LED carrier plate and display device

Abstract

The invention provides an LED carrier plate and a display device, and relates to the technical field of LED display. The LED carrier plate comprises a plurality of splicing heads and a plurality of splicing grooves, the splicing heads and the splicing grooves are distributed along the width edge of the LED carrier plate, the splicing head of any LED carrier plate is used for being spliced with the splicing groove of another to-be-spliced LED carrier plate, and the splicing head of any LED carrier plate is used for being spliced with the splicing groove of the other to-be-spliced LED carrier plate. The splicing groove of any LED carrier plate is used for being spliced with the splicing head of another to-be-spliced LED carrier plate; the LED support plate comprises a support plate base layer and a thick copper layer, the thick copper layer is fixed on the support plate base layer, the splicing head is formed by the width edge of the support plate base layer and / or the width edge of the thick copper layer, and the splicing groove is formed by the width edge of the support plate base layer and / or the width edge of the thick copper layer. According to the invention, the splicing stability of the LED support plate can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED display, and in particular to an LED carrier board and a display device. Background Art

[0002] The LED substrate is the basic supporting structure of the light-emitting diode chip, which is used to carry, support and dissipate heat of the LED light-emitting body (or LED light-emitting unit, LED lamp bead). The choice of LED substrate will affect the brightness, service life and stability of the LED product. Especially in the field of high-power LEDs, high-performance substrate materials play an important role in improving heat dissipation and extending product life.

[0003] Due to the limitations of existing PCB production processes and equipment, the size of a single LED carrier is limited. If a large display device that exceeds the length of a single LED carrier needs to be realized, multiple LED carriers must be spliced. However, since LED carriers are usually designed to be large and thin, they are easily bent or even broken due to slight external force or their own gravity during splicing, especially at the splicing joints. This structural instability will affect the electrical connection between LED carriers, resulting in unstable electrical performance, and even signal interruption, uneven brightness and other problems, thereby affecting the LED display effect. Summary of the invention

[0004] The problem solved by the present invention is how to improve the stability of LED carrier board splicing.

[0005] In order to solve the above problems, the present invention provides an LED carrier board and a display device.

[0006] In the first aspect, the present invention provides an LED carrier board, comprising a plurality of splicing joints and a plurality of splicing grooves, wherein the plurality of splicing joints and the plurality of splicing grooves are distributed along the width edge of the LED carrier board, the splicing joint of any one of the LED carrier boards is used for splicing with the splicing groove of another one of the LED carrier boards to be spliced, and the splicing groove of any one of the LED carrier boards is used for splicing with the splicing joint of another one of the LED carrier boards to be spliced; the LED carrier board comprises a carrier base layer and a thick copper layer, wherein the thick copper layer is fixed on the carrier base layer, the splicing joint is formed by the width edge of the carrier base layer and / or the width edge of the thick copper layer, and the splicing groove is formed by the width edge of the carrier base layer and / or the width edge of the thick copper layer.

[0007] Optionally, the splicing joint includes a first splicing piece formed by the width edge of the carrier base layer and a second splicing piece formed by the width edge of the thick copper layer, the splicing groove includes a third splicing piece formed by the width edge of the carrier base layer and a fourth splicing piece formed by the width edge of the thick copper layer, the first splicing piece of any LED carrier is used for splicing with the third splicing piece of another LED carrier to be spliced, and the second splicing piece of any LED carrier is used for splicing with the fourth splicing piece of another LED carrier to be spliced.

[0008] Optionally, the LED carrier board further includes a first connecting member, and the first connecting member is respectively connected to the second splicing member of any one of the LED carrier boards and the fourth splicing member of another LED carrier board to be spliced.

[0009] Optionally, the first connecting member is a conductive material, and includes a first connecting segment, a second connecting segment, and a third connecting segment that are fixedly connected in sequence, the first connecting segment is used to be embedded in a first groove set in the second splicing piece of any one of the LED carrier boards, and the third connecting segment is used to be embedded in a second groove set in the fourth splicing piece of another LED carrier board to be spliced.

[0010] Optionally, the end of the second splicing piece is stepped, and the end of the fourth splicing piece is stepped to match the shape of the end of the second splicing piece. The second splicing piece of any LED carrier board and the fourth splicing piece of another LED carrier board to be spliced ​​are used to match each other through steps for splicing.

[0011] Optionally, when the splicing joint of any LED carrier board is spliced ​​with the splicing groove of another LED carrier board to be spliced, a gap for filling solder is provided between the thick copper layer of the LED carrier board and the thick copper layer of another LED carrier board to be spliced.

[0012] Optionally, the sum of the length of the first assembling piece and the length of the third assembling piece is equal to the sum of the length of the second assembling piece, the length of the fourth assembling piece and the width of the gap.

