Display panel and display device

Abstract

This application relates to a display panel and a display device. The display panel includes: a substrate; a first conductive layer disposed on one side of the substrate, the first conductive layer including a plurality of first conductive portions; a first insulating layer disposed on the side of the first conductive layer away from the substrate, the first insulating layer including a plurality of vias; an isolation structure disposed on the side of the first insulating layer away from the substrate, the isolation structure enclosing a plurality of isolation openings and grooves; a plurality of light-emitting devices disposed on the side of the first insulating layer away from the substrate, the light-emitting devices being at least partially located within corresponding isolation openings, the light-emitting devices being connected to corresponding first conductive portions through vias; and a protective portion disposed on the side of the isolation structure away from the substrate, the orthographic projection of the protective portion on the substrate covering the orthographic projection of the corresponding vias on the substrate. This application can improve the problem of poor display.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] OLED (Organic Light Emitting Diode) display panels are one of the hottest topics in the field of display panel research today. OLED display panels have advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle and fast response speed.

[0003] However, OLED display panels in related technologies suffer from display defects. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel and display device to address the problem of poor display performance in OLED display panels.

[0005] According to a first aspect of this application, a display panel is provided, comprising:

[0006] Base;

[0007] A first conductive layer is disposed on one side of the substrate, and the first conductive layer includes a plurality of first conductive portions;

[0008] A first insulating layer is disposed on the side of the first conductive layer away from the substrate, and the first insulating layer includes a plurality of vias;

[0009] An isolation structure is disposed on the side of the first insulating layer away from the substrate, and the isolation structure encloses a plurality of isolation openings and grooves;

[0010] Multiple light-emitting devices are disposed on the side of the first insulating layer away from the substrate. The light-emitting devices are at least partially located within the corresponding isolation openings, and the light-emitting devices are connected to the corresponding first conductive parts through the vias.

[0011] A protective part is disposed on the side of the isolation structure away from the substrate, and the orthographic projection of the protective part on the substrate covers the orthographic projection of the corresponding via on the substrate;

[0012] At least a portion of the protective portion is disposed within the groove.

[0013] In some implementations, it also includes:

[0014] An encapsulation layer is disposed on the side of the light-emitting device away from the substrate;

[0015] The protective portion includes a first sub-layer, which is made of the same material as at least a portion of the encapsulation layer, and the first sub-layer is in direct contact with at least a portion of the sidewall of the groove.

[0016] In some embodiments, the isolation structure includes a support portion and a crown portion stacked sequentially on one side of the base;

[0017] Optionally, the groove includes a first sub-opening and a second sub-opening that communicate with each other, the support portion surrounds the first sub-opening, the crown portion surrounds the second sub-opening, and the orthographic projection of the second sub-opening on the base is located within the orthographic projection range of the first sub-opening on the base;

[0018] On a plane parallel to the base, the area of ​​the first sub-opening is greater than the area of ​​the second sub-opening;

[0019] Optionally, the first sub-opening penetrates the support portion in a plane perpendicular to the base.

[0020] Optionally, the first sub-opening extends through a portion of the support portion in a plane perpendicular to the base.

[0021] In some embodiments, the groove extends through the crown and at least a portion of the support portion in a direction perpendicular to the plane of the base;

[0022] Optionally, the groove extends through the support portion in a direction perpendicular to the plane of the base;

[0023] Optionally, the isolation structure further includes a pad portion, wherein the pad portion, the support portion, and the crown portion are sequentially stacked on one side of the base;

[0024] Optionally, in a direction perpendicular to the plane of the base, the groove extends through the crown, the support, and the pad.

[0025] Optionally, in a direction perpendicular to the plane of the substrate, the depth of the groove is less than the thickness of the isolation structure.

[0026] In some embodiments, the plurality of light-emitting devices include a first light-emitting device and a second light-emitting device disposed adjacent to each other, and the via corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device;

[0027] The groove is disposed between the vias that are correspondingly connected to the first light-emitting device and the second light-emitting device.

[0028] In some embodiments, the plurality of light-emitting devices include a first light-emitting device and a second light-emitting device, the vias include a first device via and a second device via, the plurality of first conductive portions include a first device conductive portion and a second device conductive portion, the first light-emitting device is connected to the first device conductive portion through the first device via, the second light-emitting device is connected to the second device conductive portion through the second device via, and the second device via corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device;

[0029] Optionally, the groove includes a first groove disposed on the side of the second device via near the first light-emitting device;

[0030] Optionally, the plurality of light-emitting devices further include a third light-emitting device, the via further includes a third device via, the first conductive part further includes a third device conductive part, the third light-emitting device is connected to the third device conductive part through the third device via, and the groove includes a second groove disposed on the side of the third device via near the first light-emitting device.

[0031] In some embodiments, the orthographic projection of the groove on the substrate surrounds the orthographic projection of the via corresponding to the light-emitting device on the substrate, and the groove is arranged in a ring shape.

[0032] In some embodiments, the light-emitting device includes a first electrode, which is connected to a corresponding first conductive portion through the via.

[0033] The orthographic projection of the groove on the substrate and the orthographic projection of the corresponding via on the substrate are both located within the orthographic projection range of the first electrode of the corresponding light-emitting device on the substrate.

[0034] In some embodiments, on a plane parallel to the substrate, the groove includes a plurality of spaced groove segments arranged in an arc shape and disposed on at least one side of the through hole;

[0035] Optionally, the groove is provided around the through hole.

[0036] In some embodiments, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode. The first electrode, the light-emitting functional layer, and the second electrode are stacked sequentially on the side of the first insulating layer away from the substrate. The first electrode is connected to the corresponding first conductive part through the via.

[0037] Optionally, the protective portion includes a first protective sub-portion located within the groove;

[0038] The first protective sub-part further includes a second sub-layer and a third sub-layer located on the side of the first sub-layer close to the substrate. The second sub-layer is disposed in the same layer and with the same material as at least a portion of the second electrode of the light-emitting device, and the third sub-layer is disposed in the same layer and with the same material as at least a portion of the light-emitting functional layer of the light-emitting device.

[0039] The second and third sub-layers are disposed on the bottom wall of the groove near the substrate, and at least part of the first sub-layer covers the sidewall of the groove;

[0040] Optionally, in a direction parallel to the plane of the substrate, the isolation structure includes a first isolation substructure with a first height and a second isolation substructure with a second height, wherein the orthographic projection of the first isolation substructure on the substrate overlaps with the orthographic projection of the via on the substrate, the second isolation substructure is located between the via and the groove, and the second height is greater than the first height;

[0041] Optionally, the protective portion includes a second protective sub-part located on the side of the second isolation sub-structure opposite to the substrate, and a first gap exists between the first sub-layer of the second protective sub-part and the surface of the second isolation sub-structure opposite to the substrate;

[0042] Optionally, the second protective sub-part further includes a second sub-layer and a third sub-layer, with a portion of the second sub-layer and the third sub-layer filling the first gap;

[0043] Optionally, the second sub-layer includes a first sub-part and a second sub-part spaced apart, the first sub-part being located on the side of the isolation structure opposite to the substrate, and the second sub-part being located within the groove;

[0044] The third sub-layer includes a third sub-part and a fourth sub-part spaced apart. The third sub-part is located on the side of the isolation structure opposite to the substrate, and the fourth sub-part is located within the groove.

[0045] The first sub-layer covers the second sub-section and also covers the sidewalls of the groove;

[0046] Optionally, the protective portion includes a third protective portion located on the side of the first isolation substructure away from the substrate, and the third protective portion has a first gap with the surface of the first isolation substructure facing away from the substrate.

[0047] In some embodiments, the display panel further includes a pixel definition layer disposed on the side of the first insulating layer away from the substrate. The pixel definition layer includes a pixel definition structure and a plurality of pixel openings surrounded by the pixel definition structure. The light-emitting device includes a first electrode, which is connected to a corresponding first conductive portion through the via. The pixel openings are disposed corresponding to the first electrode.

[0048] In a direction perpendicular to the plane of the substrate, a portion of the pixel definition structure is disposed between the protective portion and the first electrode, and the orthogonal projection of the pixel definition structure on the substrate covers the orthogonal projection of the via on the substrate.

[0049] In some embodiments, the plurality of light-emitting devices include a plurality of first-color light-emitting devices and a plurality of second-color light-emitting devices, wherein the first-color light-emitting devices and the second-color light-emitting devices emit light of different colors;

[0050] The plurality of vias includes a plurality of first vias and a plurality of second vias. The first color light-emitting device is connected to the corresponding first conductive part through the corresponding first via, and the second color light-emitting device is connected to the corresponding first conductive part through the corresponding second via.

[0051] The display panel further includes an encapsulation layer, which is disposed on the side of the corresponding light-emitting device away from the substrate. The encapsulation layer includes a plurality of first encapsulation layers and a plurality of second encapsulation layers. The first encapsulation layer is disposed on the side of the corresponding first color light-emitting device away from the substrate, and the second encapsulation layer is disposed on the side of the corresponding second color light-emitting device away from the substrate.

[0052] The plurality of protection portions include a plurality of first protection portions and a plurality of second protection portions, wherein the orthographic projection of the first protection portion on the substrate covers the orthographic projection of the corresponding first via on the substrate, and the orthographic projection of the second protection portion on the substrate covers the orthographic projection of the corresponding second via on the substrate; optionally, the first protection portion includes a first sub-layer, wherein the first sub-layer and the first encapsulation layer are disposed of in the same layer and the same material;

[0053] Optionally, the second protective layer includes the first sublayer;

[0054] Optionally, the thickness of the first sub-layer is the same as the thickness of the first encapsulation layer.

[0055] In some embodiments, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode, wherein the first electrode, the light-emitting functional layer, and the second electrode are sequentially stacked on one side of the substrate;

[0056] The first protective part includes a second sub-layer, which is made of the same layer and material as the second electrode of the first color light-emitting device;

[0057] Optionally, the second protective layer includes the second sub-layer;

[0058] Optionally, the thickness of the second sub-layer is the same as the thickness of the second electrode of the first color light-emitting device;

[0059] Optionally, the first protective part includes a third sub-layer, which is made of the same material as the light-emitting functional layer of the first color light-emitting device;

[0060] Optionally, the second protective layer includes the third sub-layer;

[0061] Optionally, the thickness of the third sub-layer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

[0062] In some embodiments, the plurality of light-emitting devices further includes a plurality of third-color light-emitting devices, wherein the first-color light-emitting device, the second-color light-emitting device, and the third-color light-emitting device emit light of different colors respectively;

[0063] The plurality of vias also include a plurality of third vias, wherein the third color light-emitting device is connected to the corresponding first conductive part through the corresponding third via;

[0064] The encapsulation layer further includes a plurality of third encapsulation layers, wherein the third encapsulation layers are disposed on the side of the corresponding third color light-emitting device away from the substrate;

[0065] The plurality of said protective portions include a plurality of third protective portions, wherein the orthographic projection of the third protective portion on the substrate covers the orthographic projection of the corresponding third via on the substrate;

[0066] Optionally, the third protective layer includes the first sublayer.

