Liquid epoxy resin mixture, process for its preparation and use thereof

Abstract

The application discloses a liquid epoxy resin composition, a preparation method and application thereof, and raw material components of the liquid epoxy resin composition are as follows in percentage by mass: inorganic silicon filler 70-92%, aliphatic epoxy resin 0.5-10%, aromatic ring-containing epoxy resin 0.5-15%, acid anhydride curing agent 1-15%, adhesion promoter 0.1-2%, curing accelerator 0.1-1%, toughening agent 0.1-5% and warpage control additive 0.1-5%. The liquid epoxy resin composition provided by the application not only has a relatively high glass transition temperature and modulus, but also can control the warpage deformation amount of the composition through the warpage control additive, and is especially suitable for packaging protection of 12-inch wafers, and the warpage control can reduce the stress generation in the wafer packaging process.

Description

Technical Field

[0001] This application belongs to the field of semiconductor electronic packaging materials, and particularly relates to a liquid epoxy resin mixture, its preparation method and application. Background Technology

[0002] In recent years, with the continuous development of integrated circuits, electronic packaging has faced new demands for low cost, high performance, and high integration. Simultaneously, its size is trending towards smaller, lighter, and thinner designs. Wafer-level packaging, as an advanced packaging technology, better meets the needs and trends of consumer electronics development. Traditional packaging materials generally use epoxy molding compounds, but these cannot meet the stringent requirements of miniaturization, such as shorter spacing between metal leads and thinner packaging devices. Wafer-level packaging, on the other hand, involves manipulating the wafer for most of the packaging process before dicing it into individual chips. Molding is a crucial step, often using liquid epoxy resin mixtures for compression molding, simultaneously molding and monolithizing the entire wafer, thus significantly improving production efficiency and reducing costs. It is mainly prepared from low-viscosity liquid epoxy resin, spherical silicon micropowder, epoxy curing agents and accelerators, silicon micropowder surface treatment agents, and other functional additives through appropriate processes.

[0003] However, wafers encapsulated in wafer-level packaging are prone to warpage, which in turn affects the yield of subsequent processes such as grinding, dicing, and assembly. Wafer warpage is mainly caused by factors such as curing shrinkage of the epoxy resin composition, uneven shrinkage of the 12-inch wafer material, orientation effects caused by shear stress during wafer molding, and differences in the coefficients of thermal expansion between the material and the wafer. Excessive warpage affects the usability of the packaged chip, and generally, a warpage height of 2cm to 3cm is required for convenient use. Packaged products with a warpage height exceeding 3cm are treated as defective products in industrial production, indirectly increasing packaging costs. Therefore, providing a low-warpage liquid epoxy resin composition to achieve low-cost packaging of electronic products is a pressing technical problem that needs to be solved.

[0004] Existing patent CN115703918A suppresses warpage by improving the flexibility of the resin system and reducing the coefficient of thermal expansion of the epoxy resin composition. Patent CN116462936A uses a dibenzo-octane anhydride curing agent to adjust the coefficient of thermal expansion of the cured epoxy resin composition, effectively reducing warpage of the molded part after resin encapsulation. Patent CN116694275A introduces small-diameter silica particles to reduce the increase in length of the liquid epoxy molding compound in a certain direction at a unit temperature during the molding stage, effectively reducing the coefficient of thermal expansion of the liquid epoxy molding compound during the molding stage, thereby reducing warpage during wafer encapsulation. It is evident that most existing technologies control warpage by controlling the coefficient of thermal expansion of the epoxy resin composition, but this method cannot simultaneously maintain the high fluidity of the epoxy resin composition. Summary of the Invention

[0005] In order to solve the problems mentioned in the background art, the present invention aims to provide a liquid epoxy resin composition with high fluidity and low warpage, which not only has high fluidity and low coefficient of thermal expansion, but also has the characteristics of low warpage deformation.

[0006] Another object of the present invention is to provide a method for preparing and using such a highly fluid, low-warpage liquid epoxy resin composition.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0008] On one hand, the present invention provides a liquid epoxy resin composition, wherein the raw material composition comprises, by weight percentage:

[0009] The composition includes 70%-92% inorganic silicon filler, 0.5%-10% aliphatic epoxy resin, 0.5%-15% aromatic ring-containing epoxy resin, 1-15% acid anhydride curing agent, 0.1-2% adhesion accelerator, 0.1-1% curing accelerator, 0.1-5% toughening agent, and 0.1-5% warpage control aid; among which...

