Display substrate, preparation method thereof and display device

Abstract

The invention provides a display substrate, a preparation method thereof and a display device.The display substrate comprises a substrate body, a display function layer located in a display area of the substrate body and a blocking dam located in a non-display area of the substrate body; the first inorganic packaging layer and the organic packaging layer are sequentially arranged on the side, away from the substrate, of the display function layer; wherein the surface of the first inorganic packaging layer is provided with an inorganic lyophobic structure covering the top of the blocking dam; the inorganic lyophobic structure has hydrophobicity, and the contact angle of the corresponding material of the organic packaging layer on the inorganic lyophobic structure is larger than or equal to 90 degrees.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate, a preparation method thereof and a display device. Background Art

[0002] In the current organic light emitting diode (OLED) display technology, the color filter on encapsulation (COE) technology is widely used. However, in the process of preparing the thin film encapsulation layer, the high thickness of the ink jet printing (IJP) will cause a large loss of OLED display brightness attenuation (L-decay), so it is necessary to reduce the thickness of the IJP. However, after the thickness of the IJP is reduced, due to its poor leveling on the inorganic encapsulation layer (referred to as the TFECVD1 layer) it contacts, orange mura will appear. In order to improve this situation, although the leveling of the IJP solution at the interface of the TFECVD1 layer has been achieved by changing the film quality at the interface of the TFECVD1 layer, the dot size (Dot size) of the IJP solution dripping on the TFECVD1 layer has increased (for example, 210μm to 450μm).

[0003] Especially in OLED mobile phone products, the area corresponding to the under-screen camera (AA hole, denoted as AAH) is mostly designed with a single barrier dam (Dam). As the IJP Dot size increases, the IJP solution is likely to overflow through the Dam and overflow to the second to third isolation columns outside the Dam, creating a risk of reliability failure. As a result, how to prevent the overflow of the IJP solution has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] The invention provides a display substrate, a preparation method thereof and a display device, which are used to avoid overflow of an IJP solution.

[0005] In a first aspect, an embodiment of the present invention provides a display substrate, comprising:

[0006] A base substrate, a display function layer located in a display area of ​​the base substrate, a barrier dam located in a non-display area of ​​the base substrate, and a first inorganic encapsulation layer and an organic encapsulation layer sequentially arranged on a side of the display function layer away from the base substrate;

[0007] The surface of the first inorganic encapsulation layer has an inorganic lyophobic structure covering the top of the blocking dam; the inorganic lyophobic structure is hydrophobic, and the contact angle of the corresponding material of the organic encapsulation layer on the inorganic lyophobic structure is greater than or equal to 90°.

[0008] In a possible implementation manner, the inorganic lyophobic structure is independently disposed on top of the first inorganic encapsulation layer.

[0009] In a possible implementation, the material of the inorganic liquid-repellent structure is a carbon nanotube film or a graphene film.

[0010] In a possible implementation, the thickness of the inorganic lyophobic structure is in the range of 1 nm to 10 nm.

[0011] In a possible implementation manner, a portion of the first inorganic encapsulation layer covering the top of the barrier dam is doped with predetermined inorganic ions and serves as the inorganic lyophobic structure.

[0012] In a possible implementation manner, the inorganic lyophobic structure extends from the top of the blocking dam to a side wall of the blocking dam close to the display area.

[0013] In a possible implementation manner, at least one groove structure is formed on a side of the blocking dam facing away from the base substrate, and the inorganic liquid-repellent structure at least covers the top of a portion of the blocking dam other than the groove structures.

[0014] In a possible implementation manner, the display substrate has a plurality of barrier dams, and the inorganic liquid-repellent structure covers the plurality of barrier dams and an area between two adjacent barrier dams.

[0015] In a second aspect, an embodiment of the present invention further provides a display device, including:

[0016] A display substrate as described in any one of the above items.

[0017] In a third aspect, an embodiment of the present invention further provides a method for preparing a display substrate, comprising:

[0018] forming a display function layer in a display area of ​​a base substrate, and forming a blocking dam in a non-display area of ​​the base substrate;

[0019] On the side of the display function layer and the blocking dam facing away from the base substrate, a first inorganic encapsulation layer having an inorganic liquid-repellent structure covering the top of the blocking dam is formed;

[0020] An organic encapsulation layer is formed on a side of the first inorganic encapsulation layer away from the base substrate; wherein the inorganic lyophobic structure is hydrophobic, and a contact angle of a corresponding material of the organic encapsulation layer on the inorganic lyophobic structure is greater than or equal to 90°.

