maximum thickness of the second packaging unit 402 is greater than or equal to the maximum thickness of the third packaging unit 403.

[0285] Optionally, the maximum thickness of the second packaging unit 402 is less than or equal to the maximum thickness of the first packaging unit 401.

[0286] Optionally, the thickness of the first portion 410 in the second packaging unit 402 may represent the maximum thickness of the second packaging unit 402. Specifically, the thickness of the first main body portion 411a in the second packaging unit 402 may represent the maximum thickness of the second packaging unit 402.

[0287] In these optional embodiments, by setting the maximum thickness of the second packaging unit 402 to be greater than the maximum thickness of the third packaging unit 403, the second packaging unit 402 is less susceptible to damage during subsequent etching processes in the fabrication of the display panel 10. For example, it makes the second packaging unit 402 less likely to be etched and damaged by the etching material during the etching process of the third light-emitting device 200c and the third packaging unit 403, thereby improving the packaging stability of the second packaging unit 402. Simultaneously, it also allows the first portion 410 of the second packaging unit 402 to be closer to the third portion 421b of the second packaging unit 402, resulting in a smaller size of the connecting opening 400b of the second packaging unit 402 in the thickness direction of the display panel 10. This facilitates the sealing of the connecting opening 400b of the second packaging unit 402 by the light-emitting unit 220 of the third light-emitting device 200c and the first electrode 230.

[0288] In some alternative embodiments, a first gap is formed between the surface of the eaves 312a facing the substrate 100 and the surface of the pixel defining portion 321 facing away from the substrate 100, and the ratio of the maximum thickness of at least a portion of the first main body portion 411a of the first packaging unit 401 to the first gap is not less than 1; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion 411b of the first packaging unit 401 to the first gap is not less than 1.

[0289] Optionally, the eaves 312a includes a first eaves 312aa corresponding to the first opening 310aa, a second eaves 312ab corresponding to the second opening 310ab, and a third eaves 312ac corresponding to the third opening 310ac. The first spacing may refer to the spacing between the surface of the first eaves 312aa facing the substrate 100 and the surface of the pixel limiting portion 321 away from the substrate 100. The ratio of the maximum thickness of the first main body portion 411a of the first packaging unit 401 to the first spacing corresponding to the first eaves 312aa is not less than 1, and / or the ratio of the maximum thickness of the second main body portion 411b of the first packaging unit 401 to the first spacing corresponding to the first eaves 312aa is not less than 1.

[0290] In these optional embodiments, by reasonably setting the ratio of the maximum thickness of the first main body portion 411a of the first encapsulation unit 401 to the first spacing, and reasonably setting the ratio of the maximum thickness of the second main body portion 411b of the first encapsulation unit 401 to the first spacing, the thickness of at least a portion of the first main body portion 411a and at least a portion of the second main body portion 411b in the first encapsulation unit 401 can be adjusted according to the shielding ability of the eaves 312a on the first encapsulation structure 400, so as to reduce the size of the connecting opening 400b of the first encapsulation unit 401 in the thickness direction of the display panel 10, thereby facilitating the sealing of the connecting opening 400b of the first encapsulation unit 401 by the light-emitting unit 220 of the second light-emitting device 200b and the first electrode 230 of the third light-emitting device 200c.

[0291] Specifically, when the first pitch is large, the eaves 312a will be closer to the fabrication equipment of the first packaging structure 400 during the fabrication process of the first packaging structure 400, so that the eaves 312a has a greater impact on the material shielding of the first packaging structure 400, that is, the eaves 312a can have a better shielding ability. Therefore, according to the large first pitch, the first main body portion 411a and at least part of the second main body portion 411b of the first packaging unit 401 can be set to have a large thickness, so that the first portion 410 and the third portion 421b of the first packaging unit 401 can be closer, so as to reduce the size of the connecting opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10.

[0292] When the first pitch is small, the eaves 312a will be relatively far away from the fabrication equipment of the first packaging structure 400 during the fabrication process of the first packaging structure 400. This results in the eaves 312a having a smaller impact on the material shielding of the first packaging structure 400, meaning the eaves 312a has poor shielding ability on the first packaging structure 400. Therefore, based on the small first pitch, at least a portion of the first main body portion 411a and at least a portion of the second main body portion 411b of the first packaging unit 401 can be set to have a reasonable thickness. This allows the first portion 410 and the third portion 421b of the first packaging unit 401 to be relatively close while also preventing an excessive increase in the thickness of the display panel 10.

[0293] Figure 19 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0294] like Figure 19 As shown, in some optional embodiments, the distance between at least a portion of the second isolation portion 312 that participates in enclosing and forming the first opening 310aa and the substrate 100 is smaller than the distance between the second isolation portion 312 that participates in enclosing and forming the third opening 310ac and the substrate 100.

[0295] Optionally, the distance between the second isolation portion 312 and the substrate 100 may refer to the distance between the surface of the second isolation portion 312 facing the substrate 100 and the substrate 100.

[0296] Optionally, the distance between the first eaves 312aa and the substrate 100 is smaller than the distance between the third eaves 312ac and the substrate 100.

[0297] In these optional embodiments, by setting the distance between at least a portion of the second isolation portion 312 participating in enclosing and forming the first opening 310aa and the substrate 100 to be smaller than the distance between the second isolation portion 312 participating in enclosing and forming the third opening 310ac and the substrate 100, the third protrusion 312ac can be closer to the fabrication equipment of the first packaging structure 400 than the first protrusion 312aa during the fabrication process of the first packaging structure 400. This makes the material obstruction effect of the first protrusion 312aa on the first packaging structure 400 smaller, which can facilitate the reduction of the size of the connecting opening 400b of the first packaging unit 401 in the thickness direction of the display panel 10. This makes it easier for the light-emitting units 220 of the second light-emitting device 200b and the third light-emitting device 200c and the first electrode 230 to block the connecting opening 400b of the first packaging unit 401.

[0298] There are various ways to adjust the distance between the second isolation portion 312 and the substrate 100. For example, the distance between the second isolation portion 312 and the substrate 100 can be adjusted by adjusting the size of the first isolation portion 311 in the thickness direction.

[0299] Optionally, the dimension of at least a portion of the first isolation portion 311 participating in enclosing and forming the first opening 310aa in the thickness direction of the display panel 10 is smaller than the dimension of the first isolation portion 311 participating in enclosing and forming the second opening 310ab in the thickness direction of the display panel 10, so as to achieve a spacing between at least a portion of the second isolation portion 312 participating in enclosing and forming the first opening 310aa and the substrate 100 that is smaller than the spacing between the second isolation portion 312 participating in enclosing and forming the third opening 310ac and the substrate 100.

[0300] In some alternative embodiments, the distance between at least a portion of the second isolation portion 312 participating in enclosing the second opening 310ab and the substrate 100 is greater than or equal to the distance between the second isolation portion 312 participating in enclosing the first opening 310aa and the substrate 100; and / or, the distance between at least a portion of the second isolation portion 312 participating in enclosing the second opening 310ab and the substrate 100 is less than or equal to the distance between the second isolation portion 312 participating in enclosing the third opening 310ac and the substrate 100.

[0301] Optionally, the distance between at least a portion of the second eaves 312ab and the substrate 100 is greater than or equal to the distance between the first eaves 312aa and the substrate 100; and / or, the distance between at least a portion of the second eaves 312ab and the substrate 100 is less than or equal to the distance between the third eaves 312ac and the substrate 100.

[0302] Optionally, the dimension of at least a portion of the first isolation portion 311 participating in enclosing and forming the second opening 310ab in the thickness direction of the display panel 10 is greater than or equal to the dimension of the first isolation portion 311 participating in enclosing and forming the first opening 310aa in the thickness direction of the display panel 10, so as to achieve a distance between at least a portion of the second isolation portion 312 participating in enclosing and forming the second opening 310ab and the substrate 100 that is greater than or equal to the distance between the second isolation portion 312 participating in enclosing and forming the first opening 310aa and the substrate 100; and / or, the dimension of at least a portion of the first isolation portion 311 participating in enclosing and forming the second opening 310ab in the thickness direction of the display panel 10 is less than or equal to the dimension of the first isolation portion 311 participating in enclosing and forming the third opening 310ac in the thickness direction of the display panel 10, so as to achieve a distance between at least a portion of the second isolation portion 312 participating in enclosing and forming the second opening 310ab and the substrate 100 that is less than or equal to the distance between the second isolation portion 312 participating in enclosing and forming the third opening 310ac and the substrate 100.

[0303] In these optional embodiments, by setting the distance between at least a portion of the second isolation portion 312 participating in enclosing and forming the second opening 310ab and the substrate 100 to be smaller than the distance between the second isolation portion 312 participating in enclosing and forming the third opening 310ac and the substrate 100, the third protrusion 312ac can be closer to the fabrication equipment of the first packaging structure 400 than the second protrusion 312ab during the fabrication process of the first packaging structure 400. This makes the material obstruction effect of the second protrusion 312ab on the first packaging structure 400 smaller, which facilitates the reduction of the size of the connecting opening 400b of the second packaging unit 402 in the thickness direction of the display panel 10. This facilitates the sealing of the connecting opening 400b of the second packaging unit 402 by the light-emitting unit 220 of the third light-emitting device 200c and the first electrode 230.

[0304] Figure 20 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0305] like Figure 20As shown, in some optional embodiments, the protruding length of the first eaves 312aa is less than the protruding length of the third eaves 312ac, that is, the protruding length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the first opening 310aa is less than the protruding length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the third opening 310ac.

[0306] Optionally, the protruding length of the first eaves 312aa can refer to the minimum distance between the orthographic projection of the edge of the first eaves 312aa facing the first opening 310aa onto the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the first eaves 312aa onto the substrate 100. Optionally, Figure 20 The length of a1 can represent the protruding length of the first convex part 312aa.

[0307] Optionally, the protruding length of the third eaves 312ac can refer to the minimum distance between the orthographic projection of the edge of the third eaves 312ac facing the third opening 310ac on the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the third eaves 312ac on the substrate 100. Optionally, Figure 20 The length of a3 can represent the protruding length of the third convex part 312ac.

[0308] In these alternative embodiments, the smaller obstruction provided by the first bulge 312aa with its shorter protrusion length facilitates a reduction in the size of the communication opening 400b of the first encapsulation unit 401 in the thickness direction of the display panel 10. This facilitates the sealing of the communication opening 400b of the first encapsulation unit 401 by the light-emitting units 220 of the second light-emitting device 200b and the first electrode 230 of the third light-emitting device 200c.

[0309] In some alternative embodiments, the protruding length of the second eaves 312ab is less than or equal to the protruding length of the third eaves 312ac; and / or, the protruding length of the second eaves 312ab is greater than or equal to the protruding length of the first eaves 312aa.

[0310] That is, the protrusion length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the second opening 310ab is less than or equal to the protrusion length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the third opening 310ac, and / or, the protrusion length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the second opening 310ab is greater than or equal to the protrusion length of the second isolation portion 312 relative to the first isolation portion 311 on the side facing the first opening 310aa.

[0311] Optionally, the protruding length of the second eaves 312ab can refer to the minimum distance between the orthographic projection of the edge of the second eaves 312ab facing the second opening 310ab onto the substrate 100 and the orthographic projection of the surface of the first isolation portion 311 facing the second eaves 312ab onto the substrate 100. Optionally, Figure 20 The length of a2 can represent the protruding length of the second convex part 312ab.

[0312] In these alternative embodiments, the smaller obstruction provided by the second bulge 312ab with its shorter protrusion length facilitates a reduction in the size of the communication opening 400b of the second encapsulation unit 402 in the thickness direction of the display panel 10, thereby facilitating the sealing of the communication opening 400b of the second encapsulation unit 402 by the light-emitting unit 220 of the third light-emitting device 200c and the first electrode 230.

[0313] Figure 21 This is a partial structural diagram of an isolation structure 310 provided in an embodiment of this application. Figure 22 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0314] Please see Figures 1 to 22 An embodiment of the first aspect of this application also provides a display panel 10, comprising: a substrate 100; an isolation structure 310 disposed on one side of the substrate 100 and enclosing an isolation opening 310a; a light-emitting device 200 at least partially located within the isolation opening 310a; and a first encapsulation structure 400 disposed on the side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 includes a first portion 410 and a second segment 421. The first portion 410 is located within the isolation opening 310a and disposed on the side of the light-emitting device 200 facing away from the substrate 100. The second segment 421 is located on the side of the isolation structure 310 facing the isolation opening 310a. The surface of the first portion 410 facing away from the substrate 100 and the surface of the second segment 421 facing away from the isolation structure 310 are at least partially interconnected to enclose a gap space 400a.

[0315] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and forms an isolation opening 310a. The light-emitting device 200 is at least partially located within the isolation opening 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10.

