Display substrate, manufacturing method thereof, display panel and display device

Abstract

The invention discloses a display substrate, a manufacturing method thereof and a display panel, and belongs to the technical field of display. The display substrate includes: a light emitting unit including a first electrode, a second electrode, and a light emitting portion; comprising a third electrode, a fourth electrode, a driving circuit and a substrate, wherein the substrate is located on the side, away from the light-emitting unit, of the driving circuit; comprising a plurality of first pins, the supporting structure is located on the side, away from the driving circuit, of the substrate, the first pins are electrically connected with the driving circuit, and the supporting structure comprises a supporting area making contact with the driving unit; comprising a plurality of conductive pads, and the plurality of conductive pads are connected with the plurality of first pins in a one-to-one correspondence manner. The ratio of the orthographic projection of the supporting area on the back plate to the orthographic projection of the driving unit on the back plate is larger than or equal to 50%. The embodiment of the invention can improve the defect of deformation of the display substrate caused by insufficient support of one side, close to the back plate, of the driving unit.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof, a display panel and a display device. Background Art

[0002] Display devices are widely used in people's daily life, such as mobile phones, monitors or tablet computers, etc. Display substrates are important components of display devices.

[0003] In the related art, the display substrate includes a backplane, a plurality of pins, a driving unit and a light-emitting unit stacked in sequence, wherein the plurality of pins protrude in a direction away from the driving unit, and the orthographic projection of the plurality of pins on the backplane is smaller than the orthographic projection of the driving unit on the backplane, and the plurality of pins are used to electrically connect the plurality of driving units and the backplane.

[0004] Due to the presence of multiple pins, there is a gap between the driving unit and the backplane; and because the orthographic projection of the multiple pins on the backplane is smaller than the orthographic projection of the driving unit on the backplane, the driving unit close to the backplane may be insufficiently supported, resulting in deformation of the display substrate. Summary of the invention

[0005] The present disclosure provides a display substrate and a manufacturing method thereof, a display panel and a display device, which can improve the defect of deformation of the display substrate caused by insufficient support of the driving unit close to the back plate. The technical solution is as follows:

[0006] On the one hand, a display substrate is provided, comprising: a light-emitting unit, the light-emitting unit comprising: a first electrode, a second electrode and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; a driving unit, the driving unit comprising: a third electrode, a fourth electrode, a driving circuit and a substrate, the third electrode and the fourth electrode are both located on a side of the driving unit facing the light-emitting unit, the third electrode and the fourth electrode are electrically connected to the driving circuit respectively, the third electrode is electrically connected to the first electrode, the fourth electrode is electrically connected to the second electrode, and the substrate is located on a side of the driving circuit away from the light-emitting unit; a supporting structure, the supporting structure is located on a side of the substrate away from the driving circuit, the supporting structure comprises a supporting area in contact with the driving unit, the supporting structure comprises a plurality of first pins, and the plurality of first pins are electrically connected to the driving circuit; a backplane, the backplane is located on a side of the supporting structure away from the light-emitting unit, the backplane comprises a plurality of conductive pads, and the plurality of conductive pads are connected to the plurality of first pins in a one-to-one correspondence; wherein the ratio of the orthographic projection of the supporting area on the backplane to the orthographic projection of the driving unit on the backplane is greater than or equal to 50%.

[0007] Optionally, the driving unit further includes a connection structure, the substrate has a connection via, and the connection structure is located in the connection via; the first pin is in contact with the connection structure, and the first pin and the driving circuit are connected through the connection structure.

[0008] Optionally, the material of the substrate is one of polyimide, polyamide, acrylic resin and phenolic resin; and the thickness of the substrate is in the range of 25 μm to 35 μm.

[0009] Optionally, the support structure further includes a first auxiliary support structure, wherein the first auxiliary support structure is in contact with the substrate and the back plate respectively.

[0010] Optionally, the material of the first auxiliary support structure includes at least one of resin, silicon nanospheres, metal oxide nanospheres and non-metal oxide nanospheres.

[0011] Optionally, the support structure further includes a second auxiliary support structure, wherein the second auxiliary support structure is connected to a side of the substrate away from the driving circuit, and the first pin is located on a side of the second auxiliary support structure away from the substrate.

[0012] Optionally, the second auxiliary supporting structure is made of glass.

[0013] Optionally, the first pin includes a first surface facing the driving circuit, and a second surface away from the driving circuit; an orthographic projection area of ​​the first surface on the backplane is larger than an orthographic projection area of ​​the second surface on the backplane.

[0014] Optionally, the first pin includes a first connection structure, which is located on a side of the first pin away from the substrate and includes a plurality of protruding structures; the conductive pad includes a second connection structure, which is located on a side of the first pin away from the substrate and includes a plurality of protruding structures; the protruding structure of the first connection structure is staggeredly connected to the protruding structure of the second connection structure; or, the protruding structure of the first connection structure is relatively connected to the protruding structure of the second connection structure.

[0015] Optionally, the display substrate also includes an isolation structure, which is located between the light-emitting portion and the driving circuit and is respectively arranged in contact with the light-emitting portion and the driving circuit; the isolation structure surrounds the first electrode and the third electrode as a whole to isolate the first electrode and the third electrode from the outside world; the isolation structure surrounds the second electrode and the fourth electrode as a whole to isolate the second electrode and the fourth electrode from the outside world.

[0016] Optionally, the display substrate also includes a first substrate, which is located on a side of the light-emitting unit away from the driving unit, and the isolation structure surrounds the light-emitting unit and fills between the driving unit connected to the light-emitting unit and the first substrate, and the isolation structure is respectively arranged in contact with the driving unit and the first substrate.

[0017] Optionally, the material of the isolation structure includes shadowless adhesive 、 At least one of silicon nanospheres, metal oxide nanospheres and non-metal oxide nanospheres.

[0018] Optionally, at least one first pin among the plurality of first pins includes an alloy containing nickel and gold elements.

[0019] Optionally, the multiple light-emitting units include a first color light-emitting unit, a second color light-emitting unit and a third color light-emitting unit; wherein the color of the light emitted by the first color light-emitting unit, the color of the light emitted by the second color light-emitting unit and the color of the light emitted by the third color light-emitting unit are different from each other.

[0020] Optionally, the light-emitting portion includes a color filter layer, a color conversion layer and a light-emitting layer which are sequentially stacked in a direction close to the driving unit, and the light-emitting color of the light-emitting layer is blue.

[0021] Optionally, the light-emitting layer includes a first doped layer, a multi-quantum well layer and a second doped layer which are stacked, wherein the first doped layer is electrically connected to the first electrode, and the second doped layer is electrically connected to the second electrode.

[0022] Optionally, the driving circuit includes multiple thin film transistors and at least one storage capacitor, each of the thin film transistors includes a gate, a source and a drain; one of the multiple first pins is connected to the source of a thin film transistor among the multiple thin film transistors, for providing the driving circuit with a data driving signal from the backplane.

[0023] Optionally, the driving circuit includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source-drain layer and a planarization layer which are located on one side of the substrate and stacked in sequence; the third electrode and the fourth electrode are located on the side of the planarization layer away from the substrate; the active layer includes a plurality of active patterns corresponding to the plurality of thin film transistors, each of the active patterns including a source region, a drain region and a channel region; the source and the drain of the thin film transistor are located in the source-drain layer, the source of the thin film transistor is connected to the source region, and the drain of the thin film transistor is connected to the drain region; the first gate layer includes a plurality of gate patterns corresponding to the plurality of thin film transistors, and the channel region is an overlapping area of ​​an orthographic projection of the gate pattern on the substrate and an orthographic projection of the active pattern on the substrate.

[0024] On the other hand, a method for manufacturing a display substrate is provided, the method comprising: obtaining a light-emitting unit, the light-emitting unit comprising: a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; obtaining a driving unit, the driving unit comprising: a third electrode, a fourth electrode, a driving circuit and a substrate, the third electrode and the fourth electrode being electrically connected to the driving circuit respectively; bonding the light-emitting unit and the driving unit through a bonding process, so that the third electrode and the fourth electrode are both located on a side of the driving unit facing the light-emitting unit, the substrate is located on a side of the driving circuit away from the light-emitting unit, the third electrode and the first The electrodes are electrically connected, the fourth electrode is electrically connected to the second electrode, and the substrate is located on a side of the drive circuit away from the light-emitting unit; a support structure is made on a side of the substrate away from the drive circuit, the support structure includes a support area in contact with the drive unit, the support structure includes a plurality of first pins, and the plurality of first pins are electrically connected to the drive circuit; a backplane is obtained, the backplane includes a plurality of conductive pads; the first pins and the backplane are bonded and connected by a bonding process, and the plurality of conductive pads are connected to the plurality of first pins in a one-to-one correspondence; wherein the ratio of the orthographic projection of the support area on the backplane to the orthographic projection of the drive unit on the backplane is greater than or equal to 50%.

[0025] Optionally, the support structure also includes a first auxiliary support structure, which is in contact with the substrate and the backplane respectively; the manufacturing method also includes: before connecting the first pin and the backplane, coating an initial auxiliary support layer on a side of the backplane close to the driving unit, and forming a plurality of grooves in the initial auxiliary support layer to obtain a first auxiliary support structure, wherein the plurality of grooves correspond to the plurality of first pins, and the first pins are located in the grooves; or, after connecting the first pin and the backplane, immersing the driving unit and the backplane fixedly connected by the plurality of first pins in a first auxiliary support material liquid, and curing to form a first auxiliary support structure.

[0026] Optionally, the support structure plate also includes a second auxiliary support structure, which is connected to a side of the substrate away from the driving circuit; the manufacturing method also includes: after the light-emitting unit and the driving unit are bonded together through a bonding process, the initial substrate base plate connected to the side of the driving unit away from the light-emitting unit is thinned and punched to form a plurality of openings, the plurality of openings corresponding one-to-one to the plurality of first pins, to obtain the second auxiliary support structure.

[0027] On the other hand, a display panel is provided, comprising any one of the display substrates described above, a touch layer and a packaging layer, wherein the touch layer and the packaging layer are sequentially stacked on a side of the light-emitting unit away from the driving unit.