[0067] In some embodiments, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode, wherein the first electrode, the light-emitting functional layer, and the second electrode are sequentially stacked on one side of the substrate;

[0068] The first protective part further includes a second sub-layer, which is made of the same layer and material as the second electrode of the first color light-emitting device;

[0069] Optionally, the second protection part further includes the second sub-layer;

[0070] Optionally, the third protective layer further includes the second sub-layer;

[0071] Optionally, the thickness of the second sub-layer is the same as the thickness of the second electrode of the first color light-emitting device;

[0072] Optionally, the first protective part further includes a third sub-layer, wherein the third sub-layer and the light-emitting functional layer of the first color light-emitting device are made of the same layer and the same material;

[0073] Optionally, the second protective layer further includes the third sub-layer;

[0074] Optionally, the third protective layer further includes the third sub-layer;

[0075] Optionally, the thickness of the third sub-layer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device;

[0076] Optionally, on the side of the corresponding via away from the substrate, the isolation structure, the third sub-layer, the second sub-layer, and the first sub-layer are sequentially stacked on one side of the substrate.

[0077] In some embodiments, the display panel further includes a pixel definition layer disposed on the side of the first insulating layer away from the substrate. The pixel definition layer includes a pixel definition structure and a plurality of pixel openings surrounding the pixel definition structure, the pixel openings exposing a portion of the first electrode.

[0078] The orthographic projection of the pixel opening onto the substrate is located within the orthographic projection range of the isolation opening onto the substrate;

[0079] The groove exposes a portion of the pixel definition layer.

[0080] According to a second aspect of this application, a display panel is provided, comprising:

[0081] Base;

[0082] A first conductive layer is disposed on one side of the substrate, and the first conductive layer includes a plurality of first conductive portions;

[0083] A first insulating layer is disposed on the side of the first conductive layer away from the substrate, and the first insulating layer includes a plurality of vias;

[0084] An isolation structure is disposed on the side of the first insulating layer away from the substrate, and multiple isolation structures are arranged to form multiple isolation openings and grooves;

[0085] Multiple light-emitting devices are disposed on the side of the first insulating layer away from the substrate. The light-emitting devices are at least partially located within the corresponding isolation openings, and the light-emitting devices are connected to the corresponding first conductive parts through the vias.

[0086] An encapsulation layer is disposed on the side of the light-emitting device away from the substrate. A portion of the encapsulation layer extends to the side of the isolation structure away from the substrate and covers the corresponding groove. The orthographic projection of the via on the substrate is located within the orthographic projection range of the encapsulation layer on the substrate.

[0087] In some implementations, it also includes:

[0088] A protective part is disposed on the side of the isolation structure away from the substrate and is disposed corresponding to a plurality of the vias. The orthographic projection of the protective part on the substrate covers the orthographic projection of the corresponding via on the substrate.

[0089] The protective part includes a first sub-layer, which is made of the same material as at least a portion of the encapsulation layer, and the first sub-layer is in direct contact with at least a portion of the sidewall of the groove.

[0090] In some embodiments, the plurality of light-emitting devices include a first light-emitting device and a second light-emitting device disposed adjacent to each other, and the via corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device;

[0091] Optionally, the groove is disposed between the vias corresponding to the first light-emitting device and the second light-emitting device;

[0092] Optionally, the orthographic projection of the groove on the substrate surrounds the orthographic projection of the corresponding through hole on the substrate, and the groove is arranged in a ring shape.

[0093] According to a third aspect of this application, a display device is provided, comprising the display panel described in any one of the preceding descriptions.

[0094] In this embodiment, in some parts of the display panel, the encapsulation layer covers a large area, making it prone to breakage and other defects. At least a portion of the protective portion is disposed within a groove, specifically a groove on at least one side around at least a portion of the vias. The protective portion can directly contact at least a portion of the sidewall of the groove. Even if the encapsulation layer breaks or suffers other defects on the side of the groove away from the via, the protective portion can still receive support at the groove, allowing it to cover the via and preventing collapse and breakage. Furthermore, the protective portion can prevent etching solution from seeping into the isolation structure between the protective portion and the isolation structure, thus preventing damage to the isolation structure at the via, or from seeping into the isolation structure at the via through the side face of the protective portion. This prevents defects such as voids in the isolation structure at the via, prevents or improves display defects such as dark spots, and enhances the display quality and reliability of the display panel. Attached Figure Description

[0095] To more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of this application, the drawings used in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0096] Figure 1 This is a first partial top view of a display panel provided for some embodiments of this application.

[0097] Figure 2 This is a schematic diagram of a first partial cross-sectional structure of a display panel provided in some embodiments of this application.

[0098] Figure 3 This is yet another schematic diagram of a first partial cross-sectional structure of a display panel provided for some embodiments of this application.

[0099] Figure 4 Another schematic diagram of a first partial cross-sectional structure of a display panel provided for some embodiments of this application.

[0100] Figure 5 This is a schematic diagram of a second partial cross-sectional structure of a display panel provided in some embodiments of this application.

[0101] Figure 6 This is a second partial top view of a display panel provided for some embodiments of this application.

[0102] Figure 7 This is a schematic diagram of a third partial cross-sectional structure of a display panel provided in some embodiments of this application.

[0103] Figure 8 This is a schematic diagram of a fourth partial cross-sectional structure of a display panel provided in some embodiments of this application.

[0104] Figure 9 This is a third partial top view of a display panel provided for some embodiments of this application.

[0105] Figure 10 This is a fourth partial top view of a display panel provided for some embodiments of this application.

[0106] Figure 11 This is a fifth partial top view of a display panel provided for some embodiments of this application.

[0107] Figure 12This is a sixth partial top view of a display panel provided for some embodiments of this application.

[0108] Figure 13 This is a seventh partial top view of a display panel provided for some embodiments of this application.

[0109] Figure 14 This is a schematic diagram of a display device 200 provided for some embodiments of this application.

[0110] Reference numerals: Display panel 100; Display device 200; Substrate 11; First conductive layer 12; First insulating layer 13; First conductive part 121; Sub-pixel 10P; First color sub-pixel 10R; Second color sub-pixel 10G; Third color sub-pixel 10B;

[0111] Protection section 101; First sublayer 111D; Second sublayer 112D; Third sublayer 113D; First protection section 101R; Second protection section 101G; Third protection section 101B; First protection sub-section 101a; Second protection sub-section 101b; Third protection sub-section 101c; First isolation substructure 16a; Second isolation substructure 16b; First gap 30J1; Second gap 30J2; Third gap 30J3; First sub-section 112D1; Second sub-section 112D2; Third sub-section 113D3; Fourth sub-section 113D4;

[0112] Light-emitting device 20; first electrode 14; light-emitting functional layer 21; second electrode 22; first color light-emitting device 20R; second color light-emitting device 20G; third color light-emitting device 20B; first device electrode 14R; first device light-emitting functional layer 21R; fourth device electrode 22R; second device electrode 14G; second device light-emitting functional layer 21G; fifth device electrode 22G; third device electrode 14B; third device light-emitting functional layer 21B; sixth device electrode 22B;

[0113] Encapsulation layer 30; First encapsulation layer 30R; Second encapsulation layer 30G; Third encapsulation layer 30B;

[0114] Via 131; First via 131R; Second via 131G; Third via 131B;

[0115] Isolation structure 16; Isolation opening 16K; Support 1601; Crown 1602; Pad 1600; Pixel definition layer 15; Pixel definition structure 151; Pixel opening 152; First isolation substructure 16a; Second isolation substructure 16b;

[0116] Groove 16C; First groove sidewall 1601a1; Second groove sidewall 1601a2; First sub-opening 16011; Second sub-opening 16021; First groove 16Ca; Second groove 16Cb;

[0117] First light-emitting device 201; second light-emitting device 202; third light-emitting device 203; first device via 1311; second device via 1312; groove segment 16C1; first dashed coil XQ1; second dashed coil XQ2; first dashed frame XQ3; first device conductive part 1211; second device conductive part 1212; third device conductive part 1213. Detailed Implementation

[0118] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0119] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0120] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0121] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0122] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0123] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0124] In related technologies, OLED display panels suffer from display defects.

[0125] In order to address the problem of poor display quality and improve the display quality of the display panel, this application presents a display panel and display device designed to enhance the display quality of the display panel.

[0126] Please see Figures 1 to 4 , Figure 5 , Figure 1 This is a first partial top view of a display panel provided for some embodiments of this application. Figure 2 This is a schematic diagram of a first partial cross-sectional structure of a display panel provided in some embodiments of this application. Figure 3 This is yet another schematic diagram of a first partial cross-sectional structure of a display panel provided for some embodiments of this application. Figure 4Another schematic diagram of a first partial cross-sectional structure of a display panel provided for some embodiments of this application. Figure 5 This is a schematic diagram of a second partial cross-sectional structure of a display panel provided in some embodiments of this application. Figure 2 , Figure 3 and Figure 4 for Figure 1 A schematic diagram of the cross-sectional structure at the dashed line C1-C1. Figure 2 , Figure 3 and Figure 4 The cross-sectional structure at the same location Figure 2 The encapsulation layer 30, the light-emitting functional layer 21, and the second electrode 22 are not shown in the diagram. Figure 4 and Figure 3 The different numbers are indicated in the text, and at the same time, Figure 4 The diagram also illustrates the first sub-part 112D1, the second sub-part 112D2, the third sub-part 113D3, and the fourth sub-part 113D4. Figure 5 for Figure 1 A schematic diagram of the cross-sectional structure at the dashed line C2-C2.

[0127] Please see Figures 6 to 8 , Figure 6 This is a second partial top view of a display panel provided for some embodiments of this application. Figure 7 This is a schematic diagram of a third partial cross-sectional structure of a display panel provided in some embodiments of this application. Figure 8 This is a schematic diagram of a fourth partial cross-sectional structure of a display panel provided in some embodiments of this application. Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure at the dashed line C3-C3. Figure 8 for Figure 6 A schematic diagram of the cross-sectional structure at the dashed line C4-C4.

[0128] Please see Figures 9 to 13 , Figure 9 This is a third partial top view of a display panel provided for some embodiments of this application. Figure 10 This is a fourth partial top view of a display panel provided for some embodiments of this application. Figure 11 This is a fifth partial top view of a display panel provided for some embodiments of this application. Figure 12 This is a sixth partial top view of a display panel provided for some embodiments of this application. Figure 13 This is a seventh partial top view of a display panel provided for some embodiments of this application.

[0129] The composition and preparation of the isolation structure mentioned below are specified in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072. Further descriptions are provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0130] Firstly, please refer to Figures 1 to 11 This application provides a display panel 100, which includes a substrate 11, a first conductive layer 12, a first insulating layer 13, an isolation structure 16, a plurality of light-emitting devices 20, and a protective part 101. A first conductive layer 12 is disposed on one side of a substrate 11, and the first conductive layer 12 includes a plurality of first conductive portions 121; a first insulating layer 13 is disposed on the side of the first conductive layer 12 away from the substrate 11, and the first insulating layer 13 includes a plurality of vias 131; an isolation structure 16 is disposed on the side of the first insulating layer 13 away from the substrate 11, and the isolation structure 16 encloses a plurality of isolation openings 16K and a groove 16C; a plurality of light-emitting devices 20 are disposed on the side of the first insulating layer 13 away from the substrate 11, and at least part of the light-emitting devices 20 are located within the corresponding isolation openings 16K, and the light-emitting devices 20 are connected to the corresponding first conductive portions 121 through the vias 131; a protective portion 101 is disposed on the side of the isolation structure 16 away from the substrate 11, and the orthographic projection of the protective portion 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11; wherein, at least part of the protective portion 101 is disposed within the groove 16C.

