Electronic component shell master batch and injection molding method of shell

Abstract

The invention relates to the technical field of plastic master batches, and discloses an electronic component shell master batch and an injection molding method of a shell. Wherein the electronic component shell master batch is prepared from the following components in parts by weight: 80 to 90 parts of polyetherimide, 5 to 10 parts of surface modified nano hexagonal aluminum nitride, 3 to 5 parts of self-made modified silicon carbide filler and 2 to 3 parts of self-made modified mica powder filler. The electronic component shell master batch is prepared by adding the self-made modified nano hexagonal aluminum nitride, the graft polymerization modified silicon carbide filler and the self-made modified mica powder filler on the basis of synthesizing polyetherimide, so that the prepared corresponding master batch has better insulativity and thermal conductivity; meanwhile, the prepared corresponding master batch has more excellent heat resistance and wear resistance; meanwhile, the invention further provides an injection molding method of the corresponding shell.

Description

Technical Field

[0001] The invention relates to the technical field of plastic masterbatches, and in particular to an electronic component housing masterbatch and a housing injection molding method. Background Art

[0002] In recent years, with the development of industrial production and science and technology, high-power electronic and electrical products have developed rapidly. At present, in order to meet people's requirements for equipment shell strength, appearance and texture, most electronic product shells are made of metal or alloy materials. Since wireless signal transmission is achieved by conducting electromagnetic waves, when electromagnetic waves reach the surface of the metal shell, due to the discontinuity of impedance at the interface between air and metal, when they penetrate the metal shell and propagate outward, the short-circuit effect of the conductive metal destroys the formation of the electric field. The disappearance of the electric field makes it impossible to continue to generate a magnetic field, thereby cutting off the continued propagation of the electromagnetic wave. Therefore, the metal shell causes a more serious attenuation of the electromagnetic wave.

[0003] The heat dissipation problem cannot be effectively solved under the thin and light design. Most of the existing heat dissipation solutions are metal heat dissipation solutions, which cannot achieve thin and light design. The existing technology also has the technology of heat dissipation through high thermal conductivity plastics, but high thermal conductivity plastics are brittle and have poor appearance performance, which cannot meet the structural strength and aesthetic requirements in product processing and use. Summary of the invention

[0004] The purpose of the present invention is to provide an electronic component housing masterbatch and a housing injection molding method, aiming to solve the problem that the existing electronic component housing has poor heat resistance and is prone to electromagnetic wave attenuation.

[0005] To solve the above technical problems, the present invention provides an electronic component housing masterbatch, which comprises, by weight: 80-90 parts of polyetherimide, 5-10 parts of surface-modified nano hexagonal aluminum nitride, 3-5 parts of grafted polymerization modified silicon carbide filler, and 2-3 parts of homemade modified mica powder filler.

[0006] Preferably, the polyetherimide preparation method is: Add n-butanol with a volume of 10 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane into the reaction bottle, add 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and ferric chloride with a mass of 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and activated carbon with a mass of 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane, heat to 95°C and stir to react for 30 minutes, while hot, add hydrazine hydrate with a volume of 1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane dropwise, control the addition to be completed within 1.5 hours, continue to react at 95°C for 8 hours, filter while hot, and concentrate the filtrate under reduced pressure at 60°C to obtain 2,2'-bis[4-(4-aminophenoxy)phenyl]propane. The reaction equation is as follows: Add N,N-dimethylacetamide with a mass of 6 times the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane to the reaction bottle, add 2,2'-bis[4-(4-aminophenoxy)phenyl]propane and stir for 30 minutes to dissolve, then add bisphenol A type diether dianhydride with a mass of 1.25 times the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, add N,N-dimethylacetamide with a mass of 3 times the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, stir at room temperature for 30 minutes under argon protection, add 2,2'-bis[4-(4-aminophenoxy)phenyl]propane and stir for 30 minutes. The reaction mixture was stirred at 50°C for 12 hours, the reaction solution was heated to 180°C and N,N-dimethylacetamide was distilled off at normal pressure, and the reaction system was heated to 220°C and stirred for 1 hour. The reaction system was cooled to 180°C and N,N-dimethylacetamide was added with a mass of 20 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane and refluxed for redissolution. The reaction solution was added dropwise into ice water with a volume of 6 times that of N,N-dimethylacetamide while hot, and stirred vigorously. The filter cake was rinsed with anhydrous ethanol and dried at 85°C in vacuum to obtain a polyetherimide polymer. The reaction equation is as follows: .

