A processing method of an ultrathin optical component superplane

Abstract

The application discloses a processing method for an ultrathin optical component superplane, and relates to the technical field of optical component processing, and comprises the following processing steps: step S1, a protective layer is coated on a pattern layer of a pattern substrate, and the other side is a to-be-processed surface; step S2, the pattern layer of the pattern substrate is fixed on a first base plate with the pattern layer facing the first base plate, a plurality of auxiliary pads are placed on the first base plate, a second base plate is placed on the to-be-processed surface of the pattern substrate, the pattern substrate is clamped between the first base plate and the second base plate, and the parallelism of the first base plate and the second base plate is adjusted to reach a set value; step S3, a disc is placed on the first base plate, and the parallelism between the second base plate and the disc is ensured to reach a set value, and then the second base plate is removed; and step S4, the to-be-processed surface of the pattern substrate is ground and polished. The processing method for the ultrathin optical component superplane can process a high-precision pattern substrate with a thickness of less than 1 mm.

Description

Technical Field

[0001] This invention relates to the field of optical component processing technology, and in particular to a method for processing ultra-thin optical components with a hyperplane shape. Background Technology

[0002] Currently, the processing of optical components with a thickness of 1mm or less can only achieve a critical dimension (CD) accuracy of 0.5μm or higher. This is because the current process involves first processing the pattern substrate, i.e., a thin glass sheet, to the designed thickness and surface shape, and then coating the pattern substrate to achieve patterning. Due to the film layer stress, the original surface shape of the pattern substrate deteriorates, and the positional accuracy of the pattern layer is also affected. In other words, the CD accuracy of the pattern substrate cannot be further improved, and the surface shape of the other side of the pattern substrate will also deteriorate. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a method for processing ultra-thin optical components with a hyperplane shape, which can produce high-precision patterned substrates with a thickness of less than 1 mm.

[0004] The method for fabricating an ultra-thin optical component hyperplane according to an embodiment of the present invention is used to fabricate a patterned substrate, wherein one side surface of the patterned substrate has a patterned layer, and includes the following fabrication steps: Step S1: A protective layer is coated on one side surface of the graphic substrate having the graphic layer, and the side surface of the graphic substrate opposite to the graphic layer is the surface to be processed; Step S2: The pattern layer of the pattern substrate is oriented towards the first pad, and the pattern substrate is fixed on the first pad. A plurality of auxiliary pads are placed on the first pad and distributed around the pattern substrate. A second pad is placed on the surface of the pattern substrate to be processed, so that the pattern substrate is clamped between the first pad and the second pad. The auxiliary pads are adjusted so that the parallelism between the first pad and the second pad reaches a set value. Step S3: Place the tray on the tray surface, and ensure that the parallelism between the second tray and the tray surface reaches the set value. Then remove the second tray. Step S4: Grind and polish the surface to be processed on the graphic substrate until the thickness, surface shape, and parallelism of the graphic substrate all reach the set values.

[0005] The method for fabricating a hyperplane ultrathin optical component according to an embodiment of the present invention has at least the following beneficial effects: First, a patterned substrate is patterned, and then the patterned substrate is thinned to the designed thickness by removing material, which can obtain an ultrathin optical component with a thickness of 1 mm or less, while the pattern CD accuracy can be better than 0.5 μm; The patterned substrate is patterned before thinning, and the film layer stress has less impact on the thicker image substrate during the patterning process, so the pattern CD accuracy can be better than 0.5 μm; When removing material from the surface to be processed of the patterned substrate, the patterned substrate is clamped by a first pad, an auxiliary pad, and a second pad and the loading operation is completed, which can accurately position the patterned substrate before processing, and the parallelism of the processed patterned substrate can meet the design requirements.

