Semiconductor package resin tray cleaning device

Abstract

The present application relates to a kind of semiconductor encapsulation resin tray cleaning device, including conveying mechanism, for carrying resin tray moves along a preset moving track, and be configured as with the non-contact carrying of resin tray lower surface, conveying mechanism includes the upper plate of the closely closed surface hole of resin tray;Internal cleaning mechanism, including lower plate, and the sealing plate that can vertically move, sealing cover and inner brush plate;The upper plate of conveying mechanism, with the lower plate of internal cleaning mechanism, sealing cover, sealing plate etc. Structure combination forms the closed chamber that can be separated and combined, the inner wall cleaning process of surface hole of resin tray is always in closed chamber, can prevent external dust contamination, and prevent powder resin fly and everywhere contamination, fast and completely clean the powder resin of resin tray surface, prevent semiconductor package and appear overflow, pit etc. Defect.

Description

Technical Field

[0001] This invention relates to the field of semiconductor integrated circuit manufacturing equipment technology, and more specifically to a semiconductor packaging resin tray cleaning device. Background Technology

[0002] To protect electronic chips at room temperature, electronic components are generally sealed with resin. Resin sealing methods include injection molding and die casting. Die casting involves using an upper and lower mold. Powdered resin is supplied to the cavity of the lower mold, adsorbing the substrate or lead frame containing the electronic chip onto the upper mold. The lower mold melts the powdered resin through heating, and the substrate containing the electronic chip is encapsulated by the closing of the upper and lower molds. Existing traditional packaging devices inject large particles into the mold cavity through heating, resulting in residual resin and waste; furthermore, the pressure and resin flow generated during injection can cause damage and misalignment of chip leads or solder joints.

[0003] Using powdered resin instead of large-particle resin in injection molding can effectively reduce damage to chip leads or solder joints. However, powdered resin is prone to contaminating the resin tray, which can lead to defects such as overflow and pitting during continuous operation. In particular, a large amount of powdered resin will accumulate in the surface holes of the resin tray. In the existing technology, manual cleaning or cleaning in an open space can cause powdered resin to splash and spread everywhere, making it impossible to clean thoroughly and affecting the yield of the package. In addition, the transfer cleaning journey is long and the cleaning efficiency is low. Summary of the Invention

[0004] I. Technical problems to be solved The purpose of this invention is to provide a semiconductor packaging resin tray cleaning device that can quickly and thoroughly clean the powdered resin on the surface of the resin tray, preventing defects such as glue overflow and pitting in semiconductor packaging.

[0005] II. Technical Solution

[0006] This invention is achieved through the following technical solution: According to a first aspect of the present invention, a semiconductor packaging resin tray cleaning device is provided, comprising: A conveying mechanism for carrying a resin tray along a preset moving trajectory and configured to carry the resin tray in a non-contact manner with the lower surface of the resin tray, the conveying mechanism including an upper plate that tightly seals the holes on the surface of the resin tray; The internal cleaning mechanism includes a lower plate, a vertically movable sealing plate, a sealing cover, and an internal brush plate; wherein, The lower plate is used to support the resin tray. The surface of the lower plate has a through groove whose circumferential contour line completely covers the circumferential contour line of the holes on the surface of the resin tray. The lower plate is configured to move in the vertical direction so that when the resin tray is transported by the conveying mechanism to the end position of the preset moving trajectory, it can be pressed against the upper plate by the lower plate. The sealing cover seamlessly connects the outer contour of the sealing plate and the circumferential edge of the through groove, and defines the surface holes of the sealing cover, sealing plate, upper plate, lower plate and resin tray as a connected sealed chamber. Bristles are arranged around the inner brush plate, which is fixed above the sealing plate by a connecting rod and can move vertically synchronously with the sealing plate to clean the surface holes of the resin tray. The sealing plate is provided with a first negative pressure pipe for communicating with the sealed chamber.