[0010] The aromatic ring-containing epoxy resin is an epoxy resin whose molecular chain contains an aromatic ring.

[0011] The inorganic silicon filler is an inorganic silicon filler modified with a silane coupling agent containing an olefin chain with C5-C20 carbon atoms.

[0012] Furthermore, its raw material composition, by mass percentage, is as follows:

[0013] The composition includes 80%-92% inorganic silicon filler, 1%-5% aliphatic epoxy resin, 1%-10% aromatic ring-containing epoxy resin, 1-10% acid anhydride curing agent, 0.1-2% adhesion accelerator, 0.1-1% curing accelerator, 1-5% toughening agent, and 0.5-5% warpage control aid.

[0014] Preferably, the inorganic silicon filler is an inorganic silicon filler modified with a silane coupling agent containing an olefin chain with C5-C15 carbon atoms;

[0015] More preferably, the inorganic silicon filler is an inorganic silicon filler modified with a silane coupling agent containing an olefin chain with C10-C15 carbon atoms; for example, silicon dioxide modified with a silane coupling agent containing an olefin chain with C10-C15 carbon atoms.

[0016] Furthermore, the modified inorganic silicon filler is spherical in shape, with an average particle size of 1μm to 50μm, preferably 10-30μm.

[0017] Furthermore, the aliphatic epoxy resin is an aliphatic epoxy resin that does not have a cyclic structure other than epoxy groups;

[0018] Preferably, the aliphatic epoxy resin includes at least one of the following: vinyl glycidyl ether, allyl glycidyl ether, alkylene glycol diglycidyl ether, poly(alkylene glycol) diglycidyl ether, alkenyl glycol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol glycidyl ether, and dipentaerythritol glycidyl ether.

[0019] Furthermore, the aliphatic epoxy resin is one or more of poly(alkylene glycol) diglycidyl ether, alkenyl glycol diglycidyl ether, and trimethylolpropane triglycidyl ether.

[0020] Further, the aromatic ring-containing epoxy resin includes one or a combination of at least two of the following: bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl-type epoxy resin, naphthyl ring epoxy resin, bisphenol AD ​​epoxy resin, p-hydroxybenzoic acid, diglycidyl aniline, 1,1,2,2-tetra(p-hydroxyphenyl)ethane tetraglycidyl ether epoxy resin, and p-aminophenol triglycidyl epoxy resin.

[0021] Furthermore, the anhydride curing agent is selected from one or a combination of at least two of phthalic anhydride, trimellitic anhydride glycerol, polyazelaic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, glutaric anhydride, dichlorocis-butenedioic anhydride, ethylene glycol bis(triphenyl)-butylene anhydride ester, and succinic anhydride.

[0022] Preferably, the adhesion promoter is selected from one or a combination of at least two of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, propyl glycidyl ether trimethoxysilane, γ-epoxypropyl ether trimethoxysilane, trimethoxysilane, γ-aminopropyltriethoxysilane, and γ-mercaptopropyltrimethoxysilane.

[0023] Preferably, the curing accelerator is selected from one or a combination of two of imidazole compounds and triphenylphosphine; more preferably, the imidazole compound is selected from one or a combination of at least two of 2-phenyl-4,5-dihydroxymethylimidazolium, 2-methylimidazolium, 2-phenylimidazolium, dimethyl-imidazolium triisocyanate, triphenylphosphine, and triphenylphosphine-1,4-benzoquinone adduct.

[0024] Preferably, the toughening agent is selected from one or a combination of at least two of the following: nitrile rubber, polysulfide rubber, polybutadiene, polyether elastomer, silicone resin, silicone rubber, silicone-modified epoxy resin, polyether-modified epoxy resin, and modified polyurethane.

[0025] Preferably, the warpage control agent is one or a combination of at least two of the following: silicone oils, silane coupling agents, silicone rubber, silicone resin, fatty alcohol sulfates, alkyl phosphates, and sulfonate anionic surfactants; more preferably, it is at least one of the following: silicone oils, silane coupling agents, silicone rubber, and silicone resin.

[0026] Preferably, the warpage control agent is one or a combination of at least two of the following: methyl silicone oil, ethyl silicone oil, phenyl silicone oil, methyl hydrogen silicone oil, methyl phenyl silicone oil, methyl chlorophenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoropropyl silicone oil, methyl vinyl silicone oil, methyl hydroxy silicone oil, ethyl hydrogen silicone oil, hydroxy hydrogen silicone oil, single-terminal modified silicone oil, side-chain modified silicone oil, two-terminal modified silicone oil, and polyorganosiloxane.

