Display panel, preparation method thereof and display device

Abstract

The display panel comprises a substrate and an isolation structure, a pixel definition layer, a light-transmitting protective layer and a plurality of light-emitting devices on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings for limiting the light-emitting devices. The pixel definition layer is between the isolation structure and the substrate, and the orthographic projection of the light-transmitting opening on the substrate is within the orthographic projection of the pixel definition layer on the substrate. The light-transmitting protective layer is on the side of the pixel definition layer away from the substrate and covers at least part of the pixel definition layer exposed by the light-transmitting opening. In the display panel, the light-transmitting protective layer not only ensures the light transmission of the area where the light-transmitting opening is located, but also protects the pixel definition layer in the process of manufacturing the light-emitting devices, thereby ensuring the protection effect of the pixel definition layer.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as simple fabrication process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display capability.

[0003] However, due to the limitations of their structural design, current electronic display products are unable to provide good display functionality when applied to scenarios such as under-display recognition and transparent displays. Summary of the Invention

[0004] This disclosure provides a display panel including a substrate and an isolation structure, a pixel defining layer, a light-transmitting protective layer, and a plurality of light-emitting devices located on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings for limiting the light-emitting devices. The pixel defining layer is located between the isolation structure and the substrate, and the orthographic projection of the light-transmitting opening onto the substrate lies within the orthographic projection of the pixel defining layer onto the substrate. The light-transmitting protective layer is located on the side of the pixel defining layer opposite to the substrate and covers at least the portion of the pixel defining layer exposed by the light-transmitting opening.

[0005] In the process of batch fabricating light-emitting devices using an isolation structure, multiple etching processes are performed. At the light-transmitting openings, the etching process etches the pixel-defining layer exposed by the openings, thereby compromising the protective effect of the pixel-defining layer on the substrate and the structure of the light-emitting device (e.g., the first electrode described below). In the above process, the light-transmitting protective layer not only ensures light transmission in the area where the light-transmitting openings are located, but also protects the pixel-defining layer during the fabrication of the light-emitting device, thus ensuring the protective effect of the pixel-defining layer.

[0006] In one embodiment of the first aspect of this disclosure, the light-transmitting protective layer covers the entire pixel-defining layer exposed by the light-transmitting opening.

[0007] Optionally, the edge portion of the light-transmitting protective layer is connected to the isolation structure. In this way, there is no gap between the light-transmitting protective layer and the isolation structure, and the light-transmitting protective layer and the isolation structure can jointly protect the pixel boundary layer, thereby improving the protection effect on the pixel boundary layer.

[0008] Optionally, multiple light-transmitting openings may be provided.

[0009] In one specific embodiment of the first aspect of this disclosure, the light-transmitting protective layer is a transparent conductive layer, the isolation structure includes a conductive structure, and the light-transmitting protective layer is electrically connected to the isolation structure. Thus, the second electrode, the isolation structure, and the light-transmitting protective layer can constitute a common electrode to reduce the voltage drop generated on the second electrode when driving the light-emitting device.

[0010] In one specific embodiment of the first aspect of this disclosure, the light-transmitting protective layer covers at least a portion of the side surface connections of the isolation structure. Thus, the light-transmitting protective layer can be fabricated after the isolation structure is fabricated, preventing damage to the light-transmitting protective layer from the etching process used to fabricate the isolation structure, thereby ensuring the protective effect of the light-transmitting protective layer.

[0011] In one specific embodiment of the first aspect of this disclosure, the isolation structure includes a support portion and a crown portion stacked on a substrate, the support portion being located between the crown portion and the substrate, the surface of the support portion facing away from the substrate being projected onto the substrate, and the crown portion being projected onto the substrate.

[0012] In one specific embodiment of the first aspect of this disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on a substrate. The light-emitting functional layer and the second electrode are located in corresponding isolation openings. The support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion.

[0013] In one specific embodiment of the first aspect of this disclosure, the isolation structure further includes a bottom located on the side of the support portion away from the crown portion. The orthographic projection of the bottom portion onto the substrate lies within the orthographic projection of the crown portion onto the substrate, and the orthographic projection of the support portion onto the substrate lies within the orthographic projection of the bottom portion onto the substrate. Optionally, the second electrode is connected to a region on the surface of the bottom portion away from the substrate that is not covered by the support portion. Corresponding to the side surface of the support portion, the second electrode is more easily deposited on the bottom portion, thereby reducing the impedance at the connection between the second electrode and the isolation structure.

[0014] In one specific embodiment of the first aspect of this disclosure, the edge portion of the light-transmitting protective layer covers at least a portion of the area on the bottom surface facing away from the substrate that is not covered by the support portion. Corresponding to the side surface of the support portion, the light-transmitting protective layer is more easily deposited on the bottom, thereby reducing the impedance at the connection between the light-transmitting protective layer and the isolation structure.

[0015] In one specific embodiment of the first aspect of this disclosure, the edge portion of the light-transmitting protective layer is located between the support portion and the pixel defining layer. Thus, the light-transmitting protective layer is formed prior to the isolation structure, allowing the light-transmitting protective layer to protect the pixel defining layer during the process of fabricating the isolation structure.

[0016] In one specific embodiment of the first aspect of this disclosure, the material of the light-transmitting protective layer includes at least one selected from indium tin oxide, indium gallium oxide, and indium zinc oxide. These materials simultaneously possess both electrical conductivity and light-transmitting properties.

[0017] In one specific embodiment of the first aspect of this disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on a substrate. The light-emitting functional layer and the second electrode are located in corresponding isolation openings. The isolation structure includes a conductive structure, and the second electrode is electrically connected to the isolation structure.

[0018] In one specific embodiment of the first aspect of this disclosure, the pixel defining layer includes a plurality of pixel openings corresponding to the isolation openings, and the pixel openings are connected to the corresponding isolation openings. The pixel openings are used to limit the light-emitting device and expose the first electrode, and the pixel openings correspond one-to-one with the isolation openings.

[0019] Optionally, the pixel defining layer is an inorganic film layer.

[0020] In one specific embodiment of the first aspect of this disclosure, the display panel may further include a first encapsulation layer, the first encapsulation layer being located on the side of the light-emitting device away from the substrate, and including a plurality of encapsulation units corresponding one-to-one with the isolation openings, the encapsulation units covering the corresponding isolation openings.

