Display panel, method for manufacturing display panel, and display device

Abstract

The application relates to the technical field of display, and provides a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, an insulating layer, a first wire and an encapsulation layer. The insulating layer comprises a first insulating subpart and a second insulating subpart connected with each other, and the second insulating subpart is arranged around the first insulating subpart. The first wire is located on the side of the insulating layer away from the substrate, the end of the first wire is in contact with the side surface of the first insulating subpart away from the substrate, the encapsulation layer is located on the side of the insulating layer away from the substrate and covers the first insulating subpart and the first wire, in the direction perpendicular to the surface where the substrate is located, the distance from the side of the first insulating subpart away from the substrate to the substrate is a first distance, the distance from the side of the second insulating subpart away from the substrate to the substrate is a second distance, and the first distance is smaller than the second distance. The display panel provided by the application can improve the use performance by improving the encapsulation effect.

Description

Technical Field

[0001] This application belongs to the field of display technology, and more specifically, relates to a display panel, a method for preparing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display panels are display devices that utilize the self-emissive principle of organic light-emitting materials to achieve display. They have advantages such as fast response speed, high brightness, and wide viewing angle, making them a highly competitive and promising type of display panel.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the display panel, and a display device, so as to improve the performance of the display panel to at least a certain extent.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, a display panel is provided, including a substrate, an insulating layer, a first trace, and an encapsulation layer. The insulating layer includes a first insulator portion and a second insulator portion connected together, the second insulator portion surrounding the first insulator portion. The first trace is located on the side of the insulating layer facing away from the substrate, and the end of the first trace contacts the surface of the first insulator portion facing away from the substrate. The encapsulation layer is located on the side of the insulating layer facing away from the substrate and covers the first insulator portion and the first trace. Along a direction perpendicular to the surface of the substrate, the distance from the side of the first insulator portion facing away from the substrate to the substrate is a first distance, and the distance from the side of the second insulator portion away from the substrate to the substrate is a second distance, wherein the first distance is less than the second distance.

[0006] In the display panel provided in this application embodiment, by providing a thinner first insulator portion on the insulating layer and placing the first insulator portion below the end of the first trace, the area of ​​the encapsulation layer covering the first trace can be effectively increased, thereby enhancing the barrier ability of the encapsulation layer against water, oxygen, etc., improving the encapsulation effect and performance of the display panel, and extending the service life of the display panel.

[0007] Optionally, the encapsulation layer includes a first encapsulation sub-part and a second encapsulation sub-part, the first encapsulation sub-part covering the first insulator part, and the second encapsulation sub-part surrounding the first encapsulation sub-part;

[0008] Along a direction perpendicular to the surface of the substrate, the distance between the side of the first package sub-part facing away from the substrate and the side of the first package sub-part close to the substrate is a third distance, and the distance between the side of the second package sub-part facing away from the substrate and the side of the second package sub-part close to the substrate is a fourth distance, wherein the third distance is greater than the fourth distance.

[0009] Optionally, the first trace includes a first metal layer and a second metal layer stacked together, the first metal layer being located on the side of the second metal layer facing away from the substrate, and the end of the first metal layer protruding relative to the end of the second metal layer in a direction parallel to the plane of the substrate.

[0010] Preferably, the first metal layer includes a protrusion and an extension connected together, the orthographic projection of the extension on the substrate coincides with the orthographic projection of the second metal layer on the substrate, the orthographic projection of the protrusion on the substrate does not overlap with the orthographic projection of the second metal layer on the substrate, and the orthographic projection of the protrusion on the substrate is located within the orthographic projection of the first insulator portion on the substrate, and the encapsulation layer covers the protrusion;

[0011] Preferably, the first trace further includes a third metal layer, which is located on the side of the second metal layer opposite to the first metal layer.

[0012] Optionally, at least a portion of the protrusion warps relative to the extension toward the side facing away from the substrate.

[0013] Optionally, the first packaging sub-part includes:

[0014] The first sub-part is located on the side of the first trace that faces away from the substrate;

[0015] The second sub-part is located on the side of the first insulator part facing away from the substrate, and is connected to the first sub-part to form a closed region.

[0016] Optionally, the first encapsulation sub-part defines a closed cavity between the protrusion and one end of the second metal layer pointing towards the middle of the first insulator part.

[0017] Optionally, the display panel further includes a display area and a non-display area, with the first insulator portion located in the non-display area.

[0018] In a second aspect, this application also provides a method for manufacturing a display panel, comprising:

[0019] Substrate;

[0020] An insulating material layer is prepared on one side of the substrate;

[0021] The insulating material layer is etched to form an insulating layer, the insulating layer including a first insulator portion and a second insulator portion, the second insulator portion being disposed around the first insulator portion;

[0022] A first trace is prepared on the side of the insulating layer facing away from the substrate, and the end of the first trace is in contact with the surface of the first insulator portion facing away from the substrate.

[0023] An encapsulation layer is prepared on the side of the insulating layer facing away from the substrate, and the encapsulation layer covers the first insulator portion and the first trace;

[0024] Wherein, along a direction perpendicular to the surface of the substrate, the distance from the side of the first insulator portion facing away from the substrate to the substrate is a first distance, and the distance from the side of the second insulator portion away from the substrate to the substrate is a second distance, and the first distance is less than the second distance.