[0028] On the other hand, a display device is provided, comprising any one of the aforementioned display substrates and a power supply circuit, wherein the power supply circuit is used to supply power to the display substrate; or, the display device comprises the aforementioned display panel and a power supply circuit, wherein the power supply circuit is used to supply power to the display panel.

[0029] The beneficial effects brought by the technical solution provided by the present disclosure include at least: the present disclosure provides a display substrate, which has a backplane, a support structure, a driving unit and a light-emitting unit arranged in sequence. The support structure includes a support area in contact with the driving unit. By making the ratio of the orthographic projection of the support area on the backplane to the orthographic projection of the driving unit on the backplane greater than or equal to 50%, it is possible to avoid a gap between the driving unit and the backplane due to the presence of multiple first pins, and insufficient support on the side of the driving unit close to the backplane, thereby causing deformation of the display substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 is a schematic diagram of a cross-sectional structure of a display substrate provided by an embodiment of the present disclosure;

[0032] Figure 2 is a schematic diagram of a planar structure of a display substrate provided by an embodiment of the present disclosure;

[0033] Figure 3 is a schematic cross-sectional structure diagram of a connected driving unit and a first pin provided by an embodiment of the present disclosure;

[0034] Figure 4 is a schematic diagram of a cross-sectional structure of a light-emitting unit provided in an embodiment of the present disclosure;

[0035] Figure 5 is a schematic diagram of a cross-sectional structure of another light-emitting unit provided in an embodiment of the present disclosure;

[0036] Figure 6 This is an optical simulation diagram of an isolation structure made of silicon nanospheres provided in an embodiment of the present disclosure;

[0037] Figure 7 is a schematic diagram of a cross-sectional structure of another display substrate provided in an embodiment of the present disclosure;

[0038] Figure 8 The embodiment of the present disclosure provides Figure 7 A partial enlarged view of

[0039] Fig. 9 is a schematic cross-sectional structure diagram of another driving unit provided in an embodiment of the present disclosure;

[0040] Fig.10 is a schematic diagram of a cross-sectional structure of another display substrate provided in an embodiment of the present disclosure;

[0041] Fig.11 The embodiment of the present disclosure provides Fig.10 A partial enlarged view of

[0042] Fig.12 is a schematic diagram of a cross-sectional structure of another display substrate provided by an embodiment of the present disclosure and a bottom view of a first pin;

[0043] Fig.13 is a schematic diagram of a cross-sectional structure of another display substrate provided in an embodiment of the present disclosure;

[0044] Fig.14 is a schematic flow chart of a method for manufacturing a display substrate provided by an embodiment of the present disclosure;

[0045] Fig.15 is a schematic flow chart of another method for manufacturing a display substrate provided by an embodiment of the present disclosure;

[0046] Fig.16 is a schematic flow chart of another method for manufacturing a display substrate provided by an embodiment of the present disclosure;

[0047] Fig.17 It is a schematic flow chart of another method for manufacturing a display substrate provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0048] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0049] The terms used in the embodiments of the present disclosure are only used to explain the embodiments of the present disclosure, and are not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be the usual meanings understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second", "third" and similar words used in the patent application specification and claims of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not indicate quantitative restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" cover the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects.

[0050] A micro light emitting diode (Micro LED) display substrate generally includes a backplane, a driving unit integrated on the backplane, and a light-emitting chip bonded to the driving unit. When preparing the MicroLED display substrate, in order to achieve color display, it is necessary to transfer and bond light-emitting chips of different colors to the backplane integrated with the driving unit, and the light-emitting chips of the same color are transferred once, and the light-emitting chips of different colors are transferred in batches. The number of transfers is equal to the number of colors of the light-emitting chip. Optionally, the light-emitting chip includes light-emitting chips of three colors, such as a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip, and three transfers are required. This solution requires a large number of transfers when preparing the Micro LED display substrate, and the process is more complicated.

[0051] In addition, in order to reduce the manufacturing cost of the Micro LED display substrate, the size of the backplane will not be designed to be too large (because if it is designed to be too large, if some of the light-emitting chips fail to emit light after transfer, the entire product will be scrapped, and the cost will be high). Therefore, if this solution needs to achieve large-size display, it can only be achieved through splicing, and the display effect is poor.

[0052] The red, green and blue micro display chip (RGB Micro LED) is bonded to a driving unit to form a new active-matrix light-emitting diode (AM-LED) chip with its own driving circuit. The AM-LED chip includes light-emitting chips of three colors, red, green and blue, and a driving unit for driving the light-emitting chip. Furthermore, depending on the size of the display substrate that needs to be prepared, a corresponding number of AM-LED chips are used to transfer and bond with the backplane at one time to achieve the preparation of a glass-based color light-emitting diode (LED) display substrate. At the same time, this solution only requires one transfer process, and the process is relatively simple. In addition, large-size display can be achieved without splicing, which can improve the glass utilization rate of the backplane, thereby reducing costs.

[0053] In addition, the AM-LED chip can achieve electrical / optical dual detection through detection technology, and screen out chips that meet the requirements of optical performance and driving performance. In this way, compared with the solution of integrating the driving circuit on the backplane to form a display substrate, it is more conducive to improving the chip yield on the display substrate and is also convenient for repairing and replacing defective chips.

[0054] However, since there are multiple first pins on the side of the AM-LED chip close to the backplane, after the AM-LED chip is transferred to the backplane, there is a gap between the AM-LED chip and the backplane due to the presence of the first pins, which may cause deformation of the display substrate due to insufficient support of the driving unit close to the backplane.

[0055] Figure 1 Schematic diagram of a cross-sectional structure of a display substrate provided by an embodiment of the present disclosure. Figure 1 As shown, the display substrate includes: a light emitting unit 101 , a driving unit 102 , a supporting structure 103 and a back plate 105 .

[0056] The light-emitting unit 101 includes: a first electrode 1011, a second electrode 1012, and a light-emitting portion 1013 electrically connected to the first electrode 1011 and the second electrode 1012. The driving unit 102 includes a third electrode 1021, a fourth electrode 1022, a driving circuit 1023, and a substrate 1024. The third electrode 1021 and the fourth electrode 1022 are both located on the side of the driving unit 102 facing the light-emitting unit 101. The third electrode 1021 and the fourth electrode 1022 are electrically connected to the driving circuit 1023, respectively. The third electrode 1021 is electrically connected to the first electrode 1011, and the fourth electrode 1022 is electrically connected to the second electrode 1012. The substrate 1024 is located on the side of the driving circuit 1023 away from the light-emitting unit 101. The support structure 103 is located on the side of the substrate 1024 away from the light-emitting unit 101, and the support structure 103 includes a support area 103A in contact with the driving unit 102. The support structure 103 includes a plurality of first pins 1031, which are located on a side of the substrate 1024 away from the driving circuit 1023 and are electrically connected to the driving circuit 1023. The back plate 105 is located on a side of the support structure 103 away from the light-emitting unit 101. The back plate 105 includes a plurality of conductive pads 1051, which are connected to the plurality of first pins 1031 in a one-to-one correspondence. Here, the light-emitting unit 101 is the aforementioned micro display chip, and the light-emitting unit 101 and the driving unit 102 can constitute the aforementioned AM-LED chip.

[0057] Figure 2 Schematic diagram of a planar structure of a display substrate provided by an embodiment of the present disclosure. Figure 1 and Figure 2 , the ratio of the orthographic projection of the support area 103A on the back plate 105 to the orthographic projection of the drive unit 102 on the back plate 105 is greater than or equal to 50%. It should be noted that, Figure 2 In the partial enlarged view on the right side, the first electrode 1011 and the second electrode 1012 are located between the light-emitting unit 101 and the driving unit 102, so they are indicated by a dotted frame; the support area 103A is located on the side of the driving unit 102 away from the light-emitting unit 101, so it is indicated by a dotted frame. In order to better distinguish the first electrode 1011, the second electrode 1012 and the support area 103A, Figure 2 The line width of the dashed frame of the middle support area 103A is larger.

[0058] Since the support structure 103 is located between the substrate 1024 and the back panel 105, and the ratio of the orthographic projection of the support area 103A on the back panel to the orthographic projection of the driving unit on the back panel is greater than or equal to 50%, the support structure 103 can reduce the gap between the back panel 105 and the driving unit 102 caused by the first pin 1031, play a supporting role, and improve the defect of deformation of the display substrate caused by insufficient support on the side of the driving unit 102 close to the back panel 105.

[0059] Optionally, the ratio of the orthographic projection of the support area 103A on the back plate 105 to the orthographic projection of the driving unit 102 on the back plate 105 is greater than or equal to 70%, so as to better support the side of the driving unit 102 close to the back plate 105 .

[0060] Figure 3 1 is a schematic diagram of a cross-sectional structure of a connected driving unit and a first pin provided in an embodiment of the present disclosure. The driving unit 102 also includes a connecting structure 1025. A connecting via 1024a is provided in the substrate 1024, and the connecting structure 1025 is located in the connecting via 1024a. The first pin 1031 is in contact with the connecting structure 1025, and the first pin 1031 and the driving circuit 1023 are connected through the connecting structure 1025. The setting of the connecting structure 1025 facilitates the electrical connection between the first pin 1031 and the driving circuit 1023.

[0061] For example, Figure 3 As shown, the area of ​​the orthographic projection of the first pin 1031 on the substrate 1024 is larger than the area of ​​the orthographic projection of the connection structure 1025 on the substrate 1024, and the orthographic projection of the first pin 1031 on the substrate 1024 covers the orthographic projection of the connection structure 1025 on the substrate 1024. The design that the orthographic projection of the first pin 1031 on the substrate 1024 is larger than the orthographic projection of the connection structure 1025 on the substrate 1024 and the former covers the latter can ensure a stable connection between the first pin 1031 and the connection structure 1025, and avoid the first pin 1031 being offset relative to the connection structure 1025 due to the first pin 1031 being too small and the process error, thereby causing the first pin 1031 to be poorly connected to the connection structure 1025.

