一种晶锭整形加工装备
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI MACHINE TOOL WORK
- Filing Date
- 2025-03-18
- Publication Date
- 2026-07-17
AI Technical Summary
Existing ingot processing technologies suffer from inaccurate positioning, inefficient crystal orientation detection and angle adjustment, lack of processing flexibility, and poor equipment compatibility, which affect wafer processing quality and production efficiency, and fail to meet the demands for high precision, high efficiency, and diversity.
Employing a dedicated workpiece clamping module, vacuum adsorption positioning, crystal orientation detector, and modular design, combined with end face grinding wheel, outer cylindrical grinding wheel, and slotted grinding wheel modules, it achieves high-precision positioning, rapid crystal orientation detection, and angle adjustment, adapting to the processing of various crystal ingot specifications.
It improves the precision of ingot processing and equipment compatibility, meets diverse needs, reduces scrap rates, enhances production efficiency and product quality, and strengthens market competitiveness.
Smart Images
Figure CN119871158B_ABST