Display panel, preparation method thereof and display device

Abstract

The invention relates to a display panel, a preparation method thereof and a display device, and relates to the technical field of display. The display panel comprises a display area, a first non-display area and a second non-display area, the first non-display area surrounds the display area and is located between the display area and the second non-display area, the display panel further comprises a substrate, a first groove and a second groove are formed in one side of the substrate in a spaced mode, the first groove is located in the first non-display area, and the second groove is located in the second non-display area. The second groove is located in the second non-display area; the dam layer, the first groove and the second groove are located on the same side of the base plate, and the dam layer is located between the first groove and the second groove; and the packaging layer at least fills the first groove and the second groove and covers part of the side wall, close to the first groove, of the dam layer. The grooves are formed in the two sides of the ultrahigh dam correspondingly, organic materials can be prevented from overflowing, water and oxygen can be blocked, a double-dam structure does not need to be arranged, and a narrow frame can be achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] With the advancement of technology and the evolution of lifestyle, display panels have become an indispensable part of daily life. However, in existing display panels, the borders are large and the ideal narrow border effect cannot be achieved. Summary of the invention

[0003] The present application provides a display panel and a method for manufacturing the same, and a display device, aiming to achieve a narrow frame.

[0004] In a first aspect, an embodiment of the present application provides a display panel, the display panel comprising a display area, a first non-display area, and a second non-display area, the first non-display area surrounds the display area, the first non-display area is located between the display area and the second non-display area, and the display panel further comprises:

[0005] A substrate, wherein a first groove and a second groove are provided at intervals on one side of the substrate, the first groove is located in the first non-display area, and the second groove is located in the second non-display area;

[0006] a dam layer, located on the same side of the substrate as the first groove and the second groove, and the dam layer is located between the first groove and the second groove;

[0007] The encapsulation layer fills at least the first groove and the second groove, and covers a portion of the sidewall of the dam layer close to the first groove.

[0008] In one embodiment, the encapsulation layer includes: a first organic water-isolating layer filling the first groove and covering a portion of the sidewall of the dam layer close to the first groove; a second organic water-isolating layer filling the second groove;

[0009] In one embodiment, the first organic water-isolating layer is formed by inkjet printing technology;

[0010] In one embodiment, the second organic water-isolating layer is formed by inkjet printing technology;

[0011] In one embodiment, the thickness of the first organic water-isolating layer is greater than the depth of the first groove;

[0012] In one embodiment, the thickness of the second organic waterproof layer is greater than or equal to the depth of the second groove.

[0013] In one embodiment, the material of the first organic water-blocking layer includes at least one of fluorine-containing polymer, silicone resin, polycarbonate, acrylic polymer, polyurethane, polysiloxane, and polyimide;

[0014] In one embodiment, the material of the second organic water-isolating layer includes at least one of fluorine-containing polymers, silicone resins, polycarbonates, acrylic polymers, polyurethanes, polysiloxanes, and polyimides.

[0015] In one embodiment, the encapsulation layer comprises:

[0016] A first inorganic layer is located on a portion of the substrate in the first non-display area close to the first groove, in the first groove, on a surface and sidewall of the dam layer away from the substrate, and in the second groove;

[0017] A first organic layer is located in a target area on a side of the first inorganic layer away from the substrate, wherein the target area includes an area of ​​the first non-display area close to the first groove and an area where the first groove is located;

[0018] The second inorganic layer is located on a side of the first inorganic layer away from the substrate and on a side of the first organic layer away from the first inorganic layer.

[0019] In one embodiment, the width of the first groove ranges from 5 micrometers to 20 micrometers, and the width direction is the direction from the first groove to the second groove;

[0020] In one embodiment, the width of the second groove ranges from 5 microns to 20 microns;

[0021] In one embodiment, the depth of the first groove ranges from 5 microns to 10 microns;

[0022] In one embodiment, the depth of the second groove ranges from 5 microns to 10 microns;

[0023] In one of the embodiments, the substrate includes a first flexible substrate, a buffer layer, and a second flexible substrate stacked in sequence, the first groove and the second groove are respectively located on the second flexible substrate, the dam layer is located on a side of the second flexible substrate away from the buffer layer, and the dam layer is adjacent to the first groove and the second groove, respectively.

[0024] In one embodiment, the dam layer comprises at least:

[0025] a first conductive layer, located on the substrate between the first groove and the second groove;

[0026] A first flat layer, located on a side of the first conductive layer away from the substrate;

[0027] a second conductive layer, located on a side of the first flat layer away from the first conductive layer;

[0028] a pixel definition layer, located on a side of the second conductive layer away from the first planar layer;

[0029] A supporting layer, located on a side of the pixel definition layer away from the second conductive layer;

[0030] In one of the embodiments, the display panel further includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, the first conductive layer is any one of the first metal layer, the second metal layer, the third metal layer and the fourth metal layer, the second conductive layer is any one of the first metal layer, the second metal layer, the third metal layer and the fourth metal layer, and the first conductive layer and the second conductive layer are different metal layers;

[0031] In one embodiment, the display panel further includes a second flat layer and a third conductive layer, wherein the second flat layer is located on a side of the second conductive layer away from the first flat layer, and the third conductive layer is located on a side of the second flat layer away from the second conductive layer;

[0032] In one embodiment, the third conductive layer is any one of the first metal layer, the second metal layer, the third metal layer and the fourth metal layer, and the first conductive layer, the second conductive layer and the third conductive layer are different metal layers.

[0033] In one of the embodiments, at least one of the first conductive layer and the second conductive layer is connected to a resistor pin of an anti-crack detection circuit of the display panel.

[0034] In one embodiment, the thickness of the dam layer ranges from 7 microns to 12 microns;

[0035] In one embodiment, the thickness of the first conductive layer ranges from 3000 angstroms to 8000 angstroms;

[0036] In one embodiment, the thickness of the second conductive layer ranges from 3000 angstroms to 8000 angstroms;

[0037] In one embodiment, the thickness of the first planar layer ranges from 2 μm to 2 μm;

[0038] In one embodiment, the thickness of the pixel definition layer ranges from 3 microns to 4 microns;

[0039] In one embodiment, the thickness of the support layer ranges from 3 microns to 4 microns;

[0040] In one embodiment, the width of the dam layer ranges from 5 microns to 10 microns;

[0041] In one embodiment, the width of the first conductive layer is greater than or equal to the width of the first planar layer, the width of the first planar layer is greater than or equal to the width of the second conductive layer, the width of the second conductive layer is greater than or equal to the width of the pixel definition layer, and the width of the pixel definition layer is greater than or equal to the width of the support layer.