[0316] The first encapsulation structure 400 is disposed on the side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 includes a first portion 410 and a second segment 421. The first portion 410 is located within the isolation opening 310a and disposed on the side of the light-emitting device 200 facing away from the substrate 100. The second segment 421 is located on the side of the isolation structure 310 facing the isolation opening 310a. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. By setting the surface of the first portion 410 facing away from the substrate 100 and the surface of the second segment 421 facing away from the isolation structure 310 to at least partially connect to form a gap space 400a, the first portion 410 can provide better support for the second segment 421, making it less likely for the second segment 421 to detach from the isolation structure 310. This can improve the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0317] Optionally, the display panel 10 provided in the first aspect of this application may be the display panel 10 in any of the foregoing embodiments. Therefore, the display panel 10 provided in the embodiments of this application may have the beneficial effects of the display panel 10 in any of the foregoing embodiments. This application will not elaborate further on it.

[0318] In some embodiments of this application, the shape of the isolation structure 310 can be varied. The shape of the isolation structure 310 can be any shape of material that can block and isolate the light-emitting device 200, so as to facilitate the fabrication of the light-emitting device 200.

[0319] In some optional embodiments, the isolation structure 310 includes a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 facing away from the substrate 100. The second isolation portion 312 protrudes from the first isolation portion 311 toward the isolation opening 310a. By providing the second isolation portion 312 protruding from the first isolation portion 311 toward the isolation opening 310a, the material of the light-emitting device 200 of the display panel 10 can be directly vapor-deposited over the entire surface during fabrication. The second isolation portion 312 can block at least a portion of the material used to fabricate the light-emitting device 200, thereby isolating the material of the light-emitting device 200 between adjacent sub-pixels. This facilitates the formation of multiple spaced light-emitting devices 200 located within the isolation opening 310a. Consequently, a high-precision photomask is not required during the fabrication of the light-emitting device 200 of the display panel 10. For example, a high-precision metal photomask is not required during the vapor deposition of the material of the light-emitting device 200, thereby significantly reducing the manufacturing cost of the display panel 10.

[0320] Optional, such as Figure 21As shown, the isolation structure 310 can be in the form of a grid to facilitate the division of sub-pixels in the display panel 10. The hollowed-out areas in the grid-like isolation structure 310 can be isolation openings 310a.

[0321] In some optional embodiments, the material of the isolation structure 310 may include a conductive material, and the first electrode 230 may be connected to the isolation structure 310, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the isolation structure 310, that is, the first electrodes 230 of adjacent sub-pixels can be electrically connected to each other through the isolation structure 310 to form a surface electrode, thereby facilitating the control of the first electrodes 230 in the display panel 10. Optionally, the material of the first isolation portion 311 may include a conductive material, and the first electrode 230 may be connected to the first isolation portion 311, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the first isolation portion 311.

[0322] Figure 23 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0323] like Figure 23 As shown, in some optional embodiments, the isolation structure 310 further includes a third isolation portion 313 disposed on the side of the first isolation portion 311 facing the substrate 100, the third isolation portion 313 protruding from the first isolation portion 311 toward the isolation opening 310a. The material of the third isolation portion 313 may include a conductive material, and the first electrode 230 may be connected to the third isolation portion 313, so that the first electrodes 230 of adjacent sub-pixels can be electrically connected through the third isolation portion 313. By providing the third isolation portion 313 to protrude from the first isolation portion 311 toward the isolation opening 310a, the third isolation portion 313 can have a larger size to facilitate connection with the first electrode 230.

[0324] Optionally, the display panel 10 may further include a pixel definition layer 320 disposed on the side of the substrate 100 facing the second electrode 210. The pixel definition layer 320 may include a pixel defining portion 321 and a pixel opening 320a formed by the pixel defining portion 321. The orthographic projection of the pixel opening 320a on the substrate 100 may be located within the orthographic projection of the isolation opening 310a on the substrate 100. The orthographic projection of the pixel opening 320a on the substrate 100 may refer to the orthographic projection area formed by the orthographic projection of the inner wall surrounding the pixel opening 320a on the substrate 100. Similarly, the orthographic projection of the isolation opening 310a on the substrate 100 may refer to the orthographic projection area formed by the orthographic projection of the inner wall surrounding the isolation opening 310a on the substrate 100.

[0325] Optionally, the pixel limiting portion 321 can be disposed between adjacent second electrodes 210. The adjacent second electrodes 210 can be insulated from each other by the pixel limiting portion 321, and the placement of the pixel limiting portion 321 also facilitates the division of sub-pixels in the display panel 10. Optionally, the pixel limiting portion 321 can also be located between the second electrode 210 and the isolation structure 310. The isolation structure 310 and the second electrode 210 can also be insulated from each other by the pixel limiting portion 321, making it less likely for the first electrode 230 and the second electrode 210 to short-circuit through the isolation structure 310, thereby improving the operational reliability of the display panel 10.

[0326] In this optional embodiment, the relative position between the isolation structure 310 and the pixel defining portion 321 can be configured in various ways. Optionally, such as... Figure 22 As shown, the isolation structure 310 can be disposed on the side of the pixel limiting portion 321 facing away from the substrate 100, or the pixel limiting portion 321 can have a receiving groove, with at least a portion of the isolation structure 310 located within the receiving groove. This makes the isolation structure 310 less likely to have a large height relative to the substrate 100, thereby effectively reducing the thickness of the display panel 10. For ease of description, the following embodiments will be described using the example of the isolation structure 310 being disposed on the side of the pixel limiting portion 321 facing away from the substrate 100.

[0327] In some embodiments of this application, the material of the first encapsulation structure 400 may include inorganic materials, thereby giving the first encapsulation structure 400 better encapsulation capabilities to reduce the impact of moisture on the light-emitting device 200. Optionally, the first encapsulation structure 400 may be fabricated using a chemical vapor deposition process.

[0328] like Figure 22 As shown, in some optional embodiments, the first segment 410 may include a main body 411 and a support 412 that protrudes from the main body 411 toward the second segment 421. The support 412 and the second segment 421 are interconnected so that the first segment 410 and the second segment 421 can participate in enclosing and forming a gap space 400a.

[0329] Optionally, one end of the main body 411 facing the isolation structure 310 is connected to the other end of the second segment 421 facing the substrate 100, so that the gap space 400a can be formed by the main body 411, the support 412 and the second segment 421, and there are two connection points between the first segment 410 and the second segment 421, which can improve the structural stability of the first packaging structure 400 and make it less likely to detach from the isolation structure 310, thereby improving the packaging effect of the first packaging structure 400 on the display panel 10.

[0330] Optionally, the main body 411 may include a first main body portion 411a and a second main body portion 411b connected to each other. The orthographic projection of the first main body portion 411a on the substrate 100 may be located within the orthographic projection of the pixel opening 320a on the substrate 100, and the orthographic projection of the second main body portion 411b on the substrate 100 may be located within the orthographic projection of the pixel limiting portion 321 on the substrate 100. One end of the main body portion 411 facing the isolation structure 310 is connected to the other end of the second segment 421 facing the substrate 100. This can mean that one end of the second main body portion 411b facing the isolation structure 310 is connected to the other end of the second segment 421 facing the substrate 100. The gap space 400a may be formed by the second main body portion 411b, the support portion 412, and the second segment 421.

[0331] Optionally, the orthographic projection of the support portion 412 on the substrate 100 may at least partially overlap with the orthographic projection of the pixel limiting portion 321 on the substrate 100, that is, at least part of the support portion 412 may be located on the side of the pixel limiting portion 321 away from the substrate 100, so that the pixel limiting portion 321 can raise the position of the support portion 412 to facilitate the connection between the support portion 412 and the second segment 421.

[0332] In some optional embodiments, the second segment 421 may include a third segment 421b disposed on the side of the second isolation portion 312 facing the isolation opening 310a. The support portion 412 and the third segment 421b are interconnected to enclose and form a gap space 400a. Optionally, at least a portion of the gap space 400a is located between the second isolation portion 312 and the substrate 100. Since the second isolation portion 312 protrudes from the first isolation portion 311 facing the isolation opening 310a, the third segment 421b disposed on the side of the second isolation portion 312 facing the isolation opening 310a can be easily connected to the support portion 412, that is, the support portion 412 can easily support the second segment 421, so that the second segment 421 is not easily detached from the isolation structure 310.

[0333] Optionally, the second segment 421 further includes a second segment 421a disposed on the side of the first isolation portion 311 facing the isolation opening 310a, a third segment 421b disposed at a distance from the main body portion 411, and a second segment 421a disposed at a distance from the support portion 412. The third segment 421b, the second segment 421a, the support portion 412 and the main body portion 411 enclose a gap space 400a.

[0334] Optionally, one end of the second portion 421a facing away from the substrate 100 may be connected to the third portion 421b. Specifically, this could mean that one end of the second portion 421a facing away from the substrate 100 may be integrally connected to the third portion 421b covering the surface of the second isolation portion 312 facing the substrate 100. Optionally, one end of the second portion 421a facing the substrate 100 may be interconnected with one end of the main body portion 411 facing the isolation structure 310. For example, one end of the second portion 421a facing the substrate 100 may be interconnected with one end of the second main body portion 411b facing the isolation structure 310. Optionally, the gap space 400a may be formed by the third portion 421b, the second portion 421a, the second main body portion 411b, and the support portion 412.

[0335] Figure 24 This is a schematic diagram of the structure of a first segment 610 provided in an embodiment of this application.

[0336] like Figures 22 to 24 As shown, in some optional embodiments, the support portion 412 is annular in shape when projected onto the substrate 100, and the support portion 412 is connected to the second segment 421 so that the first segment 410 and the second segment 421 enclose a closed gap space 400a.

[0337] Optionally, the orthographic projection of the support portion 412 onto the substrate 100 is annular, meaning that the orthographic projection of the support portion 412 onto the substrate 100 is a closed annular shape, in order to form a sealed gap space 400a. The sealed gap space 400a formed by the first segment 410 and the second segment 421 may not be connected to other external spaces, thereby further improving the structural stability of the first segment 410 and the second segment 421.

[0338] Optionally, the orthographic projection of the support portion 412 on the substrate 100 may surround the orthographic projection of the pixel opening 320a on the substrate 100. Optionally, the orthographic projection of the second segment 421 on the substrate 100 may surround the orthographic projection of the support portion 412 on the substrate 100.

[0339] In these optional embodiments, by setting the orthographic projection shape of the support portion 412 on the substrate 100 to be annular, the support portion 412 in the isolation opening 310a and the second segment 421 on the periphery of the isolation structure 310 have a large connection area, so that the support portion 412 in the isolation opening 310a can provide good support for the second segment 421 on the periphery of the isolation structure 310, thereby improving the supporting effect of the support portion 412 on the second segment 421, making it less likely for the first segment 410 to detach from the isolation structure 310, and thus improving the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0340] Figure 25 This is a schematic diagram of the structure of a first segment 610 provided in another embodiment of this application. Figure 26 This is a schematic diagram of the structure of a first segment 610 provided in another embodiment of this application. Figure 27 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0341] like Figures 25 to 27 As shown, in some alternative embodiments, the orthographic projection shape of the support portion 412 on the substrate 100 may not be annular. For example, there may be multiple support portions 412, which may be spaced apart around the pixel opening 320a.

[0342] Optionally, the surface of the first segment 410 facing away from the substrate 100 and the surface of the second segment 421 facing away from the isolation structure 310 are spaced apart to form a connecting opening 400b located on the side of the gap space 400a facing away from the substrate 100. Optionally, the connecting opening 400b may be located between adjacent support portions 412.

[0343] Figure 28 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0344] like Figure 28 As shown, in some optional embodiments, the gap space 400a may be filled with a support structure P, which can provide good support for the second segment 421. Specifically, the support structure P can provide good support for the third segment 421b, making it less likely for the second segment 421 to detach from the isolation structure 310, thereby improving the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0345] Optionally, during the fabrication of the display panel 10, the material of the support structure P can be filled into the gap space 400a through the connecting opening 400b.

[0346] Optionally, the material of the support structure P may include an organic material, which allows the material of the support structure P to have good fluidity, so that the support structure P can fill the gap space 400a through the connecting opening 400b.

[0347] Figure 29 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0348] like Figure 29 As shown, optionally, the display panel 10 may also include a second encapsulation layer 500 disposed on the side of the first encapsulation structure 400 away from the substrate 100, and at least a portion of the material of the second encapsulation layer 500 extends through the connecting opening 400b into the gap space 400a to form a support structure P.

[0349] In these optional embodiments, the second encapsulation layer 500 can also be used to encapsulate the light-emitting device 200 of the display panel 10. When fabricating the second encapsulation layer 500, the material of the second encapsulation layer 500 can enter the gap space 400a through the connecting opening 400b to form a support structure P. This allows a portion of the material of the second encapsulation layer 500 to also support the second segment 421, further enhancing the structural stability of the first encapsulation structure 400 at the gap space 400a. Furthermore, the provision of the second encapsulation layer 500 can further improve the encapsulation effect of the display panel 10.

[0350] Optionally, the material of the second encapsulation layer 500 includes an organic material, which allows the second encapsulation layer 500 to have good flowability, so that the material of the second encapsulation layer 500 can easily extend into the gap space 400a through the connecting opening 400b during the fabrication of the second encapsulation layer 500. Optionally, the second encapsulation layer 500 can be fabricated using inkjet printing technology.