[0131] For example, in some embodiments, the display panel 100 includes a substrate 11 and an array composite layer disposed on one side of the substrate 11. The film structure of the array composite layer may include a film layer of multiple transistors and drive lines in multiple driving circuits. In some embodiments, multiple light-emitting devices 20 are disposed on the side of the array composite layer away from the substrate 11.

[0132] It should be noted that, Figure 1 and Figure 6The example illustrates a display panel including multiple sub-pixels 10P, each sub-pixel 10P including a first color sub-pixel 10R, a second color sub-pixel 10G, and a third color sub-pixel 10B. The first color sub-pixel 10R includes a first color light-emitting device 20R, the second color sub-pixel 10G includes a second color light-emitting device 20G, and the third color sub-pixel 10B includes a third color light-emitting device 20B. However, the arrangement of sub-pixels 10P and the arrangement of light-emitting devices 20 within the sub-pixels in the display panel 100 are not limited to... Figure 1 and Figure 6 The example shown.

[0133] For example, in some embodiments, the first electrode 14 is connected to the corresponding first conductive portion 121 through a corresponding via 131, and the first conductive portion 121 exposed by the first electrode 14 through the corresponding via 131 provides an electrical signal. For example, the first conductive portion 121 is the source or drain of a transistor in a driving circuit; for example, the first conductive portion 121 is a connection electrode, and the first conductive portion 121 is connected to the source or drain of a transistor in a driving circuit.

[0134] For example, in some embodiments, the protective part 101 is disposed on the side of the isolation structure 16 away from the substrate 11, and the orthographic projection of the protective part 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11. That is, the orthographic projection of the protective part 101 on the substrate 11 covers the orthographic projection of the sidewall and bottom wall of the corresponding via 131 on the substrate 11, or the orthographic projection of the protective part 101 on the substrate 11 covers the orthographic projection of the area of ​​the corresponding via 131 on the substrate 11.

[0135] For example, the orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11, that is, a portion of the isolation structure 16 is located between the protective portion 101 and the via 131.

[0136] For example, in this embodiment of the application, the protective part 101 includes at least one sublayer of non-metallic material. The orthographic projection of the protective part 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11. During the manufacturing process of the display panel 100, after the protective part 101 is formed, the sublayer of non-metallic material can protect the via 131 and prevent the electrodes or traces at the via 131 from being over-etched by subsequent manufacturing processes. For example, it can prevent over-etching by the etching solution in subsequent manufacturing processes (for example, it can prevent the isolation structure 16 at the via 131 from being over-etched by the etching solution in subsequent manufacturing processes). This avoids defects such as voids in the electrodes or traces at the via 131, prevents or improves display defects such as dark spots, and improves the display quality of the display panel.

[0137] For example, in some embodiments, the light-emitting device 20 includes a first electrode 14, which is connected to a corresponding first conductive portion 121 through a corresponding via 131. The orthographic projection of the groove 16C on the substrate 11 does not overlap with the orthographic projection of the first electrode 14 on the substrate 11. The orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11. The opening of the groove 16C faces the side of the isolation structure 16 away from the substrate 11. On a plane parallel to the substrate 11, the protective portion 101 is at least partially in direct contact with the sidewall of the groove 16C.

[0138] It should be noted that on the plane parallel to the base 11, in Figure 3 and Figure 5 middle, Figure 3 The connection point at the rightmost end of the middle protection section 101 (at the first dotted circle XQ1) Figure 5 The leftmost part of the middle protection section 101 (at the second dotted circle XQ2), i.e. Figure 3 The first protection section 101R extends to Figure 5 The second via 131G is located above the side of the substrate 11 away from the substrate. In some examples, such as... Figure 1 As shown, the first encapsulation layer 30R (first dashed box XQ3) covers the first color light-emitting device 20R, the first via 131R, the groove 16C and the second via 131G on the plane where the substrate 11 is located.

[0139] It should be noted that on the plane parallel to the base 11, in Figure 7 and Figure 8 middle, Figure 7 Connection at the far right end of the middle protection section 101 Figure 8 The leftmost part of the central protection section 101, i.e. Figure 7 The first protection section 101R extends to Figure 8 The second via 131G is located above the side of the substrate 11 away from the substrate. In some examples, such as... Figure 6 As shown, the first encapsulation layer 30R (first dashed box XQ3) covers the first color light-emitting device 20R, the first via 131R, the groove 16C and the third via 131B on the plane where the substrate 11 is located.

[0140] For example, in some embodiments, the encapsulation layer 30 covers a large area in some parts of the display panel 100, making it prone to defects such as cracks. At least a portion of the protective portion 101 is disposed within the groove 16C, that is, a groove 16C is provided on at least one side around at least a portion of the via 131. The protective portion 101 is in direct contact with at least a portion of the sidewall of the groove 16C. Even if defects such as cracks occur in the encapsulation layer 30 on the side of the groove 16C away from the via 131, the protective portion 101 can still be supported at the groove 16C, allowing the protective portion 101 to continue covering the via 131, preventing the protective portion 101 from collapsing and breaking above the via 131. For example... Figure 3 Even if the protective part 101 collapses or breaks on the left side of the groove 16C, it will not affect the shape retention of the protective part 101 in the groove 16C. After being supported in the groove 16C, the protective part 101 continues to extend to the right. Figure 5 Above the side of the second via 131G away from the substrate 11, the protective part 101 can continue to protect the second via 131G.

[0141] For example, in some embodiments, the protective portion 101 can also prevent moisture, oxygen, etc. from entering the via 131. For example, it can prevent moisture and oxygen from entering and oxidizing the isolation structure 16, thereby improving the reliability of the display panel 100. At the same time, during the manufacturing process of the display panel 100, after the protective portion 101 is formed, the protective portion 101 and the groove 16C can protect the via 131. In subsequent manufacturing processes, it can prevent etching solution from seeping in through the part between the protective portion and the isolation structure and damaging the isolation structure 16 at the via 131, or it can prevent etching solution from seeping in through the side end face of the protective portion and damaging the isolation structure 16 at the via 131. This can prevent defects such as voids in the isolation structure 16 at the via 131, prevent or improve display defects such as dark spots, and improve the display quality and reliability of the display panel.

[0142] In this embodiment, in some parts of the display panel 100, the encapsulation layer 30 covers a large area, making the encapsulation layer 30 prone to breakage and other defects. At least a portion of the protective part 101 is disposed in the groove 16C, that is, the groove 16C is disposed on at least one side around at least a portion of the via 131. The protective part 101 can directly contact at least a portion of the sidewall of the groove 16C. Even if the encapsulation layer 30 breaks or suffers other defects on the side of the groove 16C away from the via 131, the protective part 101 can still be supported at the groove 16C, so that the protective part 101 covers the via 131, preventing the protective part 101 from collapsing and breaking above the via 131. Furthermore, the protective part 101 can prevent the etching solution from seeping into the isolation structure 16 at the via 131 through the part between the protective part 101 and the isolation structure 16 and damaging it, or it can prevent the etching solution from seeping into the isolation structure 16 at the via 131 through the part of the side end face of the protective part 101 and damaging it. This can prevent defects such as voids in the isolation structure 16 at the via 131, prevent or improve display defects such as dark spots, and improve the display quality and reliability of the display panel.

[0143] In some embodiments, the display panel 100 further includes an encapsulation layer 30 disposed on the side of the light-emitting device 20 away from the substrate 11; the protective portion 101 includes a first sub-layer 111D, the first sub-layer 111D and at least a portion of the encapsulation layer 30 being disposed in the same layer and of the same material, and the first sub-layer 111D being in direct contact with at least a portion of the sidewall of the groove 16C.

[0144] For example, in some embodiments, the first sublayer 111D and at least a portion of the encapsulation layer 30 are disposed in the same layer and made of the same material. For instance, the first sublayer 111D and at least a portion of the encapsulation layer 30 are manufactured in the same manufacturing process, which can simplify the production process.

[0145] For example, in some embodiments, the first sublayer 111D and at least a portion of the encapsulation layer 30 are disposed on the same layer and made of the same material. The encapsulation layer 30 includes at least one inorganic material film layer, such as a silicon nitride film layer and / or a silicon oxide film layer. The first sublayer 111D can serve to protect the film layer between the via 131 and the first sublayer 111D.

[0146] For example, such as Figure 3 and Figure 4 , Figure 7As shown, in the first aspect, the first sub-layer 111D is at least partially in direct contact with the sidewall of the groove 16C. Even if the encapsulation layer 30 experiences defects such as breakage on the side of the groove 16C away from the via 131, the first sub-layer 111D can still be supported at the groove 16C, allowing the first sub-layer 111D to cover the via 131 and preventing the first sub-layer 111D from collapsing or breaking above the via 131. In the second aspect, the first sub-layer 111D has excellent moisture and oxygen blocking and isolation capabilities. When defects such as breakage occur at the part of the encapsulation layer 30 on the side of the groove 16C away from the via 131, the protection part 101 can also protect the via 131. The protection part 101 blocks the diffusion path of moisture and oxygen at the groove 16C, for example, preventing moisture and oxygen from entering the oxide isolation structure 16, thereby improving the reliability of the display panel 100. Thirdly, the first sublayer 111D has excellent etching solution blocking and isolation capabilities. During the manufacturing process of the display panel 100, after the protective part 101 is formed, the protective part 101 and the groove 16C can protect the via 131. In subsequent manufacturing processes, it can prevent the etching solution from seeping in through the part between the protective part and the isolation structure and damaging the isolation structure 16 at the via 131, or it can prevent the etching solution from seeping in through the side end face of the protective part and damaging the isolation structure 16 at the via 131. This can prevent defects such as voids in the isolation structure 16 at the via 131, prevent or improve display defects such as dark spots, and improve the display quality and reliability of the display panel.

[0147] In some embodiments, the isolation structure 16 includes a support portion 1601 and a crown portion 1602 stacked sequentially on one side of the base 11.

[0148] Alternatively, in some implementations, such as Figure 2 As shown, the groove 16C includes a first sub-opening 16011 and a second sub-opening 16021 that are connected. The support portion 1601 surrounds the first sub-opening 16011, and the crown portion 1602 surrounds the second sub-opening 16021. The orthographic projection of the second sub-opening 16021 on the base 11 is located within the orthographic projection range of the first sub-opening 16011 on the base 11. On a plane parallel to the base 11, the area of ​​the first sub-opening 16011 is larger than the area of ​​the second sub-opening 16021.

[0149] Optionally, in some embodiments, the first sub-opening 16011 penetrates the support portion 1601 in a plane perpendicular to the base 11.

[0150] Optionally, in some embodiments, the first sub-opening 16011 penetrates the partial support 1601 in a plane perpendicular to the base 11.

[0151] For example, in some embodiments, the isolation structure 16 includes a support portion 1601 and a crown portion 1602 sequentially stacked on a substrate 11. Between two adjacent light-emitting devices 20, the orthographic projection of the support portion 1601 on the substrate 11 lies within the orthographic projection of the crown portion 1602 on the substrate 11. Thus, between two adjacent light-emitting devices 20, around the isolation opening 16K, at least the portion of the isolation structure 16 away from the substrate 11 is configured with a shape that is wider at the top and narrower at the bottom. This allows the isolation structure 16 to block other film layers such as the light-emitting layer (EML) or hole transport layer (HTL) of the adjacent light-emitting devices 20, saving the expensive fine metal mask (FMM) and reducing the manufacturing cost of the display panel. At the same time, without the use of the fine metal mask (FMM), the light-emitting area of ​​the sub-pixels is not limited by the opening of the fine metal mask, allowing the light-emitting area of ​​the sub-pixels to be made smaller, and a greater number of sub-pixels can be formed in the display panel, thereby improving the resolution of the display panel.