[0025] Optionally, the step of fabricating the first trace on the side of the insulating layer opposite to the substrate includes:

[0026] A trace metal layer is prepared on the side of the insulating layer facing away from the substrate, and the trace metal layer covers the side of the first insulator portion facing away from the substrate;

[0027] The trace metal layer is etched and patterned to obtain the first trace.

[0028] In a third aspect, this application also provides a display device comprising the display panel described in any of the preceding claims, or a display panel prepared by the above-described preparation method.

[0029] The display device provided in this application includes the above-mentioned display panel. Therefore, the display device has the beneficial effects of including at least one or more of the above-mentioned display panels. The specific effects are as described above and will not be repeated here.

[0030] The beneficial effects of the display panel, display device, and display panel manufacturing method provided in this application are as follows: Compared with related technologies, the display panel provided in this application can improve the encapsulation effect of the encapsulation layer covering the first trace by thinning a local area of ​​the insulating layer and placing the end of the first trace in the thinned area. By thinning the insulating layer and forming a thinned first insulator portion, the encapsulation layer covering the first insulator portion can obtain a larger film-forming area. At this time, the structure with a certain height difference formed between the first insulator portion and the second insulator portion can extend the water and oxygen erosion path to a certain extent, and can also improve the encapsulation performance of the display panel. In addition, the thinning of the insulating layer also helps to increase the thickness of the encapsulation layer covering the first insulator portion, thereby better filling and wrapping the end of the first trace, and helping to reduce the possibility of the encapsulation layer being broken or damaged due to the first trace. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of a display panel in related technologies;

[0033] Figure 2 This is an enlarged view of the structure of area A in the display panel provided in the embodiments of this application;

[0034] Figure 3 for Figure 2 A cross-sectional view of the display panel is shown.

[0035] Figure 4 for Figure 3 Enlarged view of the structure of region B in the middle;

[0036] Figure 5 for Figure 2 Another cross-sectional view of the display panel is shown.

[0037] Figure 6 This is a flowchart illustrating the method for manufacturing a display panel as provided in an embodiment of this application.

[0038] Figures 7A-7E A schematic diagram illustrating the manufacturing process of the display panel provided in an embodiment of this application;

[0039] Figure 8 This is a schematic diagram of the planar structure of the display device provided in the embodiments of this application.

[0040] The following are the labeling elements in the figure:

[0041] 10. Display panel; 110. Display area; 120. Non-display area; 100. Display device;

[0042] 1. Substrate; 2. Insulating layer; 21. First insulator section; 22. Second insulator section; 2'. Insulating material layer;

[0043] 3. First trace; 31. First metal layer; 311. Protrusion; 312. Extension; 32. Second metal layer; 33. Third metal layer; 301. End; 3'. Trace metal layer;

[0044] 4. Encapsulation layer; 41. First encapsulation sub-section; 411. First sub-section; 412. Second sub-section; 42. Second encapsulation sub-section. Detailed Implementation

[0045] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0046] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0047] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0049] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0050] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0051] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0052] As used herein, the term "substrate" refers to a material on which subsequent material layers are added to provide a support substrate for the layers above. In some embodiments, the substrate may be flexible, stretchable, foldable, bendable, or rollable, such that the display panel may be flexible, stretchable, foldable, bendable, or rollable. The substrate material may be formed from any suitable insulating material that is flexible, such as polyimide (PI), polycarbonate (P), polyethersulfone (PES), or polymeric materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compounds (PR), or glass fiber reinforced plastic (FRP). The substrate may be transparent, translucent, or opaque. In other embodiments, the substrate may also be rigid, made of a rigid insulating material, such as metal, ultrathin glass, plastic, or sapphire wafer. The substrate itself may be patterned. The material added to the substrate can be patterned, or it can remain unpatterned.

[0053] The terms "layer" or "element" used in this document can refer to a structural or functional layer of a certain thickness and covering a certain area, composed of different materials that make up the structure of a display panel. A layer or element can extend over a complete layer or element structure located below or above, or have a smaller extent than the layer or element structure located below or above. It should be noted that the dimensions of layers and areas may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when a layer or element is referred to as being "on" another layer or element, it can be directly on the other layer or element, or it can be a layer located between two structures. Additionally, it is understood that when a layer or element is referred to as being "below" another layer or element, it can be directly below the other layer or element, or it can be more than one intermediate layer or element. It is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between two layers or two elements, or it can be more than one intermediate layer or element. Moreover, a layer or element can be a region of a homogeneous or non-homogeneous continuous structure with a thickness less than the thickness of that continuous structure. For example, the layer may be located between the top and bottom surfaces of the continuous structure or between any pair of lateral planes at the top and bottom surfaces. The layer may extend laterally, vertically, and / or along a tapered surface. The substrate may be a layer, and may include one or more layers. For example, the interconnect layer may include one or more conductor and contact layers (forming contacts, interconnects, and / or vias therein) and one or more dielectric layers.

[0054] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0055] In related technologies, to prevent moisture and other contaminants from penetrating the display panel, an encapsulation layer is typically placed above the driving circuit layer and the light-emitting elements to protect them. Research has shown that the encapsulation effect of this layer significantly impacts the display performance. Cracks in the encapsulation layer can lead to a decrease in its encapsulation performance or even failure. Moisture and oxygen can then penetrate the light-emitting elements and driving circuits through the cracks, directly causing the light-emitting elements to malfunction. As the area affected by water and oxygen increases, the affected area expands, resulting in poor display quality. Macroscopically, this manifests as black spots appearing in certain areas of the display panel.