[0007] According to an embodiment of the present invention, the surface of the inner brush plate is provided with a plurality of air holes that connect its upper and lower spaces; The brush bristles are arranged in multiple layers and are densely packed. The bristles are in close contact with the inner wall of the holes on the surface of the resin tray, so that when the inner brush plate moves up and down, the gas between the upper and lower surfaces of the inner brush plate cannot flow quickly and fully, thus creating a pressure difference. When the inner brush plate moves downward, the airflow flows from bottom to top, causing the powdered resin to float with the airflow. When the inner brush plate moves upward, the powdered resin moves downward with the airflow and is then sucked away by the first negative pressure pipe. The airflow between the brush bristles and the inner wall of the holes on the surface of the resin tray keeps the surface of the brush bristles clean.

[0008] According to an embodiment of the present invention, the internal cleaning mechanism further includes a base plate, a first cylinder fixed to the base plate, and four positioning rods respectively fixed to the four corners of the upper surface of the base plate; The telescopic end of the first cylinder faces upward and is fixedly connected to the bottom surface of the lower plate; The positioning rod has a guide hole at its top, and the lower plate has fixing holes at its four corners. A guide pin is fixed in each fixing hole, and the lower end of the guide pin extends to the bottom of the lower plate and is slidably connected to the guide hole. According to an embodiment of the present invention, a bracket is fixedly connected below the lower plate, and the internal cleaning mechanism further includes a second cylinder fixedly connected to the bracket, wherein the telescopic end of the second cylinder faces upward and is fixedly connected to the sealing plate; The surface of the bracket is provided with a square groove that allows the first negative pressure pipe to pass through.

[0009] According to an embodiment of the present invention, a bottom cleaning mechanism is provided in the middle of the preset movement trajectory of the resin tray conveyed by the conveying mechanism. The bottom cleaning mechanism includes a support frame, a third cylinder fixed on the support frame, and a bottom brush plate fixedly connected to the top of the third cylinder.

[0010] According to an embodiment of the present invention, bristles are densely arranged around the upper edge of the bottom brush plate, and a second negative pressure pipe is provided at the bottom of the bottom brush plate, the second negative pressure pipe connecting to the space above the bottom brush plate.

[0011] According to an embodiment of the present invention, the conveying mechanism includes a linear guide rail, a frame slidably connected to the linear guide rail, and a clamping assembly. The frame includes the upper plate, and the clamping assembly is disposed above the upper plate. The clamping assembly includes: A bidirectional linear module fixed on a frame; Two sliders are symmetrically connected to the bidirectional linear module, and the two sliders move in opposite directions. A sliding pin fixedly connected to the side of the slider; Two pairs of bearing housing assemblies, each bearing housing assembly comprising two bearing housings fixed opposite to each other on the upper plate; A shaft is rotatably connected to the bearing housing assembly, with both ends of the shaft extending to the outside of both sides of the upper plate; A movable block is fixedly connected to the middle of the shaft, and the movable block has a waist-shaped groove on its side; A clamping rod is fixedly connected to both ends of the shaft. The end of the clamping rod extends to the lower part of the upper plate and forms a hook that engages with the preset slots on both sides of the resin tray. The sliding pin is slidably connected to the waist-shaped groove.

[0012] III. Beneficial Effects

[0013] The above one or more embodiments have the following advantages or beneficial effects: 1. A semiconductor packaging resin tray cleaning device according to an embodiment of the present invention, wherein the upper plate of the conveying mechanism, the lower plate of the internal cleaning mechanism, the sealing cover, the sealing plate and other structures are combined to form a separable and combinable sealed chamber. The cleaning process of the surface holes and inner wall of the resin tray is always in the sealed chamber, which can prevent external dust from contaminating and prevent powder resin from flying and contaminating everywhere. It can quickly and thoroughly clean the powder resin on the surface of the resin tray and prevent defects such as glue overflow and pits in semiconductor packaging. 2. The present invention integrates part of the structure of the sealed chamber required for cleaning the surface holes of the resin tray into the conveying mechanism, combining the two processes of transferring the resin tray to the cleaning station and cleaning the surface holes of the resin tray, which simplifies the mechanical mechanism and workflow and improves cleaning efficiency. Attached Figure Description

