High-thermal-conductivity and high-insulation organic silicon gel and preparation method thereof

Abstract

The invention provides a high thermal conductivity and high insulation organosilicon gel, the organosilicon gel comprises an organosilicon gel matrix and thermal conductive elastic microspheres, the thermal conductive elastic microspheres comprise expansion thermal conductive organosilicon elastic microspheres and fiber modified thermal conductive organosilicon elastic microspheres; the organic silicon gel matrix comprises a component A and a component B. The component A comprises the following components in parts by weight: 100 parts of vinyl silicone oil, 5-10 parts of hydrogen-containing silicone oil and 0.1-0.5 part of an inhibitor; and the component B comprises the following components in parts by weight: 100 parts of vinyl silicone oil and 0.1-1 part of catalyst. The heat conduction effect of the high-heat-conduction and high-insulation organic silicon gel can be responsively adjusted under different environment temperature conditions.

Description

Technical Field

[0001] The invention relates to the field of organic silicone gel, and in particular to a high thermal conductivity and high insulation organic silicone gel and a preparation method thereof. Background Art

[0002] While modern electronic devices are constantly developing towards high integration and high power, their size is tending to be smaller and lighter. The contradiction between the rapid accumulation of heat caused by high integration and high power and the small heat dissipation space has become an obstacle to the operation of electronic equipment. The heat dissipation problem has gradually become one of the shortcomings restricting the development of the industry. According to Moore's law of heat, the reliability of electronic components decreases by 10% for every 2°C increase in temperature. Dissipating the accumulated heat as quickly as possible, extending the service life of the product, and improving the use value of the product is one of the directions worthy of in-depth exploration. As a polymer matrix, silicone exhibits better flexibility, corrosion resistance and aging resistance, making it widely used in the field of electronic packaging. Currently, the common silicone-based thermal interface materials on the market are mainly three types: thermal pads, thermal grease and thermal gel. Among them, thermal gel, as a gel-like thermal conductive material, has attracted much attention because of its convenience and high efficiency. This material can be easily extruded through a dispensing machine, is not limited by the shape and size of electronic devices, and can effectively fill the tiny gaps between heating devices and heat dissipation devices. In addition, the thermal gel can be vulcanized at room temperature, or the heat emitted by the chip can be used for vulcanization during work, which also makes the thermal gel have a lower oil permeability, thereby ensuring that it maintains a more stable performance during use. As a thermal insulation material, silicone matrix usually adds thermal conductive fillers to improve its thermal conductivity. Silicon carbide, alumina and other inorganic fillers have become widely used thermal conductive fillers in industry due to their excellent insulation and thermal conductivity. However, there are significant differences in properties between silicone matrix and inorganic fillers, making improving the compatibility of the two the key to preparing new thermal conductive fillers. In addition, the thermal conductivity of silicone gel is fixed at a constant temperature, but when electronic equipment is used, the temperature gradually rises over time, and the thermal conductivity of silicone gel needs to be improved accordingly. Summary of the invention

[0003] Technical problem to be solved: The purpose of the present invention is to provide a high thermal conductivity and high insulation silicone gel, whose thermal conductivity effect is adjustable under different ambient temperature conditions.