[0007] Preferably, the preparation method of the surface-modified nano hexagonal aluminum nitride is: Add nano hexagonal aluminum nitride to the reaction bottle, add isopropanol with a volume 10 times the mass of nano hexagonal aluminum nitride and γ-(methacryloyloxy)propyltrimethoxysilane with a mass of 1 / 5 the mass of nano hexagonal aluminum nitride, stir at room temperature for 4 hours, add styrene with a mass of 1 / 5 the mass of nano hexagonal aluminum nitride and dibenzoyl peroxide with a mass of 1 / 100 times the mass of nano hexagonal aluminum nitride, heat to 80℃ for 4 hours of ultrasonic reaction, filter, and slurry the filter cake with anhydrous ethanol with a volume 3 times the mass of nano hexagonal aluminum nitride for 10 minutes, filter, and rinse the filter cake with anhydrous ethanol with a volume 1 times the mass of hexagonal aluminum nitride, and dry it at 40℃ under vacuum to constant weight. The modified reaction equation is as follows: .

[0008] Preferably, the preparation method of the graft polymerization modified silicon carbide filler is: Under argon protection, add silicon carbide powder to the reaction bottle, add diethylene glycol dimethyl ether with a volume of 6 times the mass of silicon carbide powder, stir and mix for 5 minutes, add silane coupling agent KH-550 with a mass of 1 / 12 of the mass of silicon carbide powder, heat the system to an internal temperature of 95°C and react for 4 hours, filter while hot, beat the filter cake with ethanol with a volume of 3 times the mass of silicon carbide powder for 10 minutes, filter, rinse the filter cake with acetone with a volume of 2 times the mass of silicon carbide powder, drain, and vacuum dry at 100°C for 12 hours to obtain coupling agent pretreated silicon carbide powder. The reaction equation is as follows: ; Add the dried coupling agent pretreated silicon carbide powder into a dry reaction bottle protected by argon, add purified water with a volume of 6 times the mass of the coupling agent pretreated silicon carbide powder, add acrylamide with a mass of 1 / 20 times the mass of the coupling agent pretreated silicon carbide powder and ammonium cerium nitrate with a mass of 1 / 100 times the mass of the coupling agent pretreated silicon carbide powder under stirring, react at 40°C for 4h, filter while hot, beat the filter cake with ethanol with a volume of 3 times the mass of the coupling agent pretreated silicon carbide powder for 10min, filter, rinse the filter cake with acetone with a volume of 2 times the mass of the coupling agent pretreated silicon carbide powder, drain, and vacuum dry at 60°C for 12h to obtain the reaction equation as follows: Decomposition of ammonium cerium nitrate: Producing active centers: Graft polymerization: .

[0009] Preferably, the method for preparing the homemade modified mica powder filler is: Sericite powder and stearic acid (1% by weight of the sericite powder) were sequentially added into a reaction bottle, and ethanol (5 times by volume of the sericite powder) was added. The mixture was heated under reflux and stirred for 4 h, filtered, and the filter cake was dried at 50°C in vacuum until constant weight was obtained.

[0010] A method for injection molding a shell of an electronic component shell masterbatch, comprising the following steps: S1. Mix the masterbatch of the electronic component housing in a blender evenly, stir and heat to 400° C. under argon protection to melt, and obtain a molten material; S2, adding the molten material obtained in step S1 dropwise into 0°C cold water under stirring to obtain a granular material; S3, crushing the granular material obtained in step S2 with a crusher, sieving, and obtaining a powder; S4, adding the powder obtained in step S3 into the shell mold, heating and pressurizing the mold to form, and leaving it to stand and mature at room temperature.

[0011] Preferably, the sieving mesh number in step S3 is 100 meshes.

[0012] Preferably, in step S4, the mold heating temperature is 370° C., the mold pressurization pressure is 10 KPa, and the room temperature standing aging time is 12 hours.