[0014] The above-described features, other objects, and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings, in which: Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 yes Figure 1 A magnified view of part A in the middle; Figure 3 yes Figure 1 A frontal perspective view; Figure 4 yes Figure 3 A magnified view of part B in the middle section; Figure 5 This is an exploded view of the internal cleaning mechanism; Figure 6 This is a structural diagram of the internal cleaning mechanism; Figure 7 This is a schematic diagram of the bottom cleaning mechanism; 1. Conveying mechanism; 101. Frame; 1011. Upper plate; 102. Linear guide rail; 103. Clamping assembly; 1031. Bidirectional linear module; 1032. Slider; 1033. Sliding pin; 1034. Bearing seat assembly; 1035. Shaft; 1036. Moving block; 10361. Waist-shaped groove; 1037. Clamping rod; 10371. Hook; 2. Internal cleaning mechanism; 201. Lower plate; 2011. Through groove; 2012. Fixing hole; 202. Sealing plate ; 203, Sealing cover; 204, Inner brush plate; 2041, Air hole; 205, Connecting rod; 206, Base plate; 207, First cylinder; 208, Positioning rod; 2081, Guide hole; 209, Guide pin; 210, Bracket; 2101, Square groove; 211, Second cylinder; 3, Sealed chamber; 4, First negative pressure pipe; 5, Bottom cleaning mechanism; 501, Support frame; 502, Third cylinder; 503, Bottom brush plate; 504, Second negative pressure pipe; 6, Resin tray. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the protection scope of the present invention.

[0016] It should be noted that, for clarity and / or descriptive purposes, the dimensions and relative dimensions of components may be enlarged in the accompanying drawings. Therefore, the dimensions and relative dimensions of the individual components are not necessarily limited to those shown in the drawings. In the specification and accompanying drawings, the same or similar reference numerals indicate the same or similar parts.

[0017] When an element is described as being "on" another element, "connected" to another element, or "attached" to another element, the element may be directly on, directly connected to, or directly attached to the other element, or there may be intermediate elements. However, when an element is described as being "directly on" another element, "directly connected" to another element, or "directly attached" to another element, there are no intermediate elements. Other terms and / or expressions used to describe relationships between elements should be interpreted in a similar manner, such as "between" to "directly between," "adjacent" to "directly adjacent," or "on" to "directly on," etc. As used herein, the term "and / or" includes any and all combinations of one or more of the listed related items.

[0018] It should be noted that although the terms "first," "second," etc., may be used herein to describe various components, members, elements, regions, layers, and / or portions, these components, members, elements, regions, layers, and / or portions should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer, and / or portion from another. Thus, for example, the first component, first member, first element, first region, first layer, and / or first portion discussed below may be referred to as a second component, second member, second element, second region, second layer, and / or second portion without departing from the teachings of the invention.

[0019] For ease of description, spatial relation terms, such as “above,” “below,” “left,” “right,” etc., may be used herein to describe the relationship between one element or feature and another element or feature as shown in the figure. It should be understood that spatial relation terms are intended to cover other orientations of the device in use or operation besides those described in the figure. For example, if the device in the figure were inverted, an element described as “below” or “under” other elements or features would be oriented “above” or “on top” other elements or features.

[0020] An embodiment of the present invention provides a cleaning device for a semiconductor packaging resin tray 6. Please refer to [link / reference]. Figure 1-7 It includes a conveying mechanism 1, an internal cleaning mechanism 2, and a bottom cleaning mechanism 5; wherein, the internal cleaning mechanism 2 is used to clean the surface holes of the semiconductor packaging resin tray 6, and the bottom cleaning mechanism 5 is used to clean the bottom of the resin tray 6.

