Display panel, preparation method thereof and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method thereof and a display device, the display panel comprises a substrate and a first metal wire located on one side of the substrate, the first metal wire comprises a first layer, a second layer and a third layer which are stacked, and the second layer is located between the first layer and the third layer; the second layer comprises a main body part and a protection part, the protection part comprises a metal compound, and the protection part covers at least part of the side wall of the main body part in the first direction; wherein the first direction is parallel to the plane where the display panel is located and points to the protection part from the main body part. The side wall of the main body part can be protected by using the anti-corrosion characteristic of the metal compound, so that the structural stability and the conductivity of the first metal wire can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] In existing display panels, electrical signal lines are usually arranged as laminated metal structures. Due to the manufacturing process and the position limitations of the electrical signal lines, some electrical signal lines in the display panel are prone to corrosion problems, which affects the performance and structural stability of the electrical signal lines. Therefore, a solution is urgently needed. Summary of the invention

[0003] In view of this, embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device to solve the above problems.

[0004] In a first aspect, an embodiment of the present application provides a display panel, comprising a substrate and a first metal wire located on one side of the substrate, the first metal wire comprising a first layer, a second layer and a third layer which are stacked, the second layer being located between the first layer and the third layer; the second layer comprising a main body and a protective portion, the protective portion comprising a metal compound, and along a first direction, the protective portion covers at least a portion of a side wall of the main body; wherein the first direction is parallel to the plane where the display panel is located, and is directed from the main body to the protective portion.

[0005] In a second aspect, an embodiment of the present application provides a method for preparing a display panel, which is used to prepare the display panel provided in the first aspect; the method comprises: Providing a substrate, and stacking a first metal layer, a second metal layer, and a third metal layer on one side of the substrate to form a third layer, an initial second layer, and a first layer of a first metal line, respectively; Gas is injected into the side wall of the initial second layer, and the gas generates a metal compound with the metal in the second metal layer to form the second layer.

[0006] In a third aspect, an embodiment of the present application provides a display device, comprising a display panel provided in the first aspect.

[0007] In an embodiment of the present application, a protective portion containing a metal compound is provided to cover at least a portion of the side walls of the main body in the second layer. The anti-corrosion properties of the metal compound can be utilized to protect the side walls of the main body, thereby reducing the erosion of the main body by corrosive materials from the side of the second layer, thereby facilitating improvement of the structural stability of the first metal wire and the conductive performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0009] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application; Figure 2 A schematic diagram of the structure of another display panel provided in an embodiment of the present application; Figure 3 A schematic diagram of the structure of another display panel provided in an embodiment of the present application; Figure 4 A schematic diagram of the structure of another display panel provided in an embodiment of the present application; Figure 5 A schematic plan view of a display panel provided in an embodiment of the present application; Figure 6 for Figure 5 A structural schematic diagram of a display panel shown; Figure 7 A schematic diagram of the structure of another display panel provided in an embodiment of the present application; Figure 8 A schematic diagram of the structure of another display panel provided in an embodiment of the present application; Fig. 9 A schematic diagram of the structure of another display panel provided in an embodiment of the present application; Fig.10 A process flow chart of manufacturing a display panel provided in an embodiment of the present application; Fig.11 A process flow chart of another display panel manufacturing method provided in an embodiment of the present application; Fig.12 A schematic diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0010] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0011] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0012] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0013] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0014] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application is shown in FIG. Figure 2 A schematic diagram of the structure of another display panel provided in an embodiment of the present application.

[0015] The present application embodiment provides a display panel 01, such as Figure 1 and Figure 2 As shown, the display panel 01 includes a substrate 10 and a first metal line 20 located on one side of the substrate 10. The first metal line 20 can be used to transmit electrical signals. The first metal line 20 includes a first layer 21, a second layer 22 and a third layer 23 stacked together, and the second layer 22 is located between the first layer 21 and the third layer 23.

[0016] For example, Figure 1 and Figure 2 As shown, the first layer 21 is located on the side of the third layer 23 away from the substrate 10. That is, in the direction Z perpendicular to the plane where the display panel 01 is located, the third layer 23, the second layer 22, and the first layer 21 can be arranged in sequence.

[0017] For example, Figure 1 and Figure 2 As shown, the thickness H2 of the second layer 22 is greater than the thickness H1 of the first layer 21 , and greater than the thickness H3 of the third layer 23 .

[0018] The second layer 22 includes a main body 221 and a protective part 222, wherein the protective part 222 includes a metal compound. The protective part 222 covers at least a portion of the side wall 221A of the main body 221 along a first direction X. The first direction X is parallel to the plane where the display panel 01 is located, and points from the main body 221 to the protective part 222.

[0019] That is, in the first direction X, at least a portion of the side wall 221A of the main body 221 is covered by the protection portion 222 containing the metal compound.

[0020] Optional, such as Figure 1As shown, in the first direction X, the protection portion 222 covers the entire side wall 221A of the main body portion 221 .

[0021] Optional, such as Figure 2 As shown, in the first direction X, the protection portion 222 covers a portion of the side wall 221A of the main body portion 221 .