[0152] For example, in some embodiments, the isolation structure 16 is a conductive structure, the support portion 1601 is a conductive material, and the second electrode 22 can be attached to the side wall of the support portion 1601 facing the corresponding light-emitting device 20. In this case, the isolation structure 16 can provide the second electrode 22 with a corresponding electrical signal. For example, the isolation structure 16 can provide the second electrode 22 with a VSS signal (cathode signal).

[0153] For example, the orthographic projection of the second sub-opening 16021 onto the base 11 is within the orthographic projection range of the first sub-opening 16011 onto the base 11; on the plane parallel to the base 11, the area of ​​the first sub-opening 16011 is larger than the area of ​​the second sub-opening 16021, that is, around the groove 16C, at least the portion of the isolation structure 16 away from the base 11 is set to a shape that is wider at the top and narrower at the bottom (undercut structure).

[0154] For example, in some embodiments, the groove 16C may be formed in the same process step as the isolation opening 16K, such that around the groove 16C, at least the portion of the isolation structure 16 away from the substrate 11 is configured to be wider at the top and narrower at the bottom.

[0155] In some embodiments, the groove 16C extends through the crown 1602 and at least a portion of the support 1601 in a direction perpendicular to the plane of the base 11. For example, the groove 16C extends through the crown 1602 and at least a portion of the support 1601 to facilitate the crown 1602 forming an undercut structure relative to the support 1601.

[0156] Optionally, in some embodiments, the groove 16C penetrates the support portion 1601 in a direction perpendicular to the plane of the base 11.

[0157] Alternatively, in some implementations, such as Figure 2 As shown, the isolation structure 16 also includes a pad 1600, and the pad 1600, the support 1601 and the crown 1602 are stacked sequentially on one side of the base 11.

[0158] For example, Figure 2 The diagram illustrates that the isolation structure 16 includes a pad 1600, a support 1601, and a crown 1602. The pad 1600, support 1601, and crown 1602 can be formed into shapes such as "I" or "T". The material of the pad 1600 includes titanium or molybdenum, but is not limited to these.

[0159] For example, Figure 2 The diagram illustrates that the isolation structure 16 is a stacked structure of a pad 1600, a support 1601, and a crown 1602. For example, the stacked structure of the isolation structure 16 can be titanium / aluminum / titanium or molybdenum / aluminum / molybdenum. The pad 1600 is made of titanium or molybdenum, the support 1601 is made of aluminum, and the crown 1602 is made of titanium or molybdenum. By setting the stacked three metal layers, the resistance of the isolation structure 16 can be reduced, thereby reducing the power consumption of the display panel 100.

[0160] Optionally, in some embodiments, the groove 16C extends through the crown 1602, the support 1601, and the pad 1600 in a direction perpendicular to the plane of the base 11.

[0161] For example, such as Figure 2 As shown, the groove 16C extends through the crown 1602, the support 1601, and the pad 1600. The groove 16C and the isolation opening 16K can be formed in the same process, which simplifies the production process.

[0162] Optionally, in some embodiments, the depth of the groove 16C is less than the thickness of the isolation structure 16 in a direction perpendicular to the plane of the base 11.

[0163] For example, in the direction perpendicular to the plane of the base 11, the depth of the groove 16C is less than the thickness of the isolation structure 16, that is, the groove 16C does not completely penetrate the isolation structure 16. For example, the groove 16C penetrates the crown 1602 and the support 1601, but the groove 16C does not penetrate the pad 1600. This can reduce the depth of the groove 16C and reduce the risk of the first sublayer 111D breaking at the groove 16C.

[0164] Please see Figures 9 to 12 .

[0165] In some implementations, such as Figure 9As shown, the plurality of light-emitting devices 20 include a first light-emitting device 201 and a second light-emitting device 202 arranged adjacent to each other, and a via 131 corresponding to the second light-emitting device 202 is disposed between the first light-emitting device 201 and the second light-emitting device 202; a groove 16C is disposed between the via 131 corresponding to the first light-emitting device 201 and the second light-emitting device 202.

[0166] For example, please combine Figure 3 and Figure 5 , Figure 9 As shown, the protective portion 101 includes a first sub-layer 111D, which is made of the same material as at least a portion of the encapsulation layer 30, i.e., for the via corresponding to the second light-emitting device 202 ( Figure 3 and Figure 5 The second via 131G, or Figure 9 The protective portion 101 covering the via corresponding to the second light-emitting device 202 includes a first sub-layer 111D made of the same layer and material as the encapsulation layer 30 covering the first light-emitting device 201 (in some embodiments, the encapsulation layer 30 covering the first light-emitting device partially extends to cover the via corresponding to the second light-emitting device 202). The first light-emitting device 201 and the second light-emitting device 202 are far apart. The first sub-layer 111D (the encapsulation layer 30 covering the first light-emitting device) is located between the via corresponding to the second light-emitting device 202 and the first light-emitting device 201. Since the first light-emitting device 201 and the second light-emitting device 202 are easily broken, the groove 16C is provided between the corresponding vias. Even if the first sub-layer 111D (the encapsulation layer 30 covering the first light-emitting device) collapses or breaks on the side of the groove 16C away from the corresponding via of the second light-emitting device 202, the protective part 101 can still be supported at the groove 16C, so that the protective part 101 continues to cover the via of the second light-emitting device 202, and avoids the protective part 101 from collapsing or breaking above the via of the second light-emitting device 202.

[0167] In some implementations, such as Figure 9 As shown, the plurality of light-emitting devices 20 include a first light-emitting device 201 and a second light-emitting device 202, the via 131 includes a first device via 1311 and a second device via 1312, and the plurality of first conductive parts 121 include a first device conductive part 1211 and a second device conductive part 1212. The first light-emitting device 201 is connected to the first device conductive part 1211 through the first device via 1311, and the second light-emitting device 202 is connected to the second device conductive part 1212 through the second device via 1312. The second device via 1312 corresponding to the second light-emitting device 202 is disposed between the first light-emitting device 201 and the second light-emitting device 202.

[0168] For example, please combine Figure 3 and Figure 5 , Figure 9 As shown, the protective portion 101 includes a first sub-layer 111D. The first sub-layer 111D and at least a portion of the encapsulation layer 30 are disposed on the same layer and with the same material. That is, for the second device via 1312 corresponding to the second light-emitting device 202, the protective portion 101 covering the second device via 1312 includes a first sub-layer 111D disposed on the same layer and with the same material as the encapsulation layer 30 covering the first light-emitting device 201 (in some embodiments, the encapsulation layer 30 covering the first light-emitting device partially extends to cover the second device via 1312). The first light-emitting device 201 and the second device via 1312 are far apart. The first sub-layer 111D (covering the first...) The encapsulation layer 30 of the light-emitting device is prone to breakage between the second device via 1312 and the first light-emitting device 201. Therefore, the groove 16C is disposed between the first light-emitting device 201 and the second device via 1312. Even if the first sub-layer 111D (encapsulation layer 30 covering the first light-emitting device) collapses or breaks on the side of the groove 16C away from the second device via 1312, the protective part 101 can still be supported at the groove 16C, so that the protective part 101 continues to cover the second device via 1312, and avoids the protective part 101 from collapsing or breaking above the second device via 1312.

[0169] Alternatively, in some implementations, such as Figure 9 As shown, the groove 16C includes a first groove 16Ca disposed on the side of the second device via 1312 near the first light-emitting device 201.

[0170] Alternatively, in some implementations, such as Figure 10 As shown, the plurality of light-emitting devices 20 also include a third light-emitting device 203, the via 131 also includes a third device via 1313, the first conductive part 121 also includes a third device conductive part 1213, the third light-emitting device 203 is connected to the third device conductive part 1213 through the third device via 1313, and the groove 16C includes a second groove 16Cb disposed on the side of the third device via 1313 near the first light-emitting device 20.

[0171] For example, please combine Figure 7 and Figure 8 , Figure 10As shown, the distance between the first light-emitting device 201 and the third device via 1313 is relatively far. The first sub-layer 111D (the encapsulation layer 30 covering the first light-emitting device) is prone to breakage between the third device via 1313 and the first light-emitting device 201. Therefore, the groove 16C is provided between the first light-emitting device 201 and the third device via 1313. Even if the first sub-layer 111D (the encapsulation layer 30 covering the first light-emitting device) collapses or breaks on the side of the groove 16C away from the third device via 1313, the protective part 101 can still be supported at the groove 16C, so that the protective part 101 continues to cover the third device via 1313, avoiding the collapse and breakage of the protective part 101 above the third device via 1313.

[0172] In some implementations, such as Figure 11 As shown, the orthographic projection of the groove 16C on the substrate 11 surrounds the orthographic projection of the via 131 connected to the light-emitting device 20 on the substrate 11, and the groove 16C is arranged in a ring shape.

[0173] For example, such as Figure 11 As shown, in some embodiments, the orthographic projection of the groove 16C on the substrate 11 surrounds the orthographic projection of the via 131 corresponding to the light-emitting device 20 on the substrate 11, for example... Figure 11 The first groove 16Ca is arranged around the second device via 1312, and the groove 16C is arranged in a ring shape. The groove 16C can provide support for the protective part 101 from all directions.

[0174] In some implementations, such as Figure 2 As shown, the light-emitting device 20 includes a first electrode 14, which is connected to a corresponding first conductive part 121 through a corresponding via 131. The orthographic projection of the groove 16C on the substrate 11 and the orthographic projection of the corresponding via 131 on the substrate 11 are both located within the orthographic projection range of the first electrode 14 of the same light-emitting device 20 on the substrate 11.

[0175] For example, the closer the groove 16C is to the corresponding via 131, the lower the risk of breakage of the protective part 101 between the groove 16C and the corresponding via 131, for example. Figure 11 The orthographic projections of the first groove 16Ca and the second device via 1312 on the substrate 11 are both located within the orthographic projection range of the first electrode 14 of the second light-emitting device 202 on the substrate 11. The first groove 16Ca is closer to the second device via 1312, which can reduce the risk of the protective part 101 breaking between the first groove 16Ca and the second device via 1312.

[0176] In some implementations, such as Figure 12As shown, on a plane parallel to the base 11, the groove 16C includes a plurality of spaced groove segments 16C1, which are arranged in an arc shape and located on at least one side of the through hole 131.

[0177] For example, multiple groove segments 16C1 can also serve to support the protective part 101.

[0178] Alternatively, in some implementations, such as Figure 12 As shown, the groove 16C is arranged around the through hole. The groove 16C can provide support for the protective part 101 from all directions.

[0179] It should be noted that the first light-emitting device 201 and the second light-emitting device 202 arranged adjacently can be light-emitting devices 20 of different colors, or the first light-emitting device 201 and the second light-emitting device 202 arranged adjacently can be light-emitting devices 20 of the same color. Figure 1 The example illustrates that the first light-emitting device 201 and the second light-emitting device 202 are light-emitting devices of different colors.