[0021] The conveying mechanism 1 is used to carry the resin tray 6 along a preset moving track, the end of which is located above the internal cleaning mechanism 2; the bottom cleaning mechanism 5 is located in the middle of the preset moving track of the conveying mechanism 1 conveying the resin tray 6, and cleans the lower surface of the resin tray 6 during the conveying process to ensure the cleanliness of the contact surface of the resin tray 6 and improve efficiency.

[0022] The conveying mechanism 1 is configured to bear the resin tray 6 without contact with the lower surface of the resin tray 6, even if the lower surface of the resin tray 6 is a flat plane. Figure 1-4 The specific structure of the conveying mechanism 1 is shown. The conveying mechanism 1 includes a linear guide rail 102, a frame 101 slidably connected to the linear guide rail 102, and a clamping assembly 103. The clamping assembly 103 clamps the resin tray 6 from the side so that the resin tray 6 is in a non-contact bearing state on the lower surface. The frame 101 includes an upper plate 1011. The clamping assembly 103 is disposed above the upper plate 1011. The linear guide rail 102 drives the frame 101 to move, the frame 101 drives the clamping assembly 103 to move, and the clamping assembly 103 drives the resin tray 6 to move.

[0023] Please see Figure 1-2 The clamping assembly 103 includes a bidirectional linear module 1031 fixed to the frame 101, two sliders 1032 symmetrically slidably connected to the bidirectional linear module 1031, a sliding pin 1033 fixedly connected to the side of the slider 1032, two pairs of bearing seats 1034, a shaft 1035 rotatably connected to the bearing seats 1034, a moving block 1036 fixedly connected to the middle of the shaft 1035, and a clamping rod 1037; wherein, the bearing seats 1034 include two oppositely fixed to the upper plate 1 The bearing housing on 011; the two ends of the shaft 1035 extend to the outside of both sides of the upper plate 1011, and the clamping rod 1037 is fixedly connected to the two ends of the shaft 1035. The end of the clamping rod 1037 extends to the bottom of the upper plate 1011 and forms a hook 10371 that engages with the preset slots on both sides of the resin tray 6; the side of the moving block 1036 is provided with a waist-shaped groove 10361, and the sliding pin 1033 is slidably connected to the waist-shaped groove 10361. The sliding pin 1033 can slide and rotate in the waist-shaped groove 10361. The process of clamping the resin tray 6 by clamping the clamping assembly 103 is as follows: the two sliders 1032 on the bidirectional linear module 1031 are driven to move in opposite directions. The sliders 1032 drive the sliding pins 1033 to move. The sliding pins 1033 rotate and move in the waist-shaped groove 10361, which drives the moving block 1036 and the shaft 1035 to rotate synchronously. The shaft 1035 drives the clamping rods 1037 to rotate. The hooks 10371 of the two clamping rods 1037 engage with the preset slots on both sides of the resin tray 6, so that the resin tray 6 is attached and fixed under the upper plate 1011. The upper plate 1011 tightly seals the holes on the surface of the resin tray 6.

