Loading mechanism, polishing apparatus, and polishing method

Abstract

The application relates to a loading mechanism, a polishing device and a polishing method. The loading mechanism comprises a first conductive seat, a second conductive seat, a conductive connecting piece and a limiting column. The first conductive seat is provided with a first hanging part for being hung to a power supply anode of a polishing equipment. The second conductive seat is provided with a second hanging part for being hung to the power supply anode of the polishing equipment, and the second conductive seat is oppositely arranged with the first conductive seat. A containing space capable of containing a pipe is formed between the first conductive seat and the second conductive seat, and the conductive connecting piece connects the first conductive seat and the second conductive seat. The limiting column is arranged between the first conductive seat and the second conductive seat, and the limiting column is used for being penetrated into the pipe. The loading mechanism can improve the polishing efficiency of the pipe while ensuring the polishing effect of the pipe.

Description

Technical Field

[0001] This application relates to the field of plasma polishing technology, and in particular to loading mechanisms, polishing apparatus and polishing methods. Background Technology

[0002] Small-sized pipes are typically manufactured using laser cutting. After cutting, the pipe end surface usually has burrs, slag, and other protruding defects, which significantly affect subsequent processes such as welding and stitching. Polishing technology can improve the aesthetics of the pipe end surface and remove these protruding defects. Traditional pipe polishing technology is usually electrochemical polishing, but electrochemical polishing is a complex process with a low yield rate, and the polishing solution used is severely environmentally damaging.

[0003] With the development of polishing technology, plasma polishing technology has been increasingly applied to the polishing processes of various workpieces due to its advantages such as simple polishing procedures, good polishing effects, and low environmental pollution. The principle of plasma polishing technology is to place the workpiece in a polishing slurry, apply a certain DC voltage, and cause the polishing slurry around the workpiece to vaporize, forming a gas layer surrounding the workpiece. By forming discharge channels at different positions in the gas layer, the surface material is selectively removed, thus achieving polishing of the workpiece surface.

[0004] In related technologies, plasma polishing of pipes generally employs either external or internal surface conductivity mechanisms. When using external surface conductivity, the pipe clamping position needs to be frequently changed during polishing to ensure all areas of the pipe surface are polished, which slows down the polishing rate and increases labor costs. When using internal surface conductivity, due to the skin effect of the current and the existence of a certain gap between the conductive wire and the lower half of the pipe, the current in different parts of the pipe will vary. This results in a thinner upper half and a thicker lower half of the polished pipe, which is detrimental to subsequent welding operations. Summary of the Invention

[0005] Therefore, it is necessary to provide a loading mechanism, polishing device, and polishing method to address the issue of balancing the polishing effect and polishing efficiency of pipes.

[0006] A loading mechanism for loading tubing to be polished, the loading mechanism comprising:

[0007] A first conductive base, wherein the first conductive base is provided with a first mounting part;

[0008] The second conductive seat has a second hook-on portion. The second conductive seat is disposed opposite to the first conductive seat, and an accommodating space for accommodating the pipe is formed between the second conductive seat and the first conductive seat.

[0009] A conductive connector, the conductive connector connecting the first conductive base and the second conductive base; and,

[0010] A limiting post is disposed between the first conductive seat and the second conductive seat, and the limiting post is used to pass through the pipe.

[0011] The technical solution will be further explained below:

[0012] In one embodiment, the two ends of the conductive connector are detachably connected to the first conductive base and the second conductive base, respectively.

[0013] In one embodiment, one end of the conductive connector is connected to the geometric center of the first conductive connector base, and the other end is connected to the geometric center of the second conductive base.

[0014] In one embodiment, one end of the limiting post is connected to the first conductive seat, and the other end of the limiting post abuts against or separates from the second conductive seat.

[0015] In one embodiment, the limiting post is disposed separately from the second conductive base, and the distance between the limiting post and the second conductive base is 1mm-5mm.

[0016] In one embodiment, there are multiple limiting posts, which are arranged at intervals along the outer periphery of the conductive connector.

