Chip inversion platform and control method and device thereof, and storage medium

Abstract

The invention provides a chip inversion platform and a control method and device thereof, and a storage medium. The chip inversion platform comprises a rotating disc, and the upper surface of the rotating disc is provided with a plurality of chip suction nozzles; the material taking assembly comprises a first rotating motor and a material taking suction nozzle, the avoiding mechanism is used for driving the material taking assembly to be close to or away from the material placing assembly, and in the state that the material taking assembly is close to the material placing assembly, the material taking suction nozzle is located below the material placing assembly; the discharging assembly comprises a first lifting mechanism and a discharging suction nozzle fixed to the first lifting mechanism. The first CCD device and the second CCD device are located above the rotating disc, and the first CCD device, the discharging assembly and the second CCD device are sequentially distributed in the circumferential direction; and the controller is in communication connection with the rotating disc, the material taking assembly, the avoiding mechanism, the material placing assembly, the first CCD device and the second CCD device. According to the technical scheme of the embodiment of the invention, automatic overturning of the chip and CCD detection before and after overturning can be realized, and the front and back surface detection efficiency of the chip is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a chip flipping platform and a control method, device and storage medium thereof. Background Art

[0002] During the chip production process, the front and back sides of the chip are inspected by testing equipment according to production requirements.

[0003] At present, for the front and back side inspection of the chip, the front side CCD inspection of the chip is carried out, and then the CCD is manually flipped over, and then the back side CCD inspection is carried out to obtain the surface inspection result of the chip. However, this method requires the chip to be flipped again for the chip that needs to be installed upright, and during the manual flipping process, there may be a situation where the chip fails to flip successfully, and the chip needs to be selected and flipped again. Manual chip flipping is inefficient and time-consuming, which is not conducive to large-scale production by manufacturers. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a chip flipping platform and its control method, device, and storage medium, which can realize automatic chip flipping and CCD detection before and after flipping, thereby improving the front and back detection efficiency of the chip.

[0005] In a first aspect, an embodiment of the present invention provides a chip flipping platform, comprising: A turntable, wherein a plurality of chip suction nozzles are arranged on the upper surface of the turntable; A material picking assembly, an avoidance mechanism and a material discharging assembly, wherein the material picking assembly comprises a first rotating motor and a material picking nozzle, and under the drive of the first rotating motor, the material picking nozzle rotates circumferentially, and the avoidance mechanism is used to drive the material picking assembly to approach or move away from the material discharging assembly, and when the material picking assembly is close to the material discharging assembly, the material picking nozzle is located below the material discharging assembly, and the material discharging assembly comprises a first lifting mechanism and a material discharging nozzle, and the material discharging nozzle is fixed to the first lifting mechanism, and under the drive of the first lifting mechanism, the material discharging nozzle moves in a vertical direction; A first CCD device and a second CCD device, wherein the first CCD device, the unloading assembly and the second CCD device are sequentially distributed along the circumferential direction, and the first CCD device and the second CCD device are located above the rotating disk; A controller is communicatively connected to the turntable, the material taking assembly, the avoidance mechanism, the material discharging assembly, the first CCD device and the second CCD device.

[0006] According to some embodiments of the present invention, the material picking assembly includes a second lifting mechanism and a first mounting plate, the second lifting mechanism is fixed to the first mounting plate, the material picking nozzle and the first rotating motor are fixed to the second lifting mechanism, and under the drive of the second lifting mechanism, the material picking nozzle and the first rotating motor move in a vertical direction, and the avoidance mechanism includes a first transmission block, a second rotating motor and a connecting rod, the first transmission block is fixed to the rotating shaft of the second rotating motor, one end of the connecting rod is fixed to one end of the first transmission block, and the other end of the connecting rod is fixed to the first mounting plate, and under the drive of the second rotating motor, the first transmission block and the connecting rod drive the first mounting plate to approach or move away from the material discharge assembly.

[0007] According to some embodiments of the present invention, the first lifting mechanism includes a second mounting plate, a third rotating motor, a second transmission block and a limit plate, the second mounting plate is vertically fixed, the third rotating motor is fixed to the second mounting plate, the second transmission block is fixed to the rotating shaft of the third rotating motor, a protrusion is provided at one end of the second transmission block, the limit plate is provided with a sliding groove, the protrusion is located in the sliding groove, the discharge suction nozzle is fixed to the limit plate, and the limit plate slides on the second mounting plate in a vertical direction.

[0008] In a second aspect, an embodiment of the present invention provides a control method for a chip flipping platform, which is applied to the chip flipping platform described in the first aspect, wherein the plurality of chip suction nozzles include a first chip suction nozzle, and the method comprises: After the first chip suction nozzle sucks the first chip, the controller controls the turntable to rotate so that the first chip suction nozzle is located below the first CCD device, and controls the first CCD device to perform CCD detection on the first chip to obtain a first front CCD result; The first chip suction nozzle is controlled to continue to rotate to the bottom of the material picking component, the controller controls the material picking nozzle to pick up the first chip, controls the first rotating motor to rotate the material picking nozzle, and then controls the material placing nozzle to pick up the first chip, controls the avoidance mechanism to drive the material picking component away from the material placing component, and then controls the first lifting mechanism to move downward, so that the material placing nozzle places the first chip on the first chip suction nozzle; Control the first chip suction nozzle to continue to rotate to below the second CCD device, and the controller controls the second CCD device to perform CCD detection on the first chip to obtain a first back CCD result; The first chip suction nozzle is controlled to continue rotating to the unloading position for unloading, and the next first chip is placed in the first chip suction nozzle.