[0042] The above-mentioned display panel has a first groove on the side of the dam layer close to the display area, which can effectively prevent the overflow of organic materials, and a second groove on the side of the dam layer away from the display area, which can prevent cutting cracks. The encapsulation layer forms a first water-oxygen barrier structure between the first groove and the substrate, and forms a second water-oxygen barrier structure between the second groove and the substrate, which can effectively block water and oxygen. Only one dam structure is required, and there is no need to set a double dam structure, which helps to reduce the border of the display panel and improve the reliability of the display panel.

[0043] In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel, wherein the display panel includes a display area, a first non-display area, and a second non-display area, wherein the first non-display area surrounds the display area, and the first non-display area is located between the display area and the second non-display area, and the method includes:

[0044] providing a substrate;

[0045] forming a barrier layer on the substrate;

[0046] Patterning the barrier layer;

[0047] Etching the substrate according to the patterned barrier layer to form a first groove and a second groove spaced apart on the substrate; wherein the first groove is located in the first non-display area, and the second groove is located in the second non-display area;

[0048] removing the barrier layer and forming a dam layer on the substrate between the first groove and the second groove;

[0049] A packaging layer is filled at least in the first groove and the second groove respectively, and the packaging layer covers a portion of the side wall of the dam layer close to the first groove.

[0050] The preparation method of the above-mentioned display panel provides a substrate, forms a barrier layer on the substrate, patterns the barrier layer, etches the substrate according to the patterned barrier layer to form a first groove and a second groove spaced apart on the substrate, removes the barrier layer and forms a dam layer on the substrate between the first groove and the second groove, fills at least the first groove and the second groove in an encapsulation layer, respectively, and covers a portion of the side wall of the dam layer close to the first groove, wherein the first groove on the side of the dam layer close to the display area can effectively prevent the overflow of organic materials, and the second groove on the side of the dam layer away from the display area can prevent cutting cracks, and the encapsulation layer forms a first water-oxygen barrier structure between the first groove and the substrate, and forms a second water-oxygen barrier structure between the second groove and the substrate, which can effectively block water and oxygen without setting a double dam structure, which helps to reduce the frame of the display panel and improve the reliability of the display panel.

[0051] In a third aspect, an embodiment of the present application provides a display device, including a display panel as described above, which can achieve a narrow frame and improve the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0053] Figure 1 is a schematic diagram of a top view structure of a display panel;

[0054] Figure 2 for Figure 1 A schematic diagram of a cross-sectional structure of a display panel shown;

[0055] Figure 3 A schematic diagram of a top view structure of a display panel provided in an embodiment of the present application;

[0056] Figure 4 A schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present application;

[0057] Figure 5 A schematic diagram of a cross-sectional structure of another display panel provided in an embodiment of the present application;

[0058] Figure 6 A schematic diagram of a process for preparing a display panel provided in an embodiment of the present application;

[0059] Figure 7A schematic diagram of a cross-sectional structure obtained in step S601 of a method for manufacturing a display panel provided in an embodiment of the present application;

[0060] Figure 8 A schematic diagram of a cross-sectional structure obtained from step S601 to step S603 of a method for manufacturing a display panel provided in an embodiment of the present application;

[0061] Fig. 9 A schematic diagram of a cross-sectional structure obtained from step S601 to step S603 of another method for manufacturing a display panel provided in an embodiment of the present application;

[0062] Fig.10 A schematic diagram of a cross-sectional structure obtained from step S601 to step S604 of a method for manufacturing a display panel provided in an embodiment of the present application;

[0063] Fig.11 A schematic diagram of a cross-sectional structure obtained from step S601 to step S605 of a method for manufacturing a display panel provided in an embodiment of the present application;

[0064] Fig.12 A schematic diagram of a top view of a display device provided in an embodiment of the present application.

[0065] Description of reference numerals:

[0066] 1-display panel, 10-substrate, 101-first flexible substrate, 102-buffer layer, 103-second flexible substrate, 110-first groove, 120-second groove, 20-dam layer, 201-first conductive layer, 202-first flat layer, 203-second conductive layer, 204-pixel definition layer, 205-support layer, 30-encapsulation layer, 301-first organic waterproof layer, 302-second organic waterproof layer, 311-first inorganic layer, 312-first organic layer, 313-second inorganic layer, 40-barrier layer, 50-photoresist layer, 1000-substrate, 1001-first dam, 1002-second dam, 10000-display device. DETAILED DESCRIPTION

[0067] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0069] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0070] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be intervening layers. In addition, it is also understood that when a layer is referred to as being "between" two layers, the layer may be the only layer between the two layers, or there may be one or more intervening layers. In addition, the same reference numerals always represent the same elements.

[0071] In the following embodiments, when a layer, region, or element is "connected", it can be interpreted that the layer, region, or element is not only directly connected but also connected through other constituent elements placed therebetween. For example, when a layer, region, element, etc. is described as being connected or electrically connected, the layer, region, element, etc. can be connected or electrically connected not only directly or directly, but also through another layer, region, element, etc. placed therebetween.

[0072] Hereinafter, although terms such as "first", "second", etc. may be used to describe various components, these components are not necessarily limited to the above terms. The above terms are only used to distinguish one component from another. It will also be understood that expressions used in the singular include plural expressions unless the expression in the singular has an obviously different meaning in the context.

[0073] When a statement such as "at least one (of)..." is located after a list of elements, it modifies the entire list of elements rather than the individual elements in the list. The term "and / or" as used herein includes any and all combinations of one or more related listed items. As used in the application documents, the term "and / or" includes any and all combinations of one or more related listed items. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0074] Electronic or electrical devices and / or any other related devices or components according to the embodiments of the concepts of the present application described herein (for example, a display device including a display panel and a display panel driver, wherein the display panel driver also includes a drive controller, a gate driver, a gamma reference voltage generator, a data driver, and an emission driver) can be implemented using any appropriate hardware, firmware (such as a dedicated integrated circuit), software, or a combination of software, firmware, and hardware. For example, the various components of these devices may be formed on an integrated circuit (IC) chip or on separate IC chips. In addition, the various components of these devices may be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on a substrate. In addition, the various components of these devices may be processes or threads that run on one or more processors in one or more computing devices to execute computer program instructions and interact with other system components to perform the various functions described herein. The computer program instructions are stored in a memory that can be implemented in a computing device using standard storage devices (e.g., such as random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media (e.g., such as CD-ROMs, flash drives, etc.). Moreover, those skilled in the art should recognize that the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed on one or more other computing devices without departing from the spirit and scope of the exemplary embodiments of the concepts of the present application.

[0075] Although exemplary embodiments of display modules and display devices including display modules have been specifically described herein, many modifications and variations will be apparent to those skilled in the art. Therefore, it will be understood that display modules and display devices including display modules constructed according to the principles of the present application may be implemented in addition to those specifically described herein. The present application is also defined in the claims and their equivalents.

