Focal plane packaging structure

Abstract

The invention relates to the technical field of focal plane packaging, in particular to a focal plane packaging structure which comprises a protection box, a heat conduction unit, a semiconductor refrigeration unit, a circuit board and a focal plane detector. The semiconductor refrigeration unit is installed between the inner bottom face of the protection box and the heat conduction unit. The circuit board is installed on the top face of the heat conduction unit, and the two opposite sides of the circuit board make contact with the corresponding sides of the heat conduction unit respectively. The focal plane detector is mounted on the top surface of the circuit board, and the middle is in contact with the middle of the heat conduction unit. The focal plane detector is electrically connected with the circuit board through a pin. Heat of the two opposite sides of the circuit board is transmitted to the semiconductor refrigeration unit through the heat conduction unit, heat of the middle of the focal plane detector is transmitted to the semiconductor refrigeration unit through the heat conduction unit, the heat is transmitted to the bottom face of the protection box through the semiconductor refrigeration unit, and then the heat is transmitted away through the heat pipe. The whole heat conduction path can efficiently transfer heat, and the heat dissipation efficiency and the heat dissipation effect are guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of focal plane packaging technology, and in particular to a focal plane packaging structure. Background Art

[0002] As various optical payloads are carried on satellites, the camera structure suitable for the unique environment of space is also constantly developing. Especially for some high-precision optical remote sensing satellites, the camera structure is very sensitive to temperature changes. Therefore, it is very important to dissipate heat and control the temperature of the heating elements in the space camera.

[0003] The circuit board and focal plane detector in the focal plane packaging structure are electronic components that generate relatively serious heat. The heat needs to be transferred to the shell first and then transferred away through the heat pipe. This requires that the entire heat conduction path can transfer heat efficiently, otherwise the heat dissipation effect cannot be guaranteed.

[0004] Therefore, how to ensure the heat dissipation effect becomes a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] The present invention provides a focal plane packaging structure to solve the problem of how to ensure the heat dissipation effect.

[0006] The present invention provides a focal plane packaging structure, comprising: A protective box having a detection port formed on a top surface; A heat transfer unit is installed in the protective box; The semiconductor refrigeration unit is installed between the inner bottom surface of the protection box and the heat conduction unit; The circuit board is mounted on the top surface of the heat conduction unit, and two opposite sides are in contact with corresponding sides of the heat conduction unit respectively; The focal plane detector is mounted on the top surface of the circuit board, and the middle portion thereof contacts the middle portion of the heat conduction unit.

[0007] In some of the embodiments, a first clearance hole is formed in the middle of the circuit board; The heat transfer unit includes: The upper heat conduction plate has first heat conduction protrusions formed on the top surfaces of the two opposite sides, a first accommodating groove formed in the middle of the bottom surface, and a second clearance hole formed in the middle; the first heat conduction protrusions on the two sides are in contact with the bottom surface of the corresponding side of the circuit board through the first insulating heat conductive pads; The lower heat conduction plate is detachably installed in the first accommodating groove, and a second heat conduction protrusion is formed in the middle of the top surface, and the bottom surface contacts the top surface of the semiconductor refrigeration unit through the second insulating thermal conductive pad; after the second heat conduction protrusion passes through the second clearance hole and the first clearance hole in sequence, the top surface contacts the bottom surface of the focal plane detector through the third insulating thermal conductive pad.

[0008] In some of these embodiments, a third heat conduction protrusion is formed in the middle of the inner bottom surface of the protection box; the top surface of the third heat conduction protrusion is in contact with the bottom surface of the semiconductor refrigeration unit through a fourth insulating heat conducting pad.