[0056] Based on this, the present application provides a display panel 10, a method for manufacturing the display panel 10, and a display device 100, so as to at least alleviate or improve the above-mentioned technical problems to a certain extent.

[0057] Please see Figures 1-3 This application provides a display panel 10, which includes a substrate 1, an insulating layer 2, a first trace 3, and an encapsulation layer 4. The insulating layer 2 is located on one side of the substrate 1, and the first trace 3 is located on the side of the insulating layer 2 facing away from the substrate 1, and the first trace 3 only covers a portion of the surface of the insulating layer 2 facing away from the substrate 1. The encapsulation layer 4 is located on the side of the insulating layer 2 facing away from the substrate 1, and covers the first trace 3 and the surface of the insulating layer 2 facing away from the substrate 1.

[0058] Please see Figure 3 The aforementioned insulating layer 2 is a continuous film structure, and a non-penetrating groove is formed on a portion of its surface facing away from the substrate 1, so that the thickness of different regions of the insulating layer 2 is different, thereby forming a first insulator portion 21 and a second insulator portion 22 with different thicknesses and connected to each other. The second insulator portion 22 surrounds the first insulator portion 21, and the thickness of the first insulator portion 21 is less than that of the second insulator portion 22.

[0059] In other words, a portion of the surface of the insulating layer 2 facing away from the substrate 1 is thinned. The thinned portion forms the first insulator portion 21, and the unthinned portion forms the second insulator portion 22. The second insulator portion 22 surrounds the first insulator portion 21.

[0060] Along the direction perpendicular to the surface of the substrate 1, the distance from the side of the first insulator portion 21 facing away from the substrate 1 to the substrate 1 is the first distance d1, and the distance from the side of the second insulator portion 22 away from the substrate 1 to the substrate 1 is the second distance d2. The first distance d1 is less than the second distance d2.

[0061] The first trace 3 located on the surface of the insulating layer 2 facing away from the substrate 1 has an end 301 in its extending direction. The end 301 is located just above the surface of the first insulator portion 21 facing away from the substrate 1 and is in contact with the surface of the first insulator portion 21 facing away from the substrate 1. Please refer to [link / reference]. Figure 3 At this time, one end of the first trace 3 extends to the first insulator portion 21 and into the first insulator portion 21. Along the thickness direction of the substrate 1, the orthographic projection of the end 301 of the first trace 3 on the substrate 1 falls exactly within the orthographic projection of the first insulator portion 21 on the substrate 1. In addition, the first trace 3 also includes a portion of the trace film layer located on the side surface of the second insulator portion 22 facing away from the substrate 1, and is connected to the portion of the first trace 3 located on the side surface of the first insulator portion 21 facing away from the substrate 1.

[0062] When the encapsulation layer 4 is prepared on the surface of the above-mentioned film layer, since there is a thickness difference between the first insulator portion 21 and the second insulator portion 22, the film-forming area of ​​the encapsulation layer 4 attached to the surface of the above-mentioned film layer is increased to a certain extent, which can extend the water and oxygen erosion path to a certain extent.

[0063] Therefore, by providing a thinner first insulator portion 21 on the insulating layer 2 and positioning the first insulator portion 21 below the end 301 of the first trace 3, the encapsulation area of ​​the encapsulation layer 4 covering the first trace 3 can be effectively increased. This allows the encapsulation layer 4 to more fully fill the surface of the first insulating groove with the end 301 of the first trace 3, thereby better blocking the water and oxygen transmission path, improving the barrier ability of the encapsulation layer 4 against water and oxygen, improving the encapsulation effect and performance of the display panel 10, and extending the service life of the display panel 10.

[0064] In some embodiments, the insulating layer 2 can be prepared by photolithography to obtain a first insulator portion 21 and a second insulator portion 22 with different thicknesses.

[0065] In the above preparation process, a mask can be used to carry the corresponding etching pattern to ensure that the desired structure can be obtained after etching.

[0066] Specifically, when preparing the insulating layer 2, the mask used can be a CNTO (contact-oxide-metal) mask or other masks with similar structures or functions.

[0067] CNTO MASK is a photomask commonly used in semiconductor manufacturing, especially for processing contact structures, oxide layers, and metal layers. The applications and structure of this mask have been disclosed in related technologies and will not be elaborated upon here.

[0068] Please see Figure 1 and Figure 2 The display panel 10 includes a display area 110 and a non-display area 120, wherein an insulating layer 2 extends from the display area 110 to the non-display area 120.

[0069] In some embodiments, the first insulator portion 21 is located in the non-display area 120.

[0070] Specifically, the number of first insulator portions 21 can be one or more. When there are multiple first insulator portions 21, they are arranged at intervals in the non-display area 120. When the first insulator portions 21 are formed in the non-display area 120 adjacent to the display area 110, the improved structure described above can further improve the encapsulation effect of the light-emitting elements in the display area 110 adjacent to the first insulator portions 21, and effectively reduce the possibility of light-emitting elements in this area failing to emit light due to water and oxygen corrosion or other reasons.

[0071] For example, the first insulator portion 21 is formed outside the arc-shaped edge of the display area 110 near the bonding area. Therefore, the possibility of light-emitting elements near the arc-shaped edge of the display area 110 failing to emit light due to water and oxygen erosion can be effectively reduced.