[0006] According to some embodiments of the present invention, step S4 further includes step S4.1.1, rough grinding of the surface to be processed on the graphic substrate, wherein the rough grinding adopts an oscillating grinding method, the grinding spindle speed is controlled at 40-60 rpm, and the air pressure is controlled at 4-5 kg / cm². 2 The oscillation speed is controlled at 7-10 times / minute; in step S4.1.2, the surface to be processed on the graphic substrate is finely ground using an oscillating grinding method, with the grinding spindle speed controlled at 30-40 rpm and the air pressure controlled at 1-2 kg / cm². 2 The swing speed should be controlled at 4 to 6 times per minute.

[0007] According to some embodiments of the present invention, in step S4, the pattern substrate is first ground to a thickness of less than 1 mm, and at this time the thickness of the pattern substrate is 0.2 mm away from the final design thickness, and then step S4.1.1 is executed.

[0008] According to some embodiments of the present invention, step S4 further includes step S4.2.1, after grinding the surface to be processed of the pattern substrate, rough polishing is performed. The rough polishing adopts an oscillating polishing method, with the polishing spindle speed controlled at 100-120 rpm and the air pressure controlled at 4-5 kg / cm². 2 The oscillation speed is controlled at 8-10 times / minute; in step S4.2.2, the surface to be processed on the graphic substrate is finely polished using an oscillating polishing method, with the polishing spindle speed controlled at 40-60 rpm and the air pressure controlled at 1-2 kg / cm². 2 The swing speed should be controlled at 3 to 5 times per minute.

[0009] According to some embodiments of the present invention, in step S1, the thickness of the coated protective layer is controlled to be 2-5 μm.

[0010] According to some embodiments of the present invention, the initial thickness of the patterned substrate to be processed is greater than or equal to 2 mm.

[0011] According to some embodiments of the present invention, the surface profiles of both the first pad and the second pad reach 1 / 4λ, and the parallelism of both the first pad and the second pad is less than or equal to 5 seconds.

[0012] According to some embodiments of the present invention, the parallelism of the auxiliary pad is less than or equal to 5 seconds.

[0013] According to some embodiments of the present invention, in step S2, at least three auxiliary pads are placed on the first pad.

[0014] According to some embodiments of the present invention, in step S3, the parallelism between the second pad and the disk surface is less than or equal to 5 seconds during the loading of the disk.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the structure of the graphic substrate in conjunction with the first pad, the second pad, and the auxiliary pad block according to an embodiment of the present invention.

[0017] Icon labels: Graphic substrate 100, first pad 200, second pad 300, auxiliary pad 400. Detailed Implementation

[0018] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0019] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0020] In the description of this invention, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features or their sequential relationship.

[0021] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0022] Ultra-planar machining refers to the ultra-precision machining of a planar surface to obtain a high-precision patterned substrate with a thickness of less than 1 mm. High precision in patterned substrates means that the pattern CD (cutoff area) is better than 0.5 μm, i.e., the pattern CD is less than or equal to 0.5 μm. Simultaneously, the surface profile of the opposite side surfaces of the patterned layer of the patterned substrate can be better than 1 / 4λ.

[0023] A surface profile better than 1 / 4λ is considered good. Surface profile can be viewed as the smoothness of the surface, and deviations in surface profile are measured by the waviness value λ, typically using light with a wavelength of 632.8nm. A surface profile of 1λ indicates a general quality level. A surface profile better than 1 / 4λ indicates a quality level better than precision.

[0024] The term "mounting plate" refers to the process of fixing the product to be processed onto the plate of the worktable during optical component manufacturing.

[0025] Parallelism is an indicator that measures the amount of variation of an actual feature relative to a reference in the parallel direction. Specifically, 1 second of parallelism means an error of 1 mm over a distance of 100 mm.