[0009] In some of these embodiments, first heat insulating columns are respectively arranged at the four corners of the inner bottom surface of the protection box; a first threaded hole is formed in the middle of each first heat insulating column; first threaded holes are respectively arranged at the four corners of the upper heat conducting plate, and the first heat insulating column and the upper heat conducting plate are fixedly connected by using first screws through the first threaded holes; Second heat insulating columns are respectively installed at the four corners of the top surface of the upper heat conducting plate; a second threaded hole is formed in each second heat insulating column; second threaded holes are respectively arranged at the four corners of the circuit board; third heat insulating columns are respectively arranged at the four corners of the bottom surface of the focal plane detector; a second threaded hole is formed in the middle of each third heat insulating column; the third heat insulating column, the circuit board and the second heat insulating column are fixedly connected by using second screws through the second threaded holes; A plurality of pins are arranged in the middle of the bottom surface of the focal plane detector; correspondingly, a plurality of jacks adapted to the pins are arranged in the middle of the circuit board; the plurality of pins and the plurality of jacks are soldered in one-to-one correspondence.

[0010] In some of these embodiments, the cross section of each second heat insulating column is a structure with two arc-shaped ends and two straight sides.

[0011] In some of these embodiments, the focal plane detector includes: A sealing plate, with third heat insulating columns respectively arranged at the four corners of the bottom surface; A pressing plate, detachably installed on the bottom surface of the sealing plate, and a second accommodation groove is formed between the top surface of the pressing plate and the top surface of the sealing plate; A detection component, installed in the second accommodation groove.

[0012] In some of these embodiments, first heat transfer cavities are respectively arranged inside the opposite sides of the upper heat conducting plate; a first phase change medium is stored in each first heat transfer cavity; a first adsorption strip for adsorbing the first phase change medium is arranged in the first heat transfer cavity; the first adsorption strip is in a "Ji" shape, and the top is installed at the top of the first heat transfer cavity through a first shape memory alloy part; Second heat transfer cavities are respectively arranged inside the middle of the lower heat conducting plate; a second phase change medium is stored in the second heat transfer cavity; a second adsorption strip for adsorbing the second phase change medium is arranged in the second heat transfer cavity; the second adsorption strip is in a "Ji" shape, and the top is installed at the top of the second heat transfer cavity through a second shape memory alloy part.

[0013] In some of these embodiments, the protection box includes: A box body; A bottom cover, detachably connected to the bottom of the box body.

[0014] The beneficial effects of the present invention are as follows: the focal plane packaging structure of the present invention is provided with a protective box, a heat conduction unit, a semiconductor refrigeration unit, a circuit board and a focal plane detector. When the focal plane packaging structure is in working state, the heat on the opposite sides of the circuit board is transferred to the semiconductor refrigeration unit through the heat conduction unit, and the heat in the middle of the focal plane detector is transferred to the semiconductor refrigeration unit through the heat conduction unit. The heat is transferred to the bottom surface of the protective box by means of the semiconductor refrigeration unit, and then the heat is transferred away by means of the heat pipe. The entire heat conduction path can efficiently transfer heat, ensuring the heat dissipation efficiency and heat dissipation effect. The overall form of stacking layers is adopted, which occupies less space and is conducive to reducing the launch cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of some specific embodiments of a focal plane packaging structure of the present invention; Figure 2 yes Figure 1 An exploded view of the focal plane packaging structure shown; Figure 3 yes Figure 1 A schematic diagram of the combined structure of the circuit board and the focal plane detector in the focal plane packaging structure shown; Figure 4 yes Figure 1 A schematic diagram of the combined structure of the heat conduction unit, the circuit board and the focal plane detector in the focal plane packaging structure shown; Figure 5 yes Figure 1 A schematic diagram of the combined structure of the bottom cover, the semiconductor refrigeration unit and the heat conduction unit in the focal plane packaging structure shown; Figure 6 is a schematic diagram of the combined structure of the heat transfer unit, the circuit board and the focal plane detector; and is a schematic diagram of the combined structure of other embodiments; Figure 7 yes Figure 6 A partial enlarged view of the middle A area; Figure 8 yes Figure 6 A partial enlarged view of area B in the middle.