[0072] Of course, it is also possible that some of the first insulator portions 21 are distributed in the display area 110. This embodiment does not limit the specific distribution area of ​​the first insulator portions 21 or the shape of the grooves formed.

[0073] In related technologies, the insulating layer 2 can be directly attached to the surface of the substrate 1, or other multilayer film structures can be arranged between it and the substrate 1, such as a buffer layer, a gate insulating layer 2, and other metal trace structures with conductive communication functions. The distribution and function of the above-mentioned film structures have been disclosed in related technologies and will not be repeated here.

[0074] Please see Figure 3 The portion of the first trace 3 located on the side of the first insulating layer 2 facing away from the substrate 1 is defined as trace one, and the portion located on the side of the second insulating layer 2 facing away from the substrate 1 is defined as trace two. Trace one and trace two have the same film layer structure and are disposed in the same layer.

[0075] In the actual processing, trace one and trace two are prepared through the same process.

[0076] Since the distance from the surface of the first insulator portion 21 facing away from the substrate 1 to the substrate 1 is a first distance d1, and the distance from the surface of the second insulator portion 22 facing away from the substrate 1 to the substrate 1 is a second distance d2, and the first distance d1 is less than the second distance d2, when trace one and trace two are fabricated by the same process and have essentially the same thickness, the surface of trace one facing away from the substrate 1 and the surface of trace two facing away from the substrate 1 are located on different planes.

[0077] The surface of trace 1 facing away from substrate 1 is defined as the first surface, and the surface of trace 2 facing away from substrate 1 is defined as the second surface. The first surface is located on the side of the second surface facing substrate 1.

[0078] In other words, since a portion of the first insulator portion 21 has been thinned and a groove structure has been formed, the surface of the first trace 3 on the side of the first insulator portion 21 facing away from the substrate 1 is also affected and forms a concave-convex surface.

[0079] Before the encapsulation layer 4 is prepared, the surface of the film layer used to deposit the encapsulation layer 4 is affected by the first insulator part 21, the second insulator part 22 and the first trace 3, etc., and its surface has multiple uneven step-like structures.

[0080] To better encapsulate the surface of the aforementioned film layer and reduce the possibility of poor encapsulation, encapsulation gaps, or other issues affecting the encapsulation effect in the encapsulation layer 4, in some embodiments, the encapsulation layer 4 comprises at least two stacked film layer structures. Please refer to [link to relevant documentation]. Figure 5 The encapsulation film layer closer to the substrate 1 is defined as the first encapsulation layer 4, and the encapsulation film layer farther from the substrate 1 is defined as the second encapsulation layer 4. In some embodiments, the first encapsulation layer 4 can be configured to have a better step coverage effect, and the second encapsulation layer 4 can have a better leveling effect.

[0081] After the first encapsulation layer 4 is prepared, it can effectively cover the substrate surface with complex morphology, so that the first trace 3 and the surface of the insulating layer 2 can be uniformly encapsulated and protected. After the second encapsulation layer 4 is prepared, it can fill the recessed area formed by the first insulator portion 21, so as to further wrap and cover the first trace 3, so that the first trace 3, especially the end 301, can obtain a better encapsulation effect. It also helps to prevent the portion of the encapsulation layer 4 corresponding to the end 301 of the first trace 3 from forming a gap that allows it to penetrate the external environment.

[0082] In some embodiments, the first encapsulation layer 4 can be prepared by chemical vapor deposition (CVD); and / or, the second encapsulation layer 4 can be prepared by inkjet printing.

[0083] The first encapsulation layer 4 prepared by chemical vapor deposition has good adhesion and step coverage, and can better cover the film surface with complex morphology, so as to ensure that the surface of the prepared display panel 10 can be uniformly encapsulated and protected.

[0084] In addition, the films prepared by chemical vapor deposition have the advantages of relatively uniform thickness and good density, which can effectively block the intrusion of external water vapor, oxygen, impurities, etc., and help improve the stability and reliability of the device.

[0085] Of course, when preparing the above-mentioned encapsulation layer 4, the second encapsulation layer 4 can be prepared immediately after the first encapsulation layer 4 is prepared, so as to achieve continuous preparation of the first encapsulation layer 4 and the second encapsulation layer 4; or, according to the actual process requirements, after the first encapsulation layer 4 is prepared, some other film layers can be prepared first, and then the second encapsulation layer 4 can be prepared when the display panel 10 is finally encapsulated. This embodiment does not limit the specific preparation order of the above-mentioned stacked multiple encapsulation film layers.

[0086] Of course, considering that chemical vapor deposition technology also has certain leveling properties, the above-mentioned encapsulation layer 4 can also be considered as a single-layer film layer prepared by chemical vapor deposition technology.

[0087] In some embodiments, the first encapsulation layer 4 includes a first encapsulation sub-part 41 and a second encapsulation sub-part 42. The first encapsulation sub-part 41 is disposed corresponding to and covers the first insulator part 21, and the second encapsulation sub-part 42 is disposed around the first encapsulation sub-part 41 to cover the second insulator part 22.

[0088] It should be noted that at this time, in the first trace 3 located between the first encapsulation layer 4 and the insulation layer 2, trace one is located between the first encapsulation sub-part 41 and the first insulator part 21, and trace two is located between the second encapsulation sub-part 42 and the second insulator part 22.