[0351] In some alternative embodiments, such as Figure 25 and Figure 26 As shown, there are multiple connecting openings 400b, which are spaced apart. For example, multiple connecting openings 400b can be spaced apart around the pixel opening 320a. By reasonably setting the number of connecting openings 400b, the connection area between the support part 412 and the second segment 421 can be better controlled. This allows the support part 412 to provide better support for the second segment 421, thereby improving the structural stability of the first encapsulation structure 400. At the same time, it can also reduce the material obstruction effect of the support part 412 on the support structure P, so that the material of the support structure P can be more fully filled in the gap space 400a, thereby improving the encapsulation effect of the first encapsulation structure 400 and the second encapsulation layer 500 on the light-emitting device 200.

[0352] In some alternative embodiments, multiple connecting openings 400b are spaced at equal intervals.

[0353] There are several ways to set the size of the connecting opening 400b. Optional options include... Figure 25 As shown, the orthographic projection areas of each connecting opening 400b on the substrate 100 can be equal, and / or, the orthographic projection shapes of each connecting opening 400b on the substrate 100 are equal. This allows the support portion 412 to support the second segment 421 of the isolation structure 310 towards the inside of the isolation opening 310a more uniformly, thereby improving the structural stability of the first packaging structure 400. Furthermore, it also allows the material of the support structure P to fill the gap space 400a of the isolation structure 310 towards the inside of the isolation opening 310a more uniformly through the connecting openings 400b.

[0354] Optional, such as Figure 26 As shown, the connecting opening 400b includes a first type of connecting opening 400ba and a second type of connecting opening 400bb. The projected area of ​​the first type of connecting opening 400ba on the substrate 100 is larger than that of the second type of connecting opening 400bb on the substrate 100. By setting the first type of connecting opening 400ba and the second type of connecting opening 400bb with different areas, the first type of connecting opening 400ba with a larger area can facilitate the material of the support structure P to be filled more fully into the gap space 400a. It also allows the support portions 412 on both sides of the second type of connecting opening 600c with a smaller area to better support the second segment 421. Thus, the support portions 412 can provide better support for the second segment 421 to improve the structural stability of the first packaging structure 400, while also reducing the obstruction effect of the support portions 412 on the material of the support structure P, so that the material of the support structure P can be filled more fully into the gap space 400a.

[0355] Optionally, the first type of connecting opening 400ba is located between adjacent second type of connecting opening 400bb, and / or, the second type of connecting opening 400bb is located between adjacent first type of connecting opening 400ba. For example, on the inner side of the isolation structure 310 facing the isolation opening 310a, the first type of connecting opening 400ba and the second type of connecting opening 400bb can be alternately arranged to better balance the structural strength of the first encapsulation structure 400 and the ability of the first encapsulation structure 400 to facilitate the material filling of the support structure P.

[0356] In some optional embodiments, the first packaging structure 400 further includes a fourth portion 422 located on the side of the isolation structure 310 facing away from the substrate 100 and spaced apart from the isolation structure 310. The fourth portion 422 located on the side of the isolation structure 310 facing away from the substrate 100 can better improve the path of moisture (which may include etching material) intruding into the light-emitting device 200, thereby better improving the packaging effect of the first packaging structure 400 on the light-emitting device 200.

[0357] Optionally, the fourth portion 422 can be connected to one end of the second segment 421 away from the substrate 100. By setting the side surface of the first portion 410 away from the substrate 100 to be at least partially connected to the side surface of the second segment 421 away from the isolation structure 310 to form a gap space 400a, the first portion 410 can provide better support for the second segment 421. This makes it less likely for the fourth portion 422, which is spaced apart from the isolation structure 310, to fall off toward the pixel opening 320a, thereby improving the structural stability of the display panel 10.

[0358] Optionally, a support structure P may be filled between the fourth portion 422 and the isolation structure 310. The support structure P filled between the fourth portion 422 and the isolation structure 310 can provide better restraint for the fourth portion 422. For example, the support structure P filled between the fourth portion 422 and the isolation structure 310 can support the fourth portion 422, making it less likely for the fourth portion 422 to break and fall off towards the isolation structure 310, thereby improving the structural stability of the first packaging structure 400.

[0359] Optionally, at least a portion of the material of the second encapsulation layer 500 may extend between the fourth portion 422 and the isolation structure 310 to form a support structure P, such that a portion of the material of the second encapsulation layer 500 may also be used to support the fourth portion 422.

[0360] Optionally, at least a portion of the second encapsulation layer 500 may also be located on the side of the fourth portion 422 away from the isolation structure 310, so that the fourth portion 422 can be better wrapped by the second encapsulation layer 500, thereby further enhancing the limiting effect of the second encapsulation layer 500 on the fourth portion 422, and preventing the fourth portion 422 from falling off and breaking towards the pixel opening 320a, thereby better improving the structural stability of the first encapsulation structure 400.

[0361] Optionally, adjacent fourth portions 422 are spaced apart. For example, the side of the isolation structure 310 facing away from the substrate 100 may have at least two fourth portions 422, and each fourth portion 422 may be connected to a second segment 421 within a different isolation opening 310a. By providing a spaced arrangement between adjacent fourth portions 422, when fabricating the second encapsulation layer 500, the material of the second encapsulation layer 500 can extend through the gap between the fourth portions 422 to the space between the fourth portions 422 and the isolation structure 310, thereby facilitating the formation of a second encapsulation layer 500 that better covers the periphery of the fourth portions 422.

[0362] Figure 30 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0363] like Figure 30 As shown, in some optional embodiments, the display panel 10 may further include a third encapsulation layer 600 disposed on the side of the second encapsulation layer 500 away from the substrate 100, so as to further improve the encapsulation effect of the light-emitting device 200.

[0364] Optionally, the material of the third encapsulation layer 600 may include inorganic materials, giving the third encapsulation layer 600 better encapsulation capabilities to reduce the impact of moisture on the light-emitting device 200. Optionally, the third encapsulation layer 600 may be prepared by chemical vapor deposition.

[0365] It is understood that the display panel 10 may also include a filter layer, optical adhesive, or cover plate structure located on the side of the third encapsulation layer 600 away from the second encapsulation layer 500.

[0366] Please refer to Figures 1 to 30 An embodiment of the first aspect of this application also provides a display panel 10, comprising: a substrate 100; an isolation structure 310 disposed on one side of the substrate 100 and forming an isolation opening 310a, the isolation structure 310 including a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 away from the substrate 100, the second isolation portion 312 protruding from the first isolation portion 311 toward the isolation opening 310a; a light-emitting device 200, at least partially located within the isolation opening 310a; and a first encapsulation structure 400 disposed on the side of the light-emitting device 200 away from the substrate 100, the first encapsulation structure 400 including a first portion 410 and a second segment 421, the first portion 410 being located within the isolation opening 310a and disposed on the side of the light-emitting device 200 away from the substrate 100, at least a portion of the second segment 421 covering the side of the second isolation portion 312 toward the isolation opening 310a and interconnected with the first portion 410.

[0367] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and forms an isolation opening 310a. The light-emitting device 200 is at least partially located within the isolation opening 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10. The first encapsulation structure 400 is disposed on the side of the light-emitting device 200 away from the substrate 100. The first encapsulation structure 400 includes a first portion 410 and a second segment 421. The first portion 410 is located within the isolation opening 310a and disposed on the side of the light-emitting device 200 away from the substrate 100. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. By setting at least a portion of the second segment 421 to cover the side of the second isolation portion 312 facing the isolation opening 310a and to be interconnected with the first segment 410, the first segment 410 can provide better support for the second segment 421, making it less likely for the second segment 421 to detach from the isolation structure 310, thereby improving the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0368] Optionally, the display panel 10 provided in the first aspect of this application may be the display panel 10 in any of the foregoing embodiments. Therefore, the display panel 10 provided in the embodiments of this application may have the beneficial effects of the display panel 10 in any of the foregoing embodiments, and this application will not elaborate further on it. For example, the isolation structure 310 may be the isolation structure 310 described in any of the foregoing embodiments. The isolation structure 310 may include the first isolation portion 311, the second isolation portion 312, and the third isolation portion 313 in any of the foregoing embodiments, so that the isolation structure 310 can be used to isolate the materials of the light-emitting unit 220 and the first electrode 230 when fabricating the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200. For example, the first packaging structure 400 can be the first packaging structure 400 described in any of the foregoing embodiments. With the support of the first segment 410, the second segment 421 can not easily fall off the isolation structure 310, and the first segment 410 and the second segment 421 can enclose to form the gap space 400a in any of the foregoing embodiments. The first segment 410 and the second segment 421 can enclose to form a closed gap space 400a, or the first segment 410 and the second segment 421 can enclose to form a non-gap space 400a with a connecting opening 400b. The shape and size of the connecting opening 400b can be set with reference to any of the foregoing embodiments.

[0369] Optionally, an embodiment of the first aspect of this application also provides a display panel 10 that may further include the support structure P described in any of the foregoing embodiments. The support structure P can provide better support for the second segment 421 and the fourth segment 422, making it less likely for the second segment 421 and the fourth segment 422 to detach from the isolation structure 310. Optionally, an embodiment of the first aspect of this application also provides a display panel 10 that may further include the second encapsulation layer 500 described in any of the foregoing embodiments. The second encapsulation layer 500 may extend through the connecting opening 400b into the gap space 400a or extend between the fourth segment 422 and the isolation structure 310 to form the support structure P. Furthermore, the second encapsulation layer 500 may also extend between the fourth segment 422 of the first encapsulation structure 400 and the isolation structure 310 to further improve the encapsulation effect and structural stability of the display panel 10.

[0370] Optionally, an embodiment of the first aspect of this application also provides a display panel 10 that may further include the third encapsulation layer 600 and pixel definition layer 320 described in any of the foregoing embodiments.

[0371] Figure 31 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Figure 32 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0372] Please combine Figures 1 to 30 And refer to Figure 31 and Figure 32 An embodiment of the first aspect of this application also provides a display panel 10, comprising: a substrate 100; an isolation structure 310 disposed on one side of the substrate 100 and enclosing an isolation opening 310a; a light-emitting device 200, at least partially located within the isolation opening 310a; and a first encapsulation structure 400 disposed on the side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 includes a first portion 410 and a second segment 421. The first portion 410 is located within the isolation opening 310a and disposed on the side of the light-emitting device 200 facing away from the substrate 100. The second segment 421 is located on the side of the isolation structure 310 facing the isolation opening 310a. The first portion 410 and the second segment 421 enclose a gap space 400a, and the gap space 400a is filled with a support structure P.

[0373] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, an isolation structure 310, a light-emitting device 200, and a first encapsulation structure 400. The isolation structure 310 is disposed on one side of the substrate 100 and forms an isolation opening 310a. The light-emitting device 200 is at least partially located within the isolation opening 310a. The isolation structure 310 can be used to divide the sub-pixels of the display panel 10.

[0374] The first encapsulation structure 400 is disposed on the side of the light-emitting device 200 facing away from the substrate 100. The first encapsulation structure 400 includes a first portion 410 and a second segment 421. The first portion 410 is located within the isolation opening 310a and is disposed on the side of the light-emitting device 200 facing away from the substrate 100. The second segment 421 is located on the side of the isolation structure 310 facing the isolation opening 310a. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. The first portion 410 and the second segment 421 enclose a gap space 400a. By filling the gap space 400a with a support structure P, the support structure P can provide good support for the second segment 421, making it less likely for the second segment 421 to detach from the isolation structure 310. This can effectively improve the encapsulation effect of the first encapsulation structure 400 on the display panel 10.

[0375] Optionally, the display panel 10 provided in the first aspect of this application may be the display panel 10 in any of the foregoing embodiments. Therefore, the display panel 10 provided in the embodiments of this application may have the beneficial effects of the display panel 10 in any of the foregoing embodiments, and this application will not elaborate further on it. For example, the isolation structure 310 may be the isolation structure 310 described in any of the foregoing embodiments. The isolation structure 310 may include the first isolation portion 311, the second isolation portion 312, and the third isolation portion 313 in any of the foregoing embodiments, so that the isolation structure 310 can be used to isolate the materials of the light-emitting unit 220 and the first electrode 230 when fabricating the light-emitting unit 220 and the first electrode 230 of the light-emitting device 200. For example, the support structure P may be the support structure P described in any of the foregoing embodiments, and the support structure P supports the second segment 421 and the fourth segment 422.

[0376] Optionally, the first segment 410 may not be used to support the second segment 421, for example, as... Figure 31 and Figure 32 As shown, the second segment 421 covering the second isolation portion 312 on the side facing the isolation opening 310a may not be connected to the first segment 410 at all, or, as... Figures 1 to 30 As shown, the first packaging structure 400 can be the first packaging structure 400 described in any of the foregoing embodiments. The first portion 410 can be used to support at least part of the second segment 421, so that the second segment 421 is not easily detached from the isolation structure 310.

[0377] Optionally, the first portion 410 and the second segment 421 can be enclosed to form the gap space 400a in any of the aforementioned embodiments. The first portion 410 and the second segment 421 can be enclosed to form a closed gap space 400a, or the first portion 410 and the second segment 421 can be enclosed to form a gap space 400a with a communicating opening 400b. The shape and size of the communicating opening 400b can be set with reference to any of the aforementioned embodiments.

