LED and preparation method thereof

Abstract

The invention relates to the technical field of photoelectricity, and discloses an LED and a preparation method thereof.The preparation method comprises the following steps that a substrate is provided, and a groove is formed in the substrate; a welding column is fixed to the groove, a chip support is prepared on the periphery of the welding column, the chip support is a hollow bowl-shaped body, the bottom of the chip support is a die bonding area used for installing a chip, the side wall of the chip support wraps the welding column, and the upper surface of the welding column is exposed; fixing a connecting piece on the upper surface of the welding column, and installing a chip on the substrate in the die bonding area; and packaging glue is added into the die bonding area, so that the chip and the connecting piece are completely wrapped by the packaging glue, and a finished product is obtained after baking and shaping. According to the LED provided by the invention, the air tightness can be improved.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic technology, and in particular to an LED and a preparation method thereof. Background Art

[0002] LEDs have a wide range of applications and their application environments are complex and diverse. During changes in ambient temperature and humidity, the materials that make up the LEDs will expand and contract, which can easily cause the LED packaging glue to peel off from the bracket plastic or substrate, allowing water vapor, oxygen, etc. to enter the interior of the LED, causing the LED brightness to decay, reducing its service life, and even causing failure.

[0003] In existing LEDs, the packaging glue and the bracket are two planes physically bonded to each other, the contact surface is straight and smooth, and the bonding strength is poor. Water vapor and oxygen from the outside enter the LED along the bonding surface between the packaging glue and the bracket plastic or substrate. The penetration path of existing LEDs is short and direct, and the airtightness of LEDs is poor. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a method for preparing an LED, which improves the airtightness of the LED.

[0005] The technical problem to be solved by the present invention is also to provide an LED with good airtightness.

[0006] In order to solve the above technical problems, the present invention provides a method for preparing an LED, comprising the following steps:

[0007] Providing a substrate, and setting a groove on the substrate;

[0008] A welding column is fixed on the groove, and a chip holder is prepared around the welding column, wherein the chip holder is a hollow bowl-shaped body, the bottom of the chip holder is a die-bonding area for installing the chip, and the side wall of the chip holder wraps the welding column and exposes the upper surface of the welding column;

[0009] Fixing a connector on the upper surface of the welding column, and mounting a chip on the substrate in the die-bonding area;

[0010] Packaging glue is added into the die-bonding area so that the chip and the connector are completely wrapped by the packaging glue, and the finished product is obtained after baking and shaping.

[0011] In some embodiments, the groove includes a positive electrode groove close to the positive electrode of the chip and a nearby groove close to the negative electrode of the chip;

[0012] The depth of the groove is 0.5 mm to 2 mm.

[0013] In some embodiments, the welding column is cylindrical or rectangular; the upper surface of the welding column is provided with a first groove; the material of the welding column is tin, lead alloy, copper or an alloy thereof.

[0014] In some embodiments, fixing the welding column on the groove includes:

[0015] Solder paste is coated on the groove, and the soldering column is placed on the solder paste and fixed at 240° C. to 280° C. for 1 min to 3 min.

[0016] In some embodiments, preparing a chip support around the welding column includes:

[0017] After the plastic material is heated to a molten state, it is injected into a preset mold arranged on the substrate, and after cooling, a hollow bowl-shaped chip bracket is formed on the substrate.

[0018] In some embodiments, the connector includes a T-shaped buckle or an L-shaped buckle;

[0019] The material of the connecting piece is tin, lead alloy, copper or their alloys.

[0020] In some embodiments, fixing the connecting member on the upper surface of the welding column includes:

[0021] Coat the solder paste on the soldering column, place the connector on the solder paste, and fix it at 240° C. to 280° C. for 1 min to 3 min.

[0022] In some embodiments, the packaging glue includes silicone glue, epoxy resin or polyurethane glue.

[0023] To solve the above problem, the present invention also provides another method for preparing an LED, comprising the following steps:

[0024] Providing a substrate, and setting a groove on the substrate;

[0025] Fixing a connector on the groove and mounting a chip on the substrate;

[0026] Add packaging glue around the chip so that the chip and the connector are completely wrapped by the packaging glue, and bake and shape them to obtain a finished product.