[0013] The beneficial effects of the present invention are as follows: the present invention provides an electronic component housing masterbatch, the polyetheramide polymer has excellent insulation and heat resistance, and strong plasticity; the nano hexagonal aluminum nitride is modified, and its maximum thermal weight loss rate temperature is increased from 202.3°C before modification to 228.07°C, and it is more stable and not prone to hydrolysis; after being modified by graft polymerization, silicon carbide has more excellent dispersion stability and fluidity, and the mica powder filler has better stability and dispersibility in the masterbatch system after being modified. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is the infrared spectrum of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane.

[0015] Figure 2 This is the hydrogen nuclear magnetic resonance pattern of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane.

[0016] Figure 3 This is the infrared spectrum of polyetherimide polymer.

[0017] Figure 4 This is the thermal gravimetric curve of polyetheramide polymer.

[0018] Figure 5 This is a differential scanning calorimetry curve of polyetheramide polymer.

[0019] Figure 6 This is the infrared spectrum of nano hexagonal aluminum nitride before and after modification.

[0020] Figure 7 The thermogravimetric and differential thermogravimetric diagrams of nano hexagonal aluminum nitride before modification.

[0021] Figure 8 The thermogravimetric and differential thermogravimetric diagrams of modified nano hexagonal aluminum nitride.

[0022] Fig. 9 This is the infrared spectrum of silicon carbide powder.

[0023] Fig.10 This is the infrared spectrum of silicon carbide powder after coupling agent treatment.

[0024] Fig.11 This is the infrared spectrum of silicon carbide powder after graft coupling.

[0025] Fig.12 X-ray diffraction patterns of silicon carbide powder before and after treatment.

[0026] Fig.13 This is the infrared spectrum of stearic acid.

[0027] Fig.14 This is the infrared spectrum of sericite before modification.

[0028] Fig.15 This is the infrared spectrum of modified sericite. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The chemical reaction equations involved in the following examples are as follows: The synthesis reaction equation of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane is: The synthetic reaction equation of polyetherimide polymer is: The modification reaction equation of surface modified nano hexagonal aluminum nitride is: The synthetic reaction equation of coupling agent pre-treated silicon carbide powder is: The synthetic reaction equation of graft polymerization modified silicon carbide filler is: Decomposition of ammonium cerium nitrate: Producing active centers: Graft polymerization: . Example

[0031] Preparation of polyetherimide: Add n-butanol with a volume 10 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane into the reaction bottle, add 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and ferric chloride with a mass 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and activated carbon with a mass 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane, heat to 95°C and stir for 30 minutes, and add 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane dropwise while hot. Hydrazine hydrate with a mass of 1 times that of [4-(4-nitrophenoxy)phenyl]propane was added dropwise within 1.5 hours, and the reaction was continued at 95°C for 8 hours. The filtrate was filtered while hot, and the filtrate was concentrated under reduced pressure at 60°C to obtain 2,2'-bis[4-(4-aminophenoxy)phenyl]propane. N,N-dimethylacetamide with a mass of 6 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane was added to the reaction bottle, and 2,2'-bis[4-(4-aminophenoxy)phenyl]propane was added and stirred for 30 minutes to dissolve, and then added The mass of bisphenol A diether dianhydride was 1.25 times of the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, and N,N-dimethylacetamide was added in an amount of 3 times of the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane. The mixture was stirred at room temperature for 30 minutes under argon protection. The mass of N,N-dimethylacetamide was added in an amount of 10 times of the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, and the mixture was stirred at 50°C for 12 hours. The reaction solution was heated to 180°C and N was evaporated at normal pressure to remove ,N-dimethylacetamide, and then heat the reaction system to 220℃ and stir to react for 1h, and then heat the reaction system to 220℃ and stir to react for 1h. The reaction system is cooled to 180℃ and N,N-dimethylacetamide with a mass 20 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane is added to reflux and dissolve. The reaction solution is added dropwise to ice water with a volume 6 times that of N,N-dimethylacetamide while hot, and stirred vigorously. The filter cake is rinsed with anhydrous ethanol and dried at 85℃ in vacuum to obtain a polyetherimide polymer.