[0013] Optionally, the solder includes flux and conductive solder, and the solder is used for electrical connection between the thick copper layer of any one of the LED carrier boards and the thick copper layer of another of the LED carrier boards to be spliced.

[0014] Optionally, the second splicing piece includes a first island area, and the fourth splicing piece includes a second island area. When the second splicing piece of any LED carrier board is spliced ​​with the fourth splicing piece of another LED carrier board to be spliced, the first island area and the second island area are spliced ​​to form an island area, and the gap is located in the island area.

[0015] Optionally, the LED carrier board further includes a second connecting member, which is arranged between the second splicing piece and the fourth splicing piece to be spliced, and gaps for filling welding objects are provided between the second connecting member and the second splicing piece and the fourth splicing piece.

[0016] Optionally, the second connecting member includes an insulating layer and a signal conducting layer, and the signal conducting layer is connected to a data signal pin of an LED light emitter arranged on the substrate of the carrier through a via hole.

[0017] Optionally, a through hole is provided on the carrier base layer.

[0018] Optionally, the LED carrier board further includes a data signal line, and the data signal line is arranged on the carrier board base layer, and an extension direction of the data signal line is the same as a splicing direction of the splicing joint and the splicing groove.

[0019] In a second aspect, the present invention provides a display device, comprising the above-mentioned LED carrier board.

[0020] The beneficial effects of the LED carrier board of the present invention are as follows: by arranging a splicing joint and a splicing groove on the LED carrier board, when two LED carrier boards are spliced, the splicing joint of any LED carrier board can be spliced ​​with the splicing groove of another LED carrier board to be spliced, and the splicing groove of any LED carrier board can be spliced ​​with the splicing joint of another LED carrier board to be spliced, and two stress application points can be formed at the splicing position of the two LED carrier boards, thereby achieving the effects of anti-bending and anti-breaking, improving the stability of the splicing of the LED carrier boards, and avoiding bending or breaking of the spliced ​​LED carrier boards at the splicing due to bending stress; by arranging the splicing joint to be formed by the width edge of the carrier base layer and / or the width edge of the thick copper layer, and the splicing groove to be formed by the width edge of the carrier base layer and / or the width edge of the thick copper layer, when any LED carrier board is spliced ​​with another LED carrier board, the carrier base layers and the thick copper layers of the two LED carrier boards can be aligned, thereby achieving accurate splicing of the splicing joint and the splicing groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the splicing of the LED carrier board according to the embodiment of the present invention Figure 1 ;

[0022] Figure 2 Schematic diagram of the splicing of the LED carrier board according to the embodiment of the present invention Figure 2 ;

[0023] Figure 3 A schematic diagram of the forces acting on the LED carrier boards when they are spliced ​​in accordance with an embodiment of the present invention;

[0024] Figure 4 Schematic diagram of the splicing of the LED carrier board according to the embodiment of the present invention Figure 3 ;

[0025] Figure 5 is a schematic diagram of an island region according to an embodiment of the present invention;

[0026] Figure 6 Schematic diagram of the splicing of the LED carrier board according to the embodiment of the present invention Figure 4 ;

[0027] Figure 7 Schematic diagram of the splicing of the LED carrier board according to the embodiment of the present invention Figure 5 ;

[0028] Figure 8 Schematic diagram of the splicing of the LED carrier board according to the embodiment of the present invention Figure 6 ;

[0029] Fig. 9 A schematic diagram of the step-by-step splicing of LED carrier boards according to an embodiment of the present invention;

[0030] Fig.10 Schematic diagram of the splicing of the LED carrier board according to the embodiment of the present invention Figure 7 ;

[0031] Fig.11 Schematic diagram of the splicing of the LED carrier board according to the embodiment of the present invention Figure 8 ;

[0032] Fig.12 It is a schematic diagram of splicing through a second connecting member according to an embodiment of the present invention;

[0033] Fig.13 A schematic diagram of the splicing of existing LED carrier boards.

[0034] Description of reference numerals:

[0035] 1-splicing joint, 2-splicing groove, 3-first connecting piece, 4, second connecting piece, 11-first splicing piece, 12-second splicing piece, 13-third splicing piece, 14-fourth splicing piece, 31-first connecting section, 32-second connecting section, 33-third connecting section, 41-insulating layer, 42-signal conducting layer, 100-carrier base layer, 121-first groove, 122-first island area, 141-second groove, 142-second island area, 200-thick copper layer, 300-gap, 310-first step, 320-second step, 400-island area, 500-through hole, 600-via, 700-LED light source. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be interpreted as being limited to the embodiments described herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0037] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to"; the term "based on" means "based at least in part on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiments". The relevant definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc. mentioned in the present invention are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0038] It should be noted that the modifications of "one" and "plurality" mentioned in the present invention are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0039] like Figure 1 As shown, an embodiment of the present invention provides an LED carrier board, comprising a plurality of splicing joints 1 and a plurality of splicing grooves 2, wherein the plurality of splicing joints 1 and the plurality of splicing grooves 2 are distributed along the width edge of the LED carrier board, and the splicing joint 1 of any LED carrier board is used for splicing with the splicing groove 2 of another LED carrier board to be spliced, and the splicing groove 2 of any LED carrier board is used for splicing with the splicing joint 1 of another LED carrier board to be spliced.