[0021] In a possible implementation, forming a first inorganic encapsulation layer having an inorganic liquid-repellent structure covering the top of the blocking dam on a side of the display function layer and the blocking dam away from the base substrate includes:

[0022] forming the first inorganic encapsulation layer on a side of the display function layer and the blocking dam facing away from the base substrate;

[0023] doping an inorganic thin film material with an organic material used to modify the inorganic thin film material by a chemical doping method to obtain a doped material;

[0024] The doped material is deposited on the surface of the first inorganic encapsulation layer corresponding to the blocking dam by a solution method to form an inorganic liquid-repellent structure, thereby obtaining the first inorganic encapsulation layer having a surface with the inorganic liquid-repellent structure covering the top of the blocking dam.

[0025] In a possible implementation, forming a first inorganic encapsulation layer having an inorganic liquid-repellent structure covering the top of the blocking dam on a side of the display function layer and the blocking dam away from the base substrate includes:

[0026] forming the first inorganic encapsulation layer on a side of the display function layer and the blocking dam facing away from the base substrate;

[0027] By ion implantation, preset inorganic ions are implanted into the portion of the first inorganic encapsulation layer corresponding to the top of the blocking dam to form an inorganic liquid-repellent structure, thereby obtaining the first inorganic encapsulation layer having the inorganic liquid-repellent structure covering the top of the blocking dam.

[0028] The beneficial effects of the present invention are as follows:

[0029] The embodiment of the present invention provides a display substrate, a preparation method thereof and a display device, wherein the display substrate includes a base substrate, a display function layer located in the display area of ​​the base substrate, a barrier dam located in the non-display area of ​​the base substrate, and a first inorganic encapsulation layer and an organic encapsulation layer sequentially arranged on the side of the display function layer away from the base substrate; wherein the surface of the first inorganic encapsulation layer has an inorganic liquid-repellent structure covering the top of the barrier dam, the inorganic liquid-repellent structure has hydrophobicity, and the contact angle of the corresponding material of the organic encapsulation layer on the inorganic liquid-repellent structure is greater than or equal to 90°. In this way, the inorganic liquid-repellent structure can at least change the film layer interface properties on the surface of the first inorganic encapsulation layer in the top area of ​​the barrier dam, thereby achieving a repelling effect on the IJP solution corresponding to the preparation of the organic encapsulation layer, thereby avoiding the undesirable problem of the IJP solution overflowing outside the barrier dam, and improving the yield of the display substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of a top view structure of a display substrate provided in an embodiment of the present invention;

[0031] Figure 2 For along Figure 1 A schematic diagram of one of the cross-sectional structures in the direction indicated by MM;

[0032] Figure 3 A schematic diagram of one structure of a display substrate provided in an embodiment of the present invention;

[0033] Figure 4 A schematic diagram of one structure of a display substrate provided in an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of one structure of a display substrate provided in an embodiment of the present invention;

[0035] Figure 6 A schematic diagram of one structure of a display substrate provided in an embodiment of the present invention;

[0036] Figure 7 A flow chart of one of the methods for preparing a display substrate provided by an embodiment of the present invention;

[0037] Figure 8 for Figure 7 A method flow chart of step S102;

[0038] Fig. 9 for Figure 7 A method flow chart of step S102;

[0039] Description of reference numerals:

[0040] 10-substrate substrate; AA-display area; 20-display function layer; BB-non-display area; 30-blocking dam; 40-first inorganic encapsulation layer; 50-organic encapsulation layer; 60-inorganic liquid-repellent structure; B1-first sub-area; B2-second sub-area; 21-anode layer; 22-organic light-emitting layer; 23-cathode layer; 70-buffer layer; 80-active layer; 90-first gate insulating layer; 91-first gate electrode layer; 92-second gate insulating layer; 93-second gate electrode layer; 94-interlayer insulating layer; 95-first source and drain electrode layer; 96-first planarization layer; 97-second source and drain electrode layer; 98-second planarization layer; 99-pixel definition layer; 100-spacer; 101-second inorganic encapsulation layer. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. And in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0042] Unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Inside", "outside", "upper", "lower" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual proportions, but are only intended to illustrate the content of the present invention. The same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions.