[0017] In one embodiment, the first attachment part includes a first hook, one end of which is connected to the first conductive base, and the other end of which is used to attach to the power anode of the polishing equipment; and / or, the second attachment part includes a second hook, one end of which is connected to the second conductive base, and the other end of which is used to attach to the power anode of the polishing equipment.

[0018] In one embodiment, the limiting post is an insulating material component, and the first conductive base, the second conductive base, the conductive connector, the first hooking part, and the second hooking part are all conductive material components.

[0019] This application also provides a polishing apparatus, including a polishing device and the loading mechanism described above. The polishing device includes a power supply and a polishing tank for containing polishing liquid. The polishing tank is connected to the cathode of the power supply, and the loading mechanism is connected to the anode of the power supply via a first or a second mounting part.

[0020] In one embodiment, the polishing equipment further includes a lifting drive and a connecting rod. The connecting rod is disposed above the polishing tank and electrically connected to the anode of the power supply. The lifting drive is connected to the connecting rod and is used to drive the connecting rod to move closer to or away from the polishing tank. The loading mechanism is suspended from the connecting rod through the first or second hook.

[0021] This application also provides a plasma polishing method, implemented using the above-described polishing apparatus, wherein the plasma polishing method includes:

[0022] The pipes are loaded into the loading mechanism;

[0023] Input predetermined polishing parameters into the polishing equipment and prepare polishing liquid in the polishing tank;

[0024] The loading mechanism is suspended to the anode of the power supply through the first hook part, and the loading mechanism is kept in a suspended state. The loading mechanism is then immersed in the polishing liquid for the first polishing.

[0025] The loading mechanism is flipped up and down, and suspended to the anode of the power supply through the second hook part. The loading mechanism is kept suspended and then immersed in the polishing liquid for a second polishing.

[0026] In one embodiment, the polishing solution is a mixed solution of ammonium sulfate, oxalic acid and water, with a concentration ranging from 2% to 10%.

[0027] The aforementioned loading mechanism, polishing device, and polishing method involve placing the pipe into a receiving space and fitting it onto a limiting post. Then, the loading mechanism is sequentially suspended from the power anode of the polishing equipment via the first and second hooking parts and placed into a polishing tank connected to the power cathode. This allows the first and second ends of the pipe to act as conductive interfaces, introducing current into the pipe and thus polishing it. Compared to traditional external or internal surface conductive connection methods, the loading mechanism of this application enables end-conductivity of the pipe. Therefore, only one rotation of the loading mechanism during polishing is needed to fully polish the outer surface, first end, and second end of the pipe, eliminating the need for multiple pipe clamping position changes required for traditional external surface conductive methods. This improves polishing efficiency and reduces labor costs. Furthermore, by rotating the loading mechanism so that the first and second ends of the pipe act as conductive interfaces sequentially, consistent current is ensured throughout the polishing process, guaranteeing consistent wall thickness across all parts of the polished pipe and improving the polishing effect. Attached Figure Description

[0028] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the various components are shown as examples only and not necessarily to scale. In the accompanying drawings:

[0031] Figure 1 This is a schematic diagram of the loading mechanism in one embodiment.

[0032] Figure 2 for Figure 1 The diagram shows the loading mechanism from another perspective.

[0033] Figure 3 for Figure 1 The left view of the loading structure shown.

[0034] Figure 4 This is a schematic diagram of the structure of a polishing apparatus according to an embodiment.

[0035] Figure 5 for Figure 4 The diagram shows the structure of the polishing device after the loading mechanism is placed into the polishing tank.