[0021] Optionally, the edge of the packaging unit extends to the side of the isolation structure (e.g., the crown included therein) away from the substrate, and the portion of the packaging unit located on the side of the isolation structure (e.g., the crown included therein) away from the substrate is spaced apart from the isolation structure (e.g., the crown included therein) to form a suspended portion.

[0022] In one specific embodiment of the first aspect of this disclosure, the display panel may further include a second encapsulation layer and a third encapsulation layer covering the first encapsulation layer, the isolation structure and the light-transmitting protective layer, wherein the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer, and the light-transmitting protective layer is located between the substrate and the second encapsulation layer.

[0023] Optionally, the first and third encapsulation layers are inorganic layers, and the second encapsulation layer is an organic layer;

[0024] Optionally, the second encapsulation layer is a planarization layer.

[0025] In one specific embodiment of the first aspect of this disclosure, the display panel may further include a display area, which includes a first area and a second area, the second area being located on at least one side of the first area, the light transmittance of the first area being greater than that of the second area, and the light-transmitting opening being located in the first area.

[0026] A second aspect of this disclosure provides a method for fabricating a display panel, the method comprising: providing a substrate; forming a pixel defining material film layer on one side of the substrate; forming an isolation structure and a light-transmitting protective layer on the side of the pixel defining material film layer opposite to the substrate, wherein the isolation structure has at least one light-transmitting opening and a plurality of isolation openings, and the light-transmitting protective layer is formed to cover at least a portion of the pixel defining material film layer exposed by the light-transmitting openings; performing a patterning process on the pixel defining material film layer to form a pixel defining layer; and forming a light-emitting device in the isolation openings.

[0027] In the above preparation method, in the process of batch preparation of light-emitting devices through isolation structure, the light-transmitting protective layer can not only ensure the light transmission in the area where the light-transmitting opening is located, but also protect the pixel boundary layer in the process of preparing the light-emitting device, thereby ensuring the protection effect of the pixel boundary layer.

[0028] In one specific embodiment of the second aspect of this disclosure, before forming the pixel defining material film layer, a plurality of first electrodes are formed on a substrate; a pixel defining material film layer is formed on the substrate, the pixel defining material film layer covering the first electrodes, and an isolation structure and a light-transmitting protective layer are formed on the side of the pixel defining material film layer facing away from the substrate; the pixel defining material film layer is patterned to form pixel openings corresponding to the isolation openings, and the first electrodes are at least partially exposed through the corresponding isolation openings, thus forming the pixel defining material film layer as a pixel defining layer; after forming the isolation structure and the light-transmitting protective layer, a light-emitting functional material layer and a conductive material layer are sequentially deposited to cover the isolation structure, the isolation openings, and the light-transmitting openings; on the back of the conductive material layer... An encapsulation material layer is formed on one side away from the substrate. Then, a patterning process is performed on the light-emitting functional material layer, the conductive material layer, and the encapsulation material layer to remove the light-transmitting opening and the light-emitting functional material layer, the conductive material layer, and the encapsulation material layer corresponding to some of the isolation openings. The remaining light-emitting functional material layer located in the isolation opening forms the light-emitting functional layer, the remaining conductive material layer forms the second electrode, and the remaining encapsulation material layer forms the encapsulation unit. The first electrode, the light-emitting functional layer in the corresponding isolation opening, and the second electrode constitute the light-emitting device. The above process of preparing the light-emitting functional layer, the second electrode, and the encapsulation unit is repeated until a light-emitting device and an encapsulation unit are formed at each isolation opening. All the encapsulation units constitute the first encapsulation layer.

[0029] In one specific embodiment of the second aspect of this disclosure, the step of forming an isolation structure and a light-transmitting protective layer on the side of the pixel-defining material film layer facing away from the substrate may include: forming an isolation structure on the pixel-defining material film layer; depositing a light-transmitting protective material film layer to cover the isolation structure, the isolation opening, and the light-transmitting opening; and performing a patterning process on the protective material film layer to form a light-transmitting protective layer; or,

[0030] A light-transmitting protective material film is deposited at the light-transmitting opening to form a light-transmitting protective layer.

[0031] In another specific embodiment of the second aspect of this disclosure, the step of forming an isolation structure and a light-transmitting protective layer on the side of the pixel defining material film layer away from the substrate may include: depositing a light-transmitting protective material film layer to cover the pixel defining material film layer, and performing a patterning process on the protective material film layer to form a light-transmitting protective layer; forming an isolation structure on the pixel defining material film layer on which the light-transmitting protective layer is formed.

[0032] A third aspect of this disclosure provides a display device comprising the display panel described in the first aspect above, or a display panel obtained by the preparation method described in the second aspect above. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the planar structure of a display panel provided in one embodiment of the present disclosure.

[0034] Figure 2 for Figure 1 An enlarged view of area S1 of the display panel shown.

[0035] Figure 3A for Figure 2 The diagram shows a cross-sectional view of the display panel along M1-N1 in one design.

[0036] Figure 3B for Figure 2 The diagram shows a cross-sectional view of the display panel along M2-N2.

[0037] Figure 4 for Figure 2 The diagram shows a cross-sectional view of the display panel along M1-N1 in another design.

[0038] Figure 5 for Figure 2 The diagram shows a cross-sectional view of the display panel along M1-N1 in another design.

[0039] Figure 6 for Figure 2 The diagram shows a cross-sectional view of the display panel along M1-N1 in another design.

[0040] Figure 7 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0041] Figures 8A to 8H for Figure 3A The diagram shows the process of fabricating the display panel.

[0042] Figures 9A to 9B for Figure 4The diagram shows the process of fabricating the display panel.

[0043] Explanation of reference numerals in the attached figures:

[0044] 10-Display panel; 11-Display area; 12-Border area; 100-Substrate; 210-Isolation structure; 201-Light-transmitting opening; 202-Isolation opening; 203-Pixel opening; 211-Support portion; 212-Crown portion; 213-Pixel defining layer; 213a-Pixel defining material layer; 220-Light-emitting device; 221-First electrode; 222-Second electrode; 223-Light-emitting functional layer; 2231-First functional layer; 2232-Light-emitting layer; 2233-Second functional layer; 214-Bottom; 300-Encapsulation structure; 310-First encapsulation layer; 310a-Encapsulation material film layer; 320-Second encapsulation layer; 330-Third encapsulation layer; 400-Light-transmitting protective layer; 500-Photoresist pattern. Detailed Implementation

[0045] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this specification.