[0027] In order to solve the above problem, the present invention provides an LED, which is manufactured by using the LED manufacturing method.

[0028] The implementation of the present invention has the following beneficial effects:

[0029] The present invention arranges a groove on the substrate, arranges a welding column on the groove, and arranges a connecting piece above the welding column, so that the substrate of the LED, the chip bracket and the packaging glue are mutually locked and nested, so that the packaging glue cannot be separated from the substrate, thereby improving the bonding force between the packaging glue and the chip bracket. When the LED prepared by the preparation method provided by the present invention is subjected to a cold and hot shock test, the peeling ratio of the packaging glue and the substrate or the chip bracket is significantly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of a structure in which a groove is provided on a substrate in a method for preparing an LED provided by the present invention;

[0031] Figure 2 A schematic diagram of the structure of fixing a welding column on a groove in a method for preparing an LED provided by the present invention;

[0032] Figure 3 A schematic diagram of the structure of preparing a chip bracket on a substrate in a method for preparing an LED provided by the present invention;

[0033] Figure 4 A schematic diagram of the structure of a fixing connector on the upper surface of a welding column in a method for preparing an LED provided by the present invention;

[0034] Figure 5 A schematic diagram of the structure of installing a chip on a substrate in a method for preparing an LED provided by the present invention;

[0035] Figure 6 A schematic diagram of the structure after adding packaging glue into the die-bonding area in a method for preparing an LED provided by the present invention;

[0036] Figure 7 A schematic diagram of a structure in which a groove is provided on a substrate in another method for preparing an LED provided by the present invention;

[0037] Figure 8 A schematic diagram of the structure of fixing a connecting piece on a groove in another method for preparing an LED provided by the present invention;

[0038] Fig. 9 A schematic diagram of the structure of installing a chip on a substrate in another method for preparing an LED provided by the present invention;

[0039] Fig.10 This is a schematic structural diagram of another LED preparation method provided by the present invention after adding packaging glue. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0041] In the description of the present invention, it is necessary to understand that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0045] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the examples of various specific processes and materials provided by the present invention, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0046] In the present invention, "preferred" and "better" are only used to describe implementation methods or embodiments with better effects, and it should be understood that they do not constitute a limitation on the scope of protection of the present invention. In the present invention, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features. In the present invention, when involving numerical ranges, unless otherwise specified, the two endpoints of the numerical range are included.

[0047] To solve the above problems, the present invention provides a method for preparing an LED, comprising the following steps:

[0048] S1, such as Figure 1 As shown, a substrate 1 is provided, and a groove 11 is arranged on the substrate 1;

[0049] The substrate 1 is the basic structure of the entire chip holder 3, and is usually made of a conductive or non-conductive material (such as metal, ceramic or plastic). In some embodiments, the substrate 1 is a copper plate. Preferably, the substrate 1 with the groove 11 is obtained by stamping.

[0050] The groove 11 is provided to help position and fix the welding column 2, ensuring that the welding column 2 forms a stable connection with the substrate 1 and the chip holder 3 in the subsequent process. The groove 11 can be completed by laser etching, machining or mold forming. Its shape and size should be designed according to the size and functional requirements of the welding column 2, and can be a long strip, a circle or other geometric shape that meets the design requirements. In some embodiments, the groove 11 includes a positive electrode groove 11 close to the positive electrode of the chip 5 and a nearby groove 11 close to the negative electrode of the chip 5; the depth of the groove 11 is 0.5mm to 2mm.

[0051] S2, such as Figures 2-3 As shown, a welding column 2 is fixed on the groove 11, and a chip holder 3 is prepared around the welding column 2. The chip holder 3 is a hollow bowl-shaped body, and the bottom of the chip holder 3 is a die-bonding area for mounting a chip 5. The side wall of the chip holder 3 wraps the welding column 2 and exposes the upper surface of the welding column 2;

[0052] In some embodiments, the welding column 2 is cylindrical or rectangular; the material of the welding column 2 is tin, lead alloy, copper or its alloy. The upper surface of the welding column 2 is provided with a first groove 11; the first groove 11 is used to install the connector 4 to improve the overall connection strength.