[0009] According to some embodiments of the present invention, the plurality of chip suction nozzles further comprises a second chip suction nozzle, and the second chip suction nozzle is located behind the first chip suction nozzle; Before the controller controls the turntable to rotate so that the first chip suction nozzle is located below the first CCD device, the method includes: Control the turntable to rotate, when the first chip suction nozzle leaves the loading position, the second chip suction nozzle enters the loading position, the controller controls the second chip suction nozzle to suck the second chip, controls the second chip to rotate to the bottom of the first CCD device, and controls the first CCD device to perform CCD detection on the second chip to obtain a second front CCD result; Control the second chip suction nozzle to continue to rotate to the bottom of the picking assembly, and control the picking assembly, the placing assembly and the avoidance mechanism so that the second chip suction nozzle located below the placing suction nozzle can pick up the flipped second chip; Control the second chip suction nozzle to continue to rotate to below the second CCD device, and control the second CCD device to perform CCD detection on the second chip to obtain a second back CCD result; The second chip suction nozzle is controlled to continue rotating to the unloading position to unload the chip, and the next second chip is placed in the second chip suction nozzle.

[0010] According to some embodiments of the present invention, before the first chip suction nozzle sucks the first chip, the method includes: Setting the working mode of the chip flipping platform; When the first chip suction nozzle rotates to the unloading position, if the working mode is the chip upright mode, the first chip suction nozzle is controlled to rotate to the bottom of the unloading suction nozzle, the material picking component, the unloading component and the avoidance mechanism are controlled to make the first chip flip again, and the first chip suction nozzle is controlled to rotate to the unloading position for the third time, and the first front CCD result and the first back CCD result are sent to an external device, the external device sucks the first chip, and the external device classifies the first chip based on the first front CCD result and the first back CCD result; When the first chip suction nozzle rotates to the unloading position, if the working mode is the chip flipping mode, the first front CCD result and the first back CCD result are sent to an external device, the external device sucks the first chip, and the external device classifies the first chip based on the first front CCD result and the first back CCD result.

[0011] According to some embodiments of the present invention, the material picking assembly includes a second lifting mechanism and a first mounting plate, the second lifting mechanism is fixed to the first mounting plate, the material picking nozzle and the first rotating motor are fixed to the second lifting mechanism, and under the drive of the second lifting mechanism, the material picking nozzle and the first rotating motor move in a vertical direction, and the avoidance mechanism includes a first transmission block, a second rotating motor and a connecting rod, the first transmission block is fixed to the rotating shaft of the second rotating motor, one end of the connecting rod is fixed to one end of the first transmission block, and the other end of the connecting rod is fixed to the first mounting plate, and under the drive of the second rotating motor, the first transmission block and the connecting rod drive the first mounting plate to approach or move away from the material discharging assembly; Controlling the avoidance mechanism so that the avoidance mechanism drives the material taking component away from the material discharging component, comprising: The second rotating motor is controlled to rotate so that the end of the first transmission block connected to the connecting rod rotates in a direction away from the discharge assembly, and the first mounting plate is driven to move in a direction away from the discharge assembly through the first transmission block and the connecting rod, and the second lifting mechanism, the material picking nozzle and the first rotating motor are driven to move in a direction away from the discharge assembly through the first mounting plate.

[0012] According to some embodiments of the present invention, the first lifting mechanism includes a second mounting plate, a third rotating motor, a second transmission block and a limit plate, the second mounting plate is vertically fixed, the third rotating motor is fixed to the second mounting plate, the second transmission block is fixed to the rotating shaft of the third rotating motor, a protrusion is provided at one end of the second transmission block, the limit plate is provided with a sliding groove, the protrusion is located in the sliding groove, the discharge suction nozzle is fixed to the limit plate, and the limit plate slides on the second mounting plate in a vertical direction; Controlling the first lifting mechanism to move downward so that the discharge nozzle places the first chip on the first chip nozzle includes: The third rotating motor is controlled to rotate so that the end of the second transmission block provided with the protrusion rotates downward, and the discharge nozzle is driven to move downward through the second transmission block and the limit plate. When the first chip abuts against the first chip nozzle, the discharge nozzle is controlled to place the first chip on the first chip nozzle.

[0013] In a third aspect, an embodiment of the present invention provides a control device for a chip flip-chip platform, comprising at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions executable by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the control method for the chip flip-chip platform as described in the second aspect above.

[0014] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute the control method of the chip flip-chip platform as described in the second aspect above.