[0032] Preparation of surface modified nano hexagonal aluminum nitride: Add nano hexagonal aluminum nitride to the reaction bottle, add isopropanol with a volume 10 times the mass of nano hexagonal aluminum nitride and γ-(methacryloyloxy)propyltrimethoxysilane with a mass 1 / 5 of the mass of nano hexagonal aluminum nitride, stir at room temperature for 4 hours, add styrene with a mass 1 / 5 of the mass of nano hexagonal aluminum nitride and dibenzoyl peroxide with a mass 1 / 100 times the mass of nano hexagonal aluminum nitride, heat to 80°C for 4 hours of ultrasonic reaction, filter, and slurry the filter cake with anhydrous ethanol with a volume 3 times the mass of nano hexagonal aluminum nitride for 10 minutes, filter, and rinse the filter cake with anhydrous ethanol with a volume 1 times the mass of hexagonal aluminum nitride, and dry it at 40°C in vacuum until constant weight; The preparation method of graft polymerization modified silicon carbide filler is as follows: Under argon protection, silicon carbide powder was added to the reaction bottle, diethylene glycol dimethyl ether with a volume of 6 times the mass of silicon carbide powder was added, stirred and mixed for 5 minutes, silane coupling agent KH-550 with a mass of 1 / 12 of the mass of silicon carbide powder was added, the system was heated to an internal temperature of 95°C and reacted for 4 hours, filtered while hot, the filter cake was slurried with ethanol with a volume of 3 times the mass of silicon carbide powder for 10 minutes, filtered, the filter cake was rinsed with acetone with a volume of 2 times the mass of silicon carbide powder, dried, and vacuum dried at 100°C for 12 hours to obtain coupling agent pretreated silicon carbide powder; the dried coupling agent pretreated silicon carbide powder was The powder is added into a dry reaction bottle protected by argon, and purified water with a volume of 6 times the mass of the silicon carbide micropowder pretreated with the coupling agent is added. Under stirring, acrylamide with a mass of 1 / 20 times the mass of the silicon carbide micropowder pretreated with the coupling agent and ammonium cerium nitrate with a mass of 1 / 100 times the mass of the silicon carbide micropowder pretreated with the coupling agent are added. Stir and react at 40°C for 4 hours, filter while hot, beat the filter cake with ethanol with a volume of 3 times the mass of the silicon carbide micropowder pretreated with the coupling agent for 10 minutes, filter, rinse the filter cake with acetone with a volume of 2 times the mass of the silicon carbide micropowder pretreated with the coupling agent, dry it, and dry it in vacuum at 60°C for 12 hours.

[0033] Preparation of homemade modified mica powder filler: Sericite powder and stearic acid (1% by weight of the sericite powder) were sequentially added into a reaction bottle, and ethanol (5 times by volume of the sericite powder) was added. The mixture was heated under reflux and stirred for 4 h, filtered, and the filter cake was dried at 50°C in vacuum until constant weight was obtained.

[0034] 240g of polyetheramide, 15g of surface-modified nano hexagonal aluminum nitride, 9g of grafted polymerization modified silicon carbide filler, and 6g of homemade modified mica powder filler were added into a blender and mixed evenly. Under argon protection, the mixture was heated to 400°C for melting to obtain a molten material. The molten material was dropped into 0°C cold water under stirring to obtain a granular material. The granular material was crushed in a crusher and passed through a 100-mesh sieve to obtain a powder. The powder was added into a shell mold, the mold was heated to 360°C and pressurized to 10KPa for 10 minutes, and then allowed to stand and mature at room temperature for 12 hours. Example