[0016] In the accompanying drawings, 110, protective box; 111, box body; 1111, detection port; 112, bottom cover; 1121, third heat conduction protrusion; 1122, first heat insulation column; 120, heat conduction unit; 121, upper heat conduction plate; 1211, first heat conduction protrusion; 1212, second make way hole; 1213, second heat insulation column; 1214, first heat transfer cavity; 1215, first phase change medium; 1216, first adsorption strip; 1217, first memory alloy member; 122, lower heat conduction plate; 1221, second heat conduction protrusion; 1222, second heat conduction cavity; 1223, second adsorption strip; 1224, second memory alloy piece; 130, circuit board; 131, first give-way hole; 140, focal plane detector; 141, sealing plate; 1411, third thermal insulation column; 142, pressure plate; 143, detection components; 1431, pin; 150, semiconductor refrigeration unit; 161, first screw; 162, second screw; 163, third screw; 164, fourth screw; 171, first insulating thermal pad; 172, second insulating thermal pad; 173, third insulating thermal pad; 174, fourth insulating thermal pad. DETAILED DESCRIPTION

[0017] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] As in the background technology, the circuit board and focal plane detector in the focal plane packaging structure are electronic components with relatively serious heat generation. The heat needs to be transferred to the shell first, and then transferred away through the heat pipe. This requires that the entire heat conduction path can efficiently transfer heat, otherwise, the heat dissipation effect cannot be guaranteed. Therefore, how to ensure the heat dissipation effect has become a technical problem that technicians in this field need to solve urgently.

[0019] To solve the above problems, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8The present invention provides a focal plane packaging structure, including a protective box 110, a heat conduction unit 120, a semiconductor refrigeration unit 150, a circuit board 130 and a focal plane detector 140. The protective box 110 isolates the outside from the heat conduction unit 120, the semiconductor refrigeration unit 150, the circuit board 130 and the focal plane detector 140. A detection port 1111 is formed on the top surface of the protective box 110, and a lens is installed in the detection port 1111. The heat conduction unit 120 is installed in the protective box 110. The semiconductor refrigeration unit 150 is installed between the inner bottom surface of the protective box 110 and the heat conduction unit 120. The circuit board 130 is installed on the top surface of the heat conduction unit 120, and the opposite two sides are respectively in contact with the corresponding sides of the heat conduction unit 120. The focal plane detector 140 is installed on the top surface of the circuit board 130, and the middle part is in contact with the middle part of the heat conduction unit 120. The focal plane detector 140 is electrically connected to the circuit board 130 through the pin 1431. It should be noted that when the focal plane packaging structure is in working state, the heat generating area of ​​the circuit board 130 is mainly distributed on the opposite sides of the circuit board 130, while the heat generating area of ​​the focal plane detector 140 is mainly concentrated in the middle position of the focal plane detector 140. The heat on the opposite sides of the circuit board 130 is transferred to the semiconductor refrigeration unit 150 through the heat conduction unit 120, and the heat in the middle of the focal plane detector 140 is transferred to the semiconductor refrigeration unit 150 through the heat conduction unit 120. The heat is transferred to the bottom surface of the protective box 110 by means of the semiconductor refrigeration unit 150, and then the heat is transferred away by means of the heat pipe. The entire heat conduction path can efficiently transfer heat, ensuring the heat dissipation efficiency and heat dissipation effect. The overall form of stacking layers is adopted, which occupies a small space and is conducive to reducing the launch cost.