[0015] According to the chip flipping platform of the embodiment of the present invention, there are at least the following beneficial effects: a turntable, a plurality of chip suction nozzles are arranged on the upper surface of the turntable; a material picking component, an avoidance mechanism and a material discharging component, the material picking component comprises a first rotating motor and a material picking nozzle, under the drive of the first rotating motor, the material picking nozzle rotates circumferentially, the avoidance mechanism is used to drive the material picking component to approach or move away from the material discharging component, when the material picking component is close to the material discharging component, the material picking nozzle is located below the material discharging component, the material discharging component comprises a first lifting mechanism and a material discharging nozzle, the material discharging nozzle is fixed to the first lifting mechanism, under the drive of the first lifting mechanism, the material discharging nozzle moves in a vertical direction; a first CCD device and a second CCD device, the first CCD device, the material discharging component and the second CCD device are sequentially distributed along the circumferential direction, and the first CCD device and the second CCD device are located above the turntable; a controller, the controller is communicatively connected to the turntable, the material picking component, the avoidance mechanism, the material discharging component, the first CCD device and the second CCD device. According to the technical solution of the embodiment of the present invention, the automatic flipping of the chip is realized through the material discharge component and the material pick-up component, and the automatic CCD detection of the chip before and after flipping is realized through the first CCD device and the second CCD device, thereby improving the front and back side detection efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of a chip flip-chip platform provided by one embodiment of the present invention; Figure 2 is a structural schematic diagram of a discharge assembly provided by another embodiment of the present invention; Figure 3 is a flow chart of a control method of a chip flipping platform provided by another embodiment of the present invention; Figure 4 It is a structural diagram of a control device of a chip flipping platform provided in another embodiment of the present invention. DETAILED DESCRIPTION

[0017] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0018] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0019] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0021] According to the chip flipping platform of the embodiment of the present invention, there are at least the following beneficial effects: a turntable, a plurality of chip suction nozzles are arranged on the upper surface of the turntable; a material picking component, an avoidance mechanism and a material discharging component, the material picking component comprises a first rotating motor and a material picking nozzle, under the drive of the first rotating motor, the material picking nozzle rotates circumferentially, the avoidance mechanism is used to drive the material picking component to approach or move away from the material discharging component, when the material picking component is close to the material discharging component, the material picking nozzle is located below the material discharging component, the material discharging component comprises a first lifting mechanism and a material discharging nozzle, the material discharging nozzle is fixed to the first lifting mechanism, under the drive of the first lifting mechanism, the material discharging nozzle moves in a vertical direction; a first CCD device and a second CCD device, the first CCD device, the material discharging component and the second CCD device are sequentially distributed along the circumferential direction, and the first CCD device and the second CCD device are located above the turntable; a controller, the controller is communicatively connected to the turntable, the material picking component, the avoidance mechanism, the material discharging component, the first CCD device and the second CCD device. According to the technical solution of the embodiment of the present invention, the automatic flipping of the chip is realized through the material discharge component and the material pick-up component, and the automatic CCD detection of the chip before and after flipping is realized through the first CCD device and the second CCD device, thereby improving the front and back side detection efficiency of the chip.

[0022] First, refer to Figure 1 The chip flipping platform provided in the embodiment of the present application includes: A turntable 10, wherein a plurality of chip suction nozzles 11 are arranged on the upper surface of the turntable 10; A material picking assembly, an avoidance mechanism and a material discharging assembly, wherein the material picking assembly comprises a first rotating motor 21 and a material picking nozzle 22. Under the drive of the first rotating motor 21, the material picking nozzle 22 rotates circumferentially. The avoidance mechanism is used to drive the material picking assembly to approach or move away from the material discharging assembly. When the material picking assembly is close to the material discharging assembly, the material picking nozzle 22 is located below the material discharging assembly. The material discharging assembly comprises a first lifting mechanism 41 and a material discharging nozzle 42. The material discharging nozzle 42 is fixed to the first lifting mechanism 41. Under the drive of the first lifting mechanism 41, the material discharging nozzle 42 moves in a vertical direction. A first CCD device and a second CCD device, the first CCD device, the unloading assembly and the second CCD device are sequentially distributed along the circumferential direction, and the first CCD device and the second CCD device are located above the turntable 10; The controller is communicatively connected to the turntable 10, the material taking component, the avoidance mechanism, the material discharging component, the first CCD device and the second CCD device.

[0023] It should be noted that the way in which the chip suction nozzle 11, the material collection nozzle 22 and the material discharge nozzle 42 suck up chips is prior art, and those skilled in the art know how to suck up chips through the suction nozzle. This application does not make any improvements to the way in which the suction nozzle sucks up chips, and will not be elaborated here.

[0024] It should be noted that, preferably, the plurality of chip suction nozzles 11 are evenly spaced, and the turntable 10 rotates at a fixed angle so that adjacent chip suction nozzles 11 pass under the detection device in sequence, thereby eliminating the step of driving the turntable 10 to rotate at different angles, and facilitating the control of the turntable 10. How to drive the turntable 10 to rotate is a prior art and will not be elaborated on here.

[0025] It should be noted that when the pick-up assembly is close to the discharge assembly, the pick-up nozzle 22 is located below the discharge nozzle 42. When the discharge nozzle 42 places a chip on the chip nozzle 11 located below the discharge nozzle 42, the pick-up assembly must first be moved away from the discharge assembly by the avoidance mechanism so that the discharge nozzle 42 will not be hindered during its downward movement. After the discharge nozzle 42 places the chip on the chip nozzle 11, the avoidance mechanism drives the pick-up assembly to approach the discharge assembly so that the pick-up assembly flips the next chip located below the discharge assembly.