[0026] An embodiment of the present invention discloses a method for fabricating an ultra-thin optical component hyperplane, used for fabricating a patterned substrate, wherein one side surface of the patterned substrate has a patterned layer, and includes the following fabrication steps: Step S1: Coat a protective layer on one side of the patterned substrate with the patterned layer, and the side of the patterned substrate opposite to the patterned layer is the surface to be processed; Step S2: Place one side of the patterned layer of the patterned substrate facing the first pad and fix the patterned substrate on the first pad. Place multiple auxiliary pads on the first pad and distribute the multiple auxiliary pads around the patterned substrate. Place the second pad on the surface of the patterned substrate to be processed, so that the patterned substrate is clamped between the first pad and the second pad. Adjust the auxiliary pads so that the parallelism between the first pad and the second pad reaches the set value. Step S3: Place the tray on the tray, and place the first pad on the tray surface, ensuring that the parallelism between the second pad and the tray surface reaches the set value, and then remove the second pad. Step S4: Grind and polish the surface of the graphic substrate to be processed until the thickness of the graphic substrate, the surface shape of the processed surface, and the parallelism of the processed surface all reach the set values.

[0027] First, the graphic substrate is patterned, and then the graphic substrate is thinned to the designed thickness by removing material, which can produce ultra-thin optical components with a thickness of 1 mm or less, while the graphic CD accuracy can be better than 0.5 μm. The graphic substrate is patterned before thinning, and the film layer stress has less impact on the thicker image substrate during the coating patterning, and the graphic CD accuracy can be better than 0.5 μm.

[0028] The patterned substrate 100 has a pattern layer. In subsequent material removal processes, a protective layer needs to be coated onto the pattern layer to protect it. Preferably, the coating thickness of the protective layer is controlled between 2-5 μm.

[0029] Reference Figure 1 As shown, the graphic substrate 100 is placed on the first pad 200 and fixed, ensuring that the side of the graphic substrate coated with the protective layer faces the first pad. The graphic substrate and the first pad can be fixed using a photoresist method or an adhesive method. Then, multiple auxiliary pads 400 are placed on the first pad, surrounding the graphic substrate. Next, the second pad 300 is placed on the surface of the graphic substrate to be processed. The second pad is adjusted using the auxiliary pads to ensure that the parallelism between the second pad and the first pad reaches a set value. Preferably, the parallelism between the second pad and the first pad is controlled within 5 seconds.

[0030] Next, the plate-mounting operation is performed. The first pad is placed on the plate surface, ensuring that the parallelism between the second pad and the plate surface also reaches the set value. Preferably, the parallelism between the second pad and the plate surface is also controlled within 5 seconds. It should be understood that the side of the graphic substrate with the graphic layer has been patterned, and the surface shape of the graphic layer already meets the set value. However, the surface shape of the side of the graphic substrate to be processed is poor. If the graphic substrate is directly placed on the plate, it is difficult to ensure that the parallelism between the graphic layer and the plate surface reaches the set value, which will cause deviations in subsequent processing and may result in poor parallelism of the processed graphic substrate.

[0031] It is important to understand that the parallelism and surface shape of the first and second pads also need to meet set values. Preferably, the parallelism of the first pad is within 5 seconds, and the surface shape reaches 1 / 4λ; the parallelism of the second pad is also within 5 seconds, and the surface shape also reaches 1 / 4λ. The parallelism of the auxiliary pads is also preferably controlled within 5 seconds. It is important to understand that the better the parallelism of the auxiliary pads, the better the parallelism of the upper plate of the graphic substrate can be controlled. The number of auxiliary pads is preferably 3, but more than 3 auxiliary pads can also be used.

[0032] The graphic substrate has undergone graphic processing on one side with the graphic layer, and the surface shape of the graphic layer already meets the set values. Therefore, after the graphic substrate is fixed with the first pad, the first pad can be used as a reference surface. Then, an auxiliary pad and a second pad are placed. By adjusting the auxiliary pad, the parallelism between the second pad and the first pad is controlled to the set value. During the loading operation, the second pad can be used as a reference to adjust the parallelism between the second pad and the tray surface to the set value, preferably within 5 seconds. Next, after removing the second pad, the surface of the graphic substrate to be processed can be processed, ensuring that the parallelism of the processed graphic substrate reaches the set value, that is, the parallelism of the processed graphic substrate can be controlled within 5 seconds.