[0004] Technical solution: A highly thermally conductive and highly insulating silicone gel, the silicone gel comprises a silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres include expanded thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; the silicone gel matrix comprises two components, A and B, in parts by weight, wherein component A is: 100 parts of vinyl silicone oil, 5-10 parts of hydrogenated silicone oil, and 0.1-0.5 parts of inhibitor; component B is: 100 parts of vinyl silicone oil and 0.1-1 parts of catalyst. In one embodiment, the mass ratio of the expanded thermally conductive silicone elastic microspheres, the fiber-modified thermally conductive silicone elastic microspheres, and the silicone gel matrix is ​​0.5-1:2-4:15-20. In one embodiment, the viscosity of the vinyl silicone oil is 1000-10000 mPa·s, the viscosity of the hydrogen-containing silicone oil is 100-800 mPa·s, and the mass percentage of H content in silicon-hydrogen is 0.35-0.8%. The present invention also provides a method for preparing a high thermal conductivity and high insulation organic silicone gel, comprising the following steps: S1. Provide expanded thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the fiber-modified thermally conductive silicone elastomer microspheres to component B and mixing evenly to obtain a mixed component B; S4. Mix the mixed components A and B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. In one embodiment, the expandable thermally conductive silicone elastic microspheres are prepared by a method comprising the following steps: S11. Sodium lauryl sulfate and polyvinyl pyrrolidone are added to water, mixed and stirred to obtain an aqueous phase; S12. adding the liquid alkane to the aqueous phase, mixing and stirring at high speed to obtain a suspension; S13. Add vinyl silicone oil, hydrogen silicone oil, chloroplatinic acid, nano thermal conductive particles and n-hexane into the suspension, continue to mix and stir at high speed for emulsification, then reduce the speed to react at room temperature, finally increase the temperature to react, filter and dry, and obtain white elastic powder, i.e., expanded thermal conductive silicone elastic microspheres. In one embodiment, the fiber-modified thermally conductive silicone elastomer microspheres are prepared by a method comprising the following steps: S21. The carbon fiber is chopped and added to anhydrous ethanol for ultrasonic dispersion, and then vinyl tri(β-methoxyethoxy) silane is added, and the temperature is raised with stirring until the ethanol evaporates to obtain modified chopped carbon fiber; S22. Add the modified chopped carbon fiber into water containing a surfactant, and after uniform ultrasonic dispersion, add vinyl silicone oil and branched low-hydrogen silicone oil into the aqueous dispersion of the modified chopped carbon fiber. After homogenization, add chloroplatinic acid dropwise, heat and stir to react, and obtain silicone elastic microspheres with carbon fiber coated on the surface. In one embodiment, in the preparation of expanded thermally conductive silicone elastic microspheres, in the step S11, the concentration of sodium dodecyl sulfate in the aqueous phase is 0.5-0.8wt%, and the concentration of polyvinyl pyrrolidone in the aqueous phase is 0.1-0.2wt%; and / or, in the step S12, the volume ratio of liquid alkane to aqueous phase is 5-8:100, the stirring speed is 500-2000r / min, and the stirring time is 20-40min; and / or, in the step S13, the mass ratio of vinyl silicone oil, hydrogenated silicone oil, chloroplatinic acid, nano thermally conductive particles and n-hexane is 10:0.5-1:0.3-0.5:2-3:1-2, the temperature of the temperature rise reaction is 40-50°C, and the temperature rise reaction time is 2-20h. In one embodiment, in the fiber-modified thermally conductive silicone elastomer microspheres, in step S21, the mass ratio of the carbon fiber to vinyl tri(β-methoxyethoxy)silane is 3 to 5:1; and / or, In the step S22, the mass ratio of the modified chopped carbon fiber, vinyl silicone oil, branched low hydrogen silicone oil and chloroplatinic acid is 1.5-2.5:10-15:0.5-1.2:0.1-0.5; and / or, In the step S23, the homogenization speed of the homogenization reaction is 5000-8000 r / min, the time is 1-2 min, the temperature of the heating and stirring reaction is 40-50° C., and the heating reaction time is 2-20 h. In one embodiment, the thermally conductive nanoparticles include any one or more of nano-silicon carbide, nano-aluminum oxide, or nano-zinc oxide. Beneficial effects: The high thermal conductivity and high insulation organic silicone gel of the present invention has the following advantages: 1. In the present invention, the thermal conductive filler is loaded in the organic silicon elastic microsphere and then added to the organic silicon gel. The organic silicon elastic microsphere includes two elastic microspheres with different functions. One elastic microsphere is coated with liquid alkane. The liquid alkane is liquid at room temperature, but in the case of heating, the liquid alkane is gaseous. The elastic microsphere that becomes gaseous will expand. The surface of the other elastic microsphere is coated with carbon fiber. The carbon fiber is like a thorn ball. After heating, the expanded elastic microsphere expands in the silicone gel. The thermal conductive particles on the surface of the expanded elastic microsphere can form a heat conduction with the carbon fiber on the surface of the other elastic microsphere. Under higher temperature conditions, it has a better thermal conductivity effect than under normal temperature conditions; 2. In the present invention, the thermally conductive filler is loaded through the silicone elastic microspheres, so that the thermally conductive particles can be better dispersed in the silicone gel, thereby improving the thermal conductivity