[0089] Due to the thickness difference between the first insulator portion 21 and the second insulator portion 22, as well as the uneven distribution of the first trace 3, the surface of the first encapsulation sub-part 41 facing away from the substrate 1 also has a complex morphology with a certain height difference.

[0090] Along the direction perpendicular to the surface of the substrate 1, the distance between the side of the first package sub-part 41 facing away from the substrate 1 and the side of the first package sub-part 41 close to the substrate 1 is the third distance d3, and the distance between the side of the second package sub-part 42 facing away from the substrate 1 and the side of the second package sub-part 42 close to the substrate 1 is the fourth distance d4. The third distance d3 is greater than the fourth distance d4.

[0091] Since the first encapsulation sub-part 41 is provided corresponding to the first insulator part 21, and the thickness of the first insulator part 21 is less than the thickness of the second insulator part 22, after the encapsulation layer 4 is applied to cover and wrap the first trace 3 and fills the groove formed in the area corresponding to the first insulator part 21, the thickness of the first encapsulation sub-part 41 will necessarily be greater than the thickness of the second encapsulation sub-part 42.

[0092] Generally speaking, the distance difference between the first distance d1 and the second distance d2 is roughly the same as the distance difference between the fourth distance d4 and the third distance d3.

[0093] It is important to note that the greater the difference between the first distance d1 and the second distance d2, the thicker the first encapsulation sub-part 41, which fills and covers the first insulator portion 21 and the end 301 of the first trace 3, will be, resulting in a better encapsulation effect of the encapsulation layer 4 on the first trace 3 and the first insulator portion 21. However, this distance difference can also affect the resistance of the first trace 3, and may even cause the first trace 3 to break when crossing the groove, thus affecting the yield of the display panel 10. Therefore, the difference between the first distance d1 and the second distance d2 should not be too large.

[0094] Please see Figure 3 The first trace 3 can be a single-layer structure or a stacked structure made of different materials.

[0095] Please see Figure 4 The first trace 3 is a stacked structure, including at least a first metal layer 31 and a second metal layer 32 stacked together, with the first metal layer 31 located on the side of the second metal layer 32 facing away from the substrate 1.

[0096] Along a direction parallel to the plane of substrate 1, the end of the first metal layer 31 protrudes relative to the end of the second metal layer 32. Figure 4 Taking the orientation shown as an example, the end of the first metal layer 31 protrudes to the right relative to the end of the second metal layer 32.

[0097] Specifically, the first metal layer 31 includes a protrusion 311 and an extension 312 connected together. The orthographic projection of the extension 312 on the substrate 1 coincides with the orthographic projection of the second metal layer 32 on the substrate 1. The orthographic projection of the protrusion 311 on the substrate 1 does not overlap with the orthographic projection of the second metal layer 32 on the substrate 1. The orthographic projection of the protrusion 311 on the substrate 1 is located within the orthographic projection of the first insulator portion 21 on the substrate 1.

[0098] The encapsulation layer 4 covers the protrusion 311 to effectively wrap and encapsulate the protrusion 311.

[0099] It should be noted that the above-mentioned "non-overlapping" means that the orthographic projection of the protrusion 311 on the substrate 1 and the orthographic projection of the second metal layer 32 on the substrate 1 are spaced apart; or, the orthographic projection of the protrusion 311 on the substrate 1 and the orthographic projection of the second metal layer 32 on the substrate 1 have only a portion of their outer contours that coincide, while the rest of the areas do not overlap.

[0100] The protrusion 311 is located at the end 301 of the first trace 3 and is an integral film structure of the same layer as the extension 312. Along the direction parallel to the plane of the substrate 1, the side of the second metal layer 32 pointing to the end 301 of the first trace 3 is recessed inward relative to the first metal layer 31, thereby causing the protrusion 311 connected to the extension 312 to be suspended relative to the second metal layer 32.

[0101] In some embodiments, the first trace 3 is fabricated by patterned etching. When etching the first trace 3, due to the different etching rates of different materials, the first metal layer 31 protrudes outward relative to the second metal layer 32 at the end 301 of the first trace 3.

[0102] The aforementioned end portion 301 is located on the first trace and is covered by the first encapsulation sub-part 41. Since the thickness of the first encapsulation sub-part 41 is greater than the thickness of the second encapsulation sub-part 42, the first encapsulation sub-part 41 can effectively wrap around and cover the end portion 301 of the first trace 3, as well as the recessed area and protrusion 311 formed on the end portion 301. The complex morphology formed by the recessed portion and the protruding portion 311 can be fully wrapped by the thicker first encapsulation sub-part 41, while also effectively reducing the defects in the encapsulation layer 4 that are prone to cracking due to the influence of the recessed portion and the protruding portion 311, thus effectively improving the reliability of the encapsulation layer 4.

[0103] In some embodiments, at least a portion of the protrusion 311 is warped relative to the extension 312 toward the side opposite to the substrate 1. In this case, the free end of the protrusion 311 can be warped toward the side opposite to the substrate 1 in a direction perpendicular to the plane of the substrate 1, thus forming a curved shape. Please refer to [link to relevant documentation]. Figure 4 .

[0104] In some embodiments, the material of the encapsulation layer 4 includes organic materials.