[0076] Figure 1is a schematic diagram of a top view structure of a display panel, Figure 2 for Figure 1 The cross-sectional structure diagram of the display panel shown in FIG. Figure 1 and Figure 2 Display panels in the prior art, such as organic light-emitting diode (OLED) display panels, need to be packaged with a packaging structure to prevent water and oxygen from invading and corroding the display panel. Generally, a thin film packaging structure is used. The thin film packaging structure is formed by stacking an organic packaging layer and an inorganic layer. The inorganic layer has a good function of blocking water and oxygen intrusion. The organic packaging layer is arranged between the inorganic layers. On the one hand, it can block water and oxygen, and on the other hand, it can provide a stress buffering effect. However, the material made of the organic packaging layer has fluidity, and two dams are usually arranged. Generally, in the non-display area DA' of the substrate 1000, the first dam 1001 close to the display area AA' is used to define the boundary surface of the organic packaging layer. If overflow occurs in the organic packaging layer, the second dam 1002 away from the display area AA' is used to limit the flow. However, the setting of the double dams will cause the frame of the display panel to be wider, so that the existing display panel cannot achieve narrow frame display.

[0077] To solve the above problems, the present application provides a display panel and a preparation method thereof, and a display device. By setting a first groove on the side of the dam layer close to the display area, the organic material can be effectively prevented from overflowing, and a second groove is set on the side of the dam layer away from the display area to prevent cracks from occurring. The encapsulation layer forms a first water-oxygen barrier structure between the first groove and the substrate, and forms a second water-oxygen barrier structure between the second groove and the substrate, which can effectively block water and oxygen. There is no need to set a double dam, which helps to reduce the border of the display panel.

[0078] Figure 3 A schematic diagram of a top view of a display panel provided in an embodiment of the present application is shown in FIG. Figure 4 A schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present application. Figure 3 and Figure 4 The present application provides a display panel 1, comprising a display area, a first non-display area and a second non-display area. The first non-display area surrounds the display area. The first non-display area is located between the display area and the second non-display area.

[0079] The display area refers to the area used to display images. The display area usually includes multiple gate signal lines and data signal lines that intersect each other. The gate signal lines and data signal lines intersect to define sub-pixel units. The non-display area refers to the area that cannot display images. It is usually used to set up driving circuits and wiring.

[0080] The display panel 1 further includes a substrate 10, a dam layer 20 and an encapsulation layer 30. The substrate 10 may be a flexible substrate 10, and the material of the substrate 10 may be metal foil, polymer plastic such as polyimide (PI), and other flexible materials known to those skilled in the art, which are not limited here.

[0081] A first groove 110 and a second groove 120 are provided at one side of the substrate 10. The first groove 110 is located in the first non-display area. The depth of the first groove 110 is less than or equal to the thickness of the substrate 10. The first groove 110 is used to prevent the organic material from overflowing.

[0082] The second groove 120 is located in the second non-display area. The depth of the second groove 120 is less than or equal to the thickness of the substrate 10. The second groove 120 is used to release stress on the display panel 1, such as when the edge of the display panel 1 is bent or the display panel 1 is cut, etc., which can reduce the probability of cracks on the display panel and improve the reliability of the display panel 1.

[0083] The dam layer 20, the first groove 110 and the second groove 120 are located on the same side of the substrate 10, and the dam layer 20 is located between the first groove 110 and the second groove 120. The dam layer 20 is used to prevent the encapsulation material from diffusing in the non-display area (such as the driving circuit part) of the display panel 1, ensuring that the components in the non-display area are fully protected and preventing the circuits in the non-display area from being affected by the encapsulation material. In application, the thickness of the dam layer 20 can be increased to enhance the performance of the dam layer 20 in preventing the overflow of organic materials.

[0084] The encapsulation layer 30 at least fills the first groove 110 and the second groove 120, and covers a portion of the sidewall of the dam layer 20 near the first groove 110. The encapsulation layer 30 near the display area can form a first water-oxygen barrier structure with the substrate 10, and the encapsulation layer 30 far from the display area can form a second water-oxygen barrier structure with the substrate 10, which can isolate sensitive materials (such as organic light-emitting materials) inside the display panel 1 from the external environment and prevent the penetration of water vapor and oxygen.

[0085] The display panel 1 provided in the above embodiment has a first groove 110 arranged on the side of the dam layer 20 close to the display area, which can effectively prevent the overflow of the organic material, and has a second groove 120 arranged on the side of the dam layer 20 away from the display area, which can prevent cutting cracks, and the encapsulation layer 30 forms a first water-oxygen barrier structure between the first groove 110 and the substrate 10, and forms a second water-oxygen barrier structure between the second groove 120 and the substrate 10, which can effectively block water and oxygen. Only one dam structure needs to be arranged, and there is no need to arrange a double dam structure, which helps to reduce the frame of the display panel 1 and improve the reliability of the display panel 1.

[0086] Please continue reading Figure 4 In some embodiments, the substrate 10 includes a first flexible substrate 101, a buffer layer 102, and a second flexible substrate 103 stacked in sequence. The first groove 110 and the second groove 120 are respectively located in the second flexible substrate 103. The dam layer 20 is located on the side of the second flexible substrate 103 away from the buffer layer 102, and the dam layer 20 is adjacent to the first groove 110 and the second groove 120 respectively. The encapsulation layer 30 on the side close to the display area can form a first water and oxygen barrier structure with the buffer layer 102, and the encapsulation layer 30 on the side away from the display area can form a second water and oxygen barrier structure with the buffer layer 102, which can effectively block moisture and oxygen and ensure the display performance of the display panel 1.

[0087] Exemplarily, the material of the first flexible substrate 101 may include a flexible material, for example, the material of the first flexible substrate 101 includes stainless steel (SUS), polyimide (PI), glass, polycarbonate, etc., but is not limited thereto. The first flexible substrate 101, as the base support layer 205 of the entire display panel 1, can provide a certain degree of mechanical protection and reduce the impact of external forces on the internal structure.

[0088] Exemplarily, the material of the buffer layer 102 may include a flexible material, for example, the material of the first flexible substrate 101 includes at least one of silicon oxide, silicon nitride, titanium oxide, zirconium oxide, polyimide, and epoxy resin, but is not limited thereto. The buffer layer 102 can compensate for the difference in thermal expansion coefficients between different materials, protect electronic components from mechanical stress, and provide a flat surface for subsequent deposition of thin film transistors (TFTs), organic light emitting diodes (OLEDs), and other layers.

[0089] Exemplarily, the material of the second flexible substrate 103 may include a flexible material, for example, the material of the first flexible substrate 101 includes stainless steel, polyimide, glass, polycarbonate, etc., but is not limited thereto. The second flexible substrate 103 can prevent environmental factors such as water vapor and oxygen from corroding the organic layer, enhance the mechanical strength of the panel, and reduce the risk of scratches and breakage.