[0180] It should be noted that the first light-emitting device 201 and the third light-emitting device 203 arranged adjacently can be light-emitting devices 20 of different colors, or the first light-emitting device 201 and the third light-emitting device 203 arranged adjacently can be light-emitting devices 20 of the same color. Figure 6 The example illustrates that the first light-emitting device 201 and the third light-emitting device 203 are light-emitting devices of different colors.

[0181] like Figure 13 As shown, in some other embodiments, the groove 16C is disposed between the through hole 131 corresponding to the second light-emitting device 202 and the isolation opening 16K corresponding to the second light-emitting device 202. In this case, the groove 16C can also provide support for the protective part 101.

[0182] Please see Figures 1 to 5 ,or Figures 6 to 8 As shown.

[0183] In some embodiments, the light-emitting device 20 includes a first electrode 14, a light-emitting functional layer 21, and a second electrode 22. The first electrode 14, the light-emitting functional layer 21, and the second electrode 22 are stacked sequentially on the side of the first insulating layer 13 away from the substrate 11. The first electrode 14 is connected to the corresponding first conductive part 121 through a via 131.

[0184] For example, one of the first electrode 14 and the second electrode 22 can be an anode and the other can be a cathode, without limitation.

[0185] For example, the light-emitting functional layer 21 may include an emission layer (EML), and the light-emitting functional layer 21 may also include other film layers besides the emission layer (EML), such as one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL).

[0186] Optionally, in some embodiments, the protective portion 101 includes a first protective sub-portion 101a located within the groove 16C;

[0187] The first protective sub-part 101a also includes a second sub-layer 112D and a third sub-layer 113D located on the side of the first sub-layer 111D close to the substrate 11. The second sub-layer 112D is disposed in the same layer and with the same material as at least part of the second electrode 22 of the light-emitting device 20, and the third sub-layer 113D is disposed in the same layer and with the same material as at least part of the light-emitting functional layer 21 of the light-emitting device 20.

[0188] The second sublayer 112D and the third sublayer 113D are disposed on the bottom wall of the groove 16C near the substrate 11, and at least part of the first sublayer 111D covers the sidewall of the groove 16C.

[0189] For example, such as Figure 3 and 7 As shown, since the orthographic projection of the second sub-opening 16021 on the substrate is within the orthographic projection range of the first sub-opening 16011 on the substrate 11, that is, an undercut structure is formed at the groove 16C, the second sub-layer 112D and the third sub-layer 113D are broken at the edge of the groove 16C, so that the second sub-layer 112D and the third sub-layer 113D are disposed on the bottom wall of the groove 16C near the substrate 11; at the same time, the second sub-layer 112D and the third sub-layer 113D broken at the edge of the groove 16C expose the sidewall of the groove 16C, so that at least part of the first sub-layer 111D covers the sidewall of the groove 16C, thereby supporting the first sub-layer 111D at the groove 16C.

[0190] Alternatively, in some implementations, such as Figure 2 , Figure 3 and 7As shown, in a direction parallel to the plane of the base 11, the isolation structure 16 includes a first isolation substructure 16a with a first height and a second isolation substructure 16b with a second height. The orthographic projection of the first isolation substructure 16a on the base 11 overlaps with the orthographic projection of the via 131 on the base 11. The second isolation substructure 16b is located between the via 131 and the groove 16C, and the second height is greater than the first height.

[0191] For example, in the direction perpendicular to the plane of the base 11, the second height is greater than the first height.

[0192] Alternatively, in some implementations, such as Figure 3 and 7 As shown, the protective part 101 includes a second protective sub-part 101b located on the side of the second isolation sub-structure 16b away from the substrate 11, and a first gap 30J1 is formed between the first sub-layer 111D of the second protective sub-part 101b and the surface of the second isolation sub-structure 16b on the side away from the substrate 11.

[0193] For example, the first gap 30J1 is formed by etching the film between the first sublayer 111D and the side surface of the second isolation substructure 16b facing away from the substrate 11. For example, the first gap 30J1 is formed by etching the film between the first encapsulation layer 30R and the isolation structure 16 (the light-emitting functional layer 21 of the first color light-emitting device 20R and the second electrode 22).

[0194] For example, such as Figure 3 In the middle, the isolation structure 16 includes a third isolation substructure 16c located between the light-emitting device 20 and the groove 16C, and a first gap 30J1 is formed between the first sublayer 111D and the surface of the third isolation substructure 16c away from the substrate 11.

[0195] For example, such as Figure 3 As shown, there is a first gap 30J1 between the first sublayer 111D and the surface of the third isolation substructure 16c away from the substrate 11, which makes the first sublayer 111D suspended in this part, making the first sublayer 111D prone to collapse and breakage in this part. The groove 16C of this application can improve or avoid the collapse and breakage of the first sublayer 111D.

[0196] Alternatively, in some implementations, such as Figure 4 As shown, the second protective sub-part 101b also includes a second sub-layer 112D and a third sub-layer 113D, with a portion of the second sub-layer 112D and the third sub-layer 113D filling the first gap 30J1.

[0197] For example, when etching the film between the first sublayer 111D and the side surface of the second isolation substructure 16b facing away from the substrate 11, some of the second sublayer 112D and the third sublayer 113D remain.

[0198] Alternatively, in some implementations, such as Figure 4 As shown, the second sub-layer 112D includes a first sub-part 112D1 and a second sub-part 112D2 spaced apart. The first sub-part 112D1 is located on the side of the isolation structure 16 away from the substrate 11, and the second sub-part 112D2 is located in the groove 16C.

[0199] The third sublayer 113D includes a third sub-part 113D3 and a fourth sub-part 113D4 spaced apart. The third sub-part 113D3 is located on the side of the isolation structure 16 away from the base 11, and the fourth sub-part 113D4 is located in the groove 16C.

[0200] The first sub-layer 111D covers the second sub-part 112D2 and also covers the sidewall of the groove 16C.

[0201] For example, such as Figure 4 As shown, a portion of the second sublayer 112D and the third sublayer 113D fill the first gap 30J1. The portion of the second sublayer 112D that fills the first gap 30J1 can be the first sub-part 112D1, and the portion of the third sublayer 113D that fills the first gap 30J1 can be the third sub-part 113D3.

[0202] For example, in some portions of the display panel 100, the second electrode 22 of the first color light-emitting device 20R between the first sub-layer 111D and the isolation structure 16 is retained to form a first sub-section 112D1, and the light-emitting functional layer 21 of the first color light-emitting device 20R between the first sub-layer 111D and the isolation structure 16 is retained to form a third sub-section 113D3. For example Figure 4 In the middle, the isolation structure 16 includes a third isolation substructure 16c located between the light-emitting device 20 and the groove 16C. A first sub-part 112D1 and a third sub-part 113D3 are provided between the first sub-layer 111D and the surface of the third isolation substructure 16c away from the substrate 11. The first sub-part 112D1 and the third sub-part 113D3 at least partially fill the first gap 30J1 between the first sub-layer 111D and the surface of the third isolation substructure 16c away from the substrate 11.

[0203] Alternatively, in some implementations, such as Figure 3 and Figure 4 , Figure 7As shown, the protection part 101 includes a third protection part 101c located on the side of the first isolation substructure 16a away from the substrate 11, and a first gap 30J1 is formed between the third protection part 101c and the surface of the first isolation substructure 16a facing away from the substrate 11.

[0204] Example location, such as Figure 3 and Figure 4 , Figure 7 As shown, the first gap 30J1 is formed after the film layer between the first sublayer 111D and the side surface of the first isolation substructure 16a facing away from the substrate 11 is etched. For example, the first gap 30J1 is formed after the film layer between the first encapsulation layer 30R and the isolation structure 16 (the light-emitting functional layer 21 of the first color light-emitting device 20R and the second electrode 22) is etched.

[0205] In some embodiments, the display panel 100 further includes a pixel definition layer 15, which is disposed on the side of the first insulating layer 13 away from the substrate 11. The pixel definition layer 15 includes a pixel definition structure 151 and a plurality of pixel openings 152 surrounded by the pixel definition structure 151. The pixel openings 152 are correspondingly disposed with respect to the first electrode 14. In a direction perpendicular to the plane of the substrate 11, a portion of the pixel definition structure 151 is disposed between the protective portion 101 and the first electrode 14. The orthographic projection of the pixel definition structure 151 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11.

[0206] For example, in some implementations, the pixel definition structure 151 surrounds a plurality of pixel openings 152, the pixel openings 152 exposing the corresponding first electrode 14.

[0207] For example, in some implementations, at pixel opening 152, pixel definition structure 151 covers the edge of the corresponding first electrode 14.

[0208] For example, in some embodiments, on the side of the corresponding via 131 away from the substrate 11, the first electrode 14, the pixel definition structure 151, the isolation structure 16 and the protection part 101 are stacked in sequence, and the protection part 101 can protect the via 131.

[0209] Please see Figures 1 to 5 .

[0210] In some implementations, such as Figures 1 to 5 As shown, the plurality of light-emitting devices 20 include a plurality of first-color light-emitting devices 20R and a plurality of second-color light-emitting devices 20G, wherein the first-color light-emitting devices 20R and the second-color light-emitting devices 20G emit light of different colors;

[0211] The multiple vias 131 include multiple first vias 131R and multiple second vias 131G. The first color light-emitting device 20R is connected to the corresponding first conductive part 121 through the corresponding first via 131R, and the second color light-emitting device 20G is connected to the corresponding first conductive part 121 through the corresponding second via 131G.

[0212] The display panel 100 also includes an encapsulation layer 30, which is disposed on the side of the corresponding light-emitting device 20 away from the substrate 11. The encapsulation layer 30 includes a plurality of first encapsulation layers 30R and a plurality of second encapsulation layers 30G. The first encapsulation layers 30R are disposed on the side of the corresponding first color light-emitting device 20R away from the substrate 11, and the second encapsulation layers 30G are disposed on the side of the corresponding second color light-emitting device 20G away from the substrate 11.

[0213] The plurality of protection parts 101 include a plurality of first protection parts 101R and a plurality of second protection parts 101G. The orthographic projection of the first protection part 101R on the substrate 11 covers the orthographic projection of the corresponding first via 131R on the substrate 11, and the orthographic projection of the second protection part 101G on the substrate 11 covers the orthographic projection of the corresponding second via 131G on the substrate 11.

[0214] For example, in some embodiments, the first color light-emitting device 20R and the second color light-emitting device 20G can be different from red, green, and blue light-emitting devices. For example, the first color light-emitting device 20R is a red light-emitting device and the second color light-emitting device 20G is a green light-emitting device; or the first color light-emitting device 20R is a blue light-emitting device and the second color light-emitting device 20G is a red light-emitting device.

[0215] For example, such as Figures 1 to 5 As shown, the first electrode 14 of the first color light-emitting device 20R is the first device electrode 14R, the light-emitting functional layer 21 of the first color light-emitting device 20R is the first device light-emitting functional layer 21R, and the second electrode 22 of the first color light-emitting device 20R is the fourth device electrode 22R.

[0216] For example, such as Figure 3 As shown, the first color light-emitting device 20R is connected to the corresponding first conductive part 121 through the corresponding first via 131R. The first encapsulation layer 30R is disposed on the side of the corresponding first color light-emitting device 20R away from the substrate 11. The orthographic projection of the first protective part 101R on the substrate 11 covers the orthographic projection of the corresponding first via 131R on the substrate 11.