[0046] In display products, some functional film layers in light-emitting devices are formed by vapor deposition. Each light-emitting device has multiple functional film layers, and the materials of some functional film layers (such as the light-emitting layer) in light-emitting devices that emit different light are different. Therefore, when vapor-depositing these functional film layers through a mask (such as a fine mask), multiple alignments are required. In order to solve the positional offset problem caused by alignment accuracy errors, sufficient space (safety margin related to alignment error) needs to be reserved between different light-emitting devices to ensure that the actual light-emitting area of ​​the light-emitting device can have a certain overlap with the designed position (design area). This is equivalent to compressing the designed area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting devices from being further increased, thus making it difficult to further improve the PPI (pixel density) of the display panel.

[0047] In this disclosure, by providing an isolation structure at the gap between the light-emitting devices (hereinafter referred to as light-emitting units), the functional film layers of adjacent light-emitting devices are separated. Thus, in the evaporation process of the functional film layers, only the entire display panel needs to be evaporated, without the need to individually prepare the functional film layer for each light-emitting device using a mask. This process does not require consideration of alignment accuracy during evaporation, thereby allowing for a smaller gap design between the light-emitting devices to increase the PPI (the principle of which can be found in the following section). Figures 8A to 8H (Related descriptions in the relevant embodiments).

[0048] In some application scenarios, display panels need to have functions such as transparent display and under-display recognition (fingerprint recognition, under-display camera, infrared sensing) based on application requirements. In this case, light-transmitting areas are divided in the display panel, and light-transmitting holes are set at the gaps between the sub-pixels in the light-transmitting areas to achieve light transmission. However, in the area where the light-transmitting holes are located, due to the requirements of light transmittance, structures that block light or have low light transmittance are removed. However, this will cause the film layer under these structures to lose protection and be etched and damaged during the fabrication process of the light-emitting device.

[0049] At least one embodiment of this disclosure provides a display panel, a method for manufacturing the same, and a display device to at least solve the aforementioned technical problems. The display panel includes a substrate and an isolation structure, a pixel defining layer, a light-transmitting protective layer, and a plurality of light-emitting devices located on the substrate. The isolation structure defines at least one light-transmitting opening and a plurality of isolation openings, which are used to limit the light-emitting devices. The isolation structure includes a support portion and a crown portion stacked sequentially on the substrate. The pixel defining layer is located between the isolation structure and the substrate, and the orthographic projection of the light-transmitting opening on the substrate lies within the orthographic projection of the pixel defining layer on the substrate. The light-transmitting protective layer is located on the side of the pixel defining layer facing away from the substrate and covers at least the portion of the pixel defining layer exposed by the light-transmitting opening. In the process of batch manufacturing the light-emitting devices using the isolation structure, multiple etching processes are performed. Thus, at the light-transmitting opening, the etching process etches the pixel defining layer exposed by the light-transmitting opening, thereby destroying the protective effect of the pixel defining layer on the substrate and the structure of the light-emitting devices (e.g., the first electrode described below). In the above process, the light-transmitting protective layer not only ensures the light transmission in the area where the light-transmitting opening is located, but also protects the pixel boundary layer in the process of preparing the light-emitting device, thereby ensuring the protective effect of the pixel boundary layer.

[0050] The structure of a display panel according to at least one embodiment of the present disclosure will now be described in detail with reference to the accompanying drawings. Furthermore, in these drawings, a spatial Cartesian coordinate system is established with the substrate in the display panel as a reference to visually represent the positional relationships of the various components in the display panel. In this spatial Cartesian coordinate system, the X-axis and Y-axis are parallel to the plane of the substrate, and the Z-axis is perpendicular to the plane of the substrate.

[0051] like Figure 1 , Figure 2 , Figure 3A and Figure 3B As shown, the display panel 10 includes a display area 11 and a non-display area 12 surrounding the display area 11. The display area 11 includes a first region 13, in which sub-pixels emitting different colors of light, such as R, G, and B, are arranged. A light-transmitting opening 201 is provided in the first region 13, which gives the first region 13 a certain light transmittance for under-display recognition, imaging, infrared sensing, or transparent display. It should be noted that in some embodiments of this disclosure, some traces in the non-display area 12 can be arranged in the display area 11, thereby allowing the non-display area 12 to be designed as a single-sided bezel.

[0052] For example, the physical structure of the display panel 10 includes a substrate 100 and an isolation structure 210, a pixel defining layer 213, a light-transmitting protective layer 400 and a plurality of light-emitting devices 220 located on the substrate 100. The light-emitting devices 220 are physical light-emitting structures of sub-pixels such as R, G and B.

[0053] For example, the isolation structure 210 defines at least one light-transmitting opening 201 and a plurality of isolation openings 202. The isolation openings 202 are used to limit the light-emitting devices 220. The light-transmitting openings 201 are arranged in the first region 13 and located between the light-emitting devices 220, that is, light-transmitting openings 201 for light transmission are provided at the gaps between the light-emitting devices 220. The application of the isolation structure 210 eliminates the need for a fine mask in the fabrication process of the light-emitting devices 220, thus eliminating the need to consider the alignment accuracy of the fabrication process. This helps to reduce the gap size of the light-emitting devices 220, thereby improving the pixel PPI of the display panel 10 (this principle can be found in [reference needed]). Figures 8A to 8H (See the relevant description in the illustrated embodiment); In addition, in the first region 13, by providing a light-transmitting opening 201 in the isolation structure 210, the area of ​​the display panel 10 with the light-transmitting opening 201 can transmit light, so that the first region 13 of the display panel 10 can realize transparent display or under-screen recognition functions such as fingerprint recognition, under-screen camera, infrared sensing, etc.

[0054] For example, the pixel defining layer 213 is located between the isolation structure 210 and the substrate 100, and the orthographic projection of the light-transmitting opening 201 on the substrate 100 is located within the orthographic projection of the pixel defining layer 213 on the substrate 100. The light-transmitting protective layer 400 is located on the side of the pixel defining layer 213 away from the substrate 100 and covers at least a portion of the pixel defining layer 213 exposed by the light-transmitting opening 201.