[0024] Please refer to Figure 5-6The internal cleaning mechanism 2 includes a lower plate 201, a sealing plate 202 that can move vertically, a sealing cover 203, and an inner brush plate 204; the lower plate 201 supports the resin tray 6 from below, and a through groove 2011 is provided on the surface of the lower plate 201, the circumferential outline of the through groove 2011 completely covers the circumferential outline of the holes on the surface of the resin tray 6. The internal cleaning mechanism 2 also includes a base plate 206, a first cylinder 207 fixed to the base plate 206, and four positioning rods 208 respectively fixed to the four corners of the upper surface of the base plate 206; the telescopic end of the first cylinder 207 faces upward and is fixedly connected to the bottom surface of the lower plate 201; a guide hole 2081 is opened at the top of the positioning rod 208, and a fixing hole 2012 is opened at the four corners of the lower plate 201. A guide pin 209 is fixed in the fixing hole 2012, and the lower end of the guide pin 209 extends to the bottom of the lower plate 201 and is connected to the guide pin 209. Hole 2081 is slidably connected; the first cylinder 207 extends and retracts to drive the lower plate 201 to rise and fall, and the guide pin 209 slides in the guide hole 2081 to stabilize the moving direction, so that the lower plate 201 is configured to move in the vertical direction; when the resin tray 6 is conveyed by the conveying mechanism 1 to the end position of the preset moving trajectory, the first cylinder 207 lifts the lower plate 201, so that the resin tray 6 is pressed by the lower plate 201 under the upper plate 1011. At this time, the through groove 2011 is located below the surface hole of the resin tray 6. The sealing cover 203 is seamlessly connected between the outer contour of the sealing plate 202 and the circumferential edge of the through groove 2011. The sealing cover 203, sealing plate 202, upper plate 1011, lower plate 201 and surface holes of resin tray 6 define a connected sealed chamber 3. A first negative pressure pipe 4 is provided outside the sealing plate 202 to communicate with the sealed chamber 3. The first negative pressure pipe 4 is connected to an external vacuum cleaner and absorbs the powdered resin cleaned by the inner brush plate 204 in the sealed chamber 3 through negative pressure. The upper plate 1011 of the conveying mechanism 1, the lower plate 201 of the internal cleaning mechanism 2, the sealing cover 203, the sealing plate 202 and other structures are combined to form a separable and combinable sealed chamber 3. Part of the structure of the sealed chamber 3 required for cleaning the surface holes of the resin tray 6 is integrated into the conveying mechanism 1. The two processes of transferring the resin tray 6 to the cleaning station and cleaning the surface holes of the resin tray 6 are combined, which simplifies the mechanical mechanism and workflow and improves the cleaning efficiency.

[0025] A bracket 210 is fixedly connected below the lower plate 201. The internal cleaning mechanism 2 also includes a second cylinder 211 fixedly connected to the bracket 210. The telescopic end of the second cylinder 211 faces upward and is fixedly connected to the sealing plate 202. A square groove 2101 is provided on the surface of the bracket 210 to allow the first negative pressure pipe 4 to pass through. The second cylinder 211 drives the sealing plate 202 to move vertically. Bristles are arranged around the inner brush plate 204, which is fixed above the sealing plate 202 by a connecting rod 205. The sealing plate 202 moves vertically as the second cylinder 211 extends and retracts. The sealing plate 202 drives the sealing cover 203 to expand and contract, and drives the inner brush plate 204 to move vertically in sync to clean the surface holes of the resin tray 6. The cleaning process of the inner wall of the surface holes of the resin tray is always in a sealed environment, which can prevent external dust from adhering and prevent powdered resin from flying and adhering everywhere, thus improving the cleaning effect.

[0026] According to an embodiment of the present invention, the inner brush plate 204 has a plurality of air holes 2041 communicating with its upper and lower spaces on its surface; the bristles are arranged in multiple layers and densely, and the bristles are in close contact with the inner wall of the holes on the surface of the resin tray 6; during the process of the inner brush plate 204 moving up and down with the sealing plate 202, the gas between the upper and lower surfaces of the inner brush plate 204 cannot flow quickly and fully, thus generating a pressure difference. Specifically, when the inner brush plate 204 moves downward, the volume of the space above the inner brush plate 204 increases, the air pressure decreases, and the air pressure below the inner brush plate 204 is higher than the air pressure above. The airflow will flow from bottom to top through the air hole 2041 and between the bristles and the inner wall of the holes on the surface of the resin tray 6, causing the powder resin in the space above the inner brush plate 204 to float with the airflow. When the inner brush plate 204 moves upward, the volume of the space above the inner brush plate 204 decreases, the air pressure increases, and the air pressure below the inner brush plate 204 is lower than the air pressure above. The powder resin moves downward with the airflow to the inner brush plate 204. When the inner brush plate 204 rises to the top in the sealed chamber 3, the powder resin floating above the inner brush plate 204 is exhausted to the bottom of the inner brush plate 204 with the gas flow and is then sucked away by the first negative pressure pipe 4. To ensure cleaning effectiveness, during the lifting and lowering of the inner brush plate 204, the first negative pressure pipe 4 can be set to be in a closed state so that the powder resin is repeatedly brushed and kept floating, or set to be in a slightly low air pressure state so that most of the powder resin is continuously sucked into the first negative pressure pipe 4. When the inner brush plate 204 rises to the top in the sealed chamber 3, the first negative pressure pipe 4 is in a maximum suction state so that the powder resin in the sealed chamber 3 is discharged. Through single or multiple lifting processes, the powdered resin adhering to the inner wall of the holes on the surface of the resin tray 6 can be cleaned, avoiding defects such as overflow and dents caused by contamination of the resin tray 6. At the same time, the airflow between the brush bristles and the inner wall of the holes on the surface of the resin tray 6 keeps the brush bristle surface clean, preventing powdered resin from accumulating on the brush bristles, extending the service life of the brush plate 204 and brush bristles when cleaning multiple resin trays 6, and improving work efficiency.