[0044] In the related art, a variety of structural designs can be used to prevent the IJP from overflowing over the barrier dam. For example, the barrier dam's transverse width is increased, the longitudinal height is increased, the number of barrier dams is increased, grooves are set on the barrier dam, etc. However, increasing the barrier dam's transverse width or the number of barrier dams will increase the AAH non-display border area; the height of the barrier dam has reached 5μm to 6μm, and further increasing its height will increase the complexity of the process and the risk of reliability failure; and although the microstructures such as grooves are set on the barrier dam, the anti-overflow effect is highly related to the depth, morphology and width of the grooves, and improper design will still cause the IJP to overflow outside the barrier dam.

[0045] In view of this, an embodiment of the present invention provides a display substrate, a preparation method thereof, and a display device, which are used to avoid overflow of an IJP solution and improve the yield of the display substrate.

[0046] Combination Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of a top view of a display substrate provided in an embodiment of the present invention. Figure 2 For along Figure 1 A schematic diagram of a cross-sectional structure in the direction indicated by MM. Specifically, it includes:

[0047] A base substrate 10, a display function layer 20 located in a display area AA of the base substrate 10, a barrier dam 30 located in a non-display area BB of the base substrate 10, and a first inorganic encapsulation layer 40 and an organic encapsulation layer 50 sequentially disposed on a side of the display function layer 20 away from the base substrate 10;

[0048] The surface of the first inorganic encapsulation layer 40 has an inorganic lyophobic structure 60 covering the top of the blocking dam 30; the inorganic lyophobic structure 60 is hydrophobic, and the contact angle of the corresponding material of the organic encapsulation layer 50 on the inorganic lyophobic structure 60 is greater than or equal to 90°.

[0049] In the specific implementation process, the display substrate provided by the embodiment of the present invention includes a base substrate 10. Exemplarily, the base substrate 10 can be a rigid substrate, such as a silicon-based substrate, a glass substrate, etc., which is not limited here. Exemplarily, the base substrate 10 can also be a flexible substrate. Of course, the specific material of the base substrate 10 can also be set according to the actual application needs, which is not limited here. In addition, the base substrate 10 is divided into a display area AA and a non-display area BB. Figure 1 FIG. 1 is a schematic diagram showing a division of the display area AA and the non-display area BB. Specifically, the non-display area BB includes a first sub-area B1 surrounded by the display area AA, and a second sub-area B2 surrounding the display area AA.

[0050] In addition, the display substrate further includes a display function layer 20 located in the display area AA, a barrier dam 30 located in the non-display area BB of the base substrate 10, and a first inorganic encapsulation layer 40 and an organic encapsulation layer 50 sequentially arranged on the side of the display function layer 20 away from the base substrate 10. Exemplarily, the display function layer 20 includes an anode layer 21, an organic light-emitting layer 22, and a cathode layer 23 sequentially arranged away from the base substrate 10. In one of the exemplary embodiments, the barrier dam 30 may be located in the first sub-area B1. In one of the exemplary embodiments, the barrier dam 30 may be located in the second sub-area B2. In one of the exemplary embodiments, the barrier dam 30 may include a portion located in the first sub-area B1 and a portion located in the second sub-area B2. In the specific implementation process, the first inorganic encapsulation layer 40 and the organic encapsulation layer 50 completely cover the display function layer 20. Exemplarily, the first inorganic encapsulation layer 40 may be an inorganic material such as SiO, SiN, etc., thereby effectively isolating the corrosion of water and oxygen to the display function layer 20, thereby improving the manufacturing yield of the display substrate.

[0051] Moreover, the surface of the first inorganic encapsulation layer 40 has an inorganic lyophobic structure 60 covering the top of the blocking dam 30; accordingly, the inorganic lyophobic structure 60 can at least cover the top of the blocking dam 30. In addition, the inorganic lyophobic structure 60 is hydrophobic, and the contact angle of the material corresponding to the organic encapsulation layer 50 on the inorganic lyophobic structure 60 is greater than or equal to 90°. In this way, the IJP solution corresponding to the preparation of the organic encapsulation layer 50 cannot be spread on the inorganic lyophobic structure 60, and the inorganic lyophobic structure 60 can achieve a repelling effect on the IJP solution corresponding to the preparation of the organic encapsulation layer 50, thereby avoiding the problem of the IJP solution overflowing outside the blocking dam 30 and improving the yield of the display substrate.