[0055] In the process of batch fabricating the light-emitting device 220 through the isolation structure 210, multiple etching processes are performed. Thus, at the light-transmitting opening 201, the etching process etches the pixel defining layer 213 exposed by the light-transmitting opening 201, thereby destroying the protective effect of the pixel defining layer 213 on the substrate 100 and the structure of the light-emitting device 220 (e.g., the first electrode 221 described below). In the above process, the light-transmitting protective layer 400 not only ensures light transmission in the area where the light-transmitting opening 201 is located, but also protects the pixel defining layer 213 during the fabrication of the light-emitting device 220, thereby ensuring the protective effect of the pixel defining layer 213.

[0056] It should be noted that the composition and preparation of the isolation structure 210 (which may be referred to as a partition structure or isolation column) can also be found in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN20 The relevant explanations in 24 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A will not be repeated here.

[0057] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the light-emitting device 220 includes a first electrode 221, a second electrode 222, and a light-emitting functional layer 223 sequentially stacked on the substrate 100. The light-emitting functional layer 223 and the second electrode 222 are located in corresponding isolation openings 202. For example, the first electrode 221 can be configured as an anode, and the second electrode 222 can be configured as a cathode.

[0058] For example, the light-emitting functional layer 223 may include a first common layer 2231, a light-emitting layer 2232, and a second common layer 2233 stacked sequentially, with the first common layer 2231, light-emitting layer 2232, and second common layer 2233 stacked sequentially on the first electrode 221. The first common layer 2231 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second common layer 2233 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. The isolation structure 210 needs to ensure that the first common layer 2231 (the main film layer causing current crosstalk) of each light-emitting device 220 is electrically disconnected from each other.

[0059] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the isolation structure 210 includes a support portion 211 and a crown portion 212 stacked on the substrate 100. The support portion 211 is located between the crown portion 212 and the substrate 100. The support portion 211 is opposite to the orthographic projection of the surface of the substrate 100 onto the substrate 100, and is located within the orthographic projection of the crown portion 212 onto the substrate 100. That is, the edge of the crown portion 212 extends beyond the edge of the support portion 211. In this way, when depositing film layers (e.g., light-emitting functional layer 223 and second electrode 222) in the light-emitting device, the crown portion 212 can limit the deposition range of these film layers, so that while some film layers (e.g., the light-emitting functional layer described below) are isolated by the isolation structure 210, other film layers (e.g., the second electrode 222) are connected to the isolation structure 210.

[0060] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the light-transmitting protective layer 400 covers the entire pixel defining layer 213 exposed by the light-transmitting opening 201, thereby improving the protective effect of the light-transmitting protective layer 400 on the underlying film layer of the light-transmitting opening 201.

[0061] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the edge portion of the light-transmitting protective layer 400 is connected to the isolation structure 210. Thus, there is no gap between the light-transmitting protective layer 400 and the isolation structure 210, and the light-transmitting protective layer 400 and the isolation structure 210 can jointly protect the pixel defining layer 213, thereby improving the protection effect on the pixel defining layer 213.

[0062] In at least one embodiment of this disclosure, the number of light-transmitting openings 201 is not limited and can be designed according to actual needs. For example, there may be one light-transmitting opening 201; or, there may be multiple light-transmitting openings 201, as detailed below. Figure 2 and Figure 3A As shown.

[0063] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the support portion 211 is a conductive structure, and the second electrode 222 is connected to the side surface of the support portion 211. In this way, the second electrodes 222 of each light-emitting device 220 are connected together through the support portion 211 to form a common electrode, and the support portion 211 is not limited by thickness, thereby reducing the impedance of the common electrode.

[0064] It should be noted that the material of the second electrode 222 can be a metallic material. The smaller the thickness of the second electrode 222, the higher its light transmittance, but its resistivity is also higher. If the thickness of the second electrode 222 is too small, without the isolation structure 210, the voltage drop of the second electrode 222 (which is the common electrode at this time) will be too large. In the embodiments of this disclosure, the second electrode 222 is connected to the conductive support portion 211, which can remove the thickness limitation of the second electrode 222, thereby allowing the second electrode 222 to have a smaller thickness and higher light transmittance.

[0065] In at least one embodiment of this disclosure, the support portion 211 can be a metal conductive structure. Metal materials have high conductivity, which can reduce the voltage drop when driving the cathode. Correspondingly, metal materials can only transmit light when they are extremely thin (e.g., on the order of tens of nanometers). The isolation structure 210 requires a certain thickness to block the light-emitting functional layer 223 (which includes the first common layer 2231). Accordingly, the support portion 211 in the isolation structure 210 is almost opaque. Therefore, the isolation structure 210 can only be made transparent by providing the light-transmitting opening 201.

[0066] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the light-transmitting protective layer 400 is a transparent conductive layer, and the isolation structure 210 includes a conductive structure (such as the support portion 211 described above), and the light-transmitting protective layer 400 is electrically connected to the isolation structure 210. Thus, the second electrodes 222 of each light-emitting device 220 are connected together through the support portion 211 to form a common electrode, and the support portion 211 is not limited by thickness, thereby reducing the impedance of the common electrode. The second electrodes 222 of each light-emitting device 220 are connected together through the isolation structure 210 and the light-transmitting protective layer 400 to form a common electrode, and the support portion 211 is not limited by thickness, thereby reducing the impedance of the common electrode and reducing the voltage drop generated on the second electrode 222 when driving the light-emitting device 220.

[0067] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the light-transmitting protective layer 400 covers at least a portion of the side surface of the isolation structure 210. For example, the edge portion of the light-transmitting protective layer 400 is connected to the side surface of the support portion 211. The isolation structure 210 can be formed using an etching process. In this embodiment, the light-transmitting protective layer 400 can be formed after the isolation structure 210 is formed, so that the light-transmitting protective layer 400 will not be damaged by the etching process used to form the isolation structure 210, thereby ensuring the protective effect of the light-transmitting protective layer 400.

[0068] In at least one embodiment of this disclosure, such as Figure 4As shown, the edge portion of the light-transmitting protective layer 400 is located between the support portion 211 and the pixel defining layer 213. Thus, the light-transmitting protective layer 400 is formed before the isolation structure 210, thereby allowing the light-transmitting protective layer 400 to protect the pixel defining layer 213 during the process of fabricating the isolation structure 210.