[0062] Optionally, the cross-sectional area of ​​the connection structure 1025 in the thickness direction of the substrate 1024 gradually changes as the distance from the driving circuit 1023 increases. Figure 3As shown, the cross-sectional area of ​​the connection structure 1025 in the direction perpendicular to the thickness of the substrate 1024 gradually increases with the increase of the distance from the driving circuit 1023. That is, the area of ​​the side of the connection structure 1025 close to the driving circuit 1023 is smaller than the area of ​​the side of the connection structure 1025 close to the first pin 1031, and the projection of the side of the connection structure 1025 close to the driving circuit 1023 is located within the projection of the side of the connection structure 1025 close to the first pin 1031. Since the wiring space near the driving circuit 1023 is relatively tight, the cross-sectional area of ​​the end of the connection structure 1025 close to the driving circuit 1023 can be designed to be smaller; since there is a larger wiring space away from the driving circuit 1023, the cross-sectional area of ​​the end of the connection structure 1025 away from the driving circuit 1023 can be designed to be larger, and the connection area between the first pin 1031 and the connection structure 1025 can be as large as possible, so as to ensure the connection reliability between the first pin 1031 and the connection structure 1025.

[0063] Optionally, the connection structure 1025 is made of metal material, such as copper, aluminum, etc.

[0064] In the embodiment of the present disclosure, the first pin 1031 includes a first surface facing the driving circuit 1023, and a second surface facing away from the driving circuit 1023. The orthographic projection area of ​​the first surface on the back plate 105 is larger than the orthographic projection area of ​​the second surface on the back plate 105. In this design, the area of ​​the first surface is larger, which is conducive to increasing the area of ​​the supporting area 103A, thereby improving the supporting effect of the supporting structure 103 on the driving unit 102.

[0065] In a possible implementation, Figure 1 As shown, the first pin 1031 is in a hemispherical shape. In other possible implementations, the first pin 1031 may also be in a prism, a frustum, or the like.

[0066] Exemplarily, at least one first pin 1031 among the plurality of first pins 1031 includes an alloy containing nickel and gold. Optionally, at least one first pin 1031 among the plurality of first pins 1031 includes a first metal layer and a second metal layer stacked before welding. The first metal layer is located between the second metal layer and the drive unit 102, that is, the first metal layer is closer to the drive unit 102 than the second metal layer. The material of the first metal layer includes nickel (Ni), and the material of the second metal layer includes gold (Au). For example, the material of the first metal layer is nickel, and the material of the second metal layer is gold. The first pin formed after welding includes an alloy of nickel and gold.

[0067] Through the design of the first pin 1031 in the embodiment of the present disclosure, when the driving unit 102 is fixed to the side away from the light-emitting unit 101 and the back plate 105, the first pin 1031 can be fixedly connected to the conductive pad 1051 of the back plate 105 by a welding process, thereby realizing the connection between the driving unit 102 and the back plate 105.

[0068] Optionally, the substrate 1024 is a flexible substrate. The flexible substrate can be made of an organic material. Since the support force of the flexible substrate is relatively weak, the embodiment of the present disclosure is particularly suitable for a display substrate having such a substrate. For example, the material of the substrate 1024 can be one of polyimide, polyamide, acrylic resin and phenolic resin.

[0069] Optionally, the thickness of the substrate 1024 is 25 μm to 35 μm. Conventional substrates are relatively thin, about 20 μm, and have poor support; while the thickness of the substrate base plate 1024 of the embodiment of the present disclosure is relatively thick, has relatively good support, and has a small deformation.

[0070] In the present disclosure, Figure 1 As shown, the support structure 103 further includes a first auxiliary support structure 1033, and the first auxiliary support structure 1033 is respectively arranged in contact with the substrate 1024 and the back plate 105. Since the first auxiliary support structure 1033 is respectively arranged in contact with the substrate 1024 and the back plate 105, the first auxiliary support structure 1033 can further increase the contact portion between the support structure 103 and the driving unit 102, that is, increase the ratio of the orthographic projection of the support area 103A on the back plate 105 to the orthographic projection of the driving unit 102 on the back plate 105, play the role of auxiliary support, and prevent the side of the driving unit in the display substrate close to the back plate from being broken due to insufficient support.

[0071] Optionally, the first auxiliary support structure 1033 has a plurality of first auxiliary support holes 1033a, the plurality of first auxiliary support holes 1033a correspond one-to-one to the plurality of first pins 1031, and the connected first pins 1031 and the conductive pads 1051 are located in the first auxiliary support holes 1033a. The design of the first auxiliary support holes 1033a does not affect the electrical connection between the driving unit 102 and the back plate 105 through the plurality of first pins 1031 and the plurality of conductive pads 1051.

[0072] Exemplarily, the material of the first auxiliary support structure 1033 is at least one of inorganic particles and organic matter.

[0073] For example, Figure 1As shown, the material of the first auxiliary support structure 1033 is silicon nanospheres, which are inorganic particles. The silicon nanospheres are easy to fully fill the gap between the drive unit 102 and the back plate 105 to form the first auxiliary support structure 1033. Moreover, when the substrate 1024 in the drive unit 102 is formed of organic materials such as PI, the substrate 1024 will have water absorption, and the first auxiliary support structure 1033 made of silicon nanospheres can also improve the defect of deformation of such substrates due to long-term absorption of water and oxygen.

[0074] Alternatively, if Figure 1 As shown, the first auxiliary support structure 1033 made of silicon nanospheres includes a plurality of silicon nanosphere layers, and each silicon nanosphere layer includes a plurality of silicon nanospheres.

[0075] Optionally, the first auxiliary support structure 1033 may also be made of resin, which is an organic material. The resin material is convenient for making the first auxiliary support hole 1033a by, for example, etching, so that while playing an auxiliary supporting role for the substrate 1024, it does not affect the electrical connection between the first pin 1031 and the conductive pad 1051. Moreover, when the substrate 1024 in the drive unit 102 is formed of organic materials such as PI, the substrate 1024 will be hygroscopic, and the first auxiliary support structure 1033 made of resin can also improve the defect of deformation of the substrate due to long-term absorption of water and oxygen.

[0076] Optionally, the material of the first auxiliary support structure 1033 can also be metal oxide nanospheres (such as zirconium oxide nanospheres) or non-metal oxide nanospheres (such as silicon oxide nanospheres), which are inorganic particles. The metal oxide nanospheres or non-metal oxide nanospheres are easy to fully fill into the gap between the drive unit 102 and the back plate 105 to form the first auxiliary support structure 1033.

[0077] Optionally, the first auxiliary support structure 1033 may also be made of resin and silicon nanospheres. For example, a portion of the first auxiliary support structure 1033 (e.g., a portion away from the substrate 1024) may be made of resin, and another portion of the first auxiliary support structure 1033 (e.g., a portion close to the substrate 1024) may be made of silicon nanospheres.

[0078] In the embodiment of the present disclosure, the driving circuit 1023 includes a plurality of thin film transistors and at least one storage capacitor. Each thin film transistor includes a gate, a source, and a drain.

[0079] Optionally, the driving circuit 1023 may include seven thin film transistors and one storage capacitor, that is, the driving circuit 1023 is a 7T1C driving circuit. Alternatively, the driving circuit 1023 may include other numbers of thin film transistors and other numbers of storage capacitors. The embodiment of the present disclosure does not limit the number of thin film transistors included in the driving circuit 1023, and the number of storage capacitors included. The multiple thin film transistors included in the driving circuit 1023 are connected to each other to achieve the function of driving the light-emitting unit 101 to emit light.

[0080] Exemplarily, one first pin 1031 among the plurality of first pins 1031 is connected to the source of one thin film transistor among the plurality of thin film transistors, for providing the driving circuit 1023 with a data driving signal from the backplane 105 , so that the driving unit 102 drives the light emitting unit 101 to emit light.

[0081] Optionally, the plurality of thin film transistors at least include a data writing transistor, the source of which is used to be connected to a data line of the backplane 105 in the display substrate. The data line can transmit a data driving signal to the driving circuit 1023 through the data writing transistor.

[0082] Optionally, combined Figure 1 and Figure 3 The first pin 1031 is connected to the source of the data writing transistor in the driving circuit 1023, and the data writing transistor is connected to the third electrode 1021 of the driving unit 102 through other thin film transistors, so that the data line included in the backplane 105 in the display substrate transmits the data driving signal to the first electrode 1011 of the light-emitting unit 101 through the first pin 1031, the driving circuit 1023, and the third electrode 1021 in sequence.

[0083] For example, Figure 3 As shown, the support structure 103 also includes a plurality of third pins 1032, and the plurality of third pins 1032 are located on a side of the substrate 1024 away from the driving circuit 1023. In order to enable the driving unit 102 to drive the light-emitting unit 101 to emit light, in addition to providing the data driving signal for the first electrode 1011 of the light-emitting unit 101, it is also necessary to provide a power signal (such as a VSS signal) for the second electrode 1012 of the light-emitting unit 101. Optionally, the backplane 105 can provide the same power signal for the plurality of driving units 102 and the light-emitting unit 101 included in the display substrate, so the power signal can be provided to the second electrodes 1012 of the plurality of light-emitting units 101 through the third pins 1032. Optionally, in combination with Figure 1 and Figure 3The back plate includes a plurality of fourth pins 1052, and the plurality of fourth pins 1052 are connected to the plurality of third pins 1032 in a one-to-one correspondence. The power signal sequentially passes through the fourth pin 1052, the third pin 1032, the driving circuit 1023, the fourth electrode 1022 to the second electrode 1012. Optionally, the third pin 1032 is located in the peripheral area of ​​the display substrate. Optionally, the third pin 1032 and the first pin 1031 are made of the same material.

[0084] The following is an exemplary description of the structure of each layer in the driving circuit 1023.