[0022] It is understandable that metal compounds generally have certain anti-corrosion properties, and some specific metal compounds, in particular, have very excellent anti-oxidation and anti-corrosion properties.

[0023] The inventor of the present application has found through research that the second layer of the first metal wire is usually used as the main material for transmitting electrical signals, and the performance of the second layer often determines the conductive performance of the first metal wire. However, in the prior art, no protective layer is provided on the sidewall of the second layer, which easily causes the etching solution used in the display panel process and / or some corrosive ions in the display panel to intrude into the second layer from the sidewall of the second layer, corrode the metal in the second layer, and affect the conductive performance and structural stability of the first metal wire.

[0024] In view of this, in the embodiment of the present application, a protective portion 222 containing a metal compound is provided to cover at least a portion of the side wall 221A of the main body 221 in the second layer 22. The anti-corrosion properties of the metal compound can be utilized to protect the side wall 221A of the main body 221, thereby reducing the erosion of the main body 221 by corrosive materials from the side of the second layer 22, thereby facilitating improving the structural stability of the first metal wire 20 and improving the conductive performance.

[0025] Optional, such as Figure 1 As shown, the protection part 222 is located outside the main body 221, and the protection part 222 is connected to the side wall 221A of the main body 221. That is, the second layer 22 may include an inner layer and an outer layer, the main body 221 is located in the inner layer, and the protection part 222 is located in the outer layer.

[0026] Since the protective part 222 includes a metal compound, the protective part 222 is connected to the side wall 221A of the main body 221. Therefore, during the preparation process of the second layer 22, the protective part 222 can be formed by injecting gas into the metal in the second layer 22. There is no need to prepare an additional layer of protective material on the side of the second layer 22, which is beneficial to simplify the preparation process of the protective part 222 and reduce the preparation cost of the first metal wire 20.

[0027] Optionally, the protection portion 222 includes at least one of metal nitride and metal fluoride. During the preparation of the second layer 22, nitrogen-containing gas or fluorine-containing gas can be injected into the metal in the second layer 22, and nitrogen ions and fluorine ions react with the metal in the second layer 22 to generate the protection portion 222.

[0028] Exemplarily, in the second layer 22 , the main body portion 221 includes aluminum, and the protection portion 222 includes at least one of aluminum nitride or aluminum fluoride.

[0029] Since aluminum has good conductivity and economy, the main body 221 is provided to include aluminum, which can ensure that the first metal wire 20 has good conductivity and reduce costs. Aluminum nitride and aluminum fluoride both have high chemical stability and can withstand high temperatures and acid and alkali corrosion. The protection part 222 is provided to include at least one of aluminum nitride or aluminum fluoride, which is beneficial to improving the ability of the protection part 222 to isolate corrosive materials, thereby facilitating the improvement of the protection ability of the main body 221.

[0030] During the preparation of the second layer 22, nitrogen (N) may be injected into the side of the second layer 22. 2 ) or fluorine-containing gas, nitrogen can react chemically with the metal aluminum (AL) on the side of the second layer 22 to generate aluminum nitride, and the chemical reaction formula is: 2AL+N 2 →2AlN. Fluoride ion (F - ) can react chemically with the metal aluminum (AL) on the side of the second layer 22 to generate aluminum fluoride. The chemical reaction formula is: AL+F - →ALF 3 .

[0031] For example, the fluorine-containing gas may be carbon tetrafluoride, sulfur hexafluoride or the like.

[0032] Please continue to refer to Figure 1 In one implementation of the present application, the protection portion 222 covers the side wall 221A of the main body 221 along the first direction X. In this way, the protection portion 222 can completely cover the side wall 221A of the main body 221, which is conducive to achieving comprehensive protection of the side wall 221A of the main body 221, thereby facilitating the improvement of the anti-corrosion effect of the first metal wire 20 and further ensuring the structural stability and conductive performance of the first metal wire 20.

[0033] Moreover, comprehensive protection of the side wall 221A of the main body 221 is also beneficial to avoiding the appearance of deep grooves on the side of the second layer 22. When preparing subsequent film layers on the first metal wire 20, it can avoid the subsequent film layers from breaking due to failure to adhere to the side of the second layer 22.

[0034] Figure 3 A schematic diagram of the structure of another display panel provided in an embodiment of the present application.

[0035] In one implementation of the present application, Figure 3As shown, the second layer 22 includes a first sublayer 2201 and a second sublayer 2202, and the first sublayer 2201 and the second sublayer 2202 are connected in a direction Z perpendicular to the plane where the display panel 01 is located. The first sublayer 2201 is located on a side of the second sublayer 2202 away from the substrate 10. The main body 221 in the first sublayer 2201 and the second sublayer 2202 may include the same material, such as the above-mentioned metal aluminum.

[0036] In the first direction X, the sidewall of the second sublayer 2202 protrudes beyond the sidewall of the first sublayer 2201 .

[0037] For example, Figure 3 As shown, in the first direction X, two opposite side walls of the second sub-layer 2202 protrude from two opposite side walls of the first sub-layer 2201 respectively.