[0052] In order to more clearly illustrate the inventive nature of the embodiment of the present invention, unless otherwise specified, the specific structure of the display substrate provided by the embodiment of the present invention is explained in detail below in combination with the case where the barrier dam 30 is located in the first sub-region B1.

[0053] In the embodiment of the present invention, the inorganic lyophobic structure 60 may be provided in the following implementations, but is not limited thereto.

[0054] In one exemplary embodiment, still in combination Figure 2 As shown, the inorganic lyophobic structure 60 is independently disposed on top of the first inorganic encapsulation layer 40 .

[0055] Still combined Figure 2In the exemplary embodiment shown, the inorganic lyophobic structure 60 is located between the first inorganic encapsulation layer 40 and the organic encapsulation layer 50, and the inorganic lyophobic structure 60 is independently arranged on the top of the first inorganic encapsulation layer 40. Exemplarily, the inorganic lyophobic structure 60 covers the top of the first encapsulation layer, so that the material of the organic encapsulation layer 50 in the area corresponding to the top of the blocking dam 30 cannot be spread on the inorganic lyophobic structure 60, thereby avoiding the problem of the IJP solution overflowing outside the blocking dam 30, and improving the yield of the display substrate.

[0056] exist Figure 2 In the exemplary embodiment shown, the material of the inorganic lyophobic structure 60 is a carbon nanotube film or a graphene film.

[0057] Exemplarily, the inorganic lyophobic structure 60 is a non-doped carbon nanotube film or graphene film; Exemplarily, the inorganic lyophobic structure 60 is a carbon nanotube film or graphene film that has been chemically doped and modified. Of course, the material of the inorganic lyophobic structure 60 can also be set according to actual application needs, which is not limited here.

[0058] exist Figure 2 In the exemplary embodiment shown, the thickness of the inorganic lyophobic structure 60 ranges from 1 nm to 10 nm. Exemplarily, the thickness of the inorganic lyophobic structure 60 is 2 nm. Exemplarily, the thickness of the first inorganic encapsulation layer 40 ranges from 500 nm to 600 nm. Of course, the specific thickness of the inorganic lyophobic structure 60 and the first inorganic encapsulation layer 40 can be set according to actual application needs, and is not limited here.

[0059] In the actual preparation process, whether the inorganic lyophobic structure 60 is prepared by using a carbon nanotube film or a graphene film, the inorganic lyophobic structure 60 can be made very thin. In this way, the surface affinity / lyophobicity of the carbon nanotube film or the graphene film can be easily controlled by the chemical doping modification method, thereby improving the preparation efficiency of the inorganic lyophobic structure 60. In addition, the solution method can be used to uniformly deposit the modified carbon nanotube film or graphene film on the surface of the first inorganic encapsulation layer 40, and then the non-patterned area (i.e., the non-patterned area) can be removed by plasma etching. Figure 2 The illustrated embodiment (except for the top of the barrier dam 30) can be easily removed, thereby being compatible with existing processes.

[0060] In one exemplary embodiment, a portion of the first inorganic encapsulation layer 40 covering the top of the barrier dam 30 is doped with predetermined inorganic ions and serves as the inorganic lyophobic structure 60 .

[0061] Combination Figure 3 and Figure 4As shown, the portion of the first inorganic encapsulation layer 40 covering the top of the blocking dam 30 is doped with preset inorganic ions and serves as an inorganic lyophobic structure 60. Exemplarily, the preset inorganic ions are at least one of boron (B) ions, phosphorus (P) ions, nitrogen (N) ions, and silicon (Si) ions. Of course, the preset inorganic ions can also be selected according to the needs of the actual application, which is not limited here. Exemplarily, the thickness range of the inorganic lyophobic structure 60 is 5nm to 50nm. Exemplarily, the specific thickness of the inorganic lyophobic structure 60 is 6nm. Of course, the specific thickness of the inorganic lyophobic structure 60 can also be set according to the needs of the actual application, which is not limited here. In the actual preparation process, the first inorganic encapsulation layer 40 at least covering the top of the blocking dam 30 can be modified by ion implantation or plasma surface treatment, so that the contact angle of the IJP solution used to prepare the inorganic lyophobic structure 60 is greater than or equal to 90°, showing that the IJP solution cannot spread over the inorganic lyophobic structure 60. Among them, in Figure 3 In the exemplary embodiment shown, only the portion of the first inorganic encapsulation layer 40 covering the top of the barrier dam 30 is doped with the inorganic lyophobic structure 60. Figure 4 In the exemplary embodiment shown, in addition to the portion of the first inorganic encapsulating layer 40 covering the top of the barrier dam 30 being doped with the inorganic lyophobic structure 60 , other extended portions of the first inorganic encapsulating layer 40 other than the top of the barrier dam 30 are also doped with the inorganic lyophobic structure 60 .

