Camera device and optical apparatus

Abstract

An embodiment includes: a fixed portion including a cover member including a top plate and a side plate connected to the top plate; a moving portion including a bracket disposed in the cover member, a first circuit board disposed on the bracket, and an image sensor electrically connected to the first circuit board; and a support portion coupled to the bracket and supporting the moving portion with respect to the fixed portion, in which the bracket includes a side portion, a corner portion, and a stopper protruding from an outer surface of the side portion of the bracket toward a side plate of the cover member, and the stopper is disposed closer to a center of the side portion of the bracket than the corner portion of the bracket.

Description

Technical Field

[0001] The present embodiment relates to a camera device and an optical instrument including the camera device. Background Art

[0002] The voice coil motor (VCM) technology used in conventional general-purpose camera devices is difficult to apply to miniature camera devices that aim to achieve low power consumption, and related research has been actively conducted.

[0003] The demand and production of electronic products such as smartphones and mobile phones equipped with cameras are growing. The resolution of mobile phone cameras is increasing and the size is decreasing, so their actuators are also required to become smaller, larger in diameter, and more functional. In order to achieve high-resolution mobile phone cameras, it is necessary to improve the performance of mobile phone cameras and add additional functions such as auto focus, shutter anti-shake, and zoom. Summary of the invention

[0004] Technical issues

[0005] The present embodiment provides a camera device capable of preventing an OIS moving unit from being damaged or broken due to impact or collision, and an optical instrument including the camera device.

[0006] Technical Solution

[0007] The camera device according to the embodiment includes: a fixed unit including a cover member including an upper plate and a side plate connected to the upper plate; a mobile unit including a bracket disposed inside the cover member, a first circuit board disposed on the bracket, and an image sensor conductively connected to the first circuit board; and a support unit coupled to the bracket and configured to support the mobile unit relative to the fixed unit, wherein the bracket includes a side portion, a corner portion, and a stopper protruding from an outer side surface of the side portion of the bracket toward the side plate of the cover member, and the stopper is disposed closer to the center of the side portion of the bracket than the corner portion of the bracket. At least a portion of the stopper may pass through the support unit.

[0008] A shortest distance between the stopper and the side plate of the cover member may be smaller than a shortest distance between an outer side surface of the side portion of the bracket and the side plate of the cover member.

[0009] The shortest distance between the stopper and the side plate of the cover member may be smaller than the shortest distance between the outer side surface of the corner portion of the bracket and the side plate of the cover member.

[0010] The bracket may include a protrusion formed to allow a portion of the support unit to be coupled thereto, and the stopper may include a first stopper protruding from an outer side surface of the protrusion of the bracket. The support unit may include a connecting portion connected to the first circuit board and coupled to the protrusion of the bracket, and the first stopper may pass through the connecting portion.

[0011] The bracket may include a protrusion protruding in the optical axis direction to allow a portion of the supporting unit to be coupled thereto, and the stopper may include a first stopper located on one side of the protrusion of the bracket and a second stopper located on the other side (opposite side) of the protrusion of the bracket.

[0012] The fixing unit may include a base disposed under the cover member and a second circuit board coupled to the base, and the stopper may include a second stopper protruding from an outer side surface of a side portion of the bracket toward the base.

[0013] The base may include a protrusion formed to allow a portion of the support unit to be connected thereto, the bracket may include a groove recessed in an outer surface of a side portion of the bracket so as to correspond to the protrusion of the base, and the second stopper may protrude from a bottom surface of the groove in the bracket toward the protrusion of the base.

[0014] A distance between the second stopper and the protrusion of the base may be smaller than a distance between an outer side surface of the side portion of the bracket and the side plate of the cover member.

[0015] Assuming that the center of the side of the bracket is a point corresponding to 50% of the total length of the side of the bracket, the stopper may be provided in a region between points corresponding to 35% and 65% of the length of the side of the bracket.

[0016] According to another embodiment, a camera device includes: a fixed unit including a cover member; a moving unit including a bracket and an image sensor arranged inside the cover member; and a supporting unit connected to the bracket and configured to support the moving unit relative to the fixed unit, wherein the bracket includes a first stopper, the first stopper protrudes from an outer side surface of a first side portion of the bracket toward a first side plate of the cover member in a second direction perpendicular to a first direction parallel to the optical axis, and the first stopper protrudes relative to the supporting unit connected to the bracket.

[0017] The bracket may include a second stopper that protrudes from an outer side surface of a second side portion of the bracket toward a second side plate of the cover member in a direction opposite to the first stopper, and the second stopper may protrude relative to a support unit coupled to the bracket. The support unit may include: a first hole formed therein to allow a portion of the first stopper to pass therethrough; and a second hole formed therein to allow the second stopper to pass therethrough.

[0018] The bracket may include a third stopper and a fourth stopper, wherein the third stopper protrudes from the outer surface of the third side portion of the bracket along a third direction perpendicular to the first direction and the second direction; and the fourth stopper protrudes from the outer surface of the fourth side portion of the bracket along a direction opposite to the third stopper.

[0019] The bracket may include a first groove formed in the outer surface of the third side of the bracket and a second groove formed in the outer surface of the fourth side of the bracket, and the third stopper may protrude from the bottom surface of the first groove and the fourth stopper may protrude from the bottom surface of the second groove.

[0020] The third stopper and the fourth stopper may each be located further inward than the supporting unit.

[0021] The protruding length of the third stopper may be less than the distance from the outer surface of the third side of the bracket to the bottom surface of the first groove, and the protruding length of the fourth stopper may be less than the distance from the outer surface of the fourth side of the bracket to the bottom surface of the second groove.

[0022] The base may include a first protrusion and a second protrusion, the first protrusion being formed to be opposite to the first groove in the bracket and allowing a portion of the support unit to be connected thereto, the second protrusion being formed to be opposite to the second groove in the bracket and allowing another portion of the support unit to be connected thereto, the third stopper may be opposite to the first protrusion of the base, and the fourth stopper may be opposite to the second protrusion of the base.

[0023] The actuator according to this embodiment includes: a fixed unit, which includes a cover member, which includes an upper plate and a side plate connected to the upper plate; a moving unit, which includes a bracket arranged inside the cover member and a first circuit board arranged on the bracket; and a supporting unit, which is connected to the bracket and is configured to support the moving unit relative to the fixed unit, wherein the bracket includes a side portion, a corner portion, and a stopper, which protrudes from the outer side surface of the side portion of the bracket toward the side plate of the cover member, and the stopper is arranged to be closer to the center of the side portion of the bracket than the corner portion of the bracket.

[0024] Beneficial Effects

[0025] According to the embodiment, a gap between an OIS moving unit and a fixed unit required for an OIS operation may be reduced.

[0026] According to the embodiment, an impulse reduction (shock absorption) effect may be achieved by reducing the gap, and thus, the OIS moving unit may be prevented from being damaged or broken due to impact or collision. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a perspective view of the camera device according to this embodiment.

[0028] Figure 2 is a perspective view of the camera device with a cover member removed.

[0029] Figure 3 yes Figure 1An exploded perspective view of the camera setup in FIG.

[0030] Figure 4a is along Figure 1 A cross-sectional view taken along line AB in the camera device.

[0031] Figure 4b is along Figure 1 A cross-sectional view taken along line CD in the camera device.

[0032] Figure 4c is along Figure 1 A cross-sectional view of the camera device taken along line EF.

[0033] Figure 5 yes Figure 3 Exploded perspective view of the AF drive unit in the .

[0034] Figure 6 It is a three-dimensional diagram of a bobbin, a sensing magnet, a balancing magnet, a first coil, a circuit board, a first position sensor, and a capacitor.

[0035] Figure 7a It is a three-dimensional diagram of a winding frame, a housing, a circuit board, an upper elastic member, a sensing magnet and a balancing magnet.

[0036] Figure 7b With wire added Figure 7a A perspective view of the configuration shown in .

[0037] Figure 8 It is a bottom perspective view of the housing, winding frame, lower elastic member, magnet and circuit board.

[0038] Fig. 9 is a perspective view of an image sensor unit.

[0039] Fig.10a yes Fig. 9 A first exploded perspective view of an image sensor unit in FIG.

[0040] Fig.10b yes Fig. 9 A second exploded perspective view of the image sensor unit in FIG.

[0041] Fig.11 yes Fig.10a A bottom-up stereoscopic view of the bracket, terminal unit, first plate unit, support plate, base and second plate unit in FIG.

[0042] Fig.12a It is a three-dimensional diagram of the bracket.

[0043] Figure 12b is a plan view of a bracket, a first board unit, an image sensor, a second coil, and an OIS position sensor.

[0044] Fig.13 is a rear perspective view of the bracket and the first plate unit.

[0045] Fig.14 This is a three-dimensional image of the base, terminal unit, and wire.

[0046] Fig.15 4 is a bottom view of the first plate unit, the support plate and the heat dissipation member.

[0047] Fig.16 is a perspective view of the first plate unit, the support plate and the heat dissipation member.

[0048] Fig.17a is a first stereoscopic view of a support plate coupled to a bracket and a base.

[0049] Fig.17b is a second stereoscopic view of the support plate coupled to the bracket and the base.

[0050] Fig.17c yes Fig.17a The configuration shown in the figure has the support plate removed.

[0051] Fig.17d yes Fig.17b The configuration shown in the figure has the support plate removed.

[0052] Fig.18a is a view for explaining the movement of the OIS moving unit in the X-axis direction.

[0053] Fig.18b is a view for explaining the movement of the OIS moving unit in the y-axis direction.

[0054] Fig.18c is a view for explaining clockwise rotation of the OIS moving unit in the four-channel driving mode.

[0055] Fig.18d is a view for explaining counterclockwise rotation of the OIS moving unit in the four-channel driving mode.

[0056] Fig.19a Shows Figure 5 An embodiment of a middle magnet.

[0057] Fig.19b Shows Figure 5 Another embodiment of the middle magnet.

[0058] Fig.20a is a view showing an embodiment of the arrangement of first to third areas of the second panel unit, the expansion area, the AF moving unit, the OIS moving unit, and the controller.

[0059] Fig.20bis a schematic cross-sectional view of a lens module, a first board unit, an image sensor, a second board unit, and a heat dissipation member.

[0060] Fig.21 is a block diagram showing the configuration of a controller and first to third sensors.

[0061] Fig. 22 It is a plan view of the bracket, base and cover components.

[0062] Fig.23a yes Fig. 22 An enlarged view of the first dotted line portion.

[0063] Figure 23b yes Fig. 22 An enlarged view of the second dotted line portion.

[0064] Fig.24 is a cross-sectional view of the image sensor unit and the cover member in a direction perpendicular to the optical axis.

[0065] Fig.25 is a perspective view of a camera device according to another embodiment.

[0066] Fig.26 yes Fig.25 A perspective view of a stand for a camera device is shown.

[0067] Fig. 27 is a perspective view of a bracket according to another embodiment.

[0068] Fig.28a is a perspective view of an optical instrument according to an embodiment.

[0069] Fig.28b is a perspective view of an optical instrument according to another embodiment.

[0070] Fig.29 yes Fig.28a and Fig.28b The configuration diagram of the optical instrument shown in FIG. DETAILED DESCRIPTION

[0071] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0072] The technical spirit of the present disclosure is not limited to the embodiments to be described, and may be implemented in various other forms, and one or more components may be selectively combined and replaced for use without departing from the scope of the technical spirit of the present disclosure.

[0073] In addition, unless otherwise specifically defined and explicitly described, the terms (including technical terms and scientific terms) used in the embodiments of the present disclosure are interpreted as having the meanings commonly understood by ordinary technicians in the field to which the present disclosure belongs, and the meanings of commonly used terms (such as terms defined in dictionaries) should be interpreted in consideration of the context of the relevant technology.

[0074] In addition, the terms used in the embodiments of the present disclosure are intended to explain the embodiments rather than to limit the present disclosure. In this specification, unless otherwise specifically stated in a phrase, a singular form may also include a plural form. When stating "at least one (one or more) of A, B or C", it may include one or more of all possible combinations of A, B and C.

[0075] In addition, when describing the components of the embodiments of the present disclosure, terms such as "first", "second", "A", "B", "(a)", "(b)", etc. may be used. These terms are only used to distinguish one component from another component and do not determine the nature, order or procedure of the corresponding constituent elements.

[0076] Furthermore, when it is described that a component is “connected,” “coupled,” or “combined” to another component, the description may include not only being “connected,” “coupled,” or “combined” directly to another component, but also being “connected,” “coupled,” or “combined” through another component between the component and the other component. Furthermore, when described as being formed or disposed above (upper) or below (lower) another component, the description may include not only a case where the two components are in direct contact with each other, but also a case where one or more other components are formed or disposed between the two components. Furthermore, when expressed as “above (upper)” or “below (lower)”, this may refer to a downward direction as well as an upward direction relative to an element.

[0077] Hereinafter, the AF drive unit may be referred to alternatively as a lens drive device, a lens drive unit, a voice coil motor (VCM), an actuator, or a lens moving device. Hereinafter, a "coil" may be referred to alternatively as a coil unit, and an "elastic member" may be referred to alternatively as an elastic unit or a spring.

[0078] Furthermore, in the following description, a “terminal” may be alternatively referred to as a pad, an electrode, a conductive layer, or a bonding unit.

[0079] In the following description, the terms "board unit", "printed circuit board", "circuit board" and "board" may be used interchangeably.

[0080] For ease of description, the camera device according to the embodiment will be described using a Cartesian coordinate system (x, y, z), but the embodiment is not limited thereto and may be described using other coordinate systems. In the various drawings, the x-axis and the y-axis may be directions perpendicular to the z-axis (i.e., the optical axis direction), the z-axis direction (i.e., the direction of the optical axis OA) may be referred to as a "first direction", the x-axis direction may be referred to as a "second direction", and the y-axis direction may be referred to as a "third direction". In addition, for example, the x-axis direction may be referred to as "one direction in the first horizontal direction and the second horizontal direction", and the y-axis direction may be referred to as "the other direction in the first horizontal direction and the second horizontal direction".

[0081] In addition, for example, the optical axis may be the optical axis of a lens mounted to the lens barrel. Alternatively, for example, the optical axis may be an axis perpendicular to the imaging area of ​​the image sensor and passing through the center of the imaging area.

[0082] The first direction may be a direction perpendicular to the imaging area of ​​the image sensor. In addition, for example, the optical axis direction may be a direction parallel to the optical axis.

[0083] The camera device according to this embodiment can perform an “auto focus function.” The auto focus function is a function of automatically focusing an image of a subject on a surface of an image sensor.

[0084] Hereinafter, the camera device may be alternatively referred to as a “camera module”, “camera component”, “camera unit”, “camera”, “image capturing device” or “lens moving device”.

[0085] Furthermore, the camera device according to this embodiment can execute a “hand shake compensation function”, which is a function of suppressing the blurring of the outline of a captured still image due to vibration caused by hand shake of the user when capturing a still image.

[0086] Figure 1 is a perspective view of a camera device 10 according to an embodiment, Figure 2 is a perspective view of the camera device 10 with the cover member 300 removed, Figure 3 yes Figure 1 An exploded perspective view of the camera device 10, Figure 4a is along Figure 1 A cross-sectional view of the camera device 10 taken along line AB, Figure 4b is along Figure 1 A cross-sectional view of the camera device 10 taken along line CD, Figure 4c is along Figure 1 A cross-sectional view of the camera device 10 taken along line EF, Figure 5 yes Figure 3 An exploded perspective view of the AF drive unit 100 in FIG. Figure 67 is a perspective view of the bobbin 110, the sensing magnet 180, the balancing magnet 185, the first coil 120, the circuit board 190, the first position sensor 170 and the capacitor 195. FIG. 8 is a perspective view of the bobbin 110, the housing 140, the circuit board 190, the upper elastic member 150, the sensing magnet 180 and the balancing magnet 185. Figure 8 1 is a bottom perspective view of the housing 140 , the bobbin 110 , the lower elastic member 160 , the magnet 130 , and the circuit board 190 .

[0087] Reference Figures 1 to 8 , the camera device 10 may include an AF driving unit 100 and an image sensor unit 350. The AF driving unit 100 may include an AF moving unit. The image sensor unit 350 may include an "OIS driving unit".

[0088] The OIS driving unit may include an OIS moving unit. One of the AF moving unit and the OIS moving unit may be a first moving unit, and the other of the AF moving unit and the OIS moving unit may be a second moving unit.

[0089] The AF driving unit 100 may be alternatively referred to as a “lens moving unit” or a “lens driving device.” Alternatively, the AF driving unit 100 may be alternatively referred to as a “first moving unit (or second moving unit)” or a “first actuator (or second actuator).”

[0090] The OIS driving unit may alternatively be referred to as a “sensor moving unit” or a “sensor moving device.” Alternatively, the OIS driving unit may be referred to as a “second moving unit (or first moving unit)” or a “second actuator (or first actuator).”

[0091] The camera apparatus 10 may further include at least one of a cover member 300 or a lens module 400. The cover member 300 and a base 210 (to be described later) may constitute a housing.

[0092] The "actuator" according to this embodiment may include at least one of an AF drive unit or an OIS drive unit. For example, the actuator according to this embodiment may not include at least one of the lens module 400 or the image sensor 810 in the camera device 10. For example, the actuator according to this embodiment may include at least one of the components of the camera device 10, but may be configured to omit the lens module 400 and the image sensor 810.

[0093] The AF driving unit 100 may be coupled to the lens module 400 , and may move the lens module in the direction of the optical axis OA or a direction parallel to the optical axis, thereby performing an auto focus function of the camera apparatus 10 .

[0094] The image sensor unit 350 may alternatively be referred to as an “image sensor moving unit,” “image sensor shift unit,” “sensor moving unit,” or “sensor shift unit.” Alternatively, the image sensor unit 350 may be referred to as a “second moving unit (or first moving unit)” or a “second actuator (or first actuator).”

[0095] The image sensor unit 350 may include the image sensor 810. For example, the image sensor unit 350 may include an OIS moving unit including the image sensor 810. For example, the image sensor unit 350 may move the OIS moving unit (e.g., the image sensor 810) in a direction perpendicular to the optical axis. In addition, the image sensor unit 350 may tilt or rotate (or roll) the OIS moving unit (e.g., the image sensor 810) relative to or around the optical axis. The hand shake compensation function of the camera device 10 may be performed by the image sensor unit 350.

[0096] In one example, the image sensor 810 may include an imaging area for sensing light that has passed through the lens module 400. Here, the imaging area may be alternatively referred to as an effective area, a light receiving area, an active area, or a pixel area. For example, the imaging area of ​​the image sensor 810 may be a portion that introduces light that has passed through the filter 610 to form an image contained in the light, and may include at least one unit pixel. In one example, the imaging area may include a plurality of unit pixels.

[0097] Reference Figure 5 and Figure 6 , the AF driving unit 100 can move the lens module 400 in the optical axis direction. In one example, the AF driving unit 100 can move the winding rack 110 in the optical axis direction. In one example, the AF driving unit 100 may include the winding rack 110, the first coil 120, the magnet 130 and the housing 140. The AF driving unit 100 may also include an upper elastic member 150 and a lower elastic member 160.

[0098] In addition, the AF driving unit 100 may further include a first position sensor 170 , a circuit board 190 , and a sensing magnet 180 to implement AF feedback. In addition, the AF driving unit 100 may further include at least one of a balancing magnet 185 or a capacitor 195 .

[0099] The bobbin 110 may be disposed in the housing 140 , and may move in the direction of the optical axis OA or the first direction (eg, the Z-axis direction) through electromagnetic interaction between the first coil 120 and the magnet 130 .

[0100] The bobbin 110 may have a hole formed therein so as to be coupled to the lens module 400 or to install the lens module 400 therein. In one example, the hole in the bobbin 110 may be a through hole formed through the bobbin 110 in the optical axis direction and may be circular, elliptical, or polygonal. However, the present disclosure is not limited thereto.

[0101] The lens module 400 may include at least one lens and / or a lens barrel. In one example, the lens module 400 may include one or more lenses and a lens barrel that accommodates one or more lenses. However, the present disclosure is not limited thereto, and any one of various retaining structures may be used instead of the lens barrel, as long as the retaining structure can support one or more lenses.

[0102] In one example, the lens module 400 may be screwed onto the bobbin 110. Alternatively, in another example, the lens module 400 may be coupled to the bobbin 110 by an adhesive (not shown). Meanwhile, the light having passed through the lens module 400 may pass through the optical filter 610 and may be introduced into the image sensor 810.

[0103] The winding frame 110 may include at least one protrusion 111A or 111B disposed on its outer surface. In one example, at least one protrusion 111A or 111B may protrude in a direction parallel to a straight line perpendicular to the optical axis OA. However, the present disclosure is not limited thereto. In one example, the winding frame 110 may include two protrusions 111A and 111B positioned opposite to each other.

[0104] The protrusions 111A and 111B of the reel 110 may correspond to the groove portions 25A and 25B of the housing 140 to be inserted or disposed in the groove portions 25A and 25B in the housing 140 and may suppress or prevent the reel 110 from rotating about the optical axis beyond a predetermined range.

[0105] The winding frame 110 may include a protrusion 146A protruding in a direction perpendicular to the optical axis. In an example, the protrusion 146A of the winding frame 110 may be set on a corner portion of the winding frame. The housing 140 may include a groove 146B formed therein to correspond to, face or overlap with the protrusion 146A of the winding frame 110. The protrusion 146A of the winding frame 110 can be used as a stopper that allows the winding frame 110 to move within a specified range along the optical axis direction (e.g., from the upper elastic member 150 toward the lower elastic member 160).

[0106] The bobbin 110 may include a first escape groove 112a formed in an upper surface thereof to avoid spatial interference with the first frame connection portion 153 of the upper elastic member 150. In addition, the bobbin 110 may include a second escape groove 112b formed in a lower surface thereof to avoid spatial interference with the second frame connection portion 163 of the lower elastic member 160.

[0107] The bobbin 110 may include a first coupling portion 116a so as to be coupled or fixed to the upper elastic member 150. For example, the first coupling portion 116a of the bobbin 110 may take the form of a protrusion. However, the present disclosure is not limited thereto. In another embodiment, the first coupling portion may take the form of a flat surface or a groove. In addition, the bobbin 110 may include a second coupling portion 116b so as to be coupled or fixed to the lower elastic member 160. For example, the second coupling portion 116b may take the form of a protrusion. However, the present disclosure is not limited thereto. In another embodiment, the second coupling portion may take the form of a flat surface or a groove.

[0108] Reference Figure 5 The bobbin 110 may include a groove 105 formed in its outer surface to allow the first coil 120 to be located, inserted, or disposed therein. For example, the shape of the groove 105 in the bobbin 110 may be consistent with the shape of the first coil 120, or may be in a closed curve shape (e.g., a ring shape).

[0109] In addition, the bobbin 110 may include a first seating groove 26a formed therein to allow the sensing magnet 180 to be seated, inserted, fixed or disposed therein. In addition, the bobbin 110 may include a second seating groove 26b formed in an outer surface thereof to allow the balancing magnet 185 to be seated, inserted, fixed or disposed therein.

[0110] In one example, the first and second seating grooves 26A and 26B in the bobbin 110 may be formed in the outer surfaces facing each other of the bobbin 110. In one example, the first seating groove 26A may be formed in the first protrusion 111A of the bobbin 110, and the second seating groove 26B may be formed in the second protrusion 111B of the bobbin 110.

[0111] Reference Figure 5 7 , the damper 48 may be disposed between the bobbin 110 and the upper elastic member 150. In an example, the damper 48 may be disposed between the bobbin 110 and the first frame connection portion 153 of the upper elastic member 150 so as to be in contact, coupled or attached thereto.

[0112] In one example, the upper elastic member 150 may include an extension portion (or protrusion) 155 extending from the first frame connection portion 153. The extension portion 155 may be separated from each of the outer frame 152 and the inner frame 151. In addition, the extension portion 155 may be separated from one end of the first frame connection portion 153 connected to the inner frame 151 and the other end of the first frame connection portion 153 connected to the outer frame 152. The extension portion 155 may extend above the upper surface of the winding frame 110. In one example, a portion (or end) of the extension portion 155 may be disposed on the guide portion 104A of the winding frame 110 and may overlap with the guide portion 104A in the optical axis direction.

[0113] The damper 48 may be disposed between the guide portion 104A of the bobbin 110 and the extension portion 155 of the upper elastic member 150 so as to be in contact with, coupled to, or attached thereto. Since the damper 48 is in contact with or attached to the extension portion 155 and the bobbin 110, the damper 48 may be used to mitigate or absorb vibration of the bobbin 110. For example, the damper 48 may be formed as a damping member (e.g., silicone resin).