[0027] More preferably, the warpage control agent is selected from one or a combination of at least two of methyl silicone oil, single-terminal modified silicone oil, and two-terminal modified silicone oil.

[0028] On the other hand, the present invention provides a method for preparing any of the above-described liquid epoxy resin compositions, comprising the following steps: mixing the alicyclic epoxy resin, the aromatic epoxy resin, the anhydride curing agent, the curing accelerator, the toughening agent, the warpage control agent, and the inorganic silica filler, and premixing them to obtain a mixture; grinding the mixture to the target particle size, and then performing vacuum degassing to obtain a liquid epoxy resin mixture.

[0029] In another aspect, the present invention also provides the application of the aforementioned liquid epoxy resin composition or the liquid epoxy resin composition prepared by the aforementioned preparation method in the 2.5D / 3D advanced packaging WLCSP or CoWoS packaging process of integrated circuits.

[0030] Compared with the prior art, the beneficial effects of the present invention are:

[0031] The liquid epoxy resin composition provided by this invention, by introducing a warpage control agent, alters the surface tension of the contact interface, eliminates the orientation effect, and suppresses warpage. Furthermore, due to the functional groups on the molecular chain of the warpage control agent, the curing shrinkage internal stress of the epoxy resin composition can be further reduced. Therefore, the liquid epoxy resin composition provided by this invention not only possesses high fluidity and a low coefficient of thermal expansion, but also allows for warpage control based on the fluidity differences at the encapsulation contact interface. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with specific implementation methods. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] Unless otherwise specified, all raw materials, reagents, instruments and equipment used in this application can be purchased from the market or prepared by existing methods.

[0034] The sources of each ingredient are as follows:

[0035] Aliphatic epoxy resin (Anhui Xinyuan);

[0036] Aromatic epoxy resins (Nippon Steel Corporation "YD8125, YD8170", DIC Corporation HP4032D);

[0037] Anhydride curing agent (Zhejiang Alpha Chemical AMH850);

[0038] Accelerator (purchased from Merck Chemicals);

[0039] Modified silica NQ1175D, 25W1, and S31055EA (purchased from Jiangsu Lianrui New Materials Co., Ltd.);

[0040] Toughening agent (purchased from Shenzhen Jiadida Chemical Co., Ltd.);

[0041] Adhesion promoters γ-(2,3-epoxypropoxy)propyltrimethoxysilane KH560 and γ-aminopropyltriethoxysilane KH550 were purchased from Hangzhou Jessica Co., Ltd.

[0042] Warp control aids (organosilicon compounds KF96, X-22-163, and X-22-173 were purchased from Shin-Yue Chemical, and sulfonate aid Tamol NN9401 was purchased from BASF).

[0043] The performance testing methods involved in the following embodiments are as follows:

[0044] Warpage Evaluation: A liquid epoxy resin composition was compressed and molded for 10 minutes at 5 MPa and 125 °C on a 775 μm thick, 300 mm diameter wafer using a Yamada compression molding machine to obtain an encapsulation material with a thickness of 1500 μm. The prepared compression-molded sample was cured at 150 °C for 1 hour to obtain samples for warpage testing. The cured sample was placed on a horizontal test bench, with a ruler placed vertically on the test bench and close to the sample, and the highest point of edge warpage was recorded as the warpage deformation.

[0045] Evaluation of coefficient of thermal expansion and glass transition temperature (Tg): Cured products with dimensions of 3 mm × 3 mm × 4 mm were measured using a TMA450 instrument manufactured by TA Instruments. Measurements were taken at a heating rate of 5 °C / min from 10 °C to 280 °C. The coefficient of thermal expansion (ppm / °C) between 25 °C and 60 °C is defined as CTE1, and the coefficient of thermal expansion (ppm / °C) between 170 °C and 220 °C is defined as CTE2. The intersection of the two tangents is defined as Tg.

[0046] Example 1

[0047] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0048]

[0049]

[0050] The liquid epoxy resin composition in this invention is prepared by the following method:

[0051] First, epoxy resin, acid anhydride curing agent, toughening agent, adhesion accelerator, and warpage control agent are uniformly mixed at room temperature. The mixture obtained above is then thoroughly mixed with inorganic filler at 35°C and cooled to room temperature. Finally, curing accelerator is added and mixed evenly to obtain a liquid epoxy resin composition.