[0217] For example, such as Figure 5As shown, the first electrode 14 of the second color light-emitting device 20G is the second device electrode 14G, the light-emitting functional layer 21 of the second color light-emitting device 20G is the second device light-emitting functional layer 21G, and the second electrode 22 of the second color light-emitting device 20G is the fifth device electrode 22G.

[0218] For example, such as Figure 5 As shown, the second color light-emitting device 20G is connected to the corresponding first conductive part 121 through the corresponding second via 131G. The second encapsulation layer 30G is disposed on the side of the corresponding second color light-emitting device 20G away from the substrate 11. The orthographic projection of the second protective part 101G on the substrate 11 covers the orthographic projection of the corresponding second via 131G on the substrate 11.

[0219] For example, such as Figure 5 As shown, a second gap 30J2 is formed between the second encapsulation layer 30G and the surface of the isolation structure 16 away from the substrate 11.

[0220] Optionally, in some embodiments, the first protective part 101R includes a first sub-layer 111D, and the first sub-layer 111D and the first encapsulation layer 30R are made of the same material.

[0221] Optionally, the second protection layer 101G includes a first sublayer 111D.

[0222] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sub-layer 111D in the first protective part 101R is also formed, which can simplify the manufacturing process.

[0223] Optionally, in some embodiments, the thickness of the first sublayer 111D is the same as the thickness of the first encapsulation layer 30R.

[0224] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sub-layer 111D is formed simultaneously, such that the thickness of the first sub-layer 111D is the same as the thickness of the first encapsulation layer 30R.

[0225] For example, in some embodiments, at least part of the protection portion 101 includes only the first sublayer 111D, for example, all of the protection portion 101 includes only the first sublayer 111D.

[0226] In some embodiments, the light-emitting device 20 further includes a light-emitting functional layer 21 and a second electrode 22, wherein the first electrode 14, the light-emitting functional layer 21 and the second electrode 22 are stacked sequentially on one side of the substrate 11; the first protective part 101R includes a second sub-layer 112D, wherein the second sub-layer 112D and the second electrode 22 of the first color light-emitting device 20R are disposed in the same layer and with the same material.

[0227] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light-emitting device 20R is formed, the second sub-layer 112D in the first protective part 101R is formed simultaneously, which can simplify the manufacturing process.

[0228] Optionally, in some embodiments, the second protection unit 101G includes a second sublayer.

[0229] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light-emitting device 20R is formed, the second sub-layer 112D in the second protective part 101G is formed simultaneously, which can simplify the manufacturing process.

[0230] Optionally, the thickness of the second sublayer is the same as the thickness of the second electrode 22 of the first color light-emitting device 20R;

[0231] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light-emitting device 20R is formed, a second sub-layer 112D is formed simultaneously, such that the thickness of the second sub-layer 112D is the same as the thickness of the second electrode 22 of the first color light-emitting device 20R.

[0232] Optionally, the first protective part 101R includes a third sub-layer 113D, and the third sub-layer 113D and the light-emitting functional layer 21 of the first color light-emitting device 20R are made of the same layer and the same material.

[0233] For example, during the manufacturing process of the display panel, when the light-emitting functional layer 21 of the first color light-emitting device 20R is formed, the third sub-layer 113D in the first protective part 101R is also formed, which can simplify the manufacturing process.

[0234] Optionally, the second protection layer 101G includes a third sublayer 113D.

[0235] For example, during the manufacturing process of the display panel, when the light-emitting functional layer 21 of the first color light-emitting device 20R is formed, the third sub-layer 113D in the second protective part 101G is formed simultaneously, which can simplify the manufacturing process.

[0236] Optionally, the thickness of the third sub-layer 113D is the same as the thickness of the light-emitting functional layer 21 of the first color light-emitting device 20R.

[0237] For example, during the manufacturing process of the display panel, when the light-emitting functional layer 21 of the first color light-emitting device 20R is formed, a third sub-layer 113D is formed simultaneously, such that the thickness of the third sub-layer 113D is the same as the thickness of the second electrode 22 of the first color light-emitting device 20R.

[0238] For example, in some embodiments of this application, in a first aspect, the first color light-emitting device 20R and the second color light-emitting device 20G are far apart, and the first sub-layer 111D (the encapsulation layer 30 covering the first light-emitting device) is prone to breakage between the second via 131G and the first color light-emitting device 20R. Therefore, the groove 16C is disposed between the first color light-emitting device 20R and the second via 131G. Even if the first sub-layer 111D (the encapsulation layer 30 covering the first light-emitting device) collapses or breaks on the side of the groove 16C away from the second via 131G, the protective part 101 can still be supported at the groove 16C, so that the protective part 101 continues to cover the second via 131G, preventing the protective part 101 from collapsing or breaking above the second via 131G, and thus protecting the second via 131G. Secondly, the protection section 101 blocks the diffusion path of water vapor and oxygen in the groove 16C. For example, it can prevent water vapor and oxygen from entering the oxide isolation structure 16, thereby improving the display quality and reliability of the display panel 100.

[0239] For example, in some embodiments of this application, the first color light-emitting device 20R and the first encapsulation layer 30R are manufactured first, compared to the second color light-emitting device 20G and the second encapsulation layer 30G. The first protective portion 101R and the second protective portion 101G are manufactured when the first color light-emitting device 20R and the first encapsulation layer 30R are completed. In the subsequent manufacturing process of the second color light-emitting device 20G and the second encapsulation layer 30G, secondly, the first protective portion 101R can protect the first via 131R and the second via 131G, preventing the electrodes or traces at the locations of the first via 131R and the second via 131G from being over-etched by subsequent manufacturing processes, for example, preventing over-etching by the etching solution in subsequent manufacturing processes. To prevent defects such as voids in the electrodes or traces (e.g., the isolation structure 16) at the second via 131G location, thus preventing or improving display defects such as dark spots; thirdly, during the manufacturing process of the display panel 100, after the protective part 101 is formed, the protective part 101 and the groove 16C can protect the via 131. In subsequent manufacturing processes, it can prevent the etching solution from seeping in through the part between the protective part and the isolation structure and damaging the isolation structure 16 at the via 131, or it can prevent the etching solution from seeping in through the side end face of the protective part and damaging the isolation structure 16 at the via 131. This can prevent defects such as voids in the isolation structure 16 at the via 131, prevent or improve display defects such as dark spots, and improve the display quality and reliability of the display panel.

[0240] Please see Figures 6 to 8 .

[0241] In some implementations, such as Figures 6 to 8As shown, the plurality of light-emitting devices 20 also include a plurality of third-color light-emitting devices 20B, and the first-color light-emitting device 20R, the second-color light-emitting device 20G and the third-color light-emitting device 20B emit light of different colors respectively;

[0242] The multiple vias 131 also include multiple third vias 131B, and the third color light-emitting device 20B is connected to the corresponding first conductive part 121 through the corresponding third via 131B;

[0243] Encapsulation layer 30 also includes a plurality of third encapsulation layers 30B, the third encapsulation layers 30B being disposed on the side of the corresponding third color light-emitting device 20B away from the substrate 11;

[0244] The plurality of protection parts 101 include a plurality of third protection parts 101B, the orthographic projection of the third protection parts 101B on the substrate 11 covering the orthographic projection of the corresponding third via 131B on the substrate 11.

[0245] For example, in some embodiments, the first color light-emitting device 20R, the second color light-emitting device 20G, and the third color light-emitting device 20B can be different from red, green, and blue light-emitting devices. For example, the first color light-emitting device 20R is a red light-emitting device, the second color light-emitting device 20G is a green light-emitting device, and the third color light-emitting device 20B is a blue light-emitting device; or the first color light-emitting device 20R is a blue light-emitting device, the second color light-emitting device 20G is a red light-emitting device, and the third color light-emitting device 20B is a green light-emitting device.

[0246] For example, such as Figure 7 and Figure 8 As shown, the first electrode 14 of the third color light-emitting device 20B is the third device electrode 14B, the light-emitting functional layer 21 of the third color light-emitting device 20B is the third device light-emitting functional layer 21B, and the second electrode 22 of the third color light-emitting device 20B is the sixth device electrode 22B.

[0247] For example, such as Figure 7 and Figure 8 As shown, the third color light-emitting device 20B is connected to the corresponding first conductive part 121 through the corresponding third via 131B. The third encapsulation layer 30B is disposed on the side of the corresponding third color light-emitting device 20B away from the substrate 11. The orthographic projection of the third protective part 101B on the substrate 11 covers the orthographic projection of the corresponding third via 131B on the substrate 11.

[0248] For example, such as Figure 8 As shown, a third gap 30J3 is formed between the third encapsulation layer 30B and the surface of the isolation structure 16 away from the substrate 11.

[0249] Optionally, in some embodiments, the third protection unit 101B includes a first sublayer 111D.

[0250] For example, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sub-layer 111D in the third protective part 101B is also formed simultaneously, which can simplify the manufacturing process.

[0251] For example, in some embodiments, during the manufacturing process of the display panel, when the first encapsulation layer 30R is formed, the first sub-layer 111D of the first protective portion 101R, the second protective portion 101G, and the third protective portion 101B is formed simultaneously, which can simplify the manufacturing process.

[0252] In some embodiments, the light-emitting device 20 further includes a light-emitting functional layer 21 and a second electrode 22, wherein the first electrode 14, the light-emitting functional layer 21 and the second electrode 22 are stacked sequentially on one side of the substrate 11; the first protective part 101R further includes a second sub-layer 112D, wherein the second sub-layer 112D and the second electrode 22 of the first color light-emitting device 20R are disposed in the same layer and with the same material.

[0253] Optionally, in some embodiments, the second protection unit 101G further includes a second sublayer 112D.

[0254] Optionally, in some embodiments, the third protection unit 101B further includes a second sublayer 112D.

[0255] Optionally, in some embodiments, the thickness of the second sublayer 112D is the same as the thickness of the second electrode 22 of the first color light-emitting device 20R.

[0256] For example, during the manufacturing process of the display panel, when the second electrode 22 of the first color light-emitting device 20R is formed, the first sub-layer 111D in the second protective part 101G or / and the third protective part 101B is formed simultaneously, which can simplify the manufacturing process.

[0257] For example, in some embodiments, during the manufacturing process of the display panel, when the second electrode 22 of the first color light-emitting device 20R is formed, the second sub-layer 112D of the first protective portion 101R, the second protective portion 101G or / and the third protective portion 101B is formed simultaneously, which can simplify the manufacturing process.

[0258] Optionally, in some embodiments, the first protective part 101R further includes a third sub-layer 113D, wherein the third sub-layer 113D and the light-emitting functional layer 21 of the first color light-emitting device 20R are made of the same layer and the same material.

[0259] Optionally, in some embodiments, the second protection layer 101G further includes a third sublayer 113D.

[0260] Optionally, in some embodiments, the third protection unit 101B further includes a third sublayer 113D.

[0261] Optionally, the thickness of the third sub-layer 113D is the same as the thickness of the light-emitting functional layer 21 of the first color light-emitting device 20R.

[0262] For example, in some embodiments, during the manufacturing process of the display panel, when the second electrode 22 of the first color light-emitting device 20R is formed, the third sub-layer 113D in the first protective part 101R, the second protective part 101G or / and the third protective part 101B is formed simultaneously, which can simplify the manufacturing process.

[0263] Optionally, in some embodiments, on the side of the corresponding via 131 away from the substrate 11, the isolation structure 16, the third sub-layer 113D, the second sub-layer and the first sub-layer 111D are stacked sequentially on one side of the substrate 11.

