Method of manufacturing film assembly for transferring light-emitting element, film assembly, and method of manufacturing display device using

Abstract

A method of manufacturing a film assembly for transferring a light emitting element, a film assembly, and a method of manufacturing a display device using the film assembly are provided. The membrane module includes: a base portion; a stamp layer on the base portion; and a protective film on the stamp layer. The method includes forming a first cut region in the film assembly including exposing at least a portion of the impression layer; and forming a second cut region in the membrane module, including fully penetrating the membrane module. The formation of the second cut region is performed after the formation of the first cut region.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0149329 filed in the Korean Intellectual Property Office on November 1, 2023, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] Aspects of embodiments of the present disclosure relate to a method of manufacturing a film assembly for transferring a light emitting element, the film assembly, and a method of manufacturing a display device using the film assembly. Background Art

[0004] Recently, with the increasing interest in information display, research and development of display devices are also ongoing. Display devices may include light emitting elements as light sources. The light emitting elements may be transferred to a substrate for manufacturing a display device by using various methods.

[0005] For example, the light emitting element may be transferred to a backplane of a display device by using a stamp film comprising one or more layers. The stamp film may include a fine structure to properly transfer a light emitting element having a relatively small size.

[0006] When manufacturing errors occur in the structure formed on the stamp film, there may be a risk of manufacturing defects occurring during the transfer process of the light emitting element. Therefore, a method for carefully manufacturing the stamp film and the like and reducing process risks during the transfer process of the light emitting element is desired. Summary of the invention

[0007] Embodiments of the present disclosure provide a method for manufacturing a film assembly for transferring a light-emitting element, a film assembly, and a method for manufacturing a display device using the film assembly, wherein the quality of the film assembly for transferring a light-emitting element is improved, the risk of manufacturing defects is reduced, and the transfer reliability and accuracy of the light-emitting element are improved.

[0008] Embodiments of the present disclosure provide a method for manufacturing a film assembly for transferring a light-emitting element. The film assembly includes: a base portion; a stamp layer on the base portion; and a protective film on the stamp layer. The method includes: forming a first cutting area in the film assembly, including exposing at least a portion of the stamp layer; and forming a second cutting area in the film assembly, including completely penetrating the film assembly. Forming the second cutting area is performed after forming the first cutting area.

[0009] Forming the first cutting region may include completely penetrating the protective film but not completely penetrating the base portion and the stamp layer.

[0010] Forming the second cutting region may include forming a plurality of unit regions separated from each other.

[0011] The plurality of unit regions may be determined based on the shape of the second cutting region.

[0012] Forming the second cutting region may include cutting at least a portion of the film assembly by using a pointed die.

[0013] The film assembly may have a pin hole for aligning the position of the tip mold, and the pin hole may penetrate at least the protective film.

[0014] At least a portion of the protective film may be absent from the base portion and the stamp layer, and the pin hole may be in at least a portion of the protective film.

[0015] The pin hole may include a first pin hole formed in a first side of the membrane assembly and a second pin hole formed in a second side of the membrane assembly.

[0016] In forming the second cutting region, the film assembly may be on the film manufacturing substrate, and the polymer lower film may be between the film manufacturing substrate and the base portion.

[0017] According to an embodiment of the present disclosure, a film assembly for transferring a light-emitting element is provided. The film assembly includes: a base portion; a stamp layer on the base portion; and a protective film on the stamp layer. A first cutting area is formed in the protective film but not in the stamp layer and the base portion, and a second cutting area completely penetrates the base portion, the stamp layer, and the protective film.

[0018] According to an embodiment of the present disclosure, a method for manufacturing a display device includes: preparing a film assembly, the film assembly including a base portion, a stamp layer on the base portion, and a protective film on the stamp layer; connecting the film assembly and the stamp head; bending at least a portion of the film assembly; removing at least a portion of the protective film; and transferring a light-emitting element to a pixel circuit layer by using the film assembly connected to the stamp head. The film assembly has a first cutting area and a second cutting area. The first cutting area is formed in the protective film but not in the stamp layer and the base portion, and the second cutting area completely penetrates the base portion, the stamp layer, and the protective film.

[0019] The film assembly may include a plurality of unit areas defined by the second cutting area, and coupling the film assembly and the die head may include coupling a portion of the film assembly in at least one of the plurality of unit areas to the die head.

[0020] Bending at least a portion of the film assembly may include bending an edge portion of the film assembly based on the first cutting region.

[0021] Removing at least a portion of the protective film may include: removing at least a portion of the protective film surrounded by the first cutting region; and exposing at least a portion of the stamp layer.

[0022] The light emitting element may include a flip chip type micro light emitting diode.

[0023] According to an embodiment of the present disclosure, a method for manufacturing a film assembly for transferring a light-emitting element, a film assembly, and a method for manufacturing a display device by using the film assembly are provided, wherein the quality of the film assembly for transferring a light-emitting element can be improved, the risk of manufacturing defects can be reduced, and the transfer reliability and accuracy of the light-emitting element can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A top plan view of a display device according to an embodiment is shown.

[0025] Figure 2 According to the embodiment Figure 1 Pixels in a display device shown in .

[0026] Figure 3 A cross-sectional view of a display device according to an embodiment is shown.

[0027] Figure 4 is a flow chart describing a method of manufacturing a membrane module according to an embodiment.

[0028] Figure 5 A schematic top plan view of a membrane assembly according to an embodiment is shown.

[0029] Figures 6 to 8 Schematic top plan views showing steps of a method of manufacturing a membrane module according to an embodiment.