[0052] In this embodiment, the liquid epoxy resin composition has a Tg of 153°C, a thermal expansion coefficient CTE1 of 7ppm / K, a CTE2 of 31ppm / K, and a warpage of 2mm.

[0053] Example 2

[0054] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0055] Components mass percentage / % Aliphatic epoxy resin XY207 2.5 Aromatic epoxy resin YD8170 0.8 Aromatic epoxy resin HP4032D 3.5 Acid anhydride curing agent AMH850 4.5 Adhesion accelerator KH560 0.1 Curing accelerator triphenylphosphine 0.5 Silica NQ1175D 87.5 Toughening agent MX154 0.1 Warp control additive X-22-163 0.5

[0056] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0057] In this embodiment, the liquid epoxy resin composition has a Tg of 151°C and a coefficient of thermal expansion CTE1:

[0058] 7.3ppm / K, CTE2: 32ppm / K, warpage deformation is 3mm.

[0059] Example 3

[0060] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0061] Components mass percentage / % Aliphatic epoxy resin XY622 0.9 Aliphatic epoxy resin XY632 1 Aromatic epoxy resin YD8125 0.7 Aromatic epoxy resin HP4032D 2.8 Acid anhydride curing agent AMH850 8 Adhesion accelerator KH560 0.5 Curing accelerator 1-methylimidazol 0.1 Silica NQ1175D 85 Toughening agent CTBNX13 0.5 Warp control additive X-22-173 0.5

[0062] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0063] In this embodiment, the liquid epoxy resin composition has a Tg of 147°C and a coefficient of thermal expansion CTE1:

[0064] 7.7ppm / K, CTE2: 35ppm / K, warpage is 3mm.

[0065] Example 4

[0066] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0067] Components mass percentage / % Aliphatic epoxy resin XY207 1.8 Aliphatic epoxy resin XY632 4 Aromatic epoxy resin YD8170 5 Aromatic epoxy resin HP4032D 8 Acid anhydride curing agent AMH850 10 Adhesion accelerator KH560 0.5 Curing accelerator 1-methylimidazol 0.1 Silica NQ1175D 70 Toughening agent CTBNX13 0.5 Warp control agent KF96 0.1

[0068] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0069] In this embodiment, the liquid epoxy resin composition has a Tg of 163°C, a thermal expansion coefficient CTE1 of 25ppm / K, a CTE2 of 48ppm / K, and a warpage of 4mm.

[0070] Example 5

[0071] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0072] Components mass percentage / % Aliphatic epoxy resin XY207 1.2 Aromatic epoxy resin HP4032D 1.5 Acid anhydride curing agent AMH850 3 Adhesion accelerator KH560 0.3 Curing accelerator 1-methylimidazol 0.5 25W silicon dioxide 90 Toughening agent MX54 2 Warp control additive X-22-163 1.5

[0073] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0074] In this embodiment, the liquid epoxy resin composition has a Tg of 160°C and a coefficient of thermal expansion CTE1:

[0075] 6.5ppm / K, CTE2: 29ppm / K, warpage deformation is 3mm.

[0076] Example 6

[0077] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0078]

[0079]

[0080] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0081] In this embodiment, the liquid epoxy resin composition has a Tg of 160°C, a thermal expansion coefficient CTE1 of 6ppm / K, a CTE2 of 33ppm / K, and a warpage of 2mm.

[0082] Example 7

[0083] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0084] Components mass percentage / % Aliphatic epoxy resin XY207 0.5 Aromatic epoxy resin YD8170 0.6 Acid anhydride curing agent AMH850 1.8 Adhesion accelerator KH560 0.5 Curing accelerator 2-methylimidazole 0.1 Silica NQ1175D 87 Toughening agent CTBNX13 4.5 Warp control agent KF96 5

[0085] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0086] In this embodiment, the liquid epoxy resin composition has a Tg of 162°C and a coefficient of thermal expansion CTE1:

[0087] 6.4ppm / K, CTE2: 31.3ppm / K, warpage deformation is 2.5mm.

[0088] Example 8

[0089] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0090]

[0091]

[0092] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0093] In this embodiment, the liquid epoxy resin composition has a Tg of 158°C and a coefficient of thermal expansion CTE1:

[0094] 7.3ppm / K, CTE2: 32ppm / K, warpage is 3.5mm.