[0062] In one exemplary embodiment, the inorganic lyophobic structure 60 extends from the top of the barrier dam 30 to the sidewall of the barrier dam 30 close to the display area AA.

[0063] Combination Figure 4 and Figure 5 As shown, the inorganic lyophobic structure 60 extends from the top of the barrier dam 30 to the side wall of the barrier dam 30 close to the display area AA. In this way, the coverage range of the inorganic lyophobic structure 60 on the barrier dam 30 is expanded. Figure 4 In the exemplary embodiment shown, the inorganic lyophobic structure 60 extends from the top of the barrier dam 30 to the side wall of the barrier dam 30 close to the display area AA, and even extends toward the display area AA. Figure 5 In the exemplary embodiment shown, the inorganic lyophobic structure 60 can also be extended from the top of the barrier dam 30 to the side wall of the barrier dam 30 close to the display area AA, or even extended to the display area AA. In this way, it is ensured as much as possible that the IJP solution for preparing the organic encapsulation layer 50 will not overflow the outside of the barrier dam 30 after contacting the inorganic lyophobic structure 60.

[0064] In one exemplary embodiment, at least one groove structure is formed on a side of the blocking dam 30 facing away from the base substrate 10 , and the inorganic lyophobic structure 60 at least covers the top of the blocking dam 30 except for the groove structures.

[0065] In the specific implementation process, at least one groove structure is provided on the side of the blocking dam 30 away from the base substrate 10. Exemplarily, the at least one groove structure can be one, or two or more, which is not limited here. In addition, the inorganic liquid-repellent structure 60 at least covers the top of the portion of the blocking dam 30 other than each groove structure. Exemplarily, the inorganic liquid-repellent structure 60 only covers the top of the portion of the blocking dam 30 other than each groove structure. Exemplarily, the inorganic liquid-repellent structure 60 not only covers the top of the blocking dam 30, but also covers each groove structure. In this way, each groove structure can be used to hold the sputtered IJP solution, further avoiding the problem of the IJP solution overflowing the blocking dam 30. Of course, the coverage of the inorganic liquid-repellent structure 60 on the blocking dam 30 can also be set according to the actual application needs, which is not limited here. It should be noted that each groove structure can be at least a part of the film layer in the corresponding stacked structure of the blocking dam 30, which can be set according to the actual application needs, which is not limited here; the specific opening of at least one groove structure can refer to the specific implementation in the relevant technology, which is not described in detail here.

[0066] In one exemplary embodiment, the display substrate has a plurality of barrier dams 30 , and the inorganic lyophobic structure 60 covers the plurality of barrier dams 30 and the area between two adjacent barrier dams 30 .

[0067] In a specific implementation process, the display substrate is provided with a plurality of barrier dams 30, and the plurality of barrier dams 30 may be two, or three or more, which is not limited here. Figure 6 Taking the exemplary embodiment shown as an example, there are two of the plurality of barrier dams 30, and the inorganic lyophobic structure 60 covers the plurality of barrier dams 30 and the area between two adjacent barrier dams 30. Specifically, the inorganic lyophobic structure 60 not only covers the top area of ​​the barrier dam 30, but also covers the groove area between the two barrier dams 30. In this way, the groove area can be used to hold the sputtered IJP solution, further avoiding the problem of the IJP solution overflowing the barrier dam 30.

[0068] In one exemplary embodiment, the display substrate has a plurality of barrier dams 30, and the inorganic lyophobic structure 60 covers the top of the barrier dam 30 farthest from the display area AA among the plurality of barrier dams 30. That is, the inorganic lyophobic structure 60 at least covers the top area of ​​the barrier dam 30 farthest from the display area AA. Of course, the coverage range of the inorganic lyophobic structure 60 can also be set according to actual application needs, which is not limited here.