[0026] It should be noted that those skilled in the art know how to perform surface defect detection on a chip by means of a CCD device. This application does not make any technical improvements to the surface defect detection on a chip by means of a CCD device, and will not be elaborated on here. The first CCD device, the discharge assembly, and the second CCD device are sequentially distributed along the circumferential direction, so that the chip passes through the first CCD device, the discharge assembly, and the second CCD device in sequence. The first CCD device performs CCD detection on the front side of the chip, and after the pick-up assembly, the avoidance mechanism, and the discharge assembly flip the chip, the second CCD device performs CCD detection on the back side of the chip.

[0027] It should be noted that the chip is placed on the chip suction nozzle 11 located at the loading position, and the chip suction nozzle 11 sucks the chip; the turntable 10 rotates so that the chip suction nozzle 11 located at the loading position rotates to the bottom of the first CCD device, and the first CCD device performs surface defect detection on the chip and generates a front CCD result, and sends the front CCD result to the controller. The material picking component is in a state close to the material discharging component, and the turntable 10 is controlled to rotate so that the chip suction nozzle 11 located below the first CCD device rotates to the bottom of the material picking nozzle 22. After the material picking nozzle 22 picks up the chip, the first rotating motor 21 drives the material picking nozzle 22 to rotate 180 degrees in the circumferential direction, so that the chip is flipped. At this time, the material picking nozzle 22 and the material discharging nozzle 42 are opposite to each other, and the material discharging nozzle 42 sucks the chip after the flipping is completed; the avoidance mechanism drives the material picking component away from the material discharging component, and then the first lifting mechanism 41 drives the material discharging nozzle 42 to move downward so that the chip abuts against the chip suction nozzle 11, and the chip suction nozzle 11 and the material discharging nozzle 42 are controlled so that the material discharging nozzle 42 places the chip on the chip suction nozzle 11, and the chip suction nozzle 11 sucks the chip; the chip suction nozzle 11 located below the material discharging nozzle 42 is controlled to rotate to the bottom of the second CCD device, and the second CCD device performs surface defect detection on the chip and generates a back CCD result, and sends the back CCD result to the controller. The chip suction nozzle 11 located below the second CCD device is controlled to rotate to the unloading position, and the external device unloads the chips, and classifies the unloaded chips based on the acquired front CCD results and back CCD results.

[0028] In addition, in one embodiment, referring to Figure 1 The material picking assembly includes a second lifting mechanism 23 and a first mounting plate 24, the second lifting mechanism 23 is fixed to the first mounting plate 24, the first rotating motor 21 and the material picking nozzle 22 are fixed to the second lifting mechanism 23, and under the drive of the second lifting mechanism 23, the first rotating motor 21 and the material picking nozzle 22 move in the vertical direction, and the avoidance mechanism includes a first transmission block 31, a second rotating motor 32 and a connecting rod 33, the first transmission block 31 is fixed to the rotating shaft of the second rotating motor 32, one end of the connecting rod 33 is fixed to one end of the first transmission block 31, and the other end of the connecting rod 33 is fixed to the first mounting plate 24, and under the drive of the second rotating motor 32, the first transmission block 31 and the connecting rod 33 drive the first mounting plate 24 to approach or move away from the material discharging assembly.

[0029] It should be noted that when the avoidance mechanism drives the material picking assembly away from the material discharging assembly, the second rotating motor 32 is driven to move the end of the first transmission block 31 connected to the connecting rod 33 in the direction away from the material discharging assembly, so that the connecting rod 33 moves in the direction away from the material discharging assembly. Driven by the connecting rod 33, the first mounting plate 24 and the second lifting mechanism 23 fixed to the first mounting plate 24, the material picking nozzle 22 and the first rotating motor 21, that is, the entire material picking assembly, move in the direction away from the material discharging assembly.

[0030] It should be noted that after the discharge assembly places the flipped chip on the chip suction nozzle 11, the avoidance mechanism drives the picking assembly to move towards the discharge assembly so that the picking assembly is located below the discharge assembly and the next chip is flipped through the picking assembly.

[0031] In addition, in one embodiment, referring to Figure 1 and Figure 2 The first lifting mechanism 41 includes a second mounting plate 411, a third rotating motor 412, a second transmission block 413 and a limiting plate 414. The second mounting plate 411 is vertically fixed, the third rotating motor 412 is fixed to the second mounting plate 411, the second transmission block 413 is fixed to the rotating shaft of the third rotating motor 412, a protrusion 4131 is provided at one end of the second transmission block 413, the limiting plate 414 is provided with a sliding groove 4141, the protrusion 4131 is located in the sliding groove 4141, the discharge suction nozzle 42 is fixed to the limiting plate 414, and the limiting plate 414 slides on the second mounting plate 411 in a vertical direction.

[0032] It should be noted that the second mounting plate 411 is vertically fixed to the ground or vertically fixed to the workbench of the chip flipping platform, the third rotating motor 412 is fixed to the second mounting plate 411, and the rotating shaft faces one side of the limit plate 414, the third rotating motor 412 drives the second transmission block 413 to rotate, so that the end of the second transmission block 413 provided with the protrusion 4131 rotates downward, and the downward rotation of the protrusion 4131 is converted into horizontal movement of the protrusion 4131 and the sliding groove 4141, and the protrusion 4131 drives the limit plate 414 to move downward, and the circumferential rotation of the second transmission block 413 is converted into a linear movement of the limit plate 414, thereby realizing the linear movement of the discharge suction nozzle 42 fixed to the limit plate 414.