[0378] Optionally, an embodiment of the first aspect of this application also provides a display panel 10 that may further include the second encapsulation layer 500 described in any of the foregoing embodiments. The second encapsulation layer 500 may extend through the connecting opening 400b into the gap space 400a or extend between the fourth portion 422 and the isolation structure 310 to form a support structure P. The second encapsulation layer 500 may also extend between the fourth portion 422 of the first encapsulation structure 400 and the isolation structure 310 to further improve the encapsulation effect and structural stability of the display panel 10.

[0379] Optionally, an embodiment of the first aspect of this application also provides a display panel 10 that may further include the third encapsulation layer 600 and pixel definition layer 320 described in any of the foregoing embodiments.

[0380] It is understandable that the arrangement of the first encapsulation structure 400 in the display panel 10 can be adjusted according to the actual situation. That is, within the partial isolation opening 310a, the side surface of the first portion 410 facing away from the substrate 100 is partially connected to the side surface of the second segment 421 facing away from the isolation structure 310. Within the partial isolation opening 310a, the side surface of the first portion 410 facing away from the substrate 100 is completely connected to the side surface of the second segment 421 facing away from the isolation structure 310. Within the partial isolation opening 310a, the side surface of the first portion 410 facing away from the substrate 100 is not connected to the side surface of the second segment 421 facing away from the isolation structure 310.

[0381] Figure 33 This is a partial schematic diagram of a defined structure 300 provided in another embodiment of this application. Figure 34 This is a partial cross-sectional view of a display panel 10 provided in an embodiment of this application.

[0382] like Figure 33 and Figure 34 As shown, an embodiment of the first aspect of this application also provides a display panel 10, comprising: a substrate 100; a defining structure 300 disposed on one side of the substrate 100 and enclosing to form a defining opening 300a, the defining structure 300 including an isolation structure 310 having opposing first end 310b and second end 310c, the second end 310c being located on the side of the first end 310b away from the substrate 100, and the orthographic projection of the first end 310b on the substrate 100 being located within the orthographic projection of the second end 310c on the substrate 100; a light-emitting device 200 located within the defining opening 300a; and a first encapsulation structure 400 disposed on the side of the light-emitting device 200 away from the substrate 100, the first encapsulation structure 400 including interconnected... The first portion 410 and the side section 420 are located within the defined opening 300a and disposed on the side of the light-emitting device 200 away from the substrate 100. At least a portion of the side section 420 is located on the side of the defined structure 300 facing the defined opening 300a. A gap space 400a is formed between the first portion 410 and the side section 420. The gap space 400a is at least partially located on the lower side of the second end 310c, and the side of the gap space 400a away from the substrate 100 has a communicating opening 400b. The support structure P includes a first encapsulation portion P1 disposed on the side of the side section 420 facing the defined opening 300a. At least a portion of the first encapsulation portion P1 is disposed within the gap space 400a and is located between the second end 310c and the substrate 100.

[0383] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, a defining structure 300, a light-emitting device 200, a first encapsulation structure 400, and a support structure P. The defining structure 300 is disposed on one side of the substrate 100 and encloses to form a defining opening 300a. The light-emitting device 200 is disposed within the defining opening 300a. The defining structure 300 can be used to divide the sub-pixels of the display panel 10. The limiting structure 300 includes an isolation structure 310, which has a first end 310b and a second end 310c. The second end 310c is located on the side of the first end 310b away from the substrate 100. By setting the orthogonal projection of the first end 310b on the substrate 100 to be within the orthogonal projection of the second end 310c on the substrate 100, the material of the light-emitting device 200 can be directly vapor-deposited on the entire surface when fabricating the light-emitting device 200 of the display panel 10. The second end 310c can block at least part of the material used to fabricate the light-emitting device 200, thereby isolating the material of the light-emitting device 200 between adjacent sub-pixels. This facilitates the formation of multiple spaced light-emitting devices 200 located within the limiting opening 300a. As a result, it is not necessary to set a high-precision mask when fabricating the light-emitting device 200 of the display panel 10. For example, it is not necessary to set a high-precision metal mask when vapor-depositing the material of the light-emitting device 200, thereby significantly reducing the production cost of the display panel 10.

[0384] Optionally, the limiting structure 300 may be in the form of a grid to facilitate the division of sub-pixels in the display panel 10. The open areas in the grid-like limiting structure 300 may be defined openings 300a.

[0385] Optionally, the defined opening 300a may include an isolation opening 310a formed by the isolation structure 310.

[0386] The first encapsulation layer is disposed on the side of the light-emitting device 200 away from the substrate 100. The first encapsulation structure 400 includes a first portion 410 and a side segment 420 connected to each other. The first portion 410 is located within the defined opening 300a and is disposed on the side of the light-emitting device 200 away from the substrate 100. At least a portion of the side segment 420 is located on the side of the defined structure 300 facing the defined opening 300a. The first encapsulation structure 400 can be used to encapsulate the light-emitting device 200. A gap space 400a can be formed between the first portion 410 and the side segment 420. The gap space 400a is at least partially located below the second end 310c, and the side of the gap space 400a facing away from the substrate 100 has a communicating opening 400b. The support structure P includes a first encapsulation portion P1 disposed on the side segment 420 facing the defining opening 300a. At least a portion of the first encapsulation portion P1 is disposed within the gap space 400a and located between the second end 310c and the substrate 100, so that the first encapsulation portion P1 can be used to protect a portion of the first encapsulation structure 400 between the second end 310c and the substrate 100. This makes it difficult for the etching material to enter the gap space 400a and etch the first encapsulation structure 400 when patterning the subsequently formed film structure using etching material. This allows the side segment 420 to have better structural stability, thereby improving the encapsulation effect of the first encapsulation structure 400.

[0387] Optionally, the display panel 10 provided in the first aspect of this application may be the display panel 10 in any of the foregoing embodiments. Therefore, the display panel 10 provided in the embodiments of this application may have the beneficial effects of the display panel 10 in any of the foregoing embodiments. This application will not elaborate further on it.

[0388] In some embodiments of this application, the first portion 410 can be mainly used to encapsulate the light-emitting device 200, so that external interference factors such as moisture are less likely to affect the working reliability of the light-emitting device 200. The side segment 420 connected to the first portion 410 and located at least partially on the side of the limiting structure 300 facing the limiting opening 300a can be used to extend the intrusion path of interference factors to improve the encapsulation effect of the display panel 10.

[0389] Since a portion of the first packaging structure 400 covers the surface of the defining structure 300, the shape of the first packaging structure 400 is easily affected by the shape of the defining structure 300. For example, under the influence of the shape of the isolation structure 310, the first portion 410 and the side section 420 are likely to form a gap space 400a at the position between the second end 310c and the substrate 100. This makes it difficult for the material of other film structures to fall into the gap space 400a under the blocking effect of the second end 310c when other film structures are formed directly on the first packaging structure 400. Even if at least part of the first packaging structure 400 in the gap space 400a is exposed from the fracture of the film structure, the first packaging structure 400 is easily etched and damaged when the film structure on the first packaging structure 400 is patterned using an etching material, thereby easily affecting the packaging effect of the first packaging structure 400. Therefore, by disposing at least a portion of the first encapsulation portion P1 within the gap space 400a and between the second end 310c and the substrate 100, the first encapsulation portion P1 can be used to protect a portion of the first encapsulation structure 400 between the second end 310c and the substrate 100, thereby improving the encapsulation effect of the display panel 10.

[0390] Figure 35 This is a partial cross-sectional view of a display panel provided in another embodiment of this application.

[0391] like Figure 35 As shown, optionally, a portion of the first package portion P1 may be located outside the gap space 400a. Optionally, in a direction away from the substrate 100, the surface of the first package portion P1 located outside the gap space 400a facing away from the side section 420 is inclined toward the side section 420.

[0392] Optionally, due to the shape of the isolation structure 310, in the direction away from the substrate 100, the side segment 420 of the first packaging structure 400 located at the second end 310c facing the defined opening 300a tends to tilt towards the defined opening 300a to a certain extent. That is, in the direction away from the substrate 100, the surface of the side segment 420 located at the second end 310c facing the defined opening 300a tends to tilt towards the defined opening 300a. This makes it easy for other film layer structures to break on the surface of the side segment 420 facing the defined opening 300a if other film layer structures are formed directly on the first packaging structure 400. This means that at least part of the side segment 420 is easily exposed from the break in the film layer structure. This makes it easy for the side segment 420 to be etched and damaged when patterning the film layer structure on the side segment 420 using an etching material, thereby easily affecting the packaging effect of the first packaging structure 400. By providing a first encapsulation portion P1 on the surface of the side segment 420 facing the limiting opening 300a, and by providing a surface of the first encapsulation portion P1 that is away from the side segment 420 that is inclined toward the side segment 420, the first encapsulation portion P1 can be made smooth on the surface of the side segment 420 facing the limiting opening 300a. This allows other film layer structures to be formed better on the first encapsulation portion P1 and to be more continuous on the first encapsulation portion P1. This makes the first encapsulation structure 400 and the support structure P less susceptible to etching damage, thereby improving the encapsulation effect of the display panel 10.

[0393] Optionally, the material of the support structure P can be configured in various ways. For example, the material of the support structure P may include an organic material, giving it good flowability to facilitate its formation, such as allowing it to flow easily into the gap space 400a. Optionally, the material of the support structure P may also be configured according to the etching material used for etching other subsequently formed film structures, making the support structure P less susceptible to being etched and damaged by the etching material during the etching of other subsequently formed film structures. Optionally, the material of the support structure P may include at least one of OC adhesive and polyimide adhesive, both resistant to stripping liquid.

[0394] Figure 36 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0395] like Figure 36 As shown, in some optional embodiments, at least a portion of the side segment 420 is located on the side of the defining structure 300 away from the substrate 100 and is spaced apart from the defining structure 300, and at least a portion of the support structure P is located between the side segment 420 and the defining structure 300.

[0396] Optionally, the side segment 420 includes a fourth segment 422 spaced apart from the defining structure 300 and a second segment 421 located on the side of the defining structure 300 facing the defining opening 300a. The support structure P includes a second encapsulation portion P2 and a third encapsulation portion P3 connected to each other. The second encapsulation portion P2 is located between the fourth segment 422 and the defining structure 300, and the third encapsulation portion P3 is disposed on the side surface of the fourth segment 422 facing away from the defining opening 300a.

[0397] In these optional embodiments, by providing at least a portion of the support structure P between the side segment 420 and the limiting structure 300, that is, by providing the second encapsulation portion P2 between the fourth portion 422 and the limiting structure 300, the support structure P can be used to support the portion of the side segment 420 located on the side of the limiting structure 300 away from the substrate 100, making it less likely for the portion of the side segment 420 spaced apart from the limiting structure 300 to fall towards the limiting structure 300, and / or, making the support structure P can be used to connect the portion of the side segment 420 located on the side of the limiting structure 300 away from the substrate 100, making it less likely for the side segment 420 to detach relative to the limiting structure 300 towards the limiting opening 300a, thereby improving the structural stability of the side segment 420.

[0398] By providing a third encapsulation part P3 connected to the second encapsulation part P2 and disposed on the surface of the fourth part 422 facing away from the limiting opening 300a, the connection area between the support structure P and the side section 420 can be further increased, thereby further restricting the movement of the side section 420 relative to the limiting structure 300 and further improving the structural stability of the side section 420.

[0399] Optionally, the first encapsulation part P1 is disposed on the side surface of the fourth segment 422 and the second segment 421 facing the limiting opening 300a, and the third encapsulation part P3 is connected to the first encapsulation part P1, so that the support structure P can better wrap around the outside of the side segment 420, thereby further restricting the movement of the side segment 420 relative to the limiting structure 300, and thus further improving the structural stability of the side segment 420.

[0400] Optionally, the gap space 400a may be formed by the first portion 410 facing the end of the defining structure 300 and the fourth portion 422.

[0401] In these alternative embodiments, when fabricating the support structure P, the material of the support structure P can enter the gap space 400a through the connecting opening 400b to form at least a portion of the first encapsulation portion P1. By providing the first encapsulation portion P1 filling the gap space 400a, when fabricating other film structures on the support structure P, the material of other film structures is less likely to enter the gap space 400a or break at the connecting opening 400b. This allows the etching material to make better contact with the film structure when patterning the film structure on the support structure P using an etching material, thereby facilitating the patterning of the film structure.

[0402] In some embodiments of this application, the display panel 10 may include light-emitting devices 200 that emit multiple colors of light. For example, the display panel 10 may have light-emitting devices 200 capable of emitting red, green, and blue light.

[0403] Optionally, the light-emitting device 200 may include a first light-emitting device 200a, a second light-emitting device 200b, and a third light-emitting device 200c disposed within different defined openings 300a. Optionally, the first light-emitting device 200a, the second light-emitting device 200b, and the third light-emitting device 200c emit different colors; for example, the first light-emitting device 200a may emit red light, the second light-emitting device 200b may emit green light, and the third light-emitting device 200c may emit blue light.

[0404] Optionally, the defined opening 300a may include a first opening 310aa for accommodating a first light-emitting device 200a, a second opening 310ab for accommodating a second light-emitting device 200b, and a third opening 310ac for accommodating a third light-emitting device 200c. For example, the isolation opening 310a may include the first opening 310aa, the second opening 310ab, and the third opening 310ac.