[0095] Example 9

[0096] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0097] Components mass percentage / % Aliphatic epoxy resin XY622 6.3 Aromatic epoxy resin YD8170 6 Methyltetrahydrophthalic anhydride AMH100 12 Adhesion accelerator KH550 0.4 Curing accelerator 1-methylimidazol 0.8 Silica S31055EA 73 Toughening agent CTBNX13 1 Warp control agent Tamol NN9401 0.5

[0098] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0099] In this embodiment, the liquid epoxy resin composition has a Tg of 165°C, a coefficient of thermal expansion CTE1 of 25ppm / K, a CTE2 of 49ppm / K, and a warpage of 2.5mm.

[0100] Example 10

[0101] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0102]

[0103]

[0104] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0105] In this embodiment, the liquid epoxy resin composition has a Tg of 163°C, a coefficient of thermal expansion CTE1 of 24 ppm / K, a CTE2 of 51 ppm / K, and a warpage of 3.5 mm.

[0106] Comparative Example 1

[0107] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0108] Components mass percentage / % Aliphatic epoxy resin XY622 1.6 Aromatic epoxy resin HP4032D 4.5 Acid anhydride curing agent AMH850 5.5 Adhesion accelerator KH560 0.1 Curing accelerator triphenylphosphine 0.2 Silica NQ1175D 88 Toughening agent MX154 0.1

[0109] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0110] In this embodiment, the liquid epoxy resin composition has a Tg of 159°C and a coefficient of thermal expansion CTE1:

[0111] 7.5ppm / K, CTE2: 34.3ppm / K, warpage deformation is 8.5mm.

[0112] Comparative Example 2

[0113] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0114]

[0115]

[0116] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0117] In this embodiment, the liquid epoxy resin composition has a Tg of 135°C, a coefficient of thermal expansion CTE1 of 32 ppm / K, a CTE2 of 65 ppm / K, and a warpage of 9.3 mm.

[0118] Comparative Example 3

[0119] The component distribution of the liquid epoxy resin composition is shown in the table below:

[0120] Components mass percentage / % Aliphatic epoxy resin XY632 5.7 Aromatic epoxy resin YD8170 5.3 Methylhexahydrophthalic anhydride AMH850 12.8 Adhesion accelerator KH560 0.3 Curing accelerator 2-methylimidazole 0.5 Silica NQ1175D 70 Toughening agent CTBNX13 0.1 Warp control additive X-22-173 5.3

[0121] In this embodiment, the liquid epoxy resin composition was prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0122] In this embodiment, the liquid epoxy resin composition has a Tg of 128°C, a coefficient of thermal expansion CTE1 of 27 ppm / K, a CTE2 of 52 ppm / K, and a warpage of 7.5 mm.

[0123] As can be seen from the warpage results of the examples and comparative examples, the examples within the scope of the present invention have good performance in terms of warpage deformation. Compared with comparative examples 1-3, the lack of warpage control additives and the adjustment of the proportions of each component in the composition changed the flowability of the epoxy resin composition and the upper and lower contact interfaces during the molding process, reducing the influence of the orientation effect on warpage, and thus further reducing warpage.

Claims

1. A liquid epoxy resin composition, characterized in that, Its raw material composition, by mass percentage, includes: The composition includes: 70%-92% inorganic silicon filler, 0.5%-10% aliphatic epoxy resin, 0.5%-15% aromatic ring-containing epoxy resin, 1-15% acid anhydride curing agent, 0.1-2% adhesion accelerator, 0.1-1% curing accelerator, 0.1-5% toughening agent, and 0.1-5% warpage control aid. The aromatic ring-containing epoxy resin is an epoxy resin whose molecular chain contains an aromatic ring. The inorganic silicon filler is an inorganic silicon filler modified with a silane coupling agent containing an olefin chain with C5-C20 carbon atoms; The toughening agent is selected from one or a combination of at least two of the following: nitrile rubber, polysulfide rubber, polybutadiene, polyether elastomer, silicone resin, silicone rubber, silicone-modified epoxy resin, polyether-modified epoxy resin, and modified polyurethane. The warpage control agent is one or a combination of at least two of the following: silicone oils, silane coupling agents, silicone rubber, silicone resins, fatty alcohol sulfates, alkyl phosphates, and sulfonate anionic surfactants.

2. The liquid epoxy resin composition according to claim 1, characterized in that, The inorganic silicon filler is an inorganic silicon filler modified with a silane coupling agent containing an olefin chain with C5-C15 carbon atoms.