[0085] For example, Figure 3 As shown, the driving circuit 1023 includes a buffer layer m1, an active layer m2, a first gate insulating layer m3, a first gate layer m4, a second gate insulating layer m5, a second gate layer (not shown in the figure), an interlayer dielectric layer m6, a source-drain layer m7, and a planarization layer m8, which are located on one side of the substrate 1024 and are stacked in sequence. The third electrode 1021 and the fourth electrode 1022 are located on the side of the planarization layer m8 away from the substrate 1024. Optionally, the second gate layer may also be located on the side of the active layer m2 away from the first gate layer m4.

[0086] The active layer m2 includes a plurality of active patterns corresponding to a plurality of thin film transistors, each of which includes a source region m21, a drain region m22, and a channel region m23. The source and drain of the thin film transistor are located in the source-drain layer, and the source of the thin film transistor is connected to the source region m21, and the drain is connected to the drain region m22. The first gate layer m4 includes a plurality of gate patterns corresponding to a plurality of thin film transistors. The orthographic projection of the channel region m23 on the substrate 1024 is the overlapping area of ​​the orthographic projection of the gate pattern on the substrate 1024 and the orthographic projection of the active pattern on the substrate 1024.

[0087] Exemplarily, the buffer layer m1 , the first gate insulating layer m3 , the second gate insulating layer m5 and the interlayer dielectric layer m6 may be made of silicon oxide or silicon nitride, silicon oxynitride or the like.

[0088] Exemplarily, the active layer m2 is made of low temperature polysilicon material, and the driving unit 102 can also be called an LTPS (Low Temperature Poly-Silicon) driving unit. Alternatively, the active layer m2 is made of low temperature polysilicon material and metal oxide semiconductor materials such as IGZO (Indium Gallium Zinc Oxide), and the driving unit 102 can also be called an LTPO (Low Temperature Polycrystalline Oxide) driving unit.

[0089] In some examples, the first gate layer m4 and the second gate layer may be made of a single metal layer, such as molybdenum, copper, aluminum, etc. In other examples, the first gate layer m4 and the second gate layer may also include multiple metal layers stacked in sequence, such as titanium, aluminum, titanium, etc. stacked in sequence.

[0090] Exemplarily, the planarization layer m8 is made of an organic insulating material, such as resin.

[0091] For example, Figure 3 As shown, the first gate layer m4 also includes a gate connection portion m41 connected to the connection structure 1025, and the gate connection portion m41 is used to connect to the connection structure 1025 and the source of the data writing transistor. In order to connect the connection structure 1025 and the gate connection portion m41, the buffer layer m1 and the first gate insulating layer m3 may also have connection vias. In addition, the connection structure 1025 is not only located in the connection via of the substrate 1024, but also in the connection via of the buffer layer m1 and the first gate insulating layer m3.

[0092] The following is an exemplary description of each structure in the light-emitting unit.

[0093] See again Figure 2 , the plurality of light emitting units 101 include a first color light emitting unit 101a, a second color light emitting unit 101b and a third color light emitting unit 101c. The color of the light emitted by the first color light emitting unit 101a, the color of the light emitted by the second color light emitting unit 101b and the color of the light emitted by the third color light emitting unit 101c are different from each other. For example, the colors of the light emitted by the first color light emitting unit 101a, the second color light emitting unit 101b and the third color light emitting unit 101c are red, green and blue respectively. The display function is realized by setting light emitting units of different colors.

[0094] Figure 4 Schematic diagram of a cross-sectional structure of a light-emitting unit provided in an embodiment of the present disclosure. Figure 4 As shown, the light-emitting portion 1013 includes a color filter layer 1014, a color conversion layer 1015 and a light-emitting layer 1016 which are sequentially stacked in a direction close to the driving unit 102, and the light-emitting color of the light-emitting layer 1016 is blue.

[0095] Optionally, the light-emitting layer 1016 includes a first light-emitting portion, a second light-emitting portion and a third light-emitting portion. The first light-emitting portion, the second light-emitting portion and the third light-emitting portion are respectively located in the first color light-emitting unit 101a, the second color light-emitting unit 101b and the third color light-emitting unit 101c. That is, the light-emitting colors of the first light-emitting portion, the second light-emitting portion and the third light-emitting portion are all blue. Figure 4By providing a first light emitting unit, a second light emitting unit and a third light emitting unit in the light emitting layer 1016, light sources are provided for the first color light emitting unit 101a, the second color light emitting unit 101b and the third color light emitting unit 101c respectively.

[0096] Optionally, the color conversion layer 1015 includes a first color conversion portion, a second color conversion portion and a transparent portion. Figure 4 Only one color conversion part or one transparent part 10151 is illustrated in the figure. The orthographic projection of the first color conversion part on the back plate 105 overlaps with the orthographic projection of the first light-emitting part on the back plate 105, that is, the first color conversion part and the first light-emitting part are located in the same light-emitting unit, for example, both are located in the first color light-emitting unit 101a. The first color conversion part is used to convert the light emitted by the first light-emitting part into the color corresponding to the first color conversion part (for example, into red). The orthographic projection of the second color conversion part on the back plate 105 overlaps with the orthographic projection of the second light-emitting part on the back plate 105, that is, the second color conversion part and the second light-emitting part are located in the same light-emitting unit, for example, both are located in the second color light-emitting unit 101b. The second color conversion part is used to convert the light emitted by the second light-emitting part into the color corresponding to the second color conversion part (for example, into green). The orthographic projection of the transparent part on the back plate 105 overlaps with the orthographic projection of the third light-emitting part on the back plate 105, that is, the transparent part and the third light-emitting part are located in the same light-emitting unit, for example, both are located in the third color light-emitting unit 101a. The transparent part is used to transmit the light emitted by the third light-emitting part.

[0097] Optionally, the first color conversion part and the second color conversion part are made of red quantum dot luminescent particles and green quantum dot luminescent particles, respectively, for example, at least one compound selected from CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgTe, GaN, GaAs, InP, and InAS. The transparent part is made of a material with high transmittance, for example, a transparent resin material such as polyimide, polyacrylic acid, etc.

[0098] Alternatively, if Figure 4 As shown, the color conversion layer 1015 further includes a spacer 10152 located between any two adjacent structures among the first color conversion portion, the second color conversion portion and the transparent portion, and the spacer 10152 is used to distinguish and space different color conversion portions and transparent portions.

[0099] Optionally, the color filter layer 1014 includes a first color block, a second color block, a third color block and a black matrix 10142. Figure 5Only one color block 10141 is illustrated in the figure. The black matrix 10142 is located between adjacent color blocks. The orthographic projection of the first color block on the back plate 105 overlaps at least partially with the orthographic projection of the first color conversion part on the back plate 105, and the first color block is used to transmit the light of the corresponding color after the conversion of the first color conversion part, and block the light of other colors. The orthographic projection of the second color block on the back plate 105 overlaps at least partially with the orthographic projection of the second color conversion part on the back plate 105, and the second color block is used to transmit the light of the corresponding color after the conversion of the second color conversion part, and block the light of other colors. The orthographic projection of the third color block on the back plate 105 overlaps at least partially with the orthographic projection of the transparent part on the back plate 105, and the third color block is used to transmit the light of the corresponding color transmitted by the transparent part, and block the light of other colors. Optionally, the first color block is a red color block, the second color block is a green color block, and the third color block is a blue color block.

[0100] Alternatively, if Figure 4 As shown, the light emitting unit 101 further includes an adhesive layer 1017 and a buffer layer 1018. The adhesive layer 1017 and the buffer layer 1018 are both located between the color conversion layer 1015 and the light emitting layer 1016. The adhesive layer 1017 is used to bond the color conversion layer 1015 and the buffer layer 1018. The material of the buffer layer 1018 can be GaN.

[0101] In one possible implementation, Figure 4 The light-emitting layer 1016 of the embodiment shown in the figure includes a first electrode layer, a light-emitting material layer, and a second electrode layer stacked in sequence in a direction from close to the driving unit 102 to far away from the driving unit 102. Different electrical signals can be applied to the first electrode layer and the second electrode layer, respectively, and the electrical signals can drive the light-emitting material to emit light in a staggered manner. Optionally, the first electrode layer and the second electrode layer are an anode layer and a cathode layer, respectively.

[0102] In another possible implementation, Figure 4 The light emitting layer 1016 of the embodiment shown in FIG. 1 is formed of an inorganic material. Figure 5 FIG. 1 is a schematic diagram of a cross-sectional structure of another light-emitting unit provided in an embodiment of the present disclosure. Figure 5 As shown, the light emitting layer 1016 includes a stacked first doping layer 10161, a multi-quantum well layer 10162, and a second doping layer 10163. The first doping layer 10161 is electrically connected to the first electrode 1011, and the second doping layer 10163 is electrically connected to the second electrode 1012.

[0103] Optionally, the first doping layer 10161 may be an N-type doping layer, and the second doping layer 10163 may be a P-type doping layer. Accordingly, the first electrode 1011 may be referred to as an N-type electrode, and the second electrode 1012 may be referred to as a P-type electrode. Optionally, the material of the first doping layer 10161 may be N-type gallium nitride (GaN), and the first doping layer 10161 is denoted as N-GaN. The material of the second doping layer 10163 may be P-type gallium nitride (GaN), and the second doping layer 10163 is denoted as P-GaN.

[0104] For example, Figure 5 As shown, the light emitting unit 101 further includes a diffusion layer 1019, and the diffusion layer 1019 is located between the bonding layer 1017 and the color conversion layer 1015. The diffusion layer 1019 includes a plurality of diffusion parts 10191 and a retaining wall 10192 located between two adjacent diffusion parts 10191. The plurality of diffusion parts 10191 correspond to the plurality of light emitting units 101 one by one, and the diffusion part 10191 has a plurality of uneven structures 10191a. The arrangement of the plurality of uneven structures 10191a can make the light emitted from the light emitting layer 1016 to the diffusion layer 1019 uniform, and then emit it to the color conversion layer 1015. The retaining wall 10192 has the function of reflecting light, and can prevent the light from being emitted from the multi-quantum well layer 10162 in the light emitting layer 1016 to the side wall of the light emitting unit 101 and then leaking out. The retaining wall 10192 can reflect this part of the light back into the light emitting unit 101, thereby improving the light extraction efficiency.