[0069] In at least one embodiment of this disclosure, such as Figure 5 As shown, the isolation structure 210 also includes a bottom 214, which is located on the side of the support portion 211 opposite to the crown portion 212. The orthographic projection of the bottom 214 on the substrate 100 lies within the orthographic projection of the crown portion 212 on the substrate 100, and the orthographic projection of the support portion 211 on the substrate 100 lies within the orthographic projection of the bottom 214 on the substrate 100. For example, the second electrode 222 is connected to the area of ​​the bottom 214 on the surface opposite to the substrate 100 that is not covered by the support portion 211. For example, the bottom 214 is a conductive structure, so that the second electrode 222 is more easily deposited on the bottom 214 than on the side surface of the support portion 211, thereby reducing the impedance at the connection between the second electrode 222 and the isolation structure 210.

[0070] For example, the crown 212, the support 211, and the bottom 214 can be made of titanium, aluminum, and molybdenum in sequence, with the corrosion resistance of titanium, molybdenum, and aluminum decreasing in that order, thus forming a structure like... Figure 5 The isolation structure 210 shown.

[0071] In some embodiments of this disclosure, such as Figure 5 As shown, when the isolation structure 210 is fabricated first and then the light-transmitting protective layer 400 is fabricated, the edge portion of the light-transmitting protective layer 400 covers at least a portion of the area of ​​the bottom 214 facing away from the substrate 100 that is not covered by the support portion 211. Corresponding to the side surface of the support portion 211, the light-transmitting protective layer 400 is more easily deposited on the bottom 214, thereby reducing the impedance at the connection between the light-transmitting protective layer 400 and the isolation structure 210.

[0072] In some other embodiments of this disclosure, where the light-transmitting protective layer 400 is formed before the isolation structure 210, the edge portion of the light-transmitting protective layer 400 is located between the bottom 214 and the pixel defining layer 213 to connect with the bottom 214.

[0073] In some embodiments of this disclosure, the material of the light-transmitting protective layer 400 includes at least one of indium tin oxide, indium gallium oxide, and indium zinc oxide. These materials possess both electrical conductivity and light-transmitting properties.

[0074] In at least one embodiment of this disclosure, such as Figure 5As shown, the pixel defining layer 213 includes a plurality of pixel openings 203 corresponding to the isolation opening 202, and the pixel openings 203 are connected to the corresponding isolation openings 202. The pixel openings 203 are used to limit the light-emitting device 220 and expose the first electrode 221, and the pixel openings 203 correspond to the isolation openings 202.

[0075] In at least one embodiment of this disclosure, the pixel defining layer 213 is an inorganic film layer. In the process of fabricating the light-emitting device 220 based on the isolation structure 210, the pixel defining layer 213 does not need to be thick enough to accommodate the light-emitting device 220, which is beneficial for the thinner design of the display panel. In addition, as an inorganic film layer, the pixel defining layer 213 can have a high bonding strength with the isolation structure 210 and the first electrode 221, thereby reducing the risk of the isolation structure 210 and the first electrode 221 falling off. Furthermore, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the encapsulation effect of the display panel. Moreover, when the pixel defining layer 213 is an inorganic layer, it can have a smaller thickness, thereby reducing the discontinuity at the edge of the pixel opening 203, improving the film continuity of the second electrode 222 at that location, reducing the impedance of the second electrode 222, and thus ensuring the display effect of the display panel.

[0076] In at least one embodiment of this disclosure, such as Figure 6 As shown, the display panel may further include an encapsulation structure 300, which may include a first encapsulation layer 310. The first encapsulation layer 310 is located on the side of the light-emitting device 220 away from the substrate 100 and includes multiple encapsulation units corresponding to the isolation openings 202. The encapsulation units cover the corresponding isolation openings 202. The light-emitting devices 220 are prepared in batches based on different emission colors. The encapsulation units are used to protect the light-emitting devices 220 during the manufacturing process; therefore, the encapsulation units are also prepared in batches.

[0077] For example, such as Figure 6 As shown, the edge of the encapsulation unit extends to the side of the isolation structure 210 (e.g., its crown 212) facing away from the substrate 100, and the portion of the encapsulation unit located on the side of the isolation structure 210 (e.g., its crown 212) facing away from the substrate 100 is spaced from the isolation structure 210 (e.g., its crown 212) to form a suspended portion. The reason for forming the suspended portion is related to the process of fabricating the light-emitting device 200 based on the isolation structure 210, which can be specifically referred to in the following section on... Figures 8A to 8H The relevant descriptions in the illustrated embodiments will not be repeated here.

[0078] In at least one embodiment of this disclosure, such as Figure 6As shown, the encapsulation structure 300 may further include a second encapsulation layer 320 and a third encapsulation layer 330 covering the first encapsulation layer 310, the isolation structure 210, and the light-transmitting protective layer 400. The second encapsulation layer 320 is located between the first encapsulation layer 310 and the third encapsulation layer 330, and the light-transmitting protective layer 400 is located between the substrate 100 and the second encapsulation layer 320. For example, the first encapsulation layer 310 and the third encapsulation layer 330 are inorganic layers with high density to isolate water and oxygen, while the second encapsulation layer 320 is an organic layer to serve as a planarization layer, thus having a larger thickness to planarize the surface of the display panel, so as to facilitate the fabrication of functional structures such as touch structures, optical films, and cover plates on the encapsulation layer 300.

[0079] It should be noted that, in the embodiments disclosed herein, the design area of ​​the first region is not limited, and can be designed according to the actual process requirements and the application scenario of the display panel.

[0080] For example, in some embodiments of this disclosure, the entire display area can be designed as a first region 13. Under this design, the display panel can be used in scenarios such as transparent displays.

[0081] For example, see other embodiments of this disclosure. Figure 1 The display area also includes a second area (the area within the display area 11 and outside the first area 13). The second area is located on at least one side of the first area 13, and the light-transmitting opening 201 is located in the first area. The light transmittance of the first area is greater than that of the second area. For example, the first area 13 is a light-transmitting area, and the second area is a non-light-transmitting area. With this design, the display panel can be used in scenarios such as fingerprint recognition or under-display camera.