[0036] Explanation of reference numerals in the attached figures:

[0037] 10. Loading mechanism; 11. First conductive seat; 12. Second conductive seat; 13. Conductive connector; 14. Limiting post; 15. First hook part; 16. Second hook part; 20. Polishing equipment; 21. Polishing groove; 22. Crossbar. Detailed Implementation

[0038] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0039] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0044] See Figure 1 as well as Figure 2 This application provides a loading mechanism 10 for loading a pipe to be polished during a pipe polishing process. Specifically, the loading mechanism 10 of one embodiment includes a first conductive seat 11, a second conductive seat 12, a conductive connector 13, and a limiting post 14. The first conductive seat 11 has a first hook-on portion 15 for hooking onto the power anode of the polishing equipment 20. The second conductive seat 12 has a second hook-on portion 16 for hooking onto the power anode of the polishing equipment 20. The second conductive seat 12 is disposed opposite to the first conductive seat 11, forming a space between the first and second conductive seats 11 capable of accommodating the pipe. Preferably, the distance between the first conductive seats 11 is greater than the length of the pipe to be polished. The conductive connector 13 connects the first conductive seat 11 and the second conductive seat 12. The limiting post 14 is disposed between the first conductive seat 11 and the second conductive seat 12 and is inserted into the pipe to limit its movement.

[0045] Furthermore, combined Figure 4 as well as Figure 5 When polishing is required, the pipe is placed in the receiving space and fitted onto the limiting post 14. The limiting post 14 can limit the pipe and prevent it from leaving the receiving space during polishing. Then, the loading mechanism 10 and the pipe are suspended to the anode of the power supply through the first hook part 15. At this time, the first conductive seat 11 of the loading mechanism 10 is set upward and the second conductive seat 12 is set downward. Under the action of gravity, the first end of the pipe is set upward and the second end of the pipe is set downward and abuts against the second conductive seat 12. Then, while keeping the loading mechanism 10 in this suspended state, the loading mechanism 10 and the pipe are placed together into the polishing tank 21 containing polishing liquid, wherein the polishing tank 21 is connected to the cathode of the power supply. Then turn on the power switch. At this time, the current is transmitted from the first connecting part 15 to the first conductive seat 11, and then through the conductive connector 13 to the second conductive seat 12. Since the second end of the tube is in contact with the second conductive seat 12, the second end of the tube can be used as a conductive interface to introduce the current into the tube, thereby polishing the outer surface of the tube and the first end.

[0046] After polishing for a period of time, the loading mechanism 10 is flipped over, and the second connecting part 16 of the loading mechanism 10 is connected to the anode of the power supply. At this time, the second conductive seat 12 of the loading mechanism 10 faces upward and the first conductive seat 11 faces downward. Under the action of gravity, the second end of the tube is set upward and the first end of the tube is set downward and abuts against the first conductive seat 11. Then, while maintaining the current suspended state of the loading mechanism 10, the loading mechanism 10 and the tube are placed into the polishing tank 21 again. Then, the power supply is turned on, and the current is transmitted from the second connecting part 16 to the second conductive seat 12, and then to the first conductive seat 11 through the conductive connector 13. Since the first end of the tube is abutting against the first conductive seat 11, the first end of the tube can act as a conductive interface to introduce current into the tube, thereby polishing the outer surface and the second end of the tube.

[0047] The loading mechanism 10, by placing the pipe into the accommodating space and fitting it onto the limiting post 14, and then suspending the loading mechanism 10 onto the power anode of the polishing equipment 20 and placing it into the polishing tank 21 connected to the power cathode via the first hook part 15 and the second hook part 16, allows the first and second ends of the pipe to sequentially serve as conductive interfaces, introducing current into the pipe and thus polishing it. Compared to traditional external or internal surface conductive connection methods, the loading mechanism 10 of this application can achieve end-conductivity of the pipe. Therefore, only one flip of the loading mechanism 10 is needed during the polishing process to fully polish the outer surface, first end, and second end of the pipe, eliminating the need for multiple changes in the pipe clamping position required by traditional external surface conductive methods, thereby improving polishing efficiency and reducing labor costs. At the same time, by flipping the loading mechanism 10 so that the first and second ends of the pipe sequentially serve as conductive interfaces, the current in all parts of the pipe can be kept consistent throughout the polishing process, thus ensuring that the wall thickness of all parts of the polished pipe remains consistent and improving the polishing effect.