[0030] Figures 9 to 12 Schematic cross-sectional views showing steps of a method of manufacturing a membrane module according to an embodiment.

[0031] Fig.13 is a flowchart describing a method of manufacturing a display device according to an embodiment.

[0032] Figures 14 to 25 Cross-sectional views showing steps of a method of manufacturing a display device according to an embodiment. DETAILED DESCRIPTION

[0033] The present disclosure may be variously modified and may have various forms. Therefore, the embodiments will be described and described in detail below. However, this does not limit the present disclosure to the described embodiments, and the present disclosure should be understood to include all embodiments included in the spirit and scope of the present disclosure, including all changes, equivalents and substitutions.

[0034] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, directly connected to, or directly coupled to the other element or layer, or there may also be one or more intervening elements or layers. When an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. For example, when a first element is described as being "coupled to" or "connected to" a second element, the first element may be directly coupled to or directly connected to the second element, or the first element may be indirectly coupled to or indirectly connected to the second element via one or more intervening elements.

[0035] In the accompanying drawings, for the clarity of explanation, the sizes of various elements, layers, etc. may be exaggerated. The same reference numerals represent the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items. In addition, when describing the embodiments of the present disclosure, the use of "may" relates to "one or more embodiments of the present disclosure". Expressions such as "at least one of ..." and "any one of ...", when after a column of elements, modify the elements of the entire column, and do not modify the individual elements in the column. For example, the expression "at least one of a, b, and c" means only a, only b, only c, a and b, a and c, b and c, a, b, and c, all or variations thereof. As used herein, the terms "use (use)", "use (using)" and "used (used)" can be considered as synonymous with the terms "utilize (utilize)", "utilize (utilizing)" and "utilized (utilized)" respectively. As used herein, the terms "substantially," "about," and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent variations in measurements or calculations that would be recognized by those of ordinary skill in the art.

[0036] It will be understood that although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teaching of the exemplary embodiment, the first element, first component, first region, first layer or first part discussed below can be referred to as the second element, second component, second region, second layer or second part.

[0037] For ease of description, spatially relative terms such as "below," "below," "down," "above," "on," etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the drawings. It will be understood that, in addition to the orientation depicted in the drawings, spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, the elements described as being "below" or "below" other elements or features will then be oriented "above" or "on" the other elements or features. Therefore, the term "below" may encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0038] The terms used herein are for the purpose of describing the embodiments of the present disclosure, and are not intended to limit the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms "a" and "an" are intended to also include plural forms. It will also be understood that the terms "include", "comprise", "include", "include" and / or "include", when used in this specification, specify the existence of stated features, wholes, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, parts and / or their groups.

[0039] Embodiments of the present disclosure relate to a method for manufacturing a film assembly for transferring a light-emitting element, a film assembly, and a method for manufacturing a display device using the film assembly. Hereinafter, a method for manufacturing a film assembly for transferring a light-emitting element, a film assembly, and a method for manufacturing a display device using the film assembly according to an embodiment will be described with reference to the accompanying drawings.

[0040] Figure 1 A top plan view of a display device according to an embodiment is shown. Figure 2 According to the embodiment Figure 1 Pixels in a display device shown in .

[0041] refer to Figure 1 The display device 10 is configured to output information in the form of light (e.g., output light information). For example, the display device 10 is a device for displaying moving images and / or still images, and can be used as a display screen of portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, and ultra mobile PCs (UMPCs), and can be used as a display screen of various products such as televisions, laptop computers, monitors, billboards, Internet of Things (IOT) devices, etc.

[0042] The display device 10 may be formed to have a flat surface having a rectangular shape with a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1. The angle where the long side in the first direction DR1 and the short side in the second direction DR2 meet may be rounded to have a curvature (e.g., a predetermined curvature), or may be formed to have a right angle. The flat shape of the display device 10 is not limited to a quadrilateral shape, and the display device 10 may be formed to have another polygonal shape, a circular shape, or an elliptical shape. The display device 10 may be formed to be flat, but is not limited thereto. For example, the display device 10 may have a curved portion at the left end (or left side) and the right end (or right side), and the curved portion may have a constant curvature or a variable curvature. In addition, the display device 10 may be flexibly formed (e.g., may be formed of a flexible material) to be curved, curved, folded, or curled.

[0043] The display device 10 may further include pixels PX, scan wirings extending in the first direction DR1, and data wirings extending in the second direction DR2 to display an image. The pixels PX may be arranged in a matrix format (or matrix pattern) in the first direction DR1 and the second direction DR2.

[0044] like Figure 2 As shown in FIG, each of the pixels PX may include a plurality of sub-pixels SPX1 , SPX2 , and SPX3 . Figure 2 An embodiment is shown in which each of the pixels PX includes three sub-pixels SPX1 , SPX2 , and SPX3 , ie, a first sub-pixel SPX1 , a second sub-pixel SPX2 , and a third sub-pixel SPX3 , but the present disclosure is not limited thereto.

[0045] The first subpixel SPX1 , the second subpixel SPX2 , and the third subpixel SPX3 may be connected to one of the data wirings and at least one of the scan wirings.

[0046] Each of the first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 may have a rectangular planar shape, a square planar shape, or a rhombus planar shape. For example, each of the first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 may have a rectangular planar shape having a short side in the first direction DR1 and a long side in the second direction DR2, for example, as Figure 2 In other embodiments, each of the first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 may have a square plan shape or a diamond plan shape having sides of the same length in the first direction DR1 and the second direction DR2.