[0264] For example, in some embodiments, the first protective layer 101R includes a first sublayer 111D, a second sublayer 112D, and a third sublayer 113D; the second protective layer 101G includes the first sublayer 111D, the second sublayer 112D, and the third sublayer 113D; and the third protective layer 101B includes the first sublayer 111D, the second sublayer 112D, and the third sublayer 113D. The first sublayer 111D and the first encapsulation layer 30R are disposed in the same layer and with the same material; the second sublayer 112D and the second electrode 22 of the first color light-emitting device 20R are disposed in the same layer and with the same material; and the third sublayer 113D and the light-emitting functional layer 21 of the first color light-emitting device 20R are disposed in the same layer and with the same material. On the side of the corresponding via 131 away from the substrate 11, the third sublayer 113D, the second sublayer 112D, and the first sublayer 111D are sequentially stacked on one side of the substrate 11.

[0265] In some implementations, such as Figure 2 As shown, the display panel 100 also includes a pixel definition layer 15, which is disposed on the side of the first insulating layer 13 away from the substrate 11. The pixel definition layer 15 includes a pixel definition structure 151 and a plurality of pixel openings 152 surrounded by the pixel definition structure 151. The pixel openings 152 expose a portion of the first electrode 14. The orthographic projection of the pixel openings 152 on the substrate 11 is located within the orthographic projection range of the isolation openings 16K on the substrate 11. The groove 16C exposes a portion of the pixel definition layer 15.

[0266] For example, the pixel definition layer 15 is made of a different material than the isolation structure 16. When the groove 16C is formed, the pixel definition layer 15 is retained, so that the groove 16C exposes part of the pixel definition layer 15. The depth of the groove 16C can be reduced, the protective part 101 can be prevented from breaking at the edge of the groove 16C, and better support can be provided for the protective part 101.

[0267] For example, in some embodiments of this application, in a first aspect, the first color light-emitting device 20R and the third color light-emitting device 20B are far apart, and the first sub-layer 111D (the encapsulation layer 30 covering the first light-emitting device) is prone to breakage between the third via 131B and the first color light-emitting device 20R. Therefore, the groove 16C is disposed between the first color light-emitting device 20R and the third via 131B. Even if the first sub-layer 111D (the encapsulation layer 30 covering the first light-emitting device) collapses or breaks on the side of the groove 16C away from the third via 131B, the protective part 101 can still be supported at the groove 16C, so that the protective part 101 continues to cover the third via 131B, preventing the protective part 101 from collapsing or breaking above the third via 131B, and thus protecting the third via 131B. Secondly, the protection section 101 blocks the diffusion path of water vapor and oxygen in the groove 16C. For example, it can prevent water vapor and oxygen from entering the oxide isolation structure 16, thereby improving the display quality and reliability of the display panel 100.

[0268] For example, in some embodiments of this application, the first color light-emitting device 20R and the first encapsulation layer 30R are manufactured first, compared to the second color light-emitting device 20G and the second encapsulation layer 30G, and the third color light-emitting device 20B and the third encapsulation layer 30B. When the first color light-emitting device 20R and the first encapsulation layer 30R are manufactured, the first protective part 101R, the second protective part 101G, and the third protective part 101B are also manufactured. In the subsequent manufacturing processes of the second color light-emitting device 20G and the second encapsulation layer 30G, and in the subsequent manufacturing processes of the third color light-emitting device 20B and the third encapsulation layer 30B, secondly, the first protective part 101R can protect the first via 131R, the second via 131G, and the third via 131B, preventing electrodes or traces at the locations of the first via 131R, the second via 131G, and the third via 131B from being damaged. The protective part 101, formed during the manufacturing process of the display panel 100, can protect the via 131 from defects such as voids in the electrodes or traces (e.g., the isolation structure 16) at the second via 131G and the third via 131B, thus preventing or improving display defects such as dark spots. Thirdly, during the manufacturing process of the display panel 100, after the protective part 101 is formed, the protective part 101 and the groove 16C can protect the via 131. In subsequent manufacturing processes, it can prevent the etching solution from seeping into the isolation structure 16 at the via 131 through the area between the protective part and the isolation structure, or from seeping into the isolation structure 16 at the via 131 through the side end face of the protective part, thus preventing defects such as voids in the isolation structure 16 at the via 131, preventing or improving display defects such as dark spots, and improving the display quality and reliability of the display panel.

[0269] Secondly, please refer to Figures 1 to 13 .

[0270] This application provides a display panel 100, which includes a substrate 11, a first conductive layer 12, a first insulating layer 13, an isolation structure 16, a plurality of light-emitting devices 20, and an encapsulation layer 30. The first conductive layer 12 is disposed on one side of the substrate 11 and includes a plurality of first conductive portions 121. The first insulating layer 13 is disposed on the side of the first conductive layer 12 away from the substrate 11 and includes a plurality of vias 131. The isolation structure 16 is disposed on the side of the first insulating layer 13 away from the substrate 11, and the plurality of isolation structures 16 enclose a plurality of partitions. The first insulating layer 13 is separated from the opening 16K and the groove 16C. A plurality of light-emitting devices 20 are disposed on the side of the first insulating layer 13 away from the substrate 11. At least part of the light-emitting devices 20 are located in the corresponding isolation opening 16K. The light-emitting devices 20 are connected to the corresponding first conductive part 121 through the via 131. The encapsulation layer 30 is disposed on the side of the light-emitting devices 20 away from the substrate 11. Part of the encapsulation layer 30 extends to the side of the isolation structure 16 away from the substrate 11 and covers the corresponding groove 16C. The orthogonal projection of the via 131 on the substrate 11 is within the orthogonal projection range of the encapsulation layer 30 on the substrate 11.

[0271] For example, such as Figure 2 As shown, the orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the via 131 on the substrate 11. The isolation structure 16 includes a plurality of grooves 16C, the openings of which face the side of the isolation structure 16 away from the substrate 11. On a plane parallel to the substrate 11, the grooves 16C are disposed on at least one side of at least a portion of the via 131. The isolation structure 16 includes a support portion 1601 and a crown portion 1602 stacked sequentially on one side of the substrate 11. The support portion 1601 includes a first groove sidewall 1601a1 near the via 131 and a second groove sidewall 1601a2 away from the via 131. The crown portion 1602 protrudes from at least one of the first groove sidewall 1601a1 and the second groove sidewall 1601a2 in a direction toward the groove 16C to form a protruding structure.

[0272] In some embodiments, the display panel 100 further includes a plurality of protective portions 101. The plurality of protective portions 101 are disposed on the side of the isolation structure 16 away from the substrate 11 and are correspondingly disposed with a plurality of vias 131. The orthographic projection of the protective portion 101 on the substrate 11 covers the orthographic projection of the corresponding via 131 on the substrate 11. The protective portion 101 includes a first sub-layer 111D, which is disposed in the same layer and material as at least a portion of the encapsulation layer 30. The first sub-layer 111D is in direct contact with at least a portion of the sidewall of the groove 16C.

[0273] In some embodiments, the plurality of light-emitting devices 20 include a first light-emitting device 201 and a second light-emitting device 202 disposed adjacent to each other, and a via 131 corresponding to the second light-emitting device 202 is disposed between the first light-emitting device 201 and the second light-emitting device 202.

[0274] Optionally, in some embodiments, the groove 16C is disposed between the via 131 corresponding to the first light-emitting device 201 and the second light-emitting device 202.

[0275] Optionally, in some embodiments, the orthographic projection of the groove 16C on the substrate 11 is arranged around the orthographic projection of the corresponding via 131 on the substrate 11, and the groove 16C is arranged in a ring shape.

[0276] It should be noted that, in the above embodiments, under the combined conditions of dry etching and wet etching processes, the first protective part 101R, the second protective part 101G, and the third protective part 101B may only include the first sublayer 111D.

[0277] It should be noted that, in the above embodiments, under the combined conditions of dry etching and wet etching processes, the first protective part 101R, the second protective part 101G, and the third protective part 101B include a first sub-layer 111D. There is a gap between the protective part 101 and the isolation structure 16. In the wet etching process therein, a portion of the second sub-layer 112D and a portion of the third sub-layer 113D may remain in the gap, that is, a portion of the second sub-layer 112D and a portion of the third sub-layer 113D fill the gap.

[0278] For example, in some other embodiments, in the dry etching process, the first protective part 101R, the second protective part 101G, and the third protective part 101B under the dry etching process conditions include a first sub-layer 111D, a second sub-layer 112D, and a third sub-layer 113D. The first sub-layer 111D is disposed in the same layer and with the same material as the first encapsulation layer 30R, the second sub-layer 112D is disposed in the same layer and with the same material as the second electrode 22 of the first color light-emitting device 20R, and the third sub-layer 113D is disposed in the same layer and with the same material as the light-emitting functional layer 21 of the first color light-emitting device 20R.

[0279] Please see Figure 14 , Figure 14 This is a schematic diagram of a display device 200 provided for some embodiments of this application.

[0280] Thirdly, please refer to Figure 14 This application provides a display device 200, which includes a display panel 100 of any one of the above features, or a display panel 100 that combines any of the above features.

[0281] For example, the display device 200 may be a mobile phone, a laptop, a television, etc., but is not limited to these.

[0282] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0283] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: Base; A first conductive layer is disposed on one side of the substrate, and the first conductive layer includes a plurality of first conductive portions; A first insulating layer is disposed on the side of the first conductive layer away from the substrate, and the first insulating layer includes a plurality of vias; An isolation structure is disposed on the side of the first insulating layer away from the substrate, and the isolation structure encloses a plurality of isolation openings and grooves; Multiple light-emitting devices are disposed on the side of the first insulating layer away from the substrate. The light-emitting devices are at least partially located within the corresponding isolation openings, and the light-emitting devices are connected to the corresponding first conductive parts through the vias. A protective part is disposed on the side of the isolation structure away from the substrate, and the orthographic projection of the protective part on the substrate covers the orthographic projection of the corresponding via on the substrate; At least a portion of the protective portion is disposed within the groove and is in direct contact with at least a portion of the sidewall of the groove.

2. The display panel according to claim 1, characterized in that, Also includes: An encapsulation layer is disposed on the side of the light-emitting device away from the substrate; The protective portion includes a first sub-layer, which is made of the same material as at least a portion of the encapsulation layer, and the first sub-layer is in direct contact with at least a portion of the sidewall of the groove.

3. The display panel according to claim 2, characterized in that, The isolation structure includes a support portion and a crown portion that are stacked sequentially on one side of the base.

4. The display panel according to claim 3, characterized in that, The groove includes a first sub-opening and a second sub-opening that are connected. The support portion surrounds the first sub-opening, and the crown portion surrounds the second sub-opening. The orthographic projection of the second sub-opening on the base is located within the orthographic projection range of the first sub-opening on the base. On a plane parallel to the base, the area of ​​the first sub-opening is greater than the area of ​​the second sub-opening; Wherein, on a plane perpendicular to the base, the first sub-opening penetrates the support portion; or, On a plane perpendicular to the base, the first sub-opening penetrates a portion of the support.

5. The display panel according to claim 3, characterized in that, In a direction perpendicular to the plane of the base, the groove extends through the crown and at least part of the support.

6. The display panel according to claim 5, characterized in that, The groove extends through the support portion in a direction perpendicular to the plane of the base.