[0040] Specifically, the splicing joint 1 refers to the protruding portion of the edge of the LED carrier board, and the splicing groove 2 refers to the concave portion of the edge of the LED carrier board or the missing groove structure. The edge of any LED carrier board is provided with multiple splicing joints 1 and multiple splicing grooves 2. Taking LED carrier board A and LED carrier board B as an example, when LED carrier board A and LED carrier board B are spliced, the splicing joint 1 of LED carrier board A can be spliced ​​with the splicing groove 2 of LED carrier board B, and the splicing groove 2 of LED carrier board A can be spliced ​​with the splicing joint 1 of LED carrier board B, thereby forming the following: Figure 2 As shown in the splicing result, each splicing joint 1 is spliced ​​with the corresponding splicing groove 2, thereby realizing the splicing of the LED carrier A and the LED carrier B; Figure 2 and Figure 3 As shown, through the above splicing structure (finger-tenon structure), the points of action of the bending stress can be dispersed, and the splicing positions of the LED carrier A and the LED carrier B can form two stress action points, namely the splicing joint 1 of the LED carrier A and the splicing groove 2 of the LED carrier B, and the splicing joint 1 of the LED carrier A and the splicing groove 2 of the LED carrier B. Therefore, both the upward bending stress and the downward bending stress can be effectively resisted, thereby achieving the effect of anti-bending and anti-breaking, and improving the stability of the LED carrier splicing; and as Fig.13 When the conventional LED substrates shown are spliced, the spot welding points of the thick copper circuits can better bear the bending stress of the LED substrates, especially the downward bending stress at both ends of the splicing points. At this time, the connection points of the data signal lines bear almost no force. However, once the spliced ​​LED substrates encounter the upward bending stress, the data signal lines may break, or even the entire spliced ​​LED substrates may bend or break at the splicing points (for example, the substrate base layer 100 may be broken, and the thick copper layer 200 may be bent).

[0041] In addition to the solution of splicing two LED carrier boards mentioned in this embodiment, a larger number of LED carrier boards may also be spliced.

[0042] Among them, combined Figure 2 and Figure 3As shown, the LED carrier includes a carrier substrate 100 and a thick copper layer 200, the splicing joint 1 is formed by the width edge of the carrier substrate 100 and / or the width edge of the thick copper layer 200, that is, the splicing joint 1 is composed of the width edge portion of the carrier substrate 100 and / or the width edge portion of the thick copper layer 200, the splicing groove 2 is formed by the width edge of the carrier substrate 100 and / or the width edge of the thick copper layer 200, that is, the splicing groove 2 is composed of the width edge portion of the carrier substrate 100 and / or the width edge portion of the thick copper layer 200; for the splicing joint 1, the width edge portion of the carrier substrate 100 may be closer to the width edge portion of the thick copper layer 200. The thick copper layer 200 may protrude, or the width edge portion of the thick copper layer 200 may protrude more relative to the width edge portion of the carrier base layer 100; for the splicing groove 2, the width edge portion of the carrier base layer 100 may protrude more relative to the width edge portion of the thick copper layer 200, or the width edge portion of the thick copper layer 200 may protrude more relative to the width edge portion of the carrier base layer 100; no matter which method is used, it is necessary to ensure that when two LED carriers are spliced, when the carrier base layers 100 of the two LED carriers are aligned, the thick copper layers 200 of the two LED carriers can also be roughly aligned (usually leaving a certain gap for filling solder).

[0043] Among them, the carrier substrate 100 serves as a supporting substrate and determines the mechanical strength of the LED carrier. The carrier substrate 100 is usually an insulator to prevent current leakage; the thick copper layer 200 is a conductive layer located on the surface of the carrier substrate 100. For example, a thicker copper plate is attached to the carrier substrate 100 through a special process to form a required circuit pattern; the thick copper layer 200 has a larger conductive cross-sectional area and can carry a larger current, thereby meeting the needs of high-power devices such as LEDs. It can also quickly conduct the heat generated by electronic components to the carrier substrate 100, thereby utilizing the good heat dissipation of the carrier substrate 100 material (such as epoxy resin and glass fiber, etc.) for heat dissipation.

[0044] The thick copper layer 200 is usually arranged on the back of the substrate 100, and the front of the substrate 100 is provided with LED light-emitting units, data signal lines and electrode pins (each LED light-emitting unit corresponds to at least three electrode pins: VDD, GND and DATA), etc. The lines in the thick copper layer 200 correspond to the data signal lines on the front and extend in the same direction. When splicing, the thick copper layers 200 on the back of the two LED substrates are spot welded to achieve physical and electrical connection of the lines, the data signal lines on the front of the two LED substrates are electrically connected, and the substrates 100 are bonded together.