of the silicone gel. DETAILED DESCRIPTION The present invention will be further described below in conjunction with embodiments, which are explanations of the present invention and are not limited to the following embodiments: Example 1 The expandable thermally conductive silicone elastic microspheres are prepared by a method comprising the following steps: S11. Sodium lauryl sulfate and polyvinyl pyrrolidone were added to water, mixed and stirred to obtain an aqueous phase, wherein the concentration of sodium lauryl sulfate in the aqueous phase was 0.5wt%, and the concentration of polyvinyl pyrrolidone in the aqueous phase was 0.1wt%; S12. The liquid alkane - isopentane was added to the aqueous phase, the volume ratio of the liquid alkane to the aqueous phase was 5:100, and the mixture was mixed and stirred at a high speed of 500 r / min for 40 min to obtain a suspension; S13. Add vinyl silicone oil, hydrogen-containing silicone oil, chloroplatinic acid, nano-alumina and n-hexane into the suspension, wherein the viscosity of the vinyl silicone oil is 8000 mPa·s, the viscosity of the hydrogen-containing silicone oil is 500 mPa·s, the mass percentage of silicon hydrogen content is 0.48%, and the mass ratio of the vinyl silicone oil, hydrogen-containing silicone oil, chloroplatinic acid, nano-thermal conductive particles and n-hexane is 10:0.5:0.3:2:1. Continue to mix and stir at high speed for emulsification, then reduce the speed to 100 r / min and react at room temperature, finally heat the reaction at 40°C and for 20 hours, filter and dry to obtain a white elastic powder, i.e., expanded thermally conductive silicone elastic microspheres. Example 2 The expandable thermally conductive silicone elastic microspheres are prepared by a method comprising the following steps: S11. Sodium lauryl sulfate and polyvinyl pyrrolidone were added to water, mixed and stirred to obtain an aqueous phase, wherein the concentration of sodium lauryl sulfate in the aqueous phase was 0.8wt%, and the concentration of polyvinyl pyrrolidone in the aqueous phase was 0.2wt%; S12. The liquid alkane - isopentane was added to the aqueous phase, the volume ratio of the liquid alkane to the aqueous phase was 8:100, and the mixture was mixed and stirred at a high speed of 2000 r / min for 20 min to obtain a suspension; S13. Add vinyl silicone oil, hydrogen-containing silicone oil, chloroplatinic acid, nano silicon carbide and n-hexane into the suspension, wherein the viscosity of the vinyl silicone oil is 8000 mPa·s, the viscosity of the hydrogen-containing silicone oil is 500 mPa·s, the mass percentage of silicon hydrogen content is 0.48%, and the mass ratio of the vinyl silicone oil, hydrogen-containing silicone oil, chloroplatinic acid, nano thermal conductive particles and n-hexane is 10:1:0.5:3:2. Continue to mix and stir at high speed for emulsification, then reduce the speed to 100 r / min and react at room temperature, finally heat the reaction at 50°C for 8 hours, filter and dry to obtain a white elastic powder, i.e., expanded thermal conductive silicone elastic microspheres. Example 3 The expandable thermally conductive silicone elastic microspheres are prepared by a method comprising the following steps: S11. Sodium lauryl sulfate and polyvinyl pyrrolidone were added to water, mixed and stirred to obtain an aqueous phase, the concentration of sodium lauryl sulfate in the aqueous phase was 0.6 t%, and the concentration of polyvinyl pyrrolidone in the aqueous phase was 0.15 wt%; S12. The liquid alkane - isopentane was added to the aqueous phase, the volume ratio of the liquid alkane to the aqueous phase was 7:100, and the mixture was mixed and stirred at a high speed of 1000 r / min for 30 min to obtain a suspension; S13. Add vinyl silicone oil, hydrogen-containing silicone oil, chloroplatinic acid, nano silicon carbide and n-hexane into the suspension, wherein the viscosity of the vinyl silicone oil is 8000 mPa·s, the viscosity of the hydrogen-containing silicone oil is 500 mPa·s, the mass percentage of silicon hydrogen content is 0.6%, and the mass ratio of the vinyl silicone oil, hydrogen-containing silicone oil, chloroplatinic acid, nano thermally conductive particles and n-hexane is 10:0.8:0.4:2.5:1.2. Continue to mix and stir at high speed for emulsification, then reduce the speed to 100 r / min and react at room temperature, finally heat the reaction at 45°C and for 15 hours, filter and dry to obtain a white elastic powder, i.e., expanded thermally conductive silicone elastic microspheres. Expandable thermal conductive silicone elastic microsphere particle size / um Example 1 658.9 Example 2 556.4 Example 3 602.1 Example 4 The fiber-modified thermally conductive silicone elastomer microspheres are prepared by a method comprising the following steps: S21. The carbon fiber is chopped into 100-500 um and then added to anhydrous ethanol for ultrasonic dispersion, and then vinyl tri(β-methoxyethoxy) silane is added, the mass ratio of carbon fiber to vinyl tri(β-methoxyethoxy) silane is 5:1, and the mixture is stirred and heated to react until the ethanol evaporates to obtain modified chopped carbon fiber; S22. Add the modified chopped carbon fiber into water containing a surfactant, and disperse it evenly by ultrasonication. Then, add vinyl silicone oil and branched low-hydrogen silicone oil into the aqueous dispersion of the modified chopped fibers for homogeneous reaction. Then, add chloroplatinic acid dropwise. The viscosity of the vinyl silicone oil is 8000 mPa·s, and the viscosity of the hydrogen-containing silicone oil is 300 mPa·s. The mass percentage of H content of silicon hydrogen is 0.45%. The mass ratio of the modified chopped carbon fiber, vinyl silicone oil, branched low-hydrogen silicone oil and chloroplatinic acid is 1.5:10:0.5:0.1. Heat and stir to react. The temperature of the heated and stirred reaction is 40°C. The