[0020] Specifically, in the example, Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, a first clearance hole 131 is formed in the middle of the circuit board 130. The heat conduction unit 120 includes an upper heat conduction plate 121 and a lower heat conduction plate 122. The top surfaces of the upper heat conduction plate 121 on opposite sides are respectively formed with first heat conduction protrusions 1211. The first heat conduction protrusions 1211 on both sides are in contact with the bottom surfaces of the corresponding sides of the circuit board 130 through the first insulating heat conduction pads 171 and the thermal conductive silicone grease. The material of the upper heat conduction plate 121 has good thermal conductivity and can be copper or silver, etc. The heat of the opposite sides of the circuit board 130 is transferred to the first heat conduction protrusions 1211 on the corresponding sides through the first insulating heat conduction pads 171 and the thermal conductive silicone grease on the corresponding sides, and then transferred to the semiconductor refrigeration unit 150. A first accommodating groove is formed in the middle of the bottom surface of the upper heat conduction plate 121, and a second clearance hole 1212 is formed in the middle. The lower heat conduction plate 122 is detachably installed in the first accommodating groove. On the one hand, it is convenient to disassemble, replace and install the lower heat conduction plate 122 and the upper heat conduction plate 121; on the other hand, the assembled lower heat conduction plate 122 and the upper heat conduction plate 121 occupy a small space. A second heat conduction protrusion 1221 is formed in the middle of the top surface of the lower heat conduction plate 122, and the bottom surface contacts the top surface of the semiconductor refrigeration unit 150 through the second insulating heat conductive pad 172 and the thermal conductive silicone grease. After the second heat conduction protrusion 1221 passes through the second clearance hole 1212 and the first clearance hole 131 in sequence, the top surface contacts the bottom surface of the focal plane detector 140 through the third insulating heat conductive pad 173 and the thermal conductive silicone grease. The material of the lower heat conduction plate 122 has good thermal conductivity and can be copper or silver, etc. The heat in the middle of the focal plane detector 140 is transferred to the second heat conduction protrusion 1221 through the third insulating heat conductive pad 173 and the thermal conductive silicone grease, and then transferred to the semiconductor refrigeration unit 150 through the second insulating heat conductive pad 172 and the thermal conductive silicone grease. A third heat-conducting protrusion 1121 is formed in the middle of the inner bottom surface of the protective box 110. The top surface of the third heat-conducting protrusion 1121 contacts the bottom surface of the semiconductor refrigeration unit 150 through the fourth insulating heat-conducting pad 174 and the thermal grease. The material of the protective box 110 has good thermal conductivity and can be copper or silver, etc. The semiconductor refrigeration unit 150 can transfer heat to the bottom end of the protective box 110 through the fourth insulating heat-conducting pad 174 and the thermal grease, so as to transfer the heat away with the help of the heat pipe. By grinding the top surface of the first heat-conducting protrusion 1211, the gap between the top surface of the first heat-conducting protrusion 1211 and the bottom surface of the circuit board 130 can be effectively adjusted to avoid the gap being too large to affect the heat dissipation effect, and to avoid the first insulating heat-conducting pad 171 being squeezed and deformed due to the gap being too small, and the heat dissipation effect being worsened due to the thermal grease being squeezed out.By grinding the top surface of the second heat-conducting protrusion 1221, the gap between the top surface of the second heat-conducting protrusion 1221 and the bottom surface of the focal plane detector 140 can be effectively adjusted to avoid the gap being too large to affect the heat dissipation effect, and to avoid the gap being too small to cause the third insulating heat-conducting pad 173 to be squeezed and deformed, and the thermal grease to be squeezed out, resulting in a poor heat dissipation effect. By grinding the top surface of the third heat-conducting protrusion 1121, the gap between the top surface of the semiconductor refrigeration unit 150 and the bottom surface of the lower heat-conducting plate 122 can be effectively adjusted to avoid the gap being too large to affect the heat dissipation effect, and to avoid the gap being too small to cause the second insulating heat-conducting pad 172 and the fourth insulating heat-conducting pad 174 to be squeezed and deformed, and the thermal grease to be squeezed out, resulting in a poor heat dissipation effect. The grinding work considering the heat dissipation efficiency is decoupled from the assembly work of the focal plane packaging structure. Through decoupling, the grinding and assembly processes are independent of each other, reducing mutual interference and constraints, improving the overall performance of the production system, and more conveniently adjusting the two links independently, reducing the difficulty of assembly and grinding.

[0021] Preferably, the bottom surface of the upper heat conduction plate 121 is also in contact with the top surface of the semiconductor refrigeration unit 150 through the second insulating heat conductive pad 172 and the thermal conductive silicone grease to further improve the heat dissipation efficiency.

[0022] Preferably, a fifth insulating thermal pad and thermally conductive silicone grease are disposed between the bottom surface of the upper heat conduction plate 121 and the top surface of the lower heat conduction plate 122 to further improve the heat dissipation efficiency.