[0090] Please continue reading Figure 3 In some embodiments, the shape of the substrate 10 in a top view may be approximately rectangular, but the shape of the substrate 10 is not limited thereto. The substrate 10 may have a variety of shapes. For example, the substrate 10 may be a polygon having a closed shape including straight sides, a circle or an ellipse including curved sides, or a semicircle or semiellipse including one side formed by a straight line and the other side formed by a curve.

[0091] Please continue reading Figure 4In some embodiments, the encapsulation layer 30 includes a first organic water-isolating layer 301 and a second organic water-isolating layer 302 .

[0092] The first organic water-isolating layer 301 fills the first groove 110, and the first organic water-isolating layer 301 covers a portion of the sidewall of the dam layer 20 near the first groove 110. The first organic water-isolating layer 301 has water-isolating properties and can block water and oxygen. The first organic water-isolating layer 301 can replace the three-layer composite structure in the related Thin Film Encapsulation (TFE) technology, that is, two inorganic layers and an organic layer in the middle, and has simple preparation, higher preparation efficiency, and low cost. The first organic water-isolating layer 301 can be connected to the buffer layer 102 in the substrate 10 to form a first water-oxygen barrier structure, which can effectively block water and oxygen.

[0093] The second organic water-proof layer 302 fills the second groove 120. The second organic water-proof layer 302 has water-proof properties and can block water and oxygen. The second organic water-proof layer 302 can replace the three-layer composite structure in the related Thin Film Encapsulation (TFE) technology, that is, two inorganic layers and an organic layer in the middle, and has simple preparation, higher preparation efficiency, and low cost. The second organic water-proof layer 302 can be connected to the buffer layer 102 in the substrate 10 to form a second water-oxygen barrier structure, which can effectively block water and oxygen.

[0094] The material of the first organic water-proof layer 301 can be an organic material with water-proof properties. Exemplarily, the material of the first organic water-proof layer 301 includes at least one of fluorine-containing polymers, silicone resins, polycarbonates, acrylic polymers, polyurethanes, polysiloxanes, and polyimides. For example, the material of the first organic water-proof layer 301 is perfluoropolyether (CYTOP), which has high transparency, good hydrophobic and oleophobic properties, chemical corrosion resistance, and moisture resistance.

[0095] The material of the second organic water-proof layer 302 can be an organic material with water-proof properties. Exemplarily, the material of the second organic water-proof layer 302 includes at least one of fluorine-containing polymers, silicone resins, polycarbonates, acrylic polymers, polyurethanes, polysiloxanes, and polyimides. For example, the material of the second organic water-proof layer 302 is perfluoropolyether (CYTOP), which has high transparency, good hydrophobic and oleophobic properties, chemical corrosion resistance, and moisture resistance.

[0096] It should be noted that the materials of the first organic water-isolating layer 301 and the second organic water-isolating layer 302 can be the same or different. For example, the first organic water-isolating layer 301 and the second organic water-isolating layer 302 each include a CYTOP material.

[0097] Exemplarily, the first organic water-blocking layer 301 can be formed by inkjet printing (IJP) technology, which does not require film deposition-related processes such as chemical vapor deposition (CVD) processes, nor does it require film deposition-related materials, thereby saving processes and materials, improving the manufacturing efficiency of the display panel 1, and reducing the manufacturing cost of the display panel 1.

[0098] Exemplarily, the second organic water-blocking layer 302 can be formed by inkjet printing (IJP) technology, which does not require film deposition-related processes such as CVD, and does not require film deposition-related materials, thereby saving processes and materials, improving the manufacturing efficiency of the display panel 1, and reducing the manufacturing cost of the display panel 1.

[0099] Exemplarily, the thickness of the first organic waterproof layer 301 is greater than the depth of the first groove 110. Since the first organic waterproof layer 301 is close to the display area, the thickness of the first organic waterproof layer 301 is higher than the thickness of the second organic waterproof layer 302, and can effectively block moisture and oxygen to protect the display area of ​​the display panel 1 from being corroded by moisture and oxygen, thereby ensuring the display performance of the display panel 1.

[0100] Exemplarily, the thickness of the second organic waterproof layer 302 is greater than or equal to the depth of the second groove 120. The second organic waterproof layer 302 can fill the second groove 120, and cooperate with the second groove 120 to relieve the stress of the display panel 1, for example, reduce the stress caused by temperature change, the bending stress of the display panel 1, the cutting stress of the display panel 1, etc., and prevent the panel from cracking or deformation.

[0101] For example, the thickness of the second organic waterproof layer 302 is equal to the depth of the second groove 120. Since the first organic waterproof layer 301 is far away from the display area, the first organic waterproof layer 301 and the dam layer 20 have the function of blocking water and oxygen, so there is no need to set a thicker second organic waterproof layer 302, which helps to reduce costs.

[0102] Figure 5 A schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present application. Figure 5 As shown, in some embodiments, the encapsulation layer 30 includes a first inorganic layer 311 , a first organic layer 312 , and a second inorganic layer 313 .

[0103] The first inorganic layer 311 is located on a portion of the substrate 10 near the first groove 110 in the first non-display area, in the first groove 110, on the surface and sidewall of the dam layer 20 away from the substrate 10, and in the second groove 120. The first organic layer 312 is located on a side of the first inorganic layer 311 away from the substrate 10 in the target area, and the target area includes the area of ​​the first non-display area near the first groove 110 and the area where the first groove 110 is located. The second inorganic layer 313 is located on a side of the first inorganic layer 311 away from the substrate 10, and on a side of the first organic layer 312 away from the first inorganic layer 311.

[0104] The first inorganic layer 311 can be connected to the buffer layer 102 in the substrate 10 to form a first water and oxygen barrier structure, and the second inorganic layer 313 can be connected to the buffer layer 102 in the substrate 10 to form a second water and oxygen barrier structure, which can effectively block the penetration of water and oxygen and ensure the display performance of the display panel.

[0105] In application, the display panel 1 may be subjected to thin film encapsulation (TFE) to form an encapsulation layer 30. The first inorganic layer 311, the first organic layer 312, and the second inorganic layer 313 may be conventional TFE encapsulation film layers in the art. The first inorganic layer 311 and the second inorganic layer 313 may be formed by a CVD process. The first organic layer 312 may be formed by an IJP process.

[0106] Exemplarily, the first inorganic layer 311 may include one or more of nitride, oxide, oxynitride, nitrate, carbide, for example, silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon nitrate, silicon oxynitride. Exemplarily, the first organic layer 312 may include one or more of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, polystyrene, etc. Exemplarily, the first inorganic layer 311 may include one or more of nitride, oxide, oxynitride, nitrate, carbide, for example, silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon nitrate, silicon oxynitride.