[0405] In some optional embodiments, the first encapsulation structure 400 has a first encapsulation region 400d, a second encapsulation region 400e, and a third encapsulation region 400f, which are configured to correspond to light-emitting devices 200 of different light-emitting colors.

[0406] In this optional embodiment, the first packaging structure 400 has a first packaging region 400d, a second packaging region 400e, and a third packaging region 400f corresponding to light-emitting devices 200 with different emission colors. This means that the first packaging structure 400 located in the first packaging region 400d, the first packaging structure 400 located in the second packaging region 400e, and the first packaging structure 400 located in the third packaging region 400f can be used to package light-emitting devices 200 with different emission colors, respectively.

[0407] Optionally, the first packaging structure 400 within the first packaging region 400d corresponds to the red-emitting light-emitting device 200, and the first packaging structure 400 within the first packaging region 400d can be used to package the red-emitting light-emitting device 200; the first packaging structure 400 within the second packaging region 400e corresponds to the green-emitting light-emitting device 200, and the first packaging structure 400 within the second packaging region 400e can be used to package the green-emitting light-emitting device 200; the first packaging structure 400 within the third packaging region 400f corresponds to the blue-emitting light-emitting device 200, and the first packaging structure 400 within the third packaging region 400f can be used to package the blue-emitting light-emitting device 200.

[0408] Optionally, the first packaging structure 400 in the first packaging region 400d corresponds to the first light-emitting device 200a, the first packaging structure 400 in the second packaging region 400e corresponds to the second light-emitting device 200b, and the first packaging structure 400 in the third packaging region 400f corresponds to the third light-emitting device 200c.

[0409] Optionally, the first packaging structure 400 in the first packaging region 400d may be located within the first opening 310aa and the limiting structure 300 surrounding the first opening 310aa may be located on the side away from the substrate 100; the first packaging structure 400 in the second packaging region 400e may be located within the second opening 310ab and the limiting structure 300 surrounding the second opening 310ab may be located on the side away from the substrate 100; the first packaging structure 400 in the third packaging region 400f may be located within the third opening 310ac and the limiting structure 300 surrounding the third opening 310ac may be located on the side away from the substrate 100.

[0410] Optionally, in at least two of the first packaging region 400d, the second packaging region 400e, and the third packaging region 400f, the side segments 420 are spaced apart, such that the second packaging portion P2 and the third packaging portion P3 of the support structure P can cover the surface of the side segment 420 facing away from the defining opening 300a through the gap between the side segments 420 of the two adjacent ones in the first packaging region 400d, the second packaging region 400e, and the third packaging region 400f, so as to improve the structural stability of the side segment 420.

[0411] Figures 37 to 46 This is a schematic diagram of the preparation process of a method for preparing a display panel 10 provided in an embodiment of this application.

[0412] In these alternative embodiments, the light-emitting device 200 and the first packaging structure 400 can be formed in various ways, for example, as... Figures 37 to 46As shown, during the fabrication of the display panel 10, under the shielding and blocking effect of the isolation structure 310 on the material of the light-emitting device 200, the light-emitting devices 200 with different emitting colors and their corresponding portions of the first encapsulation structure 400 in the display panel 10 can be fabricated relatively independently. Specifically, after the fabrication of a light-emitting device 200 of one color and the material of the portion of the first encapsulation structure 400 above it is completed, the material of the support structure P can be fabricated separately on top of this portion of the first encapsulation structure 400 material. This allows the material of the first encapsulation portion P1 to be formed on top of this portion of the first encapsulation structure 400 material, making the first encapsulation structure 400 less susceptible to etching damage during subsequent patterning processes of other film layers, thereby improving the structural stability of the first encapsulation structure 400.

[0413] In some alternative embodiments, the first package portion P1 is located within the gap space 400a in at least two of the first package region 400d, the second package region 400e, and the third package region 400f.

[0414] Optionally, a portion of the first package portion P1 is located within the gap space 400a within the first package region 400d, and a portion of the first package portion P1 is located within the gap space 400a within the second package region 400e.

[0415] In these alternative embodiments, during the fabrication process of the display panel 10, for example, during the fabrication of each light-emitting device 200 in the display panel 10, such as Figure 37 and Figure 38 As shown, the material of the first light-emitting device 200a (the first device material layer 10g in the figure) can be deposited on the entire surface firstly by vapor deposition, so that the material of the first light-emitting device 200a is present in each defined opening 300a. Then, the material of the first encapsulation structure 400 (the first encapsulation material layer 10a in the figure) is prepared on the entire surface, so that the material of the first light-emitting device 200a in each defined opening 300a can be covered by the material of the first encapsulation structure 400. Then, as... Figure 39 As shown, the material of the first light-emitting device 200a and the material of the first encapsulation structure 400 within the other defined openings 300a besides the first opening 310aa can be removed to form the material of the first light-emitting device 200a located at least partially within the first opening 310aa and the material of the first encapsulation structure 400 located at least partially within the first opening 310aa. The material of this portion of the first encapsulation structure 400 can be used to participate in forming the first encapsulation structure 400 located in the first encapsulation region 400d.

[0416] Then as Figure 40As shown, a material for the support structure P (the first support material layer 10b in the figure) can be prepared on top of the material of the first encapsulation structure 400 corresponding to the first light-emitting device 200a to form a portion of the support structure P, for example, to form a portion of the first encapsulation part P1 located within the gap space 400a, and / or to form a portion of the second encapsulation part P2 and a portion of the third encapsulation part P3 located on the defining structure 300 that encloses the first opening 310aa.

[0417] like Figure 41 As shown, the material of the second light-emitting device 200b (the second device material layer 10h in the figure) is then vapor-deposited across the entire surface, so that the material of the second light-emitting device 200b is present within each defined opening 300a. Then, the material of the first encapsulation structure 400 (the second encapsulation material layer 10c in the figure) is prepared across the entire surface, so that the material of the second light-emitting device 200b within each defined opening 300a is covered by the material of the first encapsulation structure 400. Then as... Figure 42 As shown, the material of the second light-emitting device 200b and the material of the first encapsulation structure 400 within the other defined openings 300a besides the second opening 310ab can be removed to form the material of the second light-emitting device 200b located at least partially within the second opening 310ab and the material of the first encapsulation structure 400 located at least partially within the second opening 310ab. The material of this portion of the first encapsulation structure 400 can be used to participate in forming the first encapsulation structure 400 located in the second encapsulation region 400e.

[0418] In this process, when preparing the materials for the second light-emitting device 200b and the first encapsulation structure 400, at least a portion of the first encapsulation part P1 is provided above the materials that participate in forming the first encapsulation structure 400 located in the first encapsulation region 400d. This allows the first encapsulation structure 400 that encloses the gap space 400a to be protected by the first encapsulation part P1. Furthermore, this ensures that the materials for the second light-emitting device 200b and the first encapsulation structure 400 above the connecting opening 400b of the gap space 400a have good continuity. This prevents the etching material from causing excessive etching damage to this portion of the first encapsulation structure 400 when removing the materials for the second light-emitting device 200b and the first encapsulation structure 400 within other defined openings 300a besides the second opening 310ab. This effectively improves the structural stability of the final formed first encapsulation structure 400, thereby improving the encapsulation reliability of the display panel 10 and ultimately enhancing the encapsulation effect of the display panel 10.

[0419] Then as Figure 43As shown, the material of the support structure P (the second support material layer 10d in the figure) can be prepared again on the material of the first encapsulation structure 400 corresponding to the second light-emitting device 200b to form another part of the support structure P, for example, to form another part of the first encapsulation portion P1 located in the gap space 400a, and / or to form another part of the second encapsulation portion P2 and another part of the third encapsulation portion P3 located on the defining structure 300 that encloses the first opening 310aa.

[0420] like Figure 44 As shown, the material of the third light-emitting device 200c is then deposited across the entire surface, ensuring that the material of the third light-emitting device 200c is present within each defined opening 300a (as shown in the third device material layer 10i). Then, the material of the first encapsulation structure 400 is prepared across the entire surface (as shown in the third encapsulation material layer 10e), ensuring that the material of the third light-emitting device 200c within each defined opening 300a is covered by the material of the first encapsulation structure 400. Then, as... Figure 45 As shown, the material of the third light-emitting device 200c and the material of the first encapsulation structure 400 within the other defined openings 300a besides the third opening 310ac can be removed to form the material of the third light-emitting device 200c located at least partially within the third opening 310ac and the material of the first encapsulation structure 400 located at least partially within the third opening 310ac. The material of this portion of the first encapsulation structure 400 can be used to participate in the formation of the first encapsulation structure 400 located in the third encapsulation region 400f.

[0421] In this process, when preparing the materials for the third light-emitting device 200c and the first encapsulation structure 400, at least a portion of the first encapsulation part P1 is provided above the materials that participate in forming the first encapsulation structure 400 located in the second encapsulation region 400e. This allows the first encapsulation structure 400 that encloses the gap space 400a to be protected by the first encapsulation part P1. Furthermore, this ensures that the materials for the third light-emitting device 200c and the first encapsulation structure 400 above the connecting opening 400b of the gap space 400a have good continuity. This prevents the etching material from causing excessive etching damage to this portion of the first encapsulation structure 400 when removing the materials for the third light-emitting device 200c and the first encapsulation structure 400 within other defined openings 300a besides the third opening 310ac. This effectively improves the structural stability of the final first encapsulation structure 400, thereby improving the encapsulation reliability of the display panel 10 and ultimately enhancing the encapsulation effect of the display panel 10.

[0422] In some optional embodiments, the support structure P may not be provided above the first packaging structure 400 located in the third packaging region 400f, in order to reduce material costs and reduce the manufacturing process steps of the support structure P, thereby improving the manufacturing efficiency of the display panel 10.

[0423] In some alternative embodiments, a portion of the first package portion P1 may also be located on the side surface of the side segment 420 within the third package region 400f facing the defining opening 300a.

[0424] In this optional embodiment, such as Figure 46 As shown, after the third light-emitting device 200c and the first encapsulation structure 400 in the third region above the third light-emitting device 200c are prepared, a material for the support structure P (the third support material layer 10f in the figure) can be prepared above the first encapsulation structure 400 in the third region to form another part of the support structure P, for example, to form another part of the first encapsulation portion P1 located in the gap space 400a, and / or to form another part of the second encapsulation portion P2 and another part of the third encapsulation portion P3 located on the defining structure 300 that encloses the first opening 310aa. This allows the first encapsulation structure 400, which encloses the gap space 400a, to be protected by the first encapsulation part P1 when other film structures are subsequently fabricated on the first encapsulation structure 400 in the third region. Furthermore, the other film structures can be well formed above the connecting opening 400b of the gap space 400a in the third region and have good continuity. This also makes the first encapsulation structure 400 less susceptible to etch damage when patterning the film structures on the first encapsulation structure 400 in the third region using etching materials. This results in the first encapsulation structure 400 having good structural stability, thereby further improving the overall encapsulation effect of the display panel 10.

[0425] Figure 47 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0426] Please combine Figures 33 to 46 And see Figure 47An embodiment of the first aspect of this application also provides a display panel 10, comprising: a substrate 100; a defining structure 300 disposed on one side of the substrate 100 and enclosing to form a defining opening 300a, the defining structure 300 including an isolation structure 310, the isolation structure 310 having opposing first end 310b and second end 310c, the second end 310c being located on the side of the first end 310b facing away from the substrate 100, and the orthographic projection of the first end 310b on the substrate 100 being located within the orthographic projection of the second end 310c on the substrate 100; and a light emitter. The device 200 is located within the defined opening 300a; the first encapsulation structure 400 is disposed on the side of the light-emitting device 200 away from the substrate 100, the first encapsulation structure 400 includes a first portion 410 and a side segment 420 connected to each other, the first portion 410 is located within the defined opening 300a and disposed on the side of the light-emitting device 200 away from the substrate 100, at least a portion of the side segment 420 is located on the side of the defined structure 300 away from the substrate 100 and is spaced apart from the defined structure 300; the support structure P is at least partially located between the side segment 420 and the defined structure 300.

[0427] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, a defining structure 300, a light-emitting device 200, a first encapsulation structure 400, and a support structure P. The light-emitting device 200 can be any of the light-emitting devices 200 in the preceding embodiments. Optionally, the display panel 10 may further include a second electrode 210 disposed within the defining opening 300a, and the second electrode 210 may be located between the light-emitting device 200 and the substrate 100. Optionally, the first electrode 230 and the second electrode 210 of the light-emitting device 200 can serve as pixel electrodes of the display panel 10. One of the first electrode 230 and the second electrode 210 can serve as an anode, and the other as a cathode to drive the light-emitting unit 220 of the light-emitting device 200 to emit light. The first encapsulation structure 400 can also be any of the first encapsulation structures 400 in the preceding embodiments, and the first encapsulation structure 400 can be used to encapsulate the light-emitting device 200.