[0033] It should be noted that when the discharge nozzle 42 sucks the chip located at the pick-up nozzle 22, or the flipped chip is placed on the chip nozzle 11, the discharge nozzle 42 is driven to move downward by the first lifting mechanism 41. When the discharge nozzle 42 has sucked the chip located at the pick-up nozzle 22, or the chip nozzle 11 has sucked the chip located at the discharge nozzle 42, the discharge nozzle 42 is driven to move upward by the first lifting mechanism 41.

[0034] In addition, the embodiment of the present invention provides a control method for a chip flipping platform, which is applied to Figure 1 and Figure 2 The chip flipping platform of the embodiment shown in the figure, the plurality of chip suction nozzles include a first chip suction nozzle, Figure 3 The method includes but is not limited to the following steps: S10, after the first chip suction nozzle sucks the first chip, the controller controls the turntable to rotate so that the first chip suction nozzle is located below the first CCD device, and controls the first CCD device to perform CCD detection on the first chip to obtain a first front CCD result; S20, controlling the first chip suction nozzle to continue rotating to the bottom of the material picking component, the controller controls the material picking nozzle to pick up the first chip, controls the first rotating motor to rotate the material picking nozzle, and then controls the material placing nozzle to pick up the first chip, controls the avoidance mechanism to drive the material picking component away from the material placing component, and then controls the first lifting mechanism to move downward, so that the material placing nozzle places the first chip on the first chip suction nozzle; S30, controlling the first chip suction nozzle to continue rotating to below the second CCD device, and the controller controlling the second CCD device to perform CCD detection on the first chip to obtain a first backside CCD result; S40, controlling the first chip suction nozzle to continue rotating to the unloading position to unload the material, and placing the next first chip into the first chip suction nozzle.

[0035] It should be noted that the technical principle of realizing chip flipping based on the chip flipping platform and CCD detection before and after chip flipping can be referred to Figure 1 and Figure 2 The description of the illustrated embodiment will not be repeated here.

[0036] It should be noted that after the first chip suction nozzle sucks the chip, a signal is sent to the controller, and the controller controls the turntable to rotate. The first chip suction nozzle rotates to the first CCD device, and the first CCD device detects that a chip has entered the shooting area, and sends a request detection signal to the controller, and the controller sends a detection signal to the first CCD device. After the first CCD device completes the detection of the first chip, it sends a signal to the controller, and the controller controls the turntable to rotate. The first chip suction nozzle rotates to the bottom of the material picking nozzle, and the material picking component picks up and flips the first chip. After the first rotating motor rotates, it sends a signal to the controller. After the controller controls the material placement component to suck the first chip, it controls the avoidance mechanism to drive the material picking component. After the avoidance component completes the drive, it sends a signal to the controller, and the controller controls the material picking nozzle to move down and place the first chip. The first chip suction nozzle rotates to the second CCD device, and the second CCD device detects that a chip has entered the shooting area, and sends a request detection signal to the controller, and the controller sends a detection signal to the second CCD device. After the second CCD device completes the detection of the first chip, it sends a signal to the controller, and the controller controls the turntable to rotate.

[0037] Through the technical solution of this embodiment, the chip suction nozzle of the turntable can be controlled to rotate to the upper material position, the bottom of the first CCD device, the bottom of the material picking assembly, the bottom of the second CCD device and the lower material position in sequence. When located below the first CCD device and the second CCD device, CCD test is performed and CCD results are generated. When located below the material picking assembly, the chip is flipped through the coordinated operation of the material picking assembly, the avoidance mechanism and the material discharging assembly. Thereby, the automatic flipping of the chip and the CCD detection before and after the flipping are realized, the front and back detection efficiency of the chip is improved, thereby improving the production efficiency of the chip.

[0038] In addition, in one embodiment, the plurality of chip suction nozzles further include a second chip suction nozzle, and the second chip suction nozzle is located behind the first chip suction nozzle. Step S10 specifically includes but is not limited to the following steps: S110, controlling the turntable to rotate, when the first chip suction nozzle leaves the loading position, the second chip suction nozzle enters the loading position, the controller controls the second chip suction nozzle to suck the second chip, controls the second chip to rotate to the bottom of the first CCD device, and controls the first CCD device to perform CCD detection on the second chip to obtain a second front CCD result; S120, controlling the second chip suction nozzle to continue rotating to the bottom of the picking assembly, controlling the picking assembly, the placing assembly and the avoidance mechanism, so that the second chip suction nozzle located below the placing suction nozzle can pick up the flipped second chip; S130, controlling the second chip suction nozzle to continue to rotate to below the second CCD device, and controlling the second CCD device to perform CCD detection on the second chip to obtain a second back CCD result; S140, controlling the second chip suction nozzle to continue rotating to the unloading position to unload the material, and placing the next second chip into the second chip suction nozzle.

[0039] It should be noted that the chip flipping platform can be realized by multiple chip suction nozzles. When the first chip is located at the unloading position and is being unloaded, the chip flipping platform simultaneously performs loading, CCD detection and flipping operations on other chips, thereby avoiding idle components and devices and improving the chip flipping and CCD detection efficiency of the chip flipping platform.