heated reaction time is 18 hours to obtain silicone elastic microspheres with carbon fiber surface coating. Example 5 The fiber-modified thermally conductive silicone elastomer microspheres are prepared by a method comprising the following steps: S21. The carbon fiber is chopped into 100-500 um and then added to anhydrous ethanol for ultrasonic dispersion, and then vinyl tri(β-methoxyethoxy) silane is added, the mass ratio of carbon fiber to vinyl tri(β-methoxyethoxy) silane is 3:1, and the temperature is raised to react with stirring until the ethanol evaporates to obtain modified chopped carbon fiber; S22. Add the modified chopped carbon fiber into water containing a surfactant, and disperse it evenly by ultrasonication. Then, add vinyl silicone oil and branched low-hydrogen silicone oil into the aqueous dispersion of the modified chopped fibers for homogeneous reaction. Then, add chloroplatinic acid dropwise. The viscosity of the vinyl silicone oil is 8000 mPa·s, and the viscosity of the hydrogen-containing silicone oil is 300 mPa·s. The mass percentage of H content of silicon hydrogen is 0.45%. The mass ratio of the modified chopped carbon fiber, vinyl silicone oil, branched low-hydrogen silicone oil and chloroplatinic acid is 2.5:15:1.2:0.5. Heat and stir to react. The temperature of the heated and stirred reaction is 50°C. The heating reaction time is 12 hours to obtain silicone elastic microspheres with carbon fiber surface coating. Example 6 The fiber-modified thermally conductive silicone elastomer microspheres are prepared by a method comprising the following steps: S21. The carbon fiber is chopped into 100 to 500 μm and then added to anhydrous ethanol for ultrasonic dispersion, and then vinyl tri(β-methoxyethoxy) silane is added, the mass ratio of carbon fiber to vinyl tri(β-methoxyethoxy) silane is 4:1, and the mixture is stirred and heated to react until the ethanol evaporates to obtain modified chopped carbon fiber; S22. Add the modified chopped carbon fiber into water containing a surfactant, and disperse it evenly by ultrasonication. Then, add vinyl silicone oil and branched low-hydrogen silicone oil into the aqueous dispersion of the modified chopped fibers for homogeneous reaction. Then, add chloroplatinic acid dropwise. The viscosity of the vinyl silicone oil is 8000 mPa·s, and the viscosity of the hydrogen-containing silicone oil is 300 mPa·s. The mass percentage of H content of silicon hydrogen is 0.45%. The mass ratio of the modified chopped carbon fiber, vinyl silicone oil, branched low-hydrogen silicone oil and chloroplatinic acid is 2:14:0.8:0.2. Heat and stir to react. The temperature of the heated and stirred reaction is 45°C. The heated reaction time is 10 hours to obtain silicone elastic microspheres with carbon fiber surface coating. Expandable thermal conductive silicone elastic microsphere particle size / um Example 4 456.9 Example 5 499.2 Example 6 485.6 Example 7 A highly thermally conductive and highly insulating organic silicone gel, the organic silicone gel comprising an organic silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres comprising the expanded thermally conductive organic silicone elastic microspheres prepared in Example 1 and the fiber-modified thermally conductive organic silicone elastic microspheres prepared in Example 4; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres, the fiber-modified thermally conductive organic silicone elastic microspheres and the organic silicone gel matrix is ​​0.5:2:15, the organic silicone gel matrix comprises two components A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, 5 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.35%, and 0.5 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, and 0.2 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide expanded thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the fiber-modified thermally conductive silicone elastomer microspheres to component B and mixing evenly to obtain a mixed component B; S4. Mix the mixed components A and B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. Example 8 A highly thermally conductive and highly insulating organic silicone gel, the organic silicone gel comprising an organic silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres comprising the expanded thermally conductive organic silicone elastic microspheres prepared in Example 2 and the fiber-modified thermally conductive organic silicone elastic microspheres prepared in Example 5; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres, the fiber-modified thermally conductive organic silicone elastic microspheres and the organic silicone gel matrix is ​​1:4:20, the organic silicone gel matrix comprises two components A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, 10 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.8%, and 0.1 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, and 0.1 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide expanded thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the fiber-modified thermally conductive silicone elastomer microspheres to component B and mixing evenly to obtain a mixed component B; S4. Mix the mixed components A and B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. Example 9 A highly thermally conductive and highly insulating organic silicone gel, the organic silicone gel comprising an organic silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres comprising the expanded thermally conductive organic silicone elastic microspheres prepared in Example 3 and the fiber-modified thermally conductive organic silicone elastic microspheres prepared in Example 6; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres, the fiber-modified thermally conductive organic silicone elastic microspheres and the organic silicone gel matrix is ​​0.8:3:18, the organic silicone gel matrix