[0045] The thickness of the thick copper circuit is about 0.5 mm, the thickness of the substrate base layer 100 is about 0.3 mm, and the thickness of the data signal line is about 0.05 mm.

[0046] Among them, the connection between the carrier base layer 100 and the thick copper layer 200 is usually achieved through special process treatment to ensure that the thick copper layer is firmly attached to the base layer while ensuring electrical performance and heat dissipation effects. The main processes include: fixing the thick copper layer 200 to the carrier base layer 100 through hot pressing and high pressure to achieve tight bonding.

[0047] In the present embodiment, by arranging a splicing joint and a splicing groove on the LED carrier, when two LED carriers are spliced, the splicing joint of any LED carrier can be spliced ​​with the splicing groove of the other LED carrier to be spliced, and the splicing groove of any LED carrier can be spliced ​​with the splicing joint of the other LED carrier to be spliced, and two stress application points can be formed at the splicing position of the two LED carriers, thereby achieving the effects of anti-bending and anti-breaking, improving the stability of the splicing of the LED carriers, and avoiding bending or breaking of the spliced ​​LED carriers at the splicing due to bending stress; by arranging the splicing joint to be formed by the width edge of the carrier base layer and / or the width edge of the thick copper layer, and the splicing groove to be formed by the width edge of the carrier base layer and / or the width edge of the thick copper layer, when any LED carrier is spliced ​​with another LED carrier, the carrier base layers and the thick copper layers of the two LED carriers can be aligned, thereby achieving accurate splicing of the splicing joint and the splicing groove.

[0048] Optionally, the splicing joint 1 includes a first splicing piece 11 formed by the width edge of the carrier base layer 100 and a second splicing piece 12 formed by the width edge of the thick copper layer 200, and the splicing groove 2 includes a third splicing piece 13 formed by the width edge of the carrier base layer 100 and a fourth splicing piece 14 formed by the width edge of the thick copper layer 200, the first splicing piece 11 of any LED carrier is used for splicing with the third splicing piece 13 of another LED carrier to be spliced, and the second splicing piece 12 of any LED carrier is used for splicing with the fourth splicing piece 14 of another LED carrier to be spliced.

[0049] Specifically, combined Figure 4 As shown, the splicing joint 1 includes a first splicing piece 11 formed by the edge of the carrier base layer 100 and a second splicing piece 12 formed by the edge of the thick copper layer 200, and the splicing groove 2 includes a third splicing piece 13 formed by the edge of the carrier base layer 100 and a fourth splicing piece 14 formed by the edge of the thick copper layer 200. Taking LED carrier A and LED carrier B as examples, the first splicing piece 11 of LED carrier A can be spliced ​​with the third splicing piece 13 of LED carrier B, and the second splicing piece 12 of LED carrier A can be spliced ​​with the fourth splicing piece 14 of LED carrier B. The splicing pieces of the splicing joint 1 and the splicing groove 2 are spliced ​​in turn to realize the splicing of LED carrier A and LED carrier B.

[0050] In this optional embodiment, by arranging the first splicing piece of any LED carrier board to be spliced ​​with the third splicing piece of another LED carrier board to be spliced, and the second splicing piece of any LED carrier board to be spliced ​​with the fourth splicing piece of another LED carrier board to be spliced, the carrier base layers and thick copper layers of the two LED carrier boards are aligned, thereby achieving accurate splicing of the splicing joints and splicing grooves.

[0051] Optionally, the LED carrier board further includes a first connecting member 3, and the first connecting member 3 is respectively connected to the second splicing member 12 of any LED carrier board and the fourth splicing member 14 of another LED carrier board to be spliced.

[0052] Specifically, combined Figure 7 and Figure 8 As shown, the LED carrier also includes a first connecting member 3, through which the second splicing member 12 of the LED carrier A and the fourth splicing member 14 of the LED carrier B can be physically and electrically connected, and the splicing members of the splicing joints 1 and the splicing grooves 2 are connected in turn through the first connecting member 3, thereby realizing the splicing of the LED carrier A and the LED carrier B.

[0053] In this optional embodiment, the physical connection and electrical connection at the splicing joint and the splicing groove can be simultaneously achieved through the first connecting member, which can improve the splicing strength of the LED carrier board.

[0054] Optionally, the first connecting member 3 is a conductive material, and includes a first connecting segment 31, a second connecting segment 32 and a third connecting segment 33 that are fixedly connected in sequence, the first connecting segment 31 is used to be embedded in a first groove 121 set in the second splicing piece 12 of any one of the LED carrier boards, and the third connecting segment 33 is used to be embedded in a second groove 141 set in the fourth splicing piece 14 of another LED carrier board to be spliced.