[0048] Optionally, in one embodiment, the first hook portion 15 includes a first hook, one end of which is connected to the first conductive base 11, and the other end of which is used to hook onto the power anode of the polishing device 20. Preferably, in this embodiment, the first hook and the first conductive base 11 are threaded together; in other embodiments, the first hook and the first conductive base 11 may also be welded together or bonded together with adhesive. Further, the first hook is made of a conductive material, such as titanium, titanium alloy, stainless steel, platinum-iridium, iridium-tantalum, and copper, thereby improving conductivity.

[0049] Specifically, the number of first hooks is at least one. Preferably, the number of first hooks is two or more, and the two or more first hooks are spaced apart on the first conductive base 11, thereby improving the stability of the loading mechanism 10 when suspended.

[0050] It should be noted that in other embodiments, the first hook part 15 may also be a hook ring or a hook hole provided on the first conductive base 11. At the same time, the power anode is provided with a hook. The hanging loading mechanism can also be realized by connecting the hook on the power anode to the hook ring or hook hole on the first conductive base 11. This will not be described in detail here.

[0051] Similarly, in one embodiment, the second hook 16 includes a second hook, one end of which is connected to the second conductive base 12, and the other end of which is used to hook onto the power anode of the polishing device 20. Preferably, in this embodiment, the second hook and the second conductive base 12 are threaded together; in other embodiments, the second hook and the second conductive base 12 may also be welded together or bonded together with adhesive. Further, the second hook is made of a conductive material, such as titanium, titanium alloy, stainless steel, platinum-iridium, iridium-tantalum, and copper, thereby improving conductivity.

[0052] Specifically, the number of second hooks is at least one. Preferably, the number of second hooks is two or more, and the two or more second hooks are spaced apart on the second conductive base 12, thereby improving the stability of the loading mechanism 10 when suspended.

[0053] It should be noted that in other embodiments, the second hook part 16 may also be a hook ring or a hook hole provided on the second conductive base 12. At the same time, the power anode is provided with a hook. The hanging loading mechanism can also be realized by connecting the hook on the power anode to the hook ring or hook hole on the second conductive base 12. This will not be described in detail here.

[0054] Both the first conductive base 11 and the second conductive base 12 are made of conductive materials. Optionally, the materials of the first conductive base 11 and the second conductive base 12 include, but are not limited to, metallic materials such as titanium, titanium alloy, stainless steel, platinum-iridium, iridium-tantalum, and copper, thereby improving the conductivity.

[0055] Optionally, in one embodiment, both the first conductive seat 11 and the second conductive seat 12 are flat plate structures. Preferably, both the first conductive seat 11 and the second conductive seat 12 are disc-shaped plate structures. The diameter range of the first conductive seat 11 and the second conductive seat 12 can be determined according to the diameter of the polishing groove 21, and the thickness range is between 5mm and 30mm, thereby ensuring that the first conductive seat 11 and the second conductive seat 12 have sufficient structural strength without being too heavy.

[0056] Optionally, in one embodiment, the conductive connector 13 is disposed between the first conductive seat 11 and the second conductive seat 12, and one end of the conductive connector 13 is detachably connected to the first conductive seat 11, and the other end of the conductive connector 13 is detachably connected to the second conductive seat 12. Thus, the conductive connector 13 can both conduct electricity between the first conductive seat 11 and the second conductive seat 12 and support the first conductive seat 11 and the second conductive seat 12. Simultaneously, by making the conductive connector 13 detachably connected to both the first conductive seat 11 and the second conductive seat 12, on the one hand, the second conductive seat 12 can be removed before loading the pipe to facilitate fitting the pipe onto the limiting post 14; on the other hand, it also facilitates replacing conductive connectors 13 of different diameters according to the conductivity requirements of the pipe to be polished. Preferably, in this embodiment, the conductive connector 13 is threadedly connected to both the first and second connecting seats.