[0114] In one example, the guide portion 104A of the spool 110 may include a protrusion that protrudes upward from the escape portion 112a of the spool 110. Also, in one example, the guide portion 104A of the spool 110 may include a groove formed therein to allow the damper 48 to be received or disposed therein.

[0115] The first coil 120 is disposed on or coupled to the bobbin 110. In one example, the first coil 120 may be disposed on or coupled to an outer surface of the bobbin 110. In one example, the first coil 120 may surround the outer surface of the bobbin 110 in a rotation direction around the optical axis OA. However, the present disclosure is not limited thereto.

[0116] The first coil 120 may be directly wound on the outer surface of the bobbin 110. However, the present disclosure is not limited thereto. In another embodiment, the first coil 120 may be wound on the bobbin 110 using a coil ring, or may be implemented as a coil block having an angled ring shape.

[0117] Power or a driving signal may be provided to the first coil 120. The power or driving signal provided to the first coil 120 may be a DC signal, an AC signal, or a signal containing DC and AC components, and may be a voltage type or current type signal.

[0118] When a driving signal (eg, driving current) is provided to the first coil 120 , an electromagnetic force may be generated through electromagnetic interaction with the magnet 130 , and the bobbin 110 may move in the direction of the optical axis OA by the generated electromagnetic force.

[0119] In the initial position of the AF drive unit, the winding frame 110 can move upward or downward, which is called bidirectional driving of the AF drive unit. Alternatively, in the initial position of the AF drive unit, the winding frame 110 can move upward, which is called unidirectional driving of the AF drive unit.

[0120] In the initial position of the AF driving unit, the first coil 120 may be disposed to correspond to or overlap the magnet 130 disposed in the housing 140 in a direction parallel to a straight line which is perpendicular to the optical axis OA and extends through the optical axis.

[0121] In an example, the AF driving unit may include the bobbin 110 and components (eg, the first coil 120 , the sensing magnet 180 , and the balancing magnets 180 and 185 ) coupled to the bobbin 110 . In addition, the AF driving unit may further include a lens module 400 .

[0122] In addition, the initial position of the AF driving unit may be the original position of the AF driving unit in a state where power is not supplied to the first coil 120, or the position of the AF driving unit when the upper elastic member 150 and the lower elastic member 160 are elastically deformed only due to the weight of the AF driving unit. In addition, the initial position of the bobbin 110 may be the position of the AF driving unit when gravity acts in a direction from the bobbin 110 toward the base 210 or when gravity acts in a direction from the base 210 toward the bobbin 110.

[0123] The sensing magnet 180 may provide a magnetic field detected by the first position sensor 170 , and the balancing magnet 185 may be used to offset the influence of the magnetic field of the sensing magnet 180 and establish a weight balance with the sensing magnet 180 .

[0124] The sensing magnet 180 may be alternatively referred to as a “sensor magnet” or a “second magnet”. The sensing magnet 180 may be disposed on the bobbin 110, or may be coupled to the bobbin 110. The sensing magnet 180 may be disposed to face the first position sensor 170. The balancing magnet 185 may be disposed on the bobbin 110, or may be coupled to the bobbin 110. In an example, the balancing magnet 185 may be disposed opposite to the sensing magnet 180.

[0125] In one example, the sensing magnet 180 and the balancing magnet 185 can both be monopolar magnetized magnets having one N pole and one S pole. However, the present disclosure is not limited thereto. In another embodiment, the sensing magnet 180 and the balancing magnet 185 can both be dipole magnetized magnets or quadrupole magnets including two N poles and two S poles.

[0126] The sensing magnet 180 may move in the optical axis direction together with the bobbin 110 , and the first position sensor 170 may detect the intensity of the magnetic field or force of the sensing magnet 180 moving in the optical axis direction, and may output an output signal corresponding to the detection result.

[0127] In one example, the strength of the magnetic field or magnetic force detected by the first position sensor 170 may vary according to the displacement of the winding frame 110 in the direction of the optical axis, the first position sensor 170 may output an output signal proportional to the detected magnetic field strength, and the output signal from the first position sensor 170 may be used to detect the displacement of the winding frame 110 in the direction of the optical axis.

[0128] The housing 140 is disposed inside the cover member 300. In an example, the housing 140 may be disposed on the image sensor unit 350.

[0129] The housing 140 may accommodate the bobbin 110 therein, and may support the magnet 130 , the first position sensor 170 , and the circuit board 190 .

[0130] Reference Figure 5 , Figure 7 and Figure 8 , the housing 140 may be formed in the overall shape of a hollow column. In one example, the housing 140 may include a polygonal (e.g., quadrilateral or octagonal) or circular hole formed therein, and the hole in the housing 140 may take the form of a through hole formed through the housing 140 in the direction of the optical axis.

[0131] The housing 140 may include a side portion corresponding to or facing the side plate 302 of the cover member 300 , and a corner corresponding to or facing the corner of the cover member 300 .

[0132] The housing 140 may be provided with a stopper 145 at an upper portion, an upper surface, or an upper end thereof to avoid direct collision with an inner surface of the upper plate 301 of the cover member 300 .

[0133] Reference Figure 5 , the housing 140 may include a mounting recess (or groove) 14A formed therein to accommodate the circuit board 190. The shape of the mounting recess 14A may be consistent with the shape of the circuit board 190.

[0134] Reference Figure 7a and Figure 7b, the housing 140 may include protrusions 44A and 44B that surround at least one of the circuit board 190 or the support plate 310. In one example, the protrusions 44A and 44B may be disposed or formed on an outer surface of the housing 140. In one example, the protrusions 44A and 44B may be disposed or formed on an outer surface of a side portion of the housing 140. The protrusions 44A and 44B may alternatively be referred to as "protective portions," "support portions," "extension portions," or guide portions.

[0135] The protrusions 44A and 44B of the housing 140 may surround at least a portion of the circuit board 190 and at least a portion of the support plate 310. In one example, the housing 140 may include a first protrusion 44A disposed on a first side of the housing and a second protrusion 44B disposed on a second side of the housing 140. The first protrusion 44A and the second protrusion 44B may be positioned relative to each other with respect to the optical axis OA or the winding frame 110. In another embodiment, the second protrusion 44B may be omitted.

[0136] In one example, the circuit board 190 may be disposed inside the first protrusion 44A. In one example, the mounting recess 14A may be formed in the first protrusion 44A.

[0137] In one example, the first protrusion 44A and the second protrusion 44B may each include a first portion 47A connected to the upper surface of the housing 140 and a second portion 47B connected to the first portion 47A and spaced apart from the side of the housing 140. In one example, the first portion 47A of the first protrusion 44A may be connected to the upper surface of the first side of the housing 140, and the first portion 47A of the second protrusion 44B may be connected to the upper surface of the second side of the housing 140. In one example, the first portion 47A may protrude from the upper surface of the housing 140 in the optical axis direction or protrude toward the inner surface of the upper plate 301 of the cover member 300.

[0138] In one example, at least a portion of the circuit board 190 may be located between the first portion 47A and the second portion 47B of the first protrusion 44A. In addition, in one example, at least a portion of the support plate 310 may be located between the first portion 47A and the second portion 47B of the first protrusion 44A.

[0139] The housing 140 may include an opening formed therein so that the terminals B1 to B4 of the terminal unit 95 of the circuit board 190 are exposed through the opening, and the opening may be formed in a side portion of the housing 140 .

[0140] The first protrusion 44A and the second protrusion 44B of the housing 140 may each include a third portion 37C extending from the second portion 47B. In one example, the third portion 37C may extend or protrude from the lower side or lower end of the second portion 47B in a direction parallel to the outer surface of the first side portion (or the second side portion) of the housing 140 (e.g., in the second horizontal direction).

[0141] In an example, the third portion 37C may include a portion 3-1 extending from one end of the second portion 47B and a portion 3-2 extending from the other end of the second portion, and the portion 3-1 and the portion 3-2 may extend or protrude in opposite directions.

[0142] An adhesive or a sealing member may be provided between the protrusions 44A and 44B of the housing 140 and the cover member 300. In one example, an adhesive (or a sealing member) may be provided between the protrusions 44A and 44B of the housing 140 and the side plate 302 of the cover member 300, and the protrusion and the side plate may be coupled to each other. The protrusions 44A and 44B may increase the coupling area thereof to the side plate of the cover member 300, and the housing 140 and the cover member 300 may be stably coupled to each other without interfering with the support plate 310.

[0143] The housing 140 may be provided at least one first coupling portion 143 on an upper portion, an upper end, or an upper surface thereof, which is coupled to the first outer frame 152 of the upper elastic member 150. The housing 140 may be provided at a lower portion, a lower end, or a lower surface thereof, with a second coupling portion coupled and fixed to the second outer frame 162 of the lower elastic member 160. For example, each of the first and second coupling portions of the housing 140 may be formed in the shape of a flat surface, a protrusion, or a groove.

[0144] A hole 147 may be formed in the corner of the housing 140, which is a passage for the wire 220 to pass through. The hole 147 may be a through hole formed through the housing 140 in the optical axis direction. In another embodiment, the hole may be configured to be recessed in the outer surface of the corner portion of the housing 140, and at least a portion of the hole may be open to the outer surface of the corner portion. The number of holes 147 in the housing 140 may be the same as the number of support members.

[0145] The magnet 130 may be disposed on, coupled to, or fixed to a housing 140 as a fixed unit. In one example, the magnet 130 may be disposed on, coupled to, or fixed to a side of the housing 140. The magnet 130 may include an AF drive magnet 71A for AF drive. In addition, the magnet 130 may include an OIS drive magnet 71B for OIS drive. Hereinafter, the AF drive magnet 71A may be referred to as one of the first magnet and the second magnet, and the OIS drive magnet 71B may be referred to as the other of the first magnet and the second magnet.

[0146] In another embodiment, the magnet 130 may be disposed at, coupled to, or fixed to a corner of the housing.

[0147] In one example, the magnet 130 may include a plurality of magnet units. In one example, the magnet 130 may include first to fourth magnet units 130-1 to 130-4 disposed on the housing 140. In another embodiment, the magnet 130 may include two or more magnet units.

[0148] The magnet 130 may be disposed on at least one of the side or the corner of the housing 140. In one example, at least a portion of the magnet 130 may be disposed on the side or the corner of the housing 140. Alternatively, in another example, at least a portion of the magnet 130 may be disposed on the side of the housing 140, and the rest thereof may be disposed on the corner of the housing 140.

[0149] In one example, the magnet units 130-1 to 130-4 may each include a first portion disposed on a corresponding corner among four corners of the housing 130. In addition, the magnet units 130-1 to 130-4 may each include a second portion disposed on a side of the housing 140 adjacent to a corresponding corner of the housing 140.

[0150] In one example, the first magnet unit 130-1 and the third magnet unit 130-3 may be located at opposite sides of the housing 140 in a first horizontal direction (e.g., the Y-axis direction). In one example, the second magnet unit 130-2 and the fourth magnet unit 130-4 may be located at opposite sides of the housing 140 in a second horizontal direction (e.g., the X-axis direction).

[0151] In one example, the first magnet unit 130-1 and the third magnet unit 130-3 can be arranged parallel to each other along the second horizontal direction (e.g., the X-axis direction), and the second magnet unit 130-2 and the fourth magnet unit 130-4 can be arranged parallel to each other along the first horizontal direction (e.g., the Y-axis direction).

[0152] In the initial position of the AF driving unit, the magnet 130 may be disposed on the housing 140 such that at least a portion of the magnet 130 overlaps with the first coil 120 in a direction parallel to a straight line that is perpendicular to the optical axis OA and extends through the optical axis OA.

[0153] The magnet 130 may include a monopolar magnetized magnet or a dipole magnet including one N-pole region and one S-pole region. In another embodiment, the magnet 130 may include a dipole magnetized magnet or a quadrupole magnet including two N-pole regions and two S-pole regions. In yet another embodiment, the magnet 130 may include a monopolar magnetized magnet and a dipole magnetized magnet.

[0154] In one example, the magnet 130 may include an AF magnet (or AF driving magnet) for implementing an AF operation and an OIS magnet (or OIS driving magnet) for implementing an OIS operation. In another embodiment, the magnet 130 may be a common magnet for implementing an AF operation and an OIS operation.

[0155] Fig.19a Shows Figure 5 Embodiment of the middle magnet 130 .

[0156] Reference Fig.19a , the magnet 130 may include a first magnet 71A, which is a magnet for AF, and a second magnet 71B, which is a magnet for OIS disposed below the first magnet 71A.

[0157] The first magnet 71A may be a dipole magnet including one N-pole region and one S-pole region. In one example, the N-pole region and the S-pole region of the first magnet 71A may be arranged to face or be opposite to each other in a direction perpendicular to the optical axis. In another embodiment, the first magnet 71A may be a quadrupole magnet including two N-pole regions and two S-pole regions.

[0158] The first magnet 71A may include a plurality of magnet units 71A1 to 71A4. As described above, each of the plurality of magnet units 71A1 to 71A4 may be a dipole magnet or a quadrupole magnet. In one example, the size and shape of the magnet units 71A1 to 71A4 may be identical to each other. In one example, the size and shape of the two magnet units 71A1 and 71A3 opposite to each other in the first diagonal direction may be identical to each other, and the size and shape of the remaining two magnet units 71A2 and 71A4 opposite to each other in the second diagonal direction may be identical to each other.

[0159] In another embodiment, the size and shape of the two magnet units 71A1 and 71A3 may be different from the size and shape of the remaining two magnet units 71A2 and 71A4. In one example, the length of the long side of each of the two magnet units 71A1 and 71A3 may be greater than the length of the long side of each of the remaining two magnet units 71A2 and 71A4. In one example, the length of the short side of each of the two magnet units 71A1 and 71A3 may be equal to the length of the short side of each of the remaining two magnet units 71A2 and 71A4.

[0160] The second magnet 71B may be a quadrupole magnet including two N-pole regions and two S-pole regions. In one example, the second magnet 71B may include a first magnet portion 30A, a second magnet portion 30B, and a partition wall 30C disposed between the first magnet portion 30A and the second magnet portion 30B. In this case, the partition wall 30C may be a non-magnetic material or air and may be referred to as a "neutral zone" or "neutral region". In another embodiment, the second magnet 71B may be a bipolar magnet including one N-pole region and one S-pole region.

[0161] In one example, the first magnet portion 30A and the second magnet portion 30B may be spaced apart from each other in a direction perpendicular to the first direction (or the optical axis direction). In one example, the first magnet portion 30A may include a first N-pole region and a first S-pole region that are opposite or facing each other in the optical axis direction. The second magnet portion 30B may include a second N-pole region and a second S-pole region that are opposite or facing each other in the optical axis direction. In addition, the first N-pole region (or the first S-pole region) of the first magnet portion 30A and the second S-pole region (or the second N-pole region) of the second magnet portion 30B may be opposite or facing each other in a direction perpendicular to the optical axis.

[0162] The second magnet 71B may include a plurality of magnet units 71B1 to 71B4. As described above, the plurality of magnet units 71B1 to 71B4 may be quadrupole magnets. In another embodiment, the magnet units 71B1 to 71B4 may be dipole magnets. The magnet units 71B1 to 71B4 may be opposite or overlapped with a corresponding one of the second coil units 230-1 to 230-4 in the optical axis direction.

[0163] In one example, the size and shape of the magnet units 71B1 to 71B4 can be the same as each other. In one example, the size and shape of the two magnet units 71B1 and 71B3 opposite to each other in the first diagonal direction can be the same as each other, and the size and shape of the remaining two magnet units 71B2 and 71B4 opposite to each other in the second diagonal direction can be the same as each other.

[0164] In another embodiment, the sizes and shapes of the two magnet units 71B1 and 71B3 may be different from those of the remaining two magnet units 71B2 and 71B4. In one example, the length of the long side of each of the two magnet units 71B1 and 71B3 may be greater than the length of the long side of each of the remaining two magnet units 71B2 and 71B4. In one example, the length of the short side of each of the two magnet units 71B1 and 71B3 may be equal to the length of the short side of each of the remaining two magnet units 71B2 and 71B4.

[0165] The second magnet 71B may be disposed below the first magnet 71A. The second magnet 71B may be disposed on the lower surface of the first magnet 71A. In one example, the upper surface of the second magnet 71B may be in contact with the lower surface of the first magnet 71A, or may be fixed or coupled to the lower surface of the first magnet 71A by an adhesive. In one example, at least a part of the first magnet 71A may overlap at least a part of the second magnet 71B in the first direction (or the optical axis direction).

[0166] In another embodiment, the second magnet may be separated from the first magnet. In this case, a part of the housing 140 may be disposed between the first magnet and the second magnet. Alternatively, in another embodiment, a partition wall or a yoke may be disposed between the first magnet and the second magnet that are separated from each other. In this case, the description of the partition wall 30C may be applied to the partition wall equivalently or similarly.

[0167] In one example, the length T2 of the second magnet 71B in the optical axis direction may be less than the length T1 of the first magnet 71A in the optical axis direction (T2 < T1). In another embodiment, T2 may be greater than or equal to T1.

[0168] In addition, the length L2 of the long side of the second magnet 71B may be less than or equal to the length L1 of the long side of the first magnet 71A (L2 ≤ L1). In another embodiment, L2 may be greater than L1.

[0169] In addition, the width W2 (or the length of the short side) of the second magnet 71B may be less than or equal to the width W1 (or the length of the short side) of the first magnet 71A (W2 ≤ W1). In another embodiment, W2 may be greater than W1.

[0170] At the initial position of the AF moving unit, the first coil 120 may be opposite to or overlap with the first magnet 71A in a direction perpendicular to the first direction (or the optical axis direction). In Fig.19a this case, the N - pole region of the first magnet 71A may be set to face the first coil 120, or its N - pole region may be closer to the first coil 120 than its S - pole region. However, in another embodiment, the positions of the N - pole region and the S - pole region may be interchanged.

[0171] In one example, at the initial position of the OIS moving unit, at least a portion of the first magnet 130 may overlap with at least a portion of the second coil 230 in the first direction (or the optical axis direction). In one example, at the initial position of the OIS moving unit, at least a portion of the second magnet 71B may overlap with at least a portion of the second coil 230 in the first direction (or the optical axis direction).

[0172] The length L2 of the long side of the second magnet 71B may be greater than the length L3 of the long side of the second coil 230 (L2>L3). In another embodiment, the length of the long side of the second magnet 71B may be less than or equal to the length of the long side of the second coil 230.

[0173] The width W2 (or the length of the short side) of the second magnet 71B may be greater than the length L4 of the short side of the second coil 230 (W2>L4). In another embodiment, the length of the long side of the second magnet 71B may be less than or equal to the length of the long side of the second coil 230.

[0174] In one example, the length of the long side of each of the two magnet units 71B1 and 71B3 of the second magnet 71B may be less than the length of the long side of a corresponding one of the coil units 230-1 and 230-3 of the second coil 230. In another embodiment, the length of the long side of each of the two magnet units 71B1 and 71B3 may be equal to or greater than the length of the long side of a corresponding one of the coil units 230-1 and 230-3.

[0175] In addition, the length of the long side of each of the remaining two magnet units 71B2 and 71B4 of the second magnet 71B may be greater than the length of the long side of a corresponding one of the coil units 230-2 and 230-4 of the second coil 230. In another embodiment, the length of the long side of each of the magnet units 71B2 and 71B4 may be equal to or less than the length of the long side of a corresponding one of the coil units 230-2 and 230-4 of the second coil 230.

[0176] In one example, the length of each short side of the first to fourth magnet units 71B1 to 71B4 of the second magnet 71B may be smaller than the length of the short side of a corresponding one of the first to fourth coil units 230-1 to 230-4 of the second coil 230. In another embodiment, the length of each short side of the first to fourth magnet units 71B1 to 71B4 may be greater than the length of the short side of a corresponding one of the first to fourth coil units 230-1 to 230-4.

[0177] Fig.19b Shows Figure 5 Another embodiment of the middle magnet 130 .

[0178] Reference Fig.19b , Fig.19b The second magnet 71BB in may be a bipolar magnet including one N-pole region and one S-pole region. Fig.19a The description of the lengths T2, L2 and W2 of the second magnet 71B in FIG. 1 may be equally or similarly applied to Fig.19b The second magnet 71BB in.

[0179] The circuit board 190 may be disposed in the housing 140, and the first position sensor 170 may be disposed or mounted on the circuit board 190 and may be conductively connected to the circuit board 190. In one example, the circuit board 190 may be disposed in the mounting groove 14A in the housing 140, and the terminals 95 of the circuit board 190 may be exposed to the outside of the housing 140.

[0180] The circuit board 190 may be provided with a terminal unit (or terminal portion) 95 including a plurality of terminals B1 to B4 for conductive connection with an external terminal or an external device. The plurality of terminals B1 to B4 of the circuit board 1900 may be conductively connected to the first position sensor 170 .

[0181] The first position sensor 170 may be disposed on the housing 140 and / or the circuit board 190. In one example, the first position sensor 170 may be disposed on a first surface of the circuit board 190, and a plurality of terminals B1 to B4 may be disposed on a second surface of the circuit board 190. The second surface of the circuit board 190 may be a surface opposite to the first surface of the circuit board 190. In one example, the first surface of the circuit board 190 may be a surface of the circuit board 190 facing the bobbin 110 or the sensing magnet 180. For example, the circuit board 190 may be a printed circuit board or an FPCB.

[0182] The first position sensor 170 may be conductively connected to the circuit board 190. In one example, the first position sensor 170 may be conductively connected to the first to fourth terminals B1 to B4 of the circuit board 190. In one example, the circuit board 190 may include a circuit pattern or wiring (not shown) for conductive connection between the first to fourth terminals B1 to B4 and the first position sensor 170.

[0183] In one example, at the initial position of the AF driving unit, at least a portion of the first position sensor 170 may be opposite to or overlapped with the sensing magnet 180 in a direction parallel to a straight line that is perpendicular to the optical axis OA and extends through the optical axis OA. In another embodiment, at the initial position of the AF driving unit, the first position sensor may not be opposite to or overlapped with the sensing magnet.

[0184] The first position sensor 170 is used to detect the movement, displacement or position of the winding frame 110 in the optical axis direction. That is, when the winding frame 110 moves, the first position sensor 170 can detect the magnetic field or magnetic field strength of the sensing magnet 180 mounted to the winding frame 110, and can output an output signal corresponding to the detection result, and the output from the first position sensor 170 can be used to detect the movement, displacement or position of the winding frame 110 in the optical axis direction.

[0185] The first position sensor 170 may be a driver IC including a Hall sensor and a driver. The first position sensor 170 may include: first to fourth terminals for transmitting and receiving data to and from the outside by using data communication such as an I2C communication protocol; and fifth and sixth terminals for directly providing a driving signal to the first coil 120.

[0186] In an example, each of the first to fourth terminals of the first position sensor 170 may be conductively connected to a corresponding one of the first to fourth terminals B1 to B4 of the circuit board 190 by solder or a conductive adhesive.

[0187] In addition, in one example, the fifth and sixth terminals of the first position sensor 170 may be conductively connected to the first coil 120. In one example, the first position sensor 170 may be conductively connected to the first coil 120 via at least one of the upper elastic member 150 or the lower elastic member 160, and may provide a driving signal to the first coil 120.

[0188] In one example, a portion of the first upper elastic unit 150-1 may be connected to one end of the first coil 120, and another portion of the first upper elastic unit 150-1 may be conductively connected to the circuit board 190. A portion of the second upper elastic unit 150-2 may be connected to the other end of the first coil 120, and another portion of the second upper elastic unit 150-2 may be conductively connected to the circuit board 190. The circuit board 190 may include a first pad 5A conductively connected to another portion of the first upper elastic unit 150-1 and a second pad 5B conductively connected to another portion of the second upper elastic unit 150-2. The fifth and sixth terminals of the first position sensor 170 may each be conductively connected to a corresponding one of the first and second pads 5A and 5B of the circuit board 190.

[0189] In another embodiment, the first coil 120 may be conductively connected to the circuit board 190 and the fifth and sixth terminals of the first position sensor 170 via two lower elastic members.

[0190] In one example, in an embodiment where the first position sensor 170 is a driver IC, the first and second terminals B1 and B2 of the circuit board 190 may be power terminals for supplying power, the third terminal B3 may be a terminal for transmitting and receiving a clock signal, and the fourth terminal B4 may be a terminal for transmitting and receiving a data signal.