[0082] In at least one embodiment of this disclosure, such as Figure 6 As shown, the substrate 100 may include a substrate and a driving circuit layer located on the substrate. The driving circuit layer includes multiple pixel driving circuits located in the display area, and the display functional layer is located on the side of the driving circuit layer away from the substrate. For example, the pixel driving circuit may include multiple transistors (TFTs), capacitors, etc., and may be formed in various forms such as 2T1C (i.e., 2 transistors (TFTs) and 1 capacitor (C)), 3T1C, or 7T1C. The pixel driving circuit is connected to the light-emitting device 220 in the display functional layer to control the switching state and brightness of the light-emitting device 200.

[0083] At least one embodiment of this disclosure provides a method for manufacturing a display panel, such as... Figure 7 As shown, the specific process of this preparation method can be found in steps S110 to S140 below.

[0084] S110 provides a substrate.

[0085] For example, based on step S110, multiple first electrodes can be further formed on the substrate.

[0086] S120, a pixel defining material film is formed on one side of the substrate.

[0087] For example, a pixel defining material film is formed on one side of the substrate, and the pixel defining material film can cover the first electrode.

[0088] S130, an isolation structure and a light-transmitting protective layer are formed on the side of the pixel defining material film layer away from the substrate, wherein the isolation structure has at least one light-transmitting opening and a plurality of isolation openings, and the light-transmitting protective layer is formed to cover at least a portion of the pixel defining material film layer exposed by the light-transmitting opening.

[0089] For example, the isolation opening corresponds to the first electrode.

[0090] For example, the isolation structure includes a support portion and a crown portion stacked sequentially on a substrate.

[0091] S140, a patterning process is performed on the pixel defining material film to form a pixel defining layer.

[0092] S150, a light-emitting device is formed in the isolation opening.

[0093] In the fabrication method described in steps S110 to S150 above, during the batch fabrication of light-emitting devices using an isolation structure, the light-transmitting protective layer not only ensures light transmission in the area where the light-transmitting opening is located, but also protects the pixel boundary layer during the fabrication of the light-emitting devices, thereby ensuring the protective effect of the pixel boundary layer. The structure of the display panel obtained by this fabrication method can be as follows: Figure 3A or Figure 3B As shown, the specific process steps can be found in the following section. Figures 8A to 8H The relevant descriptions in the illustrated embodiments will not be repeated here.

[0094] In the above process steps S110 to S150, the preparation method for forming the light-emitting device, the isolation structure, the light-transmitting protective layer and the pixel defining layer may also include the following process steps S210 to S260.

[0095] S210, before forming the pixel defining layer, a plurality of spaced first electrodes are formed on the substrate.

[0096] S220, a pixel defining material film is formed on the substrate, the pixel defining material film covers the first electrode, and an isolation structure and a light-transmitting protective layer are formed on the side of the pixel defining material film away from the substrate.

[0097] S230, a patterning process is performed on the pixel defining material film to form pixel openings corresponding to the isolation openings respectively, and the first electrode is exposed at least partially through the corresponding isolation opening, that is, the pixel defining material film is formed into a pixel defining layer.

[0098] S240, after forming the isolation structure and the light-transmitting protective layer, sequentially deposits a light-emitting functional material layer and a conductive material layer to cover the isolation structure, the isolation opening and the light-transmitting opening.

[0099] S250, an encapsulation material layer is formed on the side of the conductive material layer away from the substrate. Then, a patterning process is performed on the light-emitting functional material layer, the conductive material layer, and the encapsulation material layer to remove the light-transmitting opening and the light-emitting functional material layer, the conductive material layer, and the encapsulation material layer corresponding to part of the isolation opening. The remaining light-emitting functional material layer located in the isolation opening forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, and the remaining encapsulation material layer forms an encapsulation unit. The first electrode, the light-emitting functional layer in the corresponding isolation opening, and the second electrode constitute a light-emitting device.

[0100] S260, repeat the above process of preparing the light-emitting functional layer, the second electrode and the packaging unit until a light-emitting device and a packaging unit are formed at each isolation opening, wherein all the packaging units constitute the first packaging layer.

[0101] For example, in one example, step S130 may include: forming an isolation structure on a pixel-defining material film layer; depositing a light-transmitting protective material film layer to cover the isolation structure, the isolation opening, and the light-transmitting opening; and performing a patterning process on the protective material film layer to form a light-transmitting protective layer. The structure of the display panel obtained by this fabrication method can be as follows: Figure 3A or Figure 3B As shown, details will not be repeated here. Alternatively, in other embodiments, a light-transmitting protective material film is deposited directly at the light-transmitting opening to form a light-transmitting protective layer.

[0102] For example, in another example, step S130 may include: depositing a light-transmitting protective material film layer to cover the pixel-defining material film layer, and performing a patterning process on the protective material film layer to form a light-transmitting protective layer; forming an isolation structure on the pixel-defining material film layer on which the light-transmitting protective layer is formed. The structure of the display panel obtained by this fabrication method can be as follows: Figure 4 As shown, it will not be elaborated upon here.

[0103] Below, in conjunction with Figures 8A to 8H right Figure 3A The fabrication process of the display panel shown is described to visually demonstrate the principle that the isolation structure can increase the pixel density (PPI) and that the light-transmitting protective layer 400 can protect the pixel defining layer 213.

[0104] like Figure 8A As shown, a substrate 100 is provided and a first electrode 221 arranged in an array is formed on the substrate 100; a pixel defining material film layer 213a (e.g., an inorganic material film layer) is deposited on the substrate 100 on which the first electrode is formed.

[0105] like Figure 8B As shown, an isolation structure 210 is formed on the pixel defining material film layer 213a. The isolation structure 210 includes a support portion 211 and a crown portion 212, which surround a light-transmitting opening 201 and an isolation opening 202.

[0106] like Figure 8C As shown, a protective film layer is deposited covering the isolation structure 210, the light-transmitting opening 201 and the isolation opening 202 and patterned to form a light-transmitting protective layer 400. The light-transmitting protective layer 400 covers the light-transmitting opening 201 and the edge of the light-transmitting protective layer 400 extends to the side surface of the support portion 211.

[0107] In embodiments of this disclosure, the patterning process can be a photolithography patterning process, which may include, for example, coating a structural layer to be patterned with photoresist, exposing the photoresist using a photomask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern 500 described below) includes photoresist, the structural layer can be directly exposed using a photomask to form the desired pattern.

[0108] like Figure 8D As shown, a patterning process is performed on the pixel defining material film layer 213a to form a pixel defining layer 213 (the planar shape is a grid). The pixel defining layer 213 includes a pixel opening 203 and covers the gap between adjacent first electrodes. Thus, the planar shape of the pixel defining layer 213 is a grid.