[0428] Furthermore, the limiting structure 300 can be the limiting structure 300 in any of the foregoing embodiments. The limiting structure 300 can be used to divide the sub-pixels of the display panel 10 and can be used to block and isolate the material of the light-emitting device 200 so as to form a plurality of light-emitting devices 200 spaced apart and located within the limiting opening 300a. This eliminates the need to set a high-precision mask when preparing the light-emitting device 200 of the display panel 10. For example, it eliminates the need to set a high-precision metal mask when evaporating the material of the light-emitting device 200, thereby effectively reducing the production cost of the display panel 10.

[0429] By setting at least a portion of the support structure P between the side segment 420 and the limiting structure 300, the support structure P can be used to support the portion of the side segment 420 located on the side of the limiting structure 300 away from the substrate 100, making it less likely for the portion of the side segment 420 spaced apart from the limiting structure 300 to fall towards the limiting structure 300, and / or, making it possible for the support structure P to connect the portion of the side segment 420 located on the side of the limiting structure 300 away from the substrate 100, making it less likely for the side segment 420 to detach relative to the limiting structure 300 towards the limiting opening 300a, thereby improving the structural stability of the side segment 420 and thus improving the encapsulation effect of the display panel 10.

[0430] Optionally, there are various ways to set the material of the support structure P. For example, the material of the support structure P may include organic materials, so that the material of the support structure P has good flowability, so as to facilitate the formation of the support structure P.

[0431] In some alternative embodiments, the side segment 420 includes a fourth portion 422 spaced apart from the defining structure 300 and a second portion 421 located on the side of the defining structure 300 facing the defining opening 300a. The support structure P includes a second encapsulation portion P2 and a third encapsulation portion P3 connected to each other. The second encapsulation portion P2 is located between the fourth portion 422 and the defining structure 300, and the third encapsulation portion P3 is disposed on the side surface of the fourth portion 422 facing away from the defining opening 300a.

[0432] By providing a second encapsulation portion P2 located between the fourth portion 422 and the limiting structure 300, and a third encapsulation portion P3 connected to the second encapsulation portion P2 and located on the surface of the fourth portion 422 facing away from the limiting opening 300a, the connection area between the support structure P and the side segment 420 can be further increased, thereby further restricting the movement of the side segment 420 relative to the limiting structure 300 and further improving the structural stability of the side segment 420.

[0433] In some alternative embodiments, the support structure P includes a first encapsulation portion P1, at least a portion of which is disposed on one side surface of the side segment 420 facing the defining opening 300a.

[0434] Optionally, in a direction away from the substrate 100, the surface of the first package portion P1 facing away from the side section 420 is inclined toward the side section 420.

[0435] In these optional embodiments, the first encapsulation portion P1 can be used on the surface of the smooth side segment 420 facing the defined opening 300a. By setting the side surface of the first encapsulation portion P1 away from the side segment 420 to be inclined towards the side segment 420, when other film layer structures are prepared on the first encapsulation portion P1, the other film layer structures can be better formed on the first encapsulation portion P1 and can be better continuous on the first encapsulation portion P1. When the film layer structure on the first encapsulation portion P1 is patterned using an etching material, the first encapsulation portion P1 is not easily etched and damaged by the etching material, so that the side segment 420 can have better structural stability, thereby improving the encapsulation effect of the first encapsulation structure 400.

[0436] Optionally, the first encapsulation part P1 is disposed on the side surface of the fourth segment 422 and the second segment 421 facing the limiting opening 300a, and the third encapsulation part P3 is connected to the first encapsulation part P1, so that the support structure P can better wrap around the outside of the side segment 420, thereby further restricting the movement of the side segment 420 relative to the limiting structure 300, and thus further improving the structural stability of the side segment 420.

[0437] In some optional embodiments, a gap space 400a may be formed between the first portion 410 and the side segment 420. The gap space 400a is at least partially located on the lower side of the second end portion 310c, and the side of the gap space 400a facing away from the substrate 100 has a communicating opening 400b. At least a portion of the first encapsulation portion P1 is disposed in the gap space 400a and located between the second end portion 310c and the substrate 100.

[0438] Optionally, the gap space 400a may be formed by the first portion 410 facing the end of the defining structure 300 and the fourth portion 422.

[0439] In these alternative embodiments, when fabricating the support structure P, the material of the support structure P can enter the gap space 400a through the connecting opening 400b to form at least a portion of the first encapsulation structure 400. By providing the first encapsulation structure 400 filling the gap space 400a, when fabricating other film structures on the support structure P, the material of other film structures is less likely to enter the gap space 400a or break at the connecting opening 400b. This allows the etching material to make better contact with the film structure when patterning the film structure on the support structure P using an etching material, thereby facilitating the patterning of the film structure.

[0440] In some optional embodiments, the first packaging structure 400 may be similar to the first packaging structure 400 in any of the foregoing embodiments, having a first packaging region 400d, a second packaging region 400e, and a third packaging region 400f provided for light-emitting devices 200 corresponding to different light-emitting colors.

[0441] Optionally, the first packaging structure 400 within the first packaging region 400d corresponds to the red-emitting light-emitting device 200, and the first packaging structure 400 within the first packaging region 400d can be used to package the red-emitting light-emitting device 200; the first packaging structure 400 within the second packaging region 400e corresponds to the green-emitting light-emitting device 200, and the first packaging structure 400 within the second packaging region 400e can be used to package the green-emitting light-emitting device 200; the first packaging structure 400 within the third packaging region 400f corresponds to the blue-emitting light-emitting device 200, and the first packaging structure 400 within the third packaging region 400f can be used to package the blue-emitting light-emitting device 200.

[0442] Optionally, the first packaging structure 400 in the first packaging region 400d corresponds to the first light-emitting device 200a, the first packaging structure 400 in the second packaging region 400e corresponds to the second light-emitting device 200b, and the first packaging structure 400 in the third packaging region 400f corresponds to the third light-emitting device 200c.

[0443] Optionally, in at least two of the first packaging region 400d, the second packaging region 400e, and the third packaging region 400f, the side segments 420 are spaced apart, such that the second packaging portion P2 and the third packaging portion P3 of the support structure P can cover the surface of the side segment 420 facing away from the defining opening 300a through the gap between the side segments 420 of the two adjacent ones in the first packaging region 400d, the second packaging region 400e, and the third packaging region 400f, so as to improve the structural stability of the side segment 420.

[0444] In these alternative embodiments, the light-emitting device 200 and the first packaging structure 400 can be formed in various ways, for example, as... Figures 37 to 46 As shown, during the fabrication of the display panel 10, under the shielding and blocking effect of the isolation structure 310 on the material of the light-emitting device 200, the light-emitting devices 200 with different emitting colors and their corresponding portions of the first encapsulation structure 400 in the display panel 10 can be fabricated relatively independently. Specifically, after the fabrication of a light-emitting device 200 of one color and the material of the portion of the first encapsulation structure 400 above it is completed, the material of the support structure P can be fabricated separately above this portion of the first encapsulation structure 400 material. This allows the material of the second encapsulation portion P2 to be formed above this portion of the first encapsulation structure 400 material. This prevents the fabricated side segment 420 from easily detaching or falling off relative to the limiting structure 300 during subsequent film layer fabrication or patterning processes, thus improving the structural stability of the side segment 420 and consequently enhancing the encapsulation effect of the display panel 10.

[0445] In some alternative embodiments, in the first encapsulation region 400d, the second encapsulation region 400e, and the third encapsulation region 400f, at least a portion of the support structure P is located between the side segment 420 and the defining structure 300 in at least two of them.

[0446] Optionally, at least a portion of the support structure P is located between the side segment 420 and the defining structure 300 within the first packaging region 400d, and at least a portion of the support structure P is located between the side segment 420 and the defining structure 300 within the second packaging region 400e.

[0447] In these alternative embodiments, during the fabrication process of the display panel 10, for example, during the fabrication of each light-emitting device 200 in the display panel 10, such as Figure 37 and Figure 38 As shown, the material of the first light-emitting device 200a can first be vapor-deposited across its entire surface, ensuring that the material of the first light-emitting device 200a is present within each defined opening 300a. Then, the material of the first encapsulation structure 400 is prepared across its entire surface, ensuring that the material of the first light-emitting device 200a within each defined opening 300a is covered by the material of the first encapsulation structure 400. Then, as... Figure 39 As shown, the material of the first light-emitting device 200a and the material of the first encapsulation structure 400 within the other defined openings 300a besides the first opening 310aa can be removed to form the material of the first light-emitting device 200a located at least partially within the first opening 310aa and the material of the first encapsulation structure 400 located at least partially within the first opening 310aa. The material of this portion of the first encapsulation structure 400 can be used to participate in forming the first encapsulation structure 400 located in the first encapsulation region 400d.

[0448] Then as Figure 40 As shown, the material of the support structure P can be prepared above the material of the first encapsulation structure 400 corresponding to the first light-emitting device 200a to form a portion of the support structure P, for example, to form a portion of the first encapsulation portion P1 located within the first opening 310aa, and / or to form a portion of the second encapsulation portion P2 and a portion of the third encapsulation portion P3 located on the defining structure 300 surrounding the first opening 310aa. At least a portion of the material of the support structure P may be located between the materials of the defining structure 300 surrounding the first opening 310aa and the first encapsulation structure 400.

[0449] like Figure 41As shown, the material of the second light-emitting device 200b is then vapor-deposited across the entire surface, ensuring that the material of the second light-emitting device 200b is present within each defined opening 300a. Then, the material of the first encapsulation structure 400 is prepared across the entire surface, ensuring that the material of the second light-emitting device 200b within each defined opening 300a is covered by the material of the first encapsulation structure 400. Then as... Figure 42 As shown, the material of the second light-emitting device 200b and the material of the first encapsulation structure 400 within the other defined openings 300a besides the second opening 310ab can be removed to form the material of the second light-emitting device 200b located at least partially within the second opening 310ab and the material of the first encapsulation structure 400 located at least partially within the second opening 310ab. The material of this portion of the first encapsulation structure 400 can be used to participate in forming the first encapsulation structure 400 located in the second encapsulation region 400e.

[0450] In this process, when preparing the materials for the second light-emitting device 200b and the first encapsulation structure 400, at least a portion of the material of the support structure P is provided between the materials of the limiting structure 300 that encloses the first opening 310aa and the first encapsulation structure 400. This allows the material of the support structure P to better support and connect with the material of the first encapsulation structure 400 that is spaced apart from the limiting structure 300 that encloses the first opening 310aa. This makes it less likely for the material of the first encapsulation structure 400 to detach or fall off when preparing or patterning the materials for the second light-emitting device 200b and the first encapsulation structure 400. This can better improve the structural stability of the finally formed first encapsulation structure 400 and support structure P, thereby improving the encapsulation reliability of the display panel 10 and thus improving the encapsulation effect of the display panel 10.

[0451] Then as Figure 43 As shown, the material of the support structure P can be prepared again on top of the material of the first encapsulation structure 400 corresponding to the second light-emitting device 200b to form another part of the support structure P, for example, to form another part of the first encapsulation portion P1 located within the first opening 310aa, and / or to form another part of the second encapsulation portion P2 and another part of the third encapsulation portion P3 located on the defining structure 300 surrounding the first opening 310aa. At least a portion of the material of the support structure P may be located between the material of the defining structure 300 surrounding the second opening 310ab and the material of the first encapsulation structure 400.

[0452] like Figure 44As shown, the material of the third light-emitting device 200c is then vapor-deposited across the entire surface, ensuring that the material of the third light-emitting device 200c is present within each defined opening 300a. Then, the material of the first encapsulation structure 400 is prepared across the entire surface, ensuring that the material of the third light-emitting device 200c within each defined opening 300a is covered by the material of the first encapsulation structure 400. Then as... Figure 45 As shown, the material of the third light-emitting device 200c and the material of the first encapsulation structure 400 within the other defined openings 300a besides the third opening 310ac can be removed to form the material of the third light-emitting device 200c located at least partially within the third opening 310ac and the material of the first encapsulation structure 400 located at least partially within the third opening 310ac. The material of this portion of the first encapsulation structure 400 can be used to participate in the formation of the first encapsulation structure 400 located in the third encapsulation region 400f.

[0453] In this process, when preparing the materials for the third light-emitting device 200c and the first encapsulation structure 400, at least a portion of the material of the support structure P is provided between the materials of the limiting structure 300 that encloses the second opening 310ab and the first encapsulation structure 400. This allows the material of the support structure P to better support and connect with the material of the first encapsulation structure 400 that is spaced apart from the limiting structure 300 that encloses the second opening 310ab. This makes it less likely for the material of the first encapsulation structure 400 to detach or fall off when preparing or patterning the materials for the third light-emitting device 200c and the first encapsulation structure 400. This can better improve the structural stability of the finally formed first encapsulation structure 400 and support structure P, thereby improving the encapsulation reliability of the display panel 10 and thus improving the encapsulation effect of the display panel 10.

[0454] In some optional embodiments, the support structure P may not be provided above the first packaging structure 400 located in the third packaging region 400f, in order to reduce material costs and reduce the manufacturing process steps of the support structure P, thereby improving the manufacturing efficiency of the display panel 10.

[0455] In some alternative embodiments, at least part of the support structure P may also be located between the side segment 420 and the defining structure 300 within the third encapsulation region 400f.