[0105] Optionally, the retaining wall 10192 is a distributed Bragg reflector (DBR). Figure 5 As shown, DBR10192 includes a plurality of film layer structures stacked in sequence in a direction away from the back plate 105. The plurality of film layer structures include a plurality of film layer structures with a high refractive index and a plurality of film layer structures with a low refractive index, and the plurality of film layer structures with a high refractive index and the plurality of film layer structures with a low refractive index are alternately stacked. The disclosed embodiment does not limit the materials of the film layer structure of the high refractive index layer and the film layer structure of the low refractive index. For example, the material of the film layer structure of the high refractive index layer may be titanium oxide or niobium oxide, and the material of the film layer structure of the low refractive index may be silicon nitride or silicon oxide.

[0106] Optionally, the retaining wall 10192 may also be made of metal materials such as copper and have a reflective function.

[0107] For example, Figure 5 As shown, the light emitting layer 1016 also includes a raised electrode 10164 , a conductive layer 10165 and an insulating layer 10166 .

[0108] The padding electrode 10164 is connected to the first doping layer 10161, the conductive layer 10165 is located on the side of the second doping layer 10163 away from the back plate 105, and the insulating layer 10166 is located on the side of the padding electrode 10164 and the conductive layer 10165 away from the back plate 105. The insulating layer 10166 has a first via hole 10166a and a second via hole 10166b. The first via hole 10166a is used to expose the padding electrode 10164, and the padding electrode 10164 and the first electrode 1011 are connected through the first via hole 10166a, and the second via hole 10166b is used to expose the conductive layer 10165, and the conductive layer 10165 and the second electrode 1012 are connected through the second via hole 10166b. Optionally, the material of the conductive layer 10165 may be indium tin oxide (ITO); the insulating layer 10166 may be a passivation layer (PVX), and the material of the insulating layer 10166 may be silicon oxide or silicon nitride.

[0109] In the present disclosure, see again Figure 2 The display substrate includes a plurality of light-emitting units 101 and a plurality of driving units 102, and the plurality of light-emitting units 101 and the plurality of driving units 102 are connected one-to-one and distributed in an array, and the orthographic projection of each light-emitting unit 101 on the bearing surface of the back plate 105 is located inside the orthographic projection of the corresponding driving unit 102 on the bearing surface.

[0110] Optionally, since some film layers in multiple driving circuits 1023 can be common film layers, one driving unit 102 can include multiple driving circuits 1023, that is, multiple light-emitting units 101 can be connected to one driving unit 102 accordingly, and each driving circuit 1023 in the driving unit 102 can be used to drive a corresponding light-emitting unit 101 to emit light.

[0111] In the present disclosure, see again Figure 1 The display substrate further includes an isolation structure 107, which is located between the light-emitting portion 1013 and the driving circuit 1023, and is respectively arranged in contact with the light-emitting portion 1013 and the driving circuit 1023. The isolation structure 107 surrounds the entirety of the first electrode 1011 and the second electrode 1012 to isolate the first electrode 1011 and the second electrode 1012 from the outside. The isolation structure 107 surrounds the entirety of the second electrode 1012 and the fourth electrode 1022 to isolate the second electrode 1012 and the fourth electrode 1022 from the outside. The setting of the isolation structure 107 can prevent the first electrode 1011 and the second electrode 1012 from being damaged, and prevent the third electrode 1021 and the fourth electrode 1022 from being damaged.

[0112] Optionally, since the isolation structure 107 covers at least part of the light emitting unit 101, the isolation structure 107 also has the function of preventing the conductive material from penetrating into the interior of the light emitting unit 101. It should be noted that in order to show the planar relationship between more structures, Figure 2 The isolation structure 107 is not shown. Figure 2 On the basis of the isolation structure 107 and the first electrode 1011 and the second electrode 1012, the light emitting unit 101 is covered. That is, the sum of the orthographic projection of the isolation structure 107 on the bearing surface of the display backplane 105 and the orthographic projection of the first electrode 1011 and the second electrode 1012 on the bearing surface of the display backplane 105 covers the orthographic projection of the light emitting unit 101 on the bearing surface of the display backplane 105.

[0113] Since the process of the display substrate includes the steps of drilling from the side of the driving unit 102 close to the back plate 105 to the side away from the back plate 105 and injecting a conductive material (such as a metal material) to prepare the aforementioned connecting structure 1025 or the fourth electrode 1022, if there is no isolation structure 107, in this step, there may be a risk of the injected conductive material leaking to the side of the light-emitting unit 101. Since the light-emitting unit 101 has multiple structural layers, the injected conductive material may penetrate into the light-emitting unit 101 along the gaps between these structural layers and cause a short circuit.

[0114] For example, Figure 1 As shown, the display substrate further includes a first substrate 104, and the first substrate 104 is located on a side of the light-emitting unit 101 away from the driving unit 102. The first substrate 104 is used to protect the plurality of light-emitting units 101. The isolation structure 107 surrounds the light-emitting unit 101 and is filled between the driving unit 102 connected to the light-emitting unit 101 and the first substrate 104, and the isolation structure 107 is respectively arranged in contact with the driving unit 102 and the first substrate 104. In the embodiment of the present disclosure, since the isolation structure 107 is filled between the driving unit 102 connected to the light-emitting unit 101 and the first substrate 104, the defect of the conductive material injected in the process penetrating into the light-emitting unit 101 and causing a short circuit can be improved.

[0115] It should be noted that in order to show more planar relationships between structures, Figure 2 The isolation structure 107 is not shown. Figure 2 On the basis of, the isolation structure 107 and the first electrode 1011 and the second electrode 1012 cover the back plate 105. That is, the sum of the orthographic projection of the isolation structure 107 on the bearing surface of the back plate 105 and the orthographic projection of the first electrode 1011 and the second electrode 1012 on the bearing surface of the back plate 105 covers the bearing surface of the back plate 105.

[0116] Exemplarily, the material of the isolation structure 107 includes at least one of inorganic particles and organic matter.

[0117] For example, Figure 1 As shown, the isolation structure 107 is made of silicon nanosphere material, which is a kind of inorganic particle. The isolation structure 107 made of silicon nanospheres can fully fill the space between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104. The isolation structure 107 made of silicon nanospheres also has the function of reflecting the light leaking from the edge of the light-emitting unit 101 back to the light-emitting unit 101. Optionally, as Figure 1 As shown, the isolation structure 107 made of silicon nanospheres includes a plurality of silicon nanosphere layers, and each silicon nanosphere layer includes a plurality of silicon nanospheres.

[0118] Figure 6 : is an optical simulation diagram of an isolation structure of a silicon nanosphere material provided by an embodiment of the present disclosure. An optical simulation of the isolation structure of the silicon nanosphere material is performed using electromagnetic simulation software, such as Figure 6 As shown, the isolation structure 107 has a high reflectivity in the wavelength range of 400nm to 465nm, which includes the blue light band, so the blue light leaking from the edge of the light-emitting layer 1016 in the light-emitting unit 101 can be reflected back to the light-emitting unit 101.

[0119] Optionally, the radius of the silicon nanosphere is 45 nm to 55 nm, for example, the radius of the silicon nanosphere is 50 nm.

[0120] Optionally, the dielectric constant of the silicon nanospheres is 11.5.

[0121] Optionally, in other possible embodiments, the material of the isolation structure 107 may also be a shadowless adhesive, which is an organic substance. The shadowless adhesive material is easy to form into different shapes, and the isolation structure 107 made of the shadowless adhesive can fully fill the space between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104. In addition, the isolation structure 107 made of the shadowless adhesive is easy to remove after curing.

[0122] Optionally, the material of the isolation structure 107 may also be metal oxide nanospheres (e.g., zirconium oxide nanospheres) or non-metal oxide nanospheres (e.g., silicon oxide nanospheres), which are inorganic particles. The isolation structure 107 made of metal oxide nanospheres or non-metal oxide nanospheres can fully fill the space between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104.

[0123] Optionally, the material of the isolation structure 107 may also be shadowless adhesive and silicon nanospheres. The isolation structure 107 made of shadowless adhesive and silicon nanospheres can fully fill the space between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104. For example, the material of a portion of the isolation structure 107 close to the surface of the light-emitting unit 101 is silicon nanospheres, and the material of the remaining portion is shadowless adhesive.

[0124] Figure 7 FIG. 1 is a schematic diagram of a cross-sectional structure of another display substrate provided by an embodiment of the present disclosure. Figure 7 As shown, the support structure 103 further includes a second auxiliary support structure 1034 , which is connected to a side of the substrate 1024 away from the driving circuit 1023 , and the first pin 1031 is located on a side of the second auxiliary support structure 1034 away from the substrate 1024 .

[0125] and Figure 1 Compared with the embodiment shown, Figure 7 In the illustrated embodiment, the support structure includes a second auxiliary support structure 1034, but does not include a first auxiliary support structure 1033. Since the second auxiliary support structure 1034 is connected to the side of the substrate 1024 away from the driving circuit 1023, the second auxiliary support structure 1034 can further increase the contact portion between the support structure 103 and the driving unit 102, that is, increase the ratio of the orthographic projection of the support area 103A on the back plate 105 to the orthographic projection of the driving unit 102 on the back plate 105, play the role of auxiliary support, and prevent the display substrate from cracking due to insufficient support. In addition, Figure 7 The illustrated embodiment does not have the isolation structure 107, or, Figure 7 In the illustrated embodiment, the isolation structure 107 of the shadowless adhesive material is removed after being cured.

[0126] Exemplarily, the material of the second auxiliary support structure 1034 is glass. Glass can be made into a planar second auxiliary support structure 1034, which has a large contact area with the drive unit 102. In addition, the strength of glass is greater than that of the substrate 1024, and the support performance is better.

[0127] Optionally, the thickness of the second auxiliary support structure 1034 is 0.1 μm to 100 μm. Optionally, the thickness of the second auxiliary support structure 1034 is 0.1 μm to 50 μm. Optionally, the thickness of the second auxiliary support structure 1034 is 0.1 μm to 0.15 μm, which is conducive to the thinning of the display substrate. Specifically, the thickness of the second auxiliary support structure 1034 can be 0.1 μm, 0.12 μm, 0.13 μm, 0.14 μm, 0.15 μm, 20 μm, 40 μm, 60 μm, 80 μm and 100 μm.