7. The display panel according to claim 5, characterized in that, The isolation structure also includes a pad portion, and the pad portion, the support portion, and the crown portion are sequentially stacked on one side of the base. Wherein, in a direction perpendicular to the plane of the base, the groove penetrates the crown, the support, and the pad; or, In a direction perpendicular to the plane of the substrate, the depth of the groove is less than the thickness of the isolation structure.

8. The display panel according to claim 1, characterized in that, The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device arranged adjacent to each other, wherein the via corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device; The groove is disposed between the vias that are correspondingly connected to the first light-emitting device and the second light-emitting device.

9. The display panel according to claim 1, characterized in that, The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device, the vias include a first device via and a second device via, the plurality of first conductive parts include a first device conductive part and a second device conductive part, the first light-emitting device is connected to the first device conductive part through the first device via, the second light-emitting device is connected to the second device conductive part through the second device via, and the second device via corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device.

10. The display panel according to claim 9, characterized in that, The groove includes a first groove disposed on the side of the second device via near the first light-emitting device.

11. The display panel according to claim 9, characterized in that, The plurality of light-emitting devices further include a third light-emitting device, the via further includes a third device via, the first conductive part further includes a third device conductive part, the third light-emitting device is connected to the third device conductive part through the third device via, and the groove includes a second groove disposed on the side of the third device via near the first light-emitting device.

12. The display panel according to claim 1, characterized in that, The orthographic projection of the groove on the substrate surrounds the orthographic projection of the via corresponding to the light-emitting device on the substrate, and the groove is arranged in a ring shape.

13. The display panel according to claim 1, characterized in that, The light-emitting device includes a first electrode, and the first electrode is connected to the corresponding first conductive part through the via; The orthographic projection of the groove on the substrate and the orthographic projection of the corresponding via on the substrate are both located within the orthographic projection range of the first electrode of the corresponding light-emitting device on the substrate.

14. The display panel according to claim 1, characterized in that, On a plane parallel to the base, the groove includes a plurality of spaced groove segments arranged in an arc shape and disposed on at least one side of the via; or, the groove surrounds the via.

15. The display panel according to claim 2, characterized in that, The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode. The first electrode, the light-emitting functional layer, and the second electrode are stacked sequentially on the side of the first insulating layer away from the substrate. The first electrode is connected to the corresponding first conductive part through the via.

16. The display panel according to claim 15, characterized in that, The protective portion includes a first protective sub-portion located within the groove; The first protective sub-part further includes a second sub-layer and a third sub-layer located on the side of the first sub-layer close to the substrate. The second sub-layer is disposed in the same layer and with the same material as at least a portion of the second electrode of the light-emitting device, and the third sub-layer is disposed in the same layer and with the same material as at least a portion of the light-emitting functional layer of the light-emitting device. The second and third sub-layers are disposed on the bottom wall of the groove near the substrate, and at least part of the first sub-layer covers the sidewall of the groove.

17. The display panel according to claim 15, characterized in that, In a direction parallel to the plane of the substrate, the isolation structure includes a first isolation substructure with a first height and a second isolation substructure with a second height. The orthographic projection of the first isolation substructure on the substrate overlaps with the orthographic projection of the via on the substrate. The second isolation substructure is located between the via and the groove. The second height is greater than the first height.

18. The display panel according to claim 17, characterized in that, The protective portion includes a second protective sub-part located on the side of the second isolation sub-structure opposite to the substrate, and a first gap exists between the first sub-layer of the second protective sub-part and the surface of the second isolation sub-structure opposite to the substrate.

19. The display panel according to claim 18, characterized in that, The second protective sub-part also includes a second sub-layer and a third sub-layer, with a portion of the second sub-layer and the third sub-layer filling the first gap.

20. The display panel according to claim 16, characterized in that, The second sub-layer includes a first sub-part and a second sub-part spaced apart, the first sub-part being located on the side of the isolation structure opposite to the substrate, and the second sub-part being located within the groove; The third sub-layer includes a third sub-part and a fourth sub-part spaced apart. The third sub-part is located on the side of the isolation structure opposite to the substrate, and the fourth sub-part is located within the groove. The first sub-layer covers the second sub-section and also covers the sidewalls of the groove.

21. The display panel according to claim 17, characterized in that, The protective portion includes a third protective portion located on the side of the first isolation substructure away from the substrate, and the third protective portion has a first gap with the surface of the first isolation substructure facing away from the substrate.

22. The display panel according to claim 2, characterized in that, The display panel further includes a pixel definition layer, which is disposed on the side of the first insulating layer away from the substrate. The pixel definition layer includes a pixel definition structure and a plurality of pixel openings surrounded by the pixel definition structure. The light-emitting device includes a first electrode, which is connected to the corresponding first conductive part through the via. The pixel openings are disposed corresponding to the first electrode. In a direction perpendicular to the plane of the substrate, a portion of the pixel definition structure is disposed between the protective portion and the first electrode, and the orthogonal projection of the pixel definition structure on the substrate covers the orthogonal projection of the via on the substrate.

23. The display panel according to claim 2, characterized in that, The plurality of light-emitting devices include a plurality of first-color light-emitting devices and a plurality of second-color light-emitting devices, wherein the first-color light-emitting devices and the second-color light-emitting devices emit light of different colors; The plurality of vias includes a plurality of first vias and a plurality of second vias. The first color light-emitting device is connected to the corresponding first conductive part through the corresponding first via, and the second color light-emitting device is connected to the corresponding first conductive part through the corresponding second via. The display panel further includes an encapsulation layer, which is disposed on the side of the corresponding light-emitting device away from the substrate. The encapsulation layer includes a plurality of first encapsulation layers and a plurality of second encapsulation layers. The first encapsulation layer is disposed on the side of the corresponding first color light-emitting device away from the substrate, and the second encapsulation layer is disposed on the side of the corresponding second color light-emitting device away from the substrate. The plurality of protection portions include a plurality of first protection portions and a plurality of second protection portions, wherein the orthographic projection of the first protection portion on the substrate covers the orthographic projection of the corresponding first via on the substrate, and the orthographic projection of the second protection portion on the substrate covers the orthographic projection of the corresponding second via on the substrate.

24. The display panel according to claim 23, characterized in that, The first protective layer includes a first sub-layer, which is made of the same material as the first encapsulation layer; and / or, The second protective layer includes the first sublayer; and / or, The thickness of the first sub-layer is the same as the thickness of the first encapsulation layer.

25. The display panel according to claim 23, characterized in that, The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode, wherein the first electrode, the light-emitting functional layer, and the second electrode are sequentially stacked on one side of the substrate. The first protective part includes a second sub-layer, which is made of the same material as the second electrode of the first color light-emitting device.

26. The display panel according to claim 25, characterized in that, The second protection unit includes the second sublayer.

27. The display panel according to claim 25, characterized in that, The thickness of the second sub-layer is the same as the thickness of the second electrode of the first color light-emitting device.

28. The display panel according to claim 25, characterized in that, The first protective part includes a third sub-layer, which is made of the same material as the light-emitting functional layer of the first color light-emitting device.

29. The display panel according to claim 28, characterized in that, The second protective layer includes the third sublayer.

30. The display panel according to claim 28, characterized in that, The thickness of the third sub-layer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

31. The display panel according to claim 23, characterized in that, The multiple light-emitting devices also include multiple third-color light-emitting devices, wherein the first-color light-emitting device, the second-color light-emitting device, and the third-color light-emitting device emit light of different colors respectively; The plurality of vias also include a plurality of third vias, wherein the third color light-emitting device is connected to the corresponding first conductive part through the corresponding third via; The encapsulation layer further includes a plurality of third encapsulation layers, wherein the third encapsulation layers are disposed on the side of the corresponding third color light-emitting device away from the substrate; The plurality of said protective portions include a plurality of third protective portions, the orthographic projection of the third protective portion on the substrate covering the orthographic projection of the corresponding third via on the substrate.

32. The display panel according to claim 31, characterized in that, The third protective layer includes the first sublayer.

33. The display panel according to claim 31, characterized in that, The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode, wherein the first electrode, the light-emitting functional layer, and the second electrode are sequentially stacked on one side of the substrate. The first protective part further includes a second sub-layer, which is made of the same material as the second electrode of the first color light-emitting device.

34. The display panel according to claim 33, characterized in that, The second protective layer further includes the second sub-layer; and / or, The third protective layer also includes the second sub-layer.

35. The display panel according to claim 33, characterized in that, The thickness of the second sub-layer is the same as the thickness of the second electrode of the first color light-emitting device.

36. The display panel according to claim 33, characterized in that, The first protective part further includes a third sub-layer, which is made of the same material as the light-emitting functional layer of the first color light-emitting device.

37. The display panel according to claim 36, characterized in that, The second protective layer further includes the third sub-layer; and / or, The third protective layer also includes the third sublayer.

38. The display panel according to claim 36, characterized in that, The thickness of the third sub-layer is the same as the thickness of the light-emitting functional layer of the first color light-emitting device.

39. The display panel according to claim 36, characterized in that, On the side of the corresponding via away from the substrate, the isolation structure, the third sub-layer, the second sub-layer, and the first sub-layer are sequentially stacked on one side of the substrate.

40. The display panel according to claim 33, characterized in that, The display panel further includes a pixel definition layer, which is disposed on the side of the first insulating layer away from the substrate. The pixel definition layer includes a pixel definition structure and a plurality of pixel openings surrounding the pixel definition structure, and the pixel openings expose a portion of the first electrode. The orthographic projection of the pixel opening onto the substrate is located within the orthographic projection range of the isolation opening onto the substrate; The groove exposes a portion of the pixel definition layer.

41. A display panel, characterized in that, include: Base; A first conductive layer is disposed on one side of the substrate, and the first conductive layer includes a plurality of first conductive portions; A first insulating layer is disposed on the side of the first conductive layer away from the substrate, and the first insulating layer includes a plurality of vias; An isolation structure is disposed on the side of the first insulating layer away from the substrate, and multiple isolation structures are arranged to form multiple isolation openings and grooves; Multiple light-emitting devices are disposed on the side of the first insulating layer away from the substrate. The light-emitting devices are at least partially located within the corresponding isolation openings, and the light-emitting devices are connected to the corresponding first conductive parts through the vias. An encapsulation layer is disposed on the side of the light-emitting device away from the substrate. A portion of the encapsulation layer extends to the side of the isolation structure away from the substrate and covers the corresponding groove. The orthographic projection of the via on the substrate is located within the orthographic projection range of the encapsulation layer on the substrate.

42. The display panel according to claim 41, characterized in that, Also includes: A protective part is disposed on the side of the isolation structure away from the substrate and is disposed corresponding to a plurality of the vias. The orthographic projection of the protective part on the substrate covers the orthographic projection of the corresponding via on the substrate. The protective part includes a first sub-layer, which is made of the same material as at least a portion of the encapsulation layer, and the first sub-layer is in direct contact with at least a portion of the sidewall of the groove.

43. The display panel according to claim 42, characterized in that, The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device arranged adjacent to each other, wherein the via corresponding to the second light-emitting device is disposed between the first light-emitting device and the second light-emitting device; Wherein, the groove is disposed between the vias corresponding to the first light-emitting device and the second light-emitting device; and / or, The orthographic projection of the groove on the substrate surrounds the orthographic projection of the corresponding through hole on the substrate, and the groove is arranged in a ring shape.

44. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 40.

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