comprises two components A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, 8 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.5%, and 0.3 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, and 0.6 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide expanded thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the fiber-modified thermally conductive silicone elastomer microspheres to component B and mixing evenly to obtain a mixed component B; S4. Mix the mixed components A and B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. Comparative Example 1 A high thermal conductivity and high insulation organic silicon gel, the organic silicon gel comprises an organic silicon gel matrix, carbon fiber, and nano silicon carbide, the mass ratio of the carbon fiber, nano silicon carbide and the organic silicon gel matrix is ​​0.5:1.5:18, the organic silicon gel matrix comprises two components A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000mPa·s, 8 parts of hydrogenated silicone oil with a viscosity of 800mPa·s, the mass percentage of H content of silicon hydrogen is 0.5%, and 0.3 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000mPa·s, and 0.6 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Adding carbon fiber to component A and mixing evenly to obtain a mixed component A; S2. Adding nano-silicon carbide to component B and mixing evenly to obtain a mixed component B; S3. Mix the mixed components A and B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. Comparative Example 2 A highly thermally conductive and highly insulating organic silicone gel, the organic silicone gel comprising an organic silicone gel matrix, carbon fibers and expanded thermally conductive organic silicone elastic microspheres prepared in Example 3; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres, the carbon fibers and the organic silicone gel matrix is ​​0.8:1.5:18, the organic silicone gel matrix comprises two components A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, 8 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.5%, and 0.3 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, and 0.6 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide expandable thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the carbon fiber to component B and mixing evenly to obtain a mixed component B; S4. Mix the mixed components A and B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. Comparative Example 3 A high thermal conductivity and high insulation organic silicone gel, the organic silicone gel comprises an organic silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres comprise thermally conductive organic silicone elastic microspheres and fiber-modified thermally conductive organic silicone elastic microspheres prepared in Example 5; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres, the fiber-modified thermally conductive organic silicone elastic microspheres and the organic silicone gel matrix is ​​1:4:20, the organic silicone gel matrix comprises two components A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, 10 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.8%, and 0.1 part of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, and 0.1 part of chloroplatinic acid; the preparation method of the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the fiber-modified thermally conductive silicone elastomer microspheres to component B and mixing evenly to obtain a mixed component B; S4. The mixed components A and B are mixed in a mass ratio of 1:1, and then subjected to an addition cross-linking reaction to obtain a silicone gel; The thermally conductive silicone elastic microspheres are prepared by a method comprising the following steps: S11. Add nano-silicon carbide to water containing a surfactant and disperse it evenly by ultrasonication; S12. Add vinyl silicone oil, hydrogenated silicone oil and chloroplatinic acid into the suspension, wherein the viscosity of the vinyl silicone oil is 8000 mPa·s, the viscosity of the hydrogenated silicone oil is 500 mPa·s, the mass percentage of silicon hydrogen content is 0.6%, and the mass ratio of the vinyl silicone oil, hydrogenated silicone oil, chloroplatinic acid and nano thermal conductive particles is 10:0.9:0.5:2. Continue to mix and stir at high speed for emulsification, then reduce the speed to 100 r / min and react at room temperature, finally heat the reaction at 45°C and for 15 hours, filter and dry to obtain a white elastic powder, i.e., thermally conductive silicone elastic microspheres. Comparative Example 4 A highly thermally conductive and highly insulating organic silicone gel, the organic silicone gel comprising an organic silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres being the expanded thermally conductive organic silicone elastic microspheres prepared in Example 3; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres to the organic silicone gel matrix being 2.8:18, the organic silicone gel matrix comprising two components, A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, 8 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.5%, and 0.3 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, and 0.6 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide expandable thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Mixing component B evenly to obtain component B; S4. Mix component A and component B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. Comparative Example 5 A highly thermally conductive and highly insulating organic silicone gel, the organic silicone gel comprising an organic silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres being the expanded thermally conductive organic silicone elastic microspheres prepared in Example 3; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres to the organic silicone gel matrix being 4:18, the organic