[0055] Specifically, combined Figure 8As shown, the first connector 3 includes a first connecting section 31, a second connecting section 32 and a third connecting section 33 which are fixedly connected in sequence. The entire first connector 3 may be wide at both ends and narrow in the middle, and the first connector 3 is made of conductive material. A first groove 121 is provided in the second splicing piece 12, and the first connecting section 31 is embedded in the first groove 121 (the shape of the first connecting section 31 matches the shape of the first groove 121). A second groove 141 is provided in the fourth splicing piece 14, and the third connecting section 33 is embedded in the second groove 141 (the shape of the third connecting section 33 matches the shape of the second groove 141). The splicing pieces of the splicing joints 1 and the splicing grooves 2 are connected in sequence through the first connector 3, thereby realizing the physical splicing and electrical connection of the LED carrier A and the LED carrier B. In addition, after the first connector 3 is installed, it can also be soldered by brushing solder to ensure the reliability of the physical connection and the electrical connection.

[0056] Among them, combined Figure 4 and Figure 5 As shown, to ensure that there is enough space on the thick copper layer 200 to set the first groove 121 and the second groove 141 , the first groove 121 and the second groove 141 are usually set in the middle of the island area 400 of the thick copper layer 200 .

[0057] In this optional embodiment, by arranging the first connecting section to be embedded in the first groove and the third connecting section to be embedded in the second groove, the splicing of the splicing joint and the splicing groove is achieved, thereby improving the splicing strength of the LED carrier board.

[0058] Optionally, the end of the second splicing piece 12 is stepped, and the end of the fourth splicing piece 14 is stepped to match the shape of the end of the second splicing piece 12. The second splicing piece 12 of any LED carrier board and the fourth splicing piece 14 of another LED carrier board to be spliced ​​are used to be spliced ​​by matching each other through steps.

[0059] Specifically, combined Fig. 9 As shown, the end of the second splicing piece 12 is stepped, and the end of the fourth splicing piece 14 is stepped to match the shape of the end of the second splicing piece 12. Taking the first step 310 at the end of the second splicing piece 12 of the LED carrier A and the second step 320 at the end of the fourth splicing piece 14 of the LED carrier B as examples, when the LED carrier A and the LED carrier B are spliced, the first step 310 and the second step 320 cooperate with each other, the second step 320 overlaps the first step 310, and a gap 300 for filling the solder is left between the first step 310 and the second step 320, and the gap 300 is in a "Z" shape.

[0060] In actual production, after the vertical surface of the second splicing piece 12 of the LED carrier A is etched, the LED carrier A needs to form a dark base plate by inkjet. The vertical surface of the second splicing piece 12 etched during the inkjet process is prone to ink sticking, and the vertical surface is contaminated after ink sticking. When brushing solder into the reserved gap 300, the vertical surface of the second splicing piece 12 is not easy to stick tin, causing the solder brushed into the reserved gap 300 to pop out and form a protruding solder bag on the reserved gap 300. The protruding solder bag not only affects the overcurrent, but also causes the LED carrier to be uneven. In this embodiment, the "Z"-shaped reserved gap 300 formed by overlapping the first step 310 and the second step 320 has a larger welding surface, which can make the LED carrier A and the LED carrier B more firmly spliced, and the overcurrent effect is ideal. Moreover, since the first step 310 and the second step 320 are usually milled out, the first step 310 and the second step 320 formed by milling are easy to tin, and it is easy to fill the gap 300 with solder without forming a protruding solder bag on the welding surface.

[0061] In addition to the one-step step, this embodiment may also use more steps to further improve the stability and conductivity of the splicing of the LED carrier board A and the LED carrier board B.

[0062] In this optional embodiment, the second splicing piece of any LED carrier board is spliced ​​with the fourth splicing piece of another LED carrier board to be spliced ​​by matching each other in steps, thereby effectively improving the stability and conductivity of the splicing of the LED carrier boards.

[0063] Optionally, when the splicing joint 1 of any LED carrier is spliced ​​with the splicing groove 2 of another LED carrier to be spliced, a gap 300 for filling solder is provided between the thick copper layer 200 of the LED carrier and the thick copper layer 200 of another LED carrier to be spliced.

[0064] Specifically, when LED carrier A and LED carrier B are spliced, a gap 300 for filling solder is reserved between the thick copper layer 200. By filling the gap 300 with solder, both the physical connection and the electrical connection of LED carrier A and LED carrier B can be achieved.

[0065] A gap 300 for filling welding objects may also be provided between the first step 310 and the second step 320 .