[0023] Specifically, in the example, Figure 2 , Figure 3 , Figure 5As shown, first heat-insulating columns 1122 are respectively arranged at the four corners of the inner bottom surface of the protection box 110. A first threaded hole is formed in the middle of each first heat-insulating column 1122. First threaded holes are respectively arranged at the four corners of the upper heat-conducting plate 121, and the first heat-insulating columns 1122 and the upper heat-conducting plate 121 are fixedly connected by using first screws 161 through the first threaded holes to fix the inner bottom surface of the protection box 110 and the upper heat-conducting plate 121. In this way, the disassembly and assembly of the protection box 110 and the upper heat-conducting plate 121 are convenient. Second heat-insulating columns 1213 are respectively installed at the four corners of the top surface of the upper heat-conducting plate 121. A second threaded hole is formed in each second heat-insulating column 1213. Second threaded holes are respectively arranged at the four corners of the circuit board 130. Third heat-insulating columns 1411 are respectively arranged at the four corners of the bottom surface of the focal plane detector 140. A second threaded hole is formed in the middle of each third heat-insulating column 1411. The third heat-insulating column 1411, the circuit board 130 and the second heat-insulating column 1213 are fixedly connected through the second threaded hole using the second screw 162 to fix the focal plane detector 140, the circuit board 130 and the upper heat-conducting plate 121. In this way, the focal plane detector 140, the circuit board 130 and the upper heat-conducting plate 121 can be easily disassembled and assembled. A plurality of pins 1431 are provided in the middle of the bottom surface of the focal plane detector 140. Correspondingly, a plurality of sockets adapted to the pins 1431 are provided in the middle of the circuit board 130. The plurality of pins 1431 are welded in a one-to-one correspondence with the plurality of sockets. Before welding, the focal plane detector 140, the circuit board 130 and the upper heat-conducting plate 121 are first fixedly connected through the second threaded hole using the second screw 162, and then the plurality of pins 1431 are welded in a one-to-one correspondence with the plurality of sockets to ensure that the welding points are not subjected to assembly stress. Moreover, the circuit board 130 is fixed by clamping the circuit board 130 up and down, and the circuit board 130 is only subjected to the clamping force, and no redundant assembly force is introduced, thereby avoiding the occurrence of warping deformation, different gaps at different positions, internal pressure, etc. caused by the poor processing accuracy of the circuit board 130 itself. Fourth threaded holes are respectively provided at the four corners of the lower heat conduction plate 122, and fourth threaded holes are respectively provided at the four corners of the upper heat conduction plate 121. The lower heat conduction plate 122 and the upper heat conduction plate 121 are fixedly connected by the fourth screws 164 through the fourth threaded holes. In this way, the lower heat conduction plate 122 and the upper heat conduction plate 121 can be easily disassembled and assembled.

[0024] Preferably, the cross section of each second heat-insulating column 1213 is a structure with arc-shaped ends and straight lines on both sides, which increases the contact area between each second heat-insulating column 1213 and the circuit board 130 and reduces the risk of stress concentration. A second threaded hole is provided at one end of each second heat-insulating column 1213, and a fifth threaded hole is provided at the other end. Fifth threaded holes are also provided at the four corners of the upper heat-conducting plate 121. The second heat-insulating column 1213 is mounted on the upper heat-conducting plate 121 through the fifth threaded hole using a fifth screw. Since the fifth threaded hole is staggered with the second threaded hole, the connection point between the focal plane detector 140 and the circuit board 130 and the connection point between the upper heat-conducting plate 121 and the circuit board 130 are staggered with each other to avoid stress concentration.

[0025] Specifically, in the example, Figure 1 and Figure 3 As shown, the focal plane detector 140 includes a sealing plate 141, a pressure plate 142 and a detection component 143. Third heat-insulating columns 1411 are respectively provided at the four corners of the bottom surface of the sealing plate 141. The pressure plate 142 is detachably mounted on the bottom surface of the sealing plate 141, and a second receiving groove is formed between the top surface and the top surface of the sealing plate 141. The detection component 143 is installed in the second receiving groove. In this way, the focal plane detector 140 occupies a smaller space as a whole, which facilitates the assembly, use, disassembly and replacement of the focal plane detector 140.

[0026] Preferably, third threaded holes are respectively provided at the four corners of the sealing plate 141 and the four corners of the pressing plate 142 , and the sealing plate 141 and the pressing plate 142 are fixedly connected by third screws 163 through the third threaded holes.