[0038] In the embodiment of the present application, the side wall of the second sub-layer 2202 is set to protrude from the side wall of the first sub-layer 2201, so the side wall of the second sub-layer 2202 and the side wall of the first sub-layer 2201 are not on the same straight line, and the second sub-layer 2202 and the first sub-layer 2201 can form a "step-like" structure, that is, the side of the second layer 22 can form a "step". Based on this setting, the side of the second layer 22 is relatively flat. When preparing a subsequent film layer on the first metal wire 20, the subsequent film layer can climb along the side wall of the second sub-layer 2202 to the side wall of the first sub-layer 2201, which is conducive to improving the adhesion effect of the subsequent film layer and the side of the second layer 22, avoiding the subsequent film layer from being broken on the side of the second layer 22, and thus helping to further improve the film quality of the subsequent film layer.

[0039] Optional, such as Figure 3 As shown, the second sublayer 2202 includes a main body 221 and a protective portion 222 , and the protective portion 222 covers at least a portion of the sidewall 221A of the main body 221 along the first direction X. Based on this arrangement, the sidewall of the second sublayer 2202 in the above embodiment may refer to the sidewall of the protective portion 222 in the second sublayer 2202 .

[0040] Of course, if Figure 3 As shown, in the first direction X, the side wall 221A of the main body 221 in the second sub-layer 2202 may also protrude from the side wall 221A of the main body 221 in the first sub-layer 2201 .

[0041] For example, Figure 3 As shown, in the first direction X, the protection portion 222 covers the entire side walls 221A of the main body portion 221 in the second sub-layer 2202 .

[0042] For example, Figure 4 As shown, Figure 4A schematic diagram of the structure of another display panel provided by an embodiment of the present application shows that in the first direction X, the protection portion 222 covers a portion of the side wall 221A of the main body 221 in the second sub-layer 2202. At this time, the protection portion 222 covers the side wall 221A of the main body 221 in the second sub-layer 2202 close to the substrate 10.

[0043] Since the second sublayer 2202 is closer to the substrate 10 than the first sublayer 2201, that is, the second layer 22 has a "narrow at the top and wide at the bottom" structure, providing the second sublayer 2202 with a protection portion 222 that can protect the side wall 221A of the main body 221 is helpful to avoid the appearance of grooves blocked by the main body 221 on the side of the second sublayer 2202. When preparing subsequent film layers on the first metal wire 20, it is helpful to avoid the subsequent film layers from breaking on the side of the second sublayer 2202.

[0044] Optional, such as Figure 3 and Figure 4 As shown, the first sublayer 2201 includes a main body 221 and does not include a protective portion 222. That is, the protective portion 222 is no longer arranged outside the main body 221 in the first sublayer 2201. Based on this arrangement, the side wall of the first sublayer 2201 in the above embodiment may refer to the side wall 221A of the main body 221 in the first sublayer 2201.

[0045] Since there is no protective portion 222 on the side wall 221A of the main body 221 in the first sub-layer 2201, the side wall 221A of the main body 221 in the first sub-layer 2201 can be etched so that the side wall 221A of the main body 221 in the first sub-layer 2201 is retracted relative to the side wall of the second sub-layer 2202, thereby forming a "step" structure on the side of the second layer 22.

[0046] In the preparation of Figure 3 and Figure 4 During the process of forming the second layer 22 shown in the figure, a protective portion 222 with uneven thickness can be prepared on the side wall 221A of the main body 221 of the second layer 22, and the thickness of the protective portion 222 can gradually increase along the direction from the first layer 21 to the third layer 23.

[0047] By flexibly setting the thickness of the protection part 222 at different positions, the protection strength at different positions of the side wall 221A of the main body 221 can be adjusted, so that the side wall of the main body 221 close to the first layer 21 is protected with less strength and can be etched, while the side wall of the main body 221 close to the third layer 23 is protected with greater strength and can avoid being etched. This is conducive to making the side wall etching amount of the first sub-layer 2201 larger, thereby achieving that the side wall of the second sub-layer 2202 protrudes from the side wall of the first sub-layer 2201 in the first direction X. In addition, by controlling the thickness of the protection part 222, the side wall etching amount of the first sub-layer 2201 can be controlled, thereby controlling the degree of retraction of the first sub-layer 2201 relative to the second sub-layer 2202.

[0048] In the preparation of Figure 1 In the process of etching the second layer 22 shown in FIG. 23 , the protective portion 222 on the side wall 221A of the main body 221 can be set to be relatively thick, so that all the side walls 221A of the main body 221 can be well protected, and the side walls 221A of the main body 221 can be prevented from being etched in the subsequent etching process. Of course, the thickness of the protective portion 222 can also be set to gradually increase along the direction from the first layer 21 to the third layer 23, as long as all the side walls 221A of the main body 221 can be well protected.