[0107] It should be noted that the first inorganic layer 311 and the second inorganic layer 313 may be the same or different. For example, the first inorganic layer 311 is silicon oxynitride, and the second inorganic layer 313 is silicon nitride.

[0108] Please continue reading Figure 4 and Figure 5In some embodiments, the width of the first groove 110 ranges from 5 micrometers (μm) to 20 micrometers. In the present application, the width direction is the direction from the first groove 110 to the second groove 120. For example, the width of the first groove 110 can be 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, and the width of the first groove 110 can also be any other value between 5μm and 20μm, which is not limited too much here. In the application, the width of the first groove 110 can be reasonably set according to the needs to prevent the overflow of the organic material through the first groove 110, so as to achieve a narrow frame and improve the display effect of the display panel 1.

[0109] Please continue reading Figure 4 and Figure 5 In some embodiments, the depth of the first groove 110 ranges from 5 microns to 10 microns. In the present application, the depth direction is the direction from the substrate 10 to the dam layer 20. For example, the depth of the first groove 110 can be 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, and the depth of the first groove 110 can also be any other value between 5μm and 10μm, which is not limited too much here. In the application, the depth of the first groove 110 can be reasonably set according to the needs to prevent the overflow of the organic material through the first groove 110, so as to achieve a narrow frame and improve the display effect of the display panel 1.

[0110] Please continue reading Figure 4 and Figure 5 In some embodiments, the width of the second groove 120 ranges from 5 micrometers (μm) to 20 micrometers. For example, the width of the second groove 120 can be 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, and the width of the second groove 120 can also be any other value between 5μm and 20μm, which is not limited too much here. In the application, the width of the second groove 120 can be reasonably set according to the needs to prevent the overflow of the organic material through the first groove 110, so as to achieve a narrow frame and improve the display effect of the display panel 1.

[0111] Please continue reading Figure 4 and Figure 5In some embodiments, the depth of the second groove 120 ranges from 5 microns to 10 microns. For example, the depth of the second groove 120 can be 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, and the depth of the second groove 120 can also be any other value between 5μm and 10μm, which is not limited too much here. In the application, the depth of the second groove 120 can be reasonably set according to the needs to prevent the overflow of the organic material through the first groove 110, so as to achieve a narrow frame and improve the display effect of the display panel 1.

[0112] It should be noted that the widths of the first groove 110 and the second groove 120 may be the same or different. The depths of the first groove 110 and the second groove 120 may be the same or different. The specific configuration may be made according to the actual application scenario and is not limited here.

[0113] Please continue reading Figure 4 and Figure 5 In some embodiments, the dam layer 20 includes at least a first conductive layer 201 , a first planar layer 202 , a second conductive layer 203 , a pixel definition layer 204 and a support layer 205 .

[0114] The first conductive layer 201 is located on the substrate 10 between the first groove 110 and the second groove 120. For example, when the substrate 10 includes the first flexible substrate 101, the buffer layer 102 and the second flexible substrate 103, the first conductive layer 201 is located on the side of the second flexible substrate 103 away from the buffer layer 102, and is located between the first groove 110 and the second groove 120. The first planarization layer 202 (Planarization Layer, PLN) is located on the side of the first conductive layer 201 away from the substrate 10. The second conductive layer 203 is located on the side of the first planarization layer 202 away from the first conductive layer 201. The pixel defining layer 204 (Pixel Defining Layer, PDL) is located on the side of the second conductive layer 203 away from the first planarization layer 202. The support layer 205 (Spacer, SPC) is located on the side of the pixel defining layer 204 away from the second conductive layer 203. The dam layer 20 has a double conductive layer structure of a first conductive layer 201 and a second conductive layer 203. Combined with the first flat layer 202, the pixel definition layer 204 and the support layer 205, the thickness of the dam layer 20 can be increased to form an ultra-high dam layer 20, which can further improve the ability of the dam layer 20 to block the overflow of organic materials and block water and oxygen, and help to achieve a narrow frame.

[0115] Exemplarily, the material of the first conductive layer 201 may include a metal conductive material, for example, at least one of copper, silver, and aluminum, but not limited thereto. Exemplarily, the material of the first planar layer 202 may include at least one of silicon oxide, silicon nitride, titanium oxide, zirconium oxide, polyimide, benzocyclobutene, and acrylate, but not limited thereto. Exemplarily, the material of the second conductive layer 203 may include a metal conductive material, for example, at least one of copper, silver, and aluminum, but not limited thereto. Among them, the materials of the second conductive layer 203 and the first conductive layer 201 may be the same or different. For example, the materials of the first conductive layer 201 and the second conductive layer 203 include copper. Exemplarily, the material of the pixel definition layer 204 may include a photoresist material, polysiloxane, etc., but not limited thereto. Exemplarily, the material of the support layer 205 may include polyimide, polyethylene naphthalate, polyethylene terephthalate, etc., but not limited thereto.

[0116] In some embodiments, the display panel 1 further includes a first metal layer M1, a second metal layer M2, a third metal layer M3 and a fourth metal layer M4. The first conductive layer 201 is any one of the first metal layer M1, the second metal layer M2, the third metal layer M3 and the fourth metal layer M4, the second conductive layer 203 is any one of the first metal layer M1, the second metal layer M2, the third metal layer M3 and the fourth metal layer M4, and the first conductive layer 201 and the second conductive layer 203 are different metal layers. For example, the first conductive layer 201 is the third metal layer M3, and the second conductive layer 203 is the fourth metal layer M4. By reusing two different metal layers in the display panel 1 as two conductive layers of the dam layer 20, the cost and the difficulty of preparation can be reduced. The two metal layers as conductive layers can increase the thickness of the dam layer 20, improve the ability of the dam layer 20 to prevent the overflow of organic materials and block the penetration of water and oxygen, help to achieve a narrow frame, and improve the display effect of the display panel 1.

[0117] In some embodiments, the display panel 1 further includes a second flat layer and a third conductive layer, the second flat layer is located on a side of the second conductive layer 203 away from the first flat layer 202, and the third conductive layer is located on a side of the second flat layer away from the second conductive layer 203. The second flat layer and the third conductive layer can further increase the thickness of the dam layer 20, further improve the ability of the dam layer 20 to prevent the overflow of organic materials and block the penetration of water and oxygen, thereby improving the display performance of the display panel 1 and helping to achieve a narrow frame.

[0118] It should be noted that the dam layer 20 of the display panel 1 may include at least two conductive layers and at least one planar layer. The specific structure of the dam layer 20 may be set according to requirements and is not specifically limited here.