[0128] Figure 8 The embodiment of the present disclosure provides Figure 7 A partial enlarged view of the Figure 1 Compared with the embodiment shown, Figure 8 In the illustrated embodiment, the first pin 1031 includes a first connection structure 1031b, which is located on a side of the first pin 1031 away from the substrate 1024 and includes a plurality of protruding structures; the conductive pad 1051 includes a second connection structure 1051b, which is located on a side of the first pin 1031 away from the substrate 1024 and includes a plurality of protruding structures. The protruding structure 1031b' of the first connection structure is staggeredly connected to the protruding structure 1051b' of the second connection structure. This staggered connection between the first pin 1031 and the conductive pad 1051 can make the connection between the driving unit 102 and the back plate 105 more compact and reliable. In addition, Figure 1 Compared to the embodiment shown: Figure 8 In the embodiment shown, the isolation structure 107 of the cured shadowless adhesive material is removed; Figure 8 In the illustrated embodiment, the first pin 1031 is in the shape of a prism with a concave and convex surface.

[0129] Here, the staggered connection means that a recessed area 1031b' is formed between two adjacent protruding structures 1031b' in the first connecting structure 1031b, and a recessed area 1051b' is formed between two adjacent protruding structures 1051b' in the second connecting structure 1051b. The protruding structure 1031b' in the first connecting structure 1031b matches the shape of the recessed area 1051b' in the second connecting structure 1051b and fits on the sides, and the recessed area 1031b' in the first connecting structure 1031b matches the shape of the protruding structure 1051b' in the second connecting structure 1051b and fits on the sides.

[0130] Alternatively, if Figure 8 As shown, the first pin 1031 includes a first main body 1031a and a first connection structure 1031b connected to each other, and the first connection structure 1031b includes a plurality of protruding structures 1031b' located on a surface of the first main body 1031a away from the substrate 1024. The conductive pad 1051 includes a second main body 1051a and a second connection structure 1051b connected to each other, and the second connection structure 1051b includes a plurality of protruding structures 1051b' located on a surface of the second main body 1051a away from the substrate 1024.

[0131] Alternatively, if Figure 8As shown, the plurality of protrusion structures 1031b' of the first connection structure 1031b and the plurality of protrusion structures 1051b' of the second connection structure 1051b are both strip-shaped and arranged in the same direction. Optionally, the arrangement direction of the plurality of protrusion structures 1031b' intersects with the length direction of the plurality of protrusion structures 1031b', for example, is perpendicular.

[0132] Fig. 9 is a schematic cross-sectional structure diagram of another driving unit provided in an embodiment of the present disclosure, and Fig. 9 The drive unit shown is Figure 7 The drive unit in the embodiment shown. Figure 1 and Figure 3 Compared with the embodiment shown, Figure 7 and Fig. 9 In the illustrated embodiment, the second auxiliary support structure 1034 has a second connection via 1034a, and the connection structure 1025 is also located in the second connection via 1034a. Since the second auxiliary support structure 1034 is located within the aforementioned thickness range of 0.1 μm to 100 μm, it is convenient to punch a hole in the second auxiliary support structure 1034 to form the second connection via 1034a.

[0133] Fig.10 is a schematic cross-sectional structure diagram of another display substrate provided in an embodiment of the present disclosure, Fig.11 The embodiment of the present disclosure provides Fig.10 A partial enlarged view of the Figure 7 Compared with the embodiment shown, Fig.10 and Fig.11 In the embodiment shown, the protruding structure 1031a of the first connection structure is connected to the protruding structure 1051a of the second connection structure. This connection method can increase the heat dissipation area. In addition, Fig.10 In the illustrated embodiment, the isolation structure 107 of the shadowless adhesive material is removed after being cured.

[0134] Fig.12 1 is a schematic diagram of a cross-sectional structure of another display substrate provided by an embodiment of the present disclosure and a bottom view of a first pin. Figure 1 Compared with the embodiment shown, Fig.12 In the embodiment shown, the isolation structure 107 made of the shadowless adhesive is removed after curing. Fig.12 The first pin 1031 is in the shape of a prism.

[0135] Fig.13 is a schematic diagram of a cross-sectional structure of another display substrate provided by an embodiment of the present disclosure. Figure 1 Compared with the embodiment shown, Fig.13 In the embodiment shown, the isolation structure 107 made of the shadowless adhesive is removed after curing. Fig.13In the embodiment shown, the first auxiliary support structure 1033 is made of resin, and the first auxiliary support structure 1033 made of resin has a plurality of first auxiliary support holes 1033a. The first pins 1031 and the conductive pads 1051 are located in the first auxiliary support holes 1033a.

[0136] Fig.14 FIG. 1 is a flow chart of a method for manufacturing a display substrate provided by an embodiment of the present disclosure. Fig.14 As shown, the method includes:

[0137] In step S1, a light-emitting unit is obtained, where the light-emitting unit includes a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode, respectively.

[0138] In step S2, a driving unit is obtained, the driving unit comprising: a third electrode, a fourth electrode, a driving circuit and a substrate, the third electrode and the fourth electrode are electrically connected to the driving circuit respectively.

[0139] In step S3, the light-emitting unit and the driving unit are bonded together through a bonding process so that the third electrode and the fourth electrode are both located on the side of the driving unit facing the light-emitting unit, the substrate is located on the side of the driving circuit away from the light-emitting unit, the third electrode is electrically connected to the first electrode, the fourth electrode is electrically connected to the second electrode, and the substrate is located on the side of the driving circuit away from the light-emitting unit.

[0140] In step S4, a support structure is fabricated on a side of the substrate away from the driving circuit, the support structure comprising a support area in contact with the driving unit, and the support structure comprising a plurality of first pins electrically connected to the driving circuit.

[0141] In step S5, a back plate is obtained. The back plate includes a plurality of conductive pads.

[0142] In step S6, the first pins are bonded to the back plate through a bonding process, wherein the plurality of conductive pads are connected to the plurality of first pins in a one-to-one correspondence.

[0143] The supporting structure includes a supporting area in contact with the driving unit, and a ratio of an orthographic projection of the supporting area on the back plate to an orthographic projection of the driving unit on the back plate is greater than or equal to 50%.

[0144] Exemplarily, the support structure also includes a first auxiliary support structure, and the first auxiliary support structure is in contact with the substrate and the back plate respectively. The manufacturing method also includes: before connecting the first pin and the back plate, an initial auxiliary support layer is applied on the side of the back plate close to the driving unit, and a plurality of grooves are formed in the initial auxiliary support layer to obtain the first auxiliary support structure, wherein the plurality of grooves correspond to the plurality of first pins, and the first pins are located in the grooves. The manufacturing method can be used to manufacture the first auxiliary support structure of resin material, and correspondingly, the manufacturing material of the initial auxiliary support layer is resin. Since the resin material is easy to etch, a plurality of grooves can be formed in the initial auxiliary support layer by etching.

[0145] Exemplarily, the support structure further includes a first auxiliary support structure, and the first auxiliary support structure is in contact with the substrate and the back plate respectively. The manufacturing method further includes: after connecting the first pin and the back plate, immersing the driving unit and the back plate fixedly connected by a plurality of first pins into a first auxiliary support material liquid, and solidifying to form the first auxiliary support structure. The first pin and the back plate are first connected and then the first auxiliary support structure is formed by immersing the first auxiliary support material liquid, so as to prevent the first auxiliary support material liquid from forming a part of the first auxiliary support structure between the first pin and the back plate, thereby affecting the electrical connection between the first pin and the back plate.

[0146] Exemplarily, the support structure plate also includes a second auxiliary support structure, and the second auxiliary support structure is connected to the side of the substrate away from the driving circuit; the manufacturing method also includes: after the light-emitting unit and the driving unit are bonded and connected by a bonding process, the initial substrate substrate connected to the side of the driving unit away from the light-emitting unit is thinned and punched to form a plurality of openings, and the plurality of openings correspond to the plurality of first pins one by one, so as to obtain the second auxiliary support structure. Since the initial substrate substrate, the thinned initial substrate substrate, and the second auxiliary support structure formed after punching the initial substrate substrate have never left the substrate, the three can play a good supporting role on the substrate during the manufacturing process, thereby preventing the problem of insufficient substrate support during the manufacturing process.

[0147] Fig.15 FIG. 1 is a flow chart of another method for manufacturing a display substrate provided by an embodiment of the present disclosure. Figure 1 The display substrate shown in FIG. The manufacturing process includes the following steps:

[0148] The first step, such as Fig.15 As shown in part (a) of FIG. 1 , a first substrate 104 and a light emitting unit 101 , and a driving unit 102 to which an initial supporting substrate 1030 is attached are obtained.

[0149] The first substrate 104 is located on one side of the light-emitting unit 101 . The light-emitting unit 101 includes a first electrode 1011 , a second electrode 1012 , and a light-emitting portion 1013 electrically connected to the first electrode 1011 and the second electrode 1012 , respectively. The first electrode 1011 and the second electrode 1022 are located on a side of the light-emitting portion 1013 away from the first substrate 104 .

[0150] The driving unit 102 includes: a third electrode 1021, a fourth electrode 1022, a driving circuit 1023 and a substrate 1024. The third electrode 1021 and the fourth electrode 1022 are electrically connected to the driving circuit respectively. The initial supporting substrate 1030 is located on a side of the substrate 1024 away from 1022.

[0151] Optionally, the initial support substrate 1030 is made of glass.

[0152] The second step is, Fig.15 As shown in part (b), the light-emitting unit 101 and the driving unit 102 are bonded and connected by a bonding process. The third electrode 1021 and the fourth electrode 1022 are both located on the side of the driving unit 102 facing the light-emitting unit 101, the substrate 1024 is located on the side of the driving circuit 1023 away from the light-emitting unit 101, the third electrode 1021 is electrically connected to the first electrode 1011, and the fourth electrode 1012 is electrically connected to the second electrode 1012.