[0027] Preferably, the protective box 110 includes a box body 111 and a bottom cover 112. The bottom cover 112 is detachably connected to the bottom of the box body 111 to facilitate the disassembly and assembly of the focal plane packaging structure.

[0028] Preferably, the box body 111 and the bottom cover 112 are connected by screwing or snapping.

[0029] In some practical applications, such as Figure 4 As shown, the upper heat conduction plate 121 and the lower heat conduction plate 122 are solid structures, have good heat dissipation efficiency and heat dissipation effect, and can cool the circuit board 130 and the focal plane detector 140 to a suitable working temperature.

[0030] In other practical applications, such as Figure 6 , Figure 7As shown in the figure, first heat transfer cavities 1214 are respectively provided inside the opposite sides of the upper heat conduction plate 121. A first phase change medium 1215 is stored in the first heat transfer cavity 1214 on each side. A first adsorption strip 1216 for adsorption of the first phase change medium is provided in the first heat transfer cavity 1214. The first adsorption strip 1216 is in the shape of a "J", and the top is installed on the top of the first heat transfer cavity 1214 through a first memory alloy member 1217. Under different working conditions, the activity level of the circuit board 130 is different, and the heat generated is different. When the heat generated by the circuit board 130 is less, the first memory alloy member 1217 maintains low temperature phase deformation, so that the first adsorption strip 1216 will not be attached to the top surface of the first heat transfer cavity 1214, so that the first phase change medium 1215 and the first adsorption strip 1216 are almost not involved in the heat conduction task. When the circuit board 130 generates a lot of heat, the first memory alloy 1217 maintains the high temperature phase deformation, so that the first adsorption strip 1216 is attached to the top surface of the first heat transfer cavity 1214. With the help of the first adsorption strip 1216, the liquid first phase change medium 1215 climbs to the top of the first heat transfer cavity 1214 and vaporizes under the heat. The gaseous first phase change medium 1215 flows to the bottom of the first heat transfer cavity 1214 and liquefies when it is cooled. This reciprocating process greatly improves the heat conduction efficiency. A second heat transfer cavity 1222 is provided in the middle of the lower heat conduction plate 122, and a second phase change medium is stored in the second heat transfer cavity 1222. A second adsorption strip 1223 for the second phase change medium to be adsorbed is provided in the second heat transfer cavity 1222. The second adsorption strip 1223 is in the shape of a "J", and the top is installed on the top of the second heat transfer cavity 1222 through the second memory alloy 1224. Under different working conditions, the focal plane detector 140 has different levels of activity and generates different amounts of heat. When the focal plane detector 140 generates less heat, the second memory alloy 1224 maintains low-temperature phase deformation, so that the second adsorption strip 1223 will not be attached to the top surface of the second heat transfer cavity 1222, and the second phase change medium and the second adsorption strip 1223 hardly participate in the heat conduction task. When the focal plane detector 140 generates more heat, the second memory alloy 1224 maintains high-temperature phase deformation, so that the second adsorption strip 1223 is attached to the top surface of the second heat transfer cavity 1222. With the help of the second adsorption strip 1223, the liquid second phase change medium climbs to the top of the second heat transfer cavity 1222 and vaporizes under heat. The gaseous second phase change medium flows to the bottom of the second heat transfer cavity 1222 and liquefies when it is cooled. This reciprocating process greatly improves the heat conduction efficiency.

[0031] The present invention also provides an assembly method of a focal plane packaging structure, comprising the following steps: First, the sealing plate 141, the pressing plate 142 and the detection component 143 are connected. Then, the sealing plate 141, the circuit board 130 and the second heat insulation column 1213 are connected. Then, the plurality of pins 1431 are welded one by one with the plurality of sockets. After that, the second heat insulation column 1213 and the upper heat conduction plate 121 are connected. Then, the upper heat conduction plate 121 and the lower heat conduction plate 122 are connected. Then, the bottom cover 112, the semiconductor refrigeration unit 150 and the upper heat conduction plate 121 are connected. Finally, the box body 111 and the bottom cover 112 are connected to complete the packaging task.