3. The liquid epoxy resin composition according to claim 2, characterized in that, The inorganic silicon filler is an inorganic silicon filler modified with a silane coupling agent containing an olefin chain with 10-15 carbon atoms.

4. The liquid epoxy resin composition according to claim 3, characterized in that, The modified inorganic silicon filler is spherical in shape with an average particle size of 1 μm to 50 μm.

5. The liquid epoxy resin composition according to claim 4, characterized in that, The modified inorganic silicon filler has an average particle size of 10-30 μm.

6. The liquid epoxy resin composition according to claim 1, characterized in that, The aliphatic epoxy resin is an aliphatic epoxy resin that does not have a cyclic structure other than epoxy groups.

7. The liquid epoxy resin composition according to claim 6, characterized in that, The aliphatic epoxy resin includes at least one of vinyl glycidyl ether, allyl glycidyl ether, alkylene glycol diglycidyl ether, poly(alkylene glycol) diglycidyl ether, alkenyl glycol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol glycidyl ether, and dipentaerythritol glycidyl ether.

8. The liquid epoxy resin composition according to any one of claims 1 to 7, characterized in that, The aromatic ring-containing epoxy resin includes one or a combination of at least two of the following: bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl-type epoxy resin, naphthalene ring epoxy resin, bisphenol AD ​​epoxy resin, p-hydroxybenzoic acid, diglycidyl aniline, 1,1,2,2-tetra(p-hydroxyphenyl)ethane tetraglycidyl ether epoxy resin, and p-aminophenol triglycidyl epoxy resin.

9. The liquid epoxy resin composition according to any one of claims 1 to 7, characterized in that, The anhydride curing agent is selected from one or a combination of at least two of the following: phthalic anhydride, trimellitic anhydride glyceride, polyazelaic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, glutaric anhydride, dichlorocis-butenedioic anhydride, ethylene glycol bis(triphenyl)-butylene anhydride ester, and succinic anhydride.

10. The liquid epoxy resin composition according to any one of claims 1 to 7, characterized in that, The adhesion promoter is selected from one or a combination of at least two of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, trimethoxysilane, γ-aminopropyltriethoxysilane, and γ-mercaptopropyltrimethoxysilane.

11. The liquid epoxy resin composition according to any one of claims 1 to 7, characterized in that, The curing accelerator is selected from one or a combination of two of imidazole compounds and triphenylphosphine.

12. The liquid epoxy resin composition according to claim 11, characterized in that, The curing accelerator is selected from one or a combination of at least two of 2-phenyl-4,5-dihydroxymethylimidazolium, 2-methylimidazolium, 2-phenylimidazolium, dimethyl-imidazolium triisocyanate, triphenylphosphine, and triphenylphosphine-1,4-benzoquinone adduct.

13. The liquid epoxy resin composition according to claim 1, characterized in that, The warpage control agent is at least one of silicone oil, silane coupling agent, silicone rubber, and silicone resin.

14. The liquid epoxy resin composition according to claim 13, characterized in that, The warpage control agent is one or a combination of at least two of the following: methyl silicone oil, ethyl silicone oil, phenyl silicone oil, methyl hydrogen silicone oil, methyl phenyl silicone oil, methyl chlorophenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoropropyl silicone oil, methyl vinyl silicone oil, methyl hydroxy silicone oil, ethyl hydrogen silicone oil, hydroxy hydrogen silicone oil, single-terminal modified silicone oil, side-chain modified silicone oil, two-terminal modified silicone oil, and polyorganosiloxane.

15. The liquid epoxy resin composition according to claim 14, characterized in that, The warpage control agent is selected from one or a combination of at least two of the following: methyl silicone oil, single-terminal modified silicone oil, and two-terminal modified silicone oil.

16. A method for preparing the liquid epoxy resin composition according to any one of claims 1 to 15, characterized in that, Includes the following steps: The aliphatic epoxy resin, the aromatic epoxy resin, the anhydride curing agent, the curing accelerator, the toughening agent, the warpage control agent, and the inorganic silica filler are mixed and premixed to obtain a mixture; the mixture is ground to the target particle size and then vacuum degassed to obtain the liquid epoxy resin composition.

17. The application of the liquid epoxy resin composition according to any one of claims 1 to 15 or the liquid epoxy resin composition prepared by the preparation method according to claim 16 in the 2.5D / 3D advanced packaging WLCSP or CoWoS packaging process of integrated circuits.

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