[0109] In such Figure 8D In the patterning process shown, the light-transmitting protective layer 400 can protect the portion of the pixel defining layer 213 located at the light-transmitting opening 201 to prevent the pixel defining layer 213 at that location from being etched.

[0110] like Figure 8EAs shown, a light-emitting functional material layer and a conductive material layer are vapor-deposited on the substrate 100, covering the isolation structure 210, the light-transmitting opening 201, and the isolation opening 202. The portions of the light-emitting functional material layer located at the isolation opening 202 and the light-transmitting opening 201 form the light-emitting functional layer, and the portions of the conductive material layer located at the isolation opening 202 and the light-transmitting opening 201 form the second electrode. Thus, a light-emitting device 220 is formed in each isolation opening 202 of the isolation structure 210. No fine mask is used in this vapor deposition process, so the vapor-deposited material is also deposited on the crown 212. For example, the vapor-deposited light-emitting functional layer can emit red light (R). That is, in this stage, a light-emitting device 220 emitting red light is formed in each light-transmitting opening 201 and the isolation opening 202 of the isolation structure 210. It should be noted that the light-emitting device 220 at the light-transmitting opening 201 lacks a first electrode.

[0111] like Figure 8E As shown, an encapsulation material layer 310a is deposited to cover the light-emitting device 220, and the encapsulation material layer 310a covers the entire display area at this stage.

[0112] like Figure 8F As shown, a photoresist is formed (e.g., coated) on the encapsulation material layer 310a, and then a patterning process is performed on it to form a photoresist pattern 500. The photoresist pattern 500 only covers a portion of the isolation opening 202 of the isolation structure 210 (the isolation opening 202 where the light-emitting device R of the finished display panel is located).

[0113] like Figure 8G As shown, the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the encapsulation material layer 310a, the second electrode, and the light-emitting functional layer that are not covered by the photoresist pattern 700; then the remaining photoresist pattern 500 is removed.

[0114] In such Figure 8G In the etching process shown, the structure at the light-transmitting opening 201 is etched, and the light-transmitting protective layer 400 can block the etching to protect the pixel defining layer 213 below.

[0115] like Figure 8H As shown, the above steps are repeated to form light-emitting devices 220 that emit green light (G) and blue light (not shown) in other isolation openings 202, respectively.

[0116] It should be noted that the fabrication order of the light-emitting devices 220 that emit red, green, and blue light can be designed according to actual needs, and the embodiments in this announcement do not limit this.

[0117] It should be noted that in some embodiments of this disclosure, some film layers in the light-emitting functional layer, such as the light-emitting layer, can be prepared using non-evaporation methods, such as inkjet printing. The specific method can be selected based on the material of these film layers. For example, if these film layers are made of polymer materials and evaporation is not applicable, inkjet printing can be used to prepare them.

[0118] In other embodiments of this disclosure, the above-described... Figure 8B and Figure 8C The order of the preparation process, so as to obtain such Figure 4 The display panel shown can be found in the attached image. Figure 9A and Figure 9B The process steps are shown.

[0119] like Figure 9A As shown, after obtaining as Figure 8A Following the structure shown, a protective film layer of pixel-defining material 213a is deposited and patterned to form a light-transmitting protective layer 400.

[0120] like Figure 9A As shown, an isolation structure 210 is formed on the pixel defining material film layer 213a and the light-transmitting protective layer 400. The isolation structure 210 includes a support portion 211 and a crown portion 212. The support portion 211 and the crown portion 212 surround a light-transmitting opening 201 and an isolation opening 202. The edge portion of the light-transmitting protective layer 400 is located between the support portion 211 and the pixel defining material film layer 213a.

[0121] At least one embodiment of this disclosure provides a display device that may include the display panel described in the above embodiments. Furthermore, when the first region is a recognition region, the display device may include a recognition device whose orthographic projection on the substrate at least partially overlaps with the first region.

[0122] For example, in some embodiments of this disclosure, the identification device includes at least one fingerprint sensor. For instance, the fingerprint sensor may be disposed on the side of the substrate opposite to the display functional layer, or it may be disposed within the substrate.

[0123] For example, in some other embodiments of this disclosure, the identification device may be a camera located on the side of the substrate away from the display functional layer.

[0124] For example, in embodiments of this disclosure, the display device can be any product or component with display functionality, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator.

[0125] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0126] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

[0127] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications or equivalent substitutions made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on the substrate and defines at least one light-transmitting opening and a plurality of isolation openings, wherein the orthographic projection of the light-transmitting opening on the substrate and the orthographic projection of the isolation opening on the substrate do not overlap, wherein the isolation opening is used to limit light-emitting devices, the light-emitting devices include a plurality of light-emitting devices, and the light-transmitting opening is located between two partially adjacent light-emitting devices; A pixel defining layer is located between the isolation structure and the substrate, and the orthographic projection of the light-transmitting opening on the substrate lies within the orthographic projection of the pixel defining layer on the substrate; and A light-transmitting protective layer is located on the side of the pixel defining layer opposite to the substrate and covers at least a portion of the pixel defining layer exposed by the light-transmitting opening; In the first embodiment, the light-transmitting protective layer is located between the isolation structure and the pixel defining layer; or, in the second embodiment, the light-transmitting protective layer covers at least a portion of the side surface of the isolation structure.

2. The display panel according to claim 1, characterized in that, The light-transmitting protective layer covers the entire pixel-defining layer exposed by the light-transmitting opening.

3. The display panel according to claim 2, characterized in that, The edge portion of the light-transmitting protective layer is connected to the isolation structure.

4. The display panel according to claim 2, characterized in that, The light-transmitting openings are provided in multiple ways.

5. The display panel according to claim 1, characterized in that, The light-transmitting protective layer is a transparent conductive layer, the isolation structure includes a conductive structure, and the light-transmitting protective layer is electrically connected to the isolation structure.

6. The display panel according to claim 1, characterized in that, In the second embodiment, the isolation structure includes a support portion and a crown portion stacked on the substrate, the support portion being located between the crown portion and the substrate, and The orthographic projection of the surface of the support portion away from the substrate onto the substrate is located within the orthographic projection of the crown portion onto the substrate.

7. The display panel according to claim 6, characterized in that, The light-transmitting protective layer covers at least a portion of the side surface of the support.