[0032] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0036] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A focal plane packaging structure, characterized in that: include: A protective box having a detection port formed on a top surface; A heat transfer unit is installed in the protective box; A semiconductor refrigeration unit is installed between the inner bottom surface of the protection box and the heat conduction unit; A circuit board is mounted on the top surface of the heat conduction unit, with two opposite sides respectively contacting corresponding sides of the heat conduction unit; A focal plane detector is mounted on the top surface of the circuit board, and a middle portion thereof contacts the middle portion of the heat conduction unit.

2. The focal plane packaging structure according to claim 1, characterized in that: A first clearance hole is formed in the middle of the circuit board; The heat transfer unit comprises: The upper heat conduction plate has first heat conduction protrusions formed on the top surfaces of the two opposite sides, a first accommodating groove formed in the middle of the bottom surface, and a second clearance hole formed in the middle; the first heat conduction protrusions on both sides are in contact with the bottom surface of the corresponding side of the circuit board through the first insulating heat conductive pads; The lower heat conduction plate is detachably installed in the first accommodating groove, and a second heat conduction protrusion is formed in the middle of the top surface, and the bottom surface is in contact with the top surface of the semiconductor refrigeration unit through a second insulating thermal conductive pad; after the second heat conduction protrusion passes through the second clearance hole and the first clearance hole in sequence, the top surface contacts the bottom surface of the focal plane detector through a third insulating thermal conductive pad.

3. The focal plane packaging structure according to claim 2, characterized in that: A third heat-conducting protrusion is formed in the middle of the inner bottom surface of the protection box; the top surface of the third heat-conducting protrusion contacts the bottom surface of the semiconductor refrigeration unit through a fourth insulating heat-conducting pad.

4. The focal plane packaging structure according to claim 2, characterized in that: The four corners of the inner bottom surface of the protection box are respectively provided with first heat-insulating columns; a first threaded hole is formed in the middle of each of the first heat-insulating columns; the four corners of the upper heat-conducting plate are respectively provided with the first threaded holes, and the first heat-insulating columns and the upper heat-conducting plate are fixedly connected by first screws through the first threaded holes; The four corners of the top surface of the upper heat conduction plate are respectively provided with second heat insulation columns; each of the second heat insulation columns is formed with a second threaded hole; the four corners of the circuit board are respectively provided with the second threaded holes; the four corners of the bottom surface of the focal plane detector are respectively provided with third heat insulation columns; the middle part of each of the third heat insulation columns is formed with the second threaded hole; the third heat insulation columns, the circuit board and the second heat insulation columns are fixedly connected by using second screws through the second threaded holes; A plurality of pins are arranged in the middle of the bottom surface of the focal plane detector; correspondingly, a plurality of sockets matching the pins are arranged in the middle of the circuit board; and the plurality of pins are welded to the plurality of sockets in a one-to-one correspondence.

5. The focal plane packaging structure according to claim 4, characterized in that: The cross section of each of the second heat-insulating columns is a structure with arc-shaped ends and straight lines on two sides.

6. The focal plane encapsulation structure according to claim 4, characterized in that: The focal plane detector comprises: The sealing plate has the third heat-insulating columns respectively arranged at the four corners of the bottom surface; A pressing plate, detachably mounted on the bottom surface of the sealing plate, with a second accommodating groove formed between the top surface and the top surface of the sealing plate; The detection component is installed in the second containing groove.

7. The focal plane encapsulation structure according to claim 2, characterized in that: First heat transfer cavities are respectively arranged inside opposite sides of the upper heat conduction plate; a first phase change medium is stored in each of the first heat transfer cavities; a first adsorption strip for adsorbing the first phase change medium is arranged in the first heat transfer cavity; the first adsorption strip is in a "Ji" shape, and the top is installed at the top of the first heat transfer cavity through a first shape memory alloy part; Second heat transfer cavities are respectively arranged inside the middle of the lower heat conduction plate; a second phase change medium is stored in the second heat transfer cavities; a second adsorption strip for adsorbing the second phase change medium is arranged in the second heat transfer cavity; the second adsorption strip is in a "Ji" shape, and the top is installed at the top of the second heat transfer cavity through a second shape memory alloy part.

8. The focal plane packaging structure according to claim 1, characterized in that: The protective box includes: a box body; a bottom cover detachably connected to the bottom of the box body.

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