[0119] In some embodiments, the third conductive layer is any one of the first metal layer, the second metal layer, the third metal layer and the fourth metal layer, and the first conductive layer 201, the second conductive layer 203 and the third conductive layer are different metal layers. For example, the first conductive layer 201 is the first metal layer M1, the second conductive layer 203 is the second metal layer M2, and the third conductive layer is the third metal layer M3. By reusing three different metal layers in the display panel 1 as the three conductive layers of the dam layer 20, while increasing the height of the dam layer 20, the cost and difficulty of preparation can be reduced, and the preparation efficiency of the display panel 1 can be improved.

[0120] In some embodiments, at least one of the first conductive layer 201 and the second conductive layer 203 is connected to the resistor pin of the anti-crack detection circuit of the display panel 1. Exemplarily, the first conductive layer 201 is connected to the resistor pin of the anti-crack detection circuit of the display panel 1; or, the second conductive layer 203 is connected to the resistor pin of the anti-crack detection circuit of the display panel 1; or, the first conductive layer 201 and the second conductive layer 203 are respectively connected to the resistor pin of the anti-crack detection circuit of the display panel 1. That is, the first conductive layer 201 and the second conductive layer 203 can be used as the anti-crack detection signal line in the display panel 1, respectively, without the need to set up an additional anti-crack detection signal line, so that the first conductive layer 201 and the second conductive layer 203 are reused, which helps to further achieve a narrow frame and reduce costs. For example, the first conductive layer 201 is the third metal layer M3, and the second conductive layer 203 is the fourth metal layer M4, then the third metal layer M3 and the fourth metal layer M4 in the dam layer 20 can be used as the anti-crack detection signal line, respectively.

[0121] Exemplarily, the anti-crack detection circuit can be an anti-crack detection circuit based on COF (Chip On Film) technology or an anti-crack detection circuit based on FPC (Flexible Printed Circuit). Among them, COF is a technology for directly mounting integrated circuits on a flexible film. Generally, there is no need to provide a screen signal to the first conductive layer 201 and / or the second conductive layer 203. During the detection process, the first conductive layer 201 and / or the second conductive layer 203 cooperates with the resistance detection pin (PIN) on the COF or FPC anti-crack detection circuit, and anti-crack detection can be achieved according to the impedance change.

[0122] In some embodiments, the thickness of the dam layer 20 ranges from 7 microns to 12 microns. In the present application, the thickness direction is the direction from the substrate 10 to the dam layer 20. For example, the thickness of the dam layer 20 can be 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, and the thickness of the dam layer 20 can also be any other value between 7μm and 12μm, which is not limited too much here. The thickness of the dam layer 20 is relatively large, and it can have a good ability to prevent the overflow of organic materials and block the penetration of water and oxygen, which helps to achieve a narrow frame and improve the display effect of the display panel 1.

[0123] In some embodiments, the thickness of the first conductive layer 201 ranges from 3000 angstroms (Å) to 8000 Å. For example, the thickness of the first conductive layer 201 may be 3000Å, 3500Å, 4000Å, 4500Å, 5000Å, 5500Å, 6000Å, 6500Å, 7000Å, 7500Å, 8000Å, and the thickness of the first conductive layer 201 may also be any other value between 3000Å ​​and 8000Å, which is not limited here. The thickness of the first conductive layer 201 is relatively large, which helps to form an ultra-high dam layer 20, so that the dam layer 20 can have a good ability to prevent the overflow of organic materials and block the penetration of water and oxygen, which helps to achieve a narrow frame and improve the display effect of the display panel 1.

[0124] In some embodiments, the thickness of the second conductive layer 203 ranges from 3000 angstroms (Å) to 8000 Å. For example, the thickness of the second conductive layer 203 can be 3000Å, 3500Å, 4000Å, 4500Å, 5000Å, 5500Å, 6000Å, 6500Å, 7000Å, 7500Å, 8000Å, and the thickness of the second conductive layer 203 can also be any other value between 3000Å ​​and 8000Å, which is not limited too much here. The second conductive layer 203 has a large thickness, which helps to form an ultra-high dam layer 20, so that the dam layer 20 can have a good ability to prevent the overflow of organic materials and block the penetration of water and oxygen, which helps to achieve a narrow frame and improve the display effect of the display panel 1.

[0125] In some embodiments, the thickness of the first flat layer 202 ranges from 1.2 μm to 2 μm. For example, the thickness of the first flat layer 202 may be 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, or 2 μm. The thickness of the first flat layer 202 may also be any other value between 1.2 μm and 2 μm, which is not limited here. The first flat layer 202 has a relatively large thickness, which helps to form an ultra-high dam layer 20, so that the dam layer 20 can have a good ability to prevent the overflow of organic materials and block the penetration of water and oxygen, which helps to achieve a narrow frame and improve the display effect of the display panel 1.

[0126] In some embodiments, the thickness of the pixel definition layer 204 ranges from 3 microns to 4 microns. For example, the thickness of the pixel definition layer 204 can be 3μm, 3.1μm, 3.2μm, 3.3μm, 3.4μm, 3.5μm, 3.6μm, 3.7μm, 3.8μm, 3.9μm, 4μm, and the thickness of the pixel definition layer 204 can also be any other value between 1.2μm and 2μm, which is not limited too much here. The thickness of the pixel definition layer 204 is relatively large, which helps to form an ultra-high dam layer 20, so that the dam layer 20 can have a good ability to prevent the overflow of organic materials and block the penetration of water and oxygen, which helps to achieve a narrow frame and improve the display effect of the display panel 1.

[0127] In some embodiments, the thickness of the support layer 205 ranges from 3 microns to 4 microns. For example, the thickness of the support layer 205 can be 3 μm, 3.1 μm, 3.2 μm, 3.3 μm, 3.4 μm, 3.5 μm, 3.6 μm, 3.7 μm, 3.8 μm, 3.9 μm, 4 μm, and the thickness of the support layer 205 can also be any other value between 1.2 μm and 2 μm, which is not limited too much here. The thickness of the support layer 205 is relatively large, which helps to form an ultra-high dam layer 20, so that the dam layer 20 can have a good ability to prevent the overflow of organic materials and block the penetration of water and oxygen, which helps to achieve a narrow frame and improve the display effect of the display panel 1.

[0128] In some embodiments, the width of the dam layer 20 ranges from 5 μm to 10 μm. For example, the width of the dam layer 20 may be 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm, or 10 μm. The width of the dam layer 20 may also be any other value between 5 μm and 10 μm, which is not limited here. In applications, the width of the dam layer 20 may be designed according to actual needs to achieve a narrow frame.

