Sandwich board cutting device and sandwich board cutting method

CN119839953APending Publication Date: 2025-04-18QINGDAO CIMC CHUANGYING COMPOSITE MATERIAL TECH CO +2
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Patent Information

Application Number
CN202411940610.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2025-04-18

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Abstract

The invention provides a laminboard cutting device and a laminboard cutting method. The laminboard cutting device comprises a cutting assembly, the cutting assembly comprises a first cutting piece, a second cutting piece and a third cutting piece, the first cutting piece and the second cutting piece are oppositely arranged to cut a first surface layer and a second surface layer of a laminboard respectively, and the third cutting piece is arranged on the downstream of the first cutting piece and the second cutting piece in the cutting direction to cut a core layer of the laminboard. In the projection plane of the laminboard cutting device in the cutting direction, the cutting part, making contact with the laminboard, of the first cutting piece, the cutting part, making contact with the laminboard, of the second cutting piece and the cutting part, making contact with the laminboard, of the third cutting piece are located on the same straight line, and the third cutting piece covers a gap between the first cutting piece and the second cutting piece. The laminboard cutting device can solve the problems of fiber pulling, hot melting chippings, fiber breaking and edge breaking of the board, the quality of the cut laminboard is improved, the cutting difficulty is reduced, the cutting efficiency is guaranteed, and the service life of a cutting piece is prolonged.
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