[0066] Among them, the welding material includes copper or tin, etc., but since tin soldering has poor overcurrent capacity, the welding point is easy to heat up and melt when the current is large, so that a short circuit occurs, so copper welding is usually preferred; taking the scheme of setting the gap 300 as an example, tin soldering is preferably used as the welding material, which can meet the overcurrent requirement and has low cost and simple process; in the scheme without setting the gap 300, since tin soldering is only surface welding and the current only passes through the surface welding point, the solder pressure at the welding point is large and it is easy to heat up and melt, so this scheme should choose copper soldering with high process and cost.

[0067] Among them, combined Figure 4 and Figure 6 As shown, for a single LED substrate, the edge of the thick copper layer 200 is usually cut off when the line of the thick copper layer 200 is the widest (for example, 3 mm at the widest and 0.9 mm at the narrowest), thereby ensuring that the gap 300 can be filled with more solder, thereby improving the stability and conductivity of the LED substrate splicing.

[0068] In this optional embodiment, by reserving a gap for filling with solder between the thick copper layers of the two LED carriers and filling the gap with solder, both physical and electrical connections between the LED carriers can be achieved.

[0069] Optionally, the sum of the length of the first assembling piece 11 and the length of the third assembling piece 13 is equal to the sum of the length of the second assembling piece 12 , the length of the fourth assembling piece 14 and the width of the gap 300 .

[0070] Specifically, combined Figure 4 As shown, taking LED carrier A as an example, the length of the first splicing piece 11 is greater than the length of the second splicing piece 12, and in the LED carrier B corresponding thereto, the length of the third splicing piece 13 is less than the length of the fourth splicing piece 14, and the sum of the length of the first splicing piece 11 and the length of the third splicing piece 13 is equal to the sum of the length of the second splicing piece 12, the length of the fourth splicing piece 14 and the width of the gap 300.

[0071] Among them, combined Figure 4 As shown, taking LED carrier B as an example, the length of its first splicing piece 11 is smaller than the length of the second splicing piece 12 (the splicing joint 1 of LED carrier B is shown in the figure), and in the LED carrier A corresponding thereto, the length of the third splicing piece 13 is larger than the length of the fourth splicing piece 14, and it can also ensure that the sum of the length of the first splicing piece 11 and the length of the third splicing piece 13 is equal to the sum of the length of the second splicing piece 12, the length of the fourth splicing piece 14 and the width of the gap 300.

[0072] In this optional embodiment, by setting the length of each splicing piece, sufficient space is reserved for the gap, and by filling the gap with solder, both physical connection and electrical connection between the LED carrier boards can be achieved.

[0073] Optionally, the solder includes flux and conductive solder, and the solder is used for electrical connection between the thick copper layer 200 of any one of the LED carrier boards and the thick copper layer 200 of another LED carrier board to be spliced.

[0074] Specifically, the solder includes flux and conductive solder, and the electrical connection between the thick copper layers 200 of the two LED carriers can be achieved through the solder (such as materials such as copper and tin), thereby achieving electrical connection between the LED carriers.

[0075] Among them, solder is the most important welding material, which is responsible for connecting the pins of electronic components and the copper lines on the circuit board; the function of flux is to remove oxides on the welding surface, prevent solder oxidation, and improve welding quality.

[0076] In this optional embodiment, the electrical connection between the thick copper layers of the two LED carriers is achieved through solder, thereby achieving electrical connection between the LED carriers.

[0077] Optionally, the second splicing piece 12 includes a first island area 122, and the fourth splicing piece 14 includes a second island area 142. When the second splicing piece 12 of any LED carrier is spliced ​​with the fourth splicing piece 14 of another LED carrier to be spliced, the first island area 122 and the second island area 142 are spliced ​​to form an island area 400, and the gap 300 is located in the island area 400.

[0078] Specifically, combined Figure 4 and Figure 5 As shown, the second splicing piece 12 includes a first island area 122, and the fourth splicing piece 14 includes a second island area 142. When the second splicing piece 12 of any LED carrier is spliced ​​with the fourth splicing piece 14 of another LED carrier to be spliced, the first island area 122 and the second island area 142 are spliced ​​to form an island area 400, and the gap 300 is located in the island area 400, and the first island area 122 and the second island area 142 are respectively located on both sides of the gap 300.

[0079] In this optional embodiment, the first island area and the second island area are spliced ​​to form an island-shaped area, which is beneficial to the splicing of the splicing joint and the splicing groove, and improves the splicing strength of the LED carrier board.

[0080] Optionally, the LED carrier further comprises a second connecting member 4, which is arranged between the second splicing piece 12 and the fourth splicing piece 14 to be spliced, and gaps 300 for filling welding objects are provided between the second connecting member 4 and the second splicing piece 12 and the fourth splicing piece 14.