[0053] In some embodiments, fixing the soldering column 2 on the groove 11 includes: coating solder paste on the groove 11, placing the soldering column 2 on the solder paste, and fixing at 240° C. to 280° C. for 1 min to 3 min. The soldering column 2 is fixed on the substrate 1 by reflow soldering, spot welding or other welding techniques.

[0054] In some embodiments, preparing the chip holder 3 around the welding column 2 includes: heating the plastic material to a molten state, injecting it into a preset mold provided on the substrate 1, and forming a hollow bowl-shaped chip holder 3 on the substrate 1 after cooling.

[0055] In the above embodiment, a hollow bowl-shaped bracket is formed around the welding column 2 by injection molding, die casting or other molding processes. The bottom of the chip bracket 3 is provided with a die-bonding area for mounting the chip 5. The side wall of the bracket wraps around the welding column 2 and ensures that the upper surface of the welding column 2 is exposed. The hollow structure of the chip bracket 3 can effectively protect the chip 5, while reducing the weight of the entire package, facilitating heat dissipation and current conduction.

[0056] S3, such as Figures 4-5 As shown, a connector 4 is fixed on the upper surface of the welding column 2, and a chip 5 is mounted on the substrate 1 in the die-bonding area;

[0057] In some embodiments, the connector 4 includes a T-shaped buckle or an L-shaped buckle; the material of the connector 4 is tin, lead alloy, copper or an alloy thereof. The structure of the T-shaped buckle is in the shape of a "T", including a first horizontal portion and a first vertical portion. The first vertical portion is connected to the upper surface of the welding column 2, and the first horizontal portion can improve the connection force between the packaging glue 6 and the chip bracket 3. The structure of the L-shaped buckle is in the shape of an "L", including a second horizontal portion and a second vertical portion, the second vertical portion is connected to the upper surface of the welding column 2, and the second horizontal portion can improve the connection force between the packaging glue 6 and the chip bracket 3.

[0058] In some embodiments, the surface of the connecting member 4 is silver-plated to reflect light.

[0059] In some embodiments, fixing the connector 4 on the upper surface of the soldering column 2 includes: coating solder paste on the soldering column 2, placing the connector 4 on the solder paste, and fixing at 240° C. to 280° C. for 1 min to 3 min. The connector 4 is fixed to the soldering column 2 by reflow soldering, spot welding or other welding techniques.

[0060] In addition, the LED chip 5 is mounted on the bottom die-bonding area of ​​the chip holder 3. The die-bonding area is coated with a die-bonding adhesive (such as epoxy resin or UV curing adhesive) to fix the chip 5. The chip 5 is firmly fixed on the substrate 1 by the die-bonding adhesive to ensure its stability.

[0061] S4, such as Figure 6 As shown, a packaging glue 6 is added into the die-bonding area so that the chip 5 and the connector 4 are completely wrapped by the packaging glue 6, and a finished product is obtained after baking and shaping.

[0062] In some embodiments, the encapsulation glue 6 includes silicone, epoxy resin or polyurethane glue. The main function of the encapsulation glue 6 is to provide protection for the chip 5 to prevent the influence of the external environment. The encapsulation glue 6 can also enhance the mechanical fixing force between the chip 5 and the chip bracket 3 and the substrate 1 to ensure the structural stability of the package.

[0063] The added encapsulation glue 6 is shaped by baking or UV curing, so that it is completely cured and maintains its expected physical properties and chemical stability. After shaping, the chip 5 and its connector 4 will be completely wrapped by the encapsulation glue 6, and the encapsulated chip bracket 3 has stronger compressive strength, temperature resistance and durability.