[0456] In this optional embodiment, such as Figure 46As shown, after the third light-emitting device 200c and the first encapsulation structure 400 in the third region above the third light-emitting device 200c are prepared, the material of the support structure P can be prepared above the first encapsulation structure 400 in the third region to form another part of the support structure P, for example, to form another part of the first encapsulation portion P1 located in the first opening 310aa, and / or to form another part of the second encapsulation portion P2 and another part of the third encapsulation portion P3 located on the defining structure 300 surrounding the first opening 310aa. At least a portion of the support structure P is located between the side segment 420 and the limiting structure 300 within the third encapsulation region 400f. This allows the material of the support structure P to better support, connect, and enclose the material of the first encapsulation structure 400 that forms the third opening 310ac. Consequently, during the subsequent fabrication or patterning of other film structures, the material of the first encapsulation structure 400 is less likely to detach or fall off. This significantly improves the structural stability of the final first encapsulation structure 400 and the support structure P, thereby enhancing the encapsulation reliability of the display panel 10 and ultimately improving the encapsulation effect of the display panel 10.

[0457] In the display panel 10 of any of the foregoing embodiments, optionally, the first encapsulation part P1 can be enclosed to form a light-transmitting opening P1a. The orthographic projection of the light-transmitting opening P1a on the substrate 100 and the orthographic projection of the light-emitting device 200 on the substrate 100 are at least partially overlapped, so that the light emitted by the light-emitting device 200 can be emitted outward through the light-transmitting opening P1a. This can reduce the blocking effect of the support structure P on the light emitted by the light-emitting device 200 and can better improve the display effect of the display panel 10.

[0458] Figure 48 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0459] Or optional, such as Figure 48 As shown, the support structure P may not have a light-transmitting opening P1a. For example, the support structure P may also include a fourth encapsulation part P4 disposed on the side of the first portion 410 away from the substrate 100 and connected to the first encapsulation part P1. This eliminates the need for an additional process step of creating the light-transmitting opening P1a during the fabrication of the support structure P, thereby improving the fabrication efficiency of the support structure P. The fourth encapsulation part P4 may be fabricated together with at least one of the first encapsulation part P1, the second encapsulation part P2, and the third encapsulation part P3. For example, the first encapsulation part P1, the second encapsulation part P2, the third encapsulation part P3, and the fourth encapsulation part P4 may be integrally formed.

[0460] Optionally, the material of the support structure P includes a transparent organic material, so that the light emitted by the light-emitting device 200 can pass through the support structure P better, thereby reducing the shading effect of the support structure P on the light emitted by the light-emitting device 200.

[0461] In some alternative embodiments, the defining structure 300 may further include a third isolation portion 313 disposed on the side of the isolation structure 310 facing the substrate 100, at least a portion of the third isolation portion 313 protruding relative to the isolation structure 310 toward the defining opening 300a to connect with the first electrode 230.

[0462] Optionally, the material of the third isolation portion 313 may include a conductive material.

[0463] In these optional embodiments, by providing a third isolation portion 313 below the isolation structure 310 and connecting the third isolation portion 313 to the first electrode 230, the first electrodes 230 within adjacent defined openings 300a can be electrically connected through the third isolation portion 313, thereby facilitating control of the first electrodes 230. By providing a small portion of the third isolation portion 313 protruding relative to the isolation structure 310 toward the defined opening 300a, the overlap between the first electrode 230 and the third isolation portion 313 can be facilitated, and the overlap area between the first electrode 230 and the third isolation portion 313 can be significantly increased, thereby reducing the resistance of the display panel 10.

[0464] Optionally, the limiting structure 300 also includes a pixel limiting portion 321 disposed between adjacent second electrodes 210. The adjacent second electrodes 210 can be insulated from each other by the pixel limiting portion 321, and the pixel limiting portion 321 facilitates the division of sub-pixels in the display panel 10.

[0465] Optionally, the defined opening 300a may also include a pixel opening 320a formed by the pixel defining portion 321.

[0466] In the embodiments of this application, the isolation structure 310 can be configured in various ways. The shape of the isolation structure 310 can be any shape of material that can block and isolate the light-emitting device 200.

[0467] In some alternative embodiments, such as Figures 34 to 48As shown, the isolation structure 310 includes a first isolation portion 311 and a second isolation portion 312 located on the side of the first isolation portion 311 facing away from the substrate 100. The orthographic projection of the first isolation portion 311 on the substrate 100 lies within the orthographic projection of the second isolation portion 312 on the substrate 100. The second isolation portion 312 protrudes from the first isolation portion 311 toward the defined opening 300a, thereby improving the shielding and blocking effect of the second isolation portion 312 on the material of the light-emitting device 200. The first end portion 310b may be located in the first isolation portion 311, and the second end portion 310c may be located in the second isolation portion 312.

[0468] Optionally, the first isolation portion 311 may include a conductive material, and the first electrode 230 may be electrically connected to the first isolation portion 311.

[0469] Figure 49 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0470] In some other alternative embodiments, such as Figure 49 As shown, in the direction away from the substrate 100, the distance between the two surfaces of the isolation structure 310 toward the defining opening 300a gradually increases, so as to form a shape in which the orthographic projection of the first end 310b on the substrate 100 is located within the orthographic projection of the second end 310c on the substrate 100.

[0471] An embodiment of the first aspect of this application also provides a display panel 10. In some of the figures, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationship of the relevant structures in the display panel. In this spatial rectangular coordinate system, the Z-axis and Y-axis are parallel to the plane where the substrate is located, and the X-axis is perpendicular to the plane where the substrate is located.

[0472] like Figures 50 to 53 As shown, the planar area of ​​the display panel 10 can be divided into a display area AA and a bezel area NA surrounding the display area AA. The display area AA can contain sub-pixels (also called sub-pixels, etc.), such as R, G, and B sub-pixels. The physical structure of these sub-pixels can be a light-emitting device. Adjacent sub-pixels emitting light of different colors constitute a pixel (also called a pixel unit, large pixel, etc.). The density of these pixels in the display area AA represents the pixel density (PPI). It should be noted that in some embodiments of this disclosure, some traces in the bezel area NA can be routed into the display area AA, thereby allowing the bezel area NA to be designed as a single-sided bezel.

[0473] The physical structure of the display panel 10 may include a substrate 100 and a display functional layer and an isolation structure 310 located on the substrate 100. The display functional layer includes a plurality of light-emitting devices 200.

[0474] The isolation structure 310 is located on the substrate 100 and defines a plurality of isolation openings 310a. That is, the planar shape of the isolation structure 310 is a grid pattern, and the isolation openings 310a are meshes of the grid pattern. The isolation structure 310 includes a first isolation portion 311 facing the substrate 100 and a second isolation portion 312 facing away from the substrate 100. The orthographic projection of the first isolation portion 311 on the substrate 100 is located within the orthographic projection of the second isolation portion 312 on the substrate 100. That is, the isolation structure 310 is generally wider at the top and narrower at the bottom, so that when a portion of the film layer (such as the light-emitting unit described below) in the light-emitting device 200 is deposited, it is interrupted at the edge of the isolation structure 310 to reduce the risk of crosstalk between adjacent light-emitting devices.

[0475] The side of the light-emitting device 200 and the isolation structure 310 facing away from the substrate 100 is covered by a first encapsulation structure 400. Due to the top-wide and bottom-narrow design of the isolation structure 310, a gap space 400a is formed on one side of the isolation structure 310 by the first encapsulatio...

Claims

1. A display panel, characterized by, include: substrate; An isolation structure is disposed on one side of a substrate and encloses a plurality of isolation openings. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion has an eave portion protruding from the first isolation portion toward the side of the isolation opening. Multiple light-emitting devices, at least a portion of the structure of the light-emitting devices being located within the isolation opening; A first encapsulation structure is disposed on the side of the light-emitting device away from the substrate. The first encapsulation structure includes a first portion, a second portion, and a third portion. The first portion covers the side of the light-emitting device away from the substrate. The second portion covers the side of the first isolation portion facing the isolation opening. The third portion is at least partially located on the side of the second isolation portion facing the substrate and is at least partially attached to the eaves. The first portion, the second portion, and the third portion enclose a gap space. The third portion is at least partially connected to the first portion to form a connecting portion. The protruding length of at least a portion of the eaves corresponding to a portion of the isolation opening is greater than that of at least a portion of the eaves corresponding to another portion of the isolation opening.

2. The display panel according to claim 1, characterized in that, At least a portion of the connecting portion within the isolation opening has an annular orthogonal projection shape on the substrate to make the gap space a sealed space. And / or, at least part of the first portion within the isolation opening and the third portion are at least partially spaced apart and form a communicating opening.

3. The display panel according to claim 2, characterized in that, At least a portion of the first portion within the isolation opening has its surface facing away from the substrate at least partially spaced from the surface of the third portion near the isolation opening, forming at least one communicating opening. At least a portion of the communicating openings within the isolation openings have an annular orthographic projection shape on the substrate; And / or, at least some of the isolation openings contain a plurality of connecting openings, which are spaced apart.

4. The display panel according to claim 3, characterized in that, At least a portion of the connecting opening is provided with a sealing structure, one side of which is connected to the surface of the first portion, and the other side of which is connected to the surface of the third portion.

5. The display panel according to claim 1, characterized in that, At least a portion of the gap space is filled with a support structure.

6. The display panel according to claim 5, characterized in that, It also includes a second encapsulation layer disposed on the side of the first encapsulation structure away from the substrate, wherein at least a portion of the first portion in the isolation opening is at least partially spaced from the side surface of the first portion away from the substrate and at least a portion of the third portion is at least partially spaced from the side surface of the isolation opening to form a communicating opening, and at least a portion of the second encapsulation layer is located in the gap space to form the support structure.

7. The display panel according to claim 1, characterized in that, The dimension of the first isolation portion in the thickness direction of the display panel is a first height, and the ratio of the protruding length of at least a portion of the eaves to the first height is not greater than 1.

25.

8. The display panel according to claim 1, characterized in that, It also includes a pixel definition layer disposed on the side of the substrate facing the light-emitting device. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The isolation structure is disposed on the side of the pixel defining portion away from the substrate. The pixel opening communicates with the isolation opening. The first portion includes a first main body portion and a second main body portion that are interconnected. The first main body portion is located within the pixel opening, and the second main body portion is located on the side of the pixel defining portion opposite to the substrate. There is a first gap between the surface of the eaves facing the substrate and the surface of the pixel defining portion facing away from the substrate. The ratio of the maximum thickness of at least a portion of the first main body portion to the first spacing is not less than 1.25; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion to the first spacing is not less than 1.

25.

9. The display panel according to claim 8, characterized in that, The ratio of the maximum thickness of at least a portion of the first main body portion to the first spacing is 1.5-2.

5.

10. The display panel according to claim 8, characterized in that, The dimension of the first isolation portion in the thickness direction of the display panel is a first height, the ratio of the maximum thickness of at least a portion of the first main body portion to the first height is not less than 1.4, and / or the ratio of the maximum thickness of at least a portion of the second main body portion to the first height is not less than 1.

25.

11. The display panel according to claim 10, characterized in that, The ratio of the maximum thickness of at least a portion of the first main body portion to the first height is not less than 1.617, and / or the ratio of the maximum thickness of at least a portion of the second main body portion to the first height is not less than 1.

389.

12. The display panel according to claim 8, characterized in that, There is a second distance between the surface of the eaves facing the substrate and the surface of the light-emitting device facing away from the substrate, and the ratio of the maximum thickness of at least a portion of the first main body portion to the second distance is not less than 1, and / or the ratio of the maximum thickness of at least a portion of the second main body portion to the second distance is not less than 1.

13. The display panel according to any one of claims 8 to 12, characterized in that, The second main body portion includes a first main body sub-part and a second main body sub-part connected to each other. The orthographic projection of the first main body sub-part on the substrate is outside the orthographic projection of the second isolation portion on the substrate, and the orthographic projection of the second main body sub-part on the substrate is inside the orthographic projection of the second isolation portion on the substrate. The ratio of the maximum thickness of at least a portion of the first main body sub-part to the first spacing is not less than 1.

25.

14. The display panel according to claim 1, characterized in that, The isolation opening includes a first opening and a third opening, and the light-emitting device includes a first light-emitting device disposed corresponding to the first opening and a third light-emitting device disposed corresponding to the third opening. The gap space inside the first opening is a sealed space. And / or, the gap space within the third opening forms at least one connecting opening, and the connecting opening within the third opening is annular.

15. The display panel according to claim 14, characterized in that, The first packaging structure includes a first packaging unit located at least partially within the first opening and a third packaging unit located at least partially within the third opening, wherein the maximum thickness of the first packaging unit is greater than the maximum thickness of the third packaging unit.

16. The display panel according to claim 15, characterized in that, The display panel further includes a pixel definition layer disposed on the side of the substrate facing the light-emitting device. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The isolation structure is disposed on the side of the pixel defining portion away from the substrate, and the pixel opening communicates with the isolation opening. The first portion includes a first main body portion and a second main body portion that are interconnected. The first main body portion is located within the pixel opening, and the second main body portion is located on the side of the pixel defining portion opposite to the substrate. There is a first gap between the surface of the eaves facing the substrate and the surface of the pixel defining portion facing away from the substrate. The ratio of the maximum thickness of at least a portion of the first main body portion of the first packaging unit to the first spacing is not less than 1.25; and / or, the ratio of the maximum thickness of at least a portion of the second main body portion of the first packaging unit to the first spacing is not less than 1.