[0033] When removing material from the surface of the graphic substrate, a first pad, an auxiliary pad, and a second pad are used to clamp the graphic substrate and complete the mounting operation. This allows for precise positioning of the graphic substrate before processing, and the parallelism of the processed graphic substrate meets design requirements. The surface shape of the surface to be processed on the graphic substrate needs to be controlled through grinding and polishing.

[0034] It is understandable that step S4 also includes step S4.1.1, which involves rough grinding of the surface to be processed on the pattern substrate. The rough grinding adopts an oscillating grinding method, with the grinding spindle speed controlled at 40-60 rpm and the air pressure controlled at 4-5 kg / cm². 2 The oscillation speed is controlled at 7-10 times / minute; in step S4.1.2, the surface to be processed on the graphic substrate is finely ground using an oscillating grinding method, with the grinding spindle speed controlled at 30-40 rpm and the air pressure controlled at 1-2 kg / cm². 2 The swing speed should be controlled at 4 to 6 times per minute.

[0035] During rough grinding, the grinding time is preferably 20 minutes. During fine grinding, the grinding time is preferably 30 minutes. After grinding, the surface of the graphic substrate to be processed should have a surface shape within 1λ and a parallelism within 10 seconds. Preferably, after grinding, the thickness of the graphic substrate should differ from the set thickness by 0.01mm, and then polishing should be performed until the set thickness is reached. Of course, the thickness difference of the graphic substrate from the set thickness can also have a tolerance of ±0.005mm. That is, the maximum can reach 0.015mm, and the minimum can reach 0.005mm.

[0036] It is understandable that in step S4, the pattern substrate is first ground to a thickness of less than 1 mm, and at this time the thickness of the pattern substrate is 0.2 mm away from the final design thickness, and then step S4.1.1 is executed.

[0037] To minimize the impact of coating stress during pattern fabrication on the pattern substrate, a glass sheet with a thickness of 2 mm or more is preferably used. This sheet is then reduced to the desired thickness using a method for fabricating ultra-thin optical components with a hyperplane surface. It's important to understand that this process is for ultra-thin optical components, which are typically 1 mm or less thick. Therefore, before rough grinding, the pattern substrate is rapidly reduced to 1 mm or less using grinding. However, the thickness of the pattern substrate before rough grinding must be within 0.2 mm of the final design thickness. Of course, a 0.2 mm difference between the pattern substrate thickness and the set thickness can be within a tolerance of ±0.05 mm.

[0038] It is understandable that step S4 also includes step S4.2.1, after grinding the surface of the pattern substrate to be processed, rough polishing is performed. The rough polishing adopts an oscillating polishing method, with the polishing spindle speed controlled at 100-120 rpm and the air pressure controlled at 4-5 kg / cm². 2 The oscillation speed is controlled at 8-10 times / minute; in step S4.2.2, the surface to be processed on the graphic substrate is finely polished using an oscillating polishing method, with the polishing spindle speed controlled at 40-60 rpm and the air pressure controlled at 1-2 kg / cm². 2 The swing speed should be controlled at 3 to 5 times per minute.

[0039] During rough polishing, the preferred polishing time is 40 minutes. During fine polishing, the preferred polishing time is 60 minutes. After polishing, the processed surface of the pattern substrate can achieve a surface shape within 1 / 4λ, a parallelism within 5 seconds, and a surface finish of 20-10. It should be understood that after the final polishing, the surface to be processed on the pattern substrate becomes the processed surface.

[0040] It is important to understand that after fine polishing, the surface of the patterned substrate to be processed can be subjected to final low-polishing and shaping. The surface shape of the processed surface after processing can reach within 1 / 4λ, the parallelism can be within 5 seconds, and the surface finish can reach the index of 20 to 10.