[0191] In another embodiment, the first position sensor 170 may be a Hall sensor. In this case, the first position sensor 170 may include two input terminals for receiving a drive signal or power provided thereto and two output terminals for outputting a sensing voltage (or output voltage). In one example, the drive signal may be provided to the first position sensor 170 via the first and second terminals B1 and B2 of the circuit board 190, and the output from the first position sensor 170 may be output to the outside via the third and fourth terminals B3 and B4. In addition, the first coil 120 may be conductively connected to the circuit board 190. In addition to the first to fourth terminals B1 to B4, the circuit board 190 may also include two separate terminals, and the drive signal may be provided to the first coil 120 from the outside via these two separate terminals.

[0192] In an example, among the power terminals of the first position sensor 170 , the ground terminal may be conductively connected to the cover member 300 .

[0193] Capacitor 195 may be disposed or mounted on the first surface of circuit board 190. Capacitor 195 may be chip-type. In this case, the chip may include a first terminal corresponding to one end of capacitor 195 and a second terminal corresponding to the other end of capacitor 195. Capacitor 195 may alternatively be referred to as a "capacitive element" or a capacitor.

[0194] The capacitor 195 may be conductively connected in parallel with the first and second terminals B1 and B2 of the circuit board 190, and power (or a driving signal) may be provided to the first position sensor 170 from the outside through the capacitor 195. Alternatively, the capacitor 195 may be conductively connected in parallel with the terminals of the first position sensor 170, and the terminals of the first position sensor 170 may be conductively connected with the first and second terminals B1 and B2 of the circuit board 190.

[0195] Because capacitor 195 is conductively connected in parallel with the first and second terminals B1 and B2 of the circuit board 190, capacitor 195 can be used as a smoothing circuit for removing ripple components contained in the power supply signals GND and VDD provided to the first position sensor 170 from the outside, thereby providing a stable and consistent power supply signal to the first position sensor 170.

[0196] In another embodiment, the sensing magnet 180 may be disposed on the housing 140, and the first position sensor 170 may be disposed on the bobbin 110. In another embodiment, the balancing magnet 185 may be omitted.

[0197] The upper elastic member 150 and the lower elastic member 160 may be coupled to the bobbin 110 and the housing 140. In one example, the upper elastic member 150 may be coupled to an upper portion, an upper end, or an upper surface of the bobbin 110 and to an upper portion, an upper end, or an upper surface of the housing 140, and the lower elastic member 160 may be coupled to a lower portion, a lower end, or a lower surface of the bobbin 110 and to a lower portion, a lower end, or a lower surface of the housing 140. The upper elastic member 150 and the lower elastic member 160 may elastically support the bobbin 110 relative to the housing 140.

[0198] The upper elastic member 150 may include a plurality of upper elastic units (e.g., 150-1 to 150-4) that are electrically conductively separated or isolated from each other. The lower elastic member 160 is implemented by a single elastic unit. However, in another embodiment, the lower elastic member may include a plurality of lower elastic units that are electrically conductively separated or isolated from each other. In another embodiment, at least one of the upper elastic member or the lower elastic member may be implemented by a single unit or a single structure.

[0199] The upper elastic member 150 may further include a first inner frame 151 coupled or fixed to an upper portion, upper surface or upper end of the bobbin 110, a second inner frame 152 coupled or fixed to an upper portion, upper surface or upper end of the housing 140, and a first frame connecting portion 153 interconnecting the first inner frame 151 and the first outer frame 152. In addition, the upper elastic member 150 may include the above-mentioned extension portion 155.

[0200] The lower elastic member 160 may include a second inner frame 161 coupled or fixed to a lower portion, a lower surface, or a lower end of the bobbin 110, a second outer frame 162 coupled or fixed to a lower portion, a lower surface, or a lower end of the housing 140, and a second frame connecting portion 163 interconnecting the second inner frame 161 and the second outer frame 162. Alternatively, the inner frame may be alternatively referred to as an inner portion, the outer frame may be alternatively referred to as an outer portion, and the frame connecting portion may be alternatively referred to as a connecting portion.

[0201] Each of the first and second frame connection portions 153 and 163 may be formed to be bent or folded (or twisted) at least once to form a pattern having a predetermined shape.

[0202] The upper elastic member 150 and the lower elastic member 160 may each be made of a conductive material such as metal. In addition, the upper elastic member 150 and the lower elastic member 160 may each be formed as an elastic member such as a leaf spring.

[0203] Reference Figure 5 , Figure 7a and Figure 7b In one example, the second outer frame 152 of the first upper elastic unit 150-1 may include a first coupling portion 4A connected or conductively connected to the first solder pad 5A of the circuit board 190, and the second outer frame 152 of the second upper elastic unit 150-2 may include a second coupling portion 4B conductively connected to the second solder pad 5B of the circuit board 190.

[0204] In another embodiment, at least one of the upper elastic member 150 or the lower elastic member 160 may include two elastic members. In one example, the two elastic members of any one of the upper elastic member 150 and the lower elastic member 160 may be coupled or conductively connected to a corresponding one of the first and second pads of the circuit board 190, and the first coil 120 may be conductively connected to the two elastic members.

[0205] The first outer frame 152 of the upper elastic member 150 may include a first coupling portion 510 coupled to the housing 140, a second coupling portion 520 coupled to the wire 220, and a connecting portion 530 interconnecting the first coupling portion 510 and the second coupling portion 520. The first coupling portion 510 may include a through hole or a hole formed therein so as to be coupled to the first coupling portion 143 of the housing 140. The second coupling portion 520 may include a through hole or a hole formed therein so as to be coupled to the wire 220. In one example, the second coupling portion 520 may be coupled to the wire 220 by a conductive adhesive or solder. In one example, the connecting portion 530 may include a bent portion bent at least once or a bent portion bent at least once. However, the present disclosure is not limited thereto. In another embodiment, the connecting portion 530 may be in a straight line shape.

[0206] Fig. 9 is a perspective view of the image sensor unit 350; Fig.10a yes Fig. 9 A first exploded perspective view of the image sensor unit 350; Fig.10b yes Fig. 9 a second exploded perspective view of the image sensor unit 350; Fig.11 The bracket 270, the terminal unit 37, the first plate unit 255, the support plate 310, the heat dissipation member 280, the base 210 and Fig.10a A bottom perspective view of the second panel unit 800; Fig.12a It is a three-dimensional image of the bracket; Figure 12b is a plan view of the bracket 270, the first board unit 255, the image sensor 810, the second coil 230, and the OIS position sensor 240; Fig.13 is a rear perspective view of the bracket 270 and the first plate unit 255; Fig.14 is a three-dimensional diagram of the base 210, the terminal unit 37, and the wire 220; Fig.15 is a bottom view of the first plate unit 255, the support plate 310 and the heat dissipation member 280; Fig.16 is a perspective view of the first plate unit 255, the support plate 310 and the heat dissipation member 280; Fig.17a is a first perspective view of a support plate 310 coupled to a bracket 270 and a base 210; Fig.17b is a second perspective view of the support plate 310 coupled to the bracket 270 and the base 210; Fig.17c yes Fig.17a The configuration shown in FIG. 1 is a view with the support plate 310 removed; Fig.17d yes Fig.17b The configuration shown in FIG. 3 is a view with the support plate 310 removed.

[0207] Reference Figures 9 to 17d , the image sensor unit 350 may include a fixed unit and an OIS moving unit spaced apart from the fixed unit. The image sensor unit 350 may include a supporting unit interconnecting the fixed unit and the OIS moving unit.

[0208] In one example, the support unit may include the support plate 310. Alternatively, in one example, the support unit may be the support plate 310. In another embodiment, the support unit may be an elastic member (eg, a leaf spring or a suspension wire) instead of the support plate 310.

[0209] The fixing unit may be a fixing unit that the camera device 10 does not move during the OIS operation. In one example, the fixing unit may include a second board unit 800. In one example, the fixing unit may include a component coupled to the second board unit 800. The "board unit" 255 or 800 may be alternatively referred to as a "board" or a "circuit board".

[0210] In one example, the fixing unit may include a base 210 coupled to the second plate unit 800. In one example, the fixing unit may include a housing 140 of the AF driving unit and components disposed on the housing 140, such as a magnet 130, a first position sensor 170, and a circuit board 180. In addition, the fixing unit may include a cover member 300 coupled to the base 210. The OIS moving unit may be disposed inside the cover member 300. In one example, the cover member 300 may accommodate the moving unit and the support plate 310.

[0211] The OIS moving unit may include an image sensor 810. The OIS moving unit may also include a first board unit 255 that is spaced apart from the second board unit 800 and conductively connected to the second board unit 800. In addition, in an example, the OIS moving unit may include a component (e.g., at least one of a heat dissipation member 280, a bracket 270, a second coil 230, or a second position sensor 240) disposed on the first board unit 255. The bracket 270 may alternatively be referred to as a "spacer member". In another embodiment, the bracket 270 may be omitted, and the second coil 230 may be disposed on the first board unit 255 (e.g., the first circuit board 250).

[0212] In one example, the camera device 10 may include: a fixed unit; a moving unit including a first heat sink 280 disposed on the fixed unit and an image sensor 810 disposed on the first heat sink 280; and a supporting unit (e.g., 310) supporting the moving unit so that the moving unit can move in a direction perpendicular to the optical axis direction. The supporting unit (e.g., 310) may be connected between the moving unit and the fixed unit.

[0213] The moving unit may include a first board unit 255 on which the image sensor 810 is disposed, the fixing unit may include a second board unit 800 disposed to be spaced apart from the first board unit 255 , and the supporting unit may interconnect the first board unit 255 and the second board unit 800 .

[0214] The support unit may include a conductive layer 93-1, a first insulating layer 94-1 disposed under the conductive layer 93-1, and a second insulating layer 94-2 disposed on the conductive layer 93-1. In the support unit, a portion of the first insulating layer 94-1 may not be disposed to expose a portion of the conductive layer 93-1.

[0215] The first board unit 255 may include a first circuit board 250 connected to the support unit, a second circuit board 260 conductively connected to the image sensor 810 , and solder 901 conductively interconnecting the first circuit board 250 and the second circuit board 260 .

[0216] The camera device 10 may include an elastic member 220 (hereinafter referred to as a "wire") to elastically support the OIS moving unit relative to the fixed unit. The elastic member 220 may take the form of a wire or a spring.

[0217] In one example, one end of the wire 220 may be coupled to the upper elastic member 150 (or the housing 140), and the other end of the wire 220 may be coupled to the bracket 270. In one example, one end of the wire 220 may be coupled to the first outer frame 152 (e.g., the second coupling portion 520) of the upper elastic member 150 by solder or a conductive adhesive. In one example, the other end of the wire 220 may be coupled to the terminal unit 37 by solder or a conductive adhesive, and the terminal unit 37 may be disposed on the bracket 270 or may be coupled to the bracket 270.

[0218] Reference Figure 7a and Figure 7b A damper DA may be disposed between one end of the wire 220 passing through the hole 147 in the housing 140 and the hole 147 in the housing 140. In an example, at least a portion of the damper DA may be disposed in the hole 147 in the housing 140 and may be coupled or attached to at least a portion of the wire 220 and the housing 140.

[0219] In one example, the wire 220 can be arranged in the optical axis direction. In one example, the wire 220 can be arranged at a corner of the housing 140 and / or a corner of the bracket 270. In one example, the wire 220 can include four wires 220-1 to 220-4. The four wires 220-1 to 220-4 can be arranged at a corresponding one of the four corners of the housing 140 and / or the four corners of the bracket 270.

[0220] refer to Fig.10a and Fig.10b , the bracket 270 may include a hole 271 formed therein to allow at least a portion of the wire 220 to pass therethrough. In one example, the hole 271 through which the other end of the wire 220 passes may be formed in a corner of the bracket 270. In one example, the hole 271 may be formed in each of the four corners of the bracket 270. In one example, the hole 271 may be a through hole formed through the bracket 270 in the optical axis direction. However, in another embodiment, the hole 271 may take the form of an avoidance groove.

[0221] In one example, the terminal unit 27 may be disposed on an upper surface or a lower surface of the bracket 270 or coupled to the upper surface or the lower surface of the bracket 270. In one example, the terminal unit 27 may be disposed on a lower surface of a corner of the bracket 270 or coupled to the lower surface of a corner of the bracket 270. The bracket 270 may include a groove 28A formed therein to allow the terminal unit 37 to be disposed therein. In one example, the groove 28A may be formed in the lower surface of the corner of the bracket 270.

[0222] In one example, the terminal unit 27 may include at least one hole 81A formed therein so as to be coupled to the bracket 270. The terminal unit 37 and the bracket 270 may be coupled to each other by adhesive or hot melt. For example, the hole 81A may be a hole formed to allow an adhesive to be injected therein.

[0223] In addition, the terminal unit 37 may include a hole 171A formed therein to allow the other end of the wire 220 to be inserted therein or coupled thereto. For example, the holes 81A and 171A may be through holes.

[0224] In one example, the terminal unit 37 may include a body 81 coupled to the bracket 270. The body 81 may include a coupling portion 171 coupled to the wire 220. The coupling portion 171 may include a hole 171A formed therein so as to be coupled to the wire 220. The coupling portion 171 may be coupled to the wire 220 by solder or a conductive adhesive. In one example, the other end of the wire 220 having passed through the hole 171A in the coupling portion 171 may be coupled to a lower portion or lower surface of the coupling portion 171 by solder or a conductive adhesive.

[0225] The terminal unit 37 may include a connection portion 172 interconnecting the body 81 and the coupling portion 171. The width of the connection portion 172 may be smaller than the width of the body 81. In addition, in an example, the width of the connection portion 152 may be smaller than the width (or diameter) of the coupling portion 171.

[0226] In one example, the terminal unit 37 may include an extension portion (not shown) extending from the body 81. The extension portion of the terminal unit 37 may be bent and extend downward from the body 81. In one example, the extension portion of the terminal unit 37 may extend toward the hole 59 in the base 210. The extension portion of the terminal unit may alternatively be referred to as a "bent portion."

[0227] In one example, the terminal unit 37 may include four terminals 37A to 37D corresponding to the four wires 220-1 to 220-4. Each of the terminals 37A to 37D may be disposed on a corresponding one of the corners of the bracket 270 and may be coupled to a corresponding one of the wires 220-1 to 220-4. Fig.10a The description given may be equally or similarly applied to the structure of one wire of each of the terminals 37A to 37D. The terminal unit 37 may be made of a conductive material (eg, metal). In another embodiment, the terminal unit 37 may be omitted, and the wire 220 may be directly coupled to the bracket 270.

[0228] Reference Fig.14, a damper 49 or an adhesive may be provided between the terminal unit 37 and the base 210. The damper 49 may contact, couple, or attach to the terminal unit 37 and the base 210. In one example, the base 210 may include a hole 59 (or a groove) formed at a position corresponding to or opposite to the terminal unit 37. In one example, the hole 59 (or the groove) may be formed in a corner of the base 210.

[0229] In one example, the damper 49 may be disposed in the hole 59 of the base 210. Alternatively, at least a portion of the extension portion (not shown) of the terminal unit 37 may be disposed in the hole 59 in the base 210, and the damper 49 may be in contact with, coupled to, or attached to the extension portion of the terminal unit 59. The damper may be used to absorb or mitigate vibration of the OIS moving unit, thereby preventing or suppressing vibration of the OIS moving unit during OIS movement. In another embodiment, the extension portion may be omitted in the terminal unit 37, and the camera device 10 may not include Fig.14 Damper 49 in.

[0230] The support plate 310 may support the OIS moving unit relative to the fixing unit so that the OIS moving unit can move in a direction perpendicular to the optical axis or can tilt or rotate around the optical axis within a predetermined range.

[0231] In an example, one end of the support plate 310 may be connected or coupled to the first plate unit 255 , and the other end of the support plate 310 may be connected or coupled to the second plate unit 800 .

[0232] The bracket 270 may be disposed below the AF drive unit. In one example, the bracket 270 may be implemented by a non-conductive member. In one example, the bracket 270 may be made of an injection molding material that can be easily formed by an injection molding process. In addition, the bracket 270 may be formed of an insulating material. In addition, for example, the bracket 270 may be formed of a resin or plastic.

[0233] Reference Fig.10a , Fig.10b and Fig.12a The bracket 270 may include an upper surface, a lower surface formed opposite to the upper surface, and a side surface (eg, an outer side surface) interconnecting the upper surface and the lower surface. In an example, the lower surface of the bracket 270 may be opposite to or face the second board unit 800.

[0234] The bracket 270 may support the first board unit 255 and may be coupled to the first board unit 266. In one example, the first board unit 255 may be disposed below the bracket 270. In one example, a lower portion, a lower surface, or a lower end of the bracket 270 may be coupled to an upper portion, an upper surface, or an upper end of the first board unit 255. In one example, the bracket 270 may be coupled to the first board unit 255 by an adhesive. In another embodiment, for example, the first board unit 255 may be disposed on the bracket 270.

[0235] The bracket 270 may accommodate or support the second coil 230. The bracket 270 may support the second coil 230 so that the second coil 230 is spaced apart from the first board unit 255. In an example, at least a portion of the bracket 270 may be disposed between the second coil 230 and the first board unit 255.

[0236] In one example, the bracket 270 may include a receiving portion 39 in which the second coil 230 is disposed or received. For example, the receiving portion 39 may be formed in a groove shape. In one example, the receiving portion 39 may be a groove recessed in the upper surface of the bracket 270. In one example, the bracket 270 may include grooves 39A to 39D formed therein to correspond to the coil units 230-1 to 230-4 of the second coil 230. The coil units 230-1 to 230-4 may each be disposed in a corresponding one of the grooves 39A to 39D in the bracket 270.

[0237] The bracket 270 may include a hole 70 formed therein to correspond to an area of ​​the first board unit 255. In one example, the hole 70 in the bracket 270 may be a through hole formed through the bracket 270 in the optical axis direction. In one example, the hole 70 in the bracket 270 may correspond to, be opposite to, or overlap with the image sensor 810 in the optical axis direction.

[0238] When viewed from above, the shape of the hole 70 in the bracket 270 may be polygonal (eg, quadrilateral, circular, or elliptical). However, the present disclosure is not limited thereto. The hole 70 may be formed in any of various shapes.

[0239] In one example, the shape or size of the hole 70 in the bracket 270 can be suitable for exposing the image sensor 810, a portion of the upper surface of the first circuit board 250, a portion of the upper surface of the second circuit board 260, and other components. In one example, the area of ​​the hole 70 in the bracket 270 can be larger than the area of ​​the image sensor 810, and can be larger than the area of ​​the hole 250A in the first circuit board 250.

[0240] Reference Fig.11 and Fig.12a, the bracket 270 may include holes 41A, 41B, and 41C formed therein to correspond to the second position sensor 240. In one example, the bracket 270 may include holes 41A, 41B, and 41C formed therein, the positions of which correspond to the first to third sensors 240A, 240B, and 240C of the second position sensor 240, respectively.

[0241] In one example, holes 41A, 41B, and 41C may be disposed adjacent to a corner of bracket 270. Bracket 270 may include a dummy hole 41D formed therein, which is located at a position adjacent to a corner of bracket 270 but does not correspond to second position sensor 240. Dummy hole 41D is formed to establish a weight balance of the OIS moving unit during movement of the OIS. Dummy hole 41D may be a through hole. In another embodiment, dummy hole 41D may not be formed. Holes 41A, 41B, and 41C may be through holes formed through bracket 270 in the direction of the optical axis. In another embodiment, holes 41A, 41B, and 41C may be omitted in bracket 270.

[0242] The bracket 270 may be provided with at least one coupling protrusion 51 on an upper surface thereof so as to be coupled to the second coil 230. In an example, the coupling protrusion 51 may be inserted into, disposed in, or coupled to a cavity in a coil unit of the second coil 230.

[0243] The coupling protrusion 51 may protrude from the upper surface of the bracket 270 in an upward direction or toward the AF driving unit. In one example, the coupling protrusion 51 may protrude from the bottom surface of the accommodation portion 39. In one example, the coupling protrusion 51 may be formed adjacent to each of the holes 41A to 41D in the bracket 270.

[0244] In one example, two coupling protrusions 51A and 51B may be provided or arranged to correspond to each hole 41A, 41B, 41C, and 41D in the bracket 270. In one example, the holes 41A, 41B, 41C, and 41D in the bracket 270 may each be located between the two coupling protrusions 51A and 51B.

[0245] The bracket 270 may include one or more protrusions 27A and 27B. The protrusions 27A and 27B may protrude from the upper surface of the bracket 270. In an example, the protrusions 27A and 27B may protrude from the outer side surface of the bracket 270 in the optical axis direction or the upward direction.

[0246] In an example, the bracket 270 may include two protrusions 27A and 27B that are opposite to or overlap each other in the second horizontal direction (eg, the X-axis direction).

[0247] refer to Fig.12aIn one example, the bracket 270 may include a plurality of side portions (or side plates) 57A to 57D. In addition, the bracket 270 may include a plurality of corner portions CR1 to CR4 or corners.

[0248] In one example, each corner portion of the bracket 270 may include a corresponding one of the corners of the bracket 270. In this case, the corner of the bracket 270 may be a corner where two adjacent outer side surfaces of the bracket 270 intersect each other. In one example, each corner portion of the bracket 270 may be an area outside the hole 271 in the bracket 270. In one example, each corner portion of the bracket 270 may be an area closer to a corresponding one of the corners of the bracket 270 than the first position of the bracket 270. In one example, the first position may be a center point between the midpoint (or center) of each of the side portions 57A to 57D of the bracket 270 and the corresponding one of the corners of the bracket 270.

[0249] In one example, the first protrusion 27A may be formed on the first side 57A of the bracket 270, and the second protrusion 27B may be formed on the second side 57B of the bracket 270. In one example, the protrusions 27A and 27B may be disposed or located at the center of the side (or side plate) of the bracket 270.

[0250] The bracket 270 may include a groove 341a formed therein. The groove 341a may be an adhesive receiving groove. The groove 341a may be formed in the outer side surface of each of the protrusions 27A and 27B of the bracket 270. The groove 341a may be formed in the upper surface of each of the protrusions 27A and 27B of the bracket 270. The groove 341a may be formed from the upper surface of each of the protrusions 27A and 27B of the bracket 270 to the lower surface thereof. An adhesive may be provided in the groove 341a, and the support plate 310 is adhered to the bracket 270 by the adhesive. The groove 341a may include a plurality of grooves. In an example, the groove 341a may extend in the optical axis direction. In another embodiment, the groove in the bracket 270 may extend in a direction perpendicular to the optical axis.

[0251] The first board unit 255 may include a first circuit board 250 and a second circuit board 260 that are conductively connected to each other. The second circuit board 260 may alternatively be referred to as a “sensor board.” In another embodiment, the heat dissipation member 280 may be included in the first board unit 255 .

[0252] The first board unit 255 may be disposed on the lower surface of the bracket 270. In one example, the first board unit 255 may be coupled to the lower surface of the bracket 270. In one example, the first circuit board 250 may be disposed on the lower surface of the bracket 270 and / or coupled to the lower surface of the bracket 270. In one example, the first surface of the first circuit board 250 may be coupled or attached to the lower surface of the bracket 270 by an adhesive member.

[0253] In this case, the first surface of the first circuit board 250 may be a surface facing or opposite to the AF driving unit, on which the second position sensor 240 is disposed. In addition, the second surface of the first circuit board 250 may be a surface formed opposite to the first surface of the first circuit board 250.

[0254] The first circuit board 250 may be alternatively referred to as a sensor board, a main board, a main circuit board, a sensor circuit board, or a mobile circuit board. In all embodiments, the first circuit board 250 may be alternatively referred to as a "second board" or a "second circuit board", and the second circuit board 260 may be alternatively referred to as a "first board" or a "first circuit board".

[0255] The second position sensor 240 (240A, 240B, and 240C) may be disposed on the first circuit board 250 to detect movement of the OIS moving unit in a direction perpendicular to the optical axis direction and / or rotation, tilt, or roll of the OIS moving unit around the optical axis. In addition, the controller 830 and / or circuit elements (e.g., capacitors) may be disposed on the first circuit board 250.

[0256] The first circuit board 250 may include first terminals E1 to E8 so as to be conductively connected to the second coil 230. The first terminals E1 to E8 may be alternatively referred to as "first pads" or "first bonding portions". The first terminals E1 to E8 of the first circuit board 250 may be disposed or arranged on the first surface 60A of the first circuit board 250. For example, the first circuit board 250 may be a printed circuit board or a flexible printed circuit board (FPCB).

[0257] The first circuit board 250 may include a hole 250A formed therein so as to correspond to or be opposite to the holes in the lens module 400 and the bobbin 110. In one example, the hole 250A in the first circuit board 250 may be a through hole or a cavity formed through the first circuit board 250 in the optical axis direction and may be formed at the center of the first circuit board 250.