[0064] The above preparation method is a preparation method for a bracket-type LED. A bracket-type LED is a LED chip 5 mounted on a bracket structure. The bracket is usually made of metal or plastic material, and is intended to provide stable support and effectively manage heat to ensure the long-term stable operation of the LED. In the above preparation method for a bracket-type LED, a groove 11 is set on the substrate 1, and a welding column 2 is set on the groove 11. A connector 4 is set above the welding column 2, so that the LED substrate 1 and the chip bracket 3 and the packaging glue 6 are mutually snap-fitted and nested, so that the packaging glue 6 cannot be separated from the substrate 1, thereby improving the bonding force between the packaging glue 6 and the chip bracket 3. When the LED prepared by the preparation method provided by the present invention is subjected to a cold and hot shock test, the peeling ratio of the packaging glue 6 and the substrate 1 or the chip bracket 3 is significantly reduced.

[0065] In addition, the present invention also provides another method for preparing an LED, comprising the following steps:

[0066] (1) Figure 7 As shown, a substrate 1 is provided, and a groove 11 is arranged on the substrate 1;

[0067] As above, the substrate 1 is the basic structure of the entire chip holder 3, and is usually made of a conductive or non-conductive material (such as metal, ceramic or plastic). In some embodiments, the substrate 1 is a copper plate. Preferably, the substrate 1 with the groove 11 is obtained by stamping.

[0068] The groove 11 is provided to help position and fix the welding column 2, ensuring that the welding column 2 forms a stable connection with the substrate 1 and the chip holder 3 in the subsequent process. The groove 11 can be completed by laser etching, machining or mold forming. Its shape and size should be designed according to the size and functional requirements of the welding column 2, and can be a long strip, a circle or other geometric shape that meets the design requirements. In some embodiments, the groove 11 includes a positive electrode groove 11 close to the positive electrode of the chip 5 and a nearby groove 11 close to the negative electrode of the chip 5; the depth of the groove 11 is 0.5mm to 2mm.

[0069] (2) Figures 8-9 As shown, the connector 4 is fixed on the groove 11, and the chip 5 is installed on the substrate 1;

[0070] In some embodiments, the connector 4 includes a T-shaped buckle or an L-shaped buckle; the material of the connector 4 is tin, lead alloy, copper or an alloy thereof. The structure of the T-shaped buckle is in the shape of a "T", including a first horizontal portion and a first vertical portion. The first vertical portion is connected to the upper surface of the welding column 2, and the first horizontal portion can improve the connection force between the packaging glue 6 and the chip bracket 3. The structure of the L-shaped buckle is in the shape of an "L", including a second horizontal portion and a second vertical portion, the second vertical portion is connected to the upper surface of the welding column 2, and the second horizontal portion can improve the connection force between the packaging glue 6 and the chip bracket 3.

[0071] In some embodiments, the surface of the connecting member 4 is silver-plated to reflect light.

[0072] In some embodiments, one clip is disposed on each of the four corners of the LED, or three clips are disposed on each side.

[0073] In some embodiments, fixing the connector 4 on the upper surface of the groove 11 includes: coating the groove 11 with solder paste, placing the connector 4 on the solder paste, and fixing it at 240° C. to 280° C. for 1 min to 3 min. The connector 4 is fixed to the groove 11 by reflow soldering, spot welding or other welding techniques.

[0074] (3) Fig.10 As shown, a packaging glue 6 is added around the chip 5 so that the chip 5 and the connector 4 are completely wrapped by the packaging glue 6, and a finished product is obtained after baking and shaping.

[0075] In some embodiments, the encapsulation glue 6 includes silicone, epoxy resin or polyurethane glue. The main function of the encapsulation glue 6 is to provide protection for the chip 5 to prevent the influence of the external environment. The encapsulation glue 6 can also enhance the mechanical fixing force between the chip 5 and the chip bracket 3 and the substrate 1 to ensure the structural stability of the package.

[0076] The added encapsulation glue 6 is shaped by baking or UV curing, so that it is completely cured and maintains its expected physical properties and chemical stability. After shaping, the chip 5 and its connector 4 will be completely wrapped by the encapsulation glue 6, and the encapsulated chip bracket 3 has stronger compressive strength, temperature resistance and durability.