[0040] It should be noted that, each time the turntable rotates, the controller controls the chip suction nozzle at the loading position to load, the first CCD device and the second CCD device perform CCD detection on the chip below them and generate CCD results, controls the discharge assembly, the pick-up assembly and the avoidance mechanism to flip the chip, and the chip suction nozzle at the unloading position to unload. The controller generates and sends a rotation signal based on the CCD results of the first CCD device and the second CCD device to rotate the turntable.

[0041] In addition, in one embodiment, step S10 specifically includes but is not limited to the following steps: S210, setting the working mode of the chip flipping platform; S220, when the first chip suction nozzle rotates to the unloading position, if the working mode is the chip upright mode, the first chip suction nozzle is controlled to rotate to the bottom of the unloading suction nozzle, and the material picking component, the unloading component and the avoidance mechanism are controlled to make the first chip flip again, and then the first chip suction nozzle is controlled to rotate to the unloading position for the third time, and the first front CCD result and the first back CCD result are sent to the external device, and the external device sucks the first chip, and the external device classifies the first chip based on the first front CCD result and the first back CCD result; S230, when the first chip suction nozzle rotates to the unloading position, if the working mode is the chip flipping mode, the first front CCD result and the first back CCD result are sent to the external device, the external device sucks the first chip, and the external device classifies the first chip based on the first front CCD result and the first back CCD result.

[0042] It should be noted that the working modes of the chip flipping platform include the chip upright mode and the chip flipping mode. In the chip upright mode, the first chip does not need to be flipped, but the first chip needs to be inspected on the front and back sides, so the material picking assembly, the avoidance mechanism and the material discharge assembly flip the first chip twice, but when the first chip passes under the first CCD device and the second CCD device for the second time, the first CCD device and the second CCD device do not work. In the chip flipping mode, the first chip needs to be flipped in the subsequent chip production steps, so the first chip is flipped once by the chip flipping platform, and the front and back sides are inspected before and after the flipping.

[0043] In addition, in one embodiment, the material picking assembly includes a second lifting mechanism and a first mounting plate, the second lifting mechanism is fixed to the first mounting plate, the first rotating motor and the material picking nozzle are fixed to the second lifting mechanism, and under the drive of the second lifting mechanism, the first rotating motor and the material picking nozzle move in a vertical direction, and the avoidance mechanism includes a first transmission block, a second rotating motor and a connecting rod, the first transmission block is fixed to the rotating shaft of the second rotating motor, one end of the connecting rod is fixed to one end of the first transmission block, and the other end of the connecting rod is fixed to the first mounting plate, and under the drive of the second rotating motor, the first transmission block and the connecting rod drive the first mounting plate to approach or move away from the material discharging assembly; step S20 specifically also includes but is not limited to the following steps: S310, control the second rotating motor to rotate so that the end of the first transmission block connected to the connecting rod rotates in the direction away from the discharge assembly, and the first mounting plate is driven to move in the direction away from the discharge assembly through the first transmission block and the connecting rod, and the second lifting mechanism, the first rotating motor and the material picking nozzle are driven to move in the direction away from the discharge assembly through the first mounting plate.

[0044] It should be noted that the technical principle of realizing the approach of the material taking component to or from the material discharging component based on the second rotating motor through the first transmission block and the connecting rod can be referred to Figure 1 The description of the illustrated embodiment will not be repeated here.

[0045] In addition, in one embodiment, the first lifting mechanism includes a second mounting plate, a third rotating motor, a second transmission block and a limiting plate, the second mounting plate is vertically fixed, the third rotating motor is fixed to the second mounting plate, the second transmission block is fixed to the rotating shaft of the third rotating motor, a protrusion is provided at one end of the second transmission block, the limiting plate is provided with a sliding groove, the protrusion is located in the sliding groove, the discharge suction nozzle is fixed to the limiting plate, and the limiting plate slides on the second mounting plate in a vertical direction; step S20 specifically also includes but is not limited to the following steps: S410, control the third rotating motor to rotate so that the end of the second transmission block provided with the protrusion rotates downward, and the discharge nozzle is driven to move downward through the second transmission block and the limit plate. When the first chip abuts against the first chip nozzle, control the discharge nozzle to place the first chip on the first chip nozzle.

[0046] It should be noted that the technical principle of realizing the vertical movement of the discharge nozzle based on the third rotating motor through the second transmission block and the limit plate can be referred to Figure 1 and Figure 2 The description of the illustrated embodiment will not be repeated here.