[0049] For example, when preparing the protection portion 222, the center thickness of the protection portion 222 is greater than 20 nm. The center thickness here refers to the thickness of the protection portion 222 located at the middle position of the second layer along the direction from the first layer 21 to the third layer 23. By flexibly adjusting the thickness of the protection portion 222 close to the first layer 21, the following can be finally achieved: Figure 1 or Figure 3 The second layer structure is shown.

[0050] In one embodiment of the present application, Figure 1 As shown, the first layer 21 is located on the side of the third layer 23 away from the substrate 10, and in the first direction X, the third layer 23 protrudes from the edge of the first layer 21. That is, the first metal line 20 may have a "narrow at the top and wide at the bottom" structure.

[0051] It is understandable that other film layers are usually required to be prepared on the first metal wire 20. In the embodiment of the present application, the third layer 23 close to the substrate 10 is made to protrude from the first layer 21 away from the substrate 10, so that the side of the first metal wire 20 can be relatively smooth, which is beneficial to avoid the subsequent film layer from breaking on the side of the first metal wire 20, thereby improving the film formation quality of the subsequent film layer.

[0052] Optionally, the materials of the first layer 21 and the third layer 23 both include titanium. In the direction Z perpendicular to the plane where the display panel 01 is located, the first layer 21 and the third layer 23 are located on opposite sides of the second layer 22. The first layer 21 and the third layer 23 will contact other film layers in the display panel 01, and can also protect the second layer 22 as the main conductive material. Since metal titanium has extremely high chemical stability, the materials of the first layer 21 and the third layer 23 both include titanium, which is beneficial to improving the protection of the second layer 22 on the one hand, and can reduce the damage to the first metal wire 20 during the preparation process of the display panel on the other hand.

[0053] Please continue to refer to Figure 1 In one embodiment of the present application, the first layer 21 is located on a side of the third layer 23 away from the substrate 10 , and a thickness D of the protection portion 222 along the first direction X gradually increases along a direction from the first layer 21 to the third layer 23 .

[0054] From the above analysis, it can be known that in the direction Z perpendicular to the plane where the display panel 01 is located, the first metal wire 20 can be in a "narrow at the top and wide at the bottom" structure, that is, along the direction from the first layer 21 to the third layer 23, the length of the second layer 22 protruding from the first layer 21 can be increasingly larger. Moreover, the protective portion 222 can be formed by injecting gas into the metal material in the second layer 22. Therefore, by injecting gas into the second layer 22 in the direction Z perpendicular to the plane where the display panel 01 is located, the thickness D of the protective portion 222 can be gradually increased, which is conducive to simplifying the preparation process of the protective portion 222 and reducing the difficulty of preparing the protective portion 222.

[0055] Moreover, by gradually increasing the size of the protection portion 222, the thickness of the protection portion 222 at different positions can be flexibly adjusted, thereby controlling the etching degree at different positions of the main body 221, which is conducive to achieving the following Figure 3 , Figure 4 The second layer structure is shown.

[0056] Optional, such as Figure 1 As shown, the center thickness of the protection part 222 is d1, d1>20nm. Here, the center thickness refers to the thickness of the protection part 222 at the middle position of the second layer along the direction from the first layer 21 to the third layer 23. Based on this setting, it is beneficial to ensure the anti-corrosion ability of the protection part 222 and reduce the erosion of the corrosive material from the side of the second layer 22 to the main body 221, thereby ensuring the structural stability of the first metal wire 20 and the conductive performance.

[0057] Figure 5 A schematic plan view of a display panel provided in an embodiment of the present application.

[0058] In one embodiment of the present application, Figure 5As shown, the display panel 01 includes a display area AA and a non-display area NA. The non-display area NA surrounds at least a portion of the display area AA. The non-display area NA includes a first non-display area NA1 located on one side of the display area AA. The first non-display area NA1 may include a fan-out area NA11 and a bonding area NA12 located on a side of the fan-out area away from the display area AA. The first non-display area NA1 may be the "lower frame" of the display panel 01.

[0059] The first metal line 20 is located in the first non-display area NA1.

[0060] The inventor of the present application has found through research that the bonding area NA12 can be used to electrically connect a driver chip (not shown in the figure), and the driver chip will use the signal lines in the first non-display area NA1 to provide display signals to the display area AA, and these signal lines can be directly connected to the pins of the driver chip. Therefore, the conductive performance and structural stability of these signal lines are particularly important for transmitting the display signals to the display area AA.

[0061] In the embodiment of the present application, the first metal wire 20 is located in the first non-display area NA1, and the display signal can be transmitted using the first metal wire 20. From the above analysis, it can be seen that the first metal wire 20 can reduce the risk of corrosion and can have good conductivity and structural stability, which is beneficial to improving the reliability and timeliness of the display signal transmission.

[0062] Optional, combined Figure 5 and Figure 6 As shown, Figure 6 for Figure 5 The display panel 01 is a schematic structural diagram, wherein the display panel 01 further includes an organic layer 30, which is located on a side of the first metal line 20 away from the substrate 10. The display panel further includes an organic layer clearance area 31, which is located in the first non-display area NA1.

