Laser-assisted sintering device and laser-assisted sintering method

Abstract

The invention relates to the technical field of photovoltaics, and provides a laser-assisted sintering device and a laser-assisted sintering method. The device comprises a conductive station, a pressure applying assembly and a laser scanning positioning instrument, the table top of the conductive station bears the battery piece; the pressure applying assembly is of a suspension bridge type structure and comprises a conductive thin wire and a driving assembly. The laser scanning positioning instrument is in communication connection with the driving assembly so as to perform position positioning and laser scanning on the battery piece; the conductive thin wire and the conductive station are electrically connected with an external power supply; the conductive thin wire is located above the conductive station, and the two ends of the conductive thin wire are each connected with a mounting frame. And the driving assembly drives the mounting rack or the conductive station to move up and down, so that the conductive thin wires are far away from or in contact with the main grid of the battery piece, and the conductive thin wires and the conductive station can apply deflection voltage to the battery piece. The laser-assisted sintering device can simplify operation, improve productivity, is short in consumed time, saves more time and labor in replacement of the conductive thin wire, is low in cost, and can also reduce the risk of fragments.

Description

Technical Field

[0001] The invention relates to the field of photovoltaic technology, and in particular to a laser-assisted sintering device and a laser-assisted sintering method. Background Art

[0002] Laser-assisted sintering technology is a process that irradiates photovoltaic cells (cells for short) with high-intensity lasers and combines them with a deflection voltage of 10V or above to generate a local current of several amperes to form better contact between metals (such as metal electrodes or metal grid lines) and semiconductors (such as silicon surfaces), thereby improving the photoelectric conversion efficiency of the cells.

[0003] After screen printing and sintering, the cell can enter the laser assisted sintering process. Figure 1-2 As shown, the existing laser-assisted sintering method for laser-adding deflection voltage is mainly divided into two steps: in the first step, the probes of the first probe row are pressed down to the main grid on the left side of the battery cell, and the laser scans the right half of the battery cell (such as Figure 1 In the second step, the probes of the second probe row are pressed down on the main grid on the right side of the cell, and the laser scans the left half of the cell (as shown in FIG. Figure 2 The second laser scanning area shown in the figure); only in this way can the laser-assisted sintering of the entire cell be completed. The laser-adding deflection voltage method is divided into two steps of laser scanning operation, and each step only scans half of the cell. This is because: the total number of probes on the two rows of probes is as high as 96. When the probe rows abut against the cell, they will block the laser, causing the EL to blacken, which is not conducive to improving the photoelectric conversion efficiency of the cell. However, this laser-adding deflection voltage method has the following defects:

[0004] (1) This laser-deflection voltage method requires that the scanning laser and the application of the deflection voltage be decomposed into two steps, and the laser-assisted sintering of half of the battery cell must be completed first, and then the laser-assisted sintering of the other half of the battery cell can be completed. This greatly affects the production line capacity and leads to low production capacity.

[0005] (2) The number of probes in the probe row is large (two rows of probes are fully inserted with at least 96 probes). Probes are consumables and require time and materials to maintain.

[0006] (3) A large number of probes will also lead to more pressing points, which in turn will cause a greater risk of hidden cracks in the battery cell. Summary of the invention

[0007] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a laser-assisted sintering device and a laser-assisted sintering method using the laser-assisted sintering device.

[0008] Based on this, the present invention discloses a laser-assisted sintering device, including a conductive table, a pressure component and a laser scanning locator; the table top of the conductive table is used to carry a battery cell;

[0009] The pressure-applying assembly is a suspension bridge structure, which includes a conductive fine wire and a driving assembly;

[0010] The laser scanning locator is located above the conductive platform, and the laser scanning locator is communicatively connected with the driving assembly to perform position positioning and laser scanning on the battery sheet;

[0011] The conductive thin wire and the conductive platform are both electrically connected to an external power supply; the conductive thin wire is located above the conductive platform, and both ends of the conductive thin wire are connected to a mounting frame; the driving component is connected to at least one mounting frame or the conductive platform, so that the driving component drives the mounting frame or the conductive platform to move up and down, so that the conductive thin wire is away from or contacts the main grid on the surface of the battery cell, so that the conductive thin wire and the conductive platform can apply a deflection voltage to the battery cell.