25.

17. The display panel according to claim 14, characterized in that, The distance between at least a portion of the second isolation portion that participates in forming the first opening and the substrate is smaller than the distance between the second isolation portion that participates in forming the third opening and the substrate.

18. The display panel according to claim 14, characterized in that, The eaves portion includes a first eaves portion corresponding to the first opening and a third eaves portion corresponding to the third opening, wherein the protruding length of the first eaves portion is less than the protruding length of the third eaves portion.

19. The display panel according to any one of claims 14 to 18, characterized in that, The isolation opening further includes a second opening, and the light-emitting device includes a second light-emitting device disposed corresponding to the second opening. The gap space inside the second opening is a sealed space. Alternatively, the gap space within the second opening forms at least one communicating opening.

20. The display panel according to claim 19, characterized in that, The first packaging structure includes a first packaging unit located at least partially within the first opening, a second packaging unit located at least partially within the second opening, and a third packaging unit located at least partially within the third opening, wherein the maximum thickness of the second packaging unit is greater than or equal to the maximum thickness of the third packaging unit. And / or, the maximum thickness of the second packaging unit is less than or equal to the maximum thickness of the first packaging unit.

21. The display panel according to claim 19, characterized in that, The distance between at least a portion of the second isolation portion that participates in enclosing and forming the second opening and the substrate is greater than or equal to the distance between the second isolation portion that participates in enclosing and forming the first opening and the substrate. And / or, the distance between at least a portion of the second isolation portion that participates in enclosing and forming the second opening and the substrate is less than or equal to the distance between the second isolation portion that participates in enclosing and forming the third opening and the substrate.

22. The display panel according to claim 21, characterized in that, The dimension of at least a portion of the first isolation portion that participates in enclosing and forming the second opening in the thickness direction of the display panel is greater than or equal to the dimension of the first isolation portion that participates in enclosing and forming the first opening in the thickness direction of the display panel. And / or, the dimension of at least a portion of the first isolation portion that participates in enclosing and forming the second opening in the thickness direction of the display panel is less than or equal to the dimension of the first isolation portion that participates in enclosing and forming the third opening in the thickness direction of the display panel.

23. The display panel according to claim 19, characterized in that, The eaves include a first eaves corresponding to the first opening, a second eaves corresponding to the second opening, and a third eaves corresponding to the third opening. The protruding length of the second eave is less than or equal to the protruding length of the third eave; And / or, the protruding length of the second eave is greater than or equal to the protruding length of the first eave.

24. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of a substrate and encloses a plurality of isolation openings. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion has an eave portion protruding from the first isolation portion toward the side of the isolation opening. Multiple light-emitting devices, at least a portion of the structure of each light-emitting device being located within the isolation opening, each light-emitting device including a light-emitting unit and a first electrode located on the side of the light-emitting unit facing away from the substrate; A first encapsulation structure is disposed on the side of the light-emitting device facing away from the substrate. The first encapsulation structure includes a first portion, a second portion, and a third portion. The first portion covers the side of the light-emitting device facing away from the substrate. The second portion covers the side of the first isolation portion facing the isolation opening. The third portion is at least partially located on the side of the second isolation portion facing the substrate and at least partially attached to the eaves. The first portion, the second portion, and the third portion enclose a gap space. At least a portion of the first portion and the third portion within the isolation opening are at least partially spaced apart and form a communicating opening. The minimum dimension of the connecting opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thicknesses of at least a portion of the light-emitting unit of the light-emitting device and the first electrode, and the sealing coefficient.

25. The display panel according to claim 24, characterized in that, The minimum dimension of the connecting opening in the thickness direction of the display panel is less than or equal to the size of the opening between at least a portion of the light-emitting unit of the light-emitting device and the first electrode.

26. The display panel according to claim 24, characterized in that, The minimum dimension of the connecting opening in the thickness direction of the display panel is less than or equal to the sum of the thickness of at least a portion of the light-emitting unit of the light-emitting device and the thickness of the first electrode.

27. The display panel according to claim 24, characterized in that, The isolation opening includes a first opening, a second opening, and a third opening; the light-emitting device includes a first light-emitting device corresponding to the first opening, a second light-emitting device corresponding to the second opening, and a third light-emitting device corresponding to the third opening. The third portion within the first opening is at least partially connected to the surface of the first portion on the side away from the substrate to form a connecting portion, and the orthographic projection of the connecting portion within the first opening onto the substrate is annular to make the gap space within the first opening a sealed space. Alternatively, the gap space within the first opening forms at least one of the communicating openings.

28. The display panel according to claim 27, characterized in that, The gap space within the first opening forms at least one of the communicating openings. The minimum dimension of the communicating opening within the first opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thickness of the light-emitting unit of the second light-emitting device and the thickness of the first electrode and the corresponding sealing coefficient. And / or, the minimum dimension of the connecting opening within the first opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thicknesses of the light-emitting unit of the third light-emitting device and the first electrode, and the corresponding sealing coefficient.

29. The display panel according to claim 28, characterized in that, The dimension of the connecting opening within the first opening in the thickness direction of the display panel is less than or equal to the thickness of the light-emitting unit of the second light-emitting device; And / or, the dimension of the communicating opening within the first opening in the thickness direction of the display panel is less than or equal to the thickness of the light-emitting unit of the third light-emitting device.

30. The display panel according to claim 27, characterized in that, The third portion within the second opening is at least partially connected to the surface of the first portion on the side away from the substrate to form a connecting portion, and the orthographic projection of the connecting portion within the second opening onto the substrate is annular to form a sealed gap space within the gap space of the second opening. Alternatively, the gap space within the second opening forms at least one of the communicating openings.

31. The display panel according to claim 30, characterized in that, The gap space within the second opening forms at least one of the connecting openings. The minimum dimension of the connecting opening within the second opening in the thickness direction of the display panel is less than or equal to the product of the sum of the thicknesses of the light-emitting unit of the third light-emitting device and the first electrode, and the corresponding sealing coefficient.

32. The display panel according to claim 31, characterized in that, The dimension of the connecting opening within the second opening in the thickness direction of the display panel is less than or equal to the thickness of the light-emitting unit of the third light-emitting device.

33. The display panel according to any one of claims 27 to 32, characterized in that, The gap space within the first opening and the third opening forms at least one communicating opening, wherein the dimension of the communicating opening within the first opening in the thickness direction of the display panel is smaller than the dimension of the communicating opening within the third opening in the thickness direction of the display panel.

34. The display panel according to claim 33, characterized in that, The first packaging structure includes a first packaging unit located at least partially within the first opening and a third packaging unit located at least partially within the third opening, wherein the maximum thickness of the first packaging unit is greater than the maximum thickness of the third packaging unit.

35. The display panel according to claim 33, characterized in that, The gap space within the second opening forms at least one of the communicating openings. The dimension of the connecting opening within the second opening in the thickness direction of the display panel is less than or equal to the dimension of the connecting opening within the third opening in the thickness direction of the display panel; And / or, the dimension of the connecting opening in the second opening in the thickness direction of the display panel is greater than or equal to the dimension of the connecting opening in the first opening in the thickness direction of the display panel.

36. The display panel according to claim 35, characterized in that, The first packaging structure includes a first packaging unit at least partially located within the first opening, a second packaging unit at least partially located within the second opening, and a third packaging unit at least partially located within the third opening. The maximum thickness of the second packaging unit is greater than or equal to the maximum thickness of the third packaging unit; And / or, the maximum thickness of the second packaging unit is less than or equal to the maximum thickness of the first packaging unit.

37. The display panel according to claim 35, characterized in that, The distance between at least a portion of the second isolation portion that participates in enclosing and forming the second opening and the substrate is greater than or equal to the distance between the second isolation portion that participates in enclosing and forming the first opening and the substrate. And / or, the distance between at least a portion of the second isolation portion that participates in enclosing and forming the second opening and the substrate is less than or equal to the distance between the second isolation portion that participates in enclosing and forming the third opening and the substrate.

38. The display panel according to claim 37, characterized in that, The dimension of at least a portion of the first isolation portion that participates in enclosing and forming the second opening in the thickness direction of the display panel is greater than or equal to the dimension of the first isolation portion that participates in enclosing and forming the first opening in the thickness direction of the display panel. And / or, the dimension of at least a portion of the first isolation portion that participates in enclosing and forming the second opening in the thickness direction of the display panel is less than or equal to the dimension of the first isolation portion that participates in enclosing and forming the third opening in the thickness direction of the display panel.

39. The display panel according to claim 35, characterized in that, The eaves include a first eaves corresponding to the first opening, a second eaves corresponding to the second opening, and a third eaves corresponding to the third opening. The protruding length of the second eave is less than or equal to the protruding length of the third eave; And / or, the protruding length of the second eave is greater than or equal to the protruding length of the first eave.

40. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of a substrate and encloses an isolation opening. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion has an eave portion protruding from the first isolation portion toward the side of the isolation opening. The light-emitting device is at least partially located within the isolation opening; A first encapsulation structure is disposed on the side of the light-emitting device away from the substrate. The first encapsulation structure includes a first portion and a second segment. The first portion is located within the isolation opening and disposed on the side of the light-emitting device away from the substrate. The second segment is located on the side of the isolation structure facing the isolation opening. The surface of the first portion away from the substrate and the surface of the second segment away from the isolation structure are at least partially connected to each other to form a gap space. The protruding length of at least a portion of the eaves of the corresponding part of the isolation opening is greater than that of at least a portion of the eaves of the corresponding other part of the isolation opening.

41. The display panel according to claim 40, characterized in that, The first segment includes a main body and a support portion that protrudes from the main body toward the second segment, and the support portion is connected to the second segment.

42. The display panel according to claim 41, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion facing away from the substrate, the second isolation portion protruding from the first isolation portion toward the isolation opening. The second segment includes a third segment disposed on the side of the second isolation portion facing the isolation opening, and the support portion is connected to the third segment to enclose and form the gap space.

43. The display panel according to claim 41, characterized in that, The support portion has a ring-shaped orthographic projection on the substrate, and the support portion is connected to the second segment so that the first segment and the second segment enclose the gap space.

44. A method for manufacturing a display panel, characterized in that, include: An isolation structure is fabricated on a substrate, the isolation structure enclosing an isolation opening, the isolation opening including a first opening and a second opening, the isolation structure including a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, the second isolation portion having a protruding eave portion protruding from the first isolation portion toward the side of the isolation opening; The first device material layer and the first encapsulation material layer are sequentially prepared across the entire surface; The first encapsulation material layer and the first device material layer outside the first opening are etched away to form a first light-emitting device corresponding to the first opening and a first encapsulation unit located on the side of the first light-emitting device away from the substrate. The first encapsulation unit includes a first portion, a second portion and a third portion. The first portion covers the side of the light-emitting device away from the substrate, the second portion covers the side of the first isolation portion facing the isolation opening, and the third portion is at least partially located on the side of the second isolation portion facing the substrate and at least partially attached to the eaves. The first portion, the second portion and the third portion of the first encapsulation unit enclose a gap space, and the gap space of the first encapsulation unit has a communicating opening. The second device material layer and the second encapsulation material layer are prepared sequentially on the entire surface. The second device material layer includes a light-emitting unit material layer and a first electrode material layer. The first electrode material layer of the second device material layer is continuous on the side of the first encapsulation unit away from the substrate and blocks the communication opening of the first encapsulation unit. The second encapsulation material layer outside the second opening is etched away using a first etching method, and then the second device material layer is etched away using a second etching method to form a second light-emitting device corresponding to the second opening and a second encapsulation unit located on the side of the second light-emitting device away from the substrate.

45. The preparation method according to claim 44, characterized in that, Both the first packaging unit and the second packaging unit include a first portion, a second portion, and a third portion. The first portion, the second portion, and the third portion of the second packaging unit enclose a gap space, and the gap space of the second packaging unit has a communicating opening. The isolation opening further includes a third opening. After the steps of etching away the second packaging material layer outside the second opening using a first etching method and then etching away the second device material layer using a second etching method, the method further includes: A third device material layer and a third encapsulation material layer are sequentially prepared on the entire surface. The third device material layer includes a light-emitting unit material layer and a first electrode material layer. The first electrode material layer of the third device material layer is continuous on the side of the first encapsulation unit away from the substrate and blocks the communication opening of the first encapsulation unit. And / or, the third device material layer is continuous on the side of the second encapsulation unit away from the substrate and blocks the communication opening of the second encapsulation unit. The third packaging material layer outside the third opening is removed by etching using the first etching method, and then the third device material layer is removed by etching using the second etching method to form a third light-emitting device corresponding to the third opening and a third packaging unit located on the side of the third light-emitting device away from the substrate.

46. ​​A display device, characterized in that, This includes a display panel as described in any one of claims 1 to 43 or a display panel prepared by any one of claims 44 to 45.

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