[0063] For example, Figure 6 As shown, the display panel 01 further includes a transistor array layer 40, which is located on the side of the organic layer 30 close to the substrate 10. The organic layer 30 may include a planarization layer 301 and a pixel definition layer 302, and a light-emitting device FG may be provided in the opening of the pixel definition layer 302. The transistor array layer 40 may include a low-temperature polycrystalline silicon thin film transistor T1 and an oxide thin film transistor T2 at the same time, that is, the display panel 01 may be a display panel 01 of LTPO (low-temperature polycrystalline oxide) technology. In this way, the advantages of low-temperature polycrystalline silicon and oxide may be combined to improve the performance of the display panel 01. No organic layer will be provided in the organic layer clearance area 31. For example, the aforementioned planarization layer 301 and the pixel definition layer 302 will both be cut off in this area, and other organic layers located on the substrate will also be cut off in this area.

[0064] The first metal line 20 is located at the same layer as the source of the low-temperature polysilicon thin film transistor T1 and the source of the oxide thin film transistor T2 .

[0065] Exemplarily, the first metal line 20 is a power signal line, and the first metal line 20 can be used to transmit a power voltage PVDD or a power voltage PVEE.

[0066] At least a portion of the first metal line 20 is located in the organic layer clearance area 31 , that is, the first metal line 20 may extend through the organic layer clearance area 31 .

[0067] From the above analysis, it can be seen that the first metal wire 20 can reduce the erosion of the etching material on the main body 221 from the side of the second layer 22, that is, it can reduce the risk of the second layer 22 being side-etched, which is beneficial to avoid forming grooves on the side of the first metal wire 20.

[0068] Therefore, when the first metal wire 20 extends through the organic layer clearance area 31, it is helpful to avoid organic material remaining on the side of the first metal wire 20, thereby preventing the organic material from forming a channel for water vapor erosion along the side of the first metal wire 20, thereby preventing external water and oxygen from invading the interior of the display panel 01 along the side of the first metal wire 20, thereby improving the reliability and life of the display panel 01.

[0069] Please continue to refer to Figure 6 The display panel 01 further includes an encapsulation layer 50 , which is located on a side of the first metal line 20 away from the substrate 10 , and along a direction Z perpendicular to the plane where the display panel 01 is located, the encapsulation layer 50 at least partially overlaps with the first metal line 20 .

[0070] For example, Figure 6 As shown, the encapsulation layer 50 includes a first inorganic encapsulation layer 51, an organic encapsulation layer 52, and a second inorganic encapsulation layer 53 which are stacked, and the organic encapsulation layer 52 is disposed between the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53. In the embodiment of the present application, the encapsulation layer 50 overlapping with the first metal line 20 is at least one of the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53. Along the direction Z perpendicular to the plane where the display panel 01 is located, the organic encapsulation layer 52 does not overlap with the first metal line 20.

[0071] It should be noted that Figure 6 FIG. 5 only illustrates the situation where both the first inorganic encapsulation layer 51 and the second inorganic encapsulation layer 53 overlap with the first metal line 20 .

[0072] For example, Figure 6As shown, in the organic layer clearance area 31, the encapsulation layer 50 contacts the first metal line 20. That is, in the first non-display area NA1, there is a situation where the encapsulation layer 50 contacts the first metal line 20 directly.

[0073] Combination Figure 6 and Figure 7 As shown, Figure 7 A schematic diagram of the structure of another display panel provided in an embodiment of the present application, in one implementation of the present application, the protection portion 222 covers the side wall 221A of the main body 221 along the first direction X. In this way, the protection portion 222 can completely cover the side wall 221A of the main body 221, which is conducive to achieving comprehensive protection of the side wall 221A of the main body 221 and avoiding the appearance of deep grooves on the side of the second layer 22. When preparing the encapsulation layer 50 on the first metal wire 20, the encapsulation layer 50 can be relatively tightly encapsulated along the side of the second layer 22, which is conducive to forming a tight encapsulation effect.

[0074] Combination Figure 6 and Figure 8 As shown, Figure 8 A schematic diagram of the structure of another display panel provided in an embodiment of the present application. In another implementation of the present application, the second layer 22 includes a first sublayer 2201 and a second sublayer 2202, and the first sublayer 2201 is located on a side of the second sublayer 2202 away from the substrate 10. In the first direction X, the second sublayer 2202 protrudes from the first sublayer 2201, and the side of the second layer 22 can form a "step" shape. When preparing the encapsulation layer 50 on the first metal wire 20, the encapsulation layer 50 can be formed along the "step"-shaped side of the second layer 22, which is conducive to further improving the encapsulation effect of the encapsulation layer 20.

[0075] It should be noted that if Figure 8 As shown, although the first sublayer 2201 is retracted relative to the second sublayer 2202, since the first sublayer 2201 is located on the side of the second sublayer 2201 away from the substrate 10, the gap Q generated by its retraction will not be blocked by the second sublayer 2201. Moreover, the degree of retraction of the first sublayer 2201 relative to the second sublayer 2202 is controllable, and the first layer 21 has limited blocking of the gap Q. In the organic layer clearance area 31, the organic material in the gap Q can be reliably removed, and the organic material will not form a channel for water and oxygen corrosion along the side of the first metal line 20. Fig. 9 A schematic diagram of the structure of another display panel provided in an embodiment of the present application.