[0041] It is understandable that in step S1, the thickness of the coated protective layer is controlled between 2-5 μm.

[0042] The thickness of the protective layer is controlled at 2-5μm, which can protect the pattern layer without affecting the parallelism between the pattern substrate and the first pad, and also without affecting the parallelism of the pattern substrate when it is mounted.

[0043] It is understandable that the initial thickness of the pattern substrate to be processed is greater than or equal to 2mm.

[0044] In order to reduce the impact of coating stress when processing patterned surfaces on the patterned substrate, it is preferable to use glass sheets with a thickness of 2 mm or more for the patterned substrate.

[0045] It is understandable that the surface profiles of both the first and second pads reach 1 / 4λ, and the parallelism of both the first and second pads is less than or equal to 5 seconds.

[0046] Understandably, the parallelism of the auxiliary pad is less than or equal to 5 seconds.

[0047] The better the parallelism of the auxiliary pads, the better the parallelism of the pattern substrate after mounting, and the better the parallelism of the processed surfaces.

[0048] It is understandable that in step S2, at least three auxiliary pads are placed on the first pad.

[0049] The preferred number of auxiliary pads is three. The three auxiliary pads can better define a plane, which is beneficial for adjusting the second pad until the parallelism between the second pad and the first pad reaches the set value.

[0050] Understandably, in step S3, the parallelism between the second pad and the plate surface during the plate loading process is less than or equal to 5 seconds.

[0051] In some embodiments, a 2mm patterned substrate is selected, and the surface of the patterned substrate has already been patterned. A protective layer with a thickness of 3μm is coated on the side of the patterned substrate with the patterned layer. The patterned side of the patterned substrate faces the first pad, and the patterned substrate is fixed on the first pad. Three auxiliary pads are placed on the first pad, distributed around the patterned substrate. A second pad is placed on the surface of the patterned substrate to be processed, so that the patterned substrate is clamped between the first and second pads. The auxiliary pads are adjusted so that the parallelism between the first and second pads reaches 5 seconds. Specifically, the parallelism of the first pad reaches 5 seconds, and the surface shape reaches 1 / 4λ. The parallelism of the second pad also reaches 5 seconds, and the surface shape also reaches 1 / 4λ. The parallelism of the auxiliary pads is also controlled within 5 seconds.

[0052] Place the first pad on the platen and ensure the second pad is parallel to the platen surface for 5 seconds, then remove the second pad. Perform rough grinding on the surface of the graphic substrate using an oscillating grinding method, controlling the grinding spindle speed at 50 rpm and the air pressure at 4 kg / cm². 2 The oscillation speed is controlled at 8 times / minute, and the grinding time is 20 minutes. The surface to be processed on the graphic substrate is then finely ground using an oscillating grinding method. The grinding spindle speed is controlled at 40 rpm, and the air pressure is controlled at 1.5 kg / cm². 2The oscillation speed was controlled at 5 times / minute, and the grinding time was 30 minutes. After grinding, the thickness of the patterned substrate differed from the set thickness by 0.01mm, and then polishing was performed.

[0053] After grinding the surface of the graphic substrate, rough polishing is performed using an oscillating polishing method. The polishing spindle speed is controlled at 120 rpm, and the air pressure is controlled at 5 kg / cm². 2 The oscillation speed is controlled at 10 times / minute, and the polishing time is 40 minutes. The surface of the graphic substrate to be processed is then finely polished using an oscillating polishing method. The polishing spindle speed is controlled at 60 rpm, and the air pressure is controlled at 2 kg / cm². 2 The oscillation speed is controlled at 5 times / minute, and the polishing time is 60 minutes; finally, a low-level polishing repair is performed. The surface profile of the processed patterned substrate can reach within 1 / 4λ, the parallelism can be within 5 seconds, and the surface finish can reach the index of 20-10.