[0057] Furthermore, one end of the conductive connector is connected to the geometric center of the first conductive connector base, and the other end is connected to the geometric center of the second conductive base. For example, in this embodiment, both the first and second conductive bases are disc-shaped structures. The two ends of the conductive connector are connected to the center of the first and second conductive bases, respectively. This allows for a more uniform current distribution on the first and second conductive bases, which is beneficial for improving the uniformity of pipe polishing.

[0058] The conductive connector 13 is made of conductive material. Optionally, in one embodiment, the material of the conductive connector 13 includes, but is not limited to, metallic materials such as titanium, titanium alloy, stainless steel, platinum-iridium, iridium-tantalum, and copper, thereby improving the conductivity. Further, the diameter of the conductive connector 13 ranges from 5mm to 30mm, and the length of the conductive connector 13 can be determined according to the length of the tube to be polished, and is not limited here.

[0059] See Figure 3 Optionally, in one embodiment, one end of the limiting post 14 is connected to the first conductive seat 11, and the other end of the limiting post 14 abuts against or separates from the second conductive seat 12. Preferably, the limiting post 14 and the second conductive seat 12 are separately disposed, and the distance between the second conductive seat 12 and the limiting post 14 is 1mm-5mm. That is, the limiting post 14 is not directly connected to the second conductive seat 12, and the second conductive seat 12 only needs to be connected to the conductive connector 13. Thus, before loading the pipe, the second conductive seat 12 can be removed from the conductive connector 13, which facilitates the quick removal of the second conductive seat 12 and makes it easier to fit the pipe onto the limiting post 14.

[0060] Furthermore, the limiting post 14 is threadedly connected to the first conductive seat 11, so that the diameter of the limiting post 14 can be changed according to the inner diameter of the tube being polished. Preferably, the diameter of the limiting post 14 is in the range of 0.2mm-10mm.

[0061] Optionally, in one embodiment, there are multiple limiting posts 14, which are arranged at intervals between the first conductive seat 11 and the second conductive seat 12. The limiting posts 14 can be inserted into different pipes one by one to limit the different pipes. This allows the loading mechanism 10 to load multiple pipes at one time, thereby polishing multiple pipes at the same time and further improving the polishing efficiency.

[0062] Preferably, in this embodiment, the plurality of limiting posts 14 are spaced apart along the outer periphery of the conductive connector 13. This makes the structure of the loading mechanism 10 more reasonable and compact, reduces the volume of the loading mechanism 10, and also allows the current transmitted by the conductive connector to be more evenly distributed to each pipe.

[0063] Furthermore, the limiting post 14 is made of insulating material. In one embodiment, the limiting post 14 is made of plastic, which reduces the overall weight of the loading mechanism 10 and is beneficial for worker operation.

[0064] See Figure 4 as well as Figure 5 This application also provides a polishing apparatus, specifically. One embodiment of the polishing apparatus includes a polishing device 20 and a loading mechanism 10 of any of the above embodiments. The polishing device 20 includes a power supply and a polishing tank 21 for containing polishing liquid. The polishing tank 21 is connected to the cathode of the power supply. The loading mechanism 10 is connected to the anode of the power supply via a first connecting part 15 or a second connecting part 16.

[0065] Furthermore, in one embodiment, the polishing equipment 20 further includes a lifting drive and a connecting rod. The connecting rod is disposed above the polishing tank 21 and electrically connected to the anode of the power supply. The lifting drive is connected to the connecting rod and is used to drive the connecting rod seat to move closer to or away from the polishing tank 21. The loading mechanism 10 is suspended from the connecting rod via a first hook 15 or a second hook 16. Preferably, the connecting rod includes a horizontal bar 22 and a vertical bar. The vertical bar connects the horizontal bar 22 to the output shaft of the lifting drive. The loading mechanism 10 is suspended from the horizontal bar 22 via the first hook 15 or the second hook 16. In this way, by driving the connecting rod to move closer to or away from the polishing tank 21 through the lifting drive, the loading mechanism 10, along with the tubing, can be immersed in or removed from the polishing liquid.