[0153] Then, a protective film 108 is attached to the side of the first substrate 104 away from the light-emitting unit 101. The protective film 108 is used to prevent the silicon nanospheres in the subsequent auxiliary support material liquid from adhering to the side of the first substrate 104 away from the light-emitting unit 101 and located in the light-emitting area of ​​the display substrate, thereby reducing the impact on the light emission.

[0154] The third step is Fig.15 As shown in part (c) of the drawing, the isolation structure 107 is formed by, for example, a Czochralski method.

[0155] The protective film 108, the first substrate 104, the light-emitting unit 101, the driving unit 102 and the initial supporting substrate 1030 that are fixedly connected in sequence in the second step are repeatedly immersed in the auxiliary supporting material liquid, which is a solution containing silicon nanospheres, to form an isolation structure 107 made of silicon nanosphere material.

[0156] The fourth step is Fig.15 As shown in part (d) of FIG. 1 , the initial support substrate 1030 is removed. At this time, the substrate 1024 needs to play a supporting role. Since the thickness of the substrate 1024 in the embodiment of the present disclosure is relatively thick, the supporting role is better and the deformation is relatively small.

[0157] Step 5: Fig.15As shown in part (e) of the figure, a plurality of first pins 1031 are formed on a side of the substrate 1024 away from the driving circuit 1023, and the plurality of first pins 1031 are electrically connected to the driving circuit 1023. The first pins 1031 are bonded to the back plate 105 through a bonding process.

[0158] Optionally, laser drilling is used to drill holes on a side of the substrate 1024 away from the driving circuit 1023 , and metal material is filled in to form a connection structure, and then a plurality of first pins 1031 are formed on a side of the connection structure away from the driving circuit 1023 .

[0159] The back plate 105 includes a plurality of conductive pads 1051. The plurality of conductive pads 1051 are connected to the plurality of first pins 1031 in a one-to-one correspondence.

[0160] Step 6: Fig.15 As shown in part (f) of FIG. 1 , a first auxiliary support structure 1033 is formed between the substrate 1024 and the back plate 105, and then the protective film 108 is removed to form a structure as shown in FIG. Figure 1 The display substrate shown in .

[0161] Optionally, the fixedly connected driving unit 102 and the back plate 105 are immersed in an auxiliary support material liquid, where the auxiliary support material liquid is a solution containing silicon nanospheres, and solidifies to form a first auxiliary support structure 1033 made of silicon nanospheres.

[0162] Optionally, the first substrate 104 may be thinned by, for example, etching to obtain a thinner first substrate 104, so that the total thickness of the finally formed display substrate is thinner, thereby facilitating the thinning of the display substrate.

[0163] Fig.16 FIG. 1 is a flow chart of another method for manufacturing a display substrate provided by an embodiment of the present disclosure. Figure 7 The display substrate shown in FIG. In this production process:

[0164] The first step, such as Fig.16 As shown in part (a) of FIG. 1 , a first substrate 104 and a light emitting unit 101 are obtained, and a driving unit 102 to which an initial supporting substrate 1030 is attached. Fig.15 Same as the first step in .

[0165] The second step is, Fig.16 As shown in part (b), the light emitting unit 101 and the driving unit 102 are bonded together by a bonding process, but the protective film 108 is not attached to the side of the first substrate 104 away from the light emitting unit 101 .

[0166] The third step is Fig.16As shown in part (c), liquid shadowless glue is filled between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104, and is cured by ultraviolet light irradiation to form an isolation structure 107 made of shadowless glue. Optionally, the ultraviolet light irradiation time is about 10 seconds.

[0167] The fourth step is Fig.16 As shown in part (d) of FIG. 1 , the initial support substrate 1030 is thinned by, for example, etching to obtain a thinned initial support substrate 1030 ′.

[0168] Step 5: Fig.16 As shown in part (e), a plurality of openings are formed in the thinned initial support substrate 1030' by, for example, laser drilling to form a second auxiliary support structure 1034. A plurality of first pins 1031 are formed on the side of the second auxiliary support structure 1034 away from the drive circuit 1023, the plurality of first pins 1031 are electrically connected to the drive circuit 1023, and the plurality of first pins 1031 correspond one-to-one to the plurality of openings in the second auxiliary support structure 1034. Optionally, the material of the second auxiliary support structure 1034 is glass, and correspondingly, the material of the initial base substrate 1030 is glass.

[0169] Then, the first pins 1031 are bonded to the back plate 105 through a bonding process. The back plate 105 includes a plurality of conductive pads 1051 , and the plurality of conductive pads 1051 are connected to the plurality of first pins 1031 in a one-to-one correspondence.

[0170] and Fig.15 Compared with the embodiment shown, Fig.16 In the illustrated embodiment, the surface of the first pin away from the substrate 1024 has a first connection structure, and the surface of the conductive pad 1051 facing the substrate 1024 has a second connection structure. The first connection structure and the second connection structure both include a plurality of alternating recesses and a plurality of protrusions, the protrusions of the first connection structure are relatively connected to the recesses of the second connection structure, and the recesses of the first connection structure are relatively connected to the protrusions of the second connection structure.

[0171] Step 6: Fig.16 As shown in part (f) of FIG. 1 , the isolation structure 107 made of the shadowless adhesive is removed by heating, for example, heating to about 80 degrees Celsius. Figure 7 The display substrate shown in .

[0172] It should be noted that in Fig.16 In the fifth step of the manufacturing process shown in FIG. 1 , if the first pin 1031 and the conductive pad 1051 are in a prism shape, that is, the first pin 1031 does not have the first connection structure and the conductive pad 1051 does not have the second connection structure, the following can be obtained: Fig.12The display substrate is shown.

[0173] In addition, Fig.16 In the fifth step of the manufacturing process shown in FIG. 1 , if the first pin 1031 and the conductive pad 1051 are in a prism shape, that is, the first pin 1031 does not have the first connection structure and the conductive pad 1051 does not have the second connection structure, the following can be obtained: Fig.12 The display substrate is shown.

[0174] Fig.17 FIG. 1 is a flow chart of another method for manufacturing a display substrate provided by an embodiment of the present disclosure. Fig.13 The display substrate shown in FIG. Fig.15 Compared with the steps in the production process shown in the figure, in this production process:

[0175] The first step, such as Fig.17 As shown in part (a) of FIG. 1 , a first substrate 104 and a light emitting unit 101 are obtained, and a driving unit 102 to which an initial supporting substrate 1030 is attached. Fig.15 Same as the first step in .

[0176] The second step is, Fig.17 As shown in part (b), the light emitting unit 101 and the driving unit 102 are bonded together by a bonding process, but the protective film 108 is not attached to the side of the first substrate 104 away from the light emitting unit 101 .

[0177] The third step is Fig.17 As shown in part (c), liquid shadowless glue is filled between the driving unit 102 connected to the light-emitting unit 101 and the bearing surface of the first substrate 104, and is cured by ultraviolet light irradiation to form an isolation structure 107 made of shadowless glue. Optionally, the ultraviolet light irradiation time is about 10 seconds.

[0178] The fourth step is Fig.17 As shown in part (d) of FIG. 1 , the initial support substrate 1030 is removed. Fig.15 Same as step 4 in .

[0179] Step 5: Fig.17 As shown in part (e), a plurality of first pins 1031 are formed on a side of the substrate 1024 away from the driving circuit 1023, and the plurality of first pins 1031 are electrically connected to the driving circuit 1023. The back plate 105 is obtained, and the first pins 1031 and the back plate 105 are bonded and connected by a bonding process.

[0180] Among them, the back plate 105 includes a plurality of conductive pads 1051. An initial auxiliary support layer is coated on one side of the back plate 105 close to the driving unit 101, and a plurality of grooves, i.e., first auxiliary support holes 1033a, are formed in the initial auxiliary support layer by, for example, etching, to obtain a first auxiliary support structure 1033, wherein the plurality of grooves correspond to the plurality of first pins 1031, and the first pins 1031 are located in the grooves. And the grooves expose the surface of the conductive pad 1051 to facilitate the subsequent connection between the first pins 1031 and the conductive pad 1051. The manufacturing method can be used to manufacture a first auxiliary support structure made of resin material, and correspondingly, the manufacturing material of the initial auxiliary support layer is resin.

[0181] The plurality of conducting pads 1051 are connected to the plurality of first pins 1031 in a one-to-one correspondence.

[0182] Step 6: Fig.17 As shown in part (f) of FIG. 1 , the isolation structure 107 made of the shadowless adhesive is removed by heating, for example, heating to about 80 degrees Celsius. Fig.13 The display substrate shown in .

[0183] The embodiment of the present disclosure also provides a display panel, which includes any of the above display substrates, a touch layer and an encapsulation layer, wherein the touch layer and the encapsulation layer are sequentially stacked on a side of the light-emitting unit away from the driving unit. The display panel has the same effect as the above display substrate, which will not be described in detail here.

[0184] The embodiment of the present disclosure also provides a display device, which includes any of the above display substrates and a power supply circuit, the power supply circuit is used to supply power to the display substrate; or the display device includes the above display panel and a power supply circuit, the power supply circuit is used to supply power to the display panel. The display device has the same effect as the above display substrate, which will not be described in detail here.

[0185] Illustratively, the display device provided in the embodiments of the present disclosure may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or the like.