[0069] It should be noted that, in the embodiment of the present invention, in addition to the film structure mentioned above, the display substrate also includes a buffer layer 70, an active layer 80, a first gate insulating layer 90, a first gate layer 91, a second gate insulating layer 92, a second gate layer 93, an interlayer insulating layer 94, a first source and drain electrode layer 95, a first planarization layer 96, a second source and drain electrode layer 97, and a second planarization layer 98, which are located between the base substrate 10 and the display function layer 20 and are sequentially arranged away from the base substrate 10; and a pixel definition layer 99 located between the organic light emitting layer 22 and the anode layer 21, a spacer 100 located on the side of the pixel definition layer 99 away from the base substrate 10, and a second inorganic encapsulation layer 101 located on the side of the organic encapsulation layer 50 away from the base substrate 10. Exemplarily, the materials of the first source and drain electrode layer 95 and the second source and drain electrode layer 97 may be Ti / Al / Ti, and the material of the second inorganic encapsulation layer 101 may be SiO, SiN, etc. In the specific implementation process, the barrier dam 30 can be a stacked structure composed of a first planarization layer 96, a second planarization layer 98, a pixel definition layer 99, and a spacer 100. Of course, other film layer structures of the display substrate can also be set according to actual application needs, which will not be described in detail here.

[0070] Based on the same inventive concept, an embodiment of the present invention further provides a display device, which includes a display substrate as described in any one of the above items.

[0071] The principle of solving the problem by the display device is similar to that of the aforementioned display substrate, so the implementation of the display device can refer to the implementation of the aforementioned display substrate, and the repeated parts will not be repeated.

[0072] In the specific implementation process, the display device provided by the embodiment of the present invention can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a laptop computer, a digital photo frame, a navigator, etc. Other essential components of the display device should be understood by ordinary technicians in the field, and will not be described in detail here, nor should they be used as limitations of the present invention.

[0073] Based on the same inventive concept, Figure 7 As shown, an embodiment of the present invention further provides a method for preparing a display substrate, comprising:

[0074] S101: forming a display function layer in a display area of ​​a base substrate, and forming a blocking dam in a non-display area of ​​the base substrate;

[0075] S102: forming a first inorganic encapsulation layer having an inorganic liquid-repellent structure covering a top of the blocking dam on a side of the display function layer and the blocking dam facing away from the base substrate;

[0076] S103: forming an organic encapsulation layer on a side of the first inorganic encapsulation layer away from the base substrate; wherein the inorganic lyophobic structure is hydrophobic, and a contact angle of a material corresponding to the organic encapsulation layer on the inorganic lyophobic structure is greater than or equal to 90°.

[0077] The following is prepared Figure 2 Taking the display substrate shown in FIG. 1 as an example, the specific implementation process of step S101 to step S103 is as follows:

[0078] First, a display function layer 20 is formed in the display area of ​​the base substrate 10, and a barrier dam 30 is formed in the non-display area BB of the base substrate 10; then, a first inorganic encapsulation layer 40 having an inorganic lyophobic structure 60 covering the top of the barrier dam 30 is formed on the side of the display function layer 20 and the barrier dam 30 away from the base substrate 10; then, an organic encapsulation layer 50 is formed on the side of the first inorganic encapsulation layer 40 away from the base substrate 10. The inorganic lyophobic material has hydrophobicity, and the contact angle of the material corresponding to the organic encapsulation layer 50 on the inorganic lyophobic structure 60 is greater than or equal to 90°. Since in the entire preparation process, it is only necessary to set the inorganic lyophobic structure 60 with hydrophobicity at least in the top area corresponding to the first inorganic encapsulation layer 40 and the barrier dam 30, it is possible to effectively isolate the overflow of the IJP solution used to prepare the organic encapsulation layer 50 at the barrier dam 30.

[0079] In the embodiment of the present invention, the first inorganic encapsulation layer 40 having the inorganic lyophobic structure 60 covering the top of the barrier dam 30 on its surface may be prepared in the following manner, but it is not limited thereto.