[0076] In one embodiment of the present application, Fig. 9As shown, the display panel 01 further includes a light emitting layer 60 , the light emitting layer 60 includes a plurality of light emitting devices FG, and the first metal wire 20 is located on a side of the light emitting layer 60 away from the substrate 10 .

[0077] Optionally, the first metal line 20 is a touch signal line.

[0078] For example, Fig. 9 As shown, the first metal wire 20 does not overlap with the light emitting device FG along the direction Z perpendicular to the plane of the display panel 01. In this way, the first metal wire 20 can be prevented from blocking the light of the light emitting device FG, which is beneficial to improving the light efficiency of the light emitting device FG.

[0079] The inventors of the present application have found through research that in order to increase the functional diversity of the display panel, in addition to the display function, the display panel usually integrates other specific functions, such as a touch function. In order to avoid interference between the signals for implementing these specific functions and the display signals, the signal routing lines required for implementing these specific functions are usually arranged on the side of the light-emitting layer 60 away from the substrate 10. The reliability of these signal routing lines often determines whether the specific functions can be implemented.

[0080] In view of this, in the embodiment of the present application, the first metal wire 20 is arranged to be located on the side of the light-emitting layer 60 away from the substrate 10, so that the signal used to achieve a specific function can be transmitted using the first metal wire 20. From the above analysis, it can be seen that the first metal wire 20 can reduce the risk of corrosion and can have good conductive properties and structural stability, which is beneficial to improving the reliability of the display panel to achieve specific functions.

[0081] Of course, any one of the signal lines located on the side of the light emitting layer 60 away from the substrate 10 can be the first metal line 20 .

[0082] Please continue to refer to Fig. 9 In one embodiment of the present application, the display panel 01 further includes a polarizer POL, which is located on a side of the first metal line 20 away from the light emitting layer 60. That is, a polarizer POL is also provided on a side of the light emitting layer 60 away from the substrate 10.

[0083] The inventors of the present application have found through research that under high temperature and high humidity conditions, the iodine (I 2 ) will precipitate, iodine and hydroxide ions (OH - ) reacts to generate the highly oxidizing iodate ion (IO 3 - ), the chemical reaction formula is: 3I 2 +6OH - →5I - +IO 3 - +3H 2O. Iodate ion (IO 3 - ) can be converted into iodic acid (HIO 3 ), which can easily corrode the aluminum in the nearby metal traces. The chemical reaction formula is: 2Al+HIO 3 →Al 2 O 3 +HI(g).

[0084] From the above analysis, it can be known that the protection portion 222 in the first metal wire 20 is resistant to acid corrosion. Therefore, setting the first metal wire 20 between the light-emitting layer 60 and the polarizer POL (all metal traces close to the polarizer POL can be the first metal wire 20) is conducive to reducing the corrosion of the main body 221 in the first metal wire 20 by iodic acid, and ensuring the structural stability of the first metal wire 20.

[0085] For example, when the first metal line 20 is a touch signal line, it can prevent the change of touch capacitance caused by iodic acid corrosion, or even the breakage of the touch signal line, and is conducive to ensuring the realization of the touch function of the display panel 01.

[0086] Fig.10 A process flow chart of a display panel manufacturing method provided in an embodiment of the present application.

[0087] The present application also provides a method for preparing a display panel 01, which is used to prepare the display panel 01 as described above. The structure of the display panel 01 can be as follows: Figure 1-Figure 9 As shown. Fig.10 As shown, the preparation method comprises: Step S1: providing a substrate 10, and stacking a first metal layer M1, a second metal layer M2 and a third metal layer M3 on one side of the substrate 10 to form the third layer 23, the initial second layer 22C and the first layer 21 of the first metal wire 20 respectively.

[0088] That is, the first metal layer M1 can be used as the third layer 23 of the first metal line 20 , the second metal layer M2 can be used as the initial second layer 22C of the first metal line 20 , and the third metal layer M3 can be used as the first layer 21 of the first metal line 20 .

[0089] Optionally, the first metal layer M1 and the third metal layer M3 include titanium, and the second metal layer M2 includes aluminum.

[0090] Step S2 : injecting gas into the sidewall of the initial second layer 22C, the gas and the metal in the second metal layer M2 generate a metal compound to form the second layer 22 .

[0091] The metal compound forms the protection portion 222 in the second layer 22 , and the metal in the second metal layer M2 that does not react with the gas forms the main body 221 of the second layer 22 .

[0092] Since the gas reacts with the metal at the sidewall of the initial second layer 22C to generate a metal compound, the protection portion 222 formed of the metal compound may cover at least a portion of the sidewall of the main body portion 221 .

[0093] Optionally, in step S2, the central thickness of the metal compound is d1, d1>20 nm. The central thickness here refers to the thickness of the metal compound at the middle position of the second metal layer M2 along the direction from the third metal layer M3 to the first metal layer M1.