[0129] In some embodiments, the width of the first conductive layer 201 is greater than or equal to the width of the first planar layer 202, the width of the first planar layer 202 is greater than or equal to the width of the second conductive layer 203, the width of the second conductive layer 203 is greater than or equal to the width of the pixel definition layer 204, and the width of the pixel definition layer 204 is greater than or equal to the width of the support layer 205. That is, the widths of the first conductive layer 201, the first planar layer 202, the second conductive layer 203, the pixel definition layer 204, and the support layer 205 may decrease in sequence to form a ladder-shaped dam structure, which helps to block the overflow of organic materials and prevent water and oxygen penetration, so as to achieve a narrow frame and improve the display effect of the display panel 1.

[0130] Based on the same inventive concept, the present application also provides a method for preparing a display panel 1. The implementation solution provided by the method for solving the problem is similar to the implementation solution described in the above display panel 1, so the specific limitations of one or more embodiments of the method for preparing the display panel 1 provided below can refer to the above limitations on the display panel 1, and will not be repeated here.

[0131] Figure 6 A schematic diagram of a method for preparing a display panel provided in an embodiment of the present application. Figure 1 , wherein the display panel 1 includes a display area, a first non-display area, and a second non-display area, the first non-display area surrounds the display area, and the first non-display area is located between the display area and the second non-display area. Figure 1 and Figure 6 The method for preparing the display panel 1 provided in the embodiment of the present application may include the following steps S601 to S606.

[0132] S601: Provide a substrate.

[0133] like Figure 7 As shown, a first flexible substrate 101 may be provided, and then a buffer layer 102 may be formed on the first flexible substrate 101, and then a second flexible substrate 103 may be formed on a side of the buffer layer 102 away from the first flexible substrate 101. For the introduction of the first flexible substrate 101, the buffer layer 102 and the second flexible substrate 103, please refer to the above-mentioned related contents, which will not be repeated here.

[0134] S602: forming a barrier layer on the substrate.

[0135] Please continue reading Figure 7 When the substrate 10 includes a first flexible substrate 101, a buffer layer 102, and a second flexible substrate 103, a barrier layer 40 is formed on a side of the second flexible substrate 103 away from the buffer layer 102. The barrier layer 40 is used to prevent the etchant from corroding the substrate 10 during the etching process, thereby protecting the substrate 10 from damage. Exemplarily, the material of the barrier layer 40 includes indium zinc oxide (IZO), and may also be other suitable materials, but is not limited thereto.

[0136] S603: Patterning the barrier layer.

[0137] Please continue reading Figure 7 A photoresist (PR) layer may be formed on the side of the barrier layer 40 away from the second flexible substrate 103. Then, as Figure 8 As shown, a first pattern and a second pattern spaced apart are formed on the photoresist layer 50 by exposure and development. Fig. 9As shown, the barrier layer 40 can be etched according to the first pattern and the second pattern to form a first through hole and a second through hole spaced apart on the barrier layer 40. The first through hole is located in the first non-display area, and the second through hole is located in the second non-display area.

[0138] S604: etching the substrate according to the patterned barrier layer to form a first groove 110 and a second groove 120 spaced apart on the substrate.

[0139] like Fig.10 As shown, the first groove 110 is located in the first non-display area, and the second groove 120 is located in the second non-display area. When the substrate 10 includes the first flexible substrate 101, the buffer layer 102 and the second flexible substrate 103, the substrate 10 can be etched according to the patterned barrier layer 40 to form the first groove 110 and the second groove 120 that are connected in the second flexible substrate 103. The first groove 110 and the second groove 120 are spaced apart from each other.

[0140] Exemplarily, etching the substrate 10 may include dry etching or laser etching. For example, dry etching may use carbon tetrafluoride (CF4) and chlorine (CL2). Specifically, according to the patterned barrier layer 40, the substrate 10 is etched using CF4 and CL2 to form a first groove 110 that is connected to the first through hole and a second groove 120 that is connected to the second through hole on the second flexible substrate 103. For another example, according to the patterned barrier layer 40, the substrate 10 is etched using a laser to form a first groove 110 that is connected to the first through hole and a second groove 120 that is connected to the second through hole on the second flexible substrate 103.

[0141] S605 : removing the barrier layer and forming a dam layer on the substrate between the first groove 110 and the second groove 120 .

[0142] For example, Fig.11 As shown, the photoresist layer 50 and the barrier layer 40 are removed. Then, as shown in Figure 4 or Figure 5 As shown, a first conductive layer 201 is formed on the substrate 10 between the first groove 110 and the second groove 120, and then a first flat layer 202 is formed on a side of the first conductive layer 201 away from the second flexible substrate 103, and a second conductive layer 203 is formed on a side of the first flat layer 202 away from the first conductive layer 201, and a pixel definition layer 204 is formed on a side of the second conductive layer 203 away from the first flat layer 202, and a support layer 205 is formed on a side of the pixel definition layer 204 away from the second conductive layer 203. The relevant introductions of the first conductive layer 201, the first flat layer 202, the second conductive layer 203, the pixel definition layer 204 and the support layer 205 can be found in the above-mentioned relevant contents, which will not be repeated here.

[0143] S606 : Filling the first groove 110 and the second groove 120 with a packaging layer respectively, wherein the packaging layer covers a portion of the sidewall of the dam layer close to the first groove 110 .

[0144] For example, Figure 4 As shown, the first groove 110 is filled and the sidewall of the dam layer 20 close to the first groove 110 is covered to form a first organic waterproof layer 301, and the second groove 120 is filled to form a second organic waterproof layer 302, thereby forming a display panel 1 with an ultra-high dam layer 20 and grooves on both sides.

[0145] For example, Figure 5 As shown, a first inorganic layer 311 is formed on a portion of the substrate 10 near the first groove 110 in the first non-display area, in the first groove 110, on the surface and sidewall of the dam layer 20 away from the substrate 10, and in the second groove 120, and a first organic layer 312 is formed on a side of the first inorganic layer 311 away from the substrate 10 in the target area, wherein the target area includes an area of ​​the first non-display area near the first groove 110 and an area where the first groove 110 is located. Then, a second inorganic layer 313 is formed on a side of the first inorganic layer 311 away from the substrate 10 and on a side of the first organic layer 312 away from the first inorganic layer 311, thereby forming a display panel 1 having an ultra-high dam layer 20 and grooves on both sides.

[0146] The method for preparing the display panel 1 provided in the above embodiment includes providing a substrate 10, forming a barrier layer 40 on the substrate 10, patterning the barrier layer 40, etching the substrate 10 according to the patterned barrier layer 40 to form a first groove 110 and a second groove 120 spaced apart on the substrate 10, removing the barrier layer 40 and forming a dam layer 20 on the substrate 10 between the first groove 110 and the second groove 120, and filling the encapsulation layer 30 in at least the first groove 110 and the second groove 120, respectively, and the encapsulation layer 30 covers the dam layer 20. Part of the side wall close to the first groove 110, wherein the first groove 110 on the side of the dam layer 20 close to the display area can effectively prevent the overflow of the organic material, and the second groove 120 on the side of the dam layer 20 away from the display area can prevent cutting cracks, and the encapsulation layer 30 forms a first water-oxygen barrier structure between the first groove 110 and the substrate 10, and forms a second water-oxygen barrier structure between the second groove 120 and the substrate 10, which can effectively block water and oxygen without setting a double dam structure, which helps to reduce the frame of the display panel 1 and improve the reliability of the display panel 1.