[0258] When viewed from above, the shape of the first circuit board 250 (e.g., the shape of its periphery) may be a shape that is consistent with or corresponds to the shape of the bracket 270, such as a quadrilateral. In addition, when viewed from above, the shape of the hole 250A in the first circuit board 250 may be a polygon, such as a quadrilateral, a circle, or an ellipse. In one example, the hole 250A in the first circuit board 250 may open or expose the image sensor 810 and / or the hole 260A in the second circuit board 260.

[0259] In addition, the first circuit board 250 may include at least one terminal 251 so as to be conductively connected to the second circuit board 260. The terminal 251 of the first circuit board 250 may be alternatively referred to as a "pad" or a "joining portion". The terminal 251 of the first circuit board 250 may be disposed or arranged on the lower surface of the first circuit board 250.

[0260] In one example, a plurality of terminals 251 may be provided, and the plurality of terminals 251 may be disposed or arranged in a region between a hole 250A in the first circuit board 250 and any one side of the first circuit board 250 in a direction parallel to the side of the first circuit board 250. In one example, the plurality of terminals 251 may be arranged around the hole 250A.

[0261] The second circuit board 260 may be disposed below the first circuit board 250. The second circuit board 260 may be conductively connected to the image sensor 810.

[0262] When viewed from above, the second circuit board 260 may be in a polygonal shape (eg, a quadrilateral, a square, or a rectangle). However, the present disclosure is not limited thereto. In another embodiment, the second circuit board 260 may be in a circular or elliptical shape.

[0263] In one example, the area of ​​the outer peripheral surface of the quadrilateral second circuit board 260 may be larger than the area of ​​the hole 250A in the first circuit board 250. In one example, the lower side of the hole 250A in the first circuit board 250 may be blocked or obstructed by the second circuit board 260.

[0264] In one example, when viewed from above or below, the outer side surface (or side) of the second circuit board 260 may be located between the outer side surface (or side) of the first circuit board 250 and the hole 250A in the first circuit board 250 .

[0265] In one example, the second circuit board 260 may include a hole 260A formed therein so as to correspond to the hole 250A in the first circuit board 250 and / or the image sensor 810. The hole 260A in the second circuit board 260 may be a hole or a cavity formed through the second circuit board 260 in the optical axis direction and may be formed at the center of the second circuit board 260.

[0266] In one example, the hole 260A in the second circuit board 260 may open or expose the image sensor 810. In one example, the image sensor 810 may be disposed in the hole 260A in the second circuit board 260 and may be conductively connected to the second circuit board 260. In one example, the image sensor 810 may be conductively connected to the second circuit board 260 via a wire.

[0267] In another embodiment, the hole 260A may not be formed in the second circuit board 260 , and the image sensor 810 may be disposed on the upper surface of the second circuit board 260 .

[0268] In another embodiment, the heat dissipation member 280 may be omitted. In an embodiment where the heat dissipation member 280 is omitted, the hole 260A may not be formed in the second circuit board 260 , and the image sensor 810 may be disposed on an upper surface of the second circuit board 260 .

[0269] In one example, in an embodiment where the heat dissipation member 280 is omitted, the image sensor 810 may be disposed on an upper surface of a single board in which the first circuit board and the second circuit board are integrated.

[0270] The second circuit board 260 may include at least one terminal 261 conductively connected to at least one terminal 251 of the first circuit board 250. In an example, a plurality of terminals 261 of the second circuit board 260 may be provided.

[0271] In one example, at least one terminal 261 of the second circuit board 260 may be formed on a side surface or an outer side surface of the second circuit board 260, which interconnects the upper surface and the lower surface of the second circuit board 260. The upper surface of the second circuit board 260 may be a surface facing the first circuit board 250, and the lower surface of the second circuit board 260 may be a surface formed opposite to the upper surface of the second circuit board. In one example, the terminal 261 may take the form of a groove recessed in the side surface of the second circuit board 260. Or, for example, the terminal 261 may take the form of a semicircular or semi-elliptical via formed in the side surface of the second circuit board 260. In another embodiment, at least one terminal of the second circuit board 260 that is conductively connected to the second terminal 251 of the first circuit board 250 may be formed on the upper surface of the second circuit board 260.

[0272] In one example, the terminal 261 of the second circuit board 260 can be soldered to the substrate 901 (see Fig.11 ) or a conductive adhesive member is connected to the terminal 251 of the first circuit board 250. Fig.13The enlarged portion indicated by the dotted line shows only one solder 901 connecting any terminal of the second circuit board 260 to any terminal 251 of the first circuit board, but solder may be provided for connecting another terminal of the second circuit board 260 to its corresponding terminal of the first circuit board 250.

[0273] For example, the first and second circuit boards 250 and 260 may be printed circuit boards or FPCBs. Furthermore, at least one of the first circuit board 250 and the second circuit board 260 may be an organic substrate or a ceramic substrate.

[0274] The heat dissipation member 280 may be disposed on the first board unit 255 or coupled to the first board unit 255. In one example, the heat dissipation member 280 may be disposed on the second circuit board 260 or coupled to the second circuit board 260. In one example, the heat dissipation member 280 may be disposed below the second circuit board 260. In one example, the heat dissipation member 280 may be coupled or fixed to the lower surface of the second circuit board 260. In one example, at least a portion of the upper surface of the heat dissipation member 280 may be coupled or fixed to the lower surface of the second circuit board 260 by an adhesive.

[0275] The “heat dissipation member” may be alternatively referred to as a “heat dissipation fin”, “heat dissipation tape”, “heat dissipation layer”, “heat dissipation film”, “heat dissipation plate”, “heat dissipation flat plate” or “heat dissipation body”.

[0276] In another embodiment, the heat dissipation member 280 may be included in the first board unit 255 , and the image sensor 810 may be disposed on the first board unit 255 .

[0277] The hole 260A in the second circuit board 260 may open or expose at least a portion of the heat dissipation member 280. The image sensor 810 may be disposed on, attached to, or coupled to at least a portion of the heat dissipation member 280 exposed by the hole 260A. In one example, the image sensor 810 may be fixed, attached to, or coupled to the heat dissipation member 280 by an adhesive. In one example, the image sensor 810 may be disposed on the first board unit 255.

[0278] In an example, at least one area of ​​the upper surface of the heat dissipation member 280 may be exposed by the hole 260A, and the image sensor 810 may be disposed on, attached to, or coupled to the at least one area of ​​the upper surface of the heat dissipation member 280 exposed by the hole 260A.

[0279] In another embodiment, the second circuit board 260 may include a groove formed in a lower surface thereof to allow the heat dissipation member 280 to be received or disposed therein.

[0280] In another embodiment, the hole 260A may not be formed in the second circuit board 260, and the heat dissipation member 280 may be fixed, attached or coupled to the lower surface of the second circuit board 260. In yet another embodiment, the heat dissipation member 280 may be omitted.

[0281] In one example, the heat dissipation member 280 may be formed as a plate-type member having a predetermined thickness and hardness. In addition, the heat dissipation member 280 may improve the heat dissipation to the outside generated by the heat source of the first board unit 255. In this case, the heat source of the first board unit 255 may be an electronic element (or circuit element) disposed on the first board unit 255, such as the image sensor 810, the controller 830, the second position sensor 240, and / or a capacitor.

[0282] In an example, the heat dissipation member 280 may include a metal material having high thermal conductivity and high heat dissipation efficiency, such as at least one of SUS, aluminum, nickel, phosphorus, bronze, or copper.

[0283] Furthermore, the heat dissipation member 280 may function as a reinforcing member, stably supporting the image sensor 810 and suppressing damage to the image sensor 810 due to external impact or contact.

[0284] In another embodiment, the heat dissipation member 280 may be formed of a heat dissipation material having high thermal conductivity, such as heat dissipation epoxy, heat dissipation plastic (eg, polyimide), or heat dissipation synthetic resin.

[0285] For example, in the embodiments of the present disclosure, a "heat dissipation member" may be alternatively referred to as a "heat dissipation body", "heat sink", "heat dissipation plate", "heat sink", a plate, a metal plate, a reinforcing member or a reinforcing member.

[0286] The heat dissipation member 280 may include a predetermined pattern including at least one groove or at least one uneven portion to improve the heat dissipation effect. In an example, grooves or uneven portions having a predetermined pattern may be formed in the lower surface of the heat dissipation member 280 .

[0287] In one example, the predetermined pattern may include a plurality of grooves formed to be spaced apart from each other at predetermined intervals. In one example, the predetermined pattern may be in the shape of stripes. In another embodiment, the predetermined pattern may be in the shape of a net or mesh. In yet another embodiment, the predetermined pattern may be in the shape of dots spaced apart from each other. For example, the shape of the dots may be circular, elliptical, or polygonal (e.g., quadrilateral).

[0288] In another embodiment, the predetermined pattern may be formed on at least one of the upper surface, the lower surface, or the outer side surface of the heat dissipation member 280. In yet another embodiment, the heat dissipation member may include a hole or a through hole instead of the groove or the uneven portion. Since the heat dissipation member 280 moves together with the OIS moving unit, the heat dissipation member 280 may be separated from the fixed unit (e.g., the second plate unit 800). The heat dissipation member 280 may include at least one avoidance groove 281 (refer to Fig.10a ) to avoid spatial interference with solder 901.

[0289] The first circuit board 250 and the second circuit board 260 are Fig.13 9 as being conductively coupled to each other via solder 901. However, in another embodiment, the first circuit board and the second circuit board may be implemented by a single integrated circuit board.

[0290] The second coil 230 may be disposed on the OIS moving unit or coupled to the moving unit. In one example, the second coil 230 may be disposed on the bracket 270. The second coil 230 may be disposed on the upper surface of the bracket 270. The second coil 230 may be disposed under the magnet 130.

[0291] The second coil 230 may be coupled to the bracket 270. In one example, the second coil 230 may be coupled or attached to an upper surface of the bracket 270. In one example, the second coil 230 may be coupled to a coupling protrusion 51 of the bracket 270. The OIS moving unit may move by interaction between the second coil 230 and the magnet 130.

[0292] In one example, the second coil 230 may correspond to, be opposite to, or overlap with the magnet 130 provided on the fixed unit in the direction of the optical axis OA. In another embodiment, the fixed unit may include a separate OIS-specific magnet in addition to the magnet of the AF drive unit, and the second coil may correspond to, be opposite to, or overlap with the OIS-specific magnet. In this case, the number of OIS-specific magnets may be the same as the number of coil units included in the second coil 230.

[0293] In another embodiment, the OIS dedicated magnet may be disposed on the fixed portion of the second coil 230, and the OIS dedicated magnet 71B of the magnet 130 may be disposed on the OIS moving unit. In this case, the second coil 230 may be conductively connected to the support plate 310 and / or the second plate unit 800 via a conductive member.

[0294] In one example, the second coil 230 may include a plurality of coil units 230-1 to 230-4. In one example, the second coil 230 may include four coil units 230-1 to 230-4 disposed at four corners of the bracket 270. In one example, at least a portion of each of the coil units 230-1 to 230-4 may be disposed at a corresponding one of the corners of the bracket 270. A portion of each of the coil units 230-1 to 230-4 may be disposed on a side of the bracket 270 adjacent to a corresponding one of the corners of the bracket 270.

[0295] Each coil unit 230-1 to 230-4 can take the form of a coil block having a closed curve shape or an annular shape. In one example, each coil unit can have a cavity or hole formed therein. In one example, each coil unit can be formed as a fine pattern (FP) coil, a winding coil or a coil block. In one example, the protrusion 51 of the support 270 can be inserted into or coupled to the respective cavities or holes of the coil units 230-1 to 230-4.

[0296] In another embodiment, the second coil 230 may be disposed on the first circuit board 250 or may be coupled to the first circuit board 250 .

[0297] The second coil 230 may be conductively connected to the first circuit board 250. In one example, the first coil unit 230-1 may be conductively connected to two terminals E1 and E2 of the first circuit board 250, the second coil unit 230-2 may be conductively connected to the other two terminals E3 and E4 of the first circuit board 250, the third coil unit 230-3 may be conductively connected to the other two terminals E5 and E6 of the first circuit board 250, and the fourth coil unit 230-4 may be conductively connected to the other two terminals E7 and E8 of the first circuit board 250.

[0298] Power or a driving signal may be supplied to the first to fourth coil units 230-1 to 230-4 through the first circuit board 250. The power or driving signal supplied to the second coil 230 may be a DC signal, an AC signal, or a signal containing DC and AC components, and may be a current type or a voltage type.

[0299] The OIS moving unit may move in the first horizontal direction or the second horizontal direction, or may roll around the optical axis, through the interaction between the first to fourth magnet units 130 - 1 to 130 - 4 and the first to fourth coil units 230 - 1 to 230 - 4 .

[0300] In one example, current may be independently applied to at least three coil units among the four coil units 230 - 1 to 230 - 4 . In another embodiment, current may be independently applied to at least two coil units among the four coil units 230 - 1 to 230 - 4 .

[0301] In an example, a separate independent driving signal (eg, driving current) may be provided to each of the four coil units 230 - 1 to 230 - 4 .

[0302] The controller 830 or 780 may provide at least one driving signal to at least one of the first to fourth coil units 230-1 to 230-4, and may control the at least one driving signal so that the OIS moving unit moves in the X-axis direction and / or the Y-axis direction, or rotates around the optical axis within a predetermined angle range. The "controller" to be described below may be at least one of the controller 830 of the camera device 10 or the controller 780 of the optical instrument 200A.

[0303] When the second coil 230 is driven in a three-channel driving mode, three independent drive signals may be provided to the second coil 230. In one example, in four coil units, two coil units (e.g., 230-2 and 230-4, or 230-1 and 230-3) facing each other in a diagonal direction may be connected in series with each other. One drive signal may be provided to two coil units connected in series with each other, and an independent drive signal may be provided to each of the remaining two coil units in the four coil units.

[0304] Alternatively, when the second coil 230 is driven in the four-channel driving mode, an independent driving signal may be provided to each of the four coil units 230 - 1 to 230 - 4 separated from each other.

[0305] Fig.18a is a view for explaining the movement of the OIS moving unit in the X-axis direction, and Fig.18b is a view for explaining the movement of the OIS moving unit in the y-axis direction.

[0306] The N poles and S poles of the first magnet unit 71B1 and the third magnet unit 71B3 facing each other in the first diagonal direction can be arranged to face each other in the first horizontal direction (e.g., the Y-axis direction). In addition, the N poles and S poles of the second magnet unit 71B2 and the fourth magnet unit 71B4 facing each other in the second diagonal direction perpendicular to the first diagonal direction can be arranged to face each other in the second horizontal direction (e.g., the X-axis direction).

[0307] That is, the direction in which the N pole and S pole of the first magnet unit 71B1 face each other can be the same as or parallel to the direction in which the N pole and S pole of the third magnet unit 71B3 face each other. In addition, the direction in which the N pole and S pole of the second magnet unit 71B2 face each other can be the same as or parallel to the direction in which the N pole and S pole of the fourth magnet unit 71B3 face each other.

[0308] In another embodiment in which the second magnet 71B is a bipolar magnet, based on the boundary line (or interface) between the N pole and the S pole of each of the first to fourth magnet units 71B1 to 71B4, its N pole may be located in an inward position, and its S pole may be located in an outward position. In another embodiment, based on the boundary line between the N pole and the S pole of each of the first to fourth magnet units 71B1 to 71B4, its S pole may be located in an inward position, and its N pole may be located in an outward position. The boundary line (or interface) may be a portion that separates the N pole and the S pole from each other and has substantially no magnetism, and therefore has almost no polarity.

[0309] Reference Fig.18a , the OIS moving unit can move or shift in the X-axis direction by the first electromagnetic force Fx1 (or Fx3) generated by the interaction between the second coil unit 230-2 and the second magnet unit 71B2 and the second electromagnetic force Fx2 (or Fx4) generated by the interaction between the fourth coil unit 230-4 and the fourth magnet unit 71B4. In one example, the direction of the first electromagnetic force Fx1 (or Fx3) and the direction of the second electromagnetic force Fx2 (or Fx4) can be the same as each other.

[0310] Reference Fig.18b The OIS moving unit may be moved or displaced in the y-axis direction by the third electromagnetic force Fy1 (or Fy3) generated by the interaction between the first coil unit 230-1 and the first magnet unit 71B1 and the fourth electromagnetic force Fy2 (or Fy4) generated by the interaction between the third coil unit 230-3 and the third magnet unit 71B3. In one example, the direction of the third electromagnetic force Fy1 (or Fy3) and the direction of the fourth electromagnetic force Fy2 (or Fy4) may be the same as each other.

[0311] Fig.18c is a view for explaining that the OIS moving unit rotates clockwise in the four-channel driving mode, and Fig.18d is a view for explaining counterclockwise rotation of the OIS moving unit in the four-channel driving mode.

[0312] Reference Fig.18c, through the first electromagnetic force FR1 generated by the interaction between the first coil unit 230-1 and the first magnet unit 71B1, the second electromagnetic force FR2 generated by the interaction between the second coil unit 230-2 and the second magnet unit 71B2, the third electromagnetic force FR3 generated by the interaction between the third coil unit 230-3 and the third magnet unit 71B3, and the fourth electromagnetic force FR4 generated by the interaction between the fourth coil unit 230-4 and the fourth magnet unit 71B4.

[0313] In addition, refer to Fig.18d The OIS moving unit can be moved by a first electromagnetic force FL1 generated by the interaction between the first coil unit 230-1 and the first magnet unit 71B1, a second electromagnetic force FL2 generated by the interaction between the second coil unit 230-2 and the second magnet unit 71B2, a third electromagnetic force FL3 generated by the interaction between the third coil unit 230-3 and the third magnet unit 71B3, and a fourth electromagnetic force FL4 generated by the interaction between the fourth coil unit 230-4 and the fourth magnet unit 71B4.

[0314] In one example, the direction of the first electromagnetic force FR1 (or FL1) and the direction of the third electromagnetic force FR3 (or FL3) may be opposite to each other. In addition, in one example, the direction of the second electromagnetic force FR2 (or FL2) and the direction of the fourth electromagnetic force FR4 (or FL4) may be opposite to each other. In addition, in one example, the direction of the first electromagnetic force RF1 (or FL1) and the direction of the second electromagnetic force FR2 (or FL2) may be perpendicular to each other.

[0315] In the case of the three-channel driving mode, the driving signal may not be provided to the two coil units (e.g., 130-1 and 130-3, or 130-2 and 130-4) connected in series with each other, and therefore, the two coil units connected in series with each other do not generate electromagnetic force. In one example, in the case of the three-channel driving mode, FR2 and FR4 may be omitted, and FR1 and FR3 may be present. Fig.18c Alternatively, in the case of a three-channel drive mode, R2 and FR4 may be present and Fig.18c In addition, in the case of three-channel drive mode, FL2 and FL4 can be omitted, and FL1 and FL3 can appear in Fig.18d Or, in the case of three-channel drive mode, Fig.18d FL2 and FL4 may be present, and FL1 and FL3 may be omitted.

[0316] Compared with the three-channel driving mode, Fig.18c and Fig.18dIn the illustrated four-channel driving mode, the electromagnetic force for the rotation of the OIS moving unit may be increased, and thus, the amount of driving current required to drive the first to fourth coil units 230 - 1 to 230 - 4 may be reduced, thereby reducing power consumption.

[0317] exist Figure 2 In the illustrated embodiment, OIS driving for hand-shake compensation is performed using the second magnet 71B and the second coil 230. However, in another embodiment, OIS driving for hand-shake compensation can be performed using a shape memory alloy member. In one example, the shape memory alloy member can be coupled to the fixed unit and the OIS mobile unit, and can be conductively connected to the first plate unit 255. The controller 830 or 780 can provide a driving signal to the shape memory alloy member, and the shape memory alloy member can be used to move the OIS mobile unit in a direction perpendicular to the optical axis, or can be rotated, tilted, or rolled around the optical axis.

[0318] In yet another embodiment, the OIS drive may be performed using the second magnet 71B and the second coil 230, and the camera device 10 may include a ball member (not shown) disposed between the base 210 and the bracket 270 to support the OIS mobile unit. In this case, the ball member may support the OIS mobile unit using the friction and / or rolling force between the base 210 and the bracket 270, so that the OIS mobile unit moves in a direction perpendicular to the optical axis or rotates, tilts, or rolls around the optical axis. In one example, the ball member may be disposed in the hole 59 in the base 210 and may contact each of the base 210 and the bracket 270. In another embodiment, a ball member may be provided, and the terminal unit 37 and the wire 220 may be omitted.

[0319] The second position sensor 240 may be disposed on, coupled to, or mounted on a first surface (e.g., an upper surface) of the first circuit board 250. The second position sensor 240 may detect movement or displacement of the OIS moving unit in a direction perpendicular to the optical axis direction, for example, movement or displacement of the OIS moving unit in a direction perpendicular to the optical axis direction. In addition, the second position sensor 240 may detect rotation, rolling, or tilting of the OIS moving unit within a predetermined range around the optical axis or relative to the optical axis. The first position sensor 170 may alternatively be referred to as an "AF position sensor," and the second position sensor 240 may alternatively be referred to as an "OIS position sensor."

[0320] The second position sensor 240 may be opposite to or overlapped with the magnet 130 in the optical axis direction. In one example, the second position sensor 240 may be opposite to or overlapped with the second magnet 71B in the optical axis direction. In one example, the second position sensor 240 may include three or more sensors corresponding to or overlapping with three or more of the four magnet units 71B1 to 71B4 of the second magnet 71B, so as to detect the movement of the OIS moving unit.

[0321] In an example, the second position sensor 240 may be disposed below the second coil 230 .

[0322] In one example, the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. In one example, a sensing element of the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. The sensing element may be a portion that detects a magnetic field.

[0323] In one example, the center of the second position sensor 240 may not overlap with the second coil 230 in a direction perpendicular to the optical axis. In one example, the center of the second position sensor 240 may be a spatial center in the x-axis and y-axis directions in an xy coordinate plane perpendicular to the optical axis. Alternatively, the center of the second position sensor 240 may be a spatial center in the x-axis, y-axis, and z-axis directions.

[0324] In another embodiment, at least a portion of the second position sensor 240 may overlap with the second coil 230 in a direction perpendicular to the optical axis.

[0325] In one example, the second position sensor 240 may overlap with the holes 41A to 41C in the bracket 270 in the optical axis direction. In addition, in one example, the second position sensor 240 may overlap with the cavity in the second coil 230 in the optical axis direction. In addition, in one example, at least some of the holes 41A to 41C in the bracket 270 may overlap with the cavity in the second coil 230 in the optical axis direction.

[0326] In an example, at least a portion of the second position sensor 240 (eg, a center of the second position sensor 240 ) may not overlap with the second coil 230 in the optical axis direction.

[0327] In an example, the second position sensor 240 may include a first sensor 240A, a second sensor 240B, and a third sensor 240C that are spaced apart from each other.

[0328] For example, the first to third sensors 240A, 240B and 240C may be Hall sensors. In another embodiment, the first to third sensors 240A, 240B and 240C may be driver ICs including Hall sensors and drivers. The description of the first position sensor 170 may be equally or similarly applied to the first to third sensors 240A, 240B and 240C. The first to third sensors 240A2, 240B and 240C may be, for example, displacement detection sensors, whose output voltages vary according to the positional relationship of the magnet units corresponding thereto.

[0329] The first sensor 240 , the second sensor 240B, and the third sensor 240C may each be conductively connected to the first circuit board 250 .

[0330] The second position sensor 240 may be disposed below the cavity in the second coil 230. In another embodiment, the second position sensor 240 may be disposed outside the second coil 230 when viewed along the optical axis or from above.

[0331] The second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis direction. In an example, the second position sensor 240 may overlap the bracket 270 in a direction perpendicular to the optical axis direction.

[0332] In one example, the first sensor 240A may be disposed below the cavity in the first coil unit 230-1. The first sensor 240A may be disposed in a hole 41A corresponding to it among the holes 41A to 41C of the bracket 270. The second sensor 240B may be disposed below the cavity in the second coil unit 230-2. The second sensor 240B may be disposed in a hole 41B corresponding to it among the holes 41A to 41C of the bracket 270. The third sensor 240C may be disposed below the cavity in the third coil unit 230-3. The third sensor 240C may be disposed in a hole 41C corresponding to it among the holes 41A to 41C of the bracket 270.