[0012] Preferably, the laser scanning area of ​​the laser scanning locator covers the entire surface of the battery cell;

[0013] When the pressure-applying component applies a deflection voltage, the length direction of the conductive thin wire is consistent with the main grid direction of the battery cell;

[0014] The equivalent diameter of the conductive thin wire is 1 μm-1 mm; the conductive thin wire is a gold wire, a silver wire, a copper wire or a gold-plated copper wire.

[0015] Further preferably, the equivalent diameter of the conductive thin wire is 40-50 μm; and the conductive thin wire is a gold-plated copper wire.

[0016] Preferably, the side edges of the table surface of the conductive table are chamfered to prevent the conductive thin wire from contacting the conductive table when moving downward and causing a short circuit.

[0017] Further preferably, the surface of the conductive table is a curved surface, the curved surface is bent toward the battery cell, and the curvature of the curved surface is less than or equal to half of π, and the battery cell is attached to the curved surface.

[0018] Preferably, a laser-assisted sintering device further includes a turntable; the conductive wire is located above the turntable, and the conductive table is installed on the turntable, so that the turntable drives the conductive table to rotate, so that the main grid of the battery cell on the conductive table moves to below the conductive wire.

[0019] Further preferably, the outer side of the turntable is provided with a loading area, a laser-assisted sintering area and a unloading area in sequence along the circumferential direction;

[0020] The conductive table is installed at the edge area of ​​the turntable; one mounting frame is located in the laser-assisted sintering area outside the turntable, and the other mounting frame is installed in the middle area of ​​the turntable; one end of the conductive wire extends outside the turntable and is connected to a mounting frame, while the other end of the conductive wire extends to the middle area of ​​the turntable and is connected to another mounting frame.

[0021] Preferably, the driving assembly comprises an inductive driving member and a driving rod, and two ends of the driving rod are respectively connected to the inductive driving member and the mounting frame, so that the inductive driving member drives the mounting frame to move up and down through the driving rod.

[0022] Further preferably, the mounting frame comprises a connecting rod and a mounting column; the driving rod is connected to the connecting rod, and two ends of the mounting column are respectively connected to the end of the conductive thin wire and the connecting rod.

[0023] More preferably, the number of the conductive wires is less than or equal to 20; when there are multiple conductive wires, the multiple conductive wires are spaced apart in sequence to apply deflection voltages to different main grids on the battery cell respectively; the number of mounting columns on each mounting frame is the same as the number of conductive wires.

[0024] The present invention also discloses a laser-assisted sintering method, which is performed using the laser-assisted sintering device described above in the present invention, and comprises the following steps:

[0025] S1, after transferring the battery cell to the surface of the conductive table, transfer the battery cell to the bottom of the conductive thin wire;

[0026] S2, the laser scanning locator transmits the position positioning signal of the battery cell to the driving component, so that the driving component drives the mounting frame to move downward or drives the conductive table to move upward, so that the conductive thin wire contacts the main grid on the surface of the battery cell;

[0027] S3, the conductive table and the conductive thin wire are electrically connected to the positive and negative electrodes of the external power supply respectively to apply a deflection voltage to the battery cell, and the laser scanning positioning instrument performs a laser scan on the surface of the entire battery cell to perform laser-assisted sintering on the battery cell;

[0028] S4. After the laser-assisted sintering is completed, the driving assembly drives the mounting frame to move upward or drives the conductive table to move downward to keep the conductive wire away from the surface of the battery cell, and then the battery cell is removed from the laser-assisted sintering device.

[0029] Compared with the prior art, the present invention has at least the following beneficial effects:

[0030] 1. Compared with the probe row, the pressure component of the laser-assisted sintering device of the present invention is a suspension bridge structure, and the equivalent diameter of the conductive thin wire is relatively small, and the shading generated is small and basically negligible, and will not affect the laser-assisted sintering of the entire battery cell. Therefore, the laser-assisted sintering method of the present invention only needs to use a laser scanning locator to scan the surface of the entire battery cell in one step; there is no need to scan in two steps as in the prior art publication number CN117650198A, and only scan half of the battery cell each time. Therefore, compared with the prior art such as CN117650198A, when the conductive thin wire contacts the main grid of the battery cell, the laser scanning locator can realize one-step scanning, and the conductive thin wire will not bring negative effects of shading, so it takes a short time and can increase production capacity by more than double.