[0047] In addition, in order to better illustrate the technical solution of this embodiment, a specific example is provided below: S510, setting the working mode of the chip flipping platform, after the first chip suction nozzle sucks the first chip, the controller controls the turntable to rotate so that the first chip suction nozzle is located below the first CCD device, controls the first CCD device to perform CCD detection on the first chip to obtain a first front CCD result, the first chip suction nozzle leaves the loading position, and the second chip suction nozzle enters the loading position and sucks the second chip; S520, control the first chip suction nozzle to continue to rotate to the bottom of the material picking component, the controller controls the second lifting mechanism to move the material picking nozzle downward until the material picking nozzle abuts against the first chip, and then controls the material picking nozzle to make the material picking nozzle suck the first chip; control the first rotating motor to make the material picking nozzle rotate 180 degrees in the circumferential direction, and then control the third rotating motor to drive the material discharging nozzle to move downward until the material discharging nozzle abuts against the first chip, and then control the material picking nozzle and the material discharging nozzle to realize that the material discharging nozzle sucks the first chip located at the material picking nozzle; control the second rotating motor to make the avoidance mechanism drive the material picking component away from the material discharging component, and then control the first and third rotating motors to drive the material discharging nozzle to move downward until the first chip abuts against the first chip suction nozzle, and then control the first chip suction nozzle and the material discharging nozzle to make the material discharging nozzle place the first chip on the first chip suction nozzle, and the first chip suction nozzle sucks the first chip; S530, controlling the first chip suction nozzle to continue to rotate to below the second CCD device, and the controller controlling the second CCD device to perform CCD detection on the first chip to obtain a first backside CCD result; S540, after controlling the first chip suction nozzle to continue to rotate to the unloading position, if the working mode of the chip flipping platform is the upright mode, control the first chip suction nozzle to continue to rotate to the bottom of the discharge component, and at the same time control the avoidance mechanism to drive the material picking component close to the discharge component, control the material picking component, the avoidance mechanism and the discharge component to flip the first chip again and place it in the first chip suction nozzle; control the first chip suction nozzle to rotate to the unloading position, the external device unloads the first chip, and classifies the first chip based on the first front CCD result and the first back CCD result obtained, the controller deletes the first front CCD result and the first back CCD result, and puts the next first chip in the first chip suction nozzle. Alternatively, if the working mode of the chip flipping platform is the flipping mode, the external device unloads the first chip suction nozzle that rotates to the unloading position, and classifies the first chip based on the first front CCD result and the first back CCD result obtained, the controller deletes the first front CCD result and the first back CCD result, and puts the next first chip in the first chip suction nozzle.

[0048] like Figure 4 As shown, Figure 4 : is a structural diagram of a control device for a chip flipping platform provided by an embodiment of the present invention. The present invention also provides a control device for a chip flipping platform, comprising: The processor 601 may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application; The memory 602 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 602 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 602, and the processor 601 calls and executes the control method of the chip flip platform of the embodiment of this application; Input / output interface 603, used to implement information input and output; Communication interface 604, used to realize communication interaction between the device and other devices, which can be realized through wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.); A bus 605 that transmits information between various components of the device (e.g., processor 601, memory 602, input / output interface 603, and communication interface 604); The processor 601 , the memory 602 , the input / output interface 603 and the communication interface 604 are connected to each other in communication within the device via a bus 605 .

[0049] An embodiment of the present application further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the control method of the above-mentioned chip flip-chip platform is implemented.

[0050] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0051] It will be appreciated by those skilled in the art that all or some of the steps and systems in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or transient medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media generally include computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0052] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A chip flipping platform, characterized in that: include: A turntable, wherein a plurality of chip suction nozzles are arranged on the upper surface of the turntable; A material picking assembly, an avoidance mechanism and a material discharging assembly, wherein the material picking assembly comprises a first rotating motor and a material picking nozzle, and under the drive of the first rotating motor, the material picking nozzle rotates circumferentially, and the avoidance mechanism is used to drive the material picking assembly to approach or move away from the material discharging assembly, and when the material picking assembly is close to the material discharging assembly, the material picking nozzle is located below the material discharging assembly, and the material discharging assembly comprises a first lifting mechanism and a material discharging nozzle, and the material discharging nozzle is fixed to the first lifting mechanism, and under the drive of the first lifting mechanism, the material discharging nozzle moves in a vertical direction; A first CCD device and a second CCD device, wherein the first CCD device, the unloading assembly and the second CCD device are sequentially distributed along the circumferential direction, and the first CCD device and the second CCD device are located above the rotating disk; A controller is communicatively connected to the turntable, the material taking assembly, the avoidance mechanism, the material discharging assembly, the first CCD device and the second CCD device.

2. The chip flipping platform according to claim 1, characterized in that: The material picking assembly includes a second lifting mechanism and a first mounting plate, the second lifting mechanism is fixed to the first mounting plate, the material picking nozzle and the first rotating motor are fixed to the second lifting mechanism, and under the drive of the second lifting mechanism, the material picking nozzle and the first rotating motor move in a vertical direction, and the avoidance mechanism includes a first transmission block, a second rotating motor and a connecting rod, the first transmission block is fixed to the rotating shaft of the second rotating motor, one end of the connecting rod is fixed to one end of the first transmission block, and the other end of the connecting rod is fixed to the first mounting plate, and under the drive of the second rotating motor, the first transmission block and the connecting rod drive the first mounting plate to approach or move away from the material discharging assembly.

3. The chip flipping platform according to claim 1, characterized in that: The first lifting mechanism includes a second mounting plate, a third rotating motor, a second transmission block and a limit plate, the second mounting plate is vertically fixed, the third rotating motor is fixed to the second mounting plate, the second transmission block is fixed to the rotating shaft of the third rotating motor, a protrusion is provided at one end of the second transmission block, the limit plate is provided with a sliding groove, the protrusion is located in the sliding groove, the discharge suction nozzle is fixed to the limit plate, and the limit plate slides on the second mounting plate in a vertical direction.