[0047] like Figure 2As shown in , the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may be arranged in the first direction DR1 (e.g., may be adjacent to each other in the first direction DR1). In other embodiments, one of the second sub-pixel SPX2 and the third sub-pixel SPX3 and the first sub-pixel SPX1 may also be arranged in the first direction DR1, and the other of the second sub-pixel SPX2 and the third sub-pixel SPX3 and the first sub-pixel SPX1 may be arranged in the second direction DR2.

[0048] In other embodiments, one of the first subpixel SPX1 and the third subpixel SPX3 and the second subpixel SPX2 may be arranged in the first direction DR1, and the other of the first subpixel SPX1 and the third subpixel SPX3 and the second subpixel SPX2 may be arranged in the second direction DR2. In other embodiments, one of the first subpixel SPX1 and the second subpixel SPX2 and the third subpixel SPX3 may be arranged in the first direction DR1, and the other of the first subpixel SPX1 and the second subpixel SPX2 and the third subpixel SPX3 may be arranged in the second direction DR2.

[0049] The first subpixel SPX1 may emit a first light, the second subpixel SPX2 may emit a second light, and the third subpixel SPX3 may emit a third light. In one embodiment, the first light may be light of a red wavelength band, the second light may be light of a green wavelength band, and the third light may be light of a blue wavelength band. The red wavelength band is a wavelength band in the range of about 600 nm to about 750 nm, the green wavelength band is a wavelength band in the range of about 480 nm to about 560 nm, and the blue wavelength band is a wavelength band in the range of about 370 nm to about 460 nm, but they are not limited thereto.

[0050] Each of the first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 is a light emitting element that emits light and may include an inorganic light emitting element including an inorganic semiconductor. For example, the inorganic light emitting element may be a flip chip type micro light emitting diode (LED), but the embodiments of the present disclosure are not limited thereto.

[0051] like Figure 2In the embodiment shown in , the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be substantially the same, but the embodiments of the present disclosure are not limited thereto. At least one of the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be different from the other (some) of the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3. In another embodiment, two of the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be substantially the same, and the other of the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be different from the two. In another embodiment, the area of ​​the first sub-pixel SPX1, the area of ​​the second sub-pixel SPX2, and the area of ​​the third sub-pixel SPX3 may be different from each other.

[0052] Figure 3 FIG. 2 shows a cross-sectional view of a display device according to an embodiment. Figure 3 , the display device 10 may include a pixel circuit layer PCL and a light emitting element layer LEL.

[0053] The pixel circuit layer PCL may be a layer including a pixel circuit PXC for driving the light emitting element LE. The pixel circuit layer PCL may be a backplane layer. The pixel circuit layer PCL may include a base layer BSL, a metal layer for forming the pixel circuit PXC, and an insulating layer disposed between the metal layers. In some embodiments, the base layer BSL may be a base substrate or a base member for supporting the display device 10. In one embodiment, the base layer BSL may be a rigid substrate made of a glass material. In one embodiment, the base layer BSL may include a silicon material. In one embodiment, the base layer BSL may be a flexible substrate that is bendable, foldable, or rollable. In such an embodiment, the base layer BSL may include an insulating material such as a polymer resin (such as polyimide). In some embodiments, the pixel circuit PXC may include a transistor. For example, the pixel circuit PXC may include a thin film transistor. The pixel circuit PXC may also include a storage capacitor. The pixel circuit PXC may be electrically connected to the light emitting element LE to provide an electrical signal for (e.g., causing) the light emitting element LE to emit light.

[0054] The light emitting element layer LEL may be disposed on the pixel circuit layer PCL. The light emitting element layer LEL includes a pixel electrode AE, a common electrode CE, and a light emitting element LE. Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 includes a light emitting element LE connected to the pixel electrode AE ​​and the common electrode CE. In some embodiments, the light emitting element LE may include a first light emitting element LE1, a second light emitting element LE2, and a third light emitting element LE3, wherein the first light emitting element LE1 is configured to emit light of a first color and is included in the first sub-pixel SPX1, the second light emitting element LE2 is configured to emit light of a second color and is included in the second sub-pixel SPX2, and the third light emitting element LE3 is configured to emit light of a third color and is included in the third sub-pixel SPX3. The pixel electrode AE ​​may be referred to as an anode electrode, and the common electrode CE may be referred to as a cathode electrode.

[0055] The pixel electrode AE ​​and the common electrode CE may be disposed on the pixel circuit layer PCL. Each of the pixel electrodes AE may be electrically connected to the pixel circuit PXC of the pixel circuit layer PCL. Therefore, a pixel voltage (or anode voltage) controlled by the pixel circuit PXC (eg, a transistor) may be applied to the pixel electrode AE.

[0056] Each of the common electrodes CE may be electrically connected to a power wiring formed in the pixel circuit layer PCL. Therefore, a power supply voltage (eg, a single power supply voltage) of the power wiring may be applied to the common electrodes CE.

[0057] The pixel electrode AE ​​and the common electrode CE may include a highly reflective metal material such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). However, the present disclosure is not limited thereto.

[0058] Figure 3 An embodiment is shown in which each of the light emitting elements LE is a flip chip type micro LED in which the first contact electrode CTE1 and the second contact electrode CTE2 are disposed to face the pixel electrode AE ​​and the common electrode CE. However, the shape of the light emitting element LE is not limited thereto.

[0059] The light emitting element LE may include an inorganic material (e.g., GaN). The length of the light emitting element LE in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 may be in the range of several μm to several hundred μm, respectively. For example, the length of the light emitting element LE in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 may be about 100 μm or less, respectively. However, the present disclosure is not limited thereto.