[0105] Organic materials possess certain hygroscopic properties and can absorb some moisture. Since the encapsulation layer 4 is attached to and fixedly connected to the protrusion 311, the organic material constituting the encapsulation layer 4 will slightly expand after absorbing a suitable amount of moisture. Because there is no direct contact between the protrusion 311 and the second metal layer 32, slight expansion of a portion of the encapsulation layer 4 may cause the protrusion 311 to slightly fold or lift away from the substrate 1. Since the thickness of the first encapsulation sub-part 41 covering the first insulator portion 21 is greater than the thickness of the second encapsulation sub-part 42 covering the second insulator portion 22, the first encapsulation sub-part 41 can still maintain good encapsulation performance and prevent cracks even when the protrusion 311 slightly warps.

[0106] Please see Figure 4 The first encapsulation sub-part 41 used to cover the first insulator portion 21 includes a first sub-part 411 and a second sub-part 412 connected together. The first sub-part 411 is located on the side of the first trace 3 facing away from the substrate 1, that is, on the side of the first metal layer 31 facing away from the substrate 1. The second sub-part 412 is located on the side of the first insulator portion 21 facing away from the substrate 1 and is connected to the first sub-part 411. A closed area is formed on the side of the second sub-part 412 pointing towards the first sub-part 411.

[0107] It is understood that, in the embodiments of this application, the second sub-part 412 is used to cover the area on the surface of the first insulator part 21 where the first trace 3 is not provided, and the first sub-part 411 is used to cover the side surface of the first trace 3 facing away from the substrate 1. The first sub-part 411 and the second sub-part 412 are connected to form a complete and continuous first package sub-part 41.

[0108] The aforementioned closed area refers to the area where the outer contours of the first sub-part 411 and the second sub-part 412 are directly connected and remain closed, so that the first encapsulation sub-part 41 is a complete and continuous film structure, and there are no defects such as breaks or cracks in any area. The closed area is formed at the connection between the first sub-part 411 and the second sub-part 412.

[0109] Considering that there is a gap between the protrusion 311 and one end of the second trace pointing end 301 (i.e., the protrusion 311 is suspended relative to the second trace), in some embodiments, a closed cavity is defined on the first encapsulation sub-part 41 covering the protrusion 311. The closed cavity is formed in the region of the first encapsulation sub-part 41 facing the end 301 of the first trace 3.

[0110] Specifically, the first encapsulation sub-part 41 defines a closed chamber between the protrusion 311 and the end of the second metal layer 32 pointing towards the middle of the first insulator part 21. Please refer to [link / reference]. Figure 4 .

[0111] It should be noted that when there are at least two first traces 3, there is a possibility that both ends 301 and the surrounding area of ​​the first traces 3 may define the aforementioned closed chamber, there is a possibility that only one end 301 and the surrounding area of ​​the first traces 3 may define the aforementioned closed chamber, and there is a possibility that neither end 301 and the surrounding area of ​​the two first traces 3 may form the aforementioned closed chamber.

[0112] This embodiment does not limit the size and dimensions of the resulting closed chamber.

[0113] Of course, in other similar embodiments, the first trace 3 can also be a trace structure in which three layers of metal are stacked in sequence.

[0114] Specifically, the first trace 3 mentioned above also includes a third metal layer 33. Please refer to [link / reference]. Figure 4 The third metal layer 33 is located on the side of the second metal layer 32 that faces away from the first metal layer 31. At this time, the three metal layers are stacked in sequence to form a complete first trace 3.

[0115] In some embodiments, the material of the first metal layer 31 includes titanium, the material of the second metal layer 32 includes aluminum, and the material of the third metal layer 33 includes titanium.

[0116] The first trace 3 is a titanium / aluminum / titanium (Ti / Al / Ti) stacked structure. Please refer to [link / reference]. Figure 4 At this time, the end of the second metal layer 32 moves inward relative to the first metal layer 31 and the third metal layer 33. In the direction perpendicular to the plane of the substrate 1, the end of the second metal layer 32 is recessed inward relative to the first metal layer 31 and the third metal layer 33. The orthographic projection of the first metal layer 31 on the substrate 1 and the orthographic projection of the third metal layer 33 on the substrate 1 can coincide exactly. At this time, the orthographic projection of the second metal layer 32 on the substrate 1 is located within the orthographic projection of the third metal layer 33 on the substrate 1; or, due to the warping of the protrusion 311, the orthographic projection of the first metal layer 31 on the substrate 1 is located within the orthographic projection of the third metal layer 33 on the substrate 1.

[0117] It is understood that the display panel 10 provided in this application embodiment can improve the structure of the insulating layer 2 that contacts the surface of the end 301 of the first trace 3, so that the encapsulation layer 4 covering the end 301 of the first trace 3 can have a larger encapsulation area and a thicker film layer, thereby improving the encapsulation effect of the encapsulation layer 4 covering the first trace 3 and ultimately improving the performance of the display panel 10.

[0118] By thinning the insulating layer 2 to form a thinned first insulator portion 21, the encapsulation layer 4 covering the first insulator portion 21 can obtain a larger film-forming area. At this time, the structure with a certain height difference formed between the first insulator portion 21 and the second insulator portion 22 can extend the water and oxygen erosion path to a certain extent and improve the encapsulation performance of the display panel 10. In addition, the thinning of the insulating layer 2 also helps to increase the thickness of the encapsulation layer 4 covering the first insulator portion 21, thereby better filling and wrapping the end 301 of the first trace 3, which helps to reduce the possibility of the encapsulation layer 4 being broken or damaged due to the first trace 3.

[0119] Based on the same inventive concept, this application also provides a method for manufacturing a display panel 10. Please refer to [link to relevant documentation]. Figure 6 .