[0027] According to an embodiment of the present invention, a bottom cleaning mechanism 5 is provided in the middle of the preset moving trajectory of the resin tray 6 conveyed by the conveying mechanism 1. The bottom cleaning mechanism 5 includes a support frame 501, a third cylinder 502 fixed on the support frame 501, and a bottom brush plate 503 fixedly connected to the top of the third cylinder 502. Bristles are densely arranged around the edge of the upper surface of the bottom brush plate 503, and a second negative pressure pipe 504 is provided at the bottom of the bottom brush plate 503, which connects to the space above the bottom brush plate 503. During the process of the conveying mechanism 1 moving the resin tray 6 upward towards the internal cleaning mechanism 2, the third cylinder 502 drives the bottom brush plate 503 to move upward. The bristles on the bottom brush plate 503 clean the powdered resin adhering to the working surface (lower surface) of the resin tray 6, while the second negative pressure pipe 504 absorbs the powdered resin through negative pressure.

[0028] Those skilled in the art will understand that the features described in the various embodiments of the present invention can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments of the present invention can be combined and / or combined in various ways without departing from the spirit and teachings of the present invention. All such combinations and / or combinations fall within the scope of the present invention.

Claims

1. A semiconductor packaging resin tray cleaning device, characterized in that, include: The conveying mechanism (1) is used to carry the resin tray (6) along a preset moving trajectory and is configured to carry it in a non-contact manner with the lower surface of the resin tray (6). The conveying mechanism (1) includes an upper plate (1011) that tightly seals the holes on the surface of the resin tray (6). The internal cleaning mechanism (2) includes a lower plate (201), a vertically movable sealing plate (202), a sealing cover (203), and an inner brush plate (204); wherein, The lower plate (201) is used to support the resin tray (6). The surface of the lower plate (201) is provided with a through groove (2011) whose circumferential contour line completely covers the circumferential contour line of the holes on the surface of the resin tray (6). The lower plate (201) is configured to move in the vertical direction so that when the resin tray (6) is conveyed by the conveying mechanism (1) to the end position of the preset moving trajectory, it can be pressed by the lower plate (201) against the upper plate (1011). The sealing cover (203) seamlessly connects the outer contour of the sealing plate (202) and the circumferential edge of the through groove (2011), and defines the surface holes of the sealing cover (203), sealing plate (202), upper plate (1011), lower plate (201) and resin tray (6) as a connected sealed chamber (3). Brush bristles are arranged around the inner brush plate (204). The inner brush plate (204) is fixed above the sealing plate (202) by a connecting rod (205) and can move vertically synchronously with the sealing plate (202) to clean the surface holes of the resin tray (6). The sealing plate (202) is provided with a first negative pressure pipe (4) for communicating with the sealed chamber (3) on the outside. The inner brush plate (204) has multiple air holes (2041) on its surface that connect its upper and lower spaces. The bristles are arranged in multiple layers and are densely packed. The bristles are in close contact with the inner wall of the holes on the surface of the resin tray (6) so that when the inner brush plate (204) moves up and down, the gas between the upper and lower surfaces of the inner brush plate (204) cannot flow quickly and fully, thus generating a pressure difference. When the inner brush plate (204) moves down, the airflow flows from bottom to top, causing the powdered resin to float with the airflow. When the inner brush plate (204) moves up, the powdered resin moves down the inner brush plate (204) with the airflow and is then sucked away by the first negative pressure pipe (4). The airflow flows between the bristles and the inner wall of the holes on the surface of the resin tray (6), keeping the surface of the bristles clean.