[0333] In one example, each of the first to third sensors 240A, 240B, and 240C may not overlap with a corresponding one of the coil units 230-1 to 230-3 in a direction perpendicular to the optical axis. The first to third sensors 240A, 240B, and 240C may overlap with the bracket 270 in a direction perpendicular to the optical axis.

[0334] Since the first to third sensors 240A, 240B and 240C are arranged not to overlap with the OIS coil 230 in a direction perpendicular to the optical axis, the influence of the magnetic field of the OIS coil 230 on the output of the OIS position sensor 240 can be reduced, so that the OIS feedback drive can be accurately performed and the reliability of the OIS operation can be ensured.

[0335] The second position sensor 240 may be opposite, corresponding, or overlapped with the magnet 130 in the optical axis direction. In one example, at the initial position of the OIS moving unit, at least a portion of the first sensor 240A may overlap with the first magnet unit 71B1 of the second magnet 71B in the optical axis direction. The first sensor 240A may output a first output signal (e.g., a first output voltage) corresponding to the detection result of the magnetic field of the first magnet unit 71B1.

[0336] In one example, at the initial position of the OIS moving unit, at least a portion of the second sensor 240B may overlap with the second magnet unit 71B2 of the second magnet 71B in the optical axis direction. The second sensor 240B may output a second output signal (e.g., a second output voltage) corresponding to the detection result of the magnetic field of the second magnet unit 71B2.

[0337] In addition, in an example, at the initial position of the OIS moving unit, at least a portion of the third sensor 240C may overlap with the third magnet unit 71B3 of the second magnet 71B in the optical axis direction. The third sensor 240C may output a third output signal (e.g., a third output voltage) corresponding to the detection result of the magnetic field of the third magnet unit 71B3.

[0338] The initial position of the OIS mobile unit may be the original position of the OIS mobile unit, or the position of the OIS mobile unit when the support plate is elastically deformed only due to the weight of the OIS mobile unit, in a state where the controller 820 or 780 does not apply power or a driving signal to the second coil 230. In addition, the initial position of the OIS mobile unit may be the position of the OIS mobile unit when gravity acts in a direction from the first plate unit 255 toward the second plate unit 800 or when gravity acts in an opposite direction.

[0339] To improve the linearity of the relationship between the displacement of the OIS moving unit and the output from the second position sensor 250 , the sensor units 240A, 240B and 240C may each overlap with a corresponding one of the magnet units 71B1 , 71B2 and 71B3 in the optical axis direction within the travel range of the OIS moving unit.

[0340] In one example, the controller 830 or 780 may control the scrolling of the OIS mobile unit using at least one of the first output voltage from the first sensor 240A, the second output voltage from the second sensor 240B, or the third output voltage from the third sensor 240C. In one example, the controller 830 or 780 may control the scrolling of the OIS mobile unit using the first output voltage and the third output voltage.

[0341] In one example, the controller 830 or 780 may use at least one of the first to third output voltages to control or adjust the movement or displacement of the OIS mobile unit in the first horizontal direction (e.g., y-axis direction) or the second horizontal direction (e.g., x-axis direction). In one example, the controller 830 or 780 may use the first output voltage from the first sensor 240A to control or adjust the movement or displacement of the OIS mobile unit in the first horizontal direction (e.g., y-axis direction), and may use the second output voltage from the second sensor 240B to control or adjust the movement or displacement of the OIS mobile unit in the second horizontal direction.

[0342] In one example, the first to third sensors 240A, 240B, and 240C may each be a Hall sensor. In another embodiment, the first to third sensors may each be a driver IC including a Hall sensor. In yet another embodiment, the first and second sensors 240A and 240B may each be a Hall sensor, and the third sensor 240C may be a tunnel magnetoresistance (TMR) sensor. In this case, the tunnel magnetoresistance (TMR) sensor may be a TMR magnetic angle sensor.

[0343] In yet another embodiment, the first to third sensors 240A, 240B and 240C may all be tunnel magnetoresistive (TMR) sensors. In this case, the TMR sensors may be TMR linear magnetic field sensors having a linear output corresponding to the displacement (or travel) of the OIS moving unit.

[0344] The base 210 may be disposed below the first plate unit 255. The base 210 may be spaced apart from the first plate unit 255. The base 210 may have a polygonal shape (eg, a quadrangular shape) that is consistent with or corresponds to the shape of the cover member 300 or the first plate unit 255.

[0345] In one example, the base 210 may include a hole 210A formed therein to correspond to or face the first board unit 255. The hole 210A in the base 210 may be a through hole formed through the base 210 in the optical axis direction. In another embodiment, the base may not include a hole.

[0346] In one example, the base 210 may be coupled to the side plate 302 of the cover member 300. The base 210 may be provided with a stepped portion 211 (see Fig.14 ), an adhesive is applied to the stepped portion 211 so as to adhere to the side plate 302 of the cover member 300. In this case, the stepped portion 211 can guide the side plate 302 of the cover member 300 coupled to its upper side. The stepped portion 211 of the base 210 and the lower end of the side plate 302 of the cover member 300 can be adhered and fixed to each other by an adhesive or the like.

[0347] The base 210 may include at least one protrusion 216A or 216B protruding from its upper surface. In one example, the protrusion 216A or 216B may protrude upward from the outer side surface of the base 210. In one example, the base 210 may include two protrusions 216A and 216B, which are opposite to or overlap each other in a first horizontal direction (e.g., the Y-axis direction).

[0348] In one example, the base 210 may include four sides (or side panels), and the protrusions 216A and 216B may be formed on two of the four sides. In one example, the protrusions 216A and 216B may be disposed or located at the center of a corresponding side (or side panel) of the base 210.

[0349] The base 210 may include a groove 341b formed therein. The groove 341b may be an adhesive receiving groove. The groove 341b may be formed in the outer side surface of each of the protrusions 216A and 216B of the base 210. The groove 341b may be formed in the upper surface of each of the protrusions 216A and 216B of the base 210. The groove 341b may be formed from the upper surface of each of the protrusions 216A and 216B of the base 210 to its lower surface. The adhesive may be provided in the groove 341b, and the support plate 310 is adhered to the base 210 by the adhesive. The groove 341b may include a plurality of grooves. In an example, the groove 341b may extend in the optical axis direction. In another embodiment, the groove formed in each of the protrusions 216A and 216B of the base 210 may extend in a direction perpendicular to the optical axis.

[0350] The second board unit 800 may be disposed under the base 210. In an example, the second board unit 800 may be disposed to be spaced apart from the OIS moving unit (eg, the first board unit 255 and the heat dissipation member 280) in the optical axis direction.

[0351] In one example, the second board unit 800 may be disposed on a lower surface of the base 210. The second board unit 800 may be coupled to the base 210. In one example, the second board unit 800 may be coupled to a lower surface of the base 210.

[0352] The second board unit 800 may be used to provide a signal from the outside to the image sensor unit 350 , or output a signal transmitted from the image sensor unit 350 to the outside.

[0353] The second board unit 800 may include a first region (or first board) 801, a second region (or second board) 802, and a third region (or third board) 803, the first region 801 corresponding to, opposite to, or overlapping the AF drive unit 100 or the image sensor 810 in the optical axis direction, a connector 804 provided on the second region (or second board) 802, and the third region 803 interconnecting the first region 801 and the second region 802. The connector 804 may be provided with a port so as to be conductively connected to the second region 802 of the second board unit 800 and conductively connected to an external device (e.g., the optical instrument 200A). The hole 210A in the base 210 may be closed or blocked by the first region 801 of the second board unit 800.

[0354] The first region 801 of the second plate unit 800 may correspond to, face or overlap at least one of the cover member 300 or the base 210 in the optical axis direction. In one example, the first region 801 may overlap the upper plate 301 and the side plate 302 of the cover member 300 in the optical axis direction.

[0355] The first region 801 and the second region 802 of the second board unit 800 may each include a rigid substrate. The third region 803 may include a flexible substrate. In addition, the first region 801 and the third region 802 may each include a flexible substrate.

[0356] In another embodiment, at least one of the first to third regions 801 to 803 of the circuit board 800 may include at least one of a rigid substrate or a flexible substrate.

[0357] The second board unit 800 may be disposed behind the first board unit 255. In one example, the first board unit 255 may be disposed between the AF driving unit 100 and the second board unit 800. In another embodiment, the second board unit may be disposed between the AF driving unit and the first board unit.

[0358] When viewed from above, the first area 801 of the second board unit 800 may be polygonal (eg, quadrilateral, square, or rectangular). However, the present disclosure is not limited thereto. In another embodiment, the first area of ​​the second board unit may be circular.

[0359] Fig.20a 80 is a view showing an example of the arrangement of the first to third regions 801 to 803 of the second panel unit 800 , the extension region 808 , the AF moving unit, the OIS moving unit, and the controller 830 .

[0360] Reference Fig.20a , the first region 801 may include four side portions (or side surfaces) 85A to 85D. In one example, the first region 801 may include first and second side portions 85A and 85B that are opposite or positioned relative to each other in the second horizontal direction (e.g., the X-axis direction), and third and fourth side portions 85C and 85D that are opposite or positioned relative to each other in the first horizontal direction (e.g., the Y-axis direction).

[0361] The second region 802 may be disposed adjacent to the first side 85A of the first region 801, and the third region 803 may be connected to the first side 85A of the first region 801. In one example, the third region 803 may extend from the first region 801 and may be connected to a side of the second region 802 opposite to the first side 85A.

[0362] The second board unit 800 may include a plurality of terminals 800B corresponding to the terminals 311 of the support board 310. The plurality of terminals 800B may be formed in the first region 801 of the second board unit 800. In an example, the second board unit 800 may include a first terminal 800B1 and a second terminal 800B2, the first terminal 800B1 being disposed or arranged to be spaced apart from each other along the side of the third side portion 85C of the first region 801 in the second horizontal direction (e.g., the X-axis direction), and the second terminal 800B2 being disposed or arranged to be spaced apart from each other along the side of the fourth side portion 85D of the first region 801 in the second horizontal direction.

[0363] In an example, the plurality of terminals 800B may be formed on a first surface (eg, an upper surface) of the second board unit 800 (eg, a first region 801 ) facing the first board unit 255 .

[0364] In one example, the controller 830 may be disposed in an extended region extending from any one of the third side portion 85C and the fourth side portion 85D of the first region 801 of the second board unit 800. In another embodiment, the controller may be disposed in an extended region extending from a side portion of the first region 801 of the second board unit 800, on which a plurality of terminals are formed.

[0365] A coupling hole (not shown) may be formed in the first region 801 , and a coupling protrusion (not shown) may be formed on the base 210 so as to be coupled to the coupling hole in the first region 801 .

[0366] The camera device 10 may further include a heat dissipation member 380 disposed on, coupled to, or fixed to the second board unit 800. In one example, the heat dissipation member 380 may be disposed on, coupled to, or fixed to an upper surface of the first region 801 of the second board unit 800. In another embodiment, the heat dissipation member 380 may be omitted.

[0367] The camera apparatus 10 may further include a third heat dissipation member (not shown) disposed on, coupled to, or fixed to a second surface (eg, a lower surface) of the second board unit 800 .

[0368] In one example, the heat dissipation member 380 may be a plate-type member having a predetermined thickness and hardness. In addition, the heat dissipation member 380 may be opposite to or overlapped with the heat dissipation member 280 in the optical axis direction.

[0369] refer to Fig.20a , the controller 830 may be disposed on the upper surface of the extension region 808 or coupled to the upper surface of the extension region 808. In another embodiment, the controller may be disposed on the lower surface of the extension region 808 or coupled to the lower surface of the extension region 808.

[0370] Reference Fig.20a , the controller 830 may be disposed in an extension region 808 of the second board unit 800 , which is located outside the cover member 300 . In another embodiment, the controller may be disposed in a first region of the second board unit 800 , which is located outside the base 210 .

[0371] In yet another embodiment, the controller may be disposed or mounted on the second circuit board 260, which is a sensor board. In another embodiment, the controller may be disposed or mounted on the upper surface of the second circuit board 260. Since the heat dissipation member 280 is disposed on or coupled to the lower surface of the second circuit board 260, when the controller is disposed on the second circuit board 260, the heat generated by the controller may be easily dissipated through the heat dissipation member 280, and thus, the heat dissipation efficiency and heat dissipation performance may be improved.

[0372] Fig.20b is a schematic cross-sectional view of the lens module 400 , the first board unit 255 , the image sensor 810 , and the second board unit 800 .

[0373] Reference Fig.20b , the image sensor 810 may be disposed in a hole (or aperture) 260A of the second circuit board 260 , and may be coupled to the heat dissipation member 280 .

[0374] In one example, the heat dissipation member 280 may include a body 37A disposed below the second circuit board 260 and a protrusion (or protrusion area) 37B protruding from the body 37A and disposed in a hole 260A of the second circuit board 260 .

[0375] The camera apparatus 10 may include a heat dissipation body 450 interconnecting the heat dissipation member 280 and the support unit (eg, the support plate 310 ).

[0376] The heat dissipating body 450 may include a body (or first region) coupled to the lower surface of the heat dissipating member 280 and a connection portion (or second region) interconnecting the body and a support unit (eg, support plate 310). The heat dissipating body 450 may include a graphite sheet.

[0377] The image sensor 810 may be disposed on, coupled to, or fixed to the protrusion 37B. In one example, the image sensor 810 may be disposed on, coupled to, or attached to the upper surface of the protrusion 37B. In one example, the upper surface of the protrusion 37B may be located at a lower position than the upper surface of the second circuit board 260. In another embodiment, the upper surface of the protrusion 37B may be located at the same height as the upper surface of the second circuit board 260.

[0378] The heat dissipation member 380 may be disposed on the first surface 801A (or upper surface) of the first region 801 of the second board unit 800 , which is opposite to the heat dissipation member 280 in the optical axis direction.

[0379] The spacing distance (or gap) G1 between the first board unit 255 and the second board unit 800 in the optical axis direction may be 0.05 mm to 0.7 mm. In one example, the spacing distance G1 may be the distance between the lower surface of the heat dissipation member 280 and the upper surface of the heat dissipation member 380 .

[0380] In another embodiment, G1 may be 0.15 mm to 0.5 mm. In yet another embodiment, G1 may be 0.15 mm to 0.3 mm. In yet another embodiment, G1 may be 0.2 mm to 0.3 mm.

[0381] The second board unit 800 may include a first conductive layer 93 that is exposed to the first surface 801A and contacts the heat dissipation member 380 (e.g., the lower surface of the heat dissipation member 380). In one example, the first conductive layer 93 may be thermally coupled to the lower surface of the heat dissipation member 380, or may be coupled to the lower surface of the heat dissipation member 380 by a conductive adhesive (e.g., solder). In addition, in one example, the first conductive layer 93 may be conductively connected to the heat dissipation member 380.

[0382] The second board unit 800 may include a second conductive layer 92A connected to the first conductive layer 93 and exposed from a second surface 801B (or lower surface) of the second board unit 800, the second surface 801b being a surface opposite to the first surface 801A of the second board unit 800. In an example, the second conductive layer 92A may be conductively connected to the second board unit 800.

[0383] The first conductive layer 93 may take the form of a via formed through at least a portion of the second board unit 800. In one example, the first conductive layer 93 may include a first via 93A formed through the second board unit 800 so as to be open or exposed to the second surface 801B of the second board unit 800. In addition, one end of the first conductive layer 93 may contact the lower surface of the heat dissipation member 380, and the other end thereof may include a second via 93B formed therein so as to contact, couple or connect with the second conductive layer 92A.

[0384] Reference Fig.20b , the second conductive layer 92A may be disposed in a groove formed in the second surface 801B of the second board unit 800-1, or coupled or attached thereto. In another embodiment, the second conductive layer may be disposed on the second surface 801B of the second board unit 800, coupled or attached to the second surface 801b, which is a flat surface in which no groove is formed.

[0385] The first conductive layer 93 and the second conductive layer 92A may both be used as heat dissipation patterns or heat dissipation pads for dissipating heat from the second board unit 800. That is, because the first conductive layer 93 and the second conductive layer 92A are provided only for the purpose of heat dissipation, the first conductive layer 93 and the second conductive layer 92A may not be conductively connected to the wire of the second board unit 800, but may be conductively connected to the ground terminal of the second board unit 800. In this case, the other wire may be a wire conductively connected to the controller 830 or 780, an electronic component (or circuit component) such as the image sensor 810, or the support board 310.

[0386] The second conductive layer 92A may be conductively connected to the cover member 300 (e.g., the side plate 302) via solder, a conductive adhesive, or a piece of conductive tape. Alternatively, in another embodiment, the second conductive layer 92A connected to the ground end of the second board unit 800 may be conductively connected to the cover member 300 via a bracket. The bracket may be a structure that accommodates or receives the camera device to protect the camera device. In one example, the bracket may be formed of a conductive material. Since the ground end of the second board unit 800, the heat dissipation member 380, and the cover member 300 are conductively connected to each other, the camera device 10 may be protected from static electricity and the heat dissipation efficiency may be improved.

[0387] In another embodiment, at least one of the first conductive layer or the second conductive layer of the second board unit 800 may be equally or similarly applied to the second circuit board 260. In one example, the second circuit board 260 according to another embodiment may include at least one third conductive layer in contact with the heat dissipation member 280, and at least a portion of the third conductive layer may be exposed from the second circuit board 260.

[0388] Since the heat dissipation member 380 is disposed on the first surface of the second board unit 800 , a spacing distance from the heat dissipation member 280 may be reduced, and thus heat dissipation efficiency may be improved.

[0389] The heat emitted from the heat dissipation member 280 can be transferred to the heat dissipation member 380 by convection or radiation, and the transferred heat can be dissipated to the outside by the heat dissipation member 380. Therefore, the heat dissipation effect can be improved. Since the upper surface of the heat dissipation member 380 and the lower surface of the heat dissipation member 280 are arranged to face or overlap each other in the optical axis direction, heat can be smoothly transferred from the heat dissipation member 280 to the heat dissipation member 380.

[0390] In one example, the heat dissipation member 280 and the heat dissipation member 380 may be formed of the same material. In another embodiment, the heat dissipation member 280 and the heat dissipation member 380 may be formed of different materials. In one example, the thermal conductivity of the heat dissipation member 280 may be applied to the heat dissipation member 380 in the same or similar manner.

[0391] In addition, the heat dissipation member 380 may function as a reinforcing member for stably supporting the second board unit 800 and suppressing damage of the second board unit 800 due to external impact or contact.

[0392] In another embodiment, the heat dissipation member 380 may be formed of a heat dissipation material having high thermal conductivity (eg, heat dissipation epoxy, heat dissipation plastic, or heat dissipation synthetic resin).

[0393] The heat dissipation member 380 may include at least one groove or at least one uneven portion to improve the heat dissipation effect. In one example, a groove or uneven portion having a predetermined pattern may be formed in at least one of the upper surface or the lower surface of the heat dissipation member 380.

[0394] In another embodiment, the heat dissipation member 380 may include a hole or a through hole instead of the groove. In one example, the heat dissipation member 380 according to another embodiment may include a plurality of through holes. The description of the predetermined pattern of the heat dissipation member 280 may be equally or similarly applied to the heat dissipation member 380.

[0395] The camera device according to another embodiment may include a heat dissipation member disposed under the second board unit 800. In this case, the description of the material of the heat dissipation member 280 or 380 may be equally or similarly applied to the material of the heat dissipation member.

[0396] The support plate 310 may support the moving unit so that the OIS moving unit moves in a direction perpendicular to the optical axis direction relative to the fixed unit, and may conductively connect the first board unit 255 to the second board unit 800 .

[0397] The support plate 310 may alternatively be referred to as a "support member", "connecting plate" or "connecting portion". Alternatively, the support plate 310 may be referred to as an "interposer". Alternatively, the "interposer" may include the first circuit board 250 and the support plate 310 formed integrally with each other.

[0398] In another embodiment, a support unit may be provided instead of the support plate 310, one end of which is connected to the mobile unit (e.g., the first plate unit 255) and the other end of which is connected to the fixed unit (e.g., the second plate unit 800). In one example, the support unit may include at least one of a leaf spring or a suspension wire. In one example, the support unit may interconnect the first plate unit 255 and the second plate unit 800 in a conductive manner.

[0399] The support plate 310 may include a flexible substrate or may be a flexible substrate. In an example, the support plate 310 may include a flexible printed circuit board (FPCB). At least a portion of the support plate 310 may be flexible. The first circuit board 250 and the support plate 310 may be connected to each other.

[0400] Reference Fig.16 In one example, the support plate 310 may include a connection portion 320 connected to the first circuit board 250. In one example, the first circuit board 250 and the support plate 310 may be formed integrally with each other. In another embodiment, the first circuit board 250 and the support plate 310 may be provided separately from each other, rather than being integrated together, and may be connected to each other via the connection portion 320, and may be conductively connected to each other. Alternatively, in another embodiment, the connection portion 320 may be formed integrally with at least one of the support plate 310 or the first circuit board 250.

[0401] In addition, the support plate 310 may be conductively connected to the first circuit board 250. The support plate 310 may be conductively connected to the second board unit 800. In an example, one end of the support plate 310 may be connected or coupled to the first board unit 255 (e.g., the second circuit board 260). In addition, the other end of the support plate 310 may be connected or coupled to the second board unit 800.

[0402] The support plate 310 may support the OIS moving unit relative to the fixed unit. In addition, the support plate 310 may guide the movement of the OIS moving unit. The support plate 310 may guide the OIS moving unit to move in a direction perpendicular to the optical axis direction. The support plate 310 may guide the OIS moving unit to rotate, tilt, or roll around the optical axis. The support plate 310 may limit the movement of the OIS moving unit in the optical axis direction.

[0403] A portion of the support plate 310 may be coupled, attached, or fixed to the base 210 as a fixing unit, and another portion of the support plate 310 may be coupled, attached, or fixed to the bracket 270 as an OIS moving unit.

[0404] In one example, a portion of the body 86 and 87 of the support plate 310 can be connected to the base 210 as a fixed unit (e.g., protrusions 216A and 216B), and the other portion of the body 86 and 87 can be connected to the bracket 270 as an OIS moving unit (e.g., protrusions 27A and 27B).

[0405] The connection portion 320 of the support plate 310 may be coupled to the first plate unit 255 (e.g., the first plate unit 250) and may be conductively connected to the first plate unit 255. The extension portions 7A to 7D of the support plate 310 may be coupled to the second plate unit 800 (e.g., the terminal 800B) and may be conductively connected thereto.

[0406] In one example, the support plate 310 may include a circuit member and an elastic unit coupled to the circuit member. The elastic unit is used to elastically support the OIS moving unit and may be implemented by an elastomer (e.g., a spring). The elastic unit may include metal or may be made of an elastic material. The circuit member is used to conductively connect the first circuit board 250 to the second board unit 800 and may be a flexible substrate or may include at least one of a flexible substrate or a rigid substrate. The circuit member may be, for example, an FPCB.

[0407] In an example, the support plate 310 may be connected to the first board unit 255 (eg, the first circuit board 250 ), and may include at least one connection portion 320A or 320B conductively connected to the first board unit 255 (eg, the first circuit board 250 ).

[0408] Furthermore, the support plate 310 may include at least one extending portion 7A to 7D coupled to and conductively connected to the second plate unit 800 , and the at least one extending portion 7A to 7D may include a plurality of terminals 311 .

[0409] In one example, the support plate 310 may be disposed to surround the OIS moving unit, such as the first plate unit 255. In one example, the support plate 310 may be disposed to surround the four side portions 33A to 33D (see Fig.16 ) or the outer surface of the first circuit board 250.

[0410] In one example, the support plate 310 may not overlap with the OIS moving unit (e.g., the first plate unit 255) in the optical axis direction, and at least a portion of the support plate 310 may overlap with the OIS moving unit (e.g., the first plate unit 255) in a direction perpendicular to the optical axis direction.

[0411] In one example, the support plate 310 may include a plurality of support plates that are separated or spaced apart from each other. In another embodiment, the support plate 310 may be integrally formed.

[0412] The support plate 310 may include bodies 86 and 87. In one example, the bodies 86 and 87 may be disposed to surround an OIS moving unit, such as the first plate unit 255. In one example, the bodies 86 and 87 may not overlap with the OIS moving unit (e.g., the first plate unit 255) in the optical axis direction, and at least a portion of the bodies 86 and 87 may overlap with the OIS moving unit (e.g., the first plate unit 255) in a direction perpendicular to the optical axis direction.

[0413] For example, the bodies 86 and 87 may be in the form of a plate that is flat in the optical axis direction or in a direction parallel to the optical axis direction. For example, when viewed from above, the outer shape of the bodies 86 and 87 may be polygonal, such as a quadrilateral or a circle.