[0035] Preparation of polyetherimide: Add n-butanol with a volume 10 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane into the reaction bottle, add 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and ferric chloride with a mass 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and activated carbon with a mass 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane, heat to 95°C and stir for 30 minutes, and add 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane dropwise while hot. Hydrazine hydrate with a mass of 1 times that of [4-(4-nitrophenoxy)phenyl]propane was added dropwise within 1.5 hours, and the reaction was continued at 95°C for 8 hours. The filtrate was filtered while hot, and the filtrate was concentrated under reduced pressure at 60°C to obtain 2,2'-bis[4-(4-aminophenoxy)phenyl]propane. N,N-dimethylacetamide with a mass of 6 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane was added to the reaction bottle, and 2,2'-bis[4-(4-aminophenoxy)phenyl]propane was added and stirred for 30 minutes to dissolve, and then added The mass of bisphenol A diether dianhydride was 1.25 times of the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, and N,N-dimethylacetamide was added in an amount of 3 times of the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane. The mixture was stirred at room temperature for 30 minutes under argon protection. The mass of N,N-dimethylacetamide was added in an amount of 10 times of the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, and the mixture was stirred at 50°C for 12 hours. The reaction solution was heated to 180°C and N was evaporated at normal pressure to remove ,N-dimethylacetamide, and then heat the reaction system to 220℃ and stir to react for 1h, and then heat the reaction system to 220℃ and stir to react for 1h. The reaction system is cooled to 180℃ and N,N-dimethylacetamide with a mass 20 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane is added to reflux and dissolve. The reaction solution is added dropwise to ice water with a volume 6 times that of N,N-dimethylacetamide while hot, and stirred vigorously. The filter cake is rinsed with anhydrous ethanol and dried at 85℃ in vacuum to obtain a polyetherimide polymer.

[0036] Preparation of surface modified nano hexagonal aluminum nitride: Add nano hexagonal aluminum nitride to the reaction bottle, add isopropanol with a volume 10 times the mass of nano hexagonal aluminum nitride and γ-(methacryloyloxy)propyltrimethoxysilane with a mass 1 / 5 of the mass of nano hexagonal aluminum nitride, stir at room temperature for 4 hours, add styrene with a mass 1 / 5 of the mass of nano hexagonal aluminum nitride and dibenzoyl peroxide with a mass 1 / 100 times the mass of nano hexagonal aluminum nitride, heat to 80°C for 4 hours of ultrasonic reaction, filter, and slurry the filter cake with anhydrous ethanol with a volume 3 times the mass of nano hexagonal aluminum nitride for 10 minutes, filter, and rinse the filter cake with anhydrous ethanol with a volume 1 times the mass of hexagonal aluminum nitride, and dry it at 40°C in vacuum until constant weight; The preparation method of graft polymerization modified silicon carbide filler is as follows: Under argon protection, silicon carbide powder was added to the reaction bottle, diethylene glycol dimethyl ether with a volume of 6 times the mass of silicon carbide powder was added, stirred and mixed for 5 minutes, silane coupling agent KH-550 with a mass of 1 / 12 of the mass of silicon carbide powder was added, the system was heated to an internal temperature of 95°C and reacted for 4 hours, filtered while hot, the filter cake was slurried with ethanol with a volume of 3 times the mass of silicon carbide powder for 10 minutes, filtered, the filter cake was rinsed with acetone with a volume of 2 times the mass of silicon carbide powder, dried, and vacuum dried at 100°C for 12 hours to obtain coupling agent pretreated silicon carbide powder; the dried coupling agent pretreated silicon carbide powder was The powder is added into a dry reaction bottle protected by argon, and purified water with a volume of 6 times the mass of the silicon carbide micropowder pretreated with the coupling agent is added. Under stirring, acrylamide with a mass of 1 / 20 times the mass of the silicon carbide micropowder pretreated with the coupling agent and ammonium cerium nitrate with a mass of 1 / 100 times the mass of the silicon carbide micropowder pretreated with the coupling agent are added. Stir and react at 40°C for 4 hours, filter while hot, beat the filter cake with ethanol with a volume of 3 times the mass of the silicon carbide micropowder pretreated with the coupling agent for 10 minutes, filter, rinse the filter cake with acetone with a volume of 2 times the mass of the silicon carbide micropowder pretreated with the coupling agent, dry it, and dry it in vacuum at 60°C for 12 hours.

[0037] Preparation of homemade modified mica powder filler: Sericite powder and stearic acid (1% by weight of the sericite powder) were sequentially added into a reaction bottle, and ethanol (5 times by volume of the sericite powder) was added. The mixture was heated under reflux and stirred for 4 h, filtered, and the filter cake was dried at 50°C in vacuum until constant weight was obtained.