[0077] The above preparation method is a preparation method for NCSP type LED. NCSP type LED (Non-Coplanar SurfaceMount LED) is an LED whose welding pins are not coplanar with the plane of the LED chip 5, but are mounted on the substrate 1 in a non-coplanar manner. In the above NCSP type LED preparation method, by setting a groove 11 on the substrate 1 and setting a connector 4 of a specific shape on the groove 11, the substrate 1 of the LED and the packaging glue 6 are mutually snapped and nested, so that the packaging glue 6 cannot be separated from the substrate 1, thereby improving the bonding force between the packaging glue 6 and the substrate 1. When the LED prepared by the preparation method provided by the present invention is subjected to a cold and hot shock test, the peeling ratio of the packaging glue 6 and the substrate 1 is significantly reduced.

[0078] In order to solve the above problems, the present invention provides an LED, which is manufactured by the LED manufacturing method as described above.

[0079] The present invention is further described below with specific embodiments:

[0080] Example 1

[0081] This embodiment provides a method for preparing a bracket-type LED, comprising the following steps:

[0082] Providing a substrate, and setting a groove on the substrate;

[0083] A welding column is fixed on the groove, and a chip holder is prepared around the welding column, wherein the chip holder is a hollow bowl-shaped body, the bottom of the chip holder is a die-bonding area for installing the chip, and the side wall of the chip holder wraps the welding column and exposes the upper surface of the welding column;

[0084] Fixing a connector on the upper surface of the welding column, wherein the connector is a T-shaped buckle, and mounting a chip on the substrate in the die-bonding area;

[0085] Packaging glue is added into the die-bonding area so that the chip and the connector are completely wrapped by the packaging glue, and the finished product is obtained after baking and shaping.

[0086] Example 2

[0087] This embodiment provides a method for preparing a bracket-type LED, comprising the following steps:

[0088] Providing a substrate, and setting a groove on the substrate;

[0089] A welding column is fixed on the groove, and a chip holder is prepared around the welding column, wherein the chip holder is a hollow bowl-shaped body, the bottom of the chip holder is a die-bonding area for installing the chip, and the side wall of the chip holder wraps the welding column and exposes the upper surface of the welding column;

[0090] Fixing a connector on the upper surface of the welding column, wherein the connector is an L-shaped buckle, and mounting a chip on the substrate in the die-bonding area;

[0091] Packaging glue is added into the die-bonding area so that the chip and the connector are completely wrapped by the packaging glue, and the finished product is obtained after baking and shaping.

[0092] Example 3

[0093] This embodiment provides a method for preparing a NCSP type LED, comprising the following steps:

[0094] Providing a substrate, and setting a groove on the substrate;

[0095] Fixing a connector on the groove, wherein the connector is a T-shaped buckle, and installing a chip on the substrate;

[0096] Add packaging glue around the chip so that the chip and the connector are completely wrapped by the packaging glue, and bake and shape them to obtain a finished product.

[0097] Example 4

[0098] This embodiment provides a method for preparing a NCSP type LED, comprising the following steps:

[0099] Providing a substrate, and setting a groove on the substrate;

[0100] A connecting piece is fixed on the groove, wherein the connecting piece is an L-shaped buckle, and a chip is installed on the substrate;

[0101] Add packaging glue around the chip so that the chip and the connector are completely wrapped by the packaging glue, and bake and shape them to obtain a finished product.

[0102] Comparative Example 1

[0103] This comparative example provides a method for preparing a bracket-type LED, comprising the following steps:

[0104] Providing a substrate, preparing a chip holder on the substrate, wherein the chip holder is a hollow bowl-shaped body, the bottom of the chip holder is a die-bonding area for mounting the chip, and mounting the chip on the substrate in the die-bonding area;

[0105] Add packaging glue into the die-bonding area so that the chip is completely wrapped by the packaging glue, and bake and shape it to obtain a finished product.