[0060] Each of the light emitting elements LE may be a light emitting structure including an n-type semiconductor NSEM, an active layer MQW, a p-type semiconductor PSEM, a first contact electrode CTE1, and a second contact electrode CTE2.

[0061] A portion of the n-type semiconductor NSEM may be disposed on the active layer MQW. A portion of the n-type semiconductor NSEM may be disposed on the second contact electrode CTE2. In some embodiments, one surface of the n-type semiconductor NSEM may face the display surface. The n-type semiconductor NSEM may be made of GaN doped with an n-type conductive dopant such as Si, Ge, Se, or Sn.

[0062] The active layer MQW may be disposed on a portion of one surface of the n-type semiconductor NSEM. The active layer MQW may be interposed between the n-type semiconductor NSEM and the p-type semiconductor PSEM. The active layer MQW may include a material having a single quantum well structure or a multiple quantum well structure. When the active layer MQW includes a material having a multiple quantum well structure, a plurality of well layers and barrier layers may be alternately stacked with each other. In such an embodiment, the well layer may be formed of InGaN, and the barrier layer may be formed of GaN or AlGaN, but is not limited thereto. In another embodiment, the active layer MQW may have a structure in which a semiconductor material having a large band gap energy and a semiconductor material having a small band gap energy are alternately stacked with each other, or may include a III- to V-group semiconductor material according to a wavelength band of light to be emitted.

[0063] The p-type semiconductor PSEM may be disposed on one surface of the active layer MQW. The p-type semiconductor PSEM may be made of GaN doped with a p-type conductive dopant such as Mg, Zn, Ca, or Ba.

[0064] The first contact electrode CTE1 may be disposed on the p-type semiconductor PSEM, and the second contact electrode CTE2 may be disposed on another portion of one surface of the n-type semiconductor NSEM. Another portion of one surface of the n-type semiconductor NSEM on which the second contact electrode CTE2 is disposed may be spaced apart from a portion of one surface of the n-type semiconductor NSEM on which the active layer MQW is disposed.

[0065] The first contact electrode CTE1 and the pixel electrode AE ​​may be bonded to each other by a conductive adhesive member such as an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). The first contact electrode CTE1 and the pixel electrode AE ​​may be bonded to each other by a laser bonding process. The first contact electrode CTE1 and the pixel electrode AE ​​may be bonded to each other by a welding process.

[0066] Next, we will refer to Figures 4 to 12 The method for producing a film assembly FAS for transferring a light emitting element LE is described (see, for example, Figure 5 Descriptions that may be redundant with those provided above may be simplified or may not be repeated.

[0067] Figure 4 is a schematic flow chart describing the steps of a method of manufacturing a membrane module according to an embodiment.

[0068] Figure 5 A schematic top plan view of a membrane assembly according to an embodiment is shown. Figure 5 The film assembly FAS is shown ready for transferring the light emitting element LE, and wherein the manufacturing process of the film assembly FAS is almost or substantially completed.

[0069] Figures 6 to 8 A schematic top plan view of the steps of a method for manufacturing a membrane assembly according to an embodiment is shown. For better understanding and ease of description, Figures 6 to 8 Based on the reference Figure 5 The membrane module FAS of the plane structure of the membrane module FAS is shown, and the plane structure in which the membrane module FAS includes a single unit region is shown to make the illustration of the drawing clearer.

[0070] Figures 9 to 12 A schematic cross-sectional view of the steps of a method for manufacturing a membrane assembly according to an embodiment is shown. For better understanding and ease of description, Fig. 9 and Fig.10 The following diagram shows the process of membrane assembly FAS during the manufacturing process. Figures 6 to 8 Schematic cross-sectional structure taken along line AA' in FIG. Fig.11 and Fig.12 The following diagram shows the process of membrane assembly FAS during the manufacturing process. Figures 6 to 8 Schematic cross-sectional structure taken along line BB' in FIG.

[0071] refer to Figure 4 , a method of manufacturing a membrane assembly FAS may include: disposing a membrane assembly on a substrate (S20); forming a first cutting region in the membrane assembly (S40); and forming a second cutting region in the membrane assembly (S60).

[0072] According to an embodiment, a method of manufacturing a film assembly FAS may be performed to provide a film assembly FAS having first and second cutting areas CA1 and CA2 and a plurality of unit areas UA.

[0073] For example, the film assembly FAS may be a stamp structure for transferring the light emitting element LE by using a stamp method. In order to transfer the light emitting element LE by using the film assembly FAS, the film assembly FAS is divided into a plurality of unit areas UA. In each of the divided process steps, the light emitting element (s) LE disposed in each of the unit areas UA of the film assembly FAS may be connected to a stamp head SHA (for example, see Fig.17 ), and the stamp head SHA can transfer the separately provided (multiple) light emitting elements LE to the pixel circuit layer PCL.

[0074] In some embodiments, the first cutting area CA1 may be used to provide a portion where the protective film FIL is removed after the film assembly FAS is provided to the die head SHA (see, for example, FIG. 1 ). Fig. 9 ) area.

[0075] In some embodiments, the second cutting area CA2 may be a cutting portion for distinguishing (or separating) the unit area UA. For example, a process for manufacturing the second cutting area CA2 may be performed so that the unit area UA may be separated.

[0076] The unit area UA may be determined according to the shape of the second cutting area CA2. In some embodiments, the unit area UA may be formed in a matrix structure according to the X direction and the Y direction. The shape of the unit area UA is not limited thereto.