[0080] In one exemplary embodiment, Figure 8 As shown, step S102: forming a first inorganic encapsulation layer having an inorganic liquid-repellent structure covering the top of the blocking dam on the side of the display function layer and the blocking dam away from the base substrate, comprising:

[0081] S201: forming the first inorganic encapsulation layer on a side of the display function layer and the barrier dam facing away from the base substrate;

[0082] S202: doping the inorganic thin film material with an organic material used to modify the inorganic thin film material by a chemical doping method to obtain a doped material;

[0083] S203: depositing the doped material on the surface of the first inorganic encapsulation layer corresponding to the blocking dam by a solution method to form an inorganic liquid-repellent structure, thereby obtaining the first inorganic encapsulation layer having a surface with the inorganic liquid-repellent structure covering the top of the blocking dam.

[0084] In the specific implementation process, the specific implementation process of step S201 to step S203 is as follows:

[0085] First, a first inorganic encapsulation layer 40 is formed on the side of the display function layer 20 and the barrier dam 30 away from the base substrate 10; illustratively, a chemical vapor deposition method is used to deposit inorganic materials such as SiO and SiN on the side of the display function layer 20 and the barrier dam 30 away from the base substrate 10 to form the first inorganic encapsulation layer 40; then, an inorganic thin film material such as a carbon nanotube film and a graphene film is doped with an organic material for modifying the inorganic thin film material by a chemical doping method to obtain a doped material; illustratively, the organic material can be a fluorine-containing organic material, methyltrimethoxysilane (MTMS), poly (methyl-3,3,3-trifluoropropylsiloxane) (PMTFPS), etc., which is not limited here. Then, the doped material is deposited on the side of the first inorganic encapsulation layer 40 away from the base substrate 10 by a solution method, and then, the deposited material is etched by a plasma etching method to form an inorganic lyophobic structure 60 of a desired pattern, thereby obtaining a first inorganic encapsulation layer 40 having an inorganic lyophobic structure 60 covering the top of the barrier dam 30. In this way, the entire preparation process is relatively simple, and the preparation efficiency of the display substrate is improved.

[0086] In one exemplary embodiment, Fig. 9 As shown, step S102: forming a first inorganic encapsulation layer having an inorganic liquid-repellent structure covering the top of the blocking dam on the side of the display function layer and the blocking dam away from the base substrate, comprising:

[0087] S301: forming the first inorganic encapsulation layer on a side of the display function layer and the barrier dam facing away from the base substrate;

[0088] S302: Using ion implantation, preset inorganic ions are implanted into a portion of the first inorganic encapsulation layer corresponding to the top of the blocking dam to form an inorganic lyophobic structure, thereby obtaining the first inorganic encapsulation layer having a surface with the inorganic lyophobic structure covering the top of the blocking dam.

[0089] In the specific implementation process, Figure 3 Taking the exemplary embodiment shown as an example, the specific implementation process of step S301 to step S302 is as follows:

[0090] First, a first inorganic encapsulation layer 40 is formed on the side of the display function layer 20 and the blocking dam 30 that are away from the base substrate 10; illustratively, a chemical vapor deposition method is used to deposit inorganic materials such as SiO and SiN on the side of the display function layer 20 and the blocking dam 30 that are away from the base substrate 10 to form the first inorganic encapsulation layer 40; then, ion implantation is used to implant inorganic ions such as B, P, N, Si, etc. into the first inorganic encapsulation layer 40 corresponding to the top of the blocking dam 30 to form an inorganic liquid-repellent structure 60, thereby obtaining a first inorganic encapsulation layer 40 having an inorganic liquid-repellent structure 60 covering the top of the blocking dam 30 on its surface.

[0091] The embodiment of the present invention provides a display substrate, a preparation method thereof and a display device, wherein the display substrate comprises a base substrate 10, a display function layer 20 located in a display area AA of the base substrate 10, a barrier dam 30 located in a non-display area BB of the base substrate 10, and a first inorganic encapsulation layer 40 and an organic encapsulation layer arranged in sequence on the side of the display function layer 20 away from the base substrate 10; wherein the surface of the first inorganic encapsulation layer 40 has an inorganic lyophobic structure 60 covering the top of the barrier dam 30, the inorganic lyophobic structure 60 has hydrophobicity, and the contact angle of the corresponding material of the organic encapsulation layer 50 on the inorganic lyophobic structure 60 is greater than or equal to 90°. In this way, the inorganic lyophobic structure 60 can at least change the film layer interface properties on the surface of the first inorganic encapsulation layer 40 in the top area of ​​the barrier dam 30, so as to achieve a repelling effect on the IJP solution corresponding to the preparation of the organic encapsulation layer 50, thereby avoiding the problem of the IJP solution overflowing outside the barrier dam 30, and improving the yield of the display substrate.