2. The semiconductor packaging resin tray cleaning device according to claim 1, characterized in that, The internal cleaning mechanism (2) also includes a base plate (206), a first cylinder (207) fixed on the base plate (206), and four positioning rods (208) respectively fixed at the four corners of the upper surface of the base plate (206). The telescopic end of the first cylinder (207) faces upward and is fixedly connected to the bottom surface of the lower plate (201); The positioning rod (208) has a guide hole (2081) at the top, and the lower plate (201) has fixing holes (2012) at the four corners. A guide pin (209) is fixed in the fixing hole (2012). The lower end of the guide pin (209) extends to the bottom of the lower plate (201) and is slidably connected to the guide hole (2081).

3. The semiconductor packaging resin tray cleaning device according to claim 2, characterized in that, A bracket (210) is fixedly connected below the lower plate (201). The internal cleaning mechanism (2) also includes a second cylinder (211) fixedly connected to the bracket (210). The telescopic end of the second cylinder (211) faces upward and is fixedly connected to the sealing plate (202). The surface of the bracket (210) is provided with a square groove (2101) that allows the first negative pressure pipe (4) to pass through.

4. A semiconductor packaging resin tray cleaning device according to any one of claims 1-3, characterized in that, A bottom cleaning mechanism (5) is provided in the middle of the preset movement trajectory of the resin tray (6) conveyed by the conveying mechanism (1). The bottom cleaning mechanism (5) includes a support frame (501), a third cylinder (502) fixed on the support frame (501), and a bottom brush plate (503) fixedly connected to the top of the third cylinder (502).

5. The semiconductor packaging resin tray cleaning device according to claim 4, characterized in that, Brush bristles are densely arranged around the edge of the upper surface of the bottom brush plate (503), and a second negative pressure pipe (504) is provided at the bottom of the bottom brush plate (503), which connects to the space above the bottom brush plate (503).

6. The semiconductor packaging resin tray cleaning device according to claim 1, characterized in that, The conveying mechanism (1) includes a linear guide rail (102), a frame (101) slidably connected to the linear guide rail (102), and a clamping assembly (103). The frame (101) includes an upper plate (1011), and the clamping assembly (103) is disposed above the upper plate (1011). The clamping assembly (103) includes: A bidirectional linear module (1031) is fixed on the frame (101); Two sliders (1032) are symmetrically connected to the bidirectional linear module (1031), and the two sliders (1032) move in opposite directions; A sliding pin (1033) is fixedly connected to the side of the slider (1032); Two pairs of bearing housing assemblies (1034), each bearing housing assembly (1034) comprising two bearing housings fixed opposite to each other on the upper plate (1011); A shaft (1035) is rotatably connected to the bearing housing assembly (1034), the two ends of which extend to the outside of both sides of the upper plate (1011); A movable block (1036) is fixedly connected to the middle of the shaft (1035), and the movable block (1036) has a waist-shaped groove (10361) on its side. The clamping rods (1037) are fixedly connected to both ends of the shaft (1035). The ends of the clamping rods (1037) extend to the bottom of the upper plate (1011) and form hooks (10371) that engage with the preset slots on both sides of the resin tray (6). The sliding pin (1033) is slidably connected to the waist-shaped groove (10361).

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