[0077] According to an embodiment, a film assembly FAS may be manufactured on a substrate BS for manufacturing a film. A film manufacturing substrate (may be referred to as a film manufacturing substrate BS) may include a stage for manufacturing a film assembly FAS. The film manufacturing substrate BS may include a lower mold. The film manufacturing substrate may be referred to as a "substrate".

[0078] The membrane assembly FAS may include a relatively rigid material, but the present disclosure is not limited thereto.

[0079] In some embodiments, a pin hole PH may be formed in the membrane assembly FAS. The pin hole PH may have a structure for aligning the position of a layer for manufacturing the membrane assembly FAS. The pin hole PH may at least penetrate (e.g., may extend through) the protective film FIL. For example, when manufacturing the membrane assembly FAS (e.g., when performing a process for manufacturing the membrane assembly FAS), a pin PN may be provided in the pin hole PH (e.g., see Fig.10 ), and the position of the membrane assembly FAS can be tightly defined (eg, can be fixed).

[0080] The pin hole PH may be formed in (or on) each of the first and second sides of the membrane assembly FAS. For example, the pin hole PH may include a first pin hole formed in the first side of the membrane assembly FAS and a second pin hole formed in the second side of the membrane assembly FAS.

[0081] The shape of the pin hole PH may be a circular shape, etc. In some embodiments, the pin hole PH may penetrate (e.g., may extend through) the film assembly FAS, and may include a groove formed in at least a portion of the film manufacturing substrate BS. For example, the pin hole PH may penetrate the polymer lower film PSF, the base part PF, the stamp layer STL, and the protective film FIL.

[0082] Hereinafter, steps of a manufacturing process of the membrane module FAS according to the embodiment will be described.

[0083] refer to Figure 4 , Figure 6 and Fig. 9 In the step of arranging the membrane assembly on the substrate (S20), a plurality of layers forming the membrane assembly FAS may be arranged on the membrane manufacturing substrate BS of the cutting areas CA1 and CA2 for forming the membrane assembly FAS. In some embodiments, a polymer lower film PSF may be arranged on the membrane manufacturing substrate BS, and a plurality of layers for forming the membrane assembly FAS may be sequentially arranged on the polymer lower film PSF.

[0084] A polymer lower film PSF may be provided between the base portion PF and the film manufacturing substrate BS, and when the second cutting area CA2 is formed in a subsequent process, the high deviation between the layers may be mitigated. For example, the polymer lower film PSF may be a buffer layer. The polymer lower film PSF may be a sacrificial layer. The polymer lower film PSF may include various resin materials (e.g., urethane, etc.). However, the present disclosure is not limited thereto.

[0085] The plurality of layers forming the membrane assembly FAS may extend in one plane (eg, a plane extending in the X direction and the Y direction). For example, the membrane assembly FAS may be formed on a substantially flat polymer lower film PSF.

[0086] In some embodiments, at least one end portion of the membrane assembly FAS may be wound around a roller. In other embodiments, the membrane assembly FAS may be provided (or formed into) a flat shape as a whole without being wound on a roller.

[0087] The film assembly FAS may include a base portion PF, a stamp layer STL, and a protection film FIL.

[0088] A foundation part PF may be provided on the stamp layer STL and the polymer lower film PSF. The foundation part PF may support a lower portion of the stamp layer STL.

[0089] The base part PF may include various hard materials or soft materials. For example, the base part PF may include polyethylene terephthalate (PET), polycarboxylate ether (PCE), etc. In other embodiments, the base part PF may include a glass material. For example, the base part PF may include ultra-thin glass (UTG). However, the present disclosure is not limited thereto.

[0090] A stamp layer STL may be disposed between the base portion PF and the protection film FIL. The stamp layer STL may form a region in which the light emitting element LE is disposed before being transferred to the pixel circuit layer PCL. For example, the stamp layer STL may be an adhesive layer.

[0091] The stamp layer STL may include a relatively flexible material. For example, the stamp layer STL may include polydimethylsiloxane (PDMS). However, the present disclosure is not limited thereto.

[0092] In some embodiments, the stamp layer STL may be configured to emit infrared laser. In such embodiments, after the light emitting element LE is transferred to the pixel circuit layer PCL by using the stamp layer STL, a laser bonding process may be performed so that the light emitting element LE may be attached to the pixel circuit layer PCL.

[0093] A protection film FIL may be disposed on the stamp layer STL. In some embodiments, the protection film FIL may be the outermost layer of the stamp layer STL. The protection film FIL may be a structure for protecting the stamp layer STL when a process is performed.

[0094] In some embodiments, the area in which the protective film FIL is formed may be formed to be wider than other layers of the film assembly FAS except the protective film FIL (e.g., wider than the base portion PF and the stamp layer STL). In some embodiments, the pin hole PH may be formed in a partial area of ​​the protective film FIL where other layers of the film assembly FAS except the protective film FIL (e.g., the base portion PF and the stamp layer STL) are not disposed. For example, the protective film FIL may have a first protective film portion disposed on the base portion PF and the stamp layer STL and a second protective film portion formed outside the base portion PF and the stamp layer STL. In some embodiments, the pin hole PH may be formed in the second protective film portion and may not be formed in the first protective film portion.

[0095] At least a portion of the protective film FIL may be removed so that the light emitting element LE is disposed on the stamp layer STL in a later (or subsequent) process. The protective film FIL may include various resins (eg, olefin-based resin, urethane, etc.). However, the present disclosure is not limited thereto.

[0096] refer to Figure 4 , Figure 7 and Fig.11 In forming the first cutting region in the membrane assembly (S40), at least a portion of the membrane assembly FAS may be cut.