[0186] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A display substrate, characterized in that: include: A light-emitting unit (101), the light-emitting unit (101) comprising: a first electrode (1011), a second electrode (1012), and a light-emitting portion (1013) electrically connected to the first electrode (1011) and the second electrode (1012), respectively; A driving unit (102), the driving unit (102) comprising: a third electrode (1021), a fourth electrode (1022), a driving circuit (1023) and a substrate (1024), the third electrode (1021) and the fourth electrode (1022) both being located on a side of the driving unit (102) facing the light-emitting unit (101), the third electrode (1021) and the fourth electrode (1022) being electrically connected to the driving circuit (1023) respectively, the third electrode (1021) being electrically connected to the first electrode (1011), the fourth electrode (1022) being electrically connected to the second electrode (1012), and the substrate (1024) being located on a side of the driving circuit (1023) facing away from the light-emitting unit (101); A support structure (103), the support structure (103) being located on a side of the substrate (1024) away from the drive circuit (1023), the support structure (103) comprising a support area (103A) in contact with the drive unit (102), the support structure (103) comprising a plurality of first pins (1031), the plurality of first pins (1031) being electrically connected to the drive circuit (1023); a back plate (105), the back plate (105) being located on a side of the support structure (103) away from the light-emitting unit (101), the back plate (105) comprising a plurality of conductive pads (1051), the plurality of conductive pads (1051) being connected to the plurality of first pins (1031) in a one-to-one correspondence; Wherein, the ratio of the orthographic projection of the support area (103A) on the back plate (105) to the orthographic projection of the drive unit (102) on the back plate (105) is greater than or equal to 50%.

2. The display substrate according to claim 1, characterized in that: The driving unit (102) further comprises a connection structure (1025), the substrate (1024) has a connection via hole (1024a), and the connection structure (1025) is located in the connection via hole (1024a); The first pin (1031) is in contact with the connection structure (1025), and the first pin (1031) and the driving circuit (1023) are connected via the connection structure (1025).

3. The display substrate according to claim 2, characterized in that: The material of the substrate (1024) is one of polyimide, polyamide, acrylic resin and phenolic resin; The thickness of the substrate (1024) is in the range of 25 μm to 35 μm.

4. The display substrate according to claim 2, characterized in that: The support structure (103) further comprises a first auxiliary support structure (1033), wherein the first auxiliary support structure (1033) is in contact with the substrate (1024) and the back plate (105) respectively.

5. The display substrate according to claim 4, characterized in that: The material of the first auxiliary support structure (1033) includes at least one of resin, silicon nanospheres, metal oxide nanospheres and non-metal oxide nanospheres.

6. The display substrate according to claim 2, characterized in that: The support structure (103) further includes a second auxiliary support structure (1034), wherein the second auxiliary support structure (1034) is connected to a side of the substrate (1024) away from the drive circuit (1023), and the first pin (1031) is located on a side of the second auxiliary support structure (1034) away from the substrate (1024).

7. The display substrate according to claim 6, characterized in that: The material of the second auxiliary support structure (1034) is glass.

8. The display substrate according to claim 2, characterized in that: The first pin (1031) comprises a first surface facing the driving circuit (1023) and a second surface facing away from the driving circuit (1023); The orthographic projection area of ​​the first surface on the back plate (105) is greater than the orthographic projection area of ​​the second surface on the back plate (105).

9. The display substrate according to any one of claims 1 to 8, characterized in that: The first pin (1031) comprises a first connection structure (1031b), the first connection structure (1031b) is located on a side of the first pin (1031) away from the substrate (1024) and comprises a plurality of protruding structures; The conductive pad (1051) comprises a second connection structure (1051b), the second connection structure (1051b) is located on a side of the first pin (1031) away from the substrate (1024) and comprises a plurality of protruding structures; The protruding structure of the first connection structure (1031b) is staggeredly connected to the protruding structure of the second connection structure (1051b); or, The protruding structure of the first connection structure (1031b) is connected relative to the protruding structure of the second connection structure (1051b).

10. The display substrate according to any one of claims 1 to 8, characterized in that: The display substrate further comprises an isolation structure (107), wherein the isolation structure (107) is located between the light-emitting portion (1013) and the driving circuit (1023), and is respectively arranged in contact with the light-emitting portion (1013) and the driving circuit (1023); The isolation structure (107) surrounds the first electrode (1011) and the third electrode (1021) as a whole, so that the first electrode (1011) and the third electrode (1021) are isolated from the outside world; the isolation structure (107) surrounds the second electrode (1012) and the fourth electrode (1022) as a whole, so that the second electrode (1012) and the fourth electrode (1022) are isolated from the outside world.

11. The display substrate according to claim 10, characterized in that: The display substrate further comprises a first substrate (104), wherein the first substrate (104) is located on a side of the light-emitting unit (101) away from the driving unit (102), the isolation structure (107) surrounds the light-emitting unit (101) and is filled between the driving unit (102) connected to the light-emitting unit (101) and the first substrate (104), and the isolation structure (107) is arranged in contact with the driving unit (102) and the first substrate (104) respectively.

12. The display substrate according to claim 11, characterized in that: The material of the isolation structure (107) includes a shadowless adhesive 、 At least one of silicon nanospheres, metal oxide nanospheres and non-metal oxide nanospheres.

13. The display substrate according to any one of claims 1 to 8 and claims 11 to 12, characterized in that: At least one first pin among the plurality of first pins (1031) includes an alloy containing nickel and gold elements.

14. The display substrate according to any one of claims 1 to 8 and claims 11 to 12, characterized in that: The plurality of light-emitting units (101) include a first color light-emitting unit (101a), a second color light-emitting unit (101b) and a third color light-emitting unit (101c); The color of the light emitted by the first color light emitting unit (101a), the color of the light emitted by the second color light emitting unit (101b) and the color of the light emitted by the third color light emitting unit (101c) are different from each other.

15. The display substrate according to claim 14, characterized in that: The light-emitting portion (1013) comprises a color filter layer (1014), a color conversion layer (1015), and a light-emitting layer (1016) which are stacked in sequence in a direction close to the driving unit (102); the light-emitting color of the light-emitting layer (1016) is blue.

16. The display substrate according to claim 15, characterized in that: The light-emitting layer (1016) includes a first doped layer (10161), a multi-quantum well layer (10162) and a second doped layer (10163) which are stacked, wherein the first doped layer (10161) is electrically connected to the first electrode (1011), and the second doped layer (10163) is electrically connected to the second electrode (1012).

17. The display substrate according to any one of claims 1 to 8, claims 11 to 12 and claims 15 to 16, characterized in that: The driving circuit (1023) comprises a plurality of thin film transistors and at least one storage capacitor, each of the thin film transistors comprising a gate, a source and a drain; A first pin (1031) among the plurality of first pins (1031) is connected to a source electrode of a thin film transistor among the plurality of thin film transistors, and is used to provide a data driving signal from the backplane (105) to the driving circuit (1023).

18. The display substrate according to claim 17, characterized in that: The driving circuit (1023) comprises a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source-drain electrode layer and a planarization layer, which are located on one side of the substrate (1024) and are stacked in sequence; the third electrode (1021) and the fourth electrode (1022) are located on a side of the planarization layer away from the substrate (1024); The active layer includes a plurality of active patterns corresponding to the plurality of thin film transistors, each of the active patterns includes a source region, a drain region and a channel region; The source electrode and the drain electrode of the thin film transistor are located in the source-drain electrode layer, the source electrode of the thin film transistor is connected to the source electrode region, and the drain electrode of the thin film transistor is connected to the drain electrode region; The first gate layer includes a plurality of gate patterns corresponding to the plurality of thin film transistors, and the channel region is an overlapping region of an orthographic projection of the gate pattern on the substrate (1024) and an orthographic projection of the active pattern on the substrate (1024).

19. A method for manufacturing a display substrate, characterized in that: The method comprises: Acquire a light-emitting unit, wherein the light-emitting unit comprises: a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; Acquire a driving unit, the driving unit comprising: a third electrode, a fourth electrode, a driving circuit and a substrate, the third electrode and the fourth electrode being electrically connected to the driving circuit respectively; The light-emitting unit and the driving unit are bonded and connected by a bonding process, so that the third electrode and the fourth electrode are both located on a side of the driving unit facing the light-emitting unit, the substrate is located on a side of the driving circuit away from the light-emitting unit, the third electrode is electrically connected to the first electrode, the fourth electrode is electrically connected to the second electrode, and the substrate is located on a side of the driving circuit away from the light-emitting unit; A support structure is fabricated on a side of the substrate away from the driving circuit, wherein the support structure includes a support area in contact with the driving unit, and the support structure includes a plurality of first pins, and the plurality of first pins are electrically connected to the driving circuit; Obtaining a back plate, the back plate comprising a plurality of conductive pads; The first pins are bonded to the back plate through a bonding process, and the plurality of conductive pads are connected to the plurality of first pins in a one-to-one correspondence; Wherein, a ratio of an orthographic projection of the support area on the back plate to an orthographic projection of the drive unit on the back plate is greater than or equal to 50%.

20. The method for manufacturing a display substrate according to claim 19, characterized in that: The support structure further includes a first auxiliary support structure, wherein the first auxiliary support structure is in contact with the substrate and the back plate respectively; The production method further comprises: Before connecting the first pins and the back plate, an initial auxiliary support layer is coated on a side of the back plate close to the driving unit, and a plurality of grooves are formed in the initial auxiliary support layer to obtain a first auxiliary support structure, wherein the plurality of grooves correspond to the plurality of first pins, and the first pins are located in the grooves; or After the first pins and the back plate are connected, the driving unit and the back plate fixedly connected by the plurality of first pins are immersed in a first auxiliary support material liquid and solidified to form a first auxiliary support structure.

21. The method for manufacturing a display substrate according to claim 19, characterized in that: The support structure plate further includes a second auxiliary support structure, wherein the second auxiliary support structure is connected to a side of the substrate away from the driving circuit; The production method further comprises: After the light-emitting unit and the driving unit are bonded together through a bonding process, the initial base substrate connected to the side of the driving unit away from the light-emitting unit is thinned and punched to form a plurality of openings, and the plurality of openings correspond one-to-one to the plurality of first pins to obtain the second auxiliary support structure.

22. A display panel, characterized in that: The display panel comprises a display substrate, a touch layer and a packaging layer according to any one of claims 1 to 18, wherein the touch layer and the packaging layer are sequentially stacked on a side of the light-emitting unit away from the driving unit.

23. A display device, characterized in that: The display device comprises a display substrate and a power supply circuit according to any one of claims 1 to 18, wherein the power supply circuit is used to supply power to the display substrate; or The display device comprises the display panel as claimed in claim 22 and a power supply circuit, wherein the power supply circuit is used to supply power to the display panel.

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