[0092] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0093] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A display substrate, characterized in that: include: A base substrate, a display function layer located in a display area of ​​the base substrate, a barrier dam located in a non-display area of ​​the base substrate, and a first inorganic encapsulation layer and an organic encapsulation layer sequentially arranged on a side of the display function layer away from the base substrate; The surface of the first inorganic encapsulation layer has an inorganic lyophobic structure covering the top of the blocking dam; the inorganic lyophobic structure is hydrophobic, and the contact angle of the corresponding material of the organic encapsulation layer on the inorganic lyophobic structure is greater than or equal to 90°.

2. The display substrate according to claim 1, wherein: The inorganic lyophobic structure is independently disposed on top of the first inorganic encapsulation layer.

3. The display substrate according to claim 2, wherein: The material of the inorganic liquid-repellent structure is a carbon nanotube film or a graphene film.

4. The display substrate according to claim 3, wherein: The thickness of the inorganic lyophobic structure is in the range of 1 nm to 10 nm.

5. The display substrate according to claim 1, wherein: A portion of the first inorganic encapsulation layer covering the top of the barrier dam is doped with predetermined inorganic ions and serves as the inorganic lyophobic structure.

6. The display substrate according to any one of claims 1 to 5, characterized in that: The inorganic liquid-repellent structure extends from the top of the blocking dam to the side wall of the blocking dam close to the display area.

7. The display substrate according to any one of claims 1 to 5, characterized in that: At least one groove structure is formed on a side of the blocking dam facing away from the base substrate, and the inorganic liquid-repellent structure at least covers the top of the blocking dam except for the groove structures.

8. The display substrate according to any one of claims 1 to 5, characterized in that: The display substrate has a plurality of barrier dams, and the inorganic liquid-repellent structure covers the plurality of barrier dams and the area between two adjacent barrier dams.

9. A display device, characterized in that: include: A display substrate as claimed in any one of claims 1 to 8.

10. A method for preparing a display substrate, characterized in that: include: forming a display function layer in a display area of ​​a base substrate, and forming a blocking dam in a non-display area of ​​the base substrate; On the side of the display function layer and the barrier dam facing away from the base substrate, a first inorganic encapsulation layer having an inorganic liquid-repellent structure covering the top of the barrier dam is formed; An organic encapsulation layer is formed on a side of the first inorganic encapsulation layer away from the base substrate; wherein the inorganic lyophobic structure is hydrophobic, and a contact angle of a corresponding material of the organic encapsulation layer on the inorganic lyophobic structure is greater than or equal to 90°.

11. The method according to claim 10, characterized in that The first inorganic encapsulation layer having an inorganic liquid-repellent structure covering the top of the blocking dam is formed on the side of the display function layer and the blocking dam away from the base substrate, comprising: forming the first inorganic encapsulation layer on a side of the display function layer and the blocking dam away from the base substrate; doping an inorganic thin film material with an organic material used to modify the inorganic thin film material by a chemical doping method to obtain a doped material; The doped material is deposited on the surface of the first inorganic encapsulation layer corresponding to the blocking dam by a solution method to form an inorganic liquid-repellent structure, thereby obtaining the first inorganic encapsulation layer having a surface with the inorganic liquid-repellent structure covering the top of the blocking dam.

12. The method according to claim 10, characterized in that The first inorganic encapsulation layer having an inorganic liquid-repellent structure covering the top of the blocking dam is formed on the side of the display function layer and the blocking dam away from the base substrate, comprising: forming the first inorganic encapsulation layer on a side of the display function layer and the blocking dam facing away from the base substrate; By ion implantation, preset inorganic ions are implanted into the portion of the first inorganic encapsulation layer corresponding to the top of the blocking dam to form an inorganic liquid-repellent structure, thereby obtaining the first inorganic encapsulation layer having the inorganic liquid-repellent structure covering the top of the blocking dam.

Images