[0038] 255g of polyetheramide, 24g of surface-modified nano hexagonal aluminum nitride, 12g of grafted polymerization modified silicon carbide filler, and 7.5g of homemade modified mica powder filler were added into a blender and mixed evenly. Under argon protection, they were stirred and heated to 400°C to melt to obtain a molten material. The molten material was dropped into 0°C cold water with stirring to obtain a granular material. The granular material was crushed in a crusher and passed through a 100-mesh sieve to obtain a powder. The powder was added into a shell mold, the mold was heated to 360°C and pressurized to 10KPa for 10 minutes, and then allowed to stand and mature at room temperature for 12 hours. Example

[0039] Preparation of polyetherimide: Add n-butanol with a volume 10 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane into the reaction bottle, add 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and ferric chloride with a mass 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and activated carbon with a mass 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane, heat to 95°C and stir for 30 minutes, and add 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane dropwise while hot. Hydrazine hydrate with a mass of 1 times that of [4-(4-nitrophenoxy)phenyl]propane was added dropwise within 1.5 hours, and the reaction was continued at 95°C for 8 hours. The filtrate was filtered while hot, and the filtrate was concentrated under reduced pressure at 60°C to obtain 2,2'-bis[4-(4-aminophenoxy)phenyl]propane. N,N-dimethylacetamide with a mass of 6 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane was added to the reaction bottle, and 2,2'-bis[4-(4-aminophenoxy)phenyl]propane was added and stirred for 30 minutes to dissolve, and then added The mass of bisphenol A type diether dianhydride is 1.25 times the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, and the mass of N,N-dimethylacetamide is 3 times the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane. Stir at room temperature for 30 minutes under argon protection. Add N,N-dimethylacetamide with a mass of 10 times the mass of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, stir at 50℃ for 12h, heat the reaction solution to 180℃ and evaporate N,N-dimethylacetamide at normal pressure. The reaction system was heated to 220°C and stirred for 1h, the reaction system was heated to 220°C and stirred for 1h, the reaction system was cooled to 180°C, N,N-dimethylacetamide with a mass 20 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane was added to reflux and dissolve, the reaction solution was added dropwise to ice water with a volume 6 times that of N,N-dimethylacetamide while hot, the filter cake was rinsed with anhydrous ethanol, and vacuum dried at 85°C to obtain a polyetherimide polymer.

[0040] Preparation of surface modified nano hexagonal aluminum nitride: Add nano hexagonal aluminum nitride to the reaction bottle, add isopropanol with a volume 10 times the mass of nano hexagonal aluminum nitride and γ-(methacryloyloxy)propyltrimethoxysilane with a mass 1 / 5 of the mass of nano hexagonal aluminum nitride, stir at room temperature for 4 hours, add styrene with a mass 1 / 5 of the mass of nano hexagonal aluminum nitride and dibenzoyl peroxide with a mass 1 / 100 times the mass of nano hexagonal aluminum nitride, heat to 80°C for 4 hours of ultrasonic reaction, filter, and slurry the filter cake with anhydrous ethanol with a volume 3 times the mass of nano hexagonal aluminum nitride for 10 minutes, filter, and rinse the filter cake with anhydrous ethanol with a volume 1 times the mass of hexagonal aluminum nitride, and dry it at 40°C in vacuum until constant weight; The preparation method of graft polymerization modified silicon carbide filler is as follows: Under argon protection, silicon carbide powder was added to the reaction bottle, diethylene glycol dimethyl ether with a volume of 6 times the mass of silicon carbide powder was added, stirred and mixed for 5 minutes, silane coupling agent KH-550 with a mass of 1 / 12 of the mass of silicon carbide powder was added, the system was heated to an internal temperature of 95°C and reacted for 4 hours, filtered while hot, the filter cake was slurried with ethanol with a volume of 3 times the mass of silicon carbide powder for 10 minutes, filtered, the filter cake was rinsed with acetone with a volume of 2 times the mass of silicon carbide powder, dried, and vacuum dried at 100°C for 12 hours to obtain coupling agent pretreated silicon carbide powder; the dried coupling agent pretreated silicon carbide powder was The powder is added into a dry reaction bottle protected by argon, and purified water with a volume of 6 times the mass of the silicon carbide micropowder pretreated with the coupling agent is added. Under stirring, acrylamide with a mass of 1 / 20 times the mass of the silicon carbide micropowder pretreated with the coupling agent and ammonium cerium nitrate with a mass of 1 / 100 times the mass of the silicon carbide micropowder pretreated with the coupling agent are added. Stir and react at 40°C for 4 hours, filter while hot, beat the filter cake with ethanol with a volume of 3 times the mass of the silicon carbide micropowder pretreated with the coupling agent for 10 minutes, filter, rinse the filter cake with acetone with a volume of 2 times the mass of the silicon carbide micropowder pretreated with the coupling agent, dry it, and dry it in vacuum at 60°C for 12 hours.