[0081] Specifically, combined Fig.10 and Fig.11 As shown, the second splicing piece 12 of LED carrier A and the fourth splicing piece 14 of LED carrier B are partially hollowed out and passed through the second connecting piece 4, and gaps 300 are reserved between the two ends of the second connecting piece 4 and the second splicing piece 12 and the fourth splicing piece 14. Solder is brushed in the gaps 300 to complete the circuit layer connection of LED carrier A and LED carrier B.

[0082] In this optional embodiment, the second connecting member 4 is used to realize the splicing between the LED carrier boards, so that the reliability of the data connection line can be improved.

[0083] Optionally, the second connecting member 4 includes an insulating layer 41 and a signal conducting layer 42 , and the signal conducting layer 42 is connected to a data signal pin of an LED light emitter 700 disposed on the substrate base 100 through a via 600 .

[0084] Specifically, combined Fig.12 As shown, the second connector 4 includes an insulating layer 41 and a signal conducting layer 42. Since the data signal line and the LED light emitter 700 are arranged on the side of the substrate 100 away from the thick copper layer 200, the data signal line is disconnected at the joint. In the related art, complex means are usually used to connect and conduct the data signal line on the substrate 100 on the side where the LED light emitter 700 is arranged, which is difficult to implement. Therefore, in this embodiment, the data signal line is connected and conducted on the substrate 100 on the side close to the thick copper layer 200. That is, one end of the via 600 is connected to the data signal pin of the LED light-emitting body 700, and the other end is arranged on the substrate base 100; when two LED substrates are spliced, the signal conductive layer 42 of the second connector 4 covers the splicing position downward and is in electrical contact with the two vias (a contact electrode sheet will be arranged around the via 600, or a thin layer of copper will be left around the via when the thick copper circuit on the island area at the end of the splicing joint and the splicing groove is hollowed out, so that it is convenient for the signal conductive layer to cover and electrically contact the via), thereby realizing the connection of the data signal line.

[0085] Among them, the insulating layer 41 and the signal conductive layer 42 can be FPC (flexible printed circuit board). When splicing, the FPC is covered with thick copper connectors, and then solder is brushed in the gap 300 to complete the physical and electrical connection of the two LED carriers; the second connector 4 can also be an integral PCB board, including a thick copper connecting layer, an insulating layer 41 and a signal conductive layer 42. When splicing, the PCB board is installed in the connecting notch, and then solder is brushed in the gap 300 to complete the physical and electrical connection of the two LED carriers.

[0086] The two ends of the signal conducting layer 42 close to the second assembling piece 12 and the fourth assembling piece 14 are insulated to avoid short circuit with the second assembling piece 12 and the fourth assembling piece 14 when solder is applied in the gap 300 .

[0087] In this optional embodiment, the second connecting member 4 includes an insulating layer 41 and a signal conducting layer 42 , and the data signal line is connected through the via 600 , which is simpler to implement than the existing solution.

[0088] Optionally, a through hole 500 is provided on the carrier substrate 100 .

[0089] Specifically, combined Figure 4 As shown, a through hole 500 is provided on the substrate base 100 , which reduces the weight of the LED substrate and enhances the light transmission effect while ensuring the overall strength of the LED substrate.

[0090] The position of the through hole 500 can be arranged relative to the island region 400 (ie, the island region 400 is located on the thick copper layer 200 and the through hole 500 is located at a relative position on the substrate 100).

[0091] In this optional embodiment, by providing a through hole 500 on the substrate base 100 , the weight of the LED substrate is reduced and the light transmission effect is enhanced while ensuring the overall strength of the LED substrate.

[0092] Optionally, the LED carrier board further includes a data signal line, and the data signal line is arranged on the carrier board base layer 100 , and an extension direction of the data signal line is the same as a splicing direction of the splicing joint 1 and the splicing groove 2 .

[0093] Specifically, the LED carrier also includes a data signal line, which is arranged on the carrier base layer 100. LED light-emitting units and electrode pins (such as VDD, GND and DATA) are also provided on the carrier base layer 100. The extension direction of the data signal line is the same as the splicing direction of the splicing joint 1 and the splicing groove 2. The connection between the LED light-emitting units is realized through the data signal line, thereby realizing the light-emitting control of the LED light-emitting units.

[0094] The splicing joint 1 and the splicing groove 2 are connected only in the splicing direction (ie, the length direction of the LED carrier board), and are not connected in other directions.

[0095] In this optional embodiment, the light emission control of the LED light emitting unit is achieved by setting a data signal line on the base layer of the carrier board.

[0096] Another embodiment of the present invention provides a display device including the above-mentioned LED carrier board.

[0097] Specifically, the display device in this embodiment further includes an LED mounted on the LED carrier board.

[0098] Although the present invention is disclosed as above, the protection scope of the present invention is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will fall within the protection scope of the present invention.

