Electrostatic neutralization stage, wafer surface treatment device and wafer surface treatment method

By designing an electrostatic neutralization stage in the wafer surface treatment equipment, controlling the movement of positive ions and electrons using neutralization gas channels and radio frequency power supplies, the negative charge on the wafer surface is successfully neutralized, solving the damage problem of static electricity to microelectronic devices, and improving production yield and device reliability.

CN119893811APending Publication Date: 2025-04-25WUXI SHANGJI SEMICON TECH CO LTD
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Patent Information

Application Number
CN202510317588.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-18
Publication Date
2025-04-25

AI Technical Summary

Technical Problem

The wafer is prone to accumulate negative charge during surface treatment, resulting in electrical impact on microelectronic devices and breakdown failure of insulating dielectrics, affecting production yield and device reliability.

Method used

An electrostatic neutralization stage is designed, including a body, a magnet and a metal piece, and a neutralizing gas channel is provided on the body. Through auxiliary gas supply and radio frequency power control, the positive ions and electrons in the neutralizing gas are ionized, so that the positive ions pass through the neutralizing gas channel and contact the wafer, thereby neutralizing the negative charge on the wafer surface.

Benefits of technology

Effectively neutralize the negative charge on the wafer surface, prevent static electricity from causing damage to microelectronic devices, and improve the yield of wafer production and the reliability of microelectronic devices.

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Abstract

The invention discloses an electrostatic neutralization carrying table, wafer surface treatment equipment and a wafer surface treatment method, the electrostatic neutralization carrying table comprises a main body, a magnet and a metal piece, when the electrostatic neutralization carrying table works, the main body is electrified to generate negative bias potential, so that a wafer accumulates negative charges; the neutralizing gas is ionized by the metal piece to generate positive ions and electrons, when the metal piece is close to the magnet, the electrons move to the pipeline wall of the neutralizing gas channel and are transferred by touching the wall, and the positive ions can pass through the neutralizing gas channel and purge the back surface of the wafer, so that negative charges accumulated on the surface of the wafer are neutralized, and the damage of static electricity to the wafer is avoided; according to the wafer surface treatment equipment, the protection of the wafer is realized by adopting the static electricity to neutralize the carrying platform; in the wafer surface treatment process, wafer surface treatment is normally carried out, after treatment is carried out for a period of time, electrostatic neutralization is started, after wafer surface treatment is completed, electrostatic neutralization is continued for a period of time, and therefore de-electrification of the wafer is ensured.
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Citation Information

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