[0041] Preparation of homemade modified mica powder filler: Sericite powder and stearic acid (1% by weight of the sericite powder) were sequentially added into a reaction bottle, and ethanol (5 times by volume of the sericite powder) was added. The mixture was heated under reflux and stirred for 4 h, filtered, and the filter cake was dried at 50°C in vacuum until constant weight was obtained.

[0042] 270g of polyetheramide, 30g of surface modified nano hexagonal aluminum nitride, 15g of grafted polymerization modified silicon carbide filler and 9g of homemade modified mica powder filler were added into a blender and mixed evenly. Under argon protection, the mixture was stirred and heated to 400°C to melt to obtain a molten material. The molten material was dropped into 0°C cold water with stirring to obtain a granular material. The granular material was crushed in a crusher and passed through a 100-mesh sieve to obtain a powder. The powder was added into a shell mold, the mold was heated to 360°C and pressurized to 10KPa for 10 minutes, and then allowed to stand and mature at room temperature for 12 hours.

[0043] The shell prepared from the electronic component shell masterbatch prepared in the embodiment and the commercially available product (polyetherimide 1000) were tested for thermal conductivity, insulation, wear resistance and mechanical properties. The thermal conductivity was measured by a heat flow meter method, the dielectric strength was obtained by a short-time breakdown method, the Vicat softening temperature was measured by a thermal deformation Vicat temperature measuring instrument, the impact resistance was measured by a drop hammer impact tester, the yield elongation was measured by a tensile test using a tensile testing machine, and the Taibo wear resistance was measured by a Taibo wear resistance testing machine. The specific data results are shown in the following table: Test results: The test data show that the electronic component housing masterbatch prepared by developing new materials for polyetherimide and modifying various fillers has better melting point, tensile strength and elongation at break than the commercially available ones. At the same time, the thermal conductivity, insulation and wear resistance are also significantly improved.

[0044] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An electronic component housing masterbatch, characterized in that: The composition comprises, by weight, 80-90 parts of polyetherimide, 5-10 parts of surface-modified nano hexagonal aluminum nitride, 3-5 parts of graft polymerization-modified silicon carbide filler, and 2-3 parts of self-made modified mica powder filler.