[0097] Step S40 may include forming a half-cut structure in the membrane assembly FAS.

[0098] In some embodiments, the first cutting area CA1 may be manufactured to correspond to each of the unit areas UA to be manufactured. For example, the first cutting area CA1 may be manufactured in a closed loop shape inside the unit area UA to be manufactured.

[0099] In some embodiments, the region of the stamp layer STL in the first cutting area CA1 may be a region to which the light emitting element LE is attached in a later (or subsequent) process or step.

[0100] In step S40, at least a portion of the protective film FIL may be cut to produce a first cutting area CA1. For example, a cavity may be formed in at least a portion of the protective film FIL. In some embodiments, the first cutting area CA1 may be formed so that at least a portion of the stamp layer STL may be exposed.

[0101] The first cutting area CA1 may completely penetrate (eg, may completely extend through) the protection film FIL, and the first cutting area CA1 may not penetrate the stamp layer STL and the foundation portion PF.

[0102] In some embodiments, the first cutting area CA1 may be manufactured by using a mold. However, the present disclosure is not limited thereto. In some embodiments, when forming the first cutting area CA1, the mold may be aligned by using the pin hole PH.

[0103] In other embodiments, when the disposing of the film assembly on the film manufacturing substrate ( S20 ) is performed, the film assembly FAS in which the first cutting area CA1 is pre-formed may be disposed on the film manufacturing substrate.

[0104] In this embodiment, when manufacturing the separately prepared film assembly FAS, a protective film FIL having a hole (or opening) structure corresponding to the first cutting area CA1 may be provided on the stamp layer STL. Therefore, the film assembly FAS in which the first cutting area CA1 is provided may be provided on the film manufacturing substrate BS.

[0105] refer to Figure 4 , Figure 8 , Fig.10 and Fig.12 In forming the second cutting region in the membrane assembly (S60), at least a portion of the membrane assembly FAS may be cut.

[0106] Step S60 may include forming a full-cut structure in the membrane assembly FAS.

[0107] In some embodiments, the second cutting area CA2 may be manufactured so that the unit areas UA to be manufactured are distinguished from each other. For example, the second cutting area CA2 may be manufactured in the form of a closed loop in an area between the unit areas UA to be manufactured.

[0108] The second cutting area CA2 may be formed to be relatively adjacent to the first cutting area CA1. In a plan view, the second cutting area CA2 may surround the outer edge of the first cutting area CA1 (e.g., may extend around the outer edge of the first cutting area CA1). In a plan view, the second cutting area CA2 may completely surround the outside of the first cutting area CA1.

[0109] Step S60 may include manufacturing the unit area UA.

[0110] In step S60, the second cutting area CA2 may be manufactured by cutting so as to completely penetrate a portion of the film assembly FAS. For example, the second cutting area CA2 may completely penetrate the film assembly FAS, and at least a portion of the second cutting area CA2 may be inserted into at least a portion of the polymer lower film PSF.

[0111] In some embodiments, the second cutting area CA2 can be manufactured by using a pointed mold PM. For example, a pointed mold PM attached to an upper mold UBS can be provided, and a pin PN connected to the upper mold UBS can be provided. The upper mold UBS can be moved downward so that the pin PN is inserted into the pin hole PH, and the second cutting area CA2 can be provided by cutting at least a portion of the film assembly FAS by the pointed mold PM.

[0112] The tip mold PM may have a shape corresponding to the shape of the second cutting area CA2 to be manufactured, and may include a relatively hard material.

[0113] By performing step S60 , the membrane assembly FAS including the unit areas UA spaced apart from each other may be manufactured.

[0114] In some embodiments, as described above, the second cutting area CA2 may be formed after the first cutting area CA1 is formed.

[0115] Experimentally, when the first cutting area CA1 and the second cutting area CA2 are manufactured at the same time, there may be a risk of manufacturing defects in the film assembly FAS. For example, when the first cutting area CA1 and the second cutting area CA2 are formed in the film assembly FAS by using a pointed top mold including a structure for forming each of the first cutting area CA1 and the second cutting area CA2, there is a risk that the first cutting area CA1 and the second cutting area CA2 may not be properly formed because there may be a manufacturing error in the protruding structure formed in the pointed top mold. In this case, the structure of the film assembly FAS may not be carefully prepared and defects may occur during the transfer process of the light emitting element LE.

[0116] However, according to an embodiment of the present disclosure, the first cutting area CA1 and the second cutting area CA2 can be provided in separate process steps (for example, can be formed in separate process steps), and therefore, the structure of the film assembly FAS can be robustly provided and process defects during the manufacturing process of the display device 10 can be reduced or prevented.

[0117] In the following, reference will be made to Figures 13 to 25 A method of manufacturing the display device 10 by using the film assembly FAS according to an embodiment is described. Descriptions that may be redundant with those provided above may be simplified or may not be repeated.

[0118] Fig.13 is a flowchart describing steps of a method of manufacturing a display device according to an embodiment. Figures 14 to 25 Cross-sectional views showing steps of a method of manufacturing a display device according to an embodiment.

[0119] refer to Fig.13 According to an embodiment, the method for manufacturing the display device 10 may include: preparing a film assembly (S200); connecting the film assembly and a stamp head (S400); bending at least a portion of the film assembly (S600); removing at least a portion of the protective film (S800); and transferring the light emitting element to the pixel circuit layer (S1000).

[0120] refer to Fig.13 and Fig.14 In preparing the film assembly ( S200 ), a film assembly FAS including a first cutting area CA1 and a second cutting area CA2 may be provided.