silicone gel matrix comprising two components, A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, 8 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.5%, and 0.3 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, and 0.6 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide expandable thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Mixing component B evenly to obtain component B; S4. Mix component A and component B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. Comparative Example 6 A highly thermally conductive and highly insulating organic silicone gel, the organic silicone gel comprising an organic silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres comprising the expanded thermally conductive organic silicone elastic microspheres prepared in Example 3 and the fiber-modified thermally conductive organic silicone elastic microspheres prepared in Example 6; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres, the fiber-modified thermally conductive organic silicone elastic microspheres and the organic silicone gel matrix is ​​0.8:3:18, the organic silicone gel matrix comprises two components A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 15000 mPa·s, 8 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.5%, and 0.3 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 15000 mPa·s, and 0.6 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide expanded thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the fiber-modified thermally conductive silicone elastomer microspheres to component B and mixing evenly to obtain a mixed component B; S4. Mix the mixed components A and B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel. Comparative Example 7 A highly thermally conductive and highly insulating organic silicone gel, the organic silicone gel comprising an organic silicone gel matrix and thermally conductive elastic microspheres, the thermally conductive elastic microspheres comprising the expanded thermally conductive organic silicone elastic microspheres and fiber-modified thermally conductive organic silicone elastic microspheres prepared in Example 3; the mass ratio of the expanded thermally conductive organic silicone elastic microspheres, the fiber-modified thermally conductive organic silicone elastic microspheres and the organic silicone gel matrix is ​​0.8:3:18, the organic silicone gel matrix comprises two components A and B, in parts by weight, wherein component A comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, 8 parts of hydrogenated silicone oil with a viscosity of 800 mPa·s, the mass percentage of H content of silicon hydrogen being 0.5%, and 0.3 parts of 3-methyl-1-butyn-3-ol; component B comprises: 100 parts of vinyl silicone oil with a viscosity of 8000 mPa·s, and 0.6 parts of chloroplatinic acid; The method for preparing the above-mentioned high thermal conductivity and high insulation organic silicone gel comprises the following steps: S1. Provide expanded thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the fiber-modified thermally conductive silicone elastomer microspheres to component B and mixing evenly to obtain a mixed component B; S4. The mixed components A and B are mixed in a mass ratio of 1:1, and then subjected to an addition cross-linking reaction to obtain a silicone gel; The fiber-modified thermally conductive silicone elastomer microspheres are prepared by a method comprising the following steps: The modified short carbon fiber is added to water containing a surfactant, and after ultrasonic dispersion, vinyl silicone oil and hydrogen-containing silicone oil are added to the aqueous dispersion of the modified short carbon fiber for homogeneous reaction, and then chloroplatinic acid is added dropwise. The viscosity of the vinyl silicone oil is 8000mPa·s, the viscosity of the hydrogen-containing silicone oil is 300mPa·s, and the mass percentage of H content of silicon hydrogen is 0.45%. The mass ratio of the modified short carbon fiber, vinyl silicone oil, hydrogen-containing silicone oil and chloroplatinic acid is 2:14:0.8:0.2. The temperature is raised and stirred for reaction. The temperature of the temperature-raising and stirring reaction is 45°C, and the temperature-raising reaction time is 10 hours to obtain silicone elastic microspheres with carbon fiber surface coating. Performance Test: High temperature resistance test: According to the cone penetration test method for lubricating grease and petroleum grease in GB / T 269-2023, the silicone gel obtained in the embodiment and the comparative example was placed under 100°C / 200°C conditions, and the cone penetration of the silicone gel was tested at regular intervals. The high temperature resistance of the silicone gel was characterized by the change in the cone penetration of the silicone gel under a long-term high temperature environment. The results are shown in the following table: According to GB / T 1409-2006, the electrical properties of the samples in the embodiments and comparative examples were tested to obtain their respective volume resistivities. The results are shown in the following table: Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A high thermal conductivity and high insulation silicone gel, characterized by: The organic silicone gel is composed of an organic silicone gel matrix and thermally conductive elastic microspheres, wherein the thermally conductive elastic microspheres include expanded thermally conductive organic silicone elastic microspheres and fiber-modified thermally conductive organic silicone elastic microspheres; the organic silicone gel matrix includes two components, A and B, in parts by weight, wherein component A is: 100 parts of vinyl silicone oil, 5-10 parts of hydrogenated silicone oil, and 0.1-0.5 parts of inhibitor; component B is: 100 parts of vinyl silicone oil and 0.1-1 parts of catalyst.