[0120] The preparation method includes:

[0121] Step S1: Obtain substrate 1;

[0122] Step S2: Prepare an insulating material layer 2' on one side of substrate 1;

[0123] Step S3: Etch the insulating material layer 2' to form the insulating layer 2. The insulating layer 2 includes a first insulator portion 21 and a second insulator portion 22, with the second insulator portion 22 surrounding the first insulator portion 21.

[0124] Step S4: A first trace 3 is prepared on the side of the insulating layer 2 facing away from the substrate 1, and the end 301 of the first trace 3 is in contact with the surface of the first insulator portion 21 facing away from the substrate 1.

[0125] Step S5: Prepare an encapsulation layer 4 on the side of the insulating layer 2 facing away from the substrate 1. The encapsulation layer 4 covers the first insulator portion 21 and the first trace 3.

[0126] Wherein, along the direction perpendicular to the surface where the substrate 1 is located, the distance from the side of the first insulator portion 21 facing away from the substrate 1 to the substrate 1 is the first distance d1, and the distance from the side of the second insulator portion 22 away from the substrate 1 to the substrate 1 is the second distance d2, and the first distance d1 is less than the second distance d2.

[0127] Please see Figure 7A The insulating material layer 2' located on one side of the substrate 1 has a smooth surface on the side facing away from the substrate 1.

[0128] After step S3, the insulating material layer 2' is thinned by etching to obtain an insulating layer 2 including a first insulator portion 21 and a second insulator portion 22. At this time, the surface of the insulating layer 2 facing away from the substrate 1 has a complex morphology with grooves. Please refer to [link to relevant documentation]. Figure 7B .

[0129] Step S3 can be performed by photolithography to process the insulating material layer 2'. Using a mask, the insulating material layer 2' can be patterned and etched to reduce the thickness of the insulating material layer 2' in certain areas, and to form an insulating layer 2 having a first insulator portion 21 and a second insulator portion 22.

[0130] In step S3, a mask can be used to carry the corresponding etching pattern to ensure that the desired structure can be obtained after etching is completed.

[0131] Specifically, when preparing the insulating layer 2, the mask used can be a CNTO (contact-oxide-metal) mask or other masks with similar structures or functions.

[0132] In step S4, the step of fabricating the first trace 3 on the side of the insulating layer 2 facing away from the substrate 1 includes:

[0133] Step S41: A trace metal layer 3' is prepared on the side of the insulating layer 2 facing away from the substrate 1. The trace metal layer 3' covers the side of the first insulator portion 21 facing away from the substrate 1. Please refer to [link to relevant documentation]. Figure 7C ;

[0134] Step S42: Etch and pattern the trace metal layer 3' to obtain the first trace 3. Please refer to [link / reference]. Figure 7D .

[0135] In step S4, the patterned photoresist can be used as a mask to etch the trace metal layer 3'.

[0136] Specifically, after step S41 is completed, step S42 is executed. The specific process of step S42 is as follows:

[0137] Step S421: Cover the surface of the wiring metal layer 3' facing away from the substrate 1 with photoresist;

[0138] Step S422: Pattern the photoresist;

[0139] Step S423: Using the patterned photoresist as a mask, etch the wiring metal layer 3' to obtain the first wiring 3;

[0140] Step S424: After etching is completed, perform a photoresist pattern stripping operation to remove the photoresist pattern obtained in the above steps.

[0141] Step S42 is now complete.

[0142] Finally, step S5 is performed to obtain the encapsulation layer 4 covering the insulating layer 2 and the first trace 3. Please refer to [link / reference]. Figure 7E .

[0143] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0144] It is understood that the method for preparing the display panel 10 provided in this application embodiment has the effect of improving the packaging performance of the display panel 10 and further improving the performance of the display panel 10.

[0145] Based on the same inventive concept, this application also provides a display device 100, please refer to... Figure 8 The display device 100 includes the display panel 10 described in any of the above-described embodiments, or the display panel 10 prepared by the above-described preparation method.

[0146] For details regarding the specific structure of the display panel 10, please refer to the specific description in the foregoing embodiments, which will not be repeated here.

[0147] The display device 100 provided in this embodiment can be a mobile phone, laptop, tablet computer, smartwatch, smart bracelet, navigator, monitor, personal digital assistant (PDA), or other products or components with display functions.

[0148] Since the display device 100 has the aforementioned display panel 10, the display device 100 has at least the beneficial effects of any one or more of the aforementioned display panels 10. The specific effects are as described above and will not be repeated here.