4. A control method for a chip flipping platform, characterized in that: The chip flipping platform according to any one of claims 1 to 3, wherein the plurality of chip suction nozzles include a first chip suction nozzle, and the method comprises: After the first chip suction nozzle sucks the first chip, the controller controls the turntable to rotate so that the first chip suction nozzle is located below the first CCD device, and controls the first CCD device to perform CCD detection on the first chip to obtain a first front CCD result; The first chip suction nozzle is controlled to continue to rotate to the bottom of the material picking component, the controller controls the material picking nozzle to pick up the first chip, controls the first rotating motor to rotate the material picking nozzle, and then controls the material placing nozzle to pick up the first chip, controls the avoidance mechanism to drive the material picking component away from the material placing component, and then controls the first lifting mechanism to move downward, so that the material placing nozzle places the first chip on the first chip suction nozzle; Control the first chip suction nozzle to continue to rotate to below the second CCD device, and the controller controls the second CCD device to perform CCD detection on the first chip to obtain a first back CCD result; The first chip suction nozzle is controlled to continue rotating to the unloading position for unloading, and the next first chip is placed in the first chip suction nozzle.

5. The control method of the chip flipping platform according to claim 4, characterized in that: The plurality of chip suction nozzles further include a second chip suction nozzle, and the second chip suction nozzle is located behind the first chip suction nozzle; Before the controller controls the turntable to rotate so that the first chip suction nozzle is located below the first CCD device, the method includes: Control the turntable to rotate, when the first chip suction nozzle leaves the loading position, the second chip suction nozzle enters the loading position, the controller controls the second chip suction nozzle to suck the second chip, controls the second chip to rotate to the bottom of the first CCD device, and controls the first CCD device to perform CCD detection on the second chip to obtain a second front CCD result; Control the second chip suction nozzle to continue to rotate to the bottom of the picking assembly, and control the picking assembly, the placing assembly and the avoidance mechanism so that the second chip suction nozzle located below the placing suction nozzle can pick up the flipped second chip; Control the second chip suction nozzle to continue to rotate to below the second CCD device, and control the second CCD device to perform CCD detection on the second chip to obtain a second back CCD result; The second chip suction nozzle is controlled to continue rotating to the unloading position to unload the chip, and the next second chip is placed in the second chip suction nozzle.

6. The control method of the chip flipping platform according to claim 4, characterized in that: Before the first chip suction nozzle sucks the first chip, the method includes: Setting the working mode of the chip flipping platform; When the first chip suction nozzle rotates to the unloading position, if the working mode is the chip upright mode, the first chip suction nozzle is controlled to rotate to the bottom of the unloading suction nozzle, the material picking component, the unloading component and the avoidance mechanism are controlled to make the first chip flip again, and the first chip suction nozzle is controlled to rotate to the unloading position for the third time, and the first front CCD result and the first back CCD result are sent to an external device, the external device sucks the first chip, and the external device classifies the first chip based on the first front CCD result and the first back CCD result; When the first chip suction nozzle rotates to the unloading position, if the working mode is the chip flipping mode, the first front CCD result and the first back CCD result are sent to an external device, the external device sucks the first chip, and the external device classifies the first chip based on the first front CCD result and the first back CCD result.

7. The control method of the chip flipping platform according to claim 4, characterized in that: The material picking assembly includes a second lifting mechanism and a first mounting plate, the second lifting mechanism is fixed to the first mounting plate, the material picking nozzle and the first rotating motor are fixed to the second lifting mechanism, under the drive of the second lifting mechanism, the material picking nozzle and the first rotating motor move in a vertical direction, the avoidance mechanism includes a first transmission block, a second rotating motor and a connecting rod, the first transmission block is fixed to the rotating shaft of the second rotating motor, one end of the connecting rod is fixed to one end of the first transmission block, and the other end of the connecting rod is fixed to the first mounting plate, under the drive of the second rotating motor, the first transmission block and the connecting rod drive the first mounting plate to approach or move away from the material discharging assembly; Controlling the avoidance mechanism so that the avoidance mechanism drives the material taking component away from the material discharging component, comprising: The second rotating motor is controlled to rotate so that the end of the first transmission block connected to the connecting rod rotates in a direction away from the discharge assembly, and the first mounting plate is driven to move in a direction away from the discharge assembly through the first transmission block and the connecting rod, and the second lifting mechanism, the material picking nozzle and the first rotating motor are driven to move in a direction away from the discharge assembly through the first mounting plate.

8. The control method of the chip flipping platform according to claim 4, characterized in that: The first lifting mechanism comprises a second mounting plate, a third rotating motor, a second transmission block and a limit plate, the second mounting plate is vertically fixed, the third rotating motor is fixed to the second mounting plate, the second transmission block is fixed to the rotating shaft of the third rotating motor, a protrusion is provided at one end of the second transmission block, the limit plate is provided with a sliding groove, the protrusion is located in the sliding groove, the discharge suction nozzle is fixed to the limit plate, and the limit plate slides on the second mounting plate in a vertical direction; Controlling the first lifting mechanism to move downward so that the discharge nozzle places the first chip on the first chip nozzle includes: The third rotating motor is controlled to rotate so that the end of the second transmission block provided with the protrusion rotates downward, and the discharge nozzle is driven to move downward through the second transmission block and the limit plate. When the first chip abuts against the first chip nozzle, the discharge nozzle is controlled to place the first chip on the first chip nozzle.

9. A control device for a chip flipping platform, characterized in that: It includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the control method of the chip flipping platform as described in any one of claims 5 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the control method of the chip flipping platform according to any one of claims 5 to 8.

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