[0066] An embodiment of this application also provides a polishing method implemented using the polishing apparatus of any of the above embodiments, comprising the following steps:

[0067] S110: Load the pipe into the loading mechanism 10;

[0068] Specifically, first remove the second conductive seat 12 of the loading mechanism 10, then fit the pipes one by one onto the limiting post 14, and then connect the second conductive seat 12 to the conductive connector 13 to complete the installation of the pipes.

[0069] S120: Input predetermined polishing parameters into the polishing equipment and prepare polishing liquid in the polishing tank 21;

[0070] The predetermined polishing parameters include, but are not limited to, voltage and polishing time. Specifically, first, the power switch is turned on and the voltage is set, which can be set within the range of 200-350V. Then, the water replenishment solenoid valve is opened to replenish purified water into the polishing tank 21. When the water level reaches the required height, the water replenishment solenoid valve is closed. Next, the heating knob is turned on to heat the purified water. When the purified water temperature reaches the required temperature, the heating knob is closed. Then, the polishing liquid stock solution is added to the polishing tank 21. In this embodiment, the polishing liquid stock solution is a mixed solution of ammonium sulfate and oxalic acid. At the same time, the water replenishment solenoid valve is opened again to replenish purified water into the polishing tank 21 to prepare a polishing liquid of a certain concentration. Preferably, in this embodiment, the concentration of the polishing liquid is in the range of 2%-10%. Finally, the polishing time is set. The polishing time can be set according to the desired polishing effect. Generally, the polishing time is 100s-500s. S130: The loading mechanism 10 is suspended to the anode of the power supply through the first hanging part 15;

[0071] Specifically, the first mounting part 15 can be mounted on the crossbar 22 connected to the power anode. At this time, the first conductive seat 11 of the loading mechanism 10 is set upward and the second conductive seat 12 is set downward. Under the action of gravity, the first end of the pipe is set upward and the second end of the pipe is set downward and abuts against the second conductive seat 12 to serve as the conductive interface of the pipe.

[0072] S140: Keeping the loading mechanism in a suspended state, immerse the loading mechanism in the polishing liquid for the first polishing;

[0073] Specifically, the door of the polishing equipment is closed, the exhaust button is turned on, and the start button is clicked. The lifting drive drives the crossbar 22 to descend, immersing the loading mechanism 10 and the pipe together in the polishing liquid. At this time, the current is transmitted from the first hook part 15 to the first conductive seat 11, and then through the conductive connector 13 to the second conductive seat 12. Since the second end of the pipe is in contact with the second conductive seat 12 at this time, the second end of the pipe can serve as a conductive interface to introduce the current into the pipe, thereby starting the polishing of the pipe. When the polishing reaches the predetermined time, the power circuit will automatically cut off the power, and the lifting drive drives the crossbar 22 to rise, lifting the loading mechanism 10 and the pipe together, thereby completing the first polishing of the pipe.

[0074] S150: The loading mechanism is flipped up and down, and the loading mechanism is suspended to the anode of the power supply through the second hook part;

[0075] Similarly, the second mounting part 16 can be mounted on the crossbar 22 connected to the power anode. At this time, the second conductive seat 12 of the loading mechanism 10 is set upward and the first conductive seat 11 is set downward. Under the action of gravity, the second end of the pipe is set upward and the first end of the pipe is set downward and abuts against the first conductive seat 11 to serve as the conductive interface of the pipe.

[0076] S160: Keeping the loading mechanism suspended, immerse the loading mechanism in the polishing liquid for a second polishing;

[0077] Similarly, the lifting drive unit drives the crossbar 22 to descend again, so as to immerse the loading mechanism 10 and the pipe together in the polishing liquid. At this time, the current is transmitted from the second hook part 16 to the second conductive seat 12, and then through the conductive connector 13 to the first conductive seat 11. Since the first end of the pipe is in contact with the first conductive seat 11 at this time, the first end of the pipe can be used as a conductive interface to introduce the current into the pipe, thereby starting the polishing of the pipe. When the polishing reaches the predetermined time, the power circuit will automatically cut off the power, and the lifting drive unit drives the crossbar 22 to lift the loading mechanism 10 and the pipe together, thereby completing the second polishing of the pipe.