[0094] Optionally, the gas is a nitrogen- and / or fluorine-containing gas, such as nitrogen, carbon tetrafluoride gas, sulfur hexafluoride gas, and the like.

[0095] For example, since the second metal layer M2 may include aluminum, the metal compound may be aluminum nitride or aluminum fluoride.

[0096] In the preparation method provided in the embodiment of the present application, a protective portion 222 containing a metal compound is provided to cover at least a portion of the side wall 221A of the main body 221 in the second layer 22. The anti-corrosion properties of the metal compound can be utilized to protect the side wall 221A of the main body 221, thereby reducing the erosion of the main body 221 by corrosive materials from the side of the second layer 22, thereby facilitating the improvement of the structural stability of the first metal wire 20 and the improvement of the conductive performance.

[0097] Moreover, during the preparation of the second layer 22 , the protective portion 222 can be formed by injecting gas into the metal in the second layer 22 , without the need to prepare an additional layer of protective material on the side of the second layer 22 , which is beneficial for simplifying the preparation process of the protective portion 222 and reducing the preparation cost of the first metal wire 20 .

[0098] In one embodiment of the present application, Figure 3 , Figure 4 As shown, the second layer 22 includes a first sublayer 2201 and a second sublayer 2202, and the first sublayer 2201 and the second sublayer 2202 are connected in a direction Z perpendicular to the plane where the display panel 01 is located. The first sublayer 2201 is located on a side of the second sublayer 2202 away from the substrate 10. The main body 221 in the first sublayer 2201 and the second sublayer 2202 may include the same material, such as the above-mentioned metal aluminum. In the first direction X, the side wall of the second sublayer 2202 protrudes from the side wall of the first sublayer 2201.

[0099] like Fig.11 As shown, Fig.11 A process flow chart of another display panel manufacturing process provided in an embodiment of the present application, before forming the second layer 22, the manufacturing method further includes: Step S21: along the direction from the first layer 21 to the third layer 23, the gas and the metal in the second metal layer M2 generate metal compounds with uneven thickness, forming an initial first sub-layer 2201C and an initial second sub-layer 2202C.

[0100] The thickness D2 of the metal compound in the initial second sublayer 2202C is greater than the thickness D1 of the metal compound in the initial first sublayer 2201C. Of course, the minimum thickness of the metal compound in the initial second sublayer 2202C may be greater than the maximum thickness of the metal compound in the initial first sublayer 2201C. Here, the thickness of the metal compound refers to the thickness in the first direction X.

[0101] Optionally, the thickness of the metal compound gradually increases along the direction from the first layer 21 to the third layer 23. In step S21, the central thickness of the metal compound may be greater than 20 nm. Here, the central thickness refers to the thickness of the metal compound at the middle position of the second metal layer M2 along the direction from the first layer 21 to the third layer 23.

[0102] Step S22 : etching the initial first sub-layer 2201C and the initial second sub-layer 2202C to form the first sub-layer 2201 and the second sub-layer 2202 .

[0103] In step S22, since the thickness of the metal compound in the initial second sublayer 2202C is relatively large, the metal in the initial second sublayer 2202C can be well protected by the metal compound, while the thickness of the metal compound in the initial first sublayer 2201C is relatively small, and the metal in the initial first sublayer 2201C can be etched a small amount, so that in the first direction X, the formed second sublayer 2202 protrudes from the first sublayer 2201.

[0104] In the embodiment of the present application, only a small amount of metal in the initial first sub-layer 2201C is etched, so that the etching amount of metal in the second layer 22 can also be reduced, thereby improving the structural stability and conductive performance of the first metal wire 20.

[0105] Moreover, the sidewall of the second sublayer 2202 is not on the same straight line as the sidewall of the first sublayer 2201, and the second sublayer 2202 and the first sublayer 2201 can form a "step-like" structure, that is, the side of the second layer 22 can form a "step". Based on this arrangement, the side of the second layer 22 is relatively flat, and when a subsequent film layer is prepared on the first metal wire 20, the subsequent film layer can climb along the sidewall of the second sublayer 2202 to the sidewall of the first sublayer 2201, which is conducive to improving the adhesion effect of the subsequent film layer to the side of the second layer 22, thereby further improving the film quality of the subsequent film layer.

[0106] Fig.12 A schematic diagram of a display device provided in an embodiment of the present application.

[0107] The present application also provides a display device 02, such as Fig.12 As shown, the display device 02 includes the display panel 01 provided in the above embodiment. The display device 02 provided in the embodiment of the present application may be as shown in FIG. Fig.12 The mobile phone shown may also be a computer, a television, a car display or other electronic device, and this application does not make any specific limitation.

[0108] In the display device 02, a protective portion 222 containing a metal compound is provided to cover at least a portion of the side wall 221A of the main body 221 in the second layer 22. The anti-corrosion property of the metal compound can be utilized to protect the side wall 221A of the main body 221, thereby reducing the erosion of the main body 221 by corrosive materials from the side of the second layer 22, thereby facilitating the improvement of the structural stability of the first metal wire 20 and the improvement of the conductive performance.