[0031] 2. The laser-assisted sintering device of the present invention does not require a probe row, but is designed as a pressure component with a suspension bridge structure. The conductive thin wire of the pressure component is in line contact with the main grid of the battery cell. Compared with the point contact between multiple probe rows and the main grid of the battery cell, the line contact can press the conductive thin wire on the battery cell as a whole, making the stress points on the surface of the battery cell more uniform and preventing local stress concentration. Therefore, it can greatly reduce the risk of battery cell fragmentation and improve the yield rate.

[0032] 3. Compared with the existing point contact multiple probes (two rows of probes are fully inserted with at least 96 probes), the number of line contact conductive wires can be greatly reduced (in the best case, only one conductive wire can be used to form a suspension bridge structure pressure component), so the replacement of the conductive wire is more time-saving, labor-saving and cost-effective. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic structural diagram of the first step of laser scanning-applying deflection voltage operation in the existing laser-assisted sintering method.

[0034] Figure 2 The schematic diagram of the structure of the second step laser scanning-applying deflection voltage operation of the existing laser assisted sintering method.

[0035] Figure 3 Schematic diagram of the structure of a laser-assisted sintering device of this embodiment.

[0036] Figure 4 It is a schematic structural diagram of the pressure-applying assembly of this embodiment in the downward pressure working state.

[0037] Figure 5 A schematic diagram of the structure of an existing conductive platform working with conductive thin wires in a suspension bridge-type pressure-applying assembly.

[0038] Figure 6 It is a structural schematic diagram of a conductive platform in this embodiment working with a conductive thin wire in a suspension bridge type pressure applying assembly.

[0039] Figure 7 It is a structural schematic diagram of another conductive platform of this embodiment working with the conductive thin wire in the suspension bridge type pressure applying assembly.

[0040] Description of the reference numerals: first probe row 001; second probe row 002; battery cell 003; main grid 030; first laser scanning area 004; second laser scanning area 005;

[0041] Conductive table 1; curved chamfer 11; curved table top 12; pressure component 2; conductive fine wire 21; inductive drive member 22; drive rod 23; first mounting bracket 24; second mounting bracket 25; connecting rod 26; mounting column 27; laser scanning locator 3; turntable 4; loading area 5; loading device 51; laser assisted sintering area 6; unloading area 7; unloading device 71. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] Example

[0044] A laser assisted sintering device of this embodiment, see Figure 3-4 , including a turntable 4, a conductive platform 1, a pressure component 2 and a laser scanning locator 3. The pressure component 2 is a suspension bridge structure, which includes a conductive thin wire 21, a mounting frame and a driving component (the driving component is an inductive driving component, which includes an inductive driving member 22 and a driving rod 23).

[0045] The laser scanning locator 3 is located above the conductive platform 1 , and the laser scanning locator 3 is communicatively connected with the induction drive component 22 , so that the laser scanning locator 3 can realize the position positioning and laser scanning of the battery cell 003 .

[0046] The conductive wire 21 is located above the turntable 4, the conductive table 1 is installed on the turntable 4, the table surface of the conductive table 1 is used to carry the battery cell 003, and the turntable 4 drives the conductive table 1 to rotate along the horizontal plane (such as Figure 3 As shown by the arrow, it can be rotated counterclockwise) to move the main grid 030 of the battery cell 003 on the conductive platform 1 to the bottom of the conductive thin wire 21 by rotation, so that the conductive thin wire 21 and the conductive platform 1 can subsequently apply a deflection voltage to the battery cell 003.

[0047] Furthermore, the conductive thin wire 21 and the conductive platform 1 are both electrically connected to an external power source. The conductive thin wire 21 is located above the conductive platform 1, and both ends of the conductive thin wire 21 are connected to a mounting frame (such as Figure 3-4As shown, the two mounting frames are respectively called the first mounting frame 24 and the second mounting frame 25). In practice, the driving component can be connected to the mounting frame so that the driving component drives the mounting frame to move up and down, so that the conductive thin wire 21 is away from or contacts the main grid 030 on the surface of the battery cell 003, so as to apply a deflection voltage to the battery cell 003. Of course, the driving component can also be connected to the conductive table 1 or the turntable 4 so that the driving component drives the conductive table 1 or the turntable 4 to move up and down, so that the conductive thin wire 21 is away from or contacts the main grid 030 on the surface of the battery cell 003. The following takes the driving component connected to the mounting frame as an example for detailed description:

[0048] An example of this embodiment is that the first mounting frame 24 and the second mounting frame 25 are respectively connected to a driving assembly to drive the first mounting frame 24 and the second mounting frame 25 to move up and down, so that the two mounting frames drive the two ends of the conductive thin wire 21 away from (or in contact with) the main grid 030 on the surface of the battery cell 003. It should be noted that when the first mounting frame 24 and the second mounting frame 25 are both moved upward, the two ends of the conductive thin wire 21 are away from the surface of the battery cell 003, which will not affect the rotation of the turntable 4; and when the first mounting frame 24 and the second mounting frame 25 are both moved downward, the two ends of the conductive thin wire 21 are in contact with the main grid 030 on the surface of the battery cell 003, so that the conductive thin wire 21 and the conductive stage 1 can apply a deflection voltage to the surface of the battery cell 003.

[0049] In order to simplify the structure and reduce the cost. Another example of this embodiment is as follows: Figure 3-4 As shown, only the first mounting frame 24 is connected to a driving component, so that the driving component drives the first mounting frame 24 to move up and down, so that the conductive thin wire 21 is away from or contacts the main grid 030 on the surface of the battery cell 003, so that the conductive thin wire 21 and the conductive platform 1 can apply a deflection voltage to the battery cell 003 (for example, the conductive thin wire 21 and the conductive platform 1 are respectively electrically connected to the negative electrode and the positive electrode of the external power supply, and the conductive platform 1 is electrically in contact with the back of the battery cell 003, and the conductive thin wire 21 is electrically in contact with the main grid 030 on the front of the battery cell 003; in this way, a deflection voltage can be applied to the battery cell 003). This example is a preferred example, so the following is a detailed description taking this preferred example as an example.

[0050] Therefore, under the dual effects of deflection voltage and laser scanning, the laser-assisted sintering process of the entire cell 003 can be realized, so that better contact can be formed between the metal (such as metal electrode or metal grid line) and the semiconductor (such as silicon surface), thereby improving the contact performance of the cell 003 and contributing to improving the photoelectric conversion efficiency of the battery. In this embodiment, the laser scanning area of ​​the laser scanning locator 3 covers the surface of the entire cell 003; this is because: compared with the probe row, the equivalent diameter of the conductive fine wire 21 is smaller, and the light shielding generated is small, which is basically negligible and will not affect the laser-assisted sintering of the entire cell 003; therefore, the laser scanning locator 3 only needs to be used to scan the surface of the entire cell 003 in one step, without the need to scan in two steps as in the prior art publication number CN117650198A, where only half of the cell 003 is scanned each time. Therefore, compared with the prior art such as CN117650198A, the laser-assisted sintering device of this embodiment can realize one-step operation scanning, and the conductive fine wire 21 will not bring negative effects of shading, so it takes less time and can increase the production capacity by more than double.

[0051] Specifically, the equivalent diameter of the conductive fine wire 21 is 1 μm-1 mm (such as 1 μm, 3 μm, 40 μm, 50 μm, 100 μm, 500 μm, 800 μm, 995 μm or 1 mm); the equivalent diameter of the conductive fine wire 21 is preferably 40-50 μm (more preferably 50 μm). The conductive fine wire 21 is a gold wire, a silver wire, a copper wire or a gold-plated copper wire (preferably a gold-plated copper wire). Of course, in other examples, the conductive fine wire 21 can also be a fine wire of other materials with conductive properties.

[0052] like Figure 3-4 As shown, the driving assembly includes an inductive driving member 22 and a driving rod 23 (such as a threaded rod). The two ends of the driving rod 23 are respectively connected to the inductive driving member 22 and the first mounting frame 24, so that the inductive driving member 22 drives the first mounting frame 24 to move up and down through the driving rod 23. Specifically, the first mounting frame 24 and the second mounting frame 25 both include a connecting rod 26 and a mounting column 27. The driving rod 23 is connected to the connecting rod 26 of the first mounting frame 24, and the connecting rod 26 of the second mounting frame 25 is installed in the middle area of ​​the turntable 4 (the turntable 4 includes a rotatable edge area and a fixed middle area); one end of the mounting column 27 is connected to the end of the conductive thin wire 21, and the other end of the mounting column 27 is connected to the connecting rod 26.