2. The high thermal conductivity and high insulation organic silicone gel according to claim 1, characterized in that: The mass ratio of the expanded thermally conductive organic silicon elastic microspheres, the fiber-modified thermally conductive organic silicon elastic microspheres and the organic silicon gel matrix is ​​0.5-1:2-4:15-20.

3. The high thermal conductivity and high insulation organic silicone gel according to claim 1, characterized in that: The viscosity of the vinyl silicone oil is 1000-10000 mPa·s, the viscosity of the hydrogen-containing silicone oil is 100-800 mPa·s, and the mass percentage of H content in silicon-hydrogen is 0.35-0.8%.

4. A method for preparing a high thermal conductivity and high insulation organic silicone gel as claimed in claim 1 or 2, characterized in that: The following steps are involved: S1. Provide expanded thermally conductive silicone elastic microspheres and fiber-modified thermally conductive silicone elastic microspheres; S2. The expanded thermally conductive silicone elastic microspheres are added to component A and mixed evenly to obtain a mixed component A; S3. Adding the fiber-modified thermally conductive silicone elastomer microspheres to component B and mixing evenly to obtain a mixed component B; S4. Mix the mixed components A and B in a mass ratio of 1:1, and then perform an addition cross-linking reaction to obtain a silicone gel.

5. The method for preparing the high thermal conductivity and high insulation organic silicone gel according to claim 4, characterized in that: The expandable thermally conductive silicone elastic microspheres are prepared by a method comprising the following steps: S11. Sodium lauryl sulfate and polyvinyl pyrrolidone are added to water, mixed and stirred to obtain an aqueous phase; S12. adding the liquid alkane to the aqueous phase, mixing and stirring at high speed to obtain a suspension; S13. Add vinyl silicone oil, hydrogen silicone oil, chloroplatinic acid, nano thermal conductive particles and n-hexane into the suspension, continue to mix and stir at high speed for emulsification, then reduce the speed to react at room temperature, finally increase the temperature to react, filter and dry, and obtain white elastic powder, i.e., expanded thermal conductive silicone elastic microspheres.