8. The display panel according to claim 6, characterized in that, The isolation structure also includes a bottom, which is located on the side of the support portion opposite to the crown portion, and The orthographic projection of the bottom on the substrate lies within the orthographic projection of the crown on the substrate, and the orthographic projection of the support on the substrate lies within the orthographic projection of the bottom on the substrate.

9. The display panel according to claim 8, characterized in that, The edge portion of the light-transmitting protective layer covers at least a portion of the area on the bottom surface opposite to the substrate that is not covered by the support portion.

10. The display panel according to claim 6, characterized in that, The edge portion of the light-transmitting protective layer is located between the support portion and the pixel defining layer.

11. The display panel according to claim 1, characterized in that, The material of the light-transmitting protective layer includes at least one of indium tin oxide, indium gallium oxide, and indium zinc oxide.

12. The display panel according to claim 1, characterized in that, The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on the substrate, wherein the light-emitting functional layer and the second electrode are located in corresponding isolation openings. The isolation structure includes a conductive structure, and the second electrode is electrically connected to the isolation structure.

13. The display panel according to claim 12, characterized in that, The pixel defining layer includes a plurality of pixel openings corresponding to the isolation openings, and the pixel openings are connected to the corresponding isolation openings; The pixel opening limits the light-emitting device and exposes the first electrode.

14. The display panel according to claim 13, characterized in that, The pixel opening corresponds one-to-one with the isolation opening.

15. The display panel according to claim 13, characterized in that, The pixel defining layer is an inorganic film layer.

16. The display panel according to claim 1, characterized in that, It also includes a first encapsulation layer, wherein the first encapsulation layer is located on the side of the light-emitting device away from the substrate, and includes a plurality of encapsulation units corresponding one-to-one with the isolation openings, the encapsulation units covering the corresponding isolation openings.

17. The display panel according to claim 16, characterized in that, The edge of the packaging unit extends to the side of the isolation structure away from the substrate, and the portion of the packaging unit located on the side of the isolation structure away from the substrate is spaced apart from the isolation structure to form a suspended portion.

18. The display panel according to claim 16, characterized in that, It also includes a second encapsulation layer and a third encapsulation layer covering the first encapsulation layer, the isolation structure and the light-transmitting protective layer, wherein the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer, and the light-transmitting protective layer is located between the substrate and the second encapsulation layer.

19. The display panel according to claim 18, characterized in that, The first and third encapsulation layers are inorganic layers, while the second encapsulation layer is an organic layer.

20. The display panel according to any one of claims 1 to 19, characterized in that, It also includes a display area, wherein the display area comprises a first area and a second area, the second area is located on at least one side of the first area, the light transmittance of the first area is greater than that of the second area, and the light-transmitting opening is located in the first area.

21. A method for manufacturing a display panel, characterized in that, include: Provide substrate; A pixel defining material film layer is formed on one side of the substrate; An isolation structure and a light-transmitting protective layer are formed on the side of the pixel defining material film layer away from the substrate. The isolation structure has at least one light-transmitting opening and a plurality of isolation openings. The orthographic projection of the light-transmitting opening on the substrate and the orthographic projection of the isolation opening on the substrate do not overlap. The light-transmitting protective layer is formed to cover at least a portion of the pixel defining material film layer exposed by the light-transmitting opening. In the first embodiment, the light-transmitting protective layer is located between the isolation structure and the pixel defining material film layer; or, in the second embodiment, the light-transmitting protective layer covers at least a portion of the side surface of the isolation structure. The pixel defining material film is patterned to form a pixel defining layer; and A light-emitting device is formed in the isolation opening, the light-emitting device comprising a plurality of such devices, and the light-transmitting opening is located between two partially adjacent light-emitting devices.

22. The preparation method according to claim 21, characterized in that, Also includes: Before forming the pixel defining material film layer, a plurality of first electrodes are formed on the substrate; A pixel defining material film is formed on the substrate, the pixel defining material film covering the first electrode, and the isolation structure and the light-transmitting protective layer are formed on the side of the pixel defining material film facing away from the substrate; The step of patterning the pixel-defining material film to form a pixel-defining layer includes: The pixel defining material film is patterned to form pixel openings that correspond to the isolation openings respectively, and the first electrode is exposed at least partially through the corresponding isolation opening; The step of forming a light-emitting device in the isolation opening includes: A light-emitting functional material layer and a conductive material layer are sequentially deposited to cover the isolation structure, the isolation opening, and the light-transmitting opening; An encapsulation material layer is formed on the side of the conductive material layer facing away from the substrate. Then, a patterning process is performed on the light-emitting functional material layer, the conductive material layer, and the encapsulation material layer to remove the light-transmitting opening and part of the isolation opening corresponding to the light-emitting functional material layer, the conductive material layer, and the encapsulation material layer. The remaining light-emitting functional material layer located in the isolation opening forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, and the remaining encapsulation material layer forms an encapsulation unit. The first electrode, along with the corresponding light-emitting functional layer and the second electrode in the isolation opening, constitutes the light-emitting device. The above-described processes for preparing the light-emitting functional layer, the second electrode, and the packaging unit are repeated until the light-emitting device and the packaging unit are formed at each of the isolation openings, wherein all of the packaging units constitute the first packaging layer.

23. The preparation method according to claim 21, characterized in that, In the second embodiment, forming an isolation structure and a light-transmitting protective layer on the side of the pixel defining material film layer opposite to the substrate includes: The isolation structure is formed on the pixel defining material film layer; and A light-transmitting protective material film is deposited to cover the isolation structure, the isolation opening, and the light-transmitting opening, and the protective material film is patterned to form the light-transmitting protective layer; or, A light-transmitting protective material film is deposited at the light-transmitting opening to form the light-transmitting protective layer.

24. The preparation method according to claim 21, characterized in that, In the first embodiment, forming an isolation structure and a light-transmitting protective layer on the side of the pixel defining material film layer opposite to the substrate includes: A light-transmitting protective material film is deposited to cover the pixel-defining material film, and the protective material film is patterned to form the light-transmitting protective layer; and The isolation structure is formed on the pixel defining material film on which the light-transmitting protective layer is formed.

25. A display device, characterized in that, The display panel includes any one of claims 1 to 20, or a display panel obtained by the preparation method of any one of claims 21 to 24.

Images