Claims

1. An LED carrier board, characterized in that: The invention comprises a plurality of splicing joints (1) and a plurality of splicing grooves (2), wherein the plurality of splicing joints (1) and the plurality of splicing grooves (2) are distributed along the width edge of the LED carrier board, wherein the splicing joint (1) of any LED carrier board is used for splicing with the splicing groove (2) of another LED carrier board to be spliced, and the splicing groove (2) of any LED carrier board is used for splicing with the splicing joint (1) of another LED carrier board to be spliced; the LED carrier board comprises a carrier board base layer (100) and a thick copper layer (200), wherein the thick copper layer (200) is fixed on the carrier board base layer (100), wherein the splicing joint (1) is formed by the width edge of the carrier board base layer (100) and / or the width edge of the thick copper layer (200), and wherein the splicing groove (2) is formed by the width edge of the carrier board base layer (100) and / or the width edge of the thick copper layer (200).

2. The LED carrier board according to claim 1, characterized in that: The splicing joint (1) comprises a first splicing piece (11) formed by the width edge of the carrier substrate (100) and a second splicing piece (12) formed by the width edge of the thick copper layer (200); the splicing groove (2) comprises a third splicing piece (13) formed by the width edge of the carrier substrate (100) and a fourth splicing piece (14) formed by the width edge of the thick copper layer (200); the first splicing piece (11) of any LED carrier is used for splicing with the third splicing piece (13) of another LED carrier to be spliced; and the second splicing piece (12) of any LED carrier is used for splicing with the fourth splicing piece (14) of another LED carrier to be spliced.

3. The LED carrier board according to claim 2, characterized in that: It also comprises a first connecting member (3), wherein the first connecting member (3) is respectively connected to the second splicing member (12) of any one of the LED carrier boards and the fourth splicing member (14) of another LED carrier board to be spliced.

4. The LED carrier board according to claim 3, characterized in that: The first connecting member (3) is made of conductive material, and comprises a first connecting section (31), a second connecting section (32) and a third connecting section (33) which are fixedly connected in sequence, the first connecting section (31) being used to be embedded in a first groove (121) provided in the second splicing piece (12) of any one of the LED carrier boards, and the third connecting section (33) being used to be embedded in a second groove (141) provided in the fourth splicing piece (14) of another LED carrier board to be spliced.

5. The LED carrier board according to claim 2, characterized in that: The end of the second splicing piece (12) is in a stepped shape, and the end of the fourth splicing piece (14) is in a stepped shape that matches the shape of the end of the second splicing piece (12). The second splicing piece (12) of any LED carrier board and the fourth splicing piece (14) of another LED carrier board to be spliced ​​are used to be spliced ​​by matching each other through the steps.

6. The LED carrier board according to claim 3, characterized in that: When the splicing joint (1) of any LED carrier board is spliced ​​with the splicing groove (2) of another LED carrier board to be spliced, a gap (300) for filling with solder is provided between the thick copper layer (200) of the LED carrier board and the thick copper layer (200) of another LED carrier board to be spliced.

7. The LED carrier board according to claim 6, characterized in that: The sum of the length of the first assembling piece (11) and the length of the third assembling piece (13) is equal to the sum of the length of the second assembling piece (12), the length of the fourth assembling piece (14) and the width of the gap (300).

8. The LED carrier board according to claim 6, characterized in that: The solder comprises flux and conductive solder, and the solder is used for electrical connection between the thick copper layer (200) of any one of the LED carrier boards and the thick copper layer (200) of another LED carrier board to be spliced.

9. The LED carrier board according to claim 6, characterized in that: The second splicing piece (12) includes a first island area (122), and the fourth splicing piece (14) includes a second island area (142). When the second splicing piece (12) of any LED carrier board is spliced ​​with the fourth splicing piece (14) of another LED carrier board to be spliced, the first island area (122) and the second island area (142) are spliced ​​to form an island area (400), and the gap (300) is located in the island area (400).

10. The LED carrier board according to claim 2, characterized in that: The invention also comprises a second connecting piece (4), wherein the second connecting piece (4) is arranged between the second splicing piece (12) and the fourth splicing piece (14) to be spliced, and gaps (300) for filling welding objects are arranged between the second connecting piece (4) and the second splicing piece (12) and the fourth splicing piece (14).

11. The LED carrier board according to claim 10, characterized in that: The second connecting member (4) comprises an insulating layer (41) and a signal conducting layer (42), and the signal conducting layer (42) is connected to a data signal pin of an LED light emitter (700) arranged on the substrate base (100) through a via hole (600).

12. The LED carrier board according to claim 1, characterized in that: The carrier substrate (100) is provided with a through hole (500).

13. The LED carrier according to any one of claims 2 to 12, characterized in that: It also comprises a data signal line, which is arranged on the carrier substrate (100), and the extension direction of the data signal line is the same as the splicing direction of the splicing joint (1) and the splicing groove (2).

14. A display device, characterized in that: The LED carrier board comprises the LED carrier board as claimed in any one of claims 1 to 13.

Images