[0053] Specifically, the outer side of the turntable 4 is provided with a loading area 5, a laser-assisted sintering area 6 and a unloading area 7 in sequence along the circumferential direction. Figure 3 As shown, the loading area 5 and the unloading area 7 are equipped with external loading devices 51 and unloading devices 71 .

[0054] like Figure 3-4As shown, the conductive table 1 is installed in the edge area of ​​the turntable 4; the first mounting bracket 24 is located in the laser-assisted sintering area 6 outside the turntable 4, and the second mounting bracket 25 is installed in the middle area of ​​the turntable 4; one end of the conductive wire 21 extends to the outside of the turntable 4 and is connected to the mounting column 27 of the first mounting bracket 24; and the other end of the conductive wire 21 extends to the middle area of ​​the turntable 4 and is connected to the mounting column 27 of the second mounting bracket 25.

[0055] In this way, the connecting rod 26 of the second mounting frame 25 is installed in the middle area of ​​the turntable 4 (rather than on the outside of the turntable 4), which will neither affect the rotation of the edge area of ​​the turntable 4 nor require excessively extending the length of the conductive wire 21, thereby reducing consumables and enabling the conductive wire 21 to be more accurately aligned with the main grid 030 on the front side of the battery cell 003 (the longer the conductive wire 21 is, the more difficult it is to align it with the main grid 030 on the front side of the battery cell 003).

[0056] In this embodiment, when the pressure component 2 applies the deflection voltage, the length direction of the conductive thin wire 21 is consistent with the direction of the main grid 030 of the battery cell 003. In the process of applying the deflection voltage, the conductive thin wire 21 is in line contact with the main grid 030 of the battery cell 003. Compared with the point contact between multiple pins and the main grid 030 of the battery cell 003 in the prior art such as CN117650198A, the line contact can make the conductive thin wire 21 pressed on the battery cell 003 as a whole, and the stress points on the surface of the battery cell 003 are more uniform, and there will be no local stress concentration phenomenon, so it can greatly reduce the risk of fragmentation in the process of applying the deflection voltage to the battery cell 003, and improve the yield rate of laser-assisted sintering.

[0057] The number of the conductive thin wires 21 is less than or equal to 20. When the number of the conductive thin wires 21 is multiple, the multiple conductive thin wires 21 are sequentially spaced apart (eg Figure 3-4 Three conductive thin wires 21 are shown, which are spaced apart to apply deflection voltages to different main grids 030 on the battery cell 003 ; the number of mounting posts 27 on the first mounting frame 24 (or the second mounting frame 25 ) is the same as the number of conductive thin wires 21 .

[0058] The number of the conductive thin wire 21 is preferably one, and the conductive thin wire 21 only needs to electrically contact the main grid 030 in the middle of the battery cell 003. Compared with the probe row in the prior art which requires multiple probes (two rows of probe rows are fully inserted with at least 96 probes), the laser-assisted sintering device of this embodiment optimally requires only one conductive thin wire 21, so the replacement of the conductive thin wire 21 is more time-saving and labor-saving, and the cost is also lower.

[0059] In addition, the existing conductive platform 1, such as Figure 5As shown, the entire table surface carrying the battery cell 003 is flat, and the entire conductive table 1 is a cube or a rectangular parallelepiped. However, the existing conductive table 1 cannot be used in conjunction with the conductive fine wire 21 of the laser-assisted sintering device of this embodiment. This is because it was found during the experiment that: Figure 5 As shown, during the process of the induction drive member 22 being driven by the drive rod 23 and the mounting frame driving the conductive thin wire 21 to move downward, in order to ensure that the conductive thin wire 21 can be in close contact with the main grid 030 on the surface of the battery cell 003 to ensure the conductive performance, the end of the conductive thin wire 21 is bound to form a gap at the side of the battery cell 003 as shown in FIG. Figure 5 As shown in the force point A, if the surface of the conductive platform 1 is flat as a whole, the end of the conductive thin wire 21 can easily form a side edge of the conductive platform 1 as shown in the figure. Figure 5 The electrical contact point B shown results in a short circuit.

