A continuous pressing device and process for preparing a quantum dot film

By designing a sliding shell, scraper, and positioning mechanism to remove excess adhesive from the quantum dot film preparation device, the problem of adhesive solidification at the film edge was solved, thereby improving the uniformity of quantum dot film thickness and optical performance.

CN119871913BActive Publication Date: 2026-06-16NANJING BREADY ELECTRONICS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NANJING BREADY ELECTRONICS CO LTD
Filing Date
2025-01-02
Publication Date
2026-06-16

AI Technical Summary

Technical Problem

In existing continuous pressing devices, when preparing quantum dot films, the quantum dot adhesive overflows from the film edges and solidifies on the extrusion rollers, resulting in a shortened effective pressing distance at the edges of the quantum dot film, uneven thickness, and affecting optical performance and usability.

Method used

A continuous pressing device for quantum dot film preparation was designed, including a sliding shell, a scraper, a positioning mechanism, and a continuous scraping mechanism. The sliding shell moves on the connecting frame to scrape off excess adhesive, the positioning mechanism ensures the stable position of the scraper, the continuous scraping mechanism scrapes off residual adhesive at the edge of the quantum dot film, and the bending mechanism removes air bubbles from the film surface to ensure uniform thickness of the quantum dot film.

🎯Benefits of technology

Effectively scrapes off excess adhesive from the pressing roller, maintains a constant effective pressing distance at the edge of the quantum dot film, ensures uniform thickness of the quantum dot film, improves optical performance and application effect, and avoids adhesion and air bubbles.

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Abstract

The application relates to the technical field of quantum dot film preparation, and particularly discloses a continuous pressing device and process for quantum dot film preparation. The device comprises a machine tool, two winding rollers and multiple guide rollers are installed on the machine tool, two fixing frames are fixedly connected to the machine tool, two supporting sliding blocks are slidably connected to the fixing frames, pressing rollers are rotatably connected to the supporting sliding blocks on the same side of the fixing frames, a connecting frame is fixedly connected to the supporting sliding blocks, a sliding shell is limitingly and slidably connected to the connecting frame, a scraper is slidably connected to the sliding shell, and the scraper extrudes adjacent pressing rollers. The sliding shell moves on the connecting frame, the scraper accurately scrapes off the overflow glue on the pressing rollers, the possibility of the overflow glue gathering and solidifying on the pressing rollers is reduced, the effective pressing distance of the edges of the quantum dot film is unchanged, and the quantum dot film with uniform thickness is prepared.
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