[0147] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the accompanying drawings may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the steps or stages in other steps.

[0148] Based on the same inventive concept, Fig.12 As shown, an embodiment of the present application further provides a display device 10000 , which includes the display panel 11 in the above embodiment.

[0149] It can be understood that the display device 10000 in the embodiment of the present application can be an OLED display device, a QLED display device, electronic paper, a mobile phone, a foldable mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a wearable device, an Internet of Things device, or any other product or component with a display function, and the embodiments disclosed in the present application are not limited to this.

[0150] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0151] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0152] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel includes a display area, a first non-display area, and a second non-display area, wherein the first non-display area surrounds the display area and is located between the display area and the second non-display area, and the display panel further includes: A substrate, wherein a first groove and a second groove are provided at intervals on one side of the substrate, the first groove is located in the first non-display area, and the second groove is located in the second non-display area; a dam layer, located on the same side of the substrate as the first groove and the second groove, and the dam layer is located between the first groove and the second groove; The encapsulation layer fills at least the first groove and the second groove, and covers a portion of the sidewall of the dam layer close to the first groove.

2. The display panel according to claim 1, characterized in that: The encapsulation layer comprises: a first organic water-isolating layer filling the first groove and covering a portion of a side wall of the dam layer close to the first groove; A second organic water-isolating layer filling the second groove; Optionally, the first organic water-isolating layer is formed by inkjet printing technology; Optionally, the second organic water-isolating layer is formed by inkjet printing technology; Optionally, the thickness of the first organic water-isolating layer is greater than the depth of the first groove; Optionally, the thickness of the second organic waterproof layer is greater than or equal to the depth of the second groove.

3. The display panel according to claim 2, characterized in that: The material of the first organic water-blocking layer includes at least one of fluorine-containing polymer, silicone resin, polycarbonate, acrylic polymer, polyurethane, polysiloxane, and polyimide; Optionally, the material of the second organic water-isolating layer includes at least one of fluorine-containing polymers, silicone resins, polycarbonates, acrylic polymers, polyurethanes, polysiloxanes, and polyimides.

4. The display panel according to claim 1, characterized in that: The encapsulation layer comprises: A first inorganic layer is located on a portion of the substrate in the first non-display area close to the first groove, in the first groove, on a surface and sidewall of the dam layer away from the substrate, and in the second groove; A first organic layer is located in a target area on a side of the first inorganic layer away from the substrate, wherein the target area includes an area of ​​the first non-display area close to the first groove and an area where the first groove is located; The second inorganic layer is located on a side of the first inorganic layer away from the substrate and on a side of the first organic layer away from the first inorganic layer.

5. The display panel according to claim 1, characterized in that: The width of the first groove ranges from 5 micrometers to 20 micrometers, and the width direction is the direction from the first groove to the second groove; Optionally, the width of the second groove ranges from 5 microns to 20 microns; Optionally, the depth of the first groove ranges from 5 microns to 10 microns; Optionally, the depth of the second groove ranges from 5 microns to 10 microns; Optionally, the substrate includes a first flexible substrate, a buffer layer and a second flexible substrate stacked in sequence, the first groove and the second groove are respectively located on the second flexible substrate, the dam layer is located on a side of the second flexible substrate away from the buffer layer, and the dam layer is adjacent to the first groove and the second groove respectively.

6. The display panel according to claim 1, characterized in that: The dam layer at least comprises: a first conductive layer, located on the substrate between the first groove and the second groove; A first flat layer, located on a side of the first conductive layer away from the substrate; a second conductive layer, located on a side of the first flat layer away from the first conductive layer; a pixel definition layer, located on a side of the second conductive layer away from the first planar layer; A supporting layer, located on a side of the pixel definition layer away from the second conductive layer; Optionally, the display panel further includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, the first conductive layer is any one of the first metal layer, the second metal layer, the third metal layer and the fourth metal layer, the second conductive layer is any one of the first metal layer, the second metal layer, the third metal layer and the fourth metal layer, and the first conductive layer and the second conductive layer are different metal layers; Optionally, the display panel further includes a second flat layer and a third conductive layer, wherein the second flat layer is located on a side of the second conductive layer away from the first flat layer, and the third conductive layer is located on a side of the second flat layer away from the second conductive layer; Optionally, the third conductive layer is any one of the first metal layer, the second metal layer, the third metal layer and the fourth metal layer, and the first conductive layer, the second conductive layer and the third conductive layer are different metal layers.

7. The display panel according to claim 6, characterized in that: At least one of the first conductive layer and the second conductive layer is connected to a resistor pin of a crack prevention detection circuit of the display panel.

8. The display panel according to claim 6, characterized in that: The thickness of the dam layer ranges from 7 microns to 12 microns; Optionally, the thickness of the first conductive layer ranges from 3000 angstroms to 8000 angstroms; Optionally, the thickness of the second conductive layer ranges from 3000 angstroms to 8000 angstroms; Optionally, the thickness of the first planar layer ranges from 1.2 microns to 2 microns; Optionally, the pixel definition layer has a thickness ranging from 3 microns to 4 microns; Optionally, the support layer has a thickness ranging from 3 microns to 4 microns; Optionally, the width of the dam layer ranges from 5 microns to 10 microns; Optionally, the width of the first conductive layer is greater than or equal to the width of the first planar layer, the width of the first planar layer is greater than or equal to the width of the second conductive layer, the width of the second conductive layer is greater than or equal to the width of the pixel definition layer, and the width of the pixel definition layer is greater than or equal to the width of the support layer.

9. A method for preparing a display panel, characterized in that: The display panel includes a display area, a first non-display area, and a second non-display area, wherein the first non-display area surrounds the display area and is located between the display area and the second non-display area, and the method includes: providing a substrate; forming a barrier layer on the substrate; Patterning the barrier layer; Etching the substrate according to the patterned barrier layer to form a first groove and a second groove spaced apart on the substrate; wherein the first groove is located in the first non-display area, and the second groove is located in the second non-display area; removing the barrier layer and forming a dam layer on the substrate between the first groove and the second groove; A packaging layer is filled at least in the first groove and the second groove respectively, and the packaging layer covers a portion of the side wall of the dam layer close to the first groove.

10. A display device, characterized in that: Comprising the display panel as described in any one of claims 1-8.

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