[0060] Therefore, in order to avoid the short circuit phenomenon, the conductive platform 1 of this embodiment can be used in conjunction with the conductive thin wire 21 of the laser-assisted sintering device. This embodiment provides the following two schemes of the table structure of the conductive platform 1:

[0061] Option 1: See Figure 6 , the surface area of ​​the conductive platform 1 that supports the battery cell 003 is still flat, while the rest of the surface area (such as the side of the surface) is a curved chamfer 11. In this way, in the process of the induction drive 22 driving the driving rod 23 and the mounting frame driving the conductive thin wire 21 to move downward, in order to ensure that the conductive thin wire 21 can be in close contact with the main grid 030 on the surface of the battery cell 003 to ensure the conductive performance, the end of the conductive thin wire 21 will still form a curved chamfer 11 on the side of the battery cell 003. Figure 6 However, due to the design of the curved chamfer 11 on the side of the table, the end of the conductive wire 21 can be provided as Figure 6 The avoidance space C shown can prevent the conductive thin wire 21 from contacting the conductive platform 1 when moving downward and causing a short circuit problem.

[0062] Option 2: See Figure 7 , the table top of the conductive table 1 is a curved table top 12, and the curved table top 12 is bent toward the direction of the battery cell 003, so as to prevent the conductive thin wire 21 from contacting the conductive table 1 when moving downward and causing a short circuit problem. Specifically, the curvature of the curved table top 12 is less than or equal to half of π (preferably less than or equal to one-third of π). In practice, the battery cell 003 is a planar structure, but the battery cell 003 can be normally bent to a certain curvature without being damaged; therefore, the battery cell 003 can fit the curved table top 12, thereby ensuring that the back of the battery cell 003 can fit closely to the curved table top 12, and ensuring that the conductive thin wire 21 can fit more closely to the main grid 030 of the battery cell 003 when pressed downward. Scheme 2 is preferred.

[0063] A laser-assisted sintering method of this embodiment is performed using a laser-assisted sintering device described above in this embodiment; the following takes a 7BB cell 003 as an example (a 7BB cell 003 refers to a cell with 7 main grids 030 in its grid line pattern) to describe the process steps of the laser-assisted sintering method in detail:

[0064] S1, the battery cell 003 is transferred to the surface of the conductive table 1 of the turntable 4 by the loading device 51 through the loading area 5, and the turntable 4 drives the conductive table 1 to rotate counterclockwise (such as 90° counterclockwise) to transfer the battery cell 003 to the position below the conductive fine wire 21 (such as Figure 3 shown).

[0065] S2. When the laser scanning locator 3 locates the battery cell 003 to the corresponding position, the laser scanning locator 3 transmits the positioning signal to the inductive drive 22, so that the inductive drive 22 drives the mounting frame (the first mounting frame 24 and / or the second mounting frame 25) to move downward through the driving rod 23, so that the mounting frame drives the conductive thin wire 21 to contact the main grid 030 on the surface of the battery cell 003, and forms a pressing effect (see Figure 4 , the direction indicated by the arrow is the direction in which the first mounting bracket 24 and the second mounting bracket 25 move downward).

[0066] S3, the conductive table 1 and the conductive wire 21 are electrically connected to the positive and negative electrodes of the external power supply respectively, so that the conductive wire 21 and the conductive table 1 are energized to generate a potential difference to apply a deflection voltage to the battery cell 003, and the laser scanning positioning instrument 3 performs a one-step laser scanning on the surface of the entire battery cell 003 to perform laser-assisted sintering on the battery cell 003.

[0067] S4. After completing the laser assisted sintering, the induction drive member 22 drives the mounting frame (the first mounting frame 24 and / or the second mounting frame 25) to move upward through the driving rod 23, so that the mounting frame drives the conductive wire 21 away from the surface of the battery cell 003, and the turntable 4 then drives the conductive table 1 to rotate counterclockwise (such as 90° counterclockwise), so that the battery cell 003 is moved out of the laser assisted sintering device through the unloading area 7 using the unloading device 71.