[0078] Optionally, after the second polishing is completed, the workpiece and the polishing tank can also be cleaned. Specifically, one embodiment of the polishing method may further include the following steps:

[0079] S170: Clean the pipes;

[0080] Specifically, after polishing, the loading mechanism 10, along with the pipe, is immersed in water and then dried. The subsequent passivation process involves placing the polished pipe in prepared nitric acid for 30 minutes, then immersing it in pure water for 5 minutes to wash away any residual nitric acid on the surface, and finally immersing it in 75% alcohol for more than 30 seconds and then drying it in an oven.

[0081] S180: Clean the polishing tank 20;

[0082] Specifically, turn on the drain button of the polishing equipment 20 to drain the waste liquid in the polishing tank 21. After the waste liquid is drained, pour purified water into the polishing tank 21 and scrub the tank wall. After scrubbing, perform the waste liquid draining operation again.

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A loading mechanism for loading pipes to be polished, characterized in that, The loading mechanism includes: A first conductive base, wherein the first conductive base is provided with a first mounting part; The second conductive seat has a second hook-on portion. The second conductive seat is disposed opposite to the first conductive seat, and an accommodating space for accommodating the pipe is formed between the second conductive seat and the first conductive seat. A conductive connector, the conductive connector connecting the first conductive base and the second conductive base; and, A limiting post is disposed between the first conductive seat and the second conductive seat, and the limiting post is used to pass through the pipe. Wherein, the first attachment part includes a first hook, one end of the first hook is connected to the first conductive base, and the other end of the first hook is used to attach to the power anode of the polishing equipment; and / or, the second attachment part includes a second hook, one end of the second hook is connected to the second conductive base, and the other end of the second hook is used to attach to the power anode of the polishing equipment.

2. The loading mechanism according to claim 1, characterized in that, The two ends of the conductive connector are detachably connected to the geometric centers of the first conductive base and the second conductive base, respectively.

3. The loading mechanism according to claim 1, characterized in that, One end of the limiting post is connected to the first conductive base, and the other end of the limiting post is in contact with or separate from the second conductive base.

4. The loading mechanism according to claim 1, characterized in that, The number of limiting posts is multiple, and the multiple limiting posts are arranged at intervals along the outer periphery of the conductive connector.

5. The loading mechanism according to any one of claims 1-4, characterized in that, The limiting post is made of insulating material, and the first conductive base, the second conductive base, the conductive connector, the first hook part, and the second hook part are all made of conductive material.

6. A polishing apparatus, characterized in that, The invention includes a polishing device and a loading mechanism according to any one of claims 1-5. The polishing device includes a power source and a polishing tank for containing polishing fluid. The polishing tank is connected to the cathode of the power source. The loading mechanism is connected to the anode of the power source via a first or a second attachment.

7. The polishing apparatus according to claim 6, characterized in that, The polishing equipment also includes a lifting drive and a connecting rod. The connecting rod is disposed above the polishing tank and electrically connected to the anode of the power supply. The lifting drive is connected to the connecting rod and is used to drive the connecting rod to move closer to or away from the polishing tank. The loading mechanism is suspended from the connecting rod through the first or second hook.

8. A polishing method, implemented using the polishing apparatus according to any one of claims 6 or 7, characterized in that, The polishing method includes the following steps: The pipes are loaded into the loading mechanism; Input predetermined polishing parameters into the polishing equipment and prepare polishing liquid in the polishing tank; The loading mechanism is suspended to the anode of the power supply through the first hook part, and the loading mechanism is kept in a suspended state. The loading mechanism is then immersed in the polishing liquid for the first polishing. The loading mechanism is flipped up and down, and suspended to the anode of the power supply through the second hook part. The loading mechanism is kept suspended and then immersed in the polishing liquid for a second polishing.

9. The polishing method according to claim 8, characterized in that, The polishing solution is a mixed solution of ammonium sulfate, oxalic acid and water, with a concentration range of 2%-10%.

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