6. The method for preparing the high thermal conductivity and high insulation silicone gel according to claim 4, characterized in that: The fiber-modified thermally conductive silicone elastomer microspheres are prepared by a method comprising the following steps: S21. The carbon fiber is chopped and added to anhydrous ethanol for ultrasonic dispersion, and then vinyl tri(β-methoxyethoxy) silane is added, and the temperature is raised with stirring until the ethanol evaporates to obtain modified chopped carbon fiber; S22. Add the modified chopped carbon fiber into water containing a surfactant, and after uniform ultrasonic dispersion, add vinyl silicone oil and branched low-hydrogen silicone oil into the aqueous dispersion of the modified chopped carbon fiber. After homogenization, add chloroplatinic acid dropwise, heat and stir to react, and obtain silicone elastic microspheres with carbon fiber coated on the surface.

7. The method for preparing the high thermal conductivity and high insulation organic silicone gel according to claim 5, characterized in that: In the step S11 of preparing the expandable thermally conductive silicone elastic microspheres, the concentration of the sodium dodecyl sulfate in the aqueous phase is 0.5-0.8 wt %, and the concentration of the polyvinyl pyrrolidone in the aqueous phase is 0.1-0.2 wt %; and / or, In step S12, the volume ratio of liquid alkane to water phase is 5 to 8:100, the stirring speed is 500 to 2000 r / min, and the stirring time is 20 to 40 min; and / or, In the step S13, the mass ratio of vinyl silicone oil, hydrogenated silicone oil, chloroplatinic acid, nano thermal conductive particles and n-hexane is 10:0.5-1:0.3-0.5:2-3:1-2, the temperature of the temperature-raising reaction is 40-50°C, and the time of the temperature-raising reaction is 2-20 hours.

8. The method for preparing the high thermal conductivity and high insulation organic silicone gel according to claim 6, characterized in that: The fiber-modified thermally conductive silicone elastomer microspheres, in the step S21, the mass ratio of the carbon fiber to vinyl tri(β-methoxyethoxy)silane is 3 to 5:1; and / or, In the step S22, the mass ratio of the modified chopped carbon fiber, vinyl silicone oil, branched low hydrogen silicone oil and chloroplatinic acid is 1.5-2.5:10-15:0.5-1.2:0.1-0.5; and / or, In the step S23, the homogenization speed of the homogenization reaction is 5000-8000 r / min, the time is 1-2 min, the temperature of the heating and stirring reaction is 40-50° C., and the heating reaction time is 2-20 h.

9. The method for preparing the high thermal conductivity and high insulation organic silicone gel according to claim 5, characterized in that: The nano thermally conductive particles include any one or more of nano silicon carbide, nano aluminum oxide or nano zinc oxide.

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