2. The electronic component housing masterbatch according to claim 1, characterized in that: The preparation method of polyetherimide is as follows: Add n-butanol with a volume 10 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane into the reaction flask, add 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and ferric chloride with a mass 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane and activated carbon with a mass 0.1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane, heat to 95°C and stir to react for 30 minutes, add hydrazine hydrate with a volume 1 times the mass of 2,2'-bis[4-(4-nitrophenoxy)phenyl]propane dropwise while hot, control the addition to be complete within 1.5 hours, continue to react at 95°C for 8 hours, filter while hot, and concentrate the filtrate under reduced pressure at 60°C to obtain 2,2'-bis[4-(4-aminophenoxy)phenyl]propane. The reaction equation is as follows: Add N,N-dimethylacetamide with a mass of 6 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane to the reaction flask, add 2,2'-bis[4-(4-aminophenoxy)phenyl]propane and stir for 30 minutes to dissolve, add bisphenol A type diether dianhydride with a mass of 1.25 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, add N,N-dimethylacetamide with a mass of 3 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, stir at room temperature for 30 minutes under argon protection, add 2,2'-bis[4-(4-aminophenoxy)phenyl]propane and stir for 30 minutes. The reaction mixture was stirred at 50°C for 12 hours. The reaction solution was heated to 180°C and distilled off at normal pressure to remove N,N-dimethylacetamide. The reaction system was then heated to 220°C and stirred for 1 hour. The reaction system was cooled to 180°C and N,N-dimethylacetamide was added at a mass of 20 times that of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane and refluxed for redissolution. The reaction solution was added dropwise to ice water with a volume of 6 times that of N,N-dimethylacetamide while hot. The mixture was stirred vigorously. The filter cake was rinsed with anhydrous ethanol and dried at 85°C in vacuum to obtain a polyetherimide polymer. The reaction equation is as follows: 。 3. The electronic component housing masterbatch according to claim 1, characterized in that: The preparation method of the surface-modified nano hexagonal aluminum nitride is as follows: Add nano hexagonal aluminum nitride to the reaction flask, add isopropyl alcohol with a volume 10 times the mass of the nano hexagonal aluminum nitride, aluminum dihydrogen phosphate with a mass 1 / 5 the mass of the nano hexagonal aluminum nitride, and phosphoric acid with a mass 1 / 5 the mass of the nano hexagonal aluminum nitride, heat to 50 ° C and ultrasonically react for 4 hours, filter, and beat the filter cake with anhydrous ethanol with a volume 3 times the mass of the hexagonal aluminum nitride for 10 minutes under argon protection, filter, and rinse the filter cake with anhydrous ethanol with a volume 1 times the mass of the nano hexagonal aluminum nitride. Dry at 40 ° C in vacuum to constant weight. The modified reaction equation is as follows: 。 4. The electronic component housing masterbatch according to claim 1, characterized in that: The preparation method of the graft polymerization modified silicon carbide filler is: Under argon protection, silicon carbide powder was added to the reaction bottle, and diethylene glycol dimethyl ether with a volume 6 times the mass of silicon carbide powder was added and stirred for 5 minutes. A silane coupling agent KH-550 with a mass of 1 / 12 of the mass of silicon carbide powder was added. The system was heated to an internal temperature of 95°C and reacted for 4 hours. It was filtered while hot, and the filter cake was slurried with ethanol with a volume 3 times the mass of silicon carbide powder for 10 minutes. It was filtered and the filter cake was rinsed with acetone with a volume 2 times the mass of silicon carbide powder, dried, and vacuum dried at 100°C for 12 hours to obtain coupling agent pretreated silicon carbide powder. The reaction equation is as follows: ； The dried coupling agent pretreated silicon carbide micropowder was added to a dry reaction bottle protected by argon, and purified water with a volume of 6 times the mass of the coupling agent pretreated silicon carbide micropowder was added. Acrylamide with a mass of 1 / 20 times the mass of the coupling agent pretreated silicon carbide micropowder and ammonium cerium nitrate with a mass of 1 / 100 times the mass of the coupling agent pretreated silicon carbide micropowder were added under stirring. The mixture was stirred at 40°C for 4 hours, filtered while hot, and the filter cake was slurried with ethanol with a volume of 3 times the mass of the coupling agent pretreated silicon carbide micropowder for 10 minutes. The filter cake was filtered and rinsed with acetone with a volume of 2 times the mass of the coupling agent pretreated silicon carbide micropowder, dried, and vacuum dried at 60°C for 12 hours to obtain the reaction formula as follows: Decomposition of cerium ammonium nitrate: Producing active centers: Graft polymerization: 。 5. The electronic component housing masterbatch according to claim 1, characterized in that: The preparation method of the homemade modified mica powder filler is: Sericite powder and stearic acid (1% by weight of the sericite powder) were sequentially added to the reaction flask, and ethanol (5 times by volume of the sericite powder) was added. The mixture was stirred under reflux for 4 h, filtered, and the filter cake was vacuum dried at 50°C to constant weight.

6. A method for injection molding a housing of an electronic component housing masterbatch according to any one of claims 1 to 5, characterized in that: The following steps are involved: S1. Mix the masterbatch of the electronic component housing in a blender, stir and heat to 400°C under argon protection to melt, and obtain a molten material; S2. Add the molten material obtained in step S1 dropwise into 0°C cold water under stirring to obtain granular material; S3, crushing the granular material obtained in step S2 with a crusher, sieving, and obtaining a powder; S4. Add the powder obtained in step S3 into a shell mold, heat and press the mold to form it, and let it stand and mature at room temperature.

7. The method for injection molding a housing of an electronic component housing masterbatch according to claim 6, characterized in that: The mesh size of the sieve in step S3 is 100 meshes.

8. The method for injection molding a housing of an electronic component housing masterbatch according to claim 6, characterized in that: In step S4, the mold heating temperature is 370° C., the mold pressurizing pressure is 10 KPa, and the room temperature aging time is 12 hours.

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