[0109] Moreover, during the preparation of the second layer 22 , the protective portion 222 can be formed by injecting gas into the metal in the second layer 22 , without the need to prepare an additional layer of protective material on the side of the second layer 22 , which is beneficial for simplifying the preparation process of the protective portion 222 and reducing the preparation cost of the first metal wire 20 .

[0110] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The method comprises a substrate and a first metal line located on one side of the substrate, wherein the first metal line comprises a first layer, a second layer and a third layer which are stacked, and the second layer is located between the first layer and the third layer; The second layer includes a main body portion and a protection portion, the protection portion includes a metal compound, and along a first direction, the protection portion covers at least a portion of a side wall of the main body portion; Wherein, the first direction is parallel to the plane where the display panel is located, and points from the main body to the protection part.

2. The display panel according to claim 1, characterized in that: The protection portion includes at least one of metal nitride and metal fluoride.

3. The display panel according to claim 2, characterized in that: The main body portion includes aluminum, and the protection portion includes at least one of aluminum nitride or aluminum fluoride.

4. The display panel according to claim 1, characterized in that: The protection portion is located outside the main body portion, and the protection portion is connected to a side wall of the main body portion.

5. The display panel according to claim 4, characterized in that: Along the first direction, the protection portion covers a side wall of the main body portion.

6. The display panel according to claim 1, characterized in that: The second layer includes a first sublayer and a second sublayer, the first sublayer and the second sublayer are connected in a direction perpendicular to the plane where the display panel is located, and the first sublayer is located on a side of the second sublayer away from the substrate; Wherein, in the first direction, the sidewall of the second sublayer protrudes beyond the sidewall of the first sublayer.

7. The display panel according to claim 6, characterized in that: The second sub-layer includes the main body portion and the protection portion. Along the first direction, the protection portion covers at least a portion of a side wall of the main body portion.

8. The display panel according to claim 7, characterized in that: The first sub-layer includes the main body portion and does not include the protection portion.

9. The display panel according to claim 1, characterized in that: The materials of the first layer and the third layer both include titanium.

10. The display panel according to claim 1, characterized in that: The first layer is located on a side of the third layer away from the substrate, and in the first direction, the third layer protrudes beyond an edge of the first layer.

11. The display panel according to claim 1, characterized in that: The first layer is located at a side of the third layer away from the substrate, and along a direction from the first layer to the third layer, a thickness of the protection portion gradually increases along the first direction.

12. The display panel according to claim 11, characterized in that: The central thickness of the protection portion is d1, and d1>20 nm.

13. The display panel according to claim 1, characterized in that: It includes a display area and a non-display area, wherein the non-display area surrounds at least a portion of the display area; the non-display area includes a first non-display area located at one side of the display area; The first metal line is located in the first non-display area.

14. The display panel according to claim 13, characterized in that: The first non-display area includes an organic layer clearance area, and at least a portion of the first metal line is located in the organic layer clearance area.

15. The display panel according to claim 13, characterized in that: The display panel further includes an encapsulation layer, which is located on a side of the first metal line away from the substrate, and at least partially overlaps the first metal line along a direction perpendicular to a plane where the display panel is located.

16. The display panel according to claim 13, characterized in that: The first metal line is a power signal line.

17. The display panel according to claim 1, characterized in that: The display panel further includes a light emitting layer, and the first metal line is located on a side of the light emitting layer away from the substrate.

18. The display panel according to claim 17, characterized in that: The display panel further includes a polarizer, and the polarizer is located on a side of the first metal line away from the light-emitting layer.

19. The display panel according to claim 17, characterized in that: The first metal line is a touch signal line.

20. A method for preparing a display panel, characterized in that: For preparing a display panel according to any one of claims 1 to 19, the method comprising: Providing the substrate, and stacking a first metal layer, a second metal layer, and a third metal layer on one side of the substrate to form the third layer, the initial second layer, and the first layer of the first metal line respectively; A gas is injected into the side wall of the initial second layer, and the gas generates a metal compound with the metal in the second metal layer to form the second layer.

21. The method according to claim 20, characterized in that The gas is a gas containing nitrogen and / or fluorine.

22. The method according to claim 20, characterized in that The second layer includes a first sublayer and a second sublayer, the first sublayer and the second sublayer are connected in a direction perpendicular to the plane where the display panel is located, the first sublayer is located on a side of the second sublayer away from the substrate, and in the first direction, the sidewall of the second sublayer protrudes from the sidewall of the first sublayer; Before forming the second layer, the method further comprises: Along the direction from the first layer to the third layer, the gas and the metal in the second metal layer generate metal compounds with uneven thickness, forming an initial first sublayer and an initial second sublayer; the thickness of the metal compound in the initial second sublayer is greater than the thickness of the metal compound in the initial first sublayer; The initial first sub-layer and the initial second sub-layer are etched to form the first sub-layer and the second sub-layer.

23. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-19.

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