[0121] In step S200 , the membrane assembly FAS having the unit area UA may be disposed on the membrane manufacturing substrate BS, and the protection film FIL of the membrane assembly FAS may be disposed on the upper side with respect to the Z direction.

[0122] refer to Fig.13 as well as Figures 15 to 18In coupling the film assembly and the die head ( S400 ), the film assembly FAS and the die head SHA may be attached such that the base portion PF of the film assembly FAS faces the die head SHA.

[0123] In step S400, the position of the membrane assembly FAS disposed on the membrane manufacturing substrate BS may be changed by using the reversing unit RU. For example, after the position of the membrane assembly FAS is changed so that the protective film FIL is disposed on the reversing unit RU, as the reversing unit RU is turned over, the setting state of the membrane assembly FAS may be changed so that the protective film FIL of the membrane assembly FAS faces upward.

[0124] In some embodiments, in step S400 , the polymer lower film PSF may still be disposed on the film manufacturing substrate BS, and when the membrane assembly FAS is disposed on the reversing unit RU, the membrane assembly FAS and the polymer lower film PSF may be spaced apart from each other.

[0125] The reversing unit RU may be reversible in various ways. For example, a rotation axis is formed on one side of the reversing unit RU so that the reversing unit RU may rotate based on the rotation axis. However, the present disclosure is not limited thereto.

[0126] In step S400, the unit area UA of the membrane assembly FAS may be coupled to the die head SHA. In some embodiments, a portion of the membrane assembly FAS in one or more unit areas UA may be coupled to the die head SHA. In this case, because the setting state of the membrane assembly FAS is changed by the reversing unit RU, the base part PF may face outward so that the base part PF may be adjacent to the die head SHA.

[0127] In some embodiments, the stamp head SHA may include a head base HB, a fixing portion CHK, and a clamping portion CLP.

[0128] The fixing part CHK may be configured to couple the base part PF and the stamp layer STL to the stamp head SHA in various ways. For example, the fixing part CHK may include an electrostatic chuck, an adhesive chuck, a vacuum chuck, or a porous vacuum chuck.

[0129] The clamping portion CLP may clamp an object. For example, the clamping portion CLP may firmly fix the position of the film assembly FAS. For example, the clamping portion CLP may be disposed on both sides of the fixing portion CHK, and may push (or may squeeze from both sides) the film assembly FAS adjacent to the fixing portion CHK from both sides.

[0130] In some embodiments, the method of fixing the film assembly FAS by the clamping part CLP and the fixing part CHK is not limited to the examples shown in the drawings. For example, the method of fixing the film assembly FAS can be variously changed. For example, the fixture can be formed on a table set separately from the stamp head SHA.

[0131] In step S400, the foundation part PF, the stamp layer STL, and the protection film FIL may be disposed on the fixing part CHK, and their positions may be fixed. Therefore, the protection film FIL may face downward, and the foundation part PF may face upward (eg, toward the stamp head SHA).

[0132] refer to Fig.13 , Fig.18 and Fig.19 In the bending of at least a portion of the membrane assembly ( S600 ), the membrane assembly FAS may be bent.

[0133] In some embodiments, a moving portion MP may be provided. The moving portion MP may be movable in a vertical direction (eg, in a direction parallel to the Z direction), and may be configured to push at least a portion of the membrane assembly FAS in the Z direction.

[0134] In step S600, the moving part MP may push the edge of the membrane assembly FAS, and the edge portion of the membrane assembly FAS may be bent. The bent edge portion of the membrane assembly FAS may be adjacent to the fixing part CHK.

[0135] In step S600, the area in which the film assembly FAS is bent by the moving part MP may be determined by the first cutting area CA1. For example, the first cutting area CA1 may be formed in at least a portion of the film assembly FAS so that a half-cut structure may be formed, and the edge portion of the film assembly FAS may be appropriately bent based on the first cutting area CA1.

[0136] In some embodiments, the method of bending the membrane assembly FAS is not limited to the examples described above. For example, a separate chuck module may be provided so that the membrane assembly FAS can be bent.

[0137] When step S600 is performed, the protection film FIL may have a region facing downward and a region facing one side by being folded by the moving part MP.

[0138] The method of bending the protection film FIL is not limited to the above-described example, and various suitable process methods may be applied to bend the protection film FIL.

[0139] refer to Fig.13 , Fig. 20 and Fig.21In removing at least a portion of the protective film ( S800 ), at least a portion of the protective film FIL facing downward, ie, a region of the protective film FIL that is not bent in a previous process step, may be removed.

[0140] In step S800, a portion of the protection film FIL surrounded by the first cutting area CA1 may be removed Various suitable methods may be used, such as a method of physically removing a portion of the protection film FIL, but the present disclosure is not limited thereto.

[0141] When step S800 is performed, a portion of the protection film FIL may be removed, and a portion of the protection film FIL may still be disposed in a region adjacent to the clamping portion CLP (which may be referred to as a remaining protection film FIL_R).

[0142] In step S800, a portion (eg, a lower surface) of the stamp layer STL may be exposed. Thus, a region in which the light emitting element LE may be disposed may be formed in the stamp layer STL.

[0143] According to an embodiment, one surface of the stamp layer STL on which the light emitting element LE is disposed may be covered by the protective film FIL until step S800 is performed. For example, when the light emitting element LE is disposed on the stamp layer STL, at least a portion of the protective film FIL may be removed, so that the risk of contamination of the light emitting element LE can be significantly reduced.