[0106] Comparative Example 2

[0107] This comparative example provides a method for preparing a NCSP type LED, comprising the following steps:

[0108] providing a substrate on which a chip is mounted;

[0109] Add packaging glue around the chip so that the chip is completely wrapped by the packaging glue, and bake and shape it to obtain a finished product.

[0110] The bonding strength between the encapsulation adhesive and the substrate of the LEDs obtained in Examples 1 to 4 and Comparative Examples 1 to 2 was tested, and the LEDs obtained in Example 1 and Comparative Example 1 were subjected to a thermal shock test. The specific test results are shown in Tables 1 and 2.

[0111] Table 1 Binding strength test results of LEDs obtained from Examples 1 to 4 and Comparative Examples 1 to 2

[0112]

[0113] Table 2 Thermal shock test results of LEDs obtained in Example 1 and Comparative Example 1

[0114]

[0115]

[0116] From the comparison of the above data, it can be seen that compared with conventional LEDs, the present invention arranges a groove on the substrate, arranges a welding column on the groove, and arranges a connecting piece above the welding column, so that the LED substrate, the chip holder and the packaging glue are interlocked and nested with each other, so that the packaging glue cannot be separated from the substrate, thereby improving the bonding strength between the packaging glue and the chip holder. When the LED prepared by the preparation method provided by the present invention is subjected to a cold and hot shock test, the peeling ratio of the packaging glue and the substrate or the chip holder is significantly reduced.

[0117] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0118] The above is a preferred embodiment of the invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the invention. These improvements and modifications are also considered to be within the scope of protection of the invention.

Claims

1. A method for preparing an LED, characterized in that: The following steps are involved: providing a substrate, and providing a groove on the substrate; A welding column is fixed on the groove, and a chip holder is prepared around the welding column, wherein the chip holder is a hollow bowl-shaped body, the bottom of the chip holder is a die-bonding area for installing the chip, and the side wall of the chip holder wraps the welding column and exposes the upper surface of the welding column; Fixing a connector on the upper surface of the welding column, and mounting a chip on the substrate in the die-bonding area; Packaging glue is added into the die-bonding area so that the chip and the connector are completely wrapped by the packaging glue, and the finished product is obtained after baking and shaping.

2. The method for preparing an LED according to claim 1, wherein: The grooves include a positive electrode groove close to the positive electrode of the chip and a nearby groove close to the negative electrode of the chip; the depth of the grooves is 0.5 mm to 2 mm.

3. The method for preparing an LED according to claim 1, wherein: The welding column is cylindrical or rectangular; the upper surface of the welding column is provided with a first groove; the material of the welding column is tin, lead alloy, copper or an alloy thereof.

4. The method for preparing an LED according to claim 1, wherein: The method of fixing the welding column on the groove comprises: Solder paste is coated on the groove, and the soldering column is placed on the solder paste and fixed at 240° C. to 280° C. for 1 min to 3 min.

5. The method for preparing an LED according to claim 1, wherein: Preparing a chip bracket around the welding column includes: After the plastic material is heated to a molten state, it is injected into a preset mold arranged on the substrate, and after cooling, a hollow bowl-shaped chip bracket is formed on the substrate.

6. The method for preparing an LED according to claim 1, wherein: The connecting piece includes a T-shaped buckle or an L-shaped buckle; The material of the connecting piece is tin, lead alloy, copper or their alloys.

7. The method for preparing an LED according to claim 1, wherein: The connecting piece fixed on the upper surface of the welding column comprises: Coat the solder paste on the soldering column, place the connector on the solder paste, and fix it at 240° C. to 280° C. for 1 min to 3 min.

8. The method for preparing an LED according to claim 1, wherein: The packaging glue includes silicone glue, epoxy resin or polyurethane glue.

9. A method for preparing an LED, characterized in that: The following steps are involved: providing a substrate, and providing a groove on the substrate; Fixing a connector on the groove and mounting a chip on the substrate; Add packaging glue around the chip so that the chip and the connector are completely wrapped by the packaging glue, and bake and shape them to obtain a finished product.

10. An LED, characterized in that: The LED is manufactured by the method for manufacturing an LED as claimed in any one of claims 1 to 9.

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