[0414] In one example, the bodies 86 and 87 may each include multiple parts that are separated or spaced apart from each other. In another embodiment, the bodies may each be integrally formed.

[0415] In addition, the support plate 310 may include an extension portion extending from each of the bodies 86 and 87 to be coupled to the second board unit 800. In one example, the extension portion of the support plate 310 may extend toward the second board unit 800, and one end of the extension portion of the support plate 310 may be coupled to the second board unit 800. A plurality of terminals conductively connected to the second board unit 800 by solder or a conductive adhesive may be provided at one end of the extension portion of the support plate 310. For example, the extension portion of the support plate 310 may be alternatively referred to as a “terminal portion”, a “protruding portion”, or a “leg member”.

[0416] The extension portions 7A to 7D may extend from the bodies 86 and 87 toward the first board unit 800. In an example, the extension portions 7A to 7D may extend in the first direction from the bodies 86 and 87. In addition, the extension portions 7A to 7D may extend in the second horizontal direction (X-axis direction).

[0417] When viewed from the front, the two extension portions 7D and 7B may be bilaterally symmetrical to each other. In an example, the two extension portions 7D and 7B may be bilaterally symmetrical to each other with respect to a straight line that is parallel to the optical axis and extends through a center point between the two extension portions 7D and 7B.

[0418] When viewed from the front, the other two extensions 7A and 7C may be symmetrical to each other. In an example, the other two extensions 7A and 7C may be symmetrical to each other relative to a straight line that is parallel to the optical axis and extends through the center point between the other two extensions 7A and 7C.

[0419] The extension portion 7D may include: a first extension portion 45A (or first portion) extending from the bodies 86 and 87 toward the second board unit 800; and a second extension portion 45B (or second portion) extending in a direction different from the extending direction of the first extension portion. In an example, the first extension portion 45A may extend in the optical axis direction, and the second extension portion 45B may extend in a direction perpendicular to the optical axis.

[0420] In one example, the first extension portion may extend in a first direction (e.g., the Z-axis direction). In one example, the second extension portion 45B may extend in a second horizontal direction (e.g., the X-axis direction). In one example, the second extension portion 45B may extend in a leftward or rightward direction relative to one end or a center line of each of the bodies 86 and 87. The center line may be an imaginary line passing through the center point between two adjacent extension portions (e.g., 7D and 7D, or 7A and 7C).

[0421] In one example, the second extension portion 45B may extend leftward or rightward from the first extension portion 45 A. When viewed from the front, the overall shape of the extension portion 7D may be an L shape ("└") or a "┘" shape that is bilaterally symmetrical to the L shape ("└").

[0422] The length of the extending portion 7D in the transverse direction may be greater than the length of the extending portion 7D in the longitudinal direction. This is to facilitate arrangement or alignment of the terminals in the second horizontal direction.

[0423] Each of the extension portions 7A to 7D may include a plurality of terminals 311 (see Fig.16). In one example, the plurality of terminals 311 may be disposed at the lower portion or lower end of the extension portions 7A to 7D. In one example, the plurality of terminals 311 may be disposed to contact the lower end or lower surface of the extension portions 7A to 7D. In one example, the plurality of terminals 311 may be disposed or arranged to be spaced apart from each other in a second horizontal direction (e.g., the X-axis direction).

[0424] In one example, the extensions 7A to 7D of the support plate 310 may be fixed or coupled to a fixed unit (e.g., the base 210). In one example, when the OIS moving unit moves or shifts, the bodies 86 and 87 of the support plate 310 may move, and the extensions 7A to 7D of the support plate 310 may be fixed so as not to move.

[0425] In one example, the support plate 310 may include a first support plate 310-1 and a second support plate 310-2 that are spaced apart from each other. The first and second support plates 310-1 and 310-2 may be formed to be bilaterally symmetrical to each other. In another embodiment, the first support plate 310-1 and the second support plate 310-2 may be integrated into a single plate. In yet another embodiment, the support plate 310 may include three or more support plates.

[0426] In an example, the first and second support plates 310 - 1 and 310 - 2 may be disposed to surround the four side portions 33A to 33D of the first circuit board 250 .

[0427] In an example, the first support plate 310-1 may include a first body 86 and at least one extending portion 7A or 7B extending from the first body 86. The at least one extending portion 7A or 7B of the first support plate 310-1 may include a plurality of terminals 311.

[0428] The second support plate 310-2 may include a second body 87 and at least one extending portion 7C or 7D extending from the second body 87. The at least one extending portion 7C or 7D of the second support plate 310-2 may include a plurality of terminals 311.

[0429] The first circuit board 250 may include a first side portion 33A and a second side portion 33B positioned opposite to each other, and may include a third side portion 33C and a fourth side portion 33D located between the first side portion 33A and the second side portion 33B and positioned opposite to each other.

[0430] In an example, the first connection portion 320A may connect the first body 86 to the first side 33A of the first circuit board 250. The second connection portion 320B may connect the second body 87 to the second side 33B of the first circuit board 250.

[0431] The first body 86 may include a first portion 6A corresponding to or opposite to the first side portion 33A of the first circuit board 250, a second portion 6B corresponding to a portion (or one side) of the third side portion 33C of the first circuit board 250, and a third portion 6C corresponding to a portion (or one side) of the fourth side portion 33D of the first circuit board 250. In addition, the first body 86 may include a first bent portion 6D connecting one end of the first portion 6A to the second portion 6B and bending from one end of the first portion 6A, and a second bent portion 6E connecting the other end of the first portion 6A to the third portion 6C and bending from the other end of the first portion 6A. For example, the first body 86 may be in a "U" shape.

[0432] In one example, the first support plate 310 - 1 may include an extension portion 7A and an extension portion 7B. In one example, the extension portion 7A may be connected to one side of the first body 86 , and the extension portion 7B may be connected to the other side of the first body 86 .

[0433] In one example, the extension portion 7A may extend or protrude from the second portion 6B of the first body 86 toward the second board unit 800, and the extension portion 7B may extend or protrude from the third portion 6C of the first body 86 toward the second board unit 800. The extension portion 7B may be positioned opposite to the extension portion 7A, with the first board unit 255 (e.g., the first circuit board 250) interposed therebetween.

[0434] In one example, the first connection portion 320A can connect the first portion 6A of the first body 86 to the first side portion 33A of the first circuit board 250. The first connection portion 320A may include a bent portion. In one example, the first connection portion 320A can connect the central area of ​​the first portion 6A of the first body 86 to the central area of ​​the first side portion 33A of the first circuit board 250.

[0435] The second body 87 may include a first portion 9A corresponding to or opposite to the second side portion 33B of the first circuit board 250, a second portion 9B corresponding to or opposite to another portion (or another side) of the third side portion 33C of the first circuit board 250, and a third portion 9C corresponding to or opposite to another portion (or another side) of the fourth side portion 33D of the first circuit board 250. In addition, the second body 87 may include: a first bent portion 9D connecting one end of the first portion 9A to the second portion 9B and bending from the end of the first portion 9A; and a second bent portion 9E connecting the other end of the first portion 9A to the third portion 9C and bending from the other end of the first portion 9A. For example, the second body 87 may be in a "U" shape. In addition, for example, the second body 87 may have a shape symmetrical to the shape of the first body 86 with respect to the optical axis. For example, the second body 87 may be symmetrical to the first body 86 with respect to the optical axis.

[0436] In one example, the second support plate 310 - 2 may include an extension portion 7C and an extension portion 7D. In one example, the extension portion 7C may be connected to one side of the second body 87 , and the extension portion 7D may be connected to the other side of the second body 86 .

[0437] The extension portion 7C may extend or protrude from the second portion 9B of the second body 87 toward the second board unit 800, and the extension portion 7D may extend or protrude from the third portion 9C of the second body 87 toward the second board unit 800. The extension portion 7D may be positioned opposite to the extension portion 7C, with the first board unit 255 (e.g., the first circuit board 250) interposed therebetween.

[0438] In one example, when viewed from the front, the extension portion 7A and the extension portion 7C may be bilaterally symmetrical to each other. In another embodiment, the extension portion 7A and the extension portion 7C may be bilaterally asymmetrical to each other.

[0439] Furthermore, in one example, when viewed from the front, the extension portion 7B and the extension portion 7D may be bilaterally symmetrical to each other. In another embodiment, the extension portion 7B and the extension portion 7D may be asymmetrical to each other.

[0440] In one example, the second connection portion 320B can connect the first portion 9A of the second body 87 to the second side portion 33B of the first circuit board 250. The second connection portion 320B may include a bent portion. In one example, the second connection portion 320B can connect the central area of ​​the first portion 9A of the second body 87 to the central area of ​​the second side portion 33B of the first circuit board 250.

[0441] Reference Fig.16, the terminal unit (e.g., 7A and 7C) of the support plate 310 may be provided with terminals P1 to P4 so as to be conductively connected to the terminals B1 to B4 of the terminal unit 95 of the circuit board 190 of the AF drive unit 100. The terminals B1 to B4 of the terminal unit 95 of the circuit board 190 and the terminals P1 to P4 of the extension portions 7A and 7C of the support plate 310 may be conductively connected to each other by solder or a conductive adhesive. That is, the circuit board 190 of the AF drive unit 100 may be conductively connected to the second board unit 800 via the support plate 310.

[0442] Reference Fig.16 , the support plate 310 may include a conductive layer 93-1. In addition, the support plate 310 may include a first insulating layer 94-1 disposed on one surface (or first surface) or one side of the conductive layer 93-1. In addition, the support plate 310 may include a second insulating layer 94-2 disposed on another surface (or second surface) or another side of the conductive layer 93-1. In another embodiment, the support plate 310 may include at least one of the first insulating layer 94-1 or the second insulating layer 94-2. The support plate 310 may include a protective layer 96 disposed on the first insulating layer 94-1. For example, the protective layer 96 may be an EMI member (e.g., a piece of EMI tape). Alternatively, the protective layer 96 may be a heat dissipation member, such as graphite. Alternatively, for example, the protective layer 96 may be an elastic material. Alternatively, for example, the protective layer 96 may be a conductive member. Alternatively, for example, the protective layer 96 may be an insulating member.

[0443] Fig.17a is a first perspective view of a support plate 310 coupled to a bracket 270 and a base 210; Fig.17b is a second perspective view of the support plate 310 coupled to the bracket 270 and the base 210 .

[0444] Reference Fig.17a and Fig.17b The bracket 270 may include first to fourth side portions 64A to 64D corresponding to or opposite to the first to fourth side portions 33A to 33D of the first circuit board 250 (refer to Fig.18a ).

[0445] The first and second side portions 64A and 64B of the bracket 270 may be opposite to each other, or may be arranged opposite to each other in a second horizontal direction (e.g., X-axis direction). In addition, the third and fourth side portions 64C and 64D of the bracket 270 may be opposite to each other, or may be arranged opposite to each other in a first horizontal direction (e.g., Y-axis direction).

[0446] At least a portion of the support plate 310 may be attached or coupled to the bracket 270. In one example, at least one connection portion 320A or 320B of the support plate 310 may be coupled to at least one of the first to fourth side portions 64A to 54D of the bracket 270 by an adhesive. In one example, the first connection portion 320A may be coupled, attached or fixed to the first side portion 64A of the bracket 270 by an adhesive, and the second connection portion 320B may be coupled, attached or fixed to the second side portion 64B of the bracket 270.

[0447] The bracket 270 may be provided with a first protrusion 27A on the first side portion 64A thereof, and may be provided with a second protrusion 27B on the second side portion 64B thereof.

[0448] The support plate 310 may be coupled, attached, or fixed to the protrusions 27A and 27B of the bracket 270. The support plate 310 may be coupled, attached, or fixed to the outer side surfaces (or inner side surfaces) of the protrusions 27A and 27B of the bracket 270.

[0449] In an example, a portion of the support plate 310 may be coupled, attached or fixed to the first and second protrusions 27A and 27B of the bracket 270. The bodies 86 and 87 of the support plate 310 may be coupled, attached or fixed to the first and second protrusions 27A and 27B of the bracket 270.

[0450] In one example, the first support plate 310-1 can be coupled, attached or fixed to the first protrusion 27A, and the second support plate 310-2 can be coupled, attached or fixed to the second protrusion 27B. In one example, the first portion 6A of the first body 86 can be coupled, attached or fixed to the outer surface (or inner surface) of the first protrusion 27A, and the first portion 9A of the second body 87 can be coupled, attached or fixed to the outer surface (or inner surface) of the second protrusion 27B.

[0451] The base 210 may include first to fourth side portions 65A to 65D corresponding to or opposite to the first to fourth side portions 33A to 33D of the first circuit board 250 (see Fig.14 ). In addition, the first to fourth side portions 65A to 65D of the base 210 may correspond to or be opposite to the first to fourth side portions 64A to 64D of the bracket 270.

[0452] The first and second side portions 65A and 65B of the base 210 may be opposite to each other, or may be arranged opposite to each other in a first horizontal direction (e.g., Y-axis direction). In addition, the third and fourth side portions 65C and 65D of the base 210 may be opposite to each other, or may be arranged opposite to each other in a second horizontal direction (e.g., X-axis direction).

[0453] At least a portion of the support plate 310 may be coupled, attached, or fixed to the base 210. In an example, the bodies 86 and 87 of the support plate 310 may be coupled to the base 210 by an adhesive. In an example, the extensions 7A to 7D of the support plate 310 may be coupled, attached, or fixed to the protrusions 216A and 216B of the base 210. In addition, in an example, the portions of the bodies 86 and 87 of the support plate 310 connected to the extensions 7A to 7D may be coupled to the base 210.

[0454] The base 210 may include receiving portions 46A and 46B to couple or attach to at least a portion of the support plate 310. The receiving portions 46A and 46B may be formed in a groove shape. The receiving portions 46A and 46B may be grooves recessed in the outer side surface of the side of the base 210.

[0455] In one example, the base 210 may include a first groove 46A formed in the third side 65C thereof to allow the extensions 7A and 7C to be disposed therein and coupled thereto. In one example, the base 210 may include a second groove 46B formed in the fourth side 65D thereof to allow the extensions 7B and 7D to be disposed therein and coupled thereto. The grooves 46A and 46B may be recessed in the outer side surfaces of the sides 65C and 65D of the base 210.

[0456] In one example, the depth of the grooves 46A and 46B in the base 210 may be greater than or equal to the thickness of the extensions 7A to 7D of the support plate 310. This is to prevent the extensions 7A to 7D from protruding out of the grooves 46A and 46B and prevent spatial interference between the extensions 7A to 7D and the side plate 302 of the cover member 300. This is because spatial interference between the extensions 7A to 7D and the side plate 302 of the cover member 300 may restrict movement of the OIS moving unit.

[0457] In one example, the outer surface of the protrusion 216A may be disposed closer to the optical axis OA than the outer surface of the third side 65C of the base 210. In addition, in one example, the outer surface of the protrusion 216B may be disposed closer to the optical axis OA than the outer surface of the fourth side 65D of the base 210.

[0458] In one example, the outer side surface of the protrusion 216A (or 216B) may be located further inward than the outer side surface of the third side portion 65C (or the fourth side portion 65D) of the base 210. In one example, there may be a step in the first horizontal direction (e.g., the Y-axis direction) between the outer side surface of the protrusion 216A (or 216B) and the third side portion 65C (or the fourth side portion 65D) of the base 210.

[0459] In one example, the upper sides of the grooves 46A and 46B in the base 210 may be open to the upper surface of the base 210. Also, in one example, the lower sides of the grooves 46A and 46B in the base 210 may be open to the lower surface of the base 210.

[0460] In one example, at least a portion of the support plate 310 may be coupled, attached, or fixed to the protrusions 216A and 216B formed on the base 210. In one example, the support plate 310 may be coupled, attached, or fixed to the outer side surface (or inner side surface) of the protrusions 216A and 216B of the base 210. The first protrusion 216A may be formed on the third side 65C of the base 210, and the second protrusion 216B may be formed on the fourth side 65D of the base 210.

[0461] In an example, the bodies 86 and 87 of the support plate 310 may be coupled, attached, or fixed to the first and second protrusions 216A and 216B of the base 210 .

[0462] In one example, one end of the first support plate 310-1 (e.g., the second portion 6B) can be connected, attached or fixed to an area of ​​the first protrusion 216A of the base 210, and the other end of the first support plate 310-1 (e.g., the third portion 6C) can be connected, attached or fixed to an area of ​​the second protrusion 216B of the base 210.

[0463] In one example, one end of the second support plate 310-2 (e.g., the second portion 9B) can be connected, attached or fixed to another area of ​​the first protrusion 216A of the base 210, and the other end of the second support plate 310-2 (e.g., the third portion 9C) can be connected, attached or fixed to another area of ​​the second protrusion 216B of the base 210.

[0464] The first coupling region 69A may be formed between the first body 86 of the first support plate 310 - 1 and the first protrusion 27A of the bracket 270 , and the second coupling region 69B may be formed between the second body 87 of the second support plate 310 - 2 and the second protrusion 27B of the bracket 270 .

[0465] In addition, a third coupling region 59A may be formed between one end of each of the first and second support plates 310-1 and 310-2 and the first protrusion 216A of the base 210. A fourth coupling region 59B may be formed between the other end of each of the first and second support plates 310-1 and 310-2 and the second protrusion 216B of the base 210.

[0466] The OIS moving unit may be elastically supported by the support plate 310 and the first to fourth coupling regions 69A, 69B, 59A, and 59B relative to the fixed unit. The terminal 311 of the support plate 310 may be soldered to the fixed unit by solder 902 (refer to FIG. Fig.17a and 17B) or a conductive adhesive and conductively connected to the terminal 800B of the second board unit 800.

[0467] In another embodiment, the support member may be an elastic member that does not include a base, such as a spring, a wire, a shape memory alloy, or a ball member. In one example, when the support member is a wire, a plurality of wires may be disposed on at least one of the corners or sides of the base 210 or the second board unit 800, and the first board unit 255 (e.g., the second circuit board 260) and the second board unit 800 (or the base 210) may be interconnected. In one example, one end of each of the plurality of wires may be coupled to the first board unit 255 (e.g., the second circuit board 260), and the other end of each of the plurality of wires may be coupled to the second board unit 800 (or the base 210).

[0468] The image sensor unit 350 may include at least one of the controller 830 , the memory 512 , or the capacitor 514 .

[0469] The controller 830 may be disposed to be spaced apart from the first board unit 255. In an example, the controller 830 may be disposed on the second board unit 800.

[0470] The memory 512 may be disposed on any one of the first board unit 255 and the second board unit 800. In one example, the memory 512 may be disposed or installed in the first region 801 of the second board unit 800. In one example, the memory 512 may spatially avoid the heat dissipation member 380 or be separated from the heat dissipation member 380. In one example, the heat dissipation member 380 may include an avoidance groove or hole formed therein to avoid spatial interference with the memory 512, and the memory 512 may be disposed in the avoidance groove or hole in the heat dissipation member 380. The capacitor 514 may be disposed on at least one of the first board unit 255 or the second board unit 800.

[0471] The memory 512 may store a first data value (or code value) corresponding to the output from the second position sensor 240 according to the displacement (or stroke) of the OIS moving unit in a direction perpendicular to the optical axis (e.g., the X-axis direction or the Y-axis direction) so as to implement OIS feedback driving. In addition, the memory 512 may store a second data value (or code value) corresponding to the output from the first position sensor 170 according to the displacement (or stroke) of the winding frame 110 in the first direction (e.g., the optical axis direction or the Z-axis direction) so as to implement AF feedback driving.

[0472] In one example, the first and second data values ​​may be stored in the memory 512 in the form of a lookup table. Alternatively, the first and second data values ​​may be stored in the memory 512 in the form of an equation or algorithm. In addition, the memory 512 may store equations, algorithms, or programs for the operation of the controller 830. In one example, the memory 512 may be a non-volatile memory, such as an electrically erasable programmable read-only memory (EEPROM).

[0473] The controller 830 may be disposed in a region of the second board unit 800 , which is located outside the cover member 300 or is located outside the cover member 300 .

[0474] Reference Fig.20a , the second board unit 800 may include an extension region 808 connected to and extending from the first region 801. The extension region 808 may extend from the first side portion 85A of the first region 801. In one example, the extension region 808 may protrude from the outer side surface of the first side portion 85A of the first region. In one example, the extension region 808 may extend or protrude in a second horizontal direction (e.g., the X-axis direction).

[0475] The extended area 808 may be located outside the cover member 300 , or may be located external to the cover member 300 .

[0476] The extended area 808 may be alternatively referred to as a "fourth area", "protruding area", "extended portion", or "protruding portion". The extended area 808 does not overlap with the AF moving unit or the OIS moving unit in the optical axis direction. In an example, the extended area 808 may extend in the same direction as the third area 803 (e.g., a second horizontal direction).

[0477] The controller 830 may be disposed in the extension region 808 of the second board unit 800. In one example, the controller 830 may be disposed or mounted on the upper surface of the extension region 808 of the second board unit 800. In another embodiment, the controller 830 may be disposed or mounted on the lower surface of the extension region 808. In one example, the controller 830 may not overlap with the cover member 300 in the optical axis direction. In addition, in one example, the extension region 808 may not overlap with the cover member 800 in the optical axis direction. In one example, the area of ​​the upper surface of the extension region 808 may be greater than or equal to the area of ​​the lower surface of the controller 830.

[0478] Since the extension region 808 and the third region 803 are connected to the first side portion 85A of the second board unit 800, the area occupied by the camera device 10 in the direction perpendicular to the optical axis can be reduced. Therefore, this embodiment can minimize the increase in the size of the camera device 10 caused by the extension region 808.

[0479] In another embodiment, the extension region may be connected to any one of the second to fourth side portions 85B, 85C and 85D of the first region 801 of the second board unit 800 or may protrude from any one of the second to fourth side portions 85B, 85C and 85D of the first region 801 .

[0480] The controller 830 may be located outside the cover member 300 or may be located outside the cover member 300. In an example, the controller 830 may be located outside a space defined by the cover member 300, the base 210, and the first region 801 of the second board unit 800.

[0481] In one example, the controller 830 does not overlap the lens module 400 , the AF moving unit, the OIS moving unit, or the first region 801 of the second panel unit 255 in the optical axis direction. At least one capacitor 514 may be disposed or mounted on an upper surface of the extension region 808 .

[0482] In a sensor-shift camera device in which an image sensor moves to achieve hand-shake compensation, an OIS moving unit including an image sensor and a first board unit is disposed to be separated from a fixed unit including a second board unit. Therefore, heat generated from the OIS moving unit may not be effectively dissipated to the outside through the fixed unit. In addition, the sensor-shift camera device may be configured such that the AF drive unit and the OIS drive unit are surrounded by a cover member to prevent defects due to foreign matter, so that heat may not be easily dissipated to the outside of the camera device.

[0483] The image sensor, the second coil, and the controller may correspond to a heat source. The “controller” may be a driver IC that controls AF driving and / or OIS driving.

[0484] The camera device 10 may include a heat dissipation member 870, which is disposed on, coupled to, or attached to the extension area 808 to improve the heat dissipation effect. The heat dissipation member 870 may be in contact with the extension area 808. In one example, the heat dissipation member 870 may be disposed below the extension area 808. In one example, the heat dissipation member 870 may be disposed on, coupled to, or fixed to the lower surface of the extension area 808. The heat dissipation member 870 may be a plate-type member, and the description of the material of the heat dissipation member 280 may be equally or similarly applied to the heat dissipation member 870. At least a portion of the heat dissipation member 870 may overlap with the controller 830 in the optical axis direction.

[0485] The camera device 10 may include a cover 405 disposed in the extension region 808 and accommodating the controller 830 therein to protect the controller 830 from external impact. The cover 405 may include an upper plate 405A and a side plate 405B connected to the upper plate 405A and extending from the upper plate 405A toward the extension region 808.

[0486] The cover 405 may be disposed on, coupled to, or fixed to the upper surface of the extension region 808. In one example, the lower portion, lower end, or lower surface of the side plate 405B of the cover 405 may be coupled, attached, or fixed to the upper surface of the extension region 808.

[0487] Since cover 405 accommodates controller 830 therein, cover 405 can prevent heat generated by controller 830 from being dissipated to the outside of cover 405 and transferred to the image sensor. The description of the material of heat dissipation member 280 or the material of cover member 300 may be equally or similarly applied to cover 405.