[0144] refer to Fig.13 as well as Figure 22 to Figure 25 In transferring the light emitting element onto the pixel circuit layer ( S1000 ), the light emitting element LE disposed on the stamp layer STL may be disposed on the pixel circuit layer PCL.

[0145] Before performing step S1000, the light emitting element LE may be formed on a growth substrate GS (eg, a wafer). For example, after epitaxially growing a semiconductor layer on the growth substrate GS, the semiconductor layer may be etched, and thus, a separately prepared light emitting element LE may be manufactured.

[0146] In step S1000, the stamp head SHA may be adjacent to the light emitting element LE on the growth substrate GS, and the light emitting element LE may be separated from the growth substrate GS by various suitable processes (e.g., laser lift-off, etc.). Therefore, the light emitting element LE is supported by the fixing portion CHK and the clamping portion CLP, and may be coupled to one surface of the stamp layer STL exposed by the remaining protective film FIL_R. In some embodiments, the number of light emitting elements LE attached to the stamp layer STL may be determined based on the area of ​​the unit area UA.

[0147] In step S1000, the light emitting element LE attached to the stamp layer STL may be moved onto the pixel circuit layer PCL. In some embodiments, the pixel electrode AE ​​and the common electrode CE may be patterned on the pixel circuit layer PCL, and a bonding layer BL may be provided. When an infrared laser or the like is applied, the bonding layer BL may fix the light emitting element LE to the pixel circuit layer PCL. In some embodiments, the bonding layer BL may be an adhesive layer. The bonding layer BL may include an anisotropic conductive paste (ACP).

[0148] In step S1000, after the light emitting element LE is disposed on the bonding layer BL, the fixing part CHK and the clamping part CLP may release the fixing operation for the stamp layer STL and the base part PF. Therefore, the light emitting element LE, the stamp layer STL, and the base part PF may be disposed on the pixel circuit layer PCL. In addition, a laser bonding process may be performed so that the position of the light emitting element LE may be fixed and the light emitting element LE may be transferred to the pixel circuit layer PCL.

[0149] Thereafter, after providing the light emitting element LE, the stamp layer STL and the foundation portion PF on the pixel circuit layer PCL may be removed therefrom, and the bonding layer BL may also be removed, thereby providing the display device 10 according to the embodiment.

[0150] While the present disclosure has been shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

[0151] Therefore, the technical scope of the present disclosure can be determined by the technical scope of the appended claims and their equivalents.

Claims

1. A method for manufacturing a film assembly for transferring a light-emitting element, the film assembly comprising: Basic part; a stamp layer on the base portion; and a protective film, on the stamp layer, the method comprising: forming a first cutting region in the film assembly, including exposing at least a portion of the stamp layer; and forming a second cutting region in the membrane assembly, including completely penetrating the membrane assembly, Wherein, forming the second cutting region is performed after forming the first cutting region.

2. The method according to claim 1, wherein: Forming the first cutting region includes completely penetrating the protective film but not completely penetrating the base portion and the stamp layer.

3. The method according to claim 1, wherein: Forming the second cutting region includes forming a plurality of unit regions separated from each other.

4. The method according to claim 3, wherein: The plurality of unit regions are determined based on a shape of the second cutting region.

5. The method according to claim 1, wherein: Forming the second cutting region includes cutting at least a portion of the membrane assembly by using a pointed die.

6. The method according to claim 5, wherein: The membrane assembly has a pin hole for aligning the position of the pointed top mold, and Wherein, the pin hole at least penetrates the protective film.

7. The method according to claim 6, wherein: At least a portion of the protective film is not on the base portion and the stamp layer, and Wherein, the pin hole is in the at least a portion of the protective film.

8. The method according to claim 6, wherein: The pin holes include a first pin hole formed in a first side of the membrane assembly and a second pin hole formed in a second side of the membrane assembly.

9. The method according to claim 1, wherein: In forming the second cutting region, the film assembly is on a film manufacturing substrate, and a polymer lower film is between the film manufacturing substrate and the base portion.

10. A film assembly for transferring a light-emitting element, the film assembly comprising: Basic part; a stamp layer on the base portion; as well as a protective film, on the stamp layer, wherein a first cutting area is formed in the protective film but not in the stamp layer and the base portion, and The second cutting area completely penetrates the base portion, the stamp layer and the protective film.

11. A method for manufacturing a display device, the method comprising: preparing a membrane assembly, the membrane assembly comprising a base portion, a stamp layer on the base portion, and a protective film on the stamp layer; Connecting the membrane assembly and the die head; bending at least a portion of the membrane assembly; removing at least a portion of the protective film; as well as transferring a light emitting element onto a pixel circuit layer by using the film assembly coupled to the stamp head, Wherein, the membrane assembly has a first cutting area and a second cutting area, wherein the first cutting area is formed in the protective film but not in the stamp layer and the base portion, and Wherein, the second cutting area completely penetrates the base portion, the stamp layer and the protective film.

12. The method according to claim 11, wherein: The membrane assembly includes a plurality of unit areas defined by the second cutting area, and Wherein, coupling the membrane assembly and the die head comprises coupling a portion of the membrane assembly in at least one of the plurality of unit regions to the die head.

13. The method according to claim 11, wherein: Bending at least a portion of the membrane assembly includes bending an edge portion of the membrane assembly based on the first cutting area.

14. The method according to claim 13, wherein: Removing at least a portion of the protective film includes: removing at least a portion of the protective film surrounded by the first cutting area; and At least a portion of the stamp layer is exposed.

15. The method according to claim 11, wherein: The light emitting element includes a flip chip type micro light emitting diode.

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