[0054] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A method for fabricating a hyperplane of an ultrathin optical component, used to fabricate a patterned substrate, wherein one side surface of the patterned substrate has a patterned layer, characterized in that... The processing steps include the following: Step S1: A protective layer is coated on one side surface of the graphic substrate having the graphic layer, and the side surface of the graphic substrate opposite to the graphic layer is the surface to be processed; Step S2: The pattern layer of the pattern substrate is oriented towards the first pad, and the pattern substrate is fixed on the first pad. A plurality of auxiliary pads are placed on the first pad and distributed around the pattern substrate. A second pad is placed on the surface of the pattern substrate to be processed, so that the pattern substrate is clamped between the first pad and the second pad. The auxiliary pads are adjusted so that the parallelism between the first pad and the second pad reaches a set value. Step S3: Place the tray on the tray surface, and ensure that the parallelism between the second tray and the tray surface reaches the set value. Then remove the second tray. Step S4: Grind and polish the surface to be processed on the graphic substrate until the thickness, surface shape, and parallelism of the graphic substrate all reach the set values.

2. The method for fabricating a hyperplane of an ultrathin optical component according to claim 1, characterized in that, Step S4 also includes, Step S4.1.1: Rough grinding is performed on the surface to be processed of the graphic substrate. The rough grinding adopts an oscillating grinding method, with the grinding spindle speed controlled at 40-60 rpm and the air pressure controlled at 4-5 kg / cm². 2 The swing speed should be controlled at 7-10 times per minute; Step S4.1.2: The surface to be processed on the graphic substrate is finely ground using an oscillating grinding method. The grinding spindle speed is controlled at 30-40 rpm, and the air pressure is controlled at 1-2 kg / cm². 2 The swing speed should be controlled at 4 to 6 times per minute.

3. The method for fabricating a hyperplane of an ultrathin optical component according to claim 2, characterized in that, In step S4, the pattern substrate is first ground to a thickness of less than 1 mm, and at this time the thickness of the pattern substrate is 0.2 mm away from the final design thickness, and then step S4.1.1 is executed.

4. The method for fabricating a hyperplane of an ultrathin optical component according to claim 1, characterized in that, Step S4 also includes, Step S4.2.1: After grinding the surface to be processed on the graphic substrate, rough polishing is performed. The rough polishing adopts an oscillating polishing method, with the polishing spindle speed controlled at 100-120 rpm and the air pressure controlled at 4-5 kg / cm². 2 The swing speed should be controlled at 8-10 times per minute; Step S4.2.2: Perform fine polishing on the surface to be processed of the graphic substrate. Fine polishing adopts an oscillating polishing method, with the polishing spindle speed controlled at 40-60 rpm and the air pressure controlled at 1-2 kg / cm². 2 The swing speed should be controlled at 3 to 5 times per minute.

5. The method for fabricating a hyperplane of an ultrathin optical component according to claim 1, characterized in that, In step S1, the thickness of the coated protective layer is controlled to be 2-5 μm.

6. The method for fabricating a hyperplane of an ultrathin optical component according to claim 1, characterized in that, The initial thickness of the patterned substrate to be processed is greater than or equal to 2 mm.

7. The method for fabricating a hyperplane of an ultrathin optical component according to claim 1, characterized in that, The surface profiles of both the first pad and the second pad reach 1 / 4λ, and the parallelism of both the first pad and the second pad is less than or equal to 5 seconds.

8. The method for fabricating a hyperplane of an ultrathin optical component according to claim 7, characterized in that, The parallelism of the auxiliary pad is less than or equal to 5 seconds.

9. The method for fabricating a hyperplane of an ultrathin optical component according to claim 1, characterized in that, In step S2, at least three auxiliary pads are placed on the first pad.

10. The method for fabricating a hyperplane of an ultrathin optical component according to claim 1, characterized in that, In step S3, the parallelism between the second pad and the disk surface during the loading process is less than or equal to 5 seconds.

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