[0068] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0069] The technical solution provided by the present invention is introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A laser-assisted sintering device, characterized in that: It includes a conductive platform, a pressure-applying component and a laser scanning locator; the surface of the conductive platform is used to carry the battery sheet; The pressure-applying assembly is a suspension bridge structure, which includes a conductive fine wire and a driving assembly; The laser scanning locator is located above the conductive platform, and the laser scanning locator is communicatively connected with the driving assembly to perform position positioning and laser scanning on the battery sheet; The conductive thin wire and the conductive platform are both electrically connected to an external power supply; the conductive thin wire is located above the conductive platform, and both ends of the conductive thin wire are connected to a mounting frame; the driving component is connected to at least one mounting frame or the conductive platform, so that the driving component drives the mounting frame or the conductive platform to move up and down, so that the conductive thin wire is away from or contacts the main grid on the surface of the battery cell, so that the conductive thin wire and the conductive platform can apply a deflection voltage to the battery cell.

2. The laser-assisted sintering device according to claim 1, characterized in that: The laser scanning area of ​​the laser scanning positioning instrument covers the entire surface of the battery cell; When the pressure-applying component applies a deflection voltage, the length direction of the conductive thin wire is consistent with the main grid direction of the battery cell; The equivalent diameter of the conductive thin wire is 1 μm-1 mm; the conductive thin wire is a gold wire, a silver wire, a copper wire or a gold-plated copper wire.

3. The laser-assisted sintering device according to claim 2, characterized in that: The equivalent diameter of the conductive thin wire is 40-50 μm; the conductive thin wire is a gold-plated copper wire.

4. The laser-assisted sintering device according to claim 1, characterized in that: The side edge of the table surface of the conductive table is a curved chamfered surface to prevent the conductive thin wire from contacting the conductive table when moving downward and causing a short circuit.

5. A laser-assisted sintering device according to claim 1 or 4, characterized in that: The table top of the conductive table is a curved table top, which is bent toward the direction of the battery cell, and the curvature of the curved table top is less than or equal to half of π, and the battery cell is attached to the curved table top.

6. The laser-assisted sintering device according to claim 1, characterized in that: It also includes a turntable; the conductive thin wire is located above the turntable, and the conductive platform is installed on the turntable, so that the turntable drives the conductive platform to rotate, so that the main grid of the battery sheet on the conductive platform moves to the bottom of the conductive thin wire.

7. The laser-assisted sintering device according to claim 6, characterized in that: The outer side of the turntable is provided with a loading area, a laser-assisted sintering area and a unloading area in sequence along the circumferential direction; The conductive table is installed at the edge area of ​​the turntable; one mounting frame is located in the laser-assisted sintering area outside the turntable, and the other mounting frame is installed in the middle area of ​​the turntable; one end of the conductive wire extends outside the turntable and is connected to a mounting frame, while the other end of the conductive wire extends to the middle area of ​​the turntable and is connected to another mounting frame.

8. The laser-assisted sintering device according to claim 1, characterized in that: The driving assembly includes an inductive driving member and a driving rod, and the two ends of the driving rod are respectively connected to the inductive driving member and the mounting frame, so that the inductive driving member drives the mounting frame to move up and down through the driving rod; The mounting frame comprises a connecting rod and a mounting column; the driving rod is connected to the connecting rod, and two ends of the mounting column are respectively connected to the end of the conductive thin wire and the connecting rod.

9. The laser-assisted sintering device according to claim 8, characterized in that: The number of the conductive thin wires is less than or equal to 20; when there are multiple conductive thin wires, the multiple conductive thin wires are distributed in sequence to apply deflection voltages to different main grids on the battery cell respectively; the number of mounting columns on each mounting frame is the same as the number of conductive thin wires.

10. A laser-assisted sintering method, characterized in that: The method is carried out using a laser-assisted sintering device as described in any one of claims 1 to 9, and comprises the following steps: S1, after transferring the battery cell to the surface of the conductive table, transfer the battery cell to the bottom of the conductive thin wire; S2, the laser scanning locator transmits the position positioning signal of the battery cell to the driving component, so that the driving component drives the mounting frame to move downward or drives the conductive table to move upward, so that the conductive thin wire contacts the main grid on the surface of the battery cell; S3, the conductive table and the conductive thin wire are electrically connected to the positive and negative electrodes of the external power supply respectively to apply a deflection voltage to the battery cell, and the laser scanning positioning instrument performs a laser scan on the surface of the entire battery cell to perform laser-assisted sintering on the battery cell; S4. After the laser-assisted sintering is completed, the driving assembly drives the mounting frame to move upward or drives the conductive table to move downward to keep the conductive wire away from the surface of the battery cell, and then the battery cell is removed from the laser-assisted sintering device.

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