[0149] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized by, include: Substrate (1); An insulating layer (2) includes a first insulator portion (21) and a second insulator portion (22) connected together, the second insulator portion (22) being disposed around the first insulator portion (21); The first trace (3) is located on the side of the insulating layer (2) facing away from the substrate (1). The end (301) of the first trace (3) is in contact with the surface of the first insulator part (21) facing away from the substrate (1). The first trace (3) includes a first metal layer (31) and a second metal layer (32) stacked together. The first metal layer (31) is located on the side of the second metal layer (32) facing away from the substrate (1). Along a direction parallel to the plane of the substrate (1), the end of the first metal layer (31) protrudes relative to the end of the second metal layer (32). The first metal layer (31) includes a protrusion (311). The orthographic projection of the protrusion (311) on the substrate (1) does not overlap with the orthographic projection of the second metal layer (32) on the substrate (1). The orthographic projection of the protrusion (311) on the substrate (1) is located within the orthographic projection of the first insulator part (21) on the substrate (1). The encapsulation layer (4) is located on the side of the insulating layer (2) facing away from the substrate (1) and covers the first insulator portion (21) and the first trace (3). The encapsulation layer (4) contacts and covers the protrusion (311). It includes a first encapsulation sub-part (41) and a second encapsulation sub-part (42). The first encapsulation sub-part (41) covers the first insulator portion (21) and wraps around and covers the end (301) of the first trace (3). The second encapsulation sub-part (42) is disposed around the first encapsulation sub-part (41). Along a direction perpendicular to the surface of the substrate (1), the distance from the side of the first insulator portion (21) facing away from the substrate (1) to the substrate (1) is a first distance, the distance from the side of the second insulator portion (22) away from the substrate (1) to the substrate (1) is a second distance, the distance between the side of the first encapsulation portion (41) facing away from the substrate (1) and the side of the first encapsulation portion (41) close to the substrate (1) is a third distance, and the distance between the side of the second encapsulation portion (42) facing away from the substrate (1) and the side of the second encapsulation portion (42) close to the substrate (1) is a fourth distance. The first distance is less than the second distance, and the third distance is greater than the fourth distance.

2. The display panel of claim 1, wherein, The first metal layer (31) includes an extension (312) connected to the protrusion (311), and the orthographic projection of the extension (312) on the substrate (1) coincides with the orthographic projection of the second metal layer (32) on the substrate (1).

3. The display panel of claim 2, wherein, The first trace (3) also includes a third metal layer (33), which is located on the side of the second metal layer (32) facing away from the first metal layer (31).

4. The display panel according to claim 2, characterized in that, At least part of the protrusion (311) warps toward the side opposite to the substrate (1) relative to the extension (312).

5. The display panel according to claim 1, characterized in that, The first encapsulation sub-part (41) includes: The first sub-part (411) is located on the side of the first trace (3) facing away from the substrate (1); The second sub-part (412) is located on the side of the first insulator part (21) facing away from the substrate (1) and is connected to the first sub-part (411) to form a closed area.

6. The display panel according to claim 4, characterized in that, The first encapsulation sub-part (41) defines a closed cavity between the protrusion (311) and the end of the second metal layer (32) pointing towards the middle of the first insulator part (21).

7. The display panel according to any one of claims 1-6, characterized in that, The display panel (10) further includes a display area (110) and a non-display area (120), with the first insulator portion (21) located in the non-display area (120).

8. A method for manufacturing a display panel, characterized in that, include: Substrate (1); An insulating material layer is prepared on one side of the substrate (1); The insulating material layer is etched to form an insulating layer (2), the insulating layer (2) including a first insulator portion (21) and a second insulator portion (22), the second insulator portion (22) being disposed around the first insulator portion (21); A first trace (3) is prepared on the side of the insulating layer (2) facing away from the substrate (1). The end (301) of the first trace (3) is in contact with the surface of the first insulator part (21) facing away from the substrate (1). The first trace (3) includes a first metal layer (31) and a second metal layer (32) stacked together. The first metal layer (31) is located on the side of the second metal layer (32) facing away from the substrate (1). Along a direction parallel to the plane of the substrate (1), the end of the first metal layer (31) protrudes relative to the end of the second metal layer (32). The first metal layer (31) includes a protrusion (311). The orthographic projection of the protrusion (311) on the substrate (1) does not overlap with the orthographic projection of the second metal layer (32) on the substrate (1). The orthographic projection of the protrusion (311) on the substrate (1) is located within the orthographic projection of the first insulator part (21) on the substrate (1). An encapsulation layer (4) is prepared on the side of the insulating layer (2) facing away from the substrate (1). The encapsulation layer (4) covers the first insulator portion (21) and the first trace (3). The encapsulation layer (4) contacts and covers the protrusion (311). It includes a first encapsulation sub-part (41) and a second encapsulation sub-part (42). The first encapsulation sub-part (41) covers the first insulator portion (21) and wraps around and covers the end (301) of the first trace (3). The second encapsulation sub-part (42) is disposed around the first encapsulation sub-part (41). Wherein, along the direction perpendicular to the surface where the substrate (1) is located, the distance from the side of the first insulator portion (21) facing away from the substrate (1) to the substrate (1) is the first distance, the distance from the side of the second insulator portion (22) away from the substrate (1) to the substrate (1) is the second distance, the distance between the side of the first encapsulation portion (41) facing away from the substrate (1) and the side of the first encapsulation portion (41) close to the substrate (1) is the third distance, and the distance between the side of the second encapsulation portion (42) facing away from the substrate (1) and the side of the second encapsulation portion (42) close to the substrate (1) is the fourth distance, the first distance is less than the second distance, and the third distance is greater than the fourth distance.

9. The method for manufacturing a display panel according to claim 8, characterized in that, The step of fabricating the first trace (3) on the side of the insulating layer (2) facing away from the substrate (1) includes: A trace metal layer is prepared on the side of the insulating layer (2) facing away from the substrate (1), and the trace metal layer covers the side of the first insulator portion (21) facing away from the substrate (1); The metal layer of the trace is etched and patterned to obtain the first trace (3).

10. A display device, characterized in that, The display panel (10) includes any one of claims 1-7, or the display panel (10) prepared according to claim 8 or 9.

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