[0488] The camera device 10 may further include a heat dissipation layer 860 disposed on the controller 830. The heat dissipation layer 860 may cover the surface of the controller 830. In one example, the heat dissipation layer 860 may be disposed to surround the surface of the controller 830. In one example, the heat dissipation layer 860 may contact the upper surface and the side surface of the controller 830 and may surround the upper surface and the side surface. The heat dissipation layer 860 may be formed of heat dissipation plastic or heat dissipation resin (e.g., heat dissipation epoxy resin). The heat dissipation layer 860 may improve the heat dissipation efficiency and heat dissipation performance of the controller 830.

[0489] In another embodiment, the heat dissipation layer may be disposed on at least one of the upper surface or the side surface of the controller 830. In an example, the heat dissipation layer may expose at least a portion of the controller 830.

[0490] The controller 830 may be conductively connected to the second position sensor 240. The controller 830 may adjust or control the drive signal provided to the second coil 230 using the output signals received from the sensors 240A, 240B, and 240C of the second position sensor 240 and the first data value stored in the memory 512, and may perform a feedback OIS operation.

[0491] In addition, the controller 830 may be conductively connected to the first position sensor 170. For example, when the first position sensor 170 is implemented by only a Hall sensor, the first position sensor 170 may be conductively connected to the controller 830. In this case, the controller 830 may control the drive signal provided to the first coil 120 using the output signal from the first position sensor 170 and the second data value stored in the memory 512, and may perform a feedback auto focus operation.

[0492] The controller 830 may be implemented in the form of a driver IC, but the present disclosure is not limited thereto. In an example, the controller 830 may be conductively connected to the terminal 800B of the second board unit 800 .

[0493] The controller 830 may control the first position sensor and / or the second position sensor, the first position sensor being implemented only by a Hall sensor, and the second position sensor being implemented only by a Hall sensor. In one example, the controller 830 may provide a drive signal to the first position sensor implemented only by a Hall sensor and / or the second position sensor implemented only by a Hall sensor, and may receive an output signal from the first position sensor and / or an output signal from the second position sensor.

[0494] In another embodiment, the first position sensor may be implemented only by a Hall sensor, and the second position sensor may be implemented in the form of a driver IC including a Hall sensor. In this case, the controller 830 may be conductively connected to the first position sensor, may provide a drive signal to the first position sensor, and may receive an output signal from the first position sensor.

[0495] In an example, the controller 830 may include a driver for driving at least one of the first position sensor or the second position sensor.

[0496] The image sensor unit 350 may further include a motion sensor (not shown) disposed on any one of the first board unit 255 and the second board unit 800. The motion sensor may be conductively connected to the controller 830. The motion sensor may output rotational angular velocity information about the movement of the camera device 10. The motion sensor may be implemented by, for example, a two-axis or three-axis gyro sensor or an angular velocity sensor. In one example, in response to the movement of the camera device 10, the motion sensor may output information on the amount of movement in the x-axis direction, the amount of movement in the y-axis direction, and the amount of rotation.

[0497] In another embodiment, the motion sensor may be omitted in the camera device 10. In the case where the motion sensor is omitted in the camera device, the camera device 10 may receive position information from the motion sensor provided in the optical instrument 200A in response to the movement of the camera device 10.

[0498] The image sensor unit 350 may further include an optical filter 610 disposed between the lens module 400 and the image sensor 810. In addition, the image sensor unit 350 may further include an optical filter holder 600 in which the optical filter is disposed, placed or accommodated. The optical filter holder 600 may alternatively be referred to as a “sensor base”.

[0499] The filter 610 can be used to block or allow light in a specific frequency band of the light passing through the lens barrel 400 to enter the image sensor 810. The filter 610 can be, for example, an infrared cutoff filter. In an example, the filter 610 can be arranged parallel to the xy plane, and the xy plane is perpendicular to the optical axis OA. The filter 610 can be arranged below the lens module 400.

[0500] The filter holder 600 may be disposed below the AF driving unit 100. In one example, the filter holder 600 may be disposed on the first board unit 255. In one example, the filter holder 600 may be disposed on an upper surface of the second circuit board 260 of the first board unit 255.

[0501] The filter holder 600 may be coupled to a region of the second circuit board 260 around the image sensor 810 by an adhesive, and may be exposed through the hole 250A in the first circuit board 250. In an example, the hole 250A in the first circuit board 250 may expose the filter holder 600 disposed on the second circuit board 260 and the filter 610 disposed on the filter holder 600. The filter holder 600 may include a hole 61A formed in a portion thereof, on which the filter 610 is mounted or disposed, to allow light passing through the filter 610 to be introduced into the image sensor 810. The hole 61A in the filter holder 600 may be a through hole formed through the filter holder 600 in the optical axis direction. In an example, the hole 61A in the filter holder 600 may be formed through the center of the filter holder 600, and may be disposed to correspond to or face the image sensor 810.

[0502] The filter holder 600 may include a mount portion 500 that is recessed on its upper surface to allow the filter 610 to be located therein, and the filter 610 may be disposed, placed or installed in the mount portion 500. The mount portion 500 may be formed to surround the hole 61A. In another embodiment, the mount portion of the filter holder may take the form of a protrusion that protrudes from the upper surface of the filter.

[0503] The image sensor unit 350 may further include an adhesive disposed between the optical filter 610 and the mount portion 500 , and the optical filter 610 may be coupled or attached to the optical filter holder 600 by the adhesive.

[0504] In another embodiment, the filter holder may be coupled to the holder 270 or may be coupled to the AF driving unit 100 .

[0505] Reference Figure 3 , the cover member 300 may take a box-like form with an open lower portion, and include an upper plate 301 and a side plate 302. The lower portion of the side plate 302 of the cover member 300 may be coupled to the base 210. The shape of the upper plate 301 of the cover member 300 may be polygonal, such as a quadrilateral or an octagon. In one example, the side plate 302 may include four side plates 302A to 302D connected to each other. The cover member 300 may include a hole 303 formed in its upper plate 301 to expose the lens of the lens module 400 coupled to the winding frame 110 to external light.

[0506] Reference Figure 1 and Figure 3 , the side plate 302 of the cover member 300 may have a groove portion 304 formed therein to expose the terminals 95 of the circuit board 190 and the terminals 800B of the second board unit corresponding thereto.

[0507] In one example, the cover member 300 may be formed of a metal material. For example, the cover member 300 may be formed of stainless steel (SUS) (e.g., a material based on SUS-4). In addition, the cover member 300 may be formed of a common cold-rolled steel sheet (SPC). For example, the cover member 300 may be formed of SUS containing 50% or more of an iron (Fe) component. In addition, in one example, an anti-oxidation metal (e.g., nickel) may be plated on the surface of the cover member 300 to prevent oxidation. In addition, in another embodiment, the cover member 300 may be formed of a magnetic material or a magnetic metal material.

[0508] In yet another embodiment, the cover member 300 may be formed of an injection molding material such as plastic or resin. In addition, the cover member 300 may be made of an insulating material or a material capable of blocking electromagnetic waves.

[0509] The cover member 300 and the base 210 may accommodate the AF driving unit 100 and the OIS moving unit, may protect the AF driving unit 100 and the OIS moving unit from external impact, and may prevent external foreign substances from entering therein.

[0510] In one example, at the initial position of the OIS moving unit, the outer surface of the bracket 270 may be spaced a predetermined distance from the inner surface of the base 210. In addition, in one example, at the initial position of the OIS moving unit, the lower surface of the bracket 270 and the first plate unit 255 may be spaced a predetermined distance from the base 210.

[0511] The controller 830 may provide at least one driving signal to at least one of the first to fourth coil units 230-1 to 230-4, and may control the at least one driving signal to move the OIS mobile unit in the X-axis direction and / or the Y-axis direction, or to rotate, tilt or roll the OIS mobile unit within a predetermined angle range around the optical axis.

[0512] Fig.21 is a block diagram showing the configuration of the controller 830 and the first to third sensors 240A, 240B, and 240C. The controller 830 can use the clock signal SCL and the data signal SDA to perform communication such as I2C communication to transmit and receive data to and from the host. In an example, the host may be the controller 780 of the optical instrument 200A.

[0513] The controller 830 may be conductively connected to the second coil 230. The controller 830 may include a driving unit 510 for providing a driving signal required to drive the first to fourth coil units 230-1 to 230-4. In one example, the driving unit 510 may include an H-bridge circuit or an H-bridge driver capable of changing the polarity of the driving signal. In this case, in order to reduce current consumption, the driving signal may be a PWM signal, and the driving frequency of the PWM signal may be 20kHz or higher, which is beyond the audible frequency range. In another embodiment, the driving signal may be a DC signal.

[0514] The first to third sensors 240A to 240C may each include two input terminals and two output terminals. The controller 830 may provide power or a drive signal to the two input terminals of each of the first to third sensors 240A to 240C. In one example, any one of the two input terminals of each of the first to third sensors 240A to 240C may be connected in common. In one example, the two input terminals may be a (+) input terminal and a (-) input terminal (e.g., a ground terminal).

[0515] In one example, the controller 830 may receive a first output voltage from the first sensor 240A, a second output voltage from the second sensor 240B, and a third output voltage from the third sensor 240C, and may use the received first to third output voltages to control the movement (or displacement) of the OIS mobile unit in the X-axis direction or the Y-axis direction. In addition, the controller 830 may use the received first to third output voltages to control the rotation, tilt, or roll of the OIS mobile unit around the optical axis.

[0516] In addition, the controller 830 may include an analog-to-digital converter 530 that receives output voltages from two output terminals of each of the first to third sensors 240A to 240C and outputs a data value, a digital value, or a code value corresponding to the analog-to-digital conversion result of the received output voltage. The controller 830 may use the data value output from the analog-to-digital converter 530 to control the movement (or displacement) of the OIS moving unit in the X-axis direction or the Y-axis direction and the rotation, tilt, or roll of the OIS moving unit around the optical axis.

[0517] The temperature sensor 540 may measure the ambient temperature (eg, the temperature of each of the first to third sensors 240A, 240B, and 240C), and may output a temperature detection signal Ts corresponding to the measurement result. The temperature sensor 540 may be, for example, a thermistor.

[0518] The resistance value of the resistor included in the temperature sensor 540 changes with the change of the ambient temperature, and therefore, the value of the temperature detection signal Ts may change according to the change of the ambient temperature. An equation or a lookup table related to the relationship between the ambient temperature and the temperature detection signal Ts may be stored in the memory or the controller 830 or 780 through calibration.

[0519] Since the output values ​​from the first to third sensors 240A, 240B, and 240C are also affected by temperature, it is necessary to compensate the output values ​​from the first to third sensors 240A, 240B, and 240C according to the ambient temperature in order to accurately and reliably implement OIS feedback driving.

[0520] To this end, in one example, the controller 830 or 780 may compensate the output values ​​(or data values ​​corresponding to the outputs) from each of the first to third sensors 240A, 240B, and 240C using the ambient temperature measured by the temperature sensor 540 and a temperature compensation algorithm or compensation equation. The temperature compensation algorithm or compensation equation may be stored in the controller 830 or 780 or a memory.

[0521] The camera device may further include a fourth sensor 240D, which corresponds to or is opposite to the fourth magnet unit 130-4 in the optical axis direction. The fourth sensor 240D may be disposed on the first board unit 255 (e.g., the first circuit board 250). In an example, the fourth sensor 240D may be disposed adjacent to any one corner of the first circuit board 250, on which the first to third sensors 240A to 240C are not disposed. The description of the positional relationship between the first sensor 240A and the first coil unit 230-1 may be equally or similarly applied to the positional relationship between the fourth sensor 240D and the fourth coil unit 230-4.

[0522] In one example, the fourth sensor 240D may be positioned opposite to the second sensor 240B in a diagonal direction. In one example, the output voltage from the fourth sensor 240D may be used to detect movement of the OIS moving unit in the X-axis direction or the Y-axis direction.

[0523] In another embodiment, the fourth sensor 240D may correspond to the first position sensor 170 of the AF driving unit 100 .

[0524] The controller 830 may be conductively connected to at least one of the first position sensor 170 , the second coil 230 , or the second position sensor 240 via the second board unit 800 , the support board 310 , and the first board unit 255 .

[0525] In another embodiment, the controller 830 may be disposed on the first board unit 255. In another embodiment, the controller 830 may be disposed on the first circuit board 250.

[0526] Fig. 22 is a plan view of the bracket 270, the base 210 and the cover member 300; Fig.23a yes Fig. 22 An enlarged view of the first dotted line portion 11A in FIG. Figure 23b yes Fig. 22 An enlarged view of the second dotted line portion 11B in FIG. Fig.24 is a cross-sectional view of the image sensor unit 350 and the cover member 300 in a direction perpendicular to the optical axis.

[0527] Reference Figure 22 to Figure 24 The bracket 270 may include grooves 91-1 and 91-2 or recessed portions that correspond to, are opposite to, or overlap the receiving portions 46A and 46B of the base 210. The grooves 91-1 and 91-2 may be recessed in the outer side surfaces of the side portions 57C and 57D of the bracket 270.

[0528] In an example, the bracket 270 may include a first groove 91 - 1 recessed in the third side portion 57C and a second groove 91 - 2 recessed in the fourth side portion.

[0529] Reference Fig.12a In one example, the first groove 91-1 may include a bottom surface 91A and a side surface 91B, the bottom surface 91A and the outer surface of the third side portion 57C of the bracket 270 have a step, and the side surface 91B is disposed between the bottom surface 91A and the outer surface of the third side portion 57C. In one example, the bottom surface 91A may be closer to the optical axis OA than the outer surface of the third side portion 57C. In one example, the second groove 91-2 may include a bottom surface 91C and a side surface 91D, the bottom surface 91C and the outer surface of the fourth side portion 57D of the bracket 270 have a step, and the side surface 91D is disposed between the bottom surface 91C and the outer surface of the fourth side portion 57D. In one example, the bottom surface 91C may be closer to the optical axis OA than the outer surface of the fourth side portion 57D.

[0530] In one example, the distance between the bottom surface 91A or 91C of the bracket 270 and the outer side surface of the side portion 57C or 57D of the bracket 270 may be greater than or equal to the distance between the bottom surface of the groove 46A or 46B in the base 210 and the outer side surface of the base 210. In another embodiment, the former may be smaller than the latter.

[0531] In one example, the first groove 91-1 in the bracket 270 may correspond to, be opposite to, or overlap with the first groove 46A in the base 210, and the second groove 91-2 in the bracket 270 may correspond to, be opposite to, or overlap with the second groove 46B in the base 210. The reason for forming the first and second grooves 91-1 and 91-2 in the bracket 270 is to avoid spatial interference with the first and second grooves 46A and 46B in the base 210 and to ensure that space is provided for the movement of the OIS moving unit in a direction perpendicular to the optical axis or the rolling of the moving unit according to the OIS drive.

[0532] In one example, the length L21 of the bracket 270 in the second horizontal direction (e.g., the X-axis direction) may be greater than the length L22 of the bracket 270 in the first horizontal direction (e.g., the Y-axis direction). For example, L21 may be the distance from the outer surface of the first side portion 57A of the bracket 270 to the outer surface of the second side portion 57B, and L22 may be the distance from the outer surface of the third side portion 57C of the bracket 270 to the outer surface of the fourth side portion 57D.

[0533] In another embodiment, L21 and L22 may be equal to each other. In addition, the length of the image sensor 810 in the second horizontal direction (e.g., the X-axis direction) may be greater than the length of the image sensor 810 in the first horizontal direction (e.g., the Y-axis direction). In another embodiment, the length of the image sensor 810 in the second horizontal direction (e.g., the X-axis direction) may be equal to or less than the length of the image sensor 810 in the first horizontal direction (e.g., the Y-axis direction).

[0534] The bracket 260 may include a stopper (or protrusion) 55 protruding in a direction perpendicular to the optical axis. In another embodiment, the stopper 55 may be alternatively referred to as a "protrusion" or a "protrusion".

[0535] In one example, the stopper 55 may protrude from the outer side surface of the bracket 260. In one example, the stopper 55 may protrude from the side portions 57A to 57D of the bracket 260. In one example, the stopper 55 may protrude from the outer side surface of the side portions 57A to 57D of the bracket 260. In one example, the bracket 260 may include stoppers 55A and 55B protruding toward the side plate 302 of the cover member 300. In one example, the stoppers 55A and 55B may protrude toward the inner side surface of the side plate 302 of the cover member 300. In one example, the bracket 270 may include stoppers 55C and 55D protruding toward the protrusions 216A and 216B of the base 210. In one example, the stoppers 55C and 55D may protrude toward the inner side surface of the protrusions 216A and 216B of the base 210. The bracket 270 may include at least one of the stoppers 55A to 55D.

[0536] In one example, the stopper 55 may include a first stopper 55A protruding from the first side portion 57A of the bracket 270. In one example, the first stopper 55A may protrude from the second side portion 57B of the bracket 270 toward the first side portion 57A.

[0537] In one example, the stopper 55 may include a second stopper 55B protruding from the second side 57B of the bracket 270. In one example, the second stopper 55B may protrude from the first side 57A toward the second side 57B of the bracket 270. The first stopper 55A and the second stopper 55B may protrude or extend in opposite directions.

[0538] In one example, the first stopper 55A may be disposed adjacent to the first protrusion 27A of the bracket 270, and the second stopper 55B may be disposed adjacent to the second protrusion 27B of the bracket 270. In one example, the first stopper 55A may be disposed below the first protrusion 27A of the bracket 270. In one example, the second stopper 55B may be disposed below the second protrusion 27B of the bracket 270.

[0539] In an example, the stoppers 55A to 55D may be disposed closer to the center or central area of ​​the side portions 57A to 57D of the bracket 270 than the corner portions CR1 to CR4 of the bracket 270 .

[0540] In one example, the first stopper 55A may be disposed at a position corresponding to, opposite to, or overlapping with the center or center area of ​​the first side portion 57A of the bracket 270. In one example, the first stopper 55A may be disposed at a position corresponding to, opposite to, or overlapping with the center or center area of ​​the first protrusion 27A of the bracket 270.

[0541] In one example, the second stopper 55B may be disposed at a position corresponding to, opposite to, or overlapping with the center or center area of ​​the second side portion 57B of the bracket 270. In one example, the second stopper 55B may be disposed at a position corresponding to, opposite to, or overlapping with the center or center area of ​​the second protrusion 27B of the bracket 270.

[0542] In one example, assuming that the center of the first side portion 57A (or the second side portion 57B) of the bracket 270 is a point corresponding to 50% of the total length of the first side portion 57A (or the second side portion 57B), the first stopper 55A (or the second stopper 55B) may be disposed in an area between points corresponding to 10% and 90% of the total length of the first side portion 57A (or the second side portion 57B). Alternatively, in one example, the first stopper 55A (or the second stopper 55B) may be disposed in an area between points corresponding to 25% and 75% of the length of the first side portion 57A (or the second side portion 57B) of the bracket 27. Alternatively, in one example, the first stopper 55A (or the second stopper 55B) may be disposed in an area between points corresponding to 35% and 65% of the length of the first side portion 57A (or the second side portion 57B) of the bracket 27.

[0543] In another embodiment, a portion corresponding to 50% or more of the total length D11 of the first stop 55A (or the second stop 55B) may be provided with an area between points corresponding to 35% and 65% of the first side 57A (or the second side 57B) of the bracket 27.

[0544] The first stopper 55A and the second stopper 55B are both Fig.12a and Fig. 22310 is shown as being implemented by a single stopper. However, in another embodiment, the first stopper and the second stopper may each include a plurality of stoppers spaced apart from each other. In another embodiment, the support plate 310 may include a plurality of holes or through-holes formed therein so as to correspond to the plurality of stoppers, and the plurality of holes may be formed in the connecting portion 320 of the support plate 310. The plurality of stoppers may each pass through a corresponding one of the plurality of holes in the support plate 310 and may protrude from the support plate 310.

[0545] Reference Fig. 22 , the first stopper 55A may protrude toward the first side plate 302A of the cover member 300, and the second stopper 55B may protrude toward the second side plate 302B of the cover member 300. At the initial position of the OIS moving unit, the stoppers 55A and 55B may be spaced apart from the side plates 302A and 302B of the cover member 300. The reason for this is that the OIS operation is performed by moving the OIS moving unit.

[0546] Reference Fig.17a and Fig.17b , at least a portion of each of the stoppers 55A and 55B may penetrate at least a portion of the support plate 310. In one example, the stoppers 55A and 55B may protrude relative to the support plate 310 in a direction perpendicular to the optical axis OA. In one example, the stoppers 55A and 55B may penetrate at least a portion of the connection portion 320 of the support plate 310. In one example, the connection portion 320 of the support plate 310 may include an opening 320-1 formed therein to allow at least a portion of each of the stoppers 55A and 55B to pass therethrough. For example, the opening 320-1 may be a hole, a hole, or a through hole.

[0547] Because the opening 320-1 in the connection portion 320 of the support plate 310 is coupled to the stoppers 55A and 55B of the bracket 270, the stoppers 55A and 55B may serve as guides for coupling between the support plate 310 and the bracket 270. In another embodiment, the stoppers 55A and 55B may alternatively be referred to as "protrusions" or "guide protrusions."

[0548] In an example, the distal ends or front ends of the stoppers 55A and 55B may be closer to the side plate 302 of the cover member 300 than the support plate 310 (or the bracket 270 ).

[0549] Reference Fig.23a In one example, the distance d2 between the stoppers 55A and 55B and the side plate 302A of the cover member 300 may be smaller than the distance d1 (d2) between the support plate 310 (or the bracket (270)) and the side plate 302A of the cover member 300. <d3)。

[0550] For example, d2 may be the shortest distance between the stoppers 55A and 55B and the side plate 302A of the cover member 300. For example, d3 may be the shortest distance between the support plate 310 (or the bracket 270) and the side plate 302A of the cover member 300.

[0551] In one example, the protruding length d1 of the stoppers 55A and 55B protruding from the outer side surfaces of the side portions 57A to 57D of the bracket 270 may be greater than the distance d2 (d1>d2) between the stoppers 55A and 55B and the side plate 302A of the cover member 300. Because d1 is greater than d2, the stoppers 55A and 55B may stably protect the bracket 270 from external impact.

[0552] In addition, in one example, the protruding length of the stoppers 55A and 55B relative to the bodies 86 and 87 of the support plate 310 may be greater than d2. In another embodiment, the protruding length of the stoppers 55A and 55B may be equal to or less than the distance d2 between the stoppers 55A and 55B and the side plate 302A of the cover member 300.

[0553] In one example, the distance d2 between the stoppers 55A and 55B and the side plate 302A of the cover member 300 may be smaller than the distance d3 (d2 <d3)。

[0554] For example, d2 may be the distance between each end of the stoppers 55A and 55B and the inner side surface of the side plate 302A of the cover member 300 .

[0555] For example, d3 may be the distance between the side portions 57A to 57D of the bracket 270 (or the outer side surfaces of the side portions 57A to 57D) and the side plate 302 of the cover member 300 (or the inner side surface of the side plate 302). For example, d3 may be the distance between the corner portions CR1 to CR4 of the bracket 270 (or the outer side surfaces of the corner portions CR1 to CR4) and the side plate 302 of the cover member 300 (or the inner side surface of the side plate 302). For example, d3 may mean the shortest distance.

[0556] In one example, the distance between the side portions 57A to 57D of the bracket 270 (or the outer side surfaces of the side portions 57A to 57D) and the side plate 302 of the cover member 300 (or the inner side surface of the side plate 302) and the distance between the corner portions CR1 to CR4 of the bracket 270 (or the outer side surfaces of the corner portions CR1 to CR4) and the side plate 302 of the cover member 300 (or the inner side surface of the side plate 302) may be equal to each other. In another embodiment, the former may be smaller than the latter. In yet another embodiment, the former may be larger than the latter.

[0557] The lengths D11 of the stoppers 55A and 55B in the first horizontal direction (e.g., the Y-axis direction) or in a direction parallel to the outer surfaces of the side portions 57A and 57B may be less than the length D12 of the protrusions 27A and 27B of the bracket 270 in the first horizontal direction (e.g., the Y-axis direction) or in a direction parallel to the outer surfaces of the side portions 57A and 57B (D11 < D12). In another embodiment, D11 may be equal to D12.

[0558] D11 may be 10% to 50% of the length L22 of the bracket 270 in the first horizontal direction (e.g., the Y-axis direction) or in a direction parallel to the outer surfaces of the side portions 57A and 57B. In another embodiment, D11 may be 10% to 30% of L22. In yet another embodiment, D11 may be 13% to 20% of L22. If D11 is less than 10% of L22, the stoppers 55A and 55B cannot stably protect the bracket 270 from external impacts, whereby the bracket 270 may break or be damaged due to external impacts. Furthermore, if D11 exceeds 50% of L22, it may be difficult to avoid spatial interference with another component (e.g., the support plate 310), the design freedom of the camera device may be reduced, and the weight of the moving unit may increase, thereby increasing power consumption.

[0559] Referring to Fig.23a the description may be equivalently or similarly applied to the first stopper 55A and the second stopper 55B.

[0560] Referring to Fig. 22 and Figure 23b In one example, the stopper 55 may include a third stopper 55C protruding from the third side portion 57C of the bracket 270. In one example, the third stopper 55C may protrude from the fourth side portion 57D of the bracket 270 toward the third side portion 57C.

[0561] In one example, the stopper 55 may include a fourth stopper 55D protruding from the fourth side portion 57D of the bracket 270. In one example, the fourth stopper 54D may protrude from the third side portion 57C of the bracket 270 toward the fourth side portion 57D. The third stopper 55C and the fourth stopper 55D may protrude or extend in opposite directions.

[0562] In one example, the third stopper 55C may be disposed in the first groove 91-1 in the bracket 270. The fourth stopper 55D may be disposed in the second groove 91-2 in the bracket 270. In one example, the third stopper 55C may protrude from the bottom surface 91A of the first groove 91-1 in the bracket 270. In one example, the fourth stopper 55D may protrude from the bottom surface of the second groove 91-2 in the bracket 270.

[0563] In one example, the third stopper 55C may not protrude from the outer side surface of the third side portion 57C of the bracket 270. In one example, the third stopper 55C may not protrude outside the first groove 91-1 in the bracket 270. In one example, the fourth stopper 55D may not protrude from the outer side surface of the fourth side portion 57D of the bracket 270. In one example, the fourth stopper 55D may not protrude outside the second groove 91-2 in the bracket 270.

[0564] In one example, the protruding length d11 of the third stopper 55C may be less than the distance from the outer side surface of the third side portion 57C of the bracket 270 to the bottom surface 91A of the first groove 91-1. In one example, the protruding length d11 of the fourth stopper 55D may be less than the distance from the outer side surface of the fourth side portion of the bracket 270 to the bottom surface 91C of the second groove 91-2.

[0565] In one example, the third stopper 55C may be disposed to correspond to, be opposite to, or overlap with the first protrusion 216A of the base 210 in a direction perpendicular to the optical axis (e.g., a first horizontal direction (e.g., the Y-axis direction)). In one example, the fourth stopper 55D may be disposed to correspond to, be opposite to, or overlap with the second protrusion 216B of the base 210 in a direction perpendicular to the optical axis (e.g., a first horizontal direction (e.g., the Y-axis direction)).

[0566] In one example, the third stop member 55C can be set at a position corresponding to, opposite to, or overlapping with the center or center area of ​​the third side portion 57C of the bracket 270, and the fourth stop member 55D can be set at a position corresponding to, opposite to, or overlapping with the center or center area of ​​the fourth side portion 57D of the bracket 270.

[0567] In one example, the third stop member 55C can be set at a position corresponding to, opposite to, or overlapping with the center or center area of ​​the bottom surface 91A of the first groove 91-1 in the bracket 270, and the fourth stop member 55D can be set at a position corresponding to, opposite to, or overlapping with the center or center area of ​​the bottom surface 91C of the second groove 91-2 in the bracket 270.

[0568] In one example, assuming that the center of the third side 57C (or the fourth side 57D) of the bracket 270 is a point corresponding to 50% of the third side 57C (or the fourth side 57D), the third stopper 55C (or the fourth stopper 55D) may be provided in an area between points corresponding to 10% and 90% of the third side 57C (or the fourth side 57D). Alternatively, in one example, the third stopper 55C (or the fourth stopper 55D) may be provided in an area between points corresponding to 25% and 75% of the third side 57C (or the fourth side 57D) of the bracket 27. Alternatively, in one example, the third stopper 55C (or the fourth stopper 55D) may be provided in an area between points corresponding to 35% and 65% of the third side 57C (or the fourth side 57D) of the bracket 27.

[0569] In another embodiment, a portion corresponding to 50% or more of the total length D21 of the third stop 55C (or the fourth stop 55D) may be provided with an area between points corresponding to 35% and 65% of the third side 57C (or the fourth side 57D) of the bracket 27.

[0570] The third stopper 55C and the fourth stopper 55D are both Fig.12a and Fig. 22 However, in another embodiment, the third stopper and the fourth stopper of the bracket may each include a plurality of stoppers spaced apart from each other.

[0571] Reference Fig. 22 , the third stopper 55C may protrude toward the first side plate 302C of the cover member 300 , and the fourth stopper 55D may protrude toward the fourth side plate 302B of the cover member 300 .

[0572] At the initial position of the OIS moving unit, the stoppers 55C and 55D may be spaced apart from the base 210. In one example, at the initial position of the OIS moving unit, the stoppers 55C and 55D may be spaced apart from the protrusions 216A and 216B of the base 210. The reason for this is that the OIS operation is performed by the movement of the OIS moving unit.

[0573] In one example, the distal ends or front ends of the stoppers 55C and 55D may be positioned closer to the protrusions 216A and 216B of the base 210 than the bottom surfaces 91A and 91C of the grooves 91-1 and 91-2 in the bracket 270. In one example, the distal ends or front ends of the stoppers 55C and 55D may be positioned closer to the side plates 302C and 302D of the cover member 300 than the bottom surfaces 91A and 91C of the grooves 91-1 and 91-2 in the bracket 270.

[0574] Reference Figure 23bIn one example, the distance d12 between the stoppers 55C and 55D and the protrusions 216A and 216B of the base 210 may be smaller than the distance d13 (d12 <d13)。

[0575] For example, d12 may be the shortest distance between stoppers 55C and 55D and protrusions 216A and 216B of base 210. For example, d13 may be the shortest distance between bottom surfaces 91C of recesses 91-1 and 91-2 in bracket 270 and protrusions 216A and 216B of base 210.

[0576] In one example, the protruding length d11 of the stoppers 55C and 55D protruding from the bottom surfaces 91A and 91C of the grooves 91-1 and 91-2 in the bracket 270 may be greater than the distance d12 between the stoppers 55A and 55B and the protrusions 216A and 216B of the base 210 (d11>d12). Because d11 is greater than d12, the stoppers 55C and 55D can stably protect the bracket 270 from external impact. In another embodiment, the protruding length of the stoppers 55C and 55D may be equal to or less than the distance d12 between the stoppers 55C and 55D and the protrusions 216A and 216B of the base 210.

[0577] refer to Fig.24 , when viewed from above, the stoppers 55C and 55D may be closer to the optical axis than the support plate 310. In an example, when viewed from above, the distal ends of the stoppers 55C and 55D may be located inside the bodies 86 and 87 of the support plate 310.

[0578] In one example, the distance d12 between the stoppers 55C and 55D and the protrusions 216A and 216B of the base 210 may be smaller than the distance d13 (d12 <d13)。

[0579] For example, d12 may be the distance between the distal ends of the stoppers 55C and 55D and the inner side surfaces of the protrusions 216A and 216B of the base 210 .

[0580] For example, d13 may be the distance between the bottom surfaces 91A and 91C of the grooves 91 - 1 and 91 - 2 in the bracket 270 and the protrusions 216A and 216B of the base 210 (or the inner side surfaces of the protrusions 216A and 216B).

[0581] The distance d5 between the side surfaces 91B and 91D of the grooves 91-1 and 91-2 in the bracket 270 and the protrusions 216A and 216B of the base 210 may be equal to or greater than d13. In another embodiment, d5 may be less than d13.

[0582] In one example, the distance d14 between the side portions 57C and 57D of the bracket 270 (or the outer surfaces of the side portions 57C and 57D) and the side plates 302C and 302D of the cover member 300 may be equal to d13. In another embodiment, d13 may be less than d14. In yet another embodiment, d13 may be greater than d14. For example, d14 may be the shortest distance between the side portions 57C and 57D of the bracket 270 (or the outer surfaces of the side portions 57C and 57D) and the side plates 302C and 302D of the cover member 300.

[0583] Referring to Fig. 22 , the length L31 of the grooves 91-1 and 91-2 in the bracket 270 in a direction parallel to the side portions 57C and 57D of the bracket may be greater than the length L32 of the receiving portions 46A and 46B of the base 210 in a direction parallel to the outer surfaces of the side portions 57C and 57D of the bracket 270 (L31 > L32).

[0584] In one example, when viewed from above, at the initial position of the OIS moving unit, at least a portion of the receiving portions 46A and 46B of the base 210 may be located in the grooves 91-1 and 91-2 in the bracket 270.

[0585] In one example, when viewed from above, at the initial position of the OIS moving unit, at least a portion of the receiving portions 46A and 46B of the base 210 may overlap with the grooves 91-1 and 91-2 in the bracket 270 in a direction parallel to the outer surfaces of the side portions 57C and 57D of the bracket 270 or in the second horizontal direction (X-axis direction).

[0586] The length D21 of the stoppers 55C and 55D in the second horizontal direction (e.g., X-axis direction) or in a direction parallel to the outer surfaces of the side portions 57C and 57D of the bracket 270 may be less than the length D22 of the grooves 91-1 and 91-2 in the bracket 270 in the second horizontal direction (e.g., X-axis direction) or in a direction parallel to the outer surfaces of the side portions 57C and 57D of the bracket 270 (D21 < D22). In another embodiment, D21 may be equal to D22.

[0587] D21 can be 8% to 50% of the length L21 of the bracket 270 in the second horizontal direction (e.g., the X-axis direction) or in a direction parallel to the outer surfaces of the sides 57C and 57D. In another embodiment, D21 can be 10% to 25% of L21. In yet another embodiment, D21 can be 10% to 20% of L21. If D21 is less than 8% of L21, the stoppers 55C and 55D may not stably protect the bracket 270 from external impacts, so the bracket 270 may break or be damaged due to external impacts. Furthermore, if D21 exceeds 50% of L21, the design freedom of the camera device will be reduced, and the weight of the moving unit will increase, thereby increasing power consumption.

[0588] Reference Figure 23b The description of Figure 23b can be equivalently or similarly applied to the third stopper 55C and the fourth stopper 55D.

[0589] The distance d2 between the stoppers 55A and 55B of the bracket 270 and the side plates 302A and 302B of the cover member 300 can be different from the distance d4 between the stoppers 55C and 55D of the bracket 270 and the side plates 302C and 302D of the cover member 300.

[0590] In one example, the distance d2 between the stoppers 55A and 55B of the bracket 270 and the side plates 302A and 302B of the cover member 300 can be less than the distance d4 between the stoppers 55C and 55D of the bracket 270 and the side plates 302C and 302D of the cover member 300 (d2 < d4). In another embodiment, d2 can be equal to or greater than d4.

[0591] For example, the shape of the stopper 55 can be a polyhedron, a semi-circle, or a semi-ellipse. For example, when viewed from above, the shape of the stopper 55 can be a trapezoid. In another embodiment, when viewed from above, the shape of the stopper 55 can be a quadrilateral.

[0592] In one example, each of the stoppers (e.g., 55A to 55D) can include a portion whose length gradually decreases in its protruding direction. For example, the length of the stopper (e.g., 55A to 55D) can be the length in a direction parallel to the outer surface of the side portion (e.g., 57A) of the bracket 270.

[0593] Fig.25 is a perspective view of the camera device 10-1 according to another embodiment, Fig.26 is Fig.25 a perspective view of the bracket 270-1 of the camera device 10-1 shown in Fig.25 .

[0594] In Fig.25 and Fig.26In the illustrated embodiment, the positions and shapes of the first and second stoppers 55A1 and 55A2 of the bracket 270-1 may be different from Fig.12a Stop 55A is shown.

[0595] In one example, the bracket 270-1 may include stoppers 55A and 55B, each of which is formed on at least one side of one or the other side of a corresponding one of the protrusions 27A and 27B. In one example, the stoppers 55A1 and 55A2 may be provided on both sides of each of the protrusions 27A and 27B to avoid spatial interference with the connection portion 320 of the support plate 310. Fig.25 The stoppers 55A1 and 55A2 of the illustrated bracket 270 - 1 may not penetrate the support plate 310 .

[0596] In one example, the bracket 270-1 may include a first stopper 55A1 (or “first protrusion”) located at one side of the connection portion 320 of the support plate 310 and protruding relative to the connection portion 320. In one example, the bracket 270-1 may include a second stopper 55A2 (or “second protrusion”) located at one side of the connection portion 320 of the support plate 310 and protruding relative to the connection portion 320.

[0597] In one example, at least one of the first and second stoppers 55A1 and 55A2 may contact the protrusions 27A and 27B of the bracket 270-1. In another embodiment, at least one of the first and second stoppers 55A1 and 55A2 may be spaced apart from the protrusions 27A and 27B of the bracket 270-1.

[0598] right Fig.12a and Figure 22 to Figure 24 The description of the first and second stoppers 55A and 55B shown in FIG. 1 may be equally or similarly applied to Fig.25 and 26 The stoppers 55A1 and 55A2 shown in FIG.

[0599] In order to achieve movement of the OIS moving unit in a direction perpendicular to the optical axis or rolling of the OIS moving unit around the optical axis, a space or gap needs to be provided between the OIS moving unit and a fixed unit (eg, a cover member and a base).

[0600] In the camera device, the bracket of the OIS moving unit or components (circuit board, OIS coil and position sensor) coupled to the bracket may be damaged or broken due to impact. Such damage or breakage may reduce the performance of the camera device or may cause malfunction of the camera device.

[0601] This embodiment includes a stopper 55 to prevent the bracket of the OIS moving unit or components coupled to the bracket from being damaged due to external impact. The stopper 55 according to this embodiment may be located at the center or central area of ​​each of the side portions 57A to 57D of the bracket 270.

[0602] In the camera device 10 according to this embodiment, the distance d13 or d14 between the bracket 270 (or the support plate 310) and the side plate 302 of the cover member 300 can be a value obtained by adding the moving distance of the OIS moving unit along the X-axis (or Y-axis), the moving distance of the OIS moving unit during its rolling, and other processing and assembly offsets.

[0603] For example, the OIS moving distance during the offset operation in the X-axis and Y-axis directions for 1 degree correction may be 0.12 mm, the moving distance of the OIS moving unit during the rolling operation for 1 degree correction (i.e., the moving distance in the X-axis and Y-axis directions) may be 0.02 mm, and other processing and assembly offsets may be 0.1 mm.

[0604] Fig. 27 is a perspective view of a bracket 270A according to another embodiment.

[0605] Reference Fig. 27 , a bracket 270A according to another embodiment (hereinafter referred to as a “comparative example”) may include stoppers 1051 and 1052 disposed adjacent to corner regions CR1 to CR4 of the bracket 270A.

[0606] The stoppers 1051 and 1052 may be disposed closer to the corner regions CR1 to CR4 of the bracket 270A than the center of the side of the bracket 270A. In one example, at least a portion of the stoppers 1052 and 1051 may be disposed in the corner regions of the bracket 270A. Alternatively, in one example, the stoppers 1051 and 1052 may be disposed in contact with or adjacent to the corner regions of the bracket 270A.

[0607] In a comparative example, the OIS moving distance during the offset operation in the X-axis and Y-axis directions for 1 degree correction may be 0.12 mm, the moving distance of the OIS moving unit during the rolling operation for 1 degree correction may be 0.16 mm, and other processing and assembly offsets may be 0.1 mm.

[0608] Compared with the comparative example, the embodiment is configured such that the stopper 55 is provided in the central area of ​​the side of the bracket 270 and is closer to the center of the bracket 270 than the corner portion of the bracket 270. Therefore, during the rolling operation of the OIS mobile unit for 1 degree correction, the moving distance of the OIS mobile unit in the embodiment can be smaller than that in the comparative example. Figure 22 to Figure 26In the illustrated embodiment, during the rolling operation of the OIS mobile unit for 1 degree correction, the moving distance of the OIS mobile unit can be reduced to 0.14 mm. That is, this embodiment can reduce the spacing distance (hereinafter referred to as "gap" or "air gap") required for OIS operation between the OIS mobile unit (e.g., the bracket 270 or the support plate 310) and the fixed unit (e.g., the side plate of the cover member 300) compared to the side plate of the cover member 300.

[0609] As described above, according to this embodiment, a clearance (or air gap) required for OIS operation between an OIS moving unit (eg, bracket 270 or support plate 310) and a fixing unit (eg, side plate of cover member 300) may be reduced.

[0610] According to a drop experiment of the camera device, the fixed unit of the camera device (e.g., the cover member and the base) first stops when colliding with a collision surface (e.g., the ground or the floor), while the OIS mobile unit continues to fall due to the gap (or air gap) and then collides with the fixed unit of the camera device.

[0611] This embodiment can obtain an impulse reduction effect of about 20% by reducing the gap (or air gap) compared to the comparative example, thereby preventing the OIS moving unit of the camera device 10 from being damaged or broken due to impact or collision.

[0612] In addition, the camera device according to the embodiment may be included in an optical instrument for forming an image of an object existing in space using reflection, refraction, absorption, interference, and diffraction as characteristics of light to improve visibility, for recording and reproducing images using a lens, or for optical measurement or image propagation or transmission. For example, the optical instrument according to the embodiment may be a mobile phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a notebook computer, a digital broadcast terminal, a personal digital assistant (PDA), a portable multimedia player (PMP), a navigation device, but is not limited thereto, and may also be any device for capturing images or pictures.

[0613] Fig.28a is a perspective view of an optical instrument 200A according to an embodiment; Fig.28b is a perspective view of an optical instrument 200X according to another embodiment; Fig.29 yes Fig.28a and Fig.28b A configuration diagram of an optical instrument 200A shown in FIG.

[0614] For example, Fig.28aThe embodiment in the embodiment may be a front-view camera (front-view camera) of the optical instrument 200A, wherein the lens module 400 of the camera module 200 is arranged to face the front surface of the body 850, and Fig.28b The embodiment in the embodiment may be a rear-view camera (rear-view camera), wherein the lens module 400 of the camera module 200 is arranged to face the rear surface of the body 850 of the optical instrument 200A. In another embodiment, one or more rear cameras may be provided.

[0615] In another embodiment, the optical instrument 200A according to this embodiment may correspond to a front camera and a rear camera of the optical instrument 200A.

[0616] Reference Fig.28a , Fig.28b and Fig.29 The optical instrument 200A may include a body 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / output unit 750, a memory 760, an interface unit 770, a controller 780, and a power supply unit 790.

[0617] The body 850 may be in a bar shape, but is not limited thereto, and may be any of various types (eg, a sliding type, a folding type, a swing type, or a rotating type) in which two or more sub-bodies are connected to be movable relative to each other.

[0618] The body 850 may include a housing (shell, housing, cover, etc.) defining its appearance. In one example, the body 850 may be divided into a front housing 851 and a rear housing 852. Various electronic components of the terminal may be installed in a space defined between the front housing 851 and the rear housing 852.

[0619] The wireless communication unit 710 may include one or more modules that enable wireless communication between the optical instrument 200A and a wireless communication system or between the optical instrument 200A and a network in which the optical instrument 200A is located. In an example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless Internet module 713, a near field communication module 714, and a location information module 715.

[0620] The audio / video (A / V) input unit 720 is used to input an audio signal or a video signal, and may include a camera 721 and a microphone 722 .

[0621] The camera 721 may include a camera device according to this embodiment.

[0622] The sensing unit 740 can sense the current state of the optical instrument 200A, such as the open or closed state of the optical instrument 200A, the position of the optical instrument 200A, the presence or absence of a user touch, the orientation of the optical instrument 200A, or the acceleration / deceleration of the optical instrument 200A, and can generate a sensing signal to control the operation of the optical instrument 200A. For example, when the optical instrument 200A is a slide phone, it can be detected whether the slide phone is opened or closed. In addition, the sensing unit 740 is used to sense whether power is supplied from the power supply unit 790 or whether the interface unit 770 is connected to an external device.

[0623] The input / output unit 750 is used to generate visual, auditory or tactile input or output. The input / output unit 750 can generate input data to control the operation of the optical instrument 200A, and can display information processed in the optical instrument 200A.

[0624] The input / output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 may generate input data in response to an input to the keyboard.

[0625] The display module 751 may include a plurality of pixels whose colors change in response to electrical signals. In an example, the display module 751 may include at least one of a liquid crystal display, a thin film transistor liquid crystal display, an organic light emitting diode, a flexible display, or a 3D display.

[0626] The sound output module 752 may output audio data received from the wireless communication unit 710 in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or may output audio data stored in the memory 760 .

[0627] The touch screen panel 753 may convert a capacitance variation caused by a user's touch on a specific area of ​​the touch screen into an electric input signal.

[0628] The memory 760 may store programs for processing and controlling of the controller 780, and may temporarily store input / output data (e.g., phonebook, messages, audio, still images, pictures, and moving images). For example, the memory 760 may store images (e.g., pictures or moving images) captured by the camera 721. For example, the memory 760 may store software, algorithms, or equations for implementing the above-mentioned hand-shake compensation.

[0629] The interface unit 770 serves as a connection channel between the optical instrument 200A and an external device. The interface unit 770 may receive data or power from an external device and may transmit it to various components in the optical instrument 200A, or may transmit data inside the optical instrument 200A to an external device. For example, the interface unit 770 may include a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input / output (I / O) port, a video input / output (I / O) port, and a headphone port.

[0630] The controller 780 may control the overall operation of the optical instrument 200A. For example, the controller 780 may perform control and processing related to voice calls, data communications, and video calls.

[0631] The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be provided in the controller 180 or may be provided separately from the controller 780.

[0632] The controller 780 may perform a pattern recognition process, thereby recognizing a writing or drawing input of the touch screen as characters and images.

[0633] The power supply unit 790 may provide power required for operations of various components upon receiving external power or internal power under the control of the controller 780 .

[0634] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present disclosure, but are not necessarily limited to one embodiment. In addition, the features, structures, and effects illustrated in each embodiment may be combined or modified with other embodiments. Therefore, the contents related to these combinations and modifications should be interpreted as falling within the scope of the present disclosure.

[0635] Industrial Applicability

[0636] Various embodiments may be used for camera devices and optical instruments capable of preventing an OIS moving unit from being damaged or broken due to impact or collision.

Claims

1. A camera device, comprising: a fixing unit including a cover member including an upper plate and a side plate connected to the upper plate; a moving unit including a bracket disposed inside the cover member, a first circuit board disposed on the bracket, and an image sensor conductively connected to the first circuit board; as well as a supporting unit coupled to the bracket, the supporting unit being configured to support the moving unit relative to the fixing unit, wherein the bracket includes a side portion, a corner portion, and a stopper, the stopper protruding from an outer side surface of the side portion of the bracket toward the side plate of the cover member, and The stopper is arranged closer to the center of the side portion of the bracket than to the corner portion of the bracket.

2. The camera device according to claim 1, wherein: At least a portion of the stopper passes through the supporting unit.

3. The camera device according to claim 1, wherein: The shortest distance between the stopper and the side plate of the cover member is smaller than the shortest distance between the outer side surface of the side portion of the bracket and the side plate of the cover member.

4. The camera device according to claim 1, wherein: The shortest distance between the stopper and the side plate of the cover member is smaller than the shortest distance between the outer side surface of the corner portion of the bracket and the side plate of the cover member.

5. The camera device according to claim 3, wherein: The bracket includes a protrusion formed to allow a portion of the supporting unit to be coupled thereto, and The stopper includes a first stopper protruding from an outer surface of the protruding portion of the bracket.

6. The camera device according to claim 5, wherein: The supporting unit includes a connecting portion connected to the first circuit board and coupled to a protrusion of the bracket, and Wherein, the first stopper passes through the connecting portion.

7. The camera device according to claim 1, wherein: The bracket includes a protrusion that protrudes in the optical axis direction to allow a portion of the support unit to be coupled thereto, and The stopper includes a first stopper located on one side of the protruding portion of the bracket and a second stopper located on the other side of the protruding portion of the bracket.

8. The camera device according to claim 1, wherein: The fixing unit comprises: a base disposed below the cover member; and a second circuit board coupled to the base, and The stopper includes a second stopper protruding from an outer side surface of a side portion of the bracket toward the base.

9. The camera device according to claim 8, wherein: The base includes a protrusion formed to allow a portion of the support unit to be coupled thereto, wherein the bracket includes a groove recessed in an outer side surface of a side portion of the bracket so as to correspond to a protrusion of the base, and Wherein, the second stopper protrudes from the bottom surface of the groove in the bracket toward the protrusion of the base.

10. The camera device according to claim 9, wherein: A distance between the second stopper and the protrusion of the base is smaller than a distance between an outer